JP5377403B2 - Semiconductor device and circuit board manufacturing method - Google Patents

Semiconductor device and circuit board manufacturing method Download PDF

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JP5377403B2
JP5377403B2 JP2010102802A JP2010102802A JP5377403B2 JP 5377403 B2 JP5377403 B2 JP 5377403B2 JP 2010102802 A JP2010102802 A JP 2010102802A JP 2010102802 A JP2010102802 A JP 2010102802A JP 5377403 B2 JP5377403 B2 JP 5377403B2
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wiring
semiconductor substrate
insulating film
semiconductor
semiconductor device
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JP2010166095A (en
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一郎 三原
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株式会社テラミクロス
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device mounted with a semiconductor structural body 12 on a silicon substrate 1 as a mere substrate. <P>SOLUTION: The silicon substrate 1 has a through hole 2. The upper surface of the silicon substrate 1 which comprises the inside of the through hole 2 is provided with wiring 5. In this case, when the wiring provided in the through hole 2 is cylindrical, a solder ball 21 cannot be provided below the wiring and lower layer wiring is provided on the lower surface of the silicon substrate 1, whereby the solder ball 21 is required to be provided below a connection pad unit of the lower layer wiring, and therefore, the arrangement region of the lower layer wiring becomes necessary, whereby the area of the silicon substrate 1 becomes large. Meanwhile, when the wiring 5 provided in the through hole 2 has a bottomed cylindrical shape, the solder ball 21 can be provided below it, whereby the provision of the lower layer wiring on the lower surface of the silicon substrate is not necessary, and the area of the silicon substrate 1 can be reduced in accordance with the non-necessity of the lower layer wiring. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

この発明は、半導体装置及び回路基板の製造方法に関する。   The present invention relates to a semiconductor device and a method for manufacturing a circuit board.

例えば、従来の半導体装置には、半導体チップをインターポーザを介してプリント配線板上に実装したものがある（例えば、特許文献１参照）。この場合、インターポーザは、シリコン基板の上面及び下面にそれぞれ設けられた上層配線と下層配線とがシリコン基板に形成されたスルーホールの内壁面に設けられた筒状の上下導通部を介して接続され、下層配線の接続パッド部下に半田ボールが設けられた構造となっている。   For example, a conventional semiconductor device includes a semiconductor chip mounted on a printed wiring board via an interposer (see, for example, Patent Document 1). In this case, in the interposer, the upper layer wiring and the lower layer wiring respectively provided on the upper surface and the lower surface of the silicon substrate are connected via a cylindrical vertical conduction portion provided on the inner wall surface of the through hole formed in the silicon substrate. In this structure, solder balls are provided below the connection pads of the lower layer wiring.

特開２００１−３２６３０５号公報JP 2001-326305 A

そして、上記従来の半導体装置では、半導体チップの下面に設けられたパッドがインターポーザの上層配線の接続パッド部に接合されていることにより、半導体チップがインターポーザ上に搭載され、インターポーザの半田ボールがプリント配線板上の接続端子に接合されていることにより、半導体チップがインターポーザを介してプリント配線板上に実装されている。   In the conventional semiconductor device, the pad provided on the lower surface of the semiconductor chip is joined to the connection pad portion of the upper layer wiring of the interposer, so that the semiconductor chip is mounted on the interposer and the solder balls of the interposer are printed. By being bonded to connection terminals on the wiring board, the semiconductor chip is mounted on the printed wiring board via the interposer.

しかしながら、上記従来の半導体装置では、インターポーザの上下導通部が筒状であるので、この筒状の上下導通部の下側の部分に半田ボールを設けることができず、上下導通部に接続された下層配線の接続パッド部下に半田ボールを設けており、下層配線の配置領域を必要とするため、インターポーザの面積が大きくなり、ひいては半導体装置全体が大型化してしまうという問題があった。   However, in the conventional semiconductor device, since the vertical conduction part of the interposer is cylindrical, solder balls cannot be provided on the lower part of the cylindrical vertical conduction part and are connected to the vertical conduction part. Since a solder ball is provided under the connection pad portion of the lower layer wiring and an arrangement region for the lower layer wiring is required, there is a problem that the area of the interposer is increased and, as a result, the entire semiconductor device is increased in size.

そこで、この発明は、小型化することができる回路基板、半導体装置及び回路基板の製造方法を提供することを目的とする。   Accordingly, an object of the present invention is to provide a circuit board, a semiconductor device, and a circuit board manufacturing method that can be reduced in size.

この発明は、上記目的を達成するため、半導体基板、前記半導体基板の下面に積層された保護層、前記半導体基板及び前記保護層に設けられた貫通孔、前記半導体基板の上面に形成され、前記貫通孔内に形成され、かつ該半導体基板の下面側に突出した底部を含み、前記保護層の下面と面一の突出部をもつ有底筒状部を有する配線、前記配線上に形成された柱状電極、及び前記半導体基板上における前記柱状電極間に形成された絶縁膜とを有する回路基板と、前記回路基板上に搭載され、前記柱状電極に電気的に接続された半導体構成体とを具備することを特徴とするものである。 In order to achieve the above object, the present invention is formed on a semiconductor substrate, a protective layer laminated on a lower surface of the semiconductor substrate, a through hole provided in the semiconductor substrate and the protective layer, an upper surface of the semiconductor substrate, It is formed in the through hole, and saw including a bottom portion projecting on the lower surface side of the semiconductor substrate, a wiring having a bottomed cylindrical portion having a protruding portion of the lower surface flush with the protective layer, formed on the wiring A circuit board having a columnar electrode and an insulating film formed between the columnar electrodes on the semiconductor substrate, and a semiconductor structure mounted on the circuit board and electrically connected to the columnar electrode. It is characterized by comprising.

この発明によれば、貫通孔を有する半導体基板の上面に、半導体基板の貫通孔内に形成された有底筒状部を有する配線を形成し、貫通孔内の配線の有底筒状部の底部を接続パッド部としているので、半導体基板下に接続パッド部を有する下層配線を設ける必要がなく、それに応じて半導体基板の面積を小さくすることができ、ひいては小型化することができる。   According to the present invention, the wiring having the bottomed cylindrical portion formed in the through hole of the semiconductor substrate is formed on the upper surface of the semiconductor substrate having the through hole, and the bottomed cylindrical portion of the wiring in the through hole is formed. Since the bottom part is used as the connection pad part, it is not necessary to provide a lower layer wiring having the connection pad part under the semiconductor substrate, and the area of the semiconductor substrate can be reduced accordingly, and the size can be reduced.

この発明の第１実施形態としての半導体装置の断面図。1 is a cross-sectional view of a semiconductor device as a first embodiment of the present invention. 図１に示す半導体装置の製造方法の一例において、当初用意したものの断面図。Sectional drawing of what was prepared initially in an example of the manufacturing method of the semiconductor device shown in FIG. 図２に続く工程の断面図。Sectional drawing of the process following FIG. 図３に続く工程の断面図。Sectional drawing of the process following FIG. 図４に続く工程の断面図。Sectional drawing of the process following FIG. 図５に続く工程の断面図。Sectional drawing of the process following FIG. 図６に続く工程の断面図。Sectional drawing of the process following FIG. 図７に続く工程の断面図。Sectional drawing of the process following FIG. 図８に続く工程の断面図。FIG. 9 is a cross-sectional view of the process following FIG. 8. 図９に続く工程の断面図。Sectional drawing of the process following FIG. 図１０に続く工程の断面図。Sectional drawing of the process following FIG. 図１１に続く工程の断面図。Sectional drawing of the process following FIG. 図１２に続く工程の断面図。Sectional drawing of the process following FIG. 図１３に続く工程の断面図。Sectional drawing of the process following FIG. この発明の第２実施形態としての半導体装置の断面図。Sectional drawing of the semiconductor device as 2nd Embodiment of this invention. 図１５に示す半導体装置の製造方法の一例において、所定の工程の断面図。FIG. 16 is a cross-sectional view of a predetermined step in the example of the method for manufacturing the semiconductor device shown in FIG. 図１６に続く工程の断面図。FIG. 17 is a cross-sectional view of the process following FIG. 16. 図１７に続く工程の断面図。FIG. 18 is a cross-sectional view of the process following FIG. 17. この発明の第３実施形態としての半導体装置の断面図。Sectional drawing of the semiconductor device as 3rd Embodiment of this invention. この発明の第４実施形態としての半導体装置の断面図。Sectional drawing of the semiconductor device as 4th Embodiment of this invention. この発明の第５実施形態としての半導体装置の断面図。Sectional drawing of the semiconductor device as 5th Embodiment of this invention. 図１に示す半導体装置の製造方法の一例において、当初用意したものの断面図。Sectional drawing of what was prepared initially in an example of the manufacturing method of the semiconductor device shown in FIG. 図２２に続く工程の断面図。FIG. 23 is a sectional view of a step following FIG. 22; 図２３に続く工程の断面図。FIG. 24 is a sectional view of a step following FIG. 23. 図２４に続く工程の断面図。FIG. 25 is a sectional view of a step following FIG. 24. 図２５に続く工程の断面図。FIG. 26 is a sectional view of a step following FIG. 25. 図２６に続く工程の断面図。FIG. 27 is a sectional view of a step following FIG. 26; 図２７に続く工程の断面図。FIG. 28 is a sectional view of a step following FIG. 27. 図２８に続く工程の断面図。FIG. 29 is a sectional view of a step following FIG. 28. 図２９に続く工程の断面図。FIG. 30 is a sectional view of a step following FIG. 29;

（第１参考例）
図１はこの発明の第１参考例としての半導体装置の断面図を示す。この半導体装置は平面方形状の単なる基板としてのシリコン基板（半導体基板）１を備えている。シリコン基板１の複数の箇所には貫通孔２が設けられている。貫通孔２の内壁面を含むシリコン基板１の上面には酸化シリコン等からなる下地絶縁膜３が設けられている。この場合、貫通孔２の内壁面に設けられた下地絶縁膜３は筒状となっている。 (First Reference Example )
FIG. 1 is a sectional view of a semiconductor device as a first reference example of the present invention. This semiconductor device includes a silicon substrate (semiconductor substrate) 1 as a simple substrate having a planar square shape. Through holes 2 are provided at a plurality of locations on the silicon substrate 1. A base insulating film 3 made of silicon oxide or the like is provided on the upper surface of the silicon substrate 1 including the inner wall surface of the through hole 2. In this case, the base insulating film 3 provided on the inner wall surface of the through hole 2 has a cylindrical shape.

貫通孔２内の筒状の下地絶縁膜３の内壁面を含む下地絶縁膜３の上面には銅等からなる第１の下地金属層４が設けられている。この場合、貫通孔２内の筒状の下地絶縁膜３の内壁面に設けられた第１の下地金属層４は筒状となっている。貫通孔２内の筒状の第１の下地金属層４の内壁面を含む第１の下地金属層４の上面全体には銅からなる第１の配線５が設けられている。この場合、貫通孔２内の筒状の第１の下地金属層４の内壁面に設けられた第１の配線５は有底筒状であって貫通孔２を閉塞している。ここで、貫通孔２内に設けられた下地絶縁膜３、第１の下地金属層４及び第１の配線５の下面はシリコン基板１の下面と面一となっている。   A first base metal layer 4 made of copper or the like is provided on the upper surface of the base insulating film 3 including the inner wall surface of the cylindrical base insulating film 3 in the through hole 2. In this case, the first base metal layer 4 provided on the inner wall surface of the cylindrical base insulating film 3 in the through hole 2 has a cylindrical shape. A first wiring 5 made of copper is provided on the entire upper surface of the first base metal layer 4 including the inner wall surface of the cylindrical first base metal layer 4 in the through hole 2. In this case, the first wiring 5 provided on the inner wall surface of the cylindrical first base metal layer 4 in the through hole 2 has a bottomed cylindrical shape and closes the through hole 2. Here, the lower surfaces of the base insulating film 3, the first base metal layer 4, and the first wiring 5 provided in the through hole 2 are flush with the lower surface of the silicon substrate 1.

第１の配線５の接続パッド部上面には銅からなる柱状電極６が設けられている。第１の配線５を含む下地絶縁膜３の上面にはポリイミド系樹脂等からなる絶縁膜７がその上面が柱状電極６の上面と面一となるように設けられている。柱状電極６の上面を含む絶縁膜７の上面には銅等からなる第２の下地金属層８が設けられている。第２の下地金属層８の上面全体には銅からなる第２の配線９が設けられている。第２の配線９を含む絶縁膜７の上面にはソルダーレジスト等からなる上層オーバーコート膜１０が設けられている。第２の配線９の接続パッド部に対応する部分における上層オーバーコート膜１０には開口部１１が設けられている。   A columnar electrode 6 made of copper is provided on the upper surface of the connection pad portion of the first wiring 5. An insulating film 7 made of polyimide resin or the like is provided on the upper surface of the base insulating film 3 including the first wiring 5 so that the upper surface is flush with the upper surface of the columnar electrode 6. A second base metal layer 8 made of copper or the like is provided on the upper surface of the insulating film 7 including the upper surface of the columnar electrode 6. A second wiring 9 made of copper is provided on the entire upper surface of the second base metal layer 8. An upper overcoat film 10 made of a solder resist or the like is provided on the upper surface of the insulating film 7 including the second wiring 9. An opening 11 is provided in the upper overcoat film 10 in a portion corresponding to the connection pad portion of the second wiring 9.

上層オーバーコート膜１０上には半導体構成体１２が搭載されている。この場合、半導体構成体１２は、一般的にはベアチップと呼ばれるものであり、シリコン基板（半導体基板）１３の下面周辺部に複数の接続パッド１４が設けられ、接続パッド１４の中央部を除くシリコン基板１３の下面に酸化シリコン等からなる絶縁膜１５が設けられ、絶縁膜１５の下面に銅等からなる下地金属層１６及び銅からなる下層接続パッド１７が接続パッド１４に接続されて設けられ、下層接続パッド１７下に半田ボール１８が設けられた構造となっている。   A semiconductor structure 12 is mounted on the upper overcoat film 10. In this case, the semiconductor structure 12 is generally referred to as a bare chip, and a plurality of connection pads 14 are provided around the lower surface of a silicon substrate (semiconductor substrate) 13. An insulating film 15 made of silicon oxide or the like is provided on the lower surface of the substrate 13, and a base metal layer 16 made of copper or the like and a lower layer connection pad 17 made of copper are connected to the connection pad 14 on the lower surface of the insulating film 15, The structure is such that solder balls 18 are provided under the lower layer connection pads 17.

この場合、シリコン基板１３の下面には所定の機能の集積回路（図示せず）が設けられ、この集積回路には接続パッド１４が接続されている。そして、半導体構成体１２は、その半田ボール１８が上層オーバーコート膜１０の開口部１１を介して第２の配線９の接続パッド部上面に接合された状態で、上層オーバーコート膜１０上に搭載されている。   In this case, an integrated circuit (not shown) having a predetermined function is provided on the lower surface of the silicon substrate 13, and a connection pad 14 is connected to the integrated circuit. The semiconductor structure 12 is mounted on the upper overcoat film 10 in a state where the solder ball 18 is bonded to the upper surface of the connection pad portion of the second wiring 9 through the opening 11 of the upper overcoat film 10. Has been.

シリコン基板１の貫通孔２内に設けられた下地絶縁膜３、第１の下地金属層４及び第１の配線５の下面を含むシリコン基板１の下面にはソルダーレジスト等からなる下層オーバーコート膜１９が設けられている。シリコン基板１の貫通孔２内の有底筒状の第１の配線５の下面中央部（接続パッド部）に対応する部分における下層オーバーコート膜１９には開口部２０が設けられている。下層オーバーコート膜１９の開口部２０内及びその下側には半田ボール２１がシリコン基板１の貫通孔２内の有底筒状の第１の配線５の下面中央部（接続パッド部）に接続されて設けられている。   A lower overcoat film made of solder resist or the like on the lower surface of the silicon substrate 1 including the lower surface of the base insulating film 3, the first base metal layer 4, and the first wiring 5 provided in the through hole 2 of the silicon substrate 1. 19 is provided. An opening 20 is provided in the lower overcoat film 19 in a portion corresponding to the lower surface center portion (connection pad portion) of the bottomed cylindrical first wiring 5 in the through hole 2 of the silicon substrate 1. Solder balls 21 are connected to the bottom center part (connection pad part) of the bottomed cylindrical first wiring 5 in the through hole 2 of the silicon substrate 1 in the opening 20 of the lower overcoat film 19 and below the opening 20. Has been provided.

次に、この半導体装置の製造方法の一例について説明する。まず、図２に示すように、ウエハ状態の単なるシリコン基板１を用意する。この場合、ウエハ状態のシリコン基板１の厚さは、図１に示すシリコン基板１の厚さよりもある程度厚くなっている。次に、シリコン基板１の上面の貫通孔２形成領域に、レーザビームを照射するレーザ加工等により、ある程度の深さの凹部２ａを形成する。ここで、一例として、ウエハ状態のシリコン基板１の厚さが５００μｍである場合には、凹部２ａの深さを３００μｍ程度とし、直径を５０μｍ程度とする。   Next, an example of a method for manufacturing this semiconductor device will be described. First, as shown in FIG. 2, a simple silicon substrate 1 in a wafer state is prepared. In this case, the thickness of the silicon substrate 1 in the wafer state is somewhat thicker than the thickness of the silicon substrate 1 shown in FIG. Next, a recess 2 a having a certain depth is formed in the through hole 2 formation region on the upper surface of the silicon substrate 1 by laser processing or the like that irradiates a laser beam. Here, as an example, when the thickness of the silicon substrate 1 in the wafer state is 500 μm, the depth of the recess 2 a is set to about 300 μm and the diameter is set to about 50 μm.

次に、図３に示すように、凹部２ａ内を含むシリコン基板１の上面に下地絶縁膜３を形成する。この場合、下地絶縁膜３の材料及び形成方法は、凹部２ａのアスペクト比に応じて選定するようにしてもよい。例えば、凹部２ａのアスペクト比が比較的高い場合には、ＣＶＤ法により、酸化シリコン等の無機系材料を成膜するようにしてもよい。一方、凹部２ａのアスペクト比が比較的低い場合には、スクリーン印刷法等により、ポリイミド系樹脂等の有機系材料を塗布するようにしてもよい。   Next, as shown in FIG. 3, a base insulating film 3 is formed on the upper surface of the silicon substrate 1 including the inside of the recess 2a. In this case, the material and forming method of the base insulating film 3 may be selected according to the aspect ratio of the recess 2a. For example, when the aspect ratio of the recess 2a is relatively high, an inorganic material such as silicon oxide may be formed by a CVD method. On the other hand, when the aspect ratio of the recess 2a is relatively low, an organic material such as a polyimide resin may be applied by a screen printing method or the like.

次に、図４に示すように、下地絶縁膜３の上面全体に第１の下地金属層４を形成する。この場合、第１の下地金属層４は、無電解メッキにより形成された銅層のみであってもよく、またスパッタ法により形成された銅層のみであってもよく、さらにスパッタ法により形成されたチタン等の薄膜層上にスパッタ法により銅層を形成したものであってもよい。   Next, as shown in FIG. 4, a first base metal layer 4 is formed on the entire top surface of the base insulating film 3. In this case, the first base metal layer 4 may be only a copper layer formed by electroless plating, may be only a copper layer formed by sputtering, or is formed by sputtering. In addition, a copper layer may be formed by sputtering on a thin film layer such as titanium.

次に、第１の下地金属層４の上面にメッキレジスト膜３１をパターン形成する。この場合、第１の配線５形成領域に対応する部分におけるメッキレジスト膜３１には開口部３２が形成されている。次に、第１の下地金属層４をメッキ電流路として銅の電解メッキを行なうことにより、メッキレジスト膜３１の開口部３２内の第１の下地金属層４の上面に第１の配線５を形成する。第１の配線５はシリコン基板１の上面に対応する部分ではこの上面に沿った平坦部を有し、シリコン基板１の凹部２ａに対応する部分では、凹部２ａの底面に対応して形成される底部５ａと凹部２ａの側面に対応して形成される側部５ｂを有する有底筒状部を有する。次に、メッキレジスト膜３１を剥離する。   Next, a plating resist film 31 is pattern-formed on the upper surface of the first base metal layer 4. In this case, an opening 32 is formed in the plating resist film 31 in a portion corresponding to the first wiring 5 formation region. Next, the first wiring 5 is formed on the upper surface of the first base metal layer 4 in the opening 32 of the plating resist film 31 by performing copper electroplating using the first base metal layer 4 as a plating current path. Form. The first wiring 5 has a flat portion along the upper surface at a portion corresponding to the upper surface of the silicon substrate 1, and is formed corresponding to the bottom surface of the concave portion 2a at a portion corresponding to the concave portion 2a of the silicon substrate 1. It has a bottomed cylindrical part having a side part 5b formed corresponding to the side face of the bottom part 5a and the recess 2a. Next, the plating resist film 31 is peeled off.

次に、図５に示すように、第１の配線５を含む第１の下地金属層４の上面にメッキレジスト膜３３をパターン形成する。この場合、柱状電極６形成領域に対応する部分におけるメッキレジスト膜３３には開口部３４が形成されている。次に、第１の下地金属層４をメッキ電流路とした銅の電解メッキを行うことにより、メッキレジスト膜３３の開口部３４内の第１の配線５の接続パッド部上面に柱状電極６を形成する。次に、メッキレジスト膜３３を剥離し、次いで、第１の配線５をマスクとして第１の下地金属層４の不要な部分をエッチングして除去すると、図６に示すように、第１の配線５下にのみ第１の下地金属層４が残存される。   Next, as shown in FIG. 5, a plating resist film 33 is pattern-formed on the upper surface of the first base metal layer 4 including the first wiring 5. In this case, an opening 34 is formed in the plating resist film 33 in a portion corresponding to the columnar electrode 6 formation region. Next, by performing electrolytic plating of copper using the first base metal layer 4 as a plating current path, the columnar electrode 6 is formed on the upper surface of the connection pad portion of the first wiring 5 in the opening 34 of the plating resist film 33. Form. Next, the plating resist film 33 is peeled off, and then unnecessary portions of the first base metal layer 4 are removed by etching using the first wiring 5 as a mask. As shown in FIG. 5, the first base metal layer 4 remains only below.

次に、図７に示すように、スクリーン印刷法やスピンコート法等により、第１の配線５及び柱状電極６を含む下地絶縁膜３の上面にポリイミド系樹脂等からなる絶縁膜７をその厚さが柱状電極６の高さよりも厚くなるように形成する。したがって、この状態では、柱状電極６の上面は絶縁膜７によって覆われている。次に、絶縁膜７及び柱状電極６の上面側を適宜に研磨し、図８に示すように、柱状電極６の上面を露出させるとともに、この露出された柱状電極６の上面を含む絶縁膜７の上面を平坦化する。   Next, as shown in FIG. 7, an insulating film 7 made of polyimide resin or the like is formed on the upper surface of the base insulating film 3 including the first wiring 5 and the columnar electrode 6 by screen printing, spin coating, or the like. Is formed to be thicker than the height of the columnar electrode 6. Therefore, in this state, the upper surface of the columnar electrode 6 is covered with the insulating film 7. Next, the insulating film 7 and the upper surface side of the columnar electrode 6 are appropriately polished to expose the upper surface of the columnar electrode 6 as shown in FIG. 8, and the insulating film 7 including the exposed upper surface of the columnar electrode 6. The upper surface of the substrate is flattened.

次に、図９に示すように、柱状電極６の上面を含む絶縁膜７の上面全体に、無電解メッキ等により、銅等からなる第２の下地金属層８を形成する。次に、第２の下地金属層８の上面にメッキレジスト膜３５をパターン形成する。この場合、第２の配線９形成領域に対応する部分におけるメッキレジスト膜３５には開口部３６が形成されている。   Next, as shown in FIG. 9, a second base metal layer 8 made of copper or the like is formed on the entire upper surface of the insulating film 7 including the upper surface of the columnar electrode 6 by electroless plating or the like. Next, a plating resist film 35 is patterned on the upper surface of the second base metal layer 8. In this case, an opening 36 is formed in the plating resist film 35 in a portion corresponding to the second wiring 9 formation region.

次に、第２の下地金属層８をメッキ電流路として銅の電解メッキを行なうことにより、メッキレジスト膜３５の開口部３６内の第２の下地金属層８の上面に第２の配線９を形成する。次に、メッキレジスト膜３５を剥離し、次いで、第２の配線９をマスクとして第２の下地金属層８の不要な部分をエッチングして除去すると、図１０に示すように、第２の配線９下にのみ第２の下地金属層８が残存される。   Next, by performing copper electrolytic plating using the second base metal layer 8 as a plating current path, the second wiring 9 is formed on the upper surface of the second base metal layer 8 in the opening 36 of the plating resist film 35. Form. Next, the plating resist film 35 is peeled off, and then unnecessary portions of the second base metal layer 8 are removed by etching using the second wiring 9 as a mask. As shown in FIG. The second base metal layer 8 remains only under the substrate 9.

次に、図１１に示すように、スクリーン印刷法やスピンコート法等により、第２の配線９を含む絶縁膜７の上面にソルダーレジスト等からなる上層オーバーコート膜１０を形成する。この場合、第２の配線９の接続パッド部に対応する部分における上層オーバーコート膜１０には開口部１１が形成されている。   Next, as shown in FIG. 11, an upper overcoat film 10 made of a solder resist or the like is formed on the upper surface of the insulating film 7 including the second wiring 9 by screen printing, spin coating, or the like. In this case, an opening 11 is formed in the upper overcoat film 10 in a portion corresponding to the connection pad portion of the second wiring 9.

次に、シリコン基板１の凹部２ａ内に形成された下地絶縁膜３及び第１の下地金属層４を含むシリコン基板１の下面側を、凹部２ａ内に形成された有底筒状の第１の配線５の底部が少なくとも露出するまで研磨またはエッチングすると、図１２に示すようになる。この状態では、シリコン基板１に凹部２ａの残りからなる貫通孔２が形成され、この貫通孔２内に形成された筒状の下地絶縁膜３、筒状の第１の下地金属層４及び有底筒状の第１の配線５の下面がシリコン基板１の下面と面一となる。この場合、第１の配線５の有底筒状部を構成する底部５ａの表面はシリコン基板１と共に除去してもよいが、必ず、底部５ａは残存されるようにすることが重要である。   Next, the bottomed cylindrical first formed on the bottom surface of the silicon substrate 1 including the base insulating film 3 and the first base metal layer 4 formed in the recess 2a of the silicon substrate 1 is formed in the recess 2a. When polishing or etching is performed until at least the bottom of the wiring 5 is exposed, the result is as shown in FIG. In this state, a through hole 2 consisting of the remainder of the recess 2a is formed in the silicon substrate 1, and the cylindrical base insulating film 3, the cylindrical first base metal layer 4 and the presence of the cylindrical base insulating film 3 formed in the through hole 2 are formed. The lower surface of the bottom cylindrical first wiring 5 is flush with the lower surface of the silicon substrate 1. In this case, the surface of the bottom 5a constituting the bottomed cylindrical portion of the first wiring 5 may be removed together with the silicon substrate 1, but it is important that the bottom 5a is always left.

次に、図１３に示すように、スクリーン印刷法やスピンコート法等により、シリコン基板１の貫通孔２内に形成された下地絶縁膜３、第１の下地金属層４及び第１の配線５の下面を含むシリコン基板１の下面にソルダーレジスト等からなる下層オーバーコート膜１９を形成する。この場合、シリコン基板１の貫通孔２内に形成された第１の配線５の有底筒状部の底部５ａ（接続パッド部）に対応する部分における下層オーバーコート膜１９には開口部２０が形成されている。   Next, as shown in FIG. 13, the base insulating film 3, the first base metal layer 4, and the first wiring 5 formed in the through hole 2 of the silicon substrate 1 by screen printing, spin coating, or the like. A lower overcoat film 19 made of a solder resist or the like is formed on the lower surface of the silicon substrate 1 including the lower surface. In this case, an opening 20 is formed in the lower overcoat film 19 in a portion corresponding to the bottom portion 5a (connection pad portion) of the bottomed cylindrical portion of the first wiring 5 formed in the through hole 2 of the silicon substrate 1. Is formed.

次に、図１４に示すように、下層オーバーコート膜１９の開口部２０内及びその下側に半田ボール２１をシリコン基板１の貫通孔２内に形成された第１の配線５の有底筒状部の底部５ａに接続させて形成し、且つ、上層オーバーコート膜１０の開口部１１を介して露出された第２の配線９の接続パッド上面に、別途、製造しておいた半導体構成体１２の半田ボール１８を接合する。次に、ダイシング工程を経ると、図１に示す半導体装置が複数個得られる。   Next, as shown in FIG. 14, the bottomed tube of the first wiring 5 in which the solder ball 21 is formed in the through hole 2 of the silicon substrate 1 in and below the opening 20 of the lower overcoat film 19. A semiconductor structure separately formed on the upper surface of the connection pad of the second wiring 9 formed to be connected to the bottom 5a of the shape portion and exposed through the opening 11 of the upper overcoat film 10 Twelve solder balls 18 are joined. Next, through a dicing process, a plurality of semiconductor devices shown in FIG. 1 are obtained.

このようにして得られた半導体装置では、シリコン基板１の貫通孔２内に有底筒状部を有する第１の配線５からなる上下導通部を設けているので、この第１の配線５の有底筒状部からなる上下導通部の底部５ａに半田ボール２１を設けることができ、従来のような下層配線が不要となり、それに応じてシリコン基板１の面積を小さくすることができ、ひいては半導体装置全体を小型化することができる。   In the semiconductor device obtained in this way, since the vertical conduction portion including the first wiring 5 having the bottomed cylindrical portion is provided in the through hole 2 of the silicon substrate 1, The solder ball 21 can be provided on the bottom portion 5a of the vertical conduction portion made of a bottomed cylindrical portion, so that the conventional lower layer wiring is not required, the area of the silicon substrate 1 can be reduced accordingly, and the semiconductor The entire apparatus can be reduced in size.

なお、図１において、第２の下地金属層８及び第２の配線９を省略し、半導体構成体１２の半田ボール１８を上層オーバーコート膜１０の開口部１１を介して柱状電極６の上面に接合するようにしてもよい。この場合、さらに、上層オーバーコート膜１０を省略してもよい。また、シリコン基板１の凹部２ａの深さを、例えば３０〜６０μｍ程度に浅くすれば、これに応じて第１の配線５の有底筒状部の底部５ａと側部５ｂの上端との段差は小さくなるので、柱状電極６を第１の配線５の有底筒状部上、すなわち、底部５ａ上、または、底部５ａ上及び側部５ｂ上に跨って形成することもできる。   In FIG. 1, the second base metal layer 8 and the second wiring 9 are omitted, and the solder ball 18 of the semiconductor structure 12 is placed on the upper surface of the columnar electrode 6 through the opening 11 of the upper overcoat film 10. You may make it join. In this case, the upper overcoat film 10 may be omitted. Further, if the depth of the concave portion 2a of the silicon substrate 1 is reduced to, for example, about 30 to 60 [mu] m, the step between the bottom portion 5a of the bottomed cylindrical portion of the first wiring 5 and the upper end of the side portion 5b correspondingly. Therefore, the columnar electrode 6 can be formed on the bottomed cylindrical portion of the first wiring 5, that is, on the bottom 5a, or on the bottom 5a and the side 5b.

（実施形態）
図１５はこの発明の実施形態としての半導体装置の断面図を示す。この半導体装置において、図１に示す半導体装置と異なる点は、シリコン基板１の厚さを薄くし、シリコン基板１の貫通孔２内に設けられた下地絶縁膜３、第１の下地金属層４及び第１の配線５をシリコン基板１の下面側に突出させ、シリコン基板１の下面にポリイミド系樹脂等からなる保護膜２２をその下面がシリコン基板１の下面側に突出された下地絶縁膜３、第１の下地金属層４及び第１の配線５の下面と面一となるように設けた点である。 (Embodiment)
FIG. 15 is a sectional view of a semiconductor device as an embodiment of the present invention. This semiconductor device is different from the semiconductor device shown in FIG. 1 in that the thickness of the silicon substrate 1 is reduced, and a base insulating film 3 and a first base metal layer 4 provided in the through hole 2 of the silicon substrate 1. The first wiring 5 is protruded to the lower surface side of the silicon substrate 1, and the protective film 22 made of polyimide resin or the like is formed on the lower surface of the silicon substrate 1. The base insulating film 3 whose lower surface protrudes to the lower surface side of the silicon substrate 1. The first base metal layer 4 and the first wiring 5 are provided so as to be flush with the lower surfaces of the first base metal layer 4 and the first wiring 5.

次に、この半導体装置の製造方法の一例について説明する。まず、図１２に示すように、シリコン基板１等の下面側を研磨し、シリコン基板１の貫通孔２内に形成された第１の配線８の有底筒状部の下面を露出させる。次に、図１６に示すように、シリコン基板１の下面側をフッ酸等のエッチング液を用いて適宜にエッチングし、シリコン基板１の厚さを適宜に薄くする。この状態では、シリコン基板１の貫通孔２内に形成された下地絶縁膜３、第１の下地金属層４及び第１の配線５の下面はシリコン基板１の下面側に適宜に突出される。以下、この突出部を、説明の便宜上、突出部Ａという。   Next, an example of a method for manufacturing this semiconductor device will be described. First, as shown in FIG. 12, the lower surface side of the silicon substrate 1 or the like is polished, and the lower surface of the bottomed cylindrical portion of the first wiring 8 formed in the through hole 2 of the silicon substrate 1 is exposed. Next, as shown in FIG. 16, the lower surface side of the silicon substrate 1 is appropriately etched using an etchant such as hydrofluoric acid, so that the thickness of the silicon substrate 1 is appropriately reduced. In this state, the lower surface of the base insulating film 3, the first base metal layer 4, and the first wiring 5 formed in the through hole 2 of the silicon substrate 1 is appropriately projected to the lower surface side of the silicon substrate 1. Hereinafter, this protrusion is referred to as a protrusion A for convenience of explanation.

次に、図１７に示すように、スクリーン印刷法やスピンコート法等により、突出部Ａを含むシリコン基板１の下面にポリイミド系樹脂等からなる保護膜２２をその厚さが突出部Ａの高さよりも厚くなるように形成する。したがって、この状態では、突出部Ａの下面は保護膜２２によって覆われている。次に、保護膜２２の下面側を適宜に研磨またはエッチングし、図１８に示すように、突出部Ａの下面を露出させるとともに、この露出された突出部Ａの下面を含む保護膜２２の下面を平坦化する。この後、図１３及び図１４に示す工程を経た後にダイシングを行うと、図１５に示す半導体装置が複数個得られる。   Next, as shown in FIG. 17, a protective film 22 made of a polyimide-based resin or the like is formed on the lower surface of the silicon substrate 1 including the protrusion A by a screen printing method, a spin coating method, or the like. It is formed to be thicker than the thickness. Therefore, in this state, the lower surface of the protrusion A is covered with the protective film 22. Next, the lower surface side of the protective film 22 is appropriately polished or etched to expose the lower surface of the projecting portion A and the lower surface of the protective film 22 including the exposed lower surface of the projecting portion A as shown in FIG. To flatten. Thereafter, dicing is performed after the steps shown in FIGS. 13 and 14 to obtain a plurality of semiconductor devices shown in FIG.

（第２参考例）
図１９はこの発明の第２参考例としての半導体装置の断面図を示す。この半導体装置において、図１に示す半導体装置と大きく異なる点は、上層オーバーコート膜１０上に半導体構成体１２をフェイスアップ状態でワイヤボンディングした点である。この場合、半導体構成体１２は、図１に示す下地金属層１６、下層接続パッド１７及び半田ボール１８を有していない構造となっている。 ( Second reference example )
FIG. 19 is a sectional view of a semiconductor device as a second reference example of the present invention. This semiconductor device is different from the semiconductor device shown in FIG. 1 in that the semiconductor structure 12 is wire-bonded on the upper overcoat film 10 in a face-up state. In this case, the semiconductor structure 12 has a structure that does not include the base metal layer 16, the lower layer connection pad 17, and the solder ball 18 shown in FIG. 1.

そして、半導体構成体１２は、シリコン基板１３の下面に設けられたダイボンド材からなる接着層２３を介して上層オーバーコート膜１０の上面に接着されている。半導体構成体１２の接続パッド１４は、ボンディングワイヤ２４を介して、上層オーバーコート膜１０の開口部１１を介して露出された第２の配線９の接続パッド部上面に接続されている。半導体構成体１２及びボンディングワイヤ２４を含む上層オーバーコート膜１０の上面にはエポキシ系樹脂等からなる封止材２５が設けられている。   The semiconductor structure 12 is bonded to the upper surface of the upper overcoat film 10 via an adhesive layer 23 made of a die bond material provided on the lower surface of the silicon substrate 13. The connection pad 14 of the semiconductor structure 12 is connected to the upper surface of the connection pad portion of the second wiring 9 exposed through the opening 11 of the upper overcoat film 10 via the bonding wire 24. A sealing material 25 made of epoxy resin or the like is provided on the upper surface of the upper overcoat film 10 including the semiconductor structure 12 and the bonding wires 24.

（第２参考例の変形例）
第２参考例において、シリコン基板１の貫通孔２の深さを浅くし、柱状電極６を第１の配線５の有底筒状部上、すなわち、底部５ａ上、または、底部５ａ上及び側部５ｂ上に跨って形成することもできる。この場合、第２の配線９及び上層オーバーコート膜１０を形成せず、柱状電極６の表面を絶縁膜７の上面と同一平面とし、直接、外部に露出すれば、半導体構成体１２を絶縁膜７上に搭載して、ボンディングワイヤ２４により半導体構成体１２の接続パッド１４と柱状電極６を直接接続することができる。 (Modification of the second reference example)
In the second reference example , the depth of the through hole 2 of the silicon substrate 1 is reduced, and the columnar electrode 6 is placed on the bottomed cylindrical portion of the first wiring 5, that is, on the bottom 5a or on the bottom 5a and the side. It can also be formed over the portion 5b. In this case, if the second wiring 9 and the upper overcoat film 10 are not formed, and the surface of the columnar electrode 6 is flush with the upper surface of the insulating film 7 and directly exposed to the outside, the semiconductor structure 12 is formed into the insulating film. 7, the connection pads 14 of the semiconductor structure 12 and the columnar electrodes 6 can be directly connected by the bonding wires 24.

（第３参考例）
図２０はこの発明の第３参考例としての半導体装置の断面図を示す。この半導体装置において、図１に示す半導体装置と大きく異なる点は、上層オーバーコート膜１０の開口部１１内及びその上側に半田ボール２１を第２の配線９の接続パッド部上面に接続させて設け、且つ、半導体構成体１２の半田ボール１８を、下層オーバーコート膜１９の開口部２０を介して、第１の配線５の有底筒状部の底部５ａに接合させることにより、半導体構成体１２を下層オーバーコート膜１９下に搭載した点である。 ( Third reference example )
FIG. 20 is a sectional view of a semiconductor device as a third reference example of the present invention. This semiconductor device differs greatly from the semiconductor device shown in FIG. 1 in that a solder ball 21 is provided on the upper surface of the connection pad portion of the second wiring 9 in and above the opening 11 of the upper overcoat film 10. In addition, the solder ball 18 of the semiconductor structure 12 is joined to the bottom portion 5a of the bottomed cylindrical portion of the first wiring 5 through the opening 20 of the lower overcoat film 19, so that the semiconductor structure 12 Is mounted under the lower overcoat film 19.

（第４参考例）
図２１はこの発明の第４参考例としての半導体装置の断面図を示す。この半導体装置において、図１に示す半導体装置と大きく異なる点は、シリコン基板１と上層オーバーコート膜１０下に設けられた第２の配線９との間に半導体構成体４１を設け、第１の配線５と第２の配線９とを上下導通部５５を介して接続した点である。 ( 4th reference example )
FIG. 21 is a sectional view of a semiconductor device as a fourth reference example of the present invention. This semiconductor device differs greatly from the semiconductor device shown in FIG. 1 in that a semiconductor structure 41 is provided between the silicon substrate 1 and the second wiring 9 provided under the upper overcoat film 10, and the first This is that the wiring 5 and the second wiring 9 are connected via the vertical conduction portion 55.

次に、この半導体装置の一部について詳細に説明する。第１の配線５を含む下地絶縁膜３の上面にはポリイミド系樹脂等からなる第１の絶縁膜７Ａが設けられている。第１の絶縁膜７Ａの上面には、シリコン基板１のサイズよりもある程度小さいサイズの平面方形状の半導体構成体４１の下面がダイボンド材からなる接着層４２を介して接着されている。   Next, a part of the semiconductor device will be described in detail. On the upper surface of the base insulating film 3 including the first wiring 5, a first insulating film 7A made of polyimide resin or the like is provided. On the upper surface of the first insulating film 7A, the lower surface of the planar rectangular semiconductor structure 41 having a size somewhat smaller than the size of the silicon substrate 1 is bonded via an adhesive layer 42 made of a die bond material.

半導体構成体４１は、一般的にはＣＳＰ(chip size package)と呼ばれるものであり、シリコン基板（半導体基板）４３を備えている。シリコン基板４３の下面は接着層４２を介して第１の絶縁膜７Ａの上面に接着されている。シリコン基板４３の上面には所定の機能の集積回路（図示せず）が設けられ、上面周辺部にはアルミニウム系金属等からなる複数の接続パッド４４が集積回路に接続されて設けられている。   The semiconductor structure 41 is generally called a CSP (chip size package) and includes a silicon substrate (semiconductor substrate) 43. The lower surface of the silicon substrate 43 is bonded to the upper surface of the first insulating film 7A through the adhesive layer 42. An integrated circuit (not shown) having a predetermined function is provided on the upper surface of the silicon substrate 43, and a plurality of connection pads 44 made of aluminum-based metal or the like are provided on the periphery of the upper surface so as to be connected to the integrated circuit.

接続パッド４４の中央部を除くシリコン基板４３の上面には酸化シリコン等からなる絶縁膜４５が設けられ、接続パッド４４の中央部は絶縁膜４５に設けられた開口部４６を介して露出されている。絶縁膜４５の上面にはポリイミド系樹脂等からなる保護膜４７が設けられている。絶縁膜４５の開口部４６に対応する部分における保護膜４７には開口部４８が設けられている。   An insulating film 45 made of silicon oxide or the like is provided on the upper surface of the silicon substrate 43 excluding the central portion of the connection pad 44, and the central portion of the connection pad 44 is exposed through an opening 46 provided in the insulating film 45. Yes. A protective film 47 made of polyimide resin or the like is provided on the upper surface of the insulating film 45. An opening 48 is provided in the protective film 47 in a portion corresponding to the opening 46 of the insulating film 45.

保護膜４７の上面には銅等からなる下地金属層４９が設けられている。下地金属層４９の上面全体には銅からなる配線５０が設けられている。下地金属層４９を含む配線５０の一端部は、絶縁膜４５及び保護膜４７の開口部４６、４８を介して接続パッド４４に接続されている。配線４９の接続パッド部上面には銅からなる柱状電極５１が設けられている。配線５０を含む保護膜４７の上面にはエポキシ系樹脂等からなる封止膜５２がその上面が柱状電極(外部接続電極）５１の上面と面一となるように設けられている。   A base metal layer 49 made of copper or the like is provided on the upper surface of the protective film 47. A wiring 50 made of copper is provided on the entire upper surface of the base metal layer 49. One end of the wiring 50 including the base metal layer 49 is connected to the connection pad 44 through the openings 46 and 48 of the insulating film 45 and the protective film 47. A columnar electrode 51 made of copper is provided on the upper surface of the connection pad portion of the wiring 49. A sealing film 52 made of epoxy resin or the like is provided on the upper surface of the protective film 47 including the wiring 50 so that the upper surface thereof is flush with the upper surface of the columnar electrode (external connection electrode) 51.

半導体構成体４１の周囲における第１の絶縁膜７Ａの上面には方形枠状の第２の絶縁膜７Ｂが設けられている。第２の絶縁膜７Ｂは、例えば、エポキシ系樹脂やポリイミド系樹脂等の熱硬化性樹脂中にシリカフィラー等の無機材料からなる補強材を分散させたもの、あるいは、エポキシ系樹脂等の熱硬化性樹脂のみからなっている。   A square frame-shaped second insulating film 7B is provided on the upper surface of the first insulating film 7A around the semiconductor structure 41. For example, the second insulating film 7B is obtained by dispersing a reinforcing material made of an inorganic material such as silica filler in a thermosetting resin such as an epoxy resin or a polyimide resin, or thermosetting an epoxy resin or the like. It consists only of functional resin.

半導体構成体４１及び第２の絶縁膜７Ｂの上面には第３の絶縁膜７Ｃがその上面を平坦とされて設けられている。第３の絶縁膜７Ｃは、例えば、ガラス布やガラス繊維等からなる基材にエポキシ系樹脂やポリイミド系樹脂等の熱硬化性樹脂を含浸させたもの、あるいは、エポキシ系樹脂等の熱硬化性樹脂のみからなっている。   A third insulating film 7C is provided on the upper surfaces of the semiconductor structure 41 and the second insulating film 7B so that the upper surfaces thereof are flat. The third insulating film 7C is, for example, a substrate made of glass cloth or glass fiber impregnated with a thermosetting resin such as an epoxy resin or a polyimide resin, or a thermosetting resin such as an epoxy resin. It consists only of resin.

半導体構成体４１の柱状電極５１の上面中央部に対応する部分における第３の絶縁膜７Ｃには開口部５３が設けられている。第３の絶縁膜７Ｃの上面には第２の下地金属層８及び第２の配線９が設けられている。第２の下地金属層８を含む第２の配線９の一端部は、第３の絶縁膜７Ｃの開口部５３を介して半導体構成体４１の柱状電極５１の上面に接続されている。   An opening 53 is provided in the third insulating film 7 </ b> C in a portion corresponding to the central portion of the upper surface of the columnar electrode 51 of the semiconductor structure 41. A second base metal layer 8 and a second wiring 9 are provided on the upper surface of the third insulating film 7C. One end of the second wiring 9 including the second base metal layer 8 is connected to the upper surface of the columnar electrode 51 of the semiconductor structure 41 through the opening 53 of the third insulating film 7C.

第２の配線９を含む第３の絶縁膜７Ｃの上面には上層オーバーコート膜１０が設けられている。第２の配線９の接続パッド部に対応する部分における上層オーバーコート膜１０には開口部１１が設けられている。半導体構成体１２は、その半田ボール１８が上層オーバーコート膜１０の開口部１１を介して第２の配線９の接続パッド部上面に接合されていることにより、上層オーバーコート膜１０上に搭載されている。   An upper overcoat film 10 is provided on the upper surface of the third insulating film 7 </ b> C including the second wiring 9. An opening 11 is provided in the upper overcoat film 10 in a portion corresponding to the connection pad portion of the second wiring 9. The semiconductor structure 12 is mounted on the upper overcoat film 10 by the solder ball 18 being bonded to the upper surface of the connection pad portion of the second wiring 9 via the opening 11 of the upper overcoat film 10. ing.

第１の下地金属層４を含む第１の配線５と第２の下地金属層８を含む第２の配線９の少なくとも一部とは、第１〜第３の絶縁膜７Ａ、７Ｂ、７Ｃの所定の箇所に設けられた開口部５４の内壁面に設けられた銅等からなる下地金属層５５ａ及び銅層５５ｂからなる上下導通部５５を介して接続されている。上下導通部５５内にはソルダーレジスト等からなる充填材５６が充填されている。   The first wiring 5 including the first base metal layer 4 and at least a part of the second wiring 9 including the second base metal layer 8 are formed of the first to third insulating films 7A, 7B, and 7C. They are connected via a base metal layer 55a made of copper or the like and an upper and lower conductive portion 55 made of a copper layer 55b provided on the inner wall surface of the opening 54 provided at a predetermined location. The vertical conduction part 55 is filled with a filler 56 made of a solder resist or the like.

次に、この半導体装置の製造方法の一例について説明する。まず、図２２に示すように、ウエハ状態の単なるシリコン基板１の上面の貫通孔２形成領域に凹部２ａが形成され、凹部２ａ内を含むシリコン基板１の上面に下地絶縁膜３が形成され、凹部２ａ内を含む下地絶縁膜３の上面に第１の下地金属層４及び第１の配線５が形成され、第１の配線５を含む下地絶縁膜３の上面に第１の絶縁膜７Ａが形成されたものを用意する。この場合も、ウエハ状態のシリコン基板１の厚さは、図２１に示すシリコン基板１の厚さよりもある程度厚くなっている。   Next, an example of a method for manufacturing this semiconductor device will be described. First, as shown in FIG. 22, a recess 2a is formed in a through hole 2 formation region on the upper surface of a silicon substrate 1 in a wafer state, and a base insulating film 3 is formed on the upper surface of the silicon substrate 1 including the inside of the recess 2a. A first base metal layer 4 and a first wiring 5 are formed on the top surface of the base insulating film 3 including the inside of the recess 2 a, and a first insulating film 7 A is formed on the top surface of the base insulating film 3 including the first wiring 5. Prepare the formed one. Also in this case, the thickness of the silicon substrate 1 in the wafer state is somewhat larger than the thickness of the silicon substrate 1 shown in FIG.

また、半導体構成体４１のシリコン基板４３の下面に接着層４２が設けられたものを用意する。この場合、接着層４２を有する半導体構成体４１は、ウエハ状態のシリコン基板４３上に接続パッド４４、絶縁膜４５、保護膜４７、下地金属層４９、配線５０、柱状電極５１及び封止膜５２を形成した後、ウエハ状態のシリコン基板４３の下面に、ダイアタッチメントフィルムとして市販されているエポキシ系樹脂やポリイミド系樹脂等のダイボンド材からなる接着層４２を加熱加圧により半硬化させた状態で固着し、ダイシングにより個片化することにより得られる。   In addition, a semiconductor structure 41 having an adhesive layer 42 provided on the lower surface of the silicon substrate 43 is prepared. In this case, the semiconductor structure 41 having the adhesive layer 42 has a connection pad 44, an insulating film 45, a protective film 47, a base metal layer 49, a wiring 50, a columnar electrode 51, and a sealing film 52 on a silicon substrate 43 in a wafer state. In the state where the adhesive layer 42 made of a die bond material such as epoxy resin or polyimide resin commercially available as a die attachment film is semi-cured by heat and pressure on the lower surface of the silicon substrate 43 in a wafer state. It is obtained by fixing and dividing into pieces by dicing.

次に、第１の絶縁膜７Ａの上面の所定の複数箇所に複数の半導体構成体４１のシリコン基板４３の下面に固着された接着層４２を相互に離間させて接着する。ここでの接着は、加熱加圧により、接着層４２を本硬化させる。   Next, the adhesive layers 42 fixed to the lower surfaces of the silicon substrates 43 of the plurality of semiconductor constructs 41 are adhered to each other at predetermined locations on the upper surface of the first insulating film 7A while being separated from each other. In this bonding, the adhesive layer 42 is fully cured by heating and pressing.

次に、図２３に示すように、半導体構成体４１の周囲における第１の絶縁膜７Ａの上面に格子状の第２の絶縁膜形成用シート７ｂをピン等で位置決めしながら配置する。格子状の第２の絶縁膜形成用シート７ｂは、熱硬化性樹脂中に補強材を分散させ、熱硬化性樹脂を半硬化状態にしてシート状となしたものである。   Next, as shown in FIG. 23, a lattice-like second insulating film forming sheet 7b is arranged on the upper surface of the first insulating film 7A around the semiconductor structure 41 while being positioned with pins or the like. The grid-like second insulating film forming sheet 7b is a sheet in which a reinforcing material is dispersed in a thermosetting resin so that the thermosetting resin is in a semi-cured state.

次に、半導体構成体４１及び第２の絶縁膜形成用シート７ｂの上面に第３の絶縁膜形成用シート７ｃを配置する。第３の絶縁膜形成用シート７ｃは、ガラス布等にエポキシ系樹脂等の熱硬化性樹脂を含浸させ、熱硬化性樹脂を半硬化状態にしてシート状となしたものである。   Next, the third insulating film forming sheet 7c is disposed on the upper surfaces of the semiconductor structure 41 and the second insulating film forming sheet 7b. The third insulating film forming sheet 7c is formed by impregnating a glass cloth or the like with a thermosetting resin such as an epoxy resin to make the thermosetting resin into a semi-cured state into a sheet shape.

次に、一対の加熱加圧板６１、６２を用いて上下から第２の絶縁膜形成用シート７ｂ及び第３の絶縁膜形成用シート７ｃを加熱加圧する。そして、その後の冷却により、半導体構成体４１の周囲における第１の絶縁膜７Ａの上面に第２の絶縁膜７Ｂが形成され、また、半導体構成体４１及び第２の絶縁膜７Ｂの上面に第３の絶縁膜７Ｃが形成される。この場合、第３の絶縁膜７Ｃの上面は、上側の加熱加圧板４１の下面によって押さえ付けられるため、平坦面となる。したがって、第３の絶縁膜７Ｃの上面を平坦化するための研磨工程は不要である。   Next, the second insulating film forming sheet 7b and the third insulating film forming sheet 7c are heated and pressed from above and below using a pair of heating and pressing plates 61 and 62. Then, by the subsequent cooling, the second insulating film 7B is formed on the upper surface of the first insulating film 7A around the semiconductor structure 41, and the second insulating film 7B is formed on the upper surfaces of the semiconductor structure 41 and the second insulating film 7B. 3 insulating film 7C is formed. In this case, since the upper surface of the third insulating film 7C is pressed by the lower surface of the upper heating and pressing plate 41, it becomes a flat surface. Therefore, a polishing step for flattening the upper surface of the third insulating film 7C is unnecessary.

次に、図２４に示すように、レーザビームを照射するレーザ加工により、半導体構成体４１の柱状電極５１の上面中央部に対応する部分における第３の絶縁膜７Ｃに開口部５３を形成する。また、メカニカルドリルを用いて、第１の配線５の接続パッド部上面に対応する部分における第１〜第３の絶縁膜７Ａ、７Ｂ、７Ｃに開口部５４を形成する。次に、必要に応じて、開口部５３、５４内等に発生したエポキシスミア等をデスミア処理により除去する。   Next, as shown in FIG. 24, an opening 53 is formed in the third insulating film 7 </ b> C in a portion corresponding to the central portion of the upper surface of the columnar electrode 51 of the semiconductor structure 41 by laser processing with laser beam irradiation. Moreover, the opening part 54 is formed in the 1st-3rd insulating films 7A, 7B, and 7C in the part corresponding to the connection pad part upper surface of the 1st wiring 5 using a mechanical drill. Next, if necessary, epoxy smear or the like generated in the openings 53 and 54 is removed by desmear treatment.

次に、図２５に示すように、開口部５３を介して露出された柱状電極５１の上面及び開口部５４を介して露出された第１の配線５の接続パッド部上面を含む第３の絶縁膜７Ｃの上面全体に、銅の無電解メッキにより、第２の下地金属層８及び下地金属層５５ａを形成する。次に、第２の下地金属層８の上面にメッキレジスト膜６３をパターン形成する。この場合、開口部５４を含む第２の配線９形成領域に対応する部分における上層キレジスト膜６３には開口部６４が形成されている。   Next, as shown in FIG. 25, the third insulation includes the upper surface of the columnar electrode 51 exposed through the opening 53 and the upper surface of the connection pad portion of the first wiring 5 exposed through the opening 54. The second base metal layer 8 and the base metal layer 55a are formed on the entire upper surface of the film 7C by electroless plating of copper. Next, a plating resist film 63 is patterned on the upper surface of the second base metal layer 8. In this case, an opening 64 is formed in the upper layer resist film 63 in a portion corresponding to the second wiring 9 formation region including the opening 54.

次に、下地金属層８、５５ａをメッキ電流路として銅の電解メッキを行なうことにより、メッキレジスト膜６３の開口部６４内の第２の下地金属層８の上面に第２の配線９を形成し、また、開口部５４内の下地金属層５５ａの表面に銅層５５ｂを形成する。次に、メッキレジスト膜６３を剥離し、次いで、第２の配線９をマスクとして第２の下地金属層８の不要な部分をエッチングして除去すると、図２６に示すように、第２の配線９下にのみ第２の下地金属層８が残存される。この状態では、開口部５４の内壁面には下地金属層５５ａ及び銅層５５ｂからなる上下導通部５５が第１の配線５の接続パッド部上面に接続されて形成されている。   Next, the second wiring 9 is formed on the upper surface of the second base metal layer 8 in the opening 64 of the plating resist film 63 by performing electrolytic plating of copper using the base metal layers 8 and 55a as a plating current path. In addition, a copper layer 55 b is formed on the surface of the base metal layer 55 a in the opening 54. Next, the plating resist film 63 is peeled off, and then unnecessary portions of the second base metal layer 8 are removed by etching using the second wiring 9 as a mask. As shown in FIG. The second base metal layer 8 remains only under the substrate 9. In this state, a vertical conduction portion 55 made of a base metal layer 55 a and a copper layer 55 b is formed on the inner wall surface of the opening 54 so as to be connected to the upper surface of the connection pad portion of the first wiring 5.

次に、図２７に示すように、スクリーン印刷法やスピンコート法等により、第２の配線９を含む第３の絶縁膜７Ｃの上面にソルダーレジスト等からなる上層オーバーコート膜１０を形成し、同時に、上下導通部５５内にソルダーレジスト等からなる充填材５６を充填する。この場合、第２の配線９の接続パッド部に対応する部分における上層オーバーコート膜１０には開口部１１が形成されている。   Next, as shown in FIG. 27, an upper overcoat film 10 made of a solder resist or the like is formed on the upper surface of the third insulating film 7C including the second wiring 9 by a screen printing method, a spin coating method, or the like. At the same time, a filling material 56 made of a solder resist or the like is filled in the vertical conduction part 55. In this case, an opening 11 is formed in the upper overcoat film 10 in a portion corresponding to the connection pad portion of the second wiring 9.

次に、シリコン基板１の凹部２ａ内に形成された下地絶縁膜３及び第１の下地金属層４を含むシリコン基板１の下面側を、凹部２ａ内に形成された第１の配線５の有底筒状部の下面が少なくとも露出するまで研磨またはエッチングすると、図２８に示すようになる。この状態では、シリコン基板１に凹部２ａの残りからなる貫通孔２が形成され、この貫通孔２内に形成された下地絶縁膜３、第１の下地金属層４及び第１の配線５の有底筒状部の底部５ａがシリコン基板１の下面と面一となる。   Next, the lower surface side of the silicon substrate 1 including the base insulating film 3 and the first base metal layer 4 formed in the recess 2a of the silicon substrate 1 is provided with the first wiring 5 formed in the recess 2a. When polishing or etching is performed until at least the lower surface of the bottom cylindrical portion is exposed, the result is as shown in FIG. In this state, a through hole 2 consisting of the remainder of the recess 2 a is formed in the silicon substrate 1, and the presence of the base insulating film 3, the first base metal layer 4, and the first wiring 5 formed in the through hole 2. The bottom 5a of the bottom cylindrical portion is flush with the lower surface of the silicon substrate 1.

次に、図２９に示すように、スクリーン印刷法やスピンコート法等により、シリコン基板１の貫通孔２を介して露出された下地絶縁膜３、第１の下地金属層４及び第１の配線５の下面を含むシリコン基板１の下面にソルダーレジスト等からなる下層オーバーコート膜１９を形成する。この場合、シリコン基板１の貫通孔２内に形成された第１の配線５の有底筒状部の底部５ａに対応する部分における下層オーバーコート膜１９には開口部２０が形成されている。   Next, as shown in FIG. 29, the base insulating film 3, the first base metal layer 4, and the first wiring exposed through the through hole 2 of the silicon substrate 1 by screen printing, spin coating, or the like. A lower overcoat film 19 made of a solder resist or the like is formed on the lower surface of the silicon substrate 1 including the lower surface of 5. In this case, an opening 20 is formed in the lower overcoat film 19 in a portion corresponding to the bottom 5 a of the bottomed cylindrical portion of the first wiring 5 formed in the through hole 2 of the silicon substrate 1.

次に、図３０に示すように、下層オーバーコート膜１９の開口部２０内及びその下側に半田ボール２１をシリコン基板１の貫通孔２内に形成された第１の配線５の有底筒状部の底部５ａに接続させて形成し、且つ、上層オーバーコート膜１０の開口部１１を介して露出された第２の配線９の接続パッド上面に、別途、製造しておいた半導体構成体１２の半田ボール１８を接合する。次に、ダイシング工程を経ると、図２１に示す半導体装置が複数個得られる。   Next, as shown in FIG. 30, the bottomed tube of the first wiring 5 in which the solder ball 21 is formed in the through hole 2 of the silicon substrate 1 in and below the opening 20 of the lower overcoat film 19. A semiconductor structure separately formed on the upper surface of the connection pad of the second wiring 9 formed to be connected to the bottom 5a of the shape portion and exposed through the opening 11 of the upper overcoat film 10 Twelve solder balls 18 are joined. Next, through a dicing process, a plurality of semiconductor devices shown in FIG. 21 are obtained.

なお、半導体構成体４１として、封止膜５２を有し、且つ、外部接続用電極としての柱状電極５１を有する場合について説明したが、これに限らず、例えば、封止膜５２及び柱状電極５１を有せず、外部接続用電極としての接続パッド部を有する配線５０を有するものとしてもよい。この場合、配線５０の接続パッド部以外を覆うオーバーコート膜を有するものとしてもよく、さらに、オーバーコート膜上に配線５０の接続パッド部に接続された上層接続パッドを有するものとしてもよい。   In addition, although the case where the semiconductor structure 41 includes the sealing film 52 and the columnar electrode 51 as the external connection electrode has been described, the present invention is not limited thereto, and for example, the sealing film 52 and the columnar electrode 51 are included. It is good also as what has the wiring 50 which has a connection pad part as an electrode for external connection. In this case, an overcoat film that covers the wiring pad other than the connection pad portion may be provided, and an upper layer connection pad connected to the connection pad portion of the wiring 50 may be provided on the overcoat film.

１ シリコン基板
２ 貫通孔
２ａ 凹部
３ 下地絶縁膜
４ 第１の下地金属層
５ 第１の配線
６ 柱状電極
７ 絶縁膜
８ 第２の下地金属層
９ 第２の配線
１０ 上層オーバーコート膜
１１ 開口部
１２ 半導体構成体
１９ 下層オーバーコート膜
２０ 開口部
２１ 半田ボール
２２ 保護膜 DESCRIPTION OF SYMBOLS 1 Silicon substrate 2 Through-hole 2a Recessed part 3 Base insulating film 4 1st base metal layer 5 1st wiring 6 Columnar electrode 7 Insulating film 8 2nd base metal layer 9 2nd wiring 10 Upper layer overcoat film 11 Opening part 12 Semiconductor Structure 19 Lower Overcoat Film 20 Opening 21 Solder Ball 22 Protective Film

Claims (15)

半導体基板、前記半導体基板の下面に積層された保護膜、前記半導体基板及び前記保護膜に設けられた貫通孔、前記半導体基板の上面に形成され、前記貫通孔内に形成され、かつ該半導体基板の下面側に突出した底部を含み、前記保護膜の下面と面一の突出部をもつ有底筒状部を有する配線、前記配線上に形成された柱状電極、及び前記半導体基板上における前記柱状電極間に形成された絶縁膜を有する回路基板と、前記回路基板上に搭載され、前記柱状電極に電気的に接続された半導体構成体とを具備することを特徴とする半導体装置。 A semiconductor substrate, a protective film laminated on a lower surface of the semiconductor substrate, a through hole provided in the semiconductor substrate and the protective film, formed on an upper surface of the semiconductor substrate, formed in the through hole, and the semiconductor substrate; Lower side viewed including the the bottom protruding, the protective film on the lower surface flush with the protruding portions wiring having a bottomed cylindrical portion having a columnar electrode formed on the wiring, and the in the semiconductor substrate A semiconductor device comprising: a circuit board having an insulating film formed between columnar electrodes; and a semiconductor structure mounted on the circuit board and electrically connected to the columnar electrodes. 請求項１に記載の発明において、前記配線の有底筒状部の底部に半田ボールが形成されていることを特徴とする半導体装置。   2. The semiconductor device according to claim 1, wherein a solder ball is formed at the bottom of the bottomed cylindrical portion of the wiring. 請求項１に記載の発明において、前記半導体基板の上面及び前記半導体基板の貫通孔の側部には下地絶縁膜が形成され、前記配線は前記下地絶縁膜上に形成されていることを特徴とする半導体装置。   The invention according to claim 1, wherein a base insulating film is formed on an upper surface of the semiconductor substrate and a side portion of the through hole of the semiconductor substrate, and the wiring is formed on the base insulating film. Semiconductor device. 請求項１に記載の発明において、前記半導体構成体と前記柱状電極とはボンディングワイヤを介して接続されていることを特徴とする半導体装置。   2. The semiconductor device according to claim 1, wherein the semiconductor structure and the columnar electrode are connected via a bonding wire. 半導体基板、前記半導体基板の下面に積層された保護膜、前記半導体基板及び前記保護膜に設けられた貫通孔、前記半導体基板の上面に形成され、前記貫通孔内に形成され、かつ該半導体基板の下面側に突出した底部を含み、前記保護膜の下面と面一の突出部をもつ有底筒状部を有する配線、及び前記半導体基板上に形成された絶縁膜を有する回路基板と、前記配線の有底筒状部の底部に形成された半田層と、前記半田層を介して前記配線の有底筒状部の底部に接続された半導体構成体とを具備することを特徴とする半導体装置。 A semiconductor substrate, a protective film laminated on a lower surface of the semiconductor substrate, a through hole provided in the semiconductor substrate and the protective film, formed on an upper surface of the semiconductor substrate, formed in the through hole, and the semiconductor substrate; and the circuit board lower surface side viewed including the the bottom protrusion, having an insulating film wires, and formed on the semiconductor substrate having the bottomed cylindrical portion having a protruding portion of the lower surface flush with the protective film, A solder layer formed on the bottom of the bottomed cylindrical portion of the wiring, and a semiconductor structure connected to the bottom of the bottomed cylindrical portion of the wiring via the solder layer. Semiconductor device. 請求項５に記載の発明において、前記配線上に柱状電極が形成されていることを特徴とする半導体装置。   6. The semiconductor device according to claim 5, wherein a columnar electrode is formed on the wiring. 請求項６に記載の発明において、前記配線上に柱状電極が形成され、前記絶縁膜は前記回路基板上における前記柱状電極間に形成されていることを特徴とする半導体装置。   7. The semiconductor device according to claim 6, wherein columnar electrodes are formed on the wiring, and the insulating film is formed between the columnar electrodes on the circuit board. 請求項６に記載の発明において、前記絶縁膜上に前記柱状電極に接続された第２の配線が形成され、前記第２の配線上に半田ボールが形成されていることを特徴とする半導体装置。   7. The semiconductor device according to claim 6, wherein a second wiring connected to the columnar electrode is formed on the insulating film, and a solder ball is formed on the second wiring. . 半導体基板と、前記半導体基板の下面に積層された保護膜と、前記半導体基板及び前記保護膜に設けられた貫通孔と、前記半導体基板の上面に形成され、前記貫通孔内に形成され、かつ該半導体基板の下面側に突出した底部を含み、前記保護膜の下面と面一の突出部をもつ有底筒状部を有する配線と、前記配線上及び前記半導体基板上に形成された第１の絶縁膜と、前記第１の絶縁膜上に搭載された半導体構成体と、前記半導体基板上における前記半導体構成体の周囲に形成された第２の絶縁膜とを具備することを特徴とする半導体装置。 A semiconductor substrate, a protective film laminated on a lower surface of the semiconductor substrate, a through hole provided in the semiconductor substrate and the protective film, formed on an upper surface of the semiconductor substrate, formed in the through hole, and look including a bottom portion projecting on the lower surface side of the semiconductor substrate, a wiring having a bottomed cylindrical portion having a protruding portion of the lower surface flush with the protective film, the formed on the wiring and the semiconductor substrate Comprising: a first insulating film; a semiconductor structure mounted on the first insulating film; and a second insulating film formed around the semiconductor structure on the semiconductor substrate. Semiconductor device. 請求項９に記載の発明において、前記配線の有底筒状部の底部に半田ボールが形成されていることを特徴とする半導体装置。   10. The semiconductor device according to claim 9, wherein a solder ball is formed at the bottom of the bottomed cylindrical portion of the wiring. 請求項９に記載の発明において、さらに、前記半導体構成体上及び前記第２の絶縁膜上に形成された第３の絶縁膜及び前記第３の絶縁膜上に前記半導体構成体の外部接続電極に接続されて形成された第２の配線を有することを特徴とする半導体装置。   10. The semiconductor device according to claim 9, further comprising a third insulating film formed on the semiconductor structure and the second insulating film, and an external connection electrode of the semiconductor structure on the third insulating film. A semiconductor device comprising a second wiring formed connected to the semiconductor device. 請求項１１に記載の発明において、さらに、前記配線の一部分に対応して前記第１、第２、第３の絶縁膜を貫通する貫通孔が形成されていることを特徴とする半導体装置。   12. The semiconductor device according to claim 11, further comprising a through-hole penetrating the first, second, and third insulating films corresponding to a part of the wiring. 請求項１１に記載の発明において、さらに、前記第２の配線及び前記貫通孔を介して前記配線に電気的に接続された第２の半導体構成体を有することを特徴とする半導体装置。   12. The semiconductor device according to claim 11, further comprising: a second semiconductor structure that is electrically connected to the wiring through the second wiring and the through hole. 請求項９に記載の発明において、前記外部接続電極は柱状電極であることを特徴とする半導体装置。   10. The semiconductor device according to claim 9, wherein the external connection electrode is a columnar electrode. 半導体基板上に凹部を形成する工程と、
前記半導体基板上に、前記半導体基板の凹部内に有底筒状部が形成された配線を形成する工程と、
前記半導体基板の下面側を、前記貫通孔内に形成された前記配線の有底筒状部の底部が該半導体基板の下面側に突出して突出部を形成するまで除去する工程と、
前記半導体基板の下面側を除去する工程の後、前記半導体基板の下面に保護膜をその下面が前記貫通孔内に形成された前記配線の有底筒状部の底部を覆うように形成する工程と、前記保護膜の下面側を研磨して前記貫通孔内に形成された前記配線の有底筒状部の底部を露出させるとともに、この露出された前記配線の有底筒状部の底部と前記保護膜の下面とを、平坦化して面一にする工程とを含むことを特徴とする回路基板の製造方法。 Forming a recess on the semiconductor substrate;
Forming a wiring having a bottomed cylindrical portion formed in a recess of the semiconductor substrate on the semiconductor substrate;
Removing the lower surface side of the semiconductor substrate until the bottom portion of the bottomed cylindrical portion of the wiring formed in the through hole protrudes to the lower surface side of the semiconductor substrate to form a protruding portion;
After the step of removing the lower surface side of the semiconductor substrate, a step of forming a protective film on the lower surface of the semiconductor substrate so that the lower surface covers the bottom of the bottomed cylindrical portion of the wiring formed in the through hole When, to expose the bottom of the bottomed cylindrical portion of the were polished lower surface side of the protective film is formed in the through hole the wire, and the bottom portion of the bottomed cylindrical portion of the exposed the wiring method of manufacturing a circuit board, which comprises the step of the lower surface of the protective layer, flush with flattened.
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