JP5376086B1 - Method for manufacturing thermoelectric conversion device, method for manufacturing electronic component including thermoelectric conversion device - Google Patents

Abstract

A method of manufacturing a thermoelectric conversion device capable of efficiently applying pressure to a conductive paste is provided.
As a first conductive paste, a paste obtained by adding an organic solvent to a powder of an alloy in which a plurality of metal atoms maintain a predetermined crystal structure is used. As a second conductive paste, A paste made by adding an organic solvent to a powder of an alloy and a different metal is used. And in the process which comprises the laminated body 80, the space | gaps 13-17 are formed in the inside of the laminated body 80, and a 1st electroconductive paste is made to flow into the space | gaps 13-17 in the integration process. The first interlayer connection member 40 is formed by solid-phase sintering 41.
[Selection] Figure 4

Description

  The present invention relates to a method for manufacturing a thermoelectric conversion device and a method for manufacturing an electronic component including the thermoelectric conversion device.

  Conventionally, as a method for manufacturing a thermoelectric conversion device, for example, Patent Document 1 has proposed the following manufacturing method. That is, in this manufacturing method, first, a through hole is formed in an insulating mold, and the first conductive paste that is regularly made of Bi, Te, Se, etc., and Bi, Sb, Te, etc. are formed in the through hole. The second conductive paste is filled.

  A plurality of surface patterns are formed on the surface of the insulating mold so as to come into contact with the adjacent first and second conductive pastes. In addition, a plurality of back surface patterns are formed on the back surface of the insulating mold so as to be in contact with the first conductive paste and the second conductive paste that is in contact with a surface pattern different from the surface pattern in contact with the first conductive paste. To do.

  Thereafter, the insulating mold is heat-treated at 460 ° C. for 10 hours in an Ar gas atmosphere to form an N-type thermoelectric conversion element from a conductive paste composed of Bi, Te, Se, etc., and Bi, Sb, Te A P-type thermoelectric conversion element is formed from a conductive paste composed of the like. At this time, the N-type thermoelectric conversion element and the P-type thermoelectric conversion element are also connected to the front surface pattern and the back surface pattern. Thereby, a thermoelectric conversion device in which a plurality of N-type thermoelectric conversion elements and a plurality of P-type thermoelectric conversion elements are alternately connected in series is manufactured.

  In addition, when the insulating mold is heat-treated at 460 ° C. for 10 hours, the N-type thermoelectric conversion element and the P-type thermoelectric conversion element (alloy) have a melting point of Bi and Te lower than 460 ° C. It is formed by doing.

JP-A-8-153899

  However, in the manufacturing method of Patent Document 1, an alloy formed by liquid phase sintering has a problem that power is hardly generated because the crystal structure of metal atoms is random.

  Here, since the alloy formed by solid-phase sintering is laminated | stacked, maintaining a predetermined crystal structure, when it is utilized for a thermoelectric conversion apparatus, it is known that big electric power can be generated. For this reason, in order to form an N-type thermoelectric conversion element and a P-type thermoelectric conversion element by applying solid-phase sintering in the manufacturing method of Patent Document 1, for example, the insulating mold is placed between a pair of press plates. It is conceivable that the N-type thermoelectric conversion element and the P-type thermoelectric conversion element are formed by solid phase sintering by pressing the first and second conductive pastes by pressing from the front and back surfaces of the insulating mold.

  However, in this method, the applied pressure is equally applied not only to the first and second conductive pastes but also to the insulating mold located around the first and second conductive pastes (through holes). The first and second conductive pastes cannot be pressurized efficiently. For this reason, when the applied pressure applied to the first and second conductive pastes is insufficient, the N-type thermoelectric conversion element and the P-type thermoelectric conversion element cannot be formed from the first and second conductive pastes. There is a problem that there are cases.

  Such a problem is not a problem that occurs only in a thermoelectric conversion device having an N-type thermoelectric conversion element and a P-type thermoelectric conversion element. That is, the thermoelectric effect occurs when two different types of metals are connected. For this reason, for example, the through holes are filled only with a conductive paste composed of Bi, Te, Se, etc., and the front surface pattern and the back surface pattern are formed of a material different from the alloy in which the conductive paste is solid-phase sintered. The above problem also occurs in the thermoelectric converter.

  An object of this invention is to provide the manufacturing method of the thermoelectric conversion apparatus which can apply a pressurizing force efficiently to an electrically conductive paste, and the manufacturing method of an electronic component provided with a thermoelectric conversion apparatus in view of the said point.

  In order to achieve the above object, the invention according to claim 1 is configured to include a thermoplastic resin, and a plurality of first and second via holes (11, 12) penetrating in the thickness direction are formed. A step of preparing an insulating base material (10) in which the first conductive paste (41) is filled in the first via hole and the second conductive paste (51) is filled in the second via hole; A surface protection member (20) having a surface pattern (21) in contact with a predetermined first and second conductive paste is disposed on the surface (10a) of the insulating substrate, and a predetermined first is formed on the back surface (10b) of the insulating base. A step of forming a laminated body (80) by arranging a back surface protection member (30) having a back surface pattern (31) in contact with the second conductive paste, and pressurizing from the laminating direction while heating the laminated body, 1 or 2nd conductive paste The first and second interlayer connection members (40, 50) are configured, and the first and second interlayer connection members are electrically connected to the front surface pattern and the back surface pattern. .

  Then, as the first conductive paste, a paste obtained by adding an organic solvent to an alloy powder in which a plurality of metal atoms maintain a predetermined crystal structure is used, and as the second conductive paste, an alloy and a dissimilar metal are used. In the process of forming a laminate using a paste obtained by adding an organic solvent to this powder, voids (13 to 17) are formed inside the laminate, and in the integration process, the thermoplastic resin is voided. The first conductive paste is solid-phase sintered while being fluidized to form a first interlayer connection member.

  According to this, since the integration process is performed while flowing the thermoplastic resin into the gap, the pressure applied to the periphery of the first via hole (the portion where the thermoplastic resin flows) is reduced. Then, the pressure force that should originally be applied to this portion is applied to the first conductive paste, and the pressure force applied to the first conductive paste increases. That is, the applied pressure can be efficiently applied to the first conductive paste. Therefore, it can suppress that a 1st conductive paste is not solid-phase-sintered. In addition, since a pressing force can be efficiently applied also to a 2nd conductive paste, when solid-phase sintering a 2nd conductive paste, it can also suppress that a 2nd conductive paste is not solid-phase sintered. .

  Further, in the invention described in claim 14, it is configured to include a thermoplastic resin, and a plurality of via holes (11, 12) penetrating in the thickness direction are formed, and the via holes are filled with the conductive paste (41). A surface protection member (20) having a surface pattern (21) that comes into contact with a predetermined conductive paste on the surface (10a) of the insulating base, and a step of preparing the insulating base (10) that has been performed; A step of forming a laminated body (80) by arranging a back surface protective member (30) having a back surface pattern (31) in contact with a predetermined conductive paste on the back surface (10b) of the insulating substrate; and heating the laminated body Then, pressurizing from the laminating direction to form the interlayer connection member (40) from the conductive paste and to perform an integration step of electrically connecting the interlayer connection member to the front surface pattern and the back surface pattern. It is characterized in.

  Then, as a conductive paste, a paste prepared by adding an organic solvent to a powder of an alloy in which a plurality of metal atoms maintain a predetermined crystal structure is prepared. In the integration step, an interlayer connection member is formed by solid-phase sintering the conductive paste while allowing the thermoplastic resin to flow into the gap. .

  According to this, a thermoelectric conversion device in which only one type of interlayer connection member is arranged on the insulating base material is manufactured. And also in such a thermoelectric conversion apparatus, since the integration process is performed while allowing the thermoplastic resin to flow into the voids, the applied pressure is efficiently applied to the conductive paste as in the first aspect of the invention. It is possible to prevent the conductive paste from being solid-phase sintered.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment and reference example mentioned later.

It is a top view of the thermoelectric converter in a 1st embodiment of the present invention. It is sectional drawing along the II-II line | wire in FIG. It is sectional drawing along the III-III line in FIG. It is sectional drawing which shows the manufacturing process of the thermoelectric conversion apparatus shown in FIG. It is a top view of the surface side of the insulating base material shown in FIG.4 (e). It is a figure which shows the manufacturing conditions in the case of the integration process shown in FIG.4 (i). It is detailed sectional drawing in the case of the integration process shown in FIG.4 (i). It is sectional drawing corresponded in FIG.4 (e) in 2nd Embodiment of this invention. It is a top view of the surface side of the insulating base material shown in FIG. It is sectional drawing equivalent to FIG.4 (h) in 3rd Embodiment of this invention. It is sectional drawing equivalent to FIG.4 (e) in 4th Embodiment of this invention. It is sectional drawing equivalent to FIG.4 (e) in 5th Embodiment of this invention. It is sectional drawing at the time of performing the process of FIG.4 (h) in the 1st reference example of this invention. It is sectional drawing which shows the manufacturing process which prepares the insulating base material in 6th Embodiment of this invention. It is sectional drawing of the thermoelectric conversion apparatus in 7th Embodiment of this invention. It is sectional drawing equivalent to FIG.4 (i) which shows the manufacturing process of the thermoelectric conversion apparatus shown in FIG. It is sectional drawing of the thermoelectric conversion apparatus in the 2nd reference example of this invention. It is sectional drawing equivalent to FIG.4 (h) which shows the manufacturing process of the thermoelectric conversion apparatus shown in FIG. It is sectional drawing of the thermoelectric conversion apparatus in 8th Embodiment of this invention. It is a top view of the surface side of the thermoelectric conversion apparatus in 9th Embodiment of this invention. It is a top view of the back surface side of the thermoelectric conversion apparatus shown in FIG. It is sectional drawing of the thermoelectric conversion apparatus in 10th Embodiment of this invention. It is an expansion | deployment top view of a surface protection member and a back surface protection member. It is sectional drawing of the electronic component in 11th Embodiment of this invention. It is sectional drawing of the electronic component in other embodiment of this invention. It is sectional drawing of the electronic component in other embodiment of this invention. It is sectional drawing of the electronic component in other embodiment of this invention.

  Embodiments and reference examples of the present invention will be described below with reference to the drawings. In the following embodiments and reference examples, parts that are the same or equivalent to each other will be described with the same reference numerals.

(First embodiment)
A first embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 3, in the thermoelectric conversion device 1 of the present embodiment, an insulating base material 10, a surface protection member 20, and a back surface protection member 30 are integrated, and different metals are integrated inside the integrated body. The first and second interlayer connection members 40 and 50 are alternately connected in series.

  In FIG. 1, the surface protection member 20 is omitted for easy understanding. FIG. 1 is not a cross-sectional view, but the first and second interlayer connection members 40 and 50 are hatched.

  In this embodiment, the insulating base material 10 is composed of a planar rectangular thermoplastic resin film containing polyether ether ketone (PEEK) or polyether imide (PEI). The insulating base material 10 is formed in a staggered pattern so that a plurality of first and second via holes 11 and 12 penetrating in the thickness direction are staggered.

  In the present embodiment, the first and second via holes 11 and 12 have a cylindrical shape with a constant diameter from the front surface 10a toward the back surface 10b. However, the first and second via holes 11 and 12 are formed on the front surface. The diameter may be tapered from 10a toward the back surface 10b, or may be a rectangular tube.

  A first interlayer connection member 40 is disposed in the first via hole 11, and a second interlayer connection member 50 that is a different metal from the first interlayer connection member 40 is disposed in the second via hole 12. That is, the first and second interlayer connection members 40 and 50 are arranged on the insulating base material 10 in a staggered manner.

  Although not particularly limited, for example, the first interlayer connection member 40 is made of a conductive paste containing powder (metal particles) of a Bi—Sb—Te alloy constituting P-type. The second interlayer connecting member 50 is made of a conductive paste containing Bi-Te alloy powder (metal particles) constituting an N type.

  On the surface 10a of the insulating substrate 10, a surface protection member 20 made of a planar rectangular thermoplastic resin film containing polyetheretherketone (PEEK) or polyetherimide (PEI) is disposed. The surface protection member 20 has the same planar shape as the insulating base material 10, and a plurality of surface patterns 21 patterned with copper foil or the like on the one surface 20 a side facing the insulating base material 10 are separated from each other. Is formed. Each surface pattern 21 is appropriately electrically connected to the first and second interlayer connection members 40 and 50, respectively.

  Specifically, when one adjacent first interlayer connection member 40 and one second interlayer connection member 50 are set as a set 60, the first and second interlayer connection members 40, 50 of each set 60 are the same surface. It is connected to the pattern 21. That is, the first and second interlayer connection members 40 and 50 of each set 60 are electrically connected via the surface pattern 21. In the present embodiment, one first interlayer connection member 40 and one second interlayer connection member 50 that are adjacent along the long side direction of the insulating base material 10 (the left-right direction in FIG. 1) are a set 60. Has been.

  In addition, on the back surface 10 b of the insulating base material 10, a planar rectangular back surface protection member 30 made of a thermoplastic resin film containing polyether ether ketone (PEEK) or polyether imide (PEI) is disposed. The back surface protection member 30 has the same planar shape as the insulating base material 10, and a plurality of back surface patterns 31 patterned with copper foil or the like on the one surface 30 a side facing the insulating base material 10 are separated from each other. Is formed. Each back surface pattern 31 is appropriately electrically connected to the first and second interlayer connection members 40 and 50, respectively.

  Specifically, in the adjacent set 60, the first interlayer connection member 40 of one set 60 and the second interlayer connection member 50 of the other set 60 are connected to the same back surface pattern 31. That is, the first and second interlayer connection members 40 and 50 are electrically connected via the back surface pattern 31 across the set 60.

  In the present embodiment, as shown in FIG. 2, basically, two sets 60 arranged along the long side direction (the left and right direction in FIG. 1) of the insulating base 10 are adjacent to each other. Has been. As shown in FIG. 3, at the outer edge of the insulating base material 10, two sets 60 arranged in the short side direction (the vertical direction in the drawing in FIG. 1) are adjacent sets 60.

  Therefore, the first and second interlayer connection members 40 and 50 are alternately connected in series in the long side direction of the insulating base material 10 and folded back, and then connected in series in the long side direction again. That is, the first and second interlayer connection members 40 and 50 are alternately connected in series in a polygonal line shape.

  2 and 3, the back surface protection member 30 is electrically connected to the back surface pattern 31 and exposed from one surface of the back surface protection member 30 opposite to the insulating base material 10 side. An interlayer connection member is formed. The interlayer connection member can be electrically connected to the outside.

  The above is the configuration of the thermoelectric conversion device 1 in the present embodiment. In such a thermoelectric conversion device 1, for example, the diameters of the first and second via holes 11 and 12 are φ0.7 mm, the thickness of the insulating substrate 10 is 1 mm, and the first and second interlayer connection members 40 and 50 are combined. When about 900 are arranged, a power of about 2.5 mW can be obtained at a temperature difference of 10 ° C.

  Next, a method for manufacturing the thermoelectric conversion device 1 will be described with reference to FIG. 4 is a cross-sectional view taken along the line II-II in FIG.

  First, as shown in FIG. 4A, an insulating base material 10 is prepared, and a plurality of first via holes 11 are formed by a drill or the like.

  Next, as shown in FIG. 4B, the first conductive paste 41 is filled in each first via hole 11.

  As a method (apparatus) for filling the first via hole 11 with the first conductive paste 41, a method (apparatus) described in Japanese Patent Application No. 2010-50356 by the present applicant may be adopted.

  Briefly, the insulating base material 10 is arranged on a holding table (not shown) with the suction paper 70 so that the back surface 10 b faces the suction paper 70. The adsorbent paper 70 may be of any material that can absorb the organic solvent of the first conductive paste 41, and general high-quality paper or the like is used. Then, the first conductive paste 41 is filled in the first via hole 11 while the first conductive paste 41 is melted. As a result, most of the organic solvent of the first conductive paste 41 is adsorbed by the adsorption paper 70, and the alloy powder is placed in close contact with the first via hole 11.

  In the present embodiment, the first conductive paste 41 is a paste obtained by adding an organic solvent such as paraffin having a melting point of 43 ° C. to an alloy powder in which metal atoms maintain a predetermined crystal structure. It is done. For this reason, when the first conductive paste 41 is filled, the surface 10a of the insulating base 10 is heated to about 43 ° C. In addition, as the powder of the alloy constituting the first conductive paste 41, for example, Bi—Sb—Te formed by mechanical alloy is used.

  Subsequently, as shown in FIG. 4C, a plurality of second via holes 12 are formed in the insulating base material 10 by a drill or the like. As described above, the second via holes 12 are alternately formed with the first via holes 11 and are formed to form a staggered pattern together with the first via holes 11.

  Next, as illustrated in FIG. 4D, the insulating base material 10 is again disposed on the holding table (not shown) with the suction paper 70 interposed therebetween so that the back surface 10 b faces the suction paper 70. Then, the second conductive paste 51 is filled in the second via hole 12 in the same manner as when the first conductive paste 41 is filled. As a result, most of the organic solvent of the second conductive paste 51 is adsorbed by the adsorbent paper 70, and the alloy powder is placed in close contact with the second via hole 12.

  As the second conductive paste 51, in this embodiment, an alloy powder in which a metal atom different from the metal atoms constituting the first conductive paste 41 maintains a predetermined crystal structure is used, such as telepine having a melting point of room temperature. A paste obtained by adding an organic solvent is used. That is, as the organic solvent constituting the second conductive paste 51, a solvent having a lower melting point than the organic solvent constituting the first conductive paste 41 is used. And when filling the 2nd conductive paste 51, it is performed in the state by which the surface 10a of the insulating base material 10 was hold | maintained at normal temperature. In other words, the second conductive paste 51 is filled in a state where the organic solvent contained in the first conductive paste 41 is solidified. As a result, the second conductive paste 51 is prevented from entering the first via hole 11. In addition, as a powder of the alloy which comprises the 2nd conductive paste 51, Bi-Te etc. which were formed with the mechanical alloy are used, for example.

  As described above, the insulating base material 10 filled with the first and second conductive pastes 41 and 51 is prepared.

  Then, as shown in FIG. 4 (e), the through hole 13 corresponding to the gap of the present invention is formed in the insulating base material 10 by a drill, a laser, or the like. In this embodiment, as shown in FIGS. 4 (e) and 5, a cylindrical shape that is concentric with each of the first and second via holes 11 and 12 and that is spaced apart at equal intervals in the circumferential direction. A plurality of through holes 13 are formed.

  In addition, in this embodiment, although the through-hole 13 is cylindrical, the through-hole 13 may be made into the taper shape where a diameter becomes small toward the back surface 10b from the surface 10a.

  Further, in a step different from the above steps, as shown in FIGS. 4 (f) and 4 (g), one surface 20a, 30a of the front surface protection member 20 and the rear surface protection member 30 facing the insulating base material 10 is provided. A copper foil or the like is formed. Then, by appropriately patterning this copper foil, the surface protection member 20 formed with a plurality of surface patterns 21 spaced apart from each other, and the back surface protection member 30 formed with a plurality of back surface patterns 31 spaced apart from each other. prepare.

  Thereafter, as shown in FIG. 4 (h), the back surface protection member 30, the insulating base material 10, and the surface protection member 20 are sequentially stacked to form a stacked body 80. Specifically, when the first conductive paste 41 filled in one adjacent first via hole 11 and the second conductive paste 51 filled in one second via hole 12 are set as a set 60, an insulating group is formed. On the surface 10 a side of the material 10, the surface protection member 20 is disposed in a state where the first and second conductive pastes 41 and 51 for each set 60 are in contact with the same surface pattern 21. In the present embodiment, as described above, the first conductive pastes 41 and 1 filled in one first via hole 11 adjacent along the long side direction of the insulating base material 10 (the left-right direction in FIG. 1). The second conductive paste 51 filled in the second via holes 12 is a set 60.

  In the state where the first conductive paste 41 of one set 60 and the second conductive paste 51 of the other set 60 in the adjacent set 60 are in contact with the same back pattern 31 on the back surface 10b side of the insulating substrate 10. The back surface protection member 30 is disposed. In the present embodiment, as described above, the two sets 60 arranged along the long side direction (the left-right direction in FIG. 1) of the insulating base material 10 are the adjacent sets 60. In addition, at the outer edge of the insulating base material 10, two sets 60 arranged in the short side direction are adjacent sets 60.

  Subsequently, as shown in FIG. 4 (i), the laminate 80 is disposed between a pair of press plates (not shown), and the laminate 80 is integrated by applying pressure while heating in a vacuum state from the upper and lower surfaces in the lamination direction. To do. Although not particularly limited, when the laminate 80 is integrated, a cushioning material such as rock wool paper may be disposed between the laminate 80 and the press plate. Below, the integration process of this embodiment is demonstrated concretely, referring FIG. 6 and FIG.

  In the integration step, as shown in FIG. 6, first, the laminate 80 is heated to about 320 ° C. and pressurized to 0.1 Mpa until time T1, and is included in the first and second conductive pastes 41 and 51. The organic solvent is evaporated (see FIG. 7 (a)).

  Note that the interval between T0 and T1 is about 10 minutes. In addition, the organic solvent contained in the first and second conductive pastes 41 and 51 is an organic solvent remaining without being adsorbed on the adsorbing paper 70 in the steps of FIGS. 4B and 4D. It is.

  Next, as shown in FIG. 6 and FIG. 7B, the laminate 80 is pressurized at 10 MPa until time T2 while maintaining the laminated body 80 at about 320 ° C., which is a temperature higher than the softening point of the thermoplastic resin. At this time, the thermoplastic resin constituting the insulating base material 10 flows and pressurizes the first and second conductive pastes 41 and 51 (alloy powder) and flows into the through holes 13. Therefore, as shown in FIG. 7C, the diameters of the first and second via holes 11 and 12 are reduced. Further, since the thermoplastic resin flows (flows) into the through-hole 12, the pressure applied to this portion (around the first and second via holes 11 and 12) becomes small, and should be originally applied to this portion. A pressing force is applied to the first and second conductive pastes 41 and 51. Accordingly, the pressure applied from the press plate to the first and second conductive pastes 41 and 51 is increased.

  Then, as shown in FIG. 7 (d), the first and second interlayer connection members are obtained by press-contacting the alloy powders and the alloy powder with the surface pattern 21 and the back surface pattern 31 and solid-phase sintering them. 40 and 50 are configured. In addition, the first and second interlayer connection members 40 and 50 are electrically connected to the front surface pattern 21 and the back surface pattern 31.

  The interval between T1 and T2 is about 10 minutes. A space is formed in the first and second via holes 11 and 12 by evaporating the organic solvent. However, since this space is very small, solid phase sintering of the first and second interlayer connection members 40 and 50 is not inhibited by the space.

  Thereafter, as shown in FIG. 6, the laminated body 80 is integrated by cooling to a time point T <b> 3 while maintaining a pressure of 10 MPa, and the thermoelectric conversion device 1 shown in FIG. 1 is manufactured. In addition, it is about 8 minutes between T2-T3.

  As described above, in this embodiment, the through hole 13 is formed in the insulating base material 10, and the laminate 80 is integrated while pouring a thermoplastic resin into the through hole 13. For this reason, the applied pressure applied to the portion where the thermoplastic resin flows (around the first and second via holes 11 and 12) is reduced, and the applied pressure that should be applied to this portion is the first and second conductivity. Applied to the functional pastes 41, 51. Accordingly, the pressure applied to the first and second conductive pastes 41 and 51 is increased. That is, the applied pressure can be efficiently applied to the first and second conductive pastes 41 and 51. Accordingly, it is possible to prevent the first and second conductive pastes 41 and 51 from being solid-phase sintered.

  Further, the through holes 13 are formed so as to be concentric with the first and second via holes 11 and 12 as centers, and are spaced apart at equal intervals in the circumferential direction. For this reason, when the laminated body 80 is integrated, the thermoplastic resin around the first and second via holes 11 and 12 is likely to flow isotropically into the through hole 13, and the first and second via holes 11 and 12 are formed. Displacement in the planar direction of the stacked body 80 can be suppressed. Therefore, it is possible to suppress the first and second interlayer connection members 40 and 50 formed from the first and second conductive pastes 41 and 51 and the front surface pattern 21 and the back surface pattern 31 from being poorly connected.

  In addition, according to the manufacturing method of the present embodiment, a thermoelectric device having a desired conversion efficiency can be obtained simply by appropriately changing the size and thickness of the planar shape of the insulating base material 10, the number of first and second via holes 11 and 12, the diameter, and the like. The conversion device 1 can be manufactured, and the manufacturing process is not particularly increased or complicated depending on the application. That is, the degree of design freedom can be improved.

  Furthermore, the thermoelectric conversion device 1 according to the present embodiment generates large electric power because the first and second interlayer connection members 40 and 50 are formed of an alloy in which a plurality of metal atoms maintain a predetermined crystal structure. Can be made. And since the insulating base material 10 comprised including the thermoplastic resin is arrange | positioned around the 1st interlayer connection member 40 and the 2nd interlayer connection member 50, the 1st interlayer connection member 40 and the 2nd interlayer connection The adhesion between the member 50 and the front surface pattern 21 and the back surface pattern 31 can be improved. For this reason, larger electric power can be generated.

  Moreover, the insulating base material 10 is arrange | positioned between the surface pattern 21 (surface protection member 20) and the back surface pattern 31 (back surface protection member 30), and the surface pattern 21 (surface protection member 20) and the back surface pattern 31 (back surface) There is no air flow between the protective member 30). Therefore, it can suppress that the heat difference between the surface pattern 21 (surface protection member 20) and the back surface pattern 31 (back surface protection member 30) becomes small.

  By the way, a multilayer substrate is known in which a via hole having a wiring pattern such as a copper foil is formed on the bottom and a plurality of resin films in which an interlayer connection member is disposed in the via hole is laminated. The substrate is manufactured as follows.

  That is, first, a plurality of resin films in which a via hole having a wiring pattern such as a copper foil as its bottom surface is formed and the via hole is filled with a conductive paste are prepared. As the conductive paste, a paste containing Sn is used. Then, a plurality of resin films are laminated to form a laminated body, and the laminated body is pressed and integrated while being heated in a vacuum state. At this time, the conductive paste is sintered to form an interlayer connection member, and the interlayer connection member is electrically connected to the wiring pattern.

  However, in the integration process in the above manufacturing method, a conductive paste containing Sn is used, and this Sn is diffused into the wiring pattern so that the interlayer connection member (conductive paste) and the wiring pattern are made of metal (diffusion). Are connected. That is, in order not to press the metal particles, the integration process is performed with a pressure of about 4 MPa at the maximum. Therefore, such a manufacturing process cannot be applied as it is to the manufacturing method of the thermoelectric conversion device 1 of the present embodiment.

  In the present embodiment, an example in which Bi—Sb—Te alloy powder is used as the first conductive paste 41 and Bi—Te alloy powder is used as the second conductive paste 51 has been described. It is not limited to these. For example, the alloy powder constituting the first and second conductive pastes 41 and 51 is appropriately selected from those in which copper, constantan, chromel, alumel, etc. are alloyed with iron, nickel, chromium, copper, silicon or the like. May be. Moreover, you may select suitably from the alloy of tellurium, bismuth, antimony, selenium, the alloy of silicon, iron, aluminum, etc.

(Second Embodiment)
A second embodiment of the present invention will be described. In the present embodiment, the gap is changed from that of the first embodiment, and the other aspects are the same as those of the first embodiment, and thus the description thereof is omitted here.

  As shown in FIGS. 8 and 9, in the present embodiment, in the step of FIG. 4E, a frame-like groove portion 14 surrounding each of the first and second via holes 11 and 12 is formed in the insulating base material 10. Form. Specifically, the groove portion 14 is formed on the surface 10a of the insulating base material 10 so that one of the first and second via holes 11 and 12 is located in the frame one by one. Similarly, the groove part 14 is formed in the back surface 10b of the insulating base material 10 so that any one of the first and second via holes 11 and 12 is located in the frame one by one.

  In the present embodiment, the groove portion 14 corresponds to the gap of the present invention. Here, the groove portions 14 surrounding each of the first and second via holes 11 and 12 are formed in a lattice shape, but the groove portions 14 may be formed separately from each other. Furthermore, in this embodiment, the groove part 14 formed in the surface 10a and the back surface 10b of the insulating base material 10 is made into the same magnitude | size, and a groove part is located so that the 1st, 2nd via-holes 11 and 12 may be located in the center in a frame. 14 is formed.

  Thus, even if the groove part 14 is formed in the insulating base material 10, the thermoplastic resin flows into the groove part 14 when the laminated body 80 is integrated in the process of FIG. For this reason, the applied pressure applied to the first and second conductive pastes 41 and 51 can be increased, and the same effect as in the first embodiment can be obtained.

  Here, the description has been given of the formation of the groove portion 14 on the front surface 10a and the back surface 10b of the insulating base material 10. However, the groove portion 14 is formed only on one of the front surface 10a and the back surface 10b of the insulating base material 10. It may be.

(Third embodiment)
A third embodiment of the present invention will be described. In the present embodiment, the gap is changed from that of the first embodiment, and the other aspects are the same as those of the first embodiment, and thus the description thereof is omitted here.

  As shown in FIG. 10, in the present embodiment, portions of the front surface pattern 21 and the back surface pattern 31 that are in contact with the first and second conductive pastes 41 and 51 in the steps of FIGS. The laminated body 80 is formed by forming the concave portions 15 in different portions. That is, the laminated body 80 in which the recessed part 15 is formed in the part facing the thermoplastic resin which comprises the insulating base material 10 among the surface pattern 21 and the back surface pattern 31 is comprised. In the present embodiment, the recess 15 corresponds to the gap of the present invention.

  Thus, even if the recesses 15 are formed in the front surface pattern 21 and the back surface pattern 31, the thermoplastic resin flows into the recesses 15 when the laminate 80 is integrated. For this reason, the applied pressure applied to the first and second conductive pastes 41 and 51 can be increased, and the same effect as in the first embodiment can be obtained.

  Here, the formation of the recess 15 in the front surface pattern 21 and the back surface pattern 31 has been described. However, the recess 15 may be formed in only one of the front surface pattern 21 and the back surface pattern 31.

(Fourth embodiment)
A fourth embodiment of the present invention will be described. In the present embodiment, the gap is changed from that of the first embodiment, and the other aspects are the same as those of the first embodiment, and thus the description thereof is omitted here.

  As shown in FIG. 11, in this embodiment, a thermoplastic resin film 10c, a glass cloth 10d having a cavity 16 inside, and a thermoplastic resin film 10c are sequentially laminated as the insulating base material 10, and these are laminated at a low temperature press or the like. The one temporarily bonded with is used. In the present embodiment, the glass cloth 10d corresponds to the porous member of the present invention, and the cavity 16 in the glass cloth 10d corresponds to the void of the present invention.

  Even when such an insulating substrate 10 is used, the thermoplastic resin flows (impregnates) into the cavity 16 in the glass cloth 10d when the laminated body 80 is integrated in the step of FIG. 4 (i). For this reason, the applied pressure applied to the first and second conductive pastes 41 and 51 can be increased, and the same effect as in the first embodiment can be obtained.

  In addition, although glass cloth 10d was mentioned as an example and demonstrated here as a porous member, for example, an aramid nonwoven fabric etc. may be used as a porous member.

(Fifth embodiment)
A fifth embodiment of the present invention will be described. In the present embodiment, the gap is changed from that of the first embodiment, and the other aspects are the same as those of the first embodiment, and thus the description thereof is omitted here.

  As shown in FIG. 12, in this embodiment, a porous material in which a plurality of holes 17 are formed in a thermoplastic resin film is used as the insulating base material 10. Even if such an insulating substrate 10 is used, the thermoplastic resin flows into the holes 17 when the laminated body 80 is integrated in the step of FIG. For this reason, the applied pressure applied to the first and second conductive pastes 41 and 51 can be increased, and the same effect as in the first embodiment can be obtained.

(First Reference Example)
A first reference example of the present invention will be described. In this reference example, a laminated body 80 in which the through hole 13 is not formed is configured with respect to the first embodiment, and the laminated body 80 is integrated using a press plate in which a recessed portion is formed. Since other aspects are the same as those in the first embodiment, the description thereof is omitted here.

  As shown in FIG. 13A, in this reference example, the through hole 13 is not formed inside the stacked body 80. That is, in this reference example, the laminated body 80 is configured by performing the steps of FIGS. 4A to 4D and FIGS. And the laminated body 80 is pressurized using the pair of press board 90 in which the hollow part 90a is formed in the part different from the part facing the surface pattern 21 and the back surface pattern 31. FIG.

  As a result, as shown in FIG. 13B, the thermoplastic resin constituting the surface protection member 20 and the back surface protection member 30 flows into the recesses 90 a of the pair of press plates 90, and the thermoplastic resin The thermoplastic resin of the insulating base material 10 flows in the flowed portion. For this reason, the applied pressure applied from the press plate 90 to the first and second conductive pastes 41 and 51 is increased, and as shown in FIG. 13C, the first and second conductive pastes 41 and 51 are applied. Are solid-phase sintered to form the first and second interlayer connection members 40 and 50.

  Thus, even if the laminated body 80 is integrated using the pair of press plates 90 in which the recessed portions 90a are formed, the thermoplastic resin constituting the insulating base material 10 flows. The applied pressure applied to the two conductive pastes 41 and 51 can be increased, and the same effect as in the first embodiment can be obtained.

  In addition, the thermoelectric conversion apparatus manufactured by this reference example has a convex part formed with the thermoplastic resin which flowed into the hollow part 90a. For this reason, after integrating the laminated body 90, you may make it remove a convex part by cutting etc. FIG. Or you may make it arrange | position the sheet | seat etc. which have heat conductivity so that a convex part may be covered, and to planarize the upper and lower surfaces of a thermoelectric conversion apparatus.

  Here, the example in which the depression 90a is formed in each of the pair of press plates 90 has been described, but the press plate 90 in which the depression 90a is formed in only one of the pair of press plates 90 is provided. It may be used.

  Furthermore, in this reference example, the example using the pair of press plates 90 in which the recessed portions 90a are formed in portions different from the portions facing the front surface pattern 21 and the back surface pattern 31 has been described. However, you may use a pair of press plate 90 in which the hollow part 90a is formed in the part facing the surface pattern 21 and the back surface pattern 31. FIG. Even if such a press plate 90 is used, since the thermoplastic resins constituting the insulating base material 10, the surface protection member 20, and the back surface protection member 30 flow, the same effect can be obtained.

(Sixth embodiment)
A sixth embodiment of the present invention will be described. The present embodiment is different from the first embodiment in the manufacturing process for preparing the insulating base material 10 filled with the first and second conductive pastes 41 and 51, and the other steps are the first implementation. Since it is the same as that of a form, description is abbreviate | omitted here.

  As shown in FIG. 14A, in the present embodiment, the first and second via holes 11 and 12 are formed in the insulating base material 10 at the same time.

  Next, as shown in FIG. 14B, a mask 91 in which a region corresponding to the first via hole 11 is opened is disposed on the surface 10 a of the insulating base material 10. Then, only the first via hole 11 is filled with the first conductive paste 41.

  Subsequently, as shown in FIG. 14C, the mask 91 is removed, and the second conductive paste 51 is filled at room temperature as in the first embodiment. Thereby, the insulating base material 10 filled with the first and second conductive pastes 41 and 51 is prepared. Thereafter, the thermoelectric conversion device 1 shown in FIG. 1 is manufactured by performing the same steps as in the first embodiment.

  As described above, in the present embodiment, the first and second via holes 11 and 12 are formed in the insulating base material 10 at the same time, and the process of forming the via holes can be performed once.

  Note that after the first via hole 11 is filled with the first conductive paste 41, a mask having an opening corresponding to the second via hole 12 may be disposed on the surface 10 a of the insulating substrate 10. In this case, the second conductive paste 51 is suppressed from being mixed into the first via hole 11 by the mask when the second conductive paste 51 is filled in the second via hole 12. Accordingly, as the organic solvent that constitutes the second conductive paste 51, a solvent in which the first conductive paste 41 melts when the second conductive paste 51 is filled can be used. Paraffin can be used similarly to the organic solvent of the paste 41.

(Seventh embodiment)
A seventh embodiment of the present invention will be described. In the present embodiment, the configuration of the insulating base 10 is changed with respect to the first embodiment, and the shapes of the first and second via holes 11 and 12 (first and second interlayer connection members 40 and 50) are changed. Since the rest is the same as that of the first embodiment, the description thereof is omitted here.

  As shown in FIG. 15, in this embodiment, the insulating base material 10 is configured by laminating a thermosetting resin film 10e, a thermoplastic resin film 10c, and a thermosetting resin film 10e in this order. In the first and second via holes 11 and 12 (first and second interlayer connection members 40 and 50), the diameters of the portions on the front surface 10a side and the back surface 10b side of the insulating base 10 are larger than the diameter of the central portion. ing.

  Such a thermoelectric conversion device 1 is manufactured as follows. That is, as the insulating substrate 10, a thermosetting resin film 10e, a thermoplastic resin film 10c, and a thermosetting resin film 10e are sequentially laminated and temporarily joined by a low-temperature press or the like.

  4A and 4C, first, the thermoplastic resin film 10e on the front surface 10a side and the thermosetting resin film 10e on the back surface 10b side of the insulating base material 10 are thermoplastic. A hole reaching the resin film 10c is formed. Then, the 1st, 2nd via-holes 11 and 12 are formed by forming the hole whose diameter is smaller than the hole formed in the thermosetting resin film 10e in the thermoplastic resin film 10c.

  And the process of FIG.4 (i) is performed and the laminated body 80 is integrated. At this time, as shown in FIG. 16 (a), when pressure is applied from the upper and lower surfaces in the stacking direction of the laminate 80, as shown in FIG. 16 (b), the thermoplastic resin flows to the first, The second conductive pastes 41 and 51 are pressurized and flow into the through hole 13, but the thermosetting resin does not flow. For this reason, as shown in FIG. 16C, the thermoplastic resin flows between the thermosetting resin film 10 e and the first and second interlayer connection members 40 and 50 and into the through hole 13.

  Even if such an insulating base material 10 is used, the pressure applied to the first and second conductive pastes 41 and 51 increases as the thermoplastic resin flows into the through-holes 13, so that the first embodiment described above. The same effect can be obtained.

  Further, since the thermosetting resin does not flow, it is possible to further suppress the displacement of the first and second via holes 11 and 12 in the plane direction of the stacked body 80. And since the thermosetting resin film 10e becomes a flow resistance when the thermoplastic resin flows, it is possible to suppress the thermoplastic resin from flowing out particularly at the outer edge portion of the insulating base material 10.

  Further, in the present embodiment, the first and second via holes 11 and 12 have the diameters of the portions on the front surface 10a side and the back surface 10b side of the insulating base material 10 larger than the diameter of the central portion. For this reason, the contact area of the 1st, 2nd interlayer connection members 40 and 50, the surface pattern 21, and the back surface pattern 31 can fully be ensured, and it can suppress that a conduction | electrical_connection defect generate | occur | produces. Further, the first and second interlayer connection members are compared with the case where the diameters of the first and second via holes 11 and 12 are constant in the diameters of the portions on the front surface 10a side and the back surface 10b side of the insulating substrate 10. The thermal conductivity of 40 and 50 can be reduced.

  In the present embodiment, the insulating base material 10 in which three resin films of the thermosetting resin film 10e, the thermoplastic resin film 10c, and the thermosetting resin film 10e are sequentially laminated is described as an example. Further, a plurality of resin films may be sequentially laminated.

(Second reference example)
A second reference example of the present invention will be described. In this reference example, the surface protection member 20 and the back surface protection member 30 are removed from the first embodiment, and the other aspects are the same as those in the first embodiment, and thus the description thereof is omitted here.

  As shown in FIG. 17, in this reference example, only the surface pattern 21 is disposed on the front surface 10 a of the insulating base material 10, and only the back surface pattern 31 is disposed on the back surface 10 b of the insulating base material 10.

  Such a thermoelectric conversion device 1 is manufactured as follows. That is, as shown in FIG. 18, the front surface metal plate 21 a and the rear surface metal plate 31 a such as a copper plate having the same size as the planar shape of the insulating base material 10 are arranged on the front surface 10 a and the back surface 10 b of the insulating base material 10. Thus, the laminated body 80 is configured.

  And after integrating the laminated body 80 in the process of FIG. 4I, the surface metal plate 21a is connected so that only the first and second interlayer connection members 40, 50 of each set 60 are connected to the same surface pattern 21. Dicing. Further, in the adjacent set 60, the back metal plate 31a is arranged so that only the first interlayer connection member 40 of one set 60 and the second interlayer connection member 50 of the other set 60 are connected to the same back pattern 31. Dicing. Thereby, the thermoelectric conversion apparatus 1 shown in FIG. 17 is manufactured.

  Thus, the present invention can also be applied to the thermoelectric conversion device 1 in which only the front surface pattern 21 is disposed on the front surface 10a of the insulating substrate 10 and only the back surface pattern 31 is disposed on the rear surface 10b.

(Eighth embodiment)
An eighth embodiment of the present invention will be described. In the present embodiment, the second interlayer connection member 50 is changed with respect to the first embodiment, and the other parts are the same as those in the first embodiment, and thus the description thereof is omitted here.

  As shown in FIG. 19, in the present embodiment, the second interlayer connection member 50 is configured by sintering a second conductive paste 51 containing metal particles such as Ag—Sn. That is, the second interlayer connection member 50 of the present embodiment is provided not for the purpose of mainly exerting the thermoelectric effect but for the purpose of electrical conduction. For this reason, the diameter of the second via hole 12 is made smaller than the diameter of the first via hole 11. In other words, the cross-sectional area along the plane parallel to the surface of the insulating base material 10 in the second via hole 12 is made smaller than the cross-sectional area along the plane parallel to the surface of the insulating base material 10 in the first via hole 11.

  In such a thermoelectric conversion device 1 as well, the first interlayer connection member 40, the front surface pattern 21, and the back surface pattern 31 are made of different metals. A thermoelectric effect can be obtained between the two.

  Such a thermoelectric conversion device 1 forms a second via hole 12 having a diameter smaller than that of the first via hole 11 in the step of FIG. And it manufactures by using the conductive paste containing metal particles, such as Ag-Sn type | system | group, as the 2nd conductive paste 51. FIG.

  Thus, the present invention can also be applied to the thermoelectric conversion device 1 in which the second interlayer connection member 50 is mainly intended for electrical conduction.

  The second interlayer connecting member 50 is not connected to the front surface pattern 21 and the back surface pattern 31 by solid phase sintering, but is connected to the front surface pattern 21 and the back surface pattern 31 by metal (diffusion) bonding.

(Ninth embodiment)
A ninth embodiment of the present invention will be described. In this embodiment, the arrangement method of the first and second via holes 11 and 12 is changed with respect to the eighth embodiment, and the other aspects are the same as those in the eighth embodiment. To do.

  As shown in FIGS. 20 and 21, in the present embodiment, the second via hole 12 is formed only at one end in the long side direction of the insulating base material 10 (the left and right direction in FIG. 20 and FIG. 21). Yes. More specifically, the first and second via holes 11 and 12 are alternately formed in the short side direction (the vertical direction in FIG. 20 and FIG. 21) at the end of the insulating base material 10.

  The first and second interlayer connection members 40 and 50 arranged along the long side direction of the insulating base material 10 are connected to the same surface pattern 21. In addition, the first interlayer connection member 40 disposed along the long side direction of the insulating base material 10 is connected to the same back surface pattern 31. The second interlayer connection member 50 has a back surface to which a first interlayer connection member 50 different from the first interlayer connection member 40 connected to the surface pattern 21 to which the second interlayer connection member 50 is connected is connected. The pattern 31 is connected.

  That is, in this embodiment, the first interlayer connection members 40 arranged along the long side direction of the insulating base material 10 are connected in parallel, and the parallel connection members are connected in series via the second interlayer connection member 50. Connected configuration.

  In FIG. 20, the surface protection member 20 is omitted for easy understanding, and the first and second interlayer connection members 40 and 50 are hatched although they are not sectional views. Similarly, FIG. 21 omits the back surface protection member 30 for easy understanding, and is not a cross-sectional view, but the first and second interlayer connection members 40 and 50 are hatched. .

  Such a thermoelectric conversion device 1 is not particularly shown, but in the steps of FIG. 4A and FIG. 4C, the place where the first via hole 11 and the second via hole 12 are formed is changed, and FIG. ) And the process of FIG. 4G are manufactured by forming the front surface pattern 21 and the back surface pattern 31.

  Thus, the present invention can also be applied to the thermoelectric conversion device 1 in which the first and second via holes 11 and 12 are not alternately formed.

(10th Embodiment)
A tenth embodiment of the present invention will be described. This embodiment is different from the first embodiment in that only the first via hole 11 is formed and the front surface protection member 20 and the back surface protection member 30 are integrated. Therefore, the description is omitted here.

  As shown in FIG. 22 and FIG. 23, in the present embodiment, only the first via hole 11 is formed in the insulating base material 10. That is, only the first interlayer connection member 40 is disposed on the insulating base material 10. Moreover, the surface protection member 20 and the back surface protection member 30 are integrated, and the surface pattern 21 and the back surface pattern 31 are formed continuously.

  And the surface pattern 21 is connected with the 1st interlayer connection member 40 arrange | positioned along the long side direction of the insulating base material 10. FIG. The back surface pattern 31 formed continuously with the surface pattern 21 is connected to a first interlayer connection member 40 different from the first interlayer connection member 40 to which the surface pattern 21 is connected.

  That is, in this embodiment, the 1st interlayer connection member 40 arrange | positioned along the long side direction of the insulating base material 10 is respectively connected in parallel.

  Although such a thermoelectric conversion device 1 is not particularly illustrated, only the first via hole 11 is formed in the step of FIG. 4A, and the surface protection member 20 and the back surface are formed in the steps of FIGS. 4F and 4G. What is necessary is just to prepare what the protection member 30 was integrated.

  Thus, the present invention can also be applied to the thermoelectric conversion device 1 in which only the first via hole 11 is formed and the front surface protection member 20 and the back surface protection member 30 are integrated.

(Eleventh embodiment)
An eleventh embodiment of the present invention will be described. In the present embodiment, an electronic component is configured using the thermoelectric conversion device 1 of the first embodiment, and the details of the thermoelectric conversion device 1 are the same as those of the first embodiment, and thus the description thereof is omitted here.

  As shown in FIG. 24, the electronic component 100 includes a multilayer substrate 110 corresponding to the object of the present invention on the surface protection member 20 in the thermoelectric conversion device 1. The multilayer substrate 110 according to the present embodiment includes a plurality of resin films 120 each including a wiring pattern 121 and an interlayer connection member 122, and includes chips 131 to 133 inside and on the side opposite to the thermoelectric conversion device 1 side. And the thermoelectric conversion apparatus 1 and the multilayer substrate 110 are directly joined.

  In the electronic component 100, the thermoelectric conversion device 1 functions to cool the multilayer substrate 110 and generate power to be supplied to the chips 131 to 133. When the thermoelectric conversion device 1 is used to supply power to the multilayer substrate 110, the thermoelectric conversion device 1 and the multilayer substrate 110 may be provided with interlayer connection members or the like so as to be electrically connected to each other. Good.

  Such an electronic component 100 is configured by laminating the back surface protection member 30, the insulating base material 10, the surface protection member 20, and the plurality of resin films 120 to form a laminate 80, and pressurizing the laminate 80 while heating. Manufactured by integrating. That is, when manufacturing the thermoelectric conversion device 1, the thermoelectric conversion device 1 and the multilayer substrate 110 are joined simultaneously.

  As described above, in the present embodiment, when the thermoelectric conversion device 1 is manufactured, the thermoelectric conversion device 1 and the multilayer substrate 110 can be bonded at the same time, and an adhesive or the like is formed after the thermoelectric conversion device 1 is formed. As compared with the case where the thermoelectric conversion device 1 is bonded to the multilayer substrate 110 via the manufacturing process, the manufacturing process can be simplified.

  In addition, the electronic component 100 is configured by directly joining the thermoelectric conversion device 1 and the multilayer substrate 110. That is, no extra inclusions are present between the thermoelectric conversion device 1 and the multilayer substrate 110. For this reason, the heat of the multilayer substrate 110 is easily transferred to the thermoelectric conversion device 1, and the electronic component 100 having high heat transfer between the multilayer substrate 110 and the thermoelectric conversion device 1 can be obtained.

  In the present embodiment, the multilayer substrate 110 is described as an example in which a plurality of resin films 120 are stacked. However, for example, the multilayer substrate 110 is formed by stacking a plurality of ceramic substrates. Also good. Alternatively, only the multilayer substrate 110 may be formed first, and the back surface protection member 30, the insulating base material 10, the surface protection member 20, and the multilayer substrate 110 may be laminated to form the laminate 80.

(Other embodiments)
The present invention is not limited to the embodiment described above, and can be appropriately changed within the scope described in the claims.

  For example, the above embodiments can be combined. That is, the first and second embodiments may be combined with the third embodiment to form the through hole 13 or the groove 14 while forming the recess 15. The second embodiment may be combined with the sixth to tenth embodiments and the second reference example, and the groove portion 14 may be formed instead of the through hole 13. Further, the third embodiment may be combined with the sixth to tenth embodiments and the second reference example, and the recess 15 may be formed instead of the through hole 13. Further, the fourth embodiment may be combined with the sixth to tenth embodiments and the second reference example, and a glass cloth 10d may be used instead of the through hole 13, and the fifth embodiment may be used with the sixth to tenth embodiments and the first embodiment. In combination with the two reference examples, a thermoplastic resin film 10c in which a plurality of holes 17 are formed instead of the through holes 13 may be used.

  And when using the thermoplastic resin film 10c in which the glass cloth 10d and the some hole 17 are formed, the through-hole 13, the groove part 14, and the recessed part 15 may be formed suitably.

  Furthermore, the first reference example may be combined with the first to fifth embodiments, and the laminate 80 may be integrated using a pair of press plates 90 in which the recessed portions 90a are formed.

  And you may use what laminated | stacked the thermoplastic resin film 10c and the thermosetting resin film 10e as the insulating base material 10, combining 7th Embodiment with a 2nd reference example and 8th-10th embodiment. Moreover, when using the insulating base material 10 which laminated | stacked the thermoplastic resin film 10c and the thermosetting resin film 10e like 7th Embodiment, the diameter of the 1st, 2nd via-holes 11 and 12 is made constant. Also good. Then, the second reference example may be combined with the eighth to tenth embodiments, and the front surface pattern 21 and the back surface pattern 31 may be formed using the metal plates 21a and 31a.

  Furthermore, what combined each embodiment and each reference example may be combined with another embodiment or another reference example.

  Moreover, although the said 11th Embodiment demonstrated the example which comprises the electronic component 100 by the thermoelectric conversion apparatus 1 and the multilayer substrate 110, a target object is not limited to the multilayer substrate 110. FIG.

  For example, as shown in FIG. 25, the electronic component 100 may be configured by providing fins 140 corresponding to the object of the present invention on the surface protection member 20 in the thermoelectric conversion device 1. In such an electronic component 100, the heat dissipation characteristics can be improved by the fins 140. The electronic component 100 is manufactured by forming a laminated body 80 including the fins 140 and pressing and integrating the laminated body 80 while heating.

  Moreover, for example, as shown in FIG. 26, the thermoelectric conversion device 1 may be an electronic component 100 formed by joining a circular cross section such as a pipe 150.

  The thermoelectric conversion apparatus 1 used for such an electronic component 100 is manufactured by using what has a curved surface as a pair of press board which heats the laminated body 80, for example in the case of an integration process. In the integration step, stress is applied to the first and second via holes 11 and 12 by the flow of the resin constituting the insulating base 10 as described above, so that the metal particles and the metal particles and the surface pattern 21 and the back pattern 31 are applied. Therefore, stable bonding can be obtained even when the shape has a curved surface. Moreover, also in such an electronic component 100, when manufacturing the thermoelectric conversion apparatus 1, you may make it join the thermoelectric conversion apparatus 1 and a target object.

  Moreover, the insulation base material 10, the surface protection member 20, and the back surface protection member 30 are comprised with resin, and the thermoelectric conversion apparatus 1 has flexibility. For this reason, after manufacturing the thermoelectric conversion apparatus 1, you may bend | fold according to the shape of a target object.

  Further, as shown in FIG. 27, the thermoelectric conversion device 1 is mounted on the substrate 160, and the electronic member 190 including the control chip 170 and the communication device 180 is mounted on the substrate 160, and the power supplied to the communication device 180 is supplied. It can also be set as the electronic component 100 produced | generated with the thermoelectric conversion apparatus 1. FIG. In FIG. 27, the communication device 180 is exposed, but the communication device 180 may be disposed in the thermoelectric conversion device 1 (insulating base material 10).

  And the thermoelectric conversion apparatus 1 of this invention and the electronic component 100 containing this thermoelectric conversion apparatus 1 are provided in the roof and wall which partition indoor and outdoor, for example, and generate | occur | produce electric power by the temperature difference between indoor and outdoor Also used as Moreover, it is used also as what produces | generates electric power by the temperature difference of air | atmosphere and the ground.

DESCRIPTION OF SYMBOLS 10 Insulation base material 10a Surface 10b Back surface 11 1st via hole 12 2nd via hole 20 Surface protection member 21 Surface pattern 30 Back surface protection member 31 Back surface pattern 40 1st interlayer connection member 41 1st conductive paste 50 2nd interlayer connection member 51 1st 2 conductive paste 60 sets 80 laminates

Claims (15)

A plurality of first and second via holes (11, 12) penetrating in the thickness direction are formed, and a first conductive paste (41) is filled in the first via hole. And preparing an insulating base material (10) in which the second via hole is filled with the second conductive paste (51);
A surface protection member (20) having a surface pattern (21) in contact with the predetermined first and second conductive pastes is disposed on the surface (10a) of the insulating substrate, and the back surface (10b) of the insulating substrate. ) Forming a laminate (80) by disposing a back surface protection member (30) having a back surface pattern (31) in contact with the predetermined first and second conductive pastes;
The first and second interlayer connection members (40, 50) are formed from the first and second conductive pastes while heating the stacked body from the stacking direction, and the first and second interlayer connection members An integration step of electrically connecting the front surface pattern and the back surface pattern;
As the first conductive paste, a paste obtained by adding an organic solvent to a powder of an alloy in which a plurality of metal atoms maintain a predetermined crystal structure,
As the second conductive paste, a paste obtained by adding an organic solvent to the alloy and the different metal powder,
In the step of forming the laminate, voids (13 to 17) are formed inside the laminate,
In the integration step, the first interlayer connection member is configured by solid-phase sintering the first conductive paste while allowing the thermoplastic resin to flow into the gap. Method.   The method for manufacturing a thermoelectric conversion device according to claim 1, wherein a through hole (13) is formed in the insulating base material before the step of forming the laminated body.   3. The method according to claim 2, wherein in the step of forming the through holes, the plurality of through holes are formed at equal intervals in a circumferential direction on a concentric circle centering on each of the first and second via holes. A method for manufacturing a thermoelectric converter.   Before the step of forming the laminated body, a frame-shaped groove (14) is formed so that one of the first and second via holes is positioned one by one in the frame of the groove. The manufacturing method of the thermoelectric conversion apparatus of Claim 1.   In the step of forming the laminated body, the surface protection in which a recess (15) is formed in a portion different from a portion in contact with the first and second conductive pastes in at least one of the front surface pattern and the back surface pattern. The method of manufacturing a thermoelectric conversion device according to any one of claims 1 to 4, wherein a member and the back surface protection member are used.   The method for manufacturing a thermoelectric conversion device according to any one of claims 1 to 5, wherein a material containing a porous member (10d) having a cavity (16) therein is used as the insulating substrate. .   The method for manufacturing a thermoelectric conversion device according to any one of claims 1 to 5, wherein a porous material having a hole (17) formed therein is used as the insulating substrate. In the step of preparing the insulating substrate,
Forming the first via hole in the insulating substrate;
Filling the first via hole with the first conductive paste;
Forming the second via hole in the insulating base material after the step of filling the first conductive paste;
Filling the second via hole with the second conductive paste,
As the second conductive paste, a paste composed of an organic solvent having a melting point lower than that of the organic solvent constituting the first conductive paste is used.
In the step of filling the second conductive paste, the insulating substrate is at a temperature lower than the melting point of the organic solvent contained in the first conductive paste, and the melting point of the organic solvent contained in the second conductive paste. The method of manufacturing a thermoelectric conversion device according to any one of claims 1 to 7, wherein the method is performed while maintaining a higher temperature. In the step of preparing the insulating substrate,
Simultaneously forming the first and second via holes in the insulating substrate;
Disposing a mask having an area corresponding to the first via hole on the surface of the insulating base;
Filling the first via hole with the first conductive paste from the surface side of the insulating substrate;
Removing the mask;
Filling the second via hole with the second conductive paste,
As the second conductive paste, a paste composed of an organic solvent having a melting point lower than that of the organic solvent constituting the first conductive paste is used.
In the step of filling the second conductive paste, the insulating substrate is at a temperature lower than the melting point of the organic solvent contained in the first conductive paste, and the melting point of the organic solvent contained in the second conductive paste. The method of manufacturing a thermoelectric conversion device according to any one of claims 1 to 7, wherein the method is performed while maintaining a higher temperature.   10. The insulating base material according to claim 1, wherein a thermosetting resin film (10e), a thermoplastic resin film (10c), and a thermosetting resin film (10e) are sequentially laminated. The manufacturing method of the thermoelectric conversion apparatus as described in any one. In the step of preparing the insulating base material, the one in which the first and second via holes are alternately formed is prepared,
In the step of forming the stacked body, the first conductive paste filled in one adjacent first via hole and the second conductive paste filled in one second via hole are combined (60). The surface protection member in a state where the first conductive paste and the second conductive paste are in contact with the same surface pattern in the plurality of surface patterns for each set on the surface side of the insulating substrate. The first conductive paste of one set in the adjacent set and the second conductive paste of the other set are arranged on the same back surface pattern in the plurality of back surface patterns on the back surface side of the insulating base. The method for manufacturing a thermoelectric conversion device according to any one of claims 1 to 10, wherein the back surface protection member is disposed in contact with the back surface protection member. In the step of preparing the insulating base material, a cross-sectional area along a plane parallel to the surface of the insulating base material in the second via hole is smaller than a cross-sectional area along the plane of the insulating base material in the first via hole. Prepare things,
The method for manufacturing a thermoelectric conversion device according to claim 1, wherein the second conductive paste is used for connecting the front surface pattern and the back surface pattern.   The manufacturing process of the thermoelectric conversion device according to any one of claims 1 to 12, wherein in the step of forming the laminate, the surface protection member and the back surface protection member are integrated. Method. A plurality of via holes (11, 12) that are formed by including a thermoplastic resin and that penetrate in the thickness direction are formed, and an insulating base material (10) in which a conductive paste (41) is filled in the via holes is provided. A process to prepare;
A surface protection member (20) having a surface pattern (21) that comes into contact with the predetermined conductive paste is disposed on the surface (10a) of the insulating base material, and the predetermined surface on the back surface (10b) of the insulating base material. Arranging a back surface protection member (30) having a back surface pattern (31) in contact with the conductive paste to form a laminate (80);
An integration process in which the laminate is heated from the laminating direction while being heated to constitute the interlayer connection member (40) from the conductive paste and to electrically connect the interlayer connection member to the front surface pattern and the back surface pattern. And
As the conductive paste, a paste prepared by adding an organic solvent to an alloy powder in which a plurality of metal atoms maintain a predetermined crystal structure is prepared,
In the step of configuring the laminate, voids (13 to 17) are formed inside the laminate,
In the integration step, an interlayer connection member is configured by solid-phase sintering the conductive paste while allowing the thermoplastic resin to flow into the gap. Applying the method for manufacturing a thermoelectric conversion device according to any one of claims 1 to 14 as a method for manufacturing an electronic component,
In the step of forming the laminate, a laminate in which an object (110, 140, 150) is laminated on the surface protection member is configured,
In the integration step, the surface protection member and the object are directly joined to each other.

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