JP5375133B2 - Component mounting equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus which can improve working efficiency in the setup of reference position parameter and can ensure traceability in the management of a jig. <P>SOLUTION: In a tool stocker 15 which accommodates a plurality of replaceable work tools which are mounted on a plurality of working heads according to type of a target component, a jig 74 for height, a jig 75 for center position, and a jig 76 for rotation position are accommodated, which are used in common to set up the operation reference position in machine parameter of a plurality of drive shafts to a predetermined position 15b for jig. A teaching treatment part is constructed so as to automatically perform jig mounting operation for mounting these jigs on a plurality of working heads and a data acquiring operation for acquiring data required for the setup of the operation reference position. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a component mounting apparatus that takes out components such as semiconductor chips from a component supply stage and mounts them on a substrate.

  A component such as a semiconductor chip is taken out from the component supply stage and mounted on a substrate such as a lead frame or a resin substrate. This component mounting operation is performed by a transfer head that holds and transfers components, such as a pickup head that extracts components and a mounting head that mounts the extracted components on a substrate. Such a transfer head is driven by a transfer mechanism in which a plurality of drive shafts are combined, and the transfer head is set to a preset operation locus and operation sequence by controlling the motors that rotationally drive each drive shaft. Therefore, the component mounting operation is performed.

In order for such a transfer mechanism to perform a correct component mounting operation, it is necessary to correctly set the operation reference position on each drive shaft constituting the transfer mechanism as a reference position parameter on the machine parameters of the NC control system. . This reference position parameter setting operation is generally performed by attaching a jig prepared in advance for position adjustment to the transfer head and causing the transfer head to perform data acquisition operations (Patent Document). 1, 2, 3). In each of the prior arts shown in these patent documents, a jig is mounted on a transfer head such as a mounting head, and the operation of lowering the transfer head or the position of the jig mounted on the transfer head is recognized by image recognition or laser. An operation for data acquisition detected by a measuring device or the like is performed to acquire data necessary for setting the reference position parameter.
Japanese Patent Laid-Open No. 4-40000 JP 2001-223499 A JP 2007-273814 A

  By the way, there are various variations in the form of mounting a component such as a semiconductor chip on a substrate depending on differences in mounting posture of the component, a method of bonding the component to the substrate, and mounting accuracy required by the characteristics of the component. For this reason, a component mounting apparatus that performs a mounting operation for taking out a component from the component supply stage and mounting the component on the board is required to have different functions depending on the mounting form.

  When targeting a plurality of types of components having different mounting forms, a component mounting apparatus including a plurality of work heads having a function corresponding to each mounting form is used. It is necessary to set the reference position parameter. In such a case, conventionally, the work of attaching a dedicated jig to each work head is not necessarily performed automatically, and a considerable part depends on the manual work of the operator, and the work efficiency is reduced. Improvement from was desired.

  In addition, since the handling of jigs is left to manual work, the management of the jigs that are actually used is unlikely to be rigorous, eliminating the case where different jigs are used for work heads belonging to the same device. As a result, it was difficult to ensure traceability in jig management. For this reason, when the reference position parameter setting operation is performed again after the maintenance inspection, the individual error of the jig has a negative effect on the operation accuracy of each work head. As described above, in the conventional component mounting apparatus, manual work is involved in setting the reference position parameter due to the jig handling method, the work efficiency is lowered, and it is difficult to ensure traceability in jig management. There was a problem.

  Therefore, an object of the present invention is to provide a component mounting apparatus that can improve the work efficiency of the setting operation of the reference position parameter and can ensure traceability in the management of the jig.

The component mounting apparatus according to the present invention includes a component supply unit that supplies a component, a substrate holding unit that holds a substrate, and the component supplied by the component supply unit that is mounted on the substrate held by the substrate holding unit. A paste application function for performing a predetermined operation on the substrate or a component mounted on the substrate by the first head, discharging a component bonding paste, and supplying the paste to the substrate, the paste A work unit having at least one of a paste transfer function for transferring the heat to the substrate and a heating / pressing function for pressing the component mounted on the substrate against the substrate while heating The second head that can be mounted and the first head and the second head are both located in an accessible area, and the first head can be used according to the type of the target component. A tool stocker provided with a plurality of storage recesses for storing a plurality of work tools exchangeably mounted on the head and the second head, and stored in the specific storage recess specified in advance in the tool stocker, In order to set operation reference positions in machine parameters of a plurality of drive shafts constituting a head moving mechanism that is exchangeably mounted on the first head and the second head and moves the first head and the second head. A plurality of types of jigs commonly used for the first head and the second head and data for setting the operation reference position are acquired, and the operation reference position set based on the acquired data is used as a reference position parameter. A teaching processing unit for performing teaching processing stored in the storage unit as the first processing unit, the teaching processing unit, Let the head perform a jig mounting operation for mounting the jig and a data acquisition operation for acquiring data necessary for setting the operation reference position, and control the drive shaft of the head moving mechanism. Acquired data indicating the position or height position in the horizontal plane of the jig in a state of being held by the first head and the second head. Obtained based on the result detected by the detecting means.

  According to the present invention, the head is placed in a specific storage recess designated in advance in a tool stocker that stores a plurality of work tools that are interchangeably mounted on the first head and the second head according to the type of the target component. A jig that is commonly used to set the operation reference position in the machine parameters of the drive axes that make up the moving mechanism is stored, and the jig is attached to the first and second heads in the teaching processing section. To improve the work efficiency by automating the setting work of the reference position parameter by adopting the configuration to perform the data acquisition operation for acquiring the data necessary for setting the jig mounting operation and the operation reference position. In addition, traceability in jig management can be ensured by always using a common jig.

Next, embodiments of the present invention will be described with reference to the drawings. 1 is an overall perspective view of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a partial perspective view of a component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is a component according to an embodiment of the present invention. FIG. 4 is a perspective view of a unit assembly stage of the component mounting apparatus according to the embodiment of the present invention, and FIG. 5 is attached to the second head of the component mounting apparatus according to the embodiment of the present invention. FIG. 6 is an explanatory diagram of a work unit, FIG. 6 is an explanatory diagram of a jig for setting a reference position parameter used in the component mounting apparatus according to the embodiment of the present invention, and FIGS. 7 and 8 are components according to the embodiment of the present invention. FIG. 9 is a block diagram showing the configuration of the control system of the component mounting apparatus according to one embodiment of the present invention, and FIGS. 10 and 11 are one embodiment of the present invention. Setting process of reference position parameter Low view, FIG. 12 is an explanatory view of the operation of setting processing of reference position parameters in the component mounting apparatus of an embodiment of the present invention.

  First, the overall configuration of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 has a function of mounting a component such as a semiconductor chip on a substrate by bonding. In FIG. 1, a component supply stage 3 (component supply unit), a unit assembly stage 4 and a substrate holding stage 5 (substrate holding unit) are aligned on the Y direction (first direction) on the base 2. It is arranged.

  The wafer holding table 3a provided in the component supply stage 3 holds a semiconductor wafer 6 on which a plurality of semiconductor chips 6a, which are components to be mounted, are arranged.

  The unit assembly stage 4 has a tool stocker 15, a component collection unit 16, and a calibration, which will be described later, on a moving table 4 a that reciprocates in the X direction (second direction) by a linear movement mechanism (see the X axis movement mechanism 40 shown in FIG. 4). A functional unit such as the reference mark 17, the relay stage 18, and the component recognition camera 24 is collectively arranged. The substrate holding stage 5 is configured to horizontally drive a substrate holding table 5 a that holds the substrate 7 by an XY table mechanism 53 (see FIG. 3), and a semiconductor chip 6 a is mounted on the substrate 7.

  Above the component supply stage 3, the unit assembly stage 4, and the substrate holding stage 5, the Y-axis frame 8 is positioned at the end of the base 2 in the X direction, and both ends are supported by the support posts 8a in the Y direction. It is built in. On the front surface of the Y-axis frame 8 is incorporated a head moving mechanism 9 that guides and drives a first head 11 and a second head 12 described below in the Y direction by linear motor driving. A mounting unit 19 having a function of holding the semiconductor chip 6a and mounting it on the substrate 7 is mounted on the first head 11, and a function of applying an adhesive for bonding electronic components to the substrate 7 on the second head 12. A coating unit 20 having the above is mounted.

  Above the component supply stage 3, the relay stage 18, and the substrate holding stage 5, a first camera 21, a second camera 22, and a third camera 23 are disposed for position recognition. The first camera 21 images the semiconductor chip 6a to be taken out in the component supply stage 3. The second camera 22 picks up an image of the semiconductor chip 6a taken out from the component supply stage 3 and temporarily placed on the relay stage 18 for position correction, and is stored in the tool stocker 15 disposed on the unit assembly stage 4. It has a function to identify the type by imaging the tool. The third camera 23 captures an image of the board 7 held on the board holding stage 5 and recognizes the position of the component mounting point. The component recognition camera 24 disposed on the unit assembly stage 4 images the semiconductor chip 6a taken out from the component supply stage 3 from below.

  Next, the structure of each part will be described with reference to FIGS. The component supply stage 3 includes an XY table mechanism 31, and a plurality of support members 33 are erected on a horizontal moving plate 32 mounted on the upper surface of the XY table mechanism 31. The support member 33 supports the wafer holding table 3a on which the semiconductor wafer 6 is mounted and held on the upper surface. The semiconductor wafer 6 has a configuration in which a plurality of semiconductor chips 6a are bonded to a wafer sheet 6b in a predetermined arrangement. On the wafer sheet 6b, a plurality of semiconductor chips 6a in a state of being divided into pieces in a face-up posture with the active surface facing upward are adhered and held.

  In the component supply stage 3, a pick-up work position [P1] for picking up the semiconductor chip 6a from the semiconductor wafer 6 is set. The position of the first camera 21 corresponds to the pickup work position [P1], and the position of the semiconductor chip 6a to be picked up is detected by recognizing the imaging result obtained by imaging the semiconductor wafer 6 by the first camera 21. The An ejector mechanism 34 is disposed at a position corresponding to the pickup work position [P1] inside the wafer holding table 3a.

  The ejector mechanism 34 has a function of promoting the peeling of the semiconductor chip 6a from the wafer sheet 6b by pushing up the semiconductor chip 6a with a pin from the lower surface side of the wafer sheet 6b. When the semiconductor chip 6a is taken out, the ejector mechanism 34 is moved up and down and brought into contact with the lower surface of the wafer sheet 6b, whereby the semiconductor chip 6a can be easily taken out from the wafer sheet 6b by the pickup head 14 described later.

  In the component take-out operation, the XY table mechanism 31 is driven to move the wafer sheet 6b horizontally in the XY direction (arrow a), so that a plurality of semiconductor chips 6a attached to the wafer sheet 6b are picked up. The desired semiconductor chip 6a is positioned at the pick-up work position [P1]. Here, an example is shown in which a wafer table of a system for supplying wafer-state components attached to the wafer sheet 6b is used as the component supply stage 3, but a component tray that supplies a plurality of components in a predetermined planar arrangement. May be arranged on the component supply stage 3 so as to be exchangeable with the wafer table.

  Above the component supply stage 3, there is disposed a pickup head 14 having a configuration in which a pickup nozzle 70 that sucks and holds the semiconductor chip 6a is detachably attached to the nozzle attachment portion 14a. The pickup head 14 is held by a pickup arm 13a. The pickup arm 13a extends from the pickup head moving mechanism 13 suspended from the lower surface of the Y-axis frame 8 and extends above the component supply stage 3. It has been. By driving the pickup head moving mechanism 13, the pickup arm 13a moves in the XYZ directions (arrow b) and rotates around the X direction axis (arrow c).

  As a result, the pickup head 14 moves in the Y direction between the upper part of the component supply stage 3 and the upper part of the unit assembly stage 4 and moves up and down in the Z direction. As a result, the pickup head 14 picks up the semiconductor chip 6 a from the component supply stage 3 and transfers it to the relay stage 18 provided in the unit assembly stage 4. Further, when necessary, the pickup head 14 can be retracted in the X direction from above the pickup work position [P1], and the pickup head 14 is reversed by rotating the pickup arm 13a, thereby picking up the pickup nozzle 70. It is possible to reverse the orientation of the semiconductor chip 6a held on the front and back.

  As shown in FIG. 3, the unit assembly stage 4 and the substrate holding stage 5 are provided on the upper surface of the base plate 52, and the base plate 52 is supported from below by a plurality of support posts 51 erected on the upper surface of the base 2. Has been. Here, the detailed structure of the unit assembly stage 4 will be described with reference to FIG. In FIG. 4, the X-axis moving mechanism 40 has a function of moving the moving table 4 a in the X direction, and is configured by disposing a mechanism element described below on the base portion 41. A guide rail 42a is disposed on the upper surface of the base portion 41 in the X direction, and a slider 42b slidably fitted to the guide rail 42a is fixed to the lower surface of the moving table 4a.

  A feed screw 45 is pivotally supported on brackets 43a and 43b erected on both ends of the base portion 41, and the feed screw 45 is rotationally driven by a motor 44 held on the bracket 43b. The feed screw 45 is screwed to a nut member (not shown) coupled to the lower surface of the moving table 4a, and the moving table 4a reciprocates in the X direction by rotating the motor 44 in the forward and reverse directions ( Arrow g). As a result, the following functional units arranged on the moving table 4a can be integrally moved in the X direction, and these functional units are positioned in an area accessible by the first head 11 and the second head 12. It is possible.

The moving table 4a includes a tool stocker 15, a parts collection unit 16, a calibration reference mark 17,
The relay stage 18 and the component recognition camera 24 are collectively arranged.

  As shown in FIG. 4, the tool stocker 15 has a plurality of storage recesses for storing a plurality of work tools that are exchanged according to the component type, such as a component holding nozzle 71 mounted on the mounting unit 19. 15a is provided (refer to sectional view). In these storage recesses 15a, a plurality of work tools are stored for each component type. The individually stored work tools include a pickup nozzle 70 attached to the pickup head 14, a transfer unit 54 shown in FIG. 5, a transfer tool 72 attached to the heating / pressing unit 57, and a heating / pressing tool 73, respectively. It is. Furthermore, in the present embodiment, a specific storage recess 15a located in the vicinity of the rear end portion in the planar position of the tool stocker 15 is designated as a jig dedicated position 15b for storing a reference position setting jig described later. ing. A height jig 74, a center position jig 75, and a rotation position jig 76 are collectively stored in the jig dedicated position 15b. Of course, it is not always necessary to store all of these in the tool stocker 15, and only the necessary dedicated jig may be stored.

  In a state where the tool stocker 15 is moved to an area accessible by the first head 11 and the second head 12, the first unit 11 and the second head 12 are moved to the unit assembly stage 4. The unit 54, the component holding nozzle 71 mounted on the heating / pressing unit 57, the transfer tool 72, and the heating / pressing tool 73 according to the target component type, the height jig 74, the center position jig. The tool 75 and the rotation position jig 76 can be exchanged according to the reference position setting application. That is, the X-axis moving mechanism 40 moves the tool stocker 15 in the X direction (second direction) orthogonal to the Y direction (first direction), and is accessible to both the first head 11 and the second head 12. It is a stocker moving means to be located in the position.

  That is, in the component mounting apparatus 1 shown in the present embodiment, the mounting unit 19 of the first head 11 is placed at a position accessible by both the first head 11 and the second head 12 according to the type of the target component. The component holding nozzle 71 and the work unit selectively mounted on the second head 12 in accordance with the type of the target component, that is, the transfer unit 54 and the heating / pressing unit 57 are interchangeably mounted. The tool stocker 15 storing work tools such as the transfer tool 72 and the heating / pressing tool 73 is arranged.

  By adopting such a configuration, even when a large number of work tools for replacement are required for a plurality of component types, the occupied area of the mechanism part required for the tool replacement function is minimized, It is possible to reduce the size of the apparatus.

  The component collection unit 16 has a function of discarding and collecting components that are determined to be unsuitable for mounting on the substrate 7 such as defective components or mixed different components after being taken out from the component supply stage 3. The calibration reference mark 17 is provided for imaging and calibrating a mechanical position error caused by thermal expansion and contraction when the X-axis moving mechanism 40 is continuously driven by the second camera 22 disposed above. The reference mark.

The relay stage 18 is disposed between the component supply stage 3 and the substrate holding stage 5 and is provided integrally with the tool stocker 15. The relay stage 18 includes a pickup head from the component supply stage 3. The semiconductor chip 6a taken out by 14 is placed for position correction. A relay position [P2] is set on the relay stage 18, and the second camera 22 is arranged corresponding to the relay position [P2]. By moving the relay stage 18 by the X-axis moving mechanism 40, the semiconductor chip 6a placed on the relay stage 18 can be positioned at the relay position [P2] and imaged by the second camera 22, thereby relaying. The position of the semiconductor chip 6a placed on the stage 18 is detected. The component recognition camera 24 is disposed with the imaging surface 24a adjacent to the relay stage 18, and similarly, by driving the X-axis movement mechanism 40, the imaging surface 24a can be positioned at the component recognition position [P3]. . The semiconductor chip 6a temporarily placed on the relay stage 18 and taken out after position recognition is imaged by the component recognition camera 24 at the component recognition position [P3], and position detection is performed.

  Further, the unit assembly stage 4 is provided with a cleaning unit 46 for cleaning the surface of the relay stage 18. As shown in FIG. 4, the cleaning unit 46 is arranged so that the horizontal bar-shaped cleaning member 46a is positioned above the relay stage 18 in a state where the moving table 4a is moved to the front side of the apparatus (left side in FIG. 2). Has been. A brush 46b extending downward is provided on the lower surface of the cleaning member 46a so as to be in sliding contact with the upper surface of the relay stage 18. In this state, the X-axis moving mechanism 40 is driven to reciprocate the moving table 4a. Thus, the foreign matter adhering and accumulating on the surface of the relay stage 18 is removed by the brush 46b. A suction hole is provided inside the cleaning member 46a. By vacuum suctioning the inside of the cleaning member 46a through the suction pipe 46c (arrow h), fine foreign matter removed by the brush 46b is sucked. Can be discharged.

  The substrate holding stage 5 has a configuration in which a substrate holding table 5 a for holding the substrate 7 is provided on the XY table mechanism 53. A mounting work position [P4] for mounting the semiconductor chip 6a on the substrate 7 held on the substrate holding table 5a is set on the substrate holding stage 5, and the third camera 23 is set at the mounting work position [P4]. Correspondingly arranged. By imaging the board 7 with the third camera 23, the position of the component mounting point 7 a set on the board 7 is detected. Then, by driving the XY table mechanism 53, the board holding table 5a moves horizontally in the XY direction together with the board 7 (arrow f), and an arbitrary component mounting point 7a set on the board 7 is placed at the mounting work position [P4]. Can be positioned.

  Next, the first head 11 and the second head 12 will be described. 2, two guide rails 9a for guiding the first head 11 and the second head 12 in the Y direction are provided on the front surface of the head moving mechanism 9 provided on the Y-axis frame 8. Between these guide rails 9a, a stator 9b constituting a linear motor for driving the first head 11 and the second head 12 described below in the Y direction is disposed. A slider (not shown) is fitted to the guide rail 9a so as to be slidable in the Y direction, and the slider is fixed to the back of the vertical moving plates 11a and 12a.

  On the back surface of the movable plates 11a and 12a, a mover (not shown) constituting a linear motor is disposed facing the stator 9b. By driving these linear motors, the first head 11 and the second head 12 are guided by the guide rail 9a and each move in the Y direction (arrow d). Elevating mechanisms 11b and 12b are provided on the front surfaces of the movable plates 11a and 12a, respectively, and elevating plates 11c and 12c are provided on the front surfaces of the elevating mechanisms 11b and 12b so as to be slidable in the vertical direction. Driving the elevating mechanisms 11b and 12b raises and lowers the elevating plates 11c and 12c (arrow e). A mounting unit 19 having a component holding nozzle 71 at its lower part is detachably attached to the elevating plate 11c, and two coating units 20 are detachably attached to the elevating plate 12c.

The mounting unit 19 has a function of holding the semiconductor chip 6a, which is a component to be mounted, by the component holding nozzle 71. The mounting unit 19 is mounted by moving the first head 11 horizontally in the Y direction and moving the lifting plate 11c up and down. The unit 19 mounts the semiconductor chip 6 a supplied from the component supply stage 3 on the substrate 7 held on the substrate holding stage 5. Here, as a mounting form by the first head 11 to which the mounting unit 19 is mounted, the semiconductor chip 6 a taken out from the component supply stage 3 by the pickup head 14 and placed on the relay stage 18 is held by the mounting unit 19. A pre-center mounting form to be mounted on the substrate 7, a direct mounting form in which the semiconductor chip 6a of the component supply stage 3 is directly held by the mounting unit 19 and mounted on the substrate 7, and a pick-up head 14 taken out from the component supply stage 3 and turned upside down The face-down mounting configuration in which the semiconductor chip 6a held in the pickup head 14 in the state is held by the mounting unit 19 and mounted on the substrate 7 can be selectively executed. That is, the first head 11 to which the mounting unit 19 is mounted has a function of receiving the semiconductor chip 6 a supplied from the component supply stage 3 and mounting it on the substrate 7 held on the substrate holding stage 5.

  The application unit 20 mounted on the second head 12 includes a syringe 20a that stores a paste that is a resin adhesive for bonding components, and an application nozzle 20b that discharges the paste. By moving the second head 12 above the substrate 7 held on the substrate holding stage 5 and performing the coating operation by the coating unit 20, the paste discharged from the coating nozzle 20b is applied to the component mounting point 7a of the substrate 7. Apply. In addition to the coating unit 20 shown in FIG. 2, the second head 12 includes two types of work units, a transfer unit 54 and a heating / pressing unit 57 described below, according to the mounting form of the target component type. Selectively installed.

  Next, with reference to FIG. 5, the working unit that is selectively mounted on the second head 12 will be described. FIGS. 5A and 5B show a state in which the transfer unit 54 and the heating / pressing unit 57 are mounted on the second head 12, respectively. The transfer unit 54 has a function of supplying the paste 56 to the substrate 7 by transfer. The transfer unit 54 is selectively used when the target component is small and the supply amount of the paste 56 required is small. 2 is mounted on the head 12.

  As shown in FIG. 5A, the transfer unit 54 includes a transfer tool 72 that is detachably attached to the attachment portion 54a, and is used together with a transfer table 55 that supplies paste 56 in the form of a transfer film. The transfer table 55 is a substantially disk-shaped container having a smooth coating film forming surface 55a, and a coating film of a component bonding paste 56 is formed on the coating film forming surface 55a with a predetermined film thickness. When supplying the paste 56 by transfer by the transfer unit 54, first, the transfer tool 72 is lowered with respect to the transfer table 55, and the paste 56 is attached to the lower end portion of the transfer tool 72. Next, the second head 12 is moved to move the transfer unit 54 above the substrate 7 held on the substrate holding table 5a, the transfer tool 72 is lowered, and the paste 56 is transferred onto the upper surface of the substrate 7 by the transfer tool 72. Supply (arrow i).

  The heating / pressing unit 57 has a function to pressurize the semiconductor chip 6a after being mounted on the substrate 7 by the mounting unit 19 with a predetermined pressing force while heating the DAF (die attach film). This is used when the attached semiconductor chip 6a is to be mounted. The heating / pressing unit 57 includes a heating / pressing tool 73 that is detachably mounted on the mounting portion 57a. By attaching the heating / pressing unit 57 to the second head 12, as shown in FIG. Thus, after the first head 11 mounts the semiconductor chip 6a on the substrate 7 by the mounting unit 19, the second head 12 is immediately moved to the substrate 7, and the heating / pressing tool 73 is brought into contact with the semiconductor chip 6a. Heating and pressing can be performed (arrow j). As a result, the mounting unit 19 can shift to a work operation for mounting the next semiconductor chip 6a immediately after mounting the semiconductor chip 6a on the substrate 7, and all operations including heating and pressing can be performed by the mounting unit 19. Compared with the case where the operation is performed, the working efficiency can be greatly improved.

That is, here, the second head 12 has a function of performing predetermined operations such as paste application, paste transfer, heating and pressing on the substrate 7 or the semiconductor chip 6a mounted on the substrate 7 by the first head 11. The first head 11 and the second head 12 alternately access the work position on the substrate 7. The linear motor composed of the head moving mechanism 9 provided on the Y-axis frame 8, that is, the stator 9 b, the first head 11, and the mover provided in the second head 12, includes the first head 11 and the first head 11. The two heads 12 are moved in the Y direction, which is the direction in which the component supply stage 3 and the substrate holding stage 5 are arranged, thereby providing a common head moving mechanism for alternately accessing the work position on the substrate 7.

  In the above configuration example, as a work unit that is replaceably mounted on the second head 12, a paste application function for supplying the component bonding paste 56 from the application nozzle 20b to the substrate 7 and supplying the paste 56 to the substrate 7 is a transfer tool. 72 is a single-function coating unit that individually has a paste transfer function that is transferred by 72 and supplied to the substrate 7, and a heating / pressing function that presses the semiconductor chip 6a mounted on the substrate 7 against the substrate 7 while heating. 20, an example using the transfer unit 54 and the heating / pressing unit 57 has been shown, but a multi-function work unit having two of these functions may be used.

  That is, in the present invention, the second head 12 can selectively mount a work unit having at least one of a paste application function, a paste transfer function, and a heating / pressing function. The component holding nozzle 71, the transfer tool 72, and the heating / pressing tool 73 that are detachably attached to the mounting unit 19, the transfer unit 54, and the heating / pressing unit 57 according to the component type are the unit assembly stage as described above. 4 is stored in a tool stocker 15 (refer to FIG. 4), and the first head 11 and the second head 12 are made to access the tool stocker 15, so that the mounting unit 19, the transfer unit 54, and the heating / pressing unit. The component holding nozzle 71, the transfer tool 72, and the heating / pressing tool 73 that are mounted on the device 57 can be exchanged for those corresponding to the target component type.

  Next, referring to FIG. 6, the operation reference position setting jigs (height jig 74, center position jig 75, and rotation position jig 76 housed in the tool stocker 15 together with the above-described work tool. ). These jigs are stored in a specific storage recess 15a specified in advance in the tool stocker 15, and are exchangeably mounted on the first head 11, the second head 12, and the pickup head 14, and the first head 11, In order to set operation reference positions in machine parameters of a plurality of drive shafts constituting a head moving mechanism for moving the second head 12 and the pickup head 14, respectively, the first head 11, the second head 12, the pickup head 14, etc. It is commonly used for the working head.

  These head moving mechanisms include three linear motion drive shafts in the X, Y, and Z directions and a rotation drive shaft in the θ direction that rotates the respective nozzle shafts around the axes. By performing numerical control individually, each work head performs a predetermined work operation. Such numerical control is performed via machine parameters output as control commands for the respective drive shafts. For this reason, in order for these work heads to correctly perform work operations, it is necessary to preset operation reference positions in the respective machine parameters.

For example, when these work heads are lowered with respect to the corresponding work stage and perform operations such as component mounting, the work tool comes into contact with the upper surface of the work stage or the upper surface of the substrate placed on the work stage. The height position of the work head in the state is a reference for the operation of the work head, and the machine parameter of the Z-direction drive shaft corresponding to the height position is a machine parameter indicating the operation reference position. For the drive axes in the X and Y directions, the horizontal position of the work head when the plane center of the work tool coincides with the coordinate origin in the local coordinate system of the target work stage is the reference for the operation of the work head. The machine parameters of the X-direction drive axis and Y-direction drive axis corresponding to this horizontal position are machine parameters indicating the operation reference position. Further, for the rotational drive shaft in the θ direction, the rotational position of the nozzle shaft in a state where the direction reference line set in the work tool coincides with the coordinate axis direction in the local coordinate system of the target work stage indicates the operation of the work head. The machine parameter of the θ-direction drive shaft corresponding to this rotational position is a machine parameter indicating the operation reference position.

  Such an operation reference position is set by causing the first head 11, the second head 12, and the pickup head 14 to perform a predetermined data acquisition operation. In this data acquisition operation, the height reference position is set. A tool 74, a center position jig 75, and a rotation position jig 76 are selectively mounted on these working heads. The height jig 74, the center position jig 75, and the rotation position jig 76 are all formed in the same common shape at the lower part of the main body parts 74a, 75a, and 76a having a common shape to be mounted on these work heads. The collar portions 74b, 75b, and 76b are provided, and the same jig can be mounted on any work head.

FIG. 6A shows the first head 11, the second head 12 and the pickup head 1.
4 shows a height jig 74 for setting the operation reference position of the Z-direction drive shaft for moving up and down 4. The height jig 74 has a measuring part 74c extended downward from the collar part 74b. It has a structure. On the lower surface of the measurement unit 74c, a contact surface 74d that is in contact with a reference surface to be set as a reference position is provided. In setting the operation reference position of the Z direction drive shaft, as shown in FIG. 7, the height jig 74 is attached to any one of the first head 11, the second head 12, and the pickup head 14. The work head is caused to perform a data acquisition operation for acquiring data necessary for setting the operation reference position. That is, the work head is lowered to bring the contact surface 74 d into contact with the upper surface of the substrate 7, the substrate holding table 5 a, the relay stage 18, and the semiconductor wafer 6, which are reference surfaces.

  The first head 11, the second head 12, and the pickup head 14 are each provided with a contact detection unit 65 that detects that the attached work tool has come into contact with a solid surface such as a work stage. The feedback pulse from the Z-direction drive shaft 66 at the same timing, that is, data indicating the axis position of the Z-direction drive shaft 66 is output to the teaching processing unit 63 via the control system that controls the Z-direction drive shaft 66. Then, the teaching processing unit 63 performs a predetermined calculation process based on the data indicating the axis position, whereby the operation reference position on the Z-direction drive axis is set. In the above configuration, the contact detection unit 65 and the Z-direction drive shaft 66 are timings when the height jig 74 mounted on the first head 11, the second head 12, and the pickup head 14 contacts the above-described reference surface. The height position detecting means for detecting the height position at.

  FIG. 6B shows a center position jig 75 for setting the operation reference position of the X-direction drive shaft and the Y-direction drive shaft for horizontally moving the first head 11, the second head 12 and the pickup head 14. ing. The center position jig 75 has a configuration in which a conical measurement portion 75c having a vertex as a measurement reference point 75d is extended downward from the flange portion 75b. FIG. 6C shows a rotation position jig for setting the operation reference position of the θ-direction drive shaft that rotates the nozzle shafts provided in the first head 11, the second head 12, and the pickup head 14 around the axis. 76, the rotation position jig 76 has a structure in which a measuring portion 76c is extended downward from the flange portion 76b. A measurement reference line 76d for measuring the rotational position is provided on the lower surface of the measurement unit 76c.

In setting the operation reference positions of the X-direction drive shaft, the Y-direction drive shaft, and the θ-direction drive shaft, as shown in FIG. 8, the center position jig 75 or the rotation position The jig 76 is selected and attached to any one of the first head 11, the second head 12, and the pickup head 14 as a target. Then, the work head is caused to perform a data acquisition operation for acquiring data necessary for setting the operation reference position. That is, the work head on which these jigs are mounted is moved and positioned above the component recognition camera 24. In this state, by imaging the center position jig 75 or the rotation position jig 76 by the component recognition camera 24, as shown in FIG. 8B, the states of the measurement unit 75c and the measurement reference point 75d are shown. An image (b) or an image (b) indicating the state of the measurement unit 76c and the measurement reference line 76d is acquired.

  Further, by performing recognition processing on the image (A) by the recognition processing unit 62, displacement amounts Δx and Δy in the optical coordinate system of the measurement reference point 75d indicating the center of the center position jig 75 are obtained. Further, the recognition processing unit 62 performs recognition processing on the image (b), thereby obtaining a positional deviation angle Δθ in the rotational direction with respect to the coordinate axis of the optical coordinate system of the measurement reference line 76d of the rotational position jig 76. Based on these Δx, Δy, Δθ, that is, data indicating the positions of the center position jig 75 and the rotation position jig 76 held in the first head 11, the second head 12, and the pickup head 14, When the teaching processing unit 63 performs a predetermined calculation process, an operation reference position in the X direction drive axis, the Y direction drive axis, and the θ direction drive axis is set. The operation reference position of each axis drive unit in the X, Y, Z, and θ directions is obtained as an offset value indicating variation from the original reference position, and is sequentially updated and stored.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 9, the control unit 60 controls the following mechanism units via the mechanism drive unit 61 based on the control program stored in the storage unit 64. Thereby, the semiconductor chip 6 a is taken out from the component supply stage 3, and each operation for mounting the taken out semiconductor chip 6 a on the substrate 7 held on the substrate holding stage 5 is executed. First, by controlling the component supply stage 3, the unit assembly stage 4, and the substrate holding stage 5, the component supply operation by the XY table mechanism 31 and the ejector mechanism 34 in the component supply stage 3 is controlled, and the X in the unit assembly stage 4 is controlled. The operation of the axis moving mechanism 40 is controlled, and further, the operation of the XY table mechanism 53 in the substrate holding stage 5 is controlled.

  Next, by controlling the head moving mechanism 9, the first head 11, the second head 12, and the pickup head moving mechanism 13, the pick-up operation for taking out the semiconductor chip 6 a from the component supply stage 3, and the picked-up semiconductor chip 6 a as a substrate The mounting operation of transferring and mounting to 7 is performed. That is, the pickup operation is executed by controlling the pickup head moving mechanism 13, and the semiconductor chip 6 a is transferred to the substrate 7 by controlling the first head 11 with the mounting unit 19 mounted together with the head moving mechanism 9. The mounting operation to be mounted is executed.

  Further, by controlling the second head 12 on which the three types of work units of the coating unit 20, the transfer unit 54, and the heating / pressing unit 57 are selectively mounted together with the head moving mechanism 9, the paste for component bonding can be obtained. A paste coating function that is discharged from the coating nozzle 20b and supplied to the substrate, a paste transfer function that transfers the paste by the transfer tool 72 and that is supplied to the substrate, and the semiconductor chip 6a mounted on the substrate 7 while heating the substrate 7 Either the heating or pressing function of pressing is executed. When executing the paste transfer function, the transfer table 55 is also controlled.

In the above-described various operation controls, the control unit 60 controls the recognition processing unit 62 so that the following recognition processing of imaging results by each camera is performed. The position of the semiconductor chip 6a on the semiconductor wafer 6 held on the component supply stage 3 is detected by recognizing the imaging result of the first camera 21, and the control unit 60 controls the XY table mechanism 31 based on the detection result. By controlling, the semiconductor chip 6a to be picked up can be correctly aligned with the pick-up work position [P1]. The semiconductor chip 6a placed on the relay stage 18 is processed by recognizing the imaging result obtained by the second camera 22.
And the control unit 60 controls the first head 11 and the X-axis moving mechanism 40 based on the detection result, so that the component holding nozzle 71 is correctly aligned with the semiconductor chip 6a to be picked up. be able to. Further, by imaging the work tool stored in the storage recess 15a of the tool stocker 15 by the second camera 22, the type of the work tool can be identified as described above.

  Further, by performing recognition processing on the imaging result by the third camera 23, the position of the component mounting point 7a of the board 7 in the state of being held on the board holding table 5a is detected, and based on this detection result, the control unit 60 performs the XY table. By controlling the mechanism 53, the component mounting point 7a is aligned with the mounting work position [P4], and the semiconductor chip 6a held by the component holding nozzle 71 can be correctly mounted on the component mounting point 7a. . The position of the semiconductor chip 6a in the state of being held by the component holding nozzle 71 is detected by recognizing the imaging result of the component recognition camera 24. In the mounting operation by the mounting unit 19, this detection result is taken into account. Position correction at the time of mounting is performed.

  The teaching processing unit 63 acquires data for setting the above-described motion reference position, and stores the motion reference position set based on the acquired data in the storage unit 64 as an offset value of the reference position parameter. I do. That is, the teaching processing unit 63 selectively attaches the height jig 74, the center position jig 75, and the rotation position jig 76 to the first head 11, the second head 12, and the pickup head 14. The axis position of each drive axis that is output from the control system that controls the drive axis of the head moving mechanism while performing the data acquisition operation to acquire the data necessary for setting the jig mounting operation and the operation reference position Get the data. Furthermore, data indicating the positions of the center position jig 75 and the rotation position jig 76 held by the first head 11, the second head 12 and the pickup head 14 are used as components for recognizing these jigs. It acquires based on the result recognized by the recognition camera 24 and the recognition process part 62. FIG. The component recognition camera 24 and the recognition processing unit 62 detect the positions in the horizontal plane of the center position jig 75 and the rotation position jig 76 held by the first head 11, the second head 12, and the pickup head 14. The horizontal position detecting means is configured.

  Further, the teaching processing unit 63 receives data indicating the positions of the center position jig 75 and the rotation position jig 76 in the state held by the first head 11, the second head 12 and the pickup head 14. Is obtained based on the results detected by the component recognition camera 24 and the recognition processing unit 62, which are horizontal position detecting means, and further, the height treatment in a state where it is held by the first head 11, the second head 12 and the pickup head 14. It is acquired based on the result detected by the height position detecting means for detecting the height position at the timing when the tool 74 comes into contact with the reference surface. The horizontal position detection means and the height position detection means constitute position detection means for detecting the position or height position of the jig in the horizontal plane in the state held by the first head 11, the second head 12, and the pickup head 14. To do.

  This teaching process will be described with reference to FIG. 10, FIG. 11, and FIG. The teaching process shown here is completely automatically performed using a common jig at a preset execution interval without manual intervention by an operator. FIG. 10 shows a center / rotation reference position setting process for setting the operation reference positions of the X direction drive axis, the Y direction drive axis, and the θ direction drive axis. First, the target head, that is, any one of the first head 11, the second head 12, and the pickup head 14 is moved to the jig dedicated position 15b of the tool stocker 15 (ST1). Next, the center position jig 75 or the rotation position jig 76 is mounted on the target head in accordance with the center position / rotation position classification to be set (ST2).

Next, as shown in FIG. 12A, the target head is moved above the component recognition camera 24 (ST3), and the mounted center position jig 75 or rotation position jig 76 is moved by the component recognition camera 24. An image is taken from below (ST4). The imaging result is recognized by the recognition processing unit 62 (ST5), and the recognition result is sent to the teaching processing unit 63. Based on the recognition result, the teaching processing unit 63 calculates an offset value indicating the fluctuation amount of the operation reference position of the X-direction drive axis, the Y-direction drive axis, and the θ-direction drive axis (ST6), and the calculated offset value is It is stored in the storage unit 64 (ST7). In FIG. 12A, only the first head 11 and the second head 12 are shown, but the same teaching process is performed for the pickup head 14.

  FIG. 11 shows a height reference position setting process for setting the operation reference position of the Z-direction drive shaft. First, the target head, that is, any one of the first head 11, the second head 12, and the pickup head 14 is moved to the jig dedicated position 15b of the tool stocker 15 (ST11), and the height jig 74 is attached to the target head. (ST12). Next, as shown in FIGS. 12B and 12C, the target head is moved to the reference setting target stage (ST13), and the target head is lowered with respect to the stage (ST14).

  FIG. 12B shows a state in which the first head 11 and the second head 12 are lowered with respect to the upper surface of the substrate 7 placed on the relay stage 18 and the substrate holding table 5a, respectively. ) Shows a state in which the pickup head 14 is lowered with respect to the semiconductor wafer 6 held on the relay stage 18 or the component supply stage 3. Next, the height measurement shown in FIG. 7 is performed by bringing the work tool mounted on the target head into contact with the stage for reference setting (ST15). Based on the measurement result, the teaching processing unit 63 calculates an offset value indicating the fluctuation amount of the operation reference position of the Z-direction drive shaft (ST16), and stores the calculated offset value in the storage unit 64 (ST17).

  As described above, the present invention is specified in advance in the tool stocker 15 that stores a plurality of work tools that are interchangeably mounted on the first head 11 and the second head 12 in accordance with the type of the target component. A height jig 74, a center position jig 75, and a rotation position jig that are commonly used to set operation reference positions in machine parameters of a plurality of drive shafts constituting the head moving mechanism. Data for acquiring data necessary for setting the jig mounting operation and the operation reference position for mounting these jigs on the first head 11 and the second head 12 by the teaching processing unit. The acquisition operation is automatically performed.

  As a result, it is possible to improve the work efficiency and the production efficiency by automating the setting operation of the reference position parameter. That is, even when the apparatus is in operation, the necessary teaching process can be performed without bothering the operator and continuing the production. Furthermore, since the teaching process is performed using a single jig uniquely assigned to the apparatus, it is guaranteed that a common jig is always used for a plurality of work heads belonging to the same apparatus, and the jig is managed. Traceability can be secured.

  The component mounting apparatus of the present invention has the effect of improving the work efficiency of the reference position parameter setting operation and ensuring traceability in jig management, and mounting components on a lead frame, resin substrate, etc. It can be used in the field to do.

1 is an overall perspective view of a component mounting apparatus according to an embodiment of the present invention. The fragmentary perspective view of the component mounting apparatus of one embodiment of this invention The front view of the component mounting apparatus of one embodiment of this invention The perspective view of the unit set stage of the component mounting apparatus of one embodiment of this invention Explanatory drawing of the work unit with which the 2nd head of the component mounting apparatus of one embodiment of this invention is mounted | worn Explanatory drawing of the jig | tool for the reference position parameter setting used in the component mounting apparatus of one embodiment of this invention Explanatory drawing of the setting process of the reference position parameter in the component mounting apparatus of one embodiment of this invention Explanatory drawing of the setting process of the reference position parameter in the component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention The flowchart of the setting process of the reference position parameter in the component mounting apparatus of one embodiment of this invention The flowchart of the setting process of the reference position parameter in the component mounting apparatus of one embodiment of this invention Operation explanatory diagram of the reference position parameter setting process in the component mounting apparatus of one embodiment of the present invention

1 Component mounting device 3 Component supply stage (component supply unit)
4 unit assembly stage 4a moving table 5 substrate holding stage (substrate holding unit)
5a substrate holding table 6 semiconductor wafer 6a semiconductor chip 7 substrate 9 head moving mechanism 11 first head 12 second head 13 pickup head moving mechanism 14 pickup head 15 tool stocker 18 relay stage 19 mounting unit 20 coating unit 20b coating nozzle 21 first Camera 22 Second camera 23 Third camera 24 Component recognition camera 31 XY table mechanism 40 X axis moving mechanism 53 XY table mechanism 54 Transfer unit 55 Transfer table 56 Paste 57 Heating / pressing unit 70 Pickup nozzle 71 Component holding nozzle 72 Transfer tool 73 Heating / Pressing Tool 74 Height Jig 75 Center Position Jig 76 Rotation Position Jig

Claims (2)

A component supply unit that supplies components, a substrate holding unit that holds a substrate, a first head that receives the components supplied by the component supply unit and mounts the components on the substrate held by the substrate holding unit;
The substrate or the component mounted on the substrate by the first head performs a predetermined operation, a paste application function for discharging the component bonding paste and supplying the paste to the substrate, and transferring the paste to the substrate A second head capable of selectively mounting a work unit having at least one of a paste transfer function to be supplied to the substrate and a heating / pressing function of pressing the component mounted on the substrate against the substrate When,
The first head and the second head are both located in an accessible area, and contain a plurality of work tools that are interchangeably attached to the first head and the second head according to the type of the target component. A tool stocker provided with a plurality of storage recesses for
The tool stocker is housed in a specific storage recess designated in advance, and is exchangeably mounted on the first head and the second head to constitute a head moving mechanism for moving the first head and the second head. A plurality of types of jigs commonly used for the first head and the second head in order to set operation reference positions in machine parameters of a plurality of drive axes;
A teaching processing unit that acquires data for setting the operation reference position and performs a teaching process that stores the operation reference position set based on the acquired data as a reference position parameter in a storage unit,
The teaching processing unit performs a jig mounting operation for mounting the jig on the first head and the second head and a data acquisition operation for acquiring data necessary for setting the operation reference position. And
Acquire data of the shaft position of each drive shaft output from a control system that controls the drive shaft of the head moving mechanism;
Further, the component mounting is characterized in that data indicating a position or height position of the jig in a horizontal plane in a state of being held by the first head and the second head is acquired based on a result of detection by a position detection unit. apparatus.   The jig is a height jig for setting the operation reference position of the Z-direction drive shaft for raising and lowering the first head and the second head, and the X direction for horizontally moving the first head and the second head. The center direction jig for setting the operation reference position of the drive shaft and the Y direction drive shaft, the operation of the θ direction drive shaft for rotating the nozzle shaft provided in the first head and the second head around the axis. The component mounting apparatus according to claim 1, comprising any one of rotational position jigs for setting a reference position.

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