JP5403567B2 - Temperature characteristic measuring device - Google Patents

Description

  The present invention relates to a temperature characteristic measuring apparatus or a temperature characteristic measuring method for measuring a temperature characteristic of an electronic component, and more particularly to a technique for improving the temperature control of an electronic component with high accuracy.

  Electronic components such as a crystal resonator, an acceleration sensor, and a pneumatic sensor output various signals according to the measurement purpose, and this output varies depending on the ambient temperature used. For example, a crystal resonator has temperature dependence in its frequency characteristics. Therefore, this type of electronic component needs to be tested for temperature-dependent characteristics by measuring output characteristics at a plurality of temperatures before shipment. In a crystal resonator, frequency characteristics are measured at a temperature of 3 to 5 points or more in the range of −40 to 90 ° C., and characteristic classification and non-defective / defective products are determined.

  In order to test the temperature characteristic of the electronic component having such temperature dependence, a temperature characteristic measuring device is used. One type of temperature characteristic measuring device is a thermostat type temperature measuring device. In this thermostatic bath type, for example, an electronic component is mounted on a measurement board in which a plurality of electronic component sockets are arranged on a printed circuit board, and this is set inside the thermostatic bath. For measurement in a low temperature environment, control is performed so that the cooling gas is discharged into the thermostat and the internal temperature is lowered to the target temperature and kept constant. When the internal temperature of the temperature chamber reaches the measurement temperature, the output value of the electronic component is measured using a socket connected to the electronic component. In the case of measurement in a high temperature environment, control is performed so that the gas heated through the heater is released into the thermostat and kept constant in the same manner. When the measured temperature is reached, the output value of the electronic component is controlled.

  Another type of temperature characteristic measuring apparatus is a temperature control element type. In this temperature control element type, for example, an electronic component is placed on an electronic component mounting plate and moved on the index table in the circumferential direction. In the index table, a plurality of heat transfer plates are arranged in the circumferential direction, and a temperature control element such as a Peltier element is arranged on the back side of the heat transfer plate. The Peltier element controls the heat transfer plate to a target temperature by directly supplying cold heat or heat to the heat transfer plate. As a result, the index table can be divided into a plurality of temperature areas by this heat transfer plate, for example, when the electronic component mounting plate moves to a low temperature area, the electronic component mounting plate is controlled to a low temperature by the heat transfer plate, In the meantime, the measurement characteristic is measured by bringing the measurement probe into contact with the terminal of the electronic component. Further, when the electronic component mounting plate moves to the high temperature area, the electronic component is similarly controlled to a high temperature via the electronic component mounting plate by the heat transfer plate, and the output characteristics are measured. As described above, in the case of the temperature control element type, the temperature of the electronic component is controlled by directly supplying the heat or cold to the electronic component mounting plate to control the temperature of the electronic component. There is an advantage that it can be greatly shortened.

JP 2003-161750 A

  However, in the case of the temperature chamber type, it is necessary to control the temperature of a wide space in the temperature chamber, so it takes a long time to set the temperature of the electronic component to the target value, and the temperature varies depending on the location. There was a problem that it was easy to do.

  In addition, it is conceivable to reduce the temperature distribution by reducing the temperature of the thermostatic chamber, but the heat source for feedback control is placed in another location, and the gas is controlled by this heat source to indirectly control the ambient temperature of the electronic component. Due to the adjustment structure, there is a problem that it is basically difficult to control the temperature of the electronic component with high accuracy.

  In the case of the conventional temperature control element type, the temperature of the heat transfer plate adjacent to the Peltier element is measured and this Peltier element is feedback-controlled, so the temperature of the electronic component cannot be accurately controlled. There was a problem. Therefore, the conventional temperature control element type has a problem that it is difficult to use it for an electronic component whose temperature dependence characteristics are to be measured with extremely high accuracy.

  The present invention has been made in view of such a situation, and an object of the present invention is to provide a technique for realizing highly accurate temperature control in a temperature characteristic measuring apparatus.

The present invention is a temperature characteristic measuring device for measuring the temperature characteristics of the electronic component, an electronic component mounting plate having an electronic component placement area on which an electronic component is to be placed, is placed on the electronic component placement area An output measurement device that measures the output of the electronic component, a temperature measurement master that is placed in the electronic component placement area in the same manner as the electronic component and outputs a temperature-dependent signal, and a temperature measurement master A master temperature measurement device that measures the temperature of the temperature measurement master from an output, a first temperature control element that heats or cools the electronic component placement area, and a temperature different from the first temperature control element A second temperature control element that heats or cools the electronic component mounting area, and the electronic component area is heated by the first temperature control element in the transport path of the electronic component mounting plate. Others a first position to be cooled, the electronic component area is set and a second position to be heated or cooled by said second temperature control element, the first probe unit is arranged in the further first position In addition, a second probe unit is disposed at the second position, and the first probe unit measures the output of the electronic component placed on the electronic component mounting plate at the first position. A first electronic component-side probe that is movable in the vertical direction between a component measurement position and a first electronic component retracted position that is retracted from the first electronic component measurement position, and the electronic component mounting plate at the first position. between the first retracted position retracted from the first measurement position and the first measurement position for measuring the output of the location has been said temperature measuring master, perforated first and the master-side probe which is movable, a vertically The second probe unit has a second electronic component measurement position for measuring an output of the electronic component placed on the electronic component mounting plate at the second position and a second electronic component retreated from the second electronic component measurement position. A second measurement that measures the output of the second electronic component-side probe that is movable in the vertical direction between the electronic component retreat positions and the temperature measurement master mounted on the electronic component mounting plate at the second position. position and between the second retracted position retracted from the second measurement position, a second master-side probe which is movable in the vertical direction, has, in the first position, the by the first electronic component side probe The output measurement of the electronic component and the output measurement of the temperature measurement master by the first master side probe are performed substantially simultaneously, and the electronic component by the second electronic component side probe is performed at the second position. The output measurement and the output measurement of the temperature measurement master by the second master side probe are performed substantially simultaneously .

A temperature control unit for controlling the first temperature control element or the second temperature control element, wherein the temperature control unit is configured to control the first temperature based on a temperature of the temperature measurement master measured by the master temperature measurement device; It is preferable to control the control element or the second temperature control element.

  The present invention can be configured as follows.

  A temperature characteristic measuring apparatus for measuring a temperature characteristic of an electronic component, the electronic component mounting plate on which the electronic component is mounted, and the electronic component mounting plate mounted on the electronic component mounting plate in the same manner as the electronic component, depending on the temperature There may be provided a temperature measurement master that outputs a signal and a master temperature measurement device that measures the temperature of the temperature measurement master from the output of the temperature measurement master. Moreover, it is preferable that the said master temperature measuring apparatus measures the temperature of the said master for temperature measurement substantially simultaneously with the measurement of the output of the said electronic component. Furthermore, it is preferable that the temperature measurement master has substantially the same heat capacity as the electronic component.

  The temperature measurement master preferably includes a thermistor. The temperature measuring master is preferably the electronic component whose temperature characteristics are known.

  It is preferable to further comprise a thermostatic chamber for accommodating the electronic component mounting plate on which the electronic component and the temperature measurement master are mounted. The temperature control unit further controls a temperature in the thermostat, and the temperature controller controls the temperature in the thermostat based on the temperature of the temperature measurement master measured by the master temperature measurement device. It is preferable to do.

  It is preferable that the electronic component mounting plate further includes a temperature control element that supplies hot or cold heat. Further, it is preferable that the apparatus further includes a temperature control unit that controls the temperature control element, and the temperature control device controls the temperature control element based on the temperature of the temperature measurement master measured by the master temperature measurement device. .

  It is preferable to further include a probe unit that is electrically joined to all the electronic components placed on the electronic component mounting plate and the temperature measurement master.

  It is preferable that the electronic component, the temperature measurement master, and the electronic component mounting plate further include a preheating unit that preheats the electronic component before measuring the temperature characteristics of the electronic component.

  Further, the temperature measurement measurement method includes a heat supply step of supplying heat or cold to an electronic component mounting plate on which the electronic component and the temperature measurement master are placed, and a temperature measurement master substantially simultaneously with the measurement of the output of the electronic component. And a step of measuring the temperature. It is preferable that the method further includes a step of controlling the temperature of the electronic component to a predetermined temperature based on the temperature of the temperature measurement master.

ADVANTAGE OF THE INVENTION According to this invention, the outstanding effect that a temperature characteristic can be measured in the state by which the temperature of the electronic component was controlled with high precision can be show | played.

It is the figure which showed the whole structure of the temperature characteristic measuring device 1 which concerns on embodiment of this invention. It is the figure which expanded and showed the electronic component mounting plate. It is the figure which expanded and showed the heat transfer plate. 3 is a block diagram showing a configuration of a temperature control unit 35. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows the overall configuration of an electronic component temperature characteristic measuring apparatus 1 according to this embodiment. The temperature characteristic measuring apparatus 1 includes an electronic component mounting plate 10 on which the electronic component D is mounted, a heat transfer plate 20 on which the electronic component mounting plate 10 is mounted, and cooling or heating of the heat transfer plate 20. The plate-shaped temperature control element 30 is provided.

  The temperature of the electronic component mounting plate 10 is directly measured by the component side temperature measuring device 15, and the temperature on the heat transfer plate 20 side is directly measured by the temperature control element side temperature measuring device 25. The temperature of the temperature control element 30 is controlled by the temperature control unit 35.

  The output characteristics of the electronic component D are measured by the output measuring device 80 via the probe unit 70. A probe-side temperature control element 75 is disposed in the probe unit 70 so that the temperature of the probe 72 can be controlled.

  As shown in FIG. 2 in an enlarged manner, the electronic component mounting plate 10 is a plate-like member made of a metal material having high thermal conductivity such as copper or aluminum, and the recesses 12 for accommodating the electronic components D are arranged in a row. A plurality are formed. In addition, when there is a high possibility that the terminal of the electronic component D protrudes and comes into contact with the recess 12, it is preferable to subject the recess 12 to an insulating coating. The electronic component D is accommodated in the recess 12 so that high-precision positioning is performed and the electronic component D is prevented from jumping out due to an impact. Inside the electronic component mounting plate 10, temperature sensors 14 of the component-side temperature measuring device 15 are accommodated at three locations in the row direction of the recesses 12. The temperature sensor 14 measures the temperature of the entire electronic component mounting plate 10. In detail, the temperature sensors 14 of the component-side temperature measuring device 15 are arranged at the center and both outer sides in the longitudinal direction of the electronic component array. Thus, by measuring the temperature at a plurality of locations along the longitudinal direction of the row of electronic components D (which coincides with the row of recesses 12), variation in temperature for each electronic component D is reduced. Yes. In addition, although two temperature sensors 14 are arrange | positioned in the center in the center, one temperature sensor 14 is a sensor for failure detection. For example, if there is a large difference between the detected temperatures, it can be determined that some trouble has occurred in the temperature sensor 14 itself.

  A temperature measurement master 100 is accommodated in one of the recesses 12 of the electronic component mounting plate 10. In the present embodiment, the temperature measuring master 100 is provided with a thermistor installed in a housing formed in the substantially same shape by the same material as the electronic component D, and provided with a terminal for outputting a signal from the thermistor. Is. The temperature measurement master 100 may further include an amplifier that amplifies a signal from the thermistor. The temperature measurement master 100 is configured to have substantially the same heat capacity as the electronic component D. That is, the temperature measuring master 100 is heated or cooled while being placed on the electronic component mounting plate 10 in the same manner as the electronic component D, and maintains substantially the same temperature as the electronic component D.

  In the present embodiment, by measuring the temperature of the temperature measurement master 100, the temperature of the electronic component D can be estimated more accurately. The thermistor of the temperature measurement master 100 outputs a temperature-dependent signal. Therefore, the temperature of the temperature measuring master 100 is measured by measuring the output of the thermistor with the master temperature measuring device 82 via the probe unit 70. The temperature of the electronic component D can be estimated to be the same value as the temperature of the temperature measurement master 100 or a value obtained by correcting the temperature of the temperature measurement master 100.

  The position where the temperature measurement master 100 is placed is not particularly limited. The electronic component mounting plate 10 may be placed at an optimal position in consideration of the temperature distribution of the electronic component mounting plate 10 and the ease of handling due to the arrangement of various devices.

  A plurality of temperature measurement masters 100 may be used. In this case, a failure of the temperature measurement master 100 can be immediately detected by comparing the outputs from the plurality of temperature measurement masters 100 respectively. Further, since the temperature distribution on the electronic component mounting plate 10 can be obtained, the temperature of each electronic component D on the electronic component mounting plate 10 can be estimated more accurately according to the place where the electronic component mounting plate 10 is placed. Can do.

  Further, the temperature measurement master 100 is not limited to a component that can output temperature information, and may use an electronic component that can output other information whose temperature characteristics are known, and more preferably, an electronic device to be measured. The same part as the part D is used. In other words, the temperature can be calculated from the output of the master electronic component D whose temperature characteristics are known, or the output value of the master electronic component D can be compared with the output of the electronic component D to be measured. May be output. In this case, since the other electronic component D for measuring the temperature characteristic and the temperature measuring master 100 have the same structure, the temperature of the other electronic component D can be estimated more accurately.

  As shown in FIG. 3 in an enlarged manner, the heat transfer plate 20 is a plate-like member made of a material having high thermal conductivity such as copper or aluminum, and is mounted with an electronic component placed on the placement surface 20A. Hot or cold heat is supplied to the plate 10. Three plate-like temperature control elements 30 are arranged on the lower surface along the row direction of the electronic components D. Furthermore, the temperature sensor 24 of the temperature control element side temperature measuring device 25 is accommodated in the heat transfer plate 10. This temperature sensor 24 measures the temperature of the entire heat transfer plate 20. The temperature sensors 24 are individually arranged at the center and both outer sides in the longitudinal direction of the electronic component array. In addition, although two temperature sensors 24 are arranged in the center in the opposite state, one temperature sensor 24 is a sensor for detecting a failure. For example, if there is a large difference between the detected temperatures, it can be determined that some trouble has occurred in the temperature sensor 24 itself.

  Here, a Peltier element is used as the temperature control element 30, and supplies heat or cold to the heat transfer plate 20. Therefore, the heat transfer plate 20 plays a role of transferring the heat of the temperature control element 30 to the electronic component mounting plate 10.

  The operating principle of the Peltier element is that when a current is passed through the PN junction, an endothermic phenomenon occurs at the N → P junction when viewed in the current direction, and a heat dissipation phenomenon occurs at the P → N junction. Therefore, it is possible to switch between heat dissipation (heating) and heat absorption (cooling) with respect to the heat conduction plate 20 by the Peltier element only by switching the direction of the current. In addition, since the temperature difference of both surfaces of this Peltier element arises relatively, if heat is supplied with respect to the heat absorption side (cooling side) of this Peltier element, the temperature of the thermal radiation side will rise. On the other hand, when the heat on the heat dissipation (heating) side of the Peltier element is taken away, the temperature on the heat absorption (cooling) side decreases.

  The temperature sensor 14 of the component side temperature measuring device 15 and the temperature sensor 24 of the temperature control element side temperature measuring device 25 are both platinum temperature measuring resistors. In particular, in the present embodiment, a platinum resistance thermometer is employed in which the temperature tolerance of the measured value when measuring 100 ° C. is + 0.35 ° C./−0.35° C. or less. By using this platinum resistance thermometer, temperature measurement with high accuracy and high resolution becomes possible. Here, further calibration is performed so that the temperature tolerance becomes + 0.10 ° C./−0.10° C. or less.

  With the above configuration, the electronic component mounting plate 10 and the heat transfer plate 20 can be divided into central areas A1, B1, first side areas A2, B2, and second side areas A3, B3, respectively. That is, the central area A1 of the electronic component mounting plate 10 and the central area B1 of the heat transfer plate 20 are set, and the temperature control element 30 disposed on the back surface of the central area B1 controls the central areas A1 and B1. Is done. Similarly, the first side areas A2 and B2 are set, and the temperature of the first side areas A2 and B2 is controlled by the temperature control element 30 disposed on the back surface of the first side area B2. The second side areas A3 and B3 are a set, and the temperature of the second side areas A3 and B3 is controlled by the temperature control element 30 disposed on the back surface of the second side area B3. Therefore, the component side temperature measuring device 15 and the temperature control element side temperature measuring device 25 measure the temperature of at least three locations corresponding to these three areas.

  The surface area of the electronic component mounting plate 10 is set to 3/4 or less, preferably 1/2 or less, more specifically about 1/3 or less of the surface area of the heat transfer plate 20 in detail. Therefore, the entire first side area A2 and second side area A3 of the electronic component mounting plate 10 are roughly accommodated above the central area B1 of the heat transfer plate 20. As a result, it is possible to supply cold or hot heat to the electronic component mounting plate 10 using the central area B1 where the temperature is most stable in the heat transfer plate 20.

  Returning to FIG. 1, the probe unit 70 is arranged to face the electronic component mounting plate 10 and can be moved in the vertical direction by the moving mechanism 74. Therefore, when the probe unit 70 is lowered, the probe 72 contacts the electronic component D on the electronic component mounting plate 10 and the terminals of the temperature measurement master 100. The output characteristic of the electronic component D is detected via the probe 72 and the temperature of the temperature measuring master 100 is measured. An isolation cover 76 is installed around the probe 72. The isolation cover 76 is lowered toward the electronic component mounting plate 10 together with the probe unit 70 so as to cover the periphery of the electronic component mounting plate 10 (the surface exposed to the atmosphere side). Therefore, at least during the measurement of the characteristics of the electronic component D, the electronic component D is surrounded by a very narrow space, so that the temperature of the electronic component D can be suppressed from being deprived of heat by convection of the outside air.

  Further, the probe-side temperature control element 75 disposed in the probe unit 70 is a Peltier element, and supplies cold or hot heat to the probe 72 via the probe unit 70 to control the temperature of the probe 72 with high accuracy. The probe unit 70 is further provided with a probe-side temperature measuring device 78, which measures three temperatures facing the electronic component-side temperature measuring device 15. Using this measurement result, the temperature of the probe 72 is set to a target value. The target temperature of the probe 72 is set to be the same as the target temperature of the electronic component D.

  The temperature characteristic measuring apparatus 1 according to the present embodiment further includes a preheating unit 90. The preheating unit 90 is disposed on the upstream side of the apparatus, and includes a heat transfer plate 92 on which the electronic component mounting plate 10 is placed, and a plate-like temperature control element 94 that supplies cold heat or heat to the heat transfer plate 92. I have. Although not shown, the heat transfer plate 92 and the temperature control element 94 are each provided with a temperature sensor. The preheating unit 90 controls the temperature control element 94 based on these temperature sensors and the output of the temperature sensor 14 accommodated in the electronic component mounting plate 10, and the electronic component D and the temperature measurement master 100 are controlled by the electronic component mounting plate 10. Preheat with.

  Next, control of the temperature control element 30 by the temperature control unit 35 will be described.

  As shown in FIG. 4, the temperature control unit 35 includes a temperature calibration unit 42, an element side control unit 44, a component side control unit 46, and a probe side control unit 47. The temperature calibration unit 42 calibrates the measurement result of the master temperature measurement device 82 based on the calibration value of the thermistor of the temperature measurement master 100. The temperature calibration unit 42 calibrates the temperature measurement result of the component side temperature measurement device 15 based on the calibration value of the temperature sensor 14 of the component side temperature measurement device 15. Specifically, the output error of the thermistor or the like of the temperature measurement master 100 is measured in advance in advance, and the output error data is stored in the temperature calibration unit 42, or a correction coefficient is set in advance. Keep it. The temperature calibration unit 42 uses this output error data or the like to calibrate so as to remove the error from the actual temperature measurement result. In this way, by correcting variations in the sensitivity of the thermistor and the like of the temperature measurement master 100, the absolute temperature can be measured with extremely high accuracy.

  The element side control unit 44 controls the temperature of the temperature control element 30 so that there is no difference based on the temperature measurement result of the temperature control element side temperature measurement device 25 and the preset temperature target value of the heat transfer plate. . Specifically, the temperature control element 30 arranged on the back surface of the central area B1 is changed to the element side control unit 44 so that the temperature measurement result of the temperature sensor 24 installed in the central area B1 becomes a temperature target value. Control. Similarly, the temperature control element 30 arranged on the back surface of the first side area B2 is arranged on the element side so that the temperature measurement result of the temperature sensor 24 installed in the first side area B2 becomes the temperature target value. Control unit 44 controls. Further, the temperature control element 30 disposed on the back surface of the second side area B3 is controlled on the element side so that the temperature measurement result of the temperature sensor 24 installed in the second side area B3 becomes the temperature target value. The unit 44 controls. Here, a case is shown in which feedback control is performed by associating the measurement results of the areas B1, B2, and B3 with the temperature control elements 30 in a one-to-one relationship, but, for example, disposed under the first side area B2. The temperature control element 30 can be feedback-controlled based on the measured temperature of the central area B1 and the measured temperature of the first side area B2. Similarly, the temperature control element 30 disposed below the second side area B3 can also perform feedback control based on the measured temperature of the central area B1 and the measured temperature of the second side area B3.

  The component-side control unit 46 refers to the difference between the measurement result of the component-side temperature measurement device 15 and the target temperature of the electronic component mounting plate 10 so that the difference is eliminated, so that the target of the temperature control element-side temperature measurement device 25 is eliminated. Correct the set temperature. Specifically, when the temperature measurement result of the electronic component mounting plate 10 by the component-side temperature measurement device 15 is lower than the target temperature, it is necessary to supply hot heat (or to suppress the supply of cold heat), so the temperature control element The target temperature of the side temperature measuring device 25 is increased. As a result, the element-side control unit 44 makes an illusion that the heat supply of the heat transfer plate 20 is insufficient, so that the temperature control element 30 is adjusted so as to increase the supply of heat (or suppress the supply of cold heat). As a result, the temperature of the electronic component mounting plate 10 rises. Similarly, when the temperature measurement result of the electronic component mounting plate 10 by the component side temperature measurement device 15 is higher than the temperature target value, it is necessary to supply cold (or suppress the amount of supply of heat), so the temperature control element side It correct | amends so that the target temperature of the temperature measuring device 25 may be lowered | hung. As a result, the element-side control unit 44 makes an illusion that there is too much supply of heat from the heat transfer plate 20, and therefore controls the temperature control element 30 so as to increase the supply of cold (or suppress the supply of heat). As a result, the temperature of the electronic component mounting plate 10 decreases.

  In the present embodiment, the component side control unit 46 further refers to the difference between the measurement result of the master temperature measurement device 82 and the preset target temperature of the electronic component D, and sets the target setting of the temperature control element side temperature measurement device 25. The temperature is corrected more finely. For example, depending on the material and shape of the electronic component D, heat transfer between the electronic component D and the electronic component mounting plate 10 may not be performed satisfactorily, and the electronic component D against the temperature rise (or decrease) of the electronic component mounting plate 10 There may be a delay in temperature rise (or fall). Further, when the probe 72 contacts the electronic component D and the temperature measurement master 100, the heat of the electronic component D and the like is absorbed by the probe 72, and the temperature of the electronic component mounting plate 10 is hardly changed. In some cases, only the temperature of the component D or the like decreases. In such a case, the electronic component D is accurately corrected by correcting the target temperature of the temperature control element side temperature measuring device 25 based on the difference between the measurement result of the master temperature measuring device 82 and the target temperature of the electronic component D. This can be maintained after reaching the target temperature.

  In the case where the temperature of the electronic component D can be easily predicted from the temperature of the electronic component mounting plate 10, only based on the difference between the measurement result of the component side temperature measuring device 15 and the target temperature of the electronic component mounting plate 10. Thus, the target set temperature of the temperature control element side temperature measuring device 25 may be corrected. In some cases, the same object can be achieved only by correcting the actual measurement result (measured temperature) of the temperature control element side temperature measuring device 25.

  The probe-side control unit 47 controls the temperature of the probe-side temperature control element 75 so that there is no difference based on the temperature measurement result of the probe-side temperature measurement device 78 and the preset temperature target value of the probe unit 70. To do.

  Next, a procedure for measuring the temperature characteristic of the electronic component D by the temperature characteristic measuring apparatus 1 will be described.

  First, the electronic component mounting plate 10 on which the electronic component D and the temperature measurement master 100 are mounted is transported from a production line or the like of the electronic component D and then mounted on the heat transfer plate 92 of the preheating unit 90. . The electronic component D and the temperature measurement master 100 are heated or cooled to a predetermined temperature close to the target temperature for temperature characteristic measurement together with the electronic component mounting plate 10. Next, the electronic component mounting plate 10 is placed on the heat transfer plate 20 for temperature characteristic measurement, and further heated or cooled until the temperature measurement master 100 reaches a target temperature for temperature characteristic measurement. After the temperature measurement master 100 reaches the target temperature, temperature control is performed so as to maintain the target temperature. Then, the probe unit 70 is lowered to bring the probe 72 into contact with the electronic component D and the temperature measuring master 100, and the output measuring device 80 measures the output of the electronic component D. At the same time, the master temperature measuring device 82 is measured. To measure the temperature of the temperature measuring master 100 and store these values. After the probe 72 is brought into contact with the electronic component D and the temperature measurement master 100, it is confirmed that the temperature of the temperature measurement master 100 is the target temperature, and then the output of the electronic component D and the temperature measurement are performed. The temperature of the master 100 may be measured.

  As described above, the temperature characteristic measuring apparatus 1 according to the present embodiment is placed on the electronic component mounting plate 10 in the same manner as the electronic component D and outputs a temperature-dependent signal, and this temperature. Since the master temperature measuring device 82 that measures the temperature of the measurement master 100 is provided, the instantaneous temperature of the electronic component D when measuring the temperature characteristics can be estimated with higher accuracy than before. That is, the temperature characteristic of the electronic component D can be specified with higher accuracy than before.

  In addition, since the master temperature measuring device 82 measures the temperature of the temperature measuring master 100 almost simultaneously with the measurement of the output of the electronic component D, the temperature of the electronic component D is lowered by the contact of the probe 72. In addition, the temperature on the temperature measuring master 100 side can be lowered at the same time. As a result, the temperature of the electronic component D at the moment when the output is generated can be estimated with high accuracy using the temperature measuring master 100.

  Further, since the temperature measurement master 100 has the same heat capacity as that of the electronic component D, if the surrounding environment is the same, the temperature changes of the temperature measurement master 100 and the electronic component D are substantially the same. Become. Therefore, if the output values of the temperature measurement master 100 and the electronic component D are compared at the same timing, it can be estimated with higher accuracy than before whether the output of the electronic component D has an error. .

  Moreover, since the temperature measurement master 100 includes a thermistor, the temperature of the temperature measurement master 100 can be measured easily and with high accuracy.

  Further, an electronic component D whose temperature characteristics are known may be used as the temperature measurement master 100, and a master measurement value obtained from the temperature measurement master 100 in a temperature environment extremely close to other electronic components D. Can be used to estimate the temperature of another electronic component D.

  In addition, since the temperature characteristic measuring apparatus 1 includes the temperature control element 30 that supplies heat or cold to the electronic component mounting plate 10, the electronic component D can reach the target temperature at high speed and with high accuracy.

  Further, the temperature characteristic measuring apparatus 1 includes the temperature control unit 35 and controls the temperature control element 30 based on the temperature of the temperature measuring master 100 measured by the master temperature measuring apparatus 82. Therefore, the temperature characteristic measuring apparatus 1 is electronic with higher accuracy than before. The part D can reach the target temperature.

  In addition, since the temperature characteristic measuring apparatus 1 includes the probe unit 70 that is electrically joined to all the electronic components D and the temperature measuring master 100 placed on the electronic component mounting plate 10, By bonding the electronic component D to the probe unit 70 at a time, it is possible to shorten the time for measuring the temperature characteristics. Further, since the electronic component D and the temperature measurement master 100 are brought into contact with the probe 72 under the same conditions, the temperature of the temperature measurement master 100 can be brought closer to the temperature of the electronic component D with higher accuracy.

  Moreover, since the temperature characteristic measuring apparatus 1 includes the preheating unit 90 that preheats the electronic component D, the temperature measurement master 100, and the electronic component mounting plate 10 before measuring the temperature characteristic of the electronic component D, the temperature characteristic measurement apparatus 1 measures the temperature characteristic. In this case, it is possible to shorten the time for the electronic component D to reach the target temperature, and the time for measuring the temperature characteristic can be shortened. Further, in the production line of the electronic component D or the like, when the temperature characteristics of the electronic component D placed on the plurality of electronic component mounting plates 10 are continuously measured, the electronic component D or the like is measured during the standby time. By preheating, the total efficiency of the production line and the like can be improved.

  The temperature characteristic measuring apparatus and the temperature characteristic inspection method of the present invention are not limited to the above-described embodiments, and it is needless to say that various changes can be made without departing from the gist of the present invention.

  For example, the temperature characteristic measuring apparatus 1 may include a plurality of sets of the heat transfer plate 20, the temperature control element 30, and the probe unit 70. By doing in this way, the temperature characteristic of the electronic component D can be continuously measured at a plurality of different temperatures.

  Further, the temperature measurement master 100 may be directly connected to the master temperature measurement unit 82 without using the probe unit 70.

  Further, the temperature characteristic measuring apparatus 1 may include a thermostatic chamber that houses the electronic component mounting plate 10 instead of the heat transfer plate 20 and the temperature control element 30. Also in this case, the temperature characteristic of the electronic component D can be measured with higher accuracy than before by measuring the temperature of the temperature measurement master 100. Further, by controlling the temperature in the thermostatic chamber based on the temperature of the temperature measurement master 100, the electronic component D can be made to reach the target temperature with higher accuracy than before.

  Furthermore, in the present embodiment, the temperature measurement master 100 is not limited to the temperature measurement, and an output other than the temperature of the temperature measurement master 100 may be used to evaluate the temperature of the object to be measured. .

  In the present embodiment, the electronic component mounting plate 10 is shown only when the temperature sensor 14 of the component-side temperature measuring device 15 is accommodated in the electronic component mounting plate 10, but the present invention is not limited thereto. Since the temperature state of the electronic component mounting plate 10 can be evaluated with high accuracy by the temperature measurement master 100, the temperature can be controlled using this output result.

  In the present embodiment, the temperature information measured by the temperature measurement master 100 is used for the purpose of feedback for temperature control of the temperature control element 30 in addition to evaluating the output characteristics of the electronic component D. Although cases have been shown, the invention is not so limited. That is, the output result of the temperature measurement master 100 may be used only for the purpose of evaluating the output characteristics of the electronic component D.

  Further, as a method of using the output result of the temperature measurement master 100, the present embodiment shows a case where the temperature of the electronic component D is estimated. However, the temperature characteristic measurement apparatus 1 includes an output characteristic evaluation unit. Is also preferable. This output characteristic evaluation unit uses the temperature information (or temperature converted value) obtained from the output result of the temperature measurement master 100 and outputs the output value (for example, voltage, frequency, etc.) of the electronic component D measured at the same timing. ) Correction (calibration) information is calculated. In this way, the electronic component D can be calibrated based on temperature information (or a temperature converted value) obtained in a very close temperature environment, and as a result, an electronic component D with good output characteristics can be obtained. It becomes possible.

  Further, the actions and effects described in the embodiments of the present invention only list the most preferable actions and effects resulting from the present invention, and the actions and effects according to the present invention are described in the embodiments of the present invention. It is not limited to what was done.

  The temperature characteristic measuring apparatus or temperature characteristic measuring method of the present invention is preferably used for inspection of electronic components whose output is temperature dependent.

DESCRIPTION OF SYMBOLS 1 ... Temperature characteristic measuring device 10 ... Electronic component mounting plate 30 ... Temperature control element 35 ... Temperature control unit 70 ... Probe unit 90 ... Preheating unit 82 ... Master temperature measuring device 100: Master for temperature measurement D: Electronic component

Claims (2)

A temperature characteristic measuring device for measuring the temperature characteristic of an electronic component,
An electronic component mounting plate having an electronic component mounting area on which the electronic component is mounted;
An output measuring device for measuring the output of the electronic component placed in the electronic component placement area;
A temperature measurement master that outputs a temperature-dependent signal placed in the electronic component placement area in the same manner as the electronic component;
A master temperature measurement device for measuring the temperature of the temperature measurement master from the output of the temperature measurement master; and
A first temperature control element for heating or cooling the electronic component placement area;
A second temperature control element that heats or cools the electronic component placement area at a temperature different from that of the first temperature control element,
In the transport path of the electronic component mounting plate, the electronic component area is heated or cooled by the first temperature control element, and the electronic component area is heated or cooled by the second temperature control element. Second position to be set,
Furthermore, a first probe unit is disposed at the first position, and a second probe unit is disposed at the second position.
The first probe unit includes:
Between the first electronic component measurement position for measuring the output of the electronic component placed on the electronic component mounting plate at the first position and the first electronic component retraction position retracted from the first electronic component measurement position, A first electronic component side probe that is movable in the vertical direction;
Between the first retracted position retracted from the first measurement position and the first measurement position for measuring the output of the first position the electronic component mounted on the mounting plate by said temperature measuring master, moved in the vertical direction A free first master side probe ,
The second probe unit includes:
Between the second electronic component measurement position for measuring the output of the electronic component placed on the electronic component mounting plate at the second position and the second electronic component retraction position retracted from the second electronic component measurement position, A second electronic component side probe that is movable in the vertical direction;
Between the second retracted position retracted from the second measurement position and the second measurement position for measuring the output of the second position the electronic component mounted on the mounting plate by said temperature measuring master, moved in the vertical direction A free second master side probe ,
In the first position, the output measurement of the electronic component by the first electronic component side probe and the output measurement of the temperature measurement master by the first master side probe are performed substantially simultaneously,
In the second position, the output measurement of the electronic component by the second electronic component side probe and the output measurement of the temperature measurement master by the second master side probe are performed substantially simultaneously , Temperature characteristic measuring device. A temperature control unit for controlling the first temperature control element or the second temperature control element ;
The temperature control unit controls the first temperature control element or the second temperature control element based on the temperature of the temperature measurement master measured by the master temperature measurement device. Temperature characteristic measuring device.

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