JP2010135363A - Component mounting apparatus and tool arrangement data preparing method for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus that reduces burden on a worker when preparing tool arrangement data in a tool stocker while ensuring accuracy of the tool arrangement data, and a tool arrangement data preparing method for the component mounting apparatus. <P>SOLUTION: The component mounting apparatus is configured as follows. A camera 21 or a color sensor 25 is located above a tool stocker storing work tools such as a plurality of component holding nozzles 71. A shape mark M1 or a color mark M2 as a distinguishing mark formed on the upper face of each work tool is optically detected so as to distinguish the type of work tool. The tool arrangement data showing the arrangement of the work tools in the tool stocker are automatically prepared by a tool arrangement data preparing part on the basis of the distinguished result. By this, it reduces burden on a worker when preparing the tool arrangement data in the tool stocker while ensuring accuracy of the tool arrangement data. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus that takes out a component such as a semiconductor chip from a component supply unit and mounts it on a substrate, and a tool array data generation method that generates tool array data indicating the array state of work tools in a tool stocker in this component mounting apparatus It is about.

  A component such as a semiconductor chip is taken out from the component supply stage and mounted on a substrate such as a lead frame or a resin substrate. There are various variations in the mounting form of such components depending on differences in mounting posture of the component, a method of bonding the component to the substrate, and mounting accuracy required by the characteristics of the component. For this reason, a component mounting apparatus that performs a mounting operation for taking out a component from the component supply stage and mounting the component on the board is required to have different functions depending on the mounting form.

  For this reason, when targeting a plurality of types of components having different mounting forms, a component mounting apparatus having a work head having a function corresponding to each mounting form is used. The work tool according to the part type is mounted in a replaceable manner. Such work tools are stored in a tool stocker arranged at a position accessible to the work head in the apparatus corresponding to a plurality of component types (see Patent Document 1). Each time the component type is switched, the work head accesses the tool stocker, and when the work head performs a tool exchanging operation, a work tool corresponding to the component type is mounted on the work head.

In this tool exchange operation, the arrangement state of the work tools in the tool stocker needs to be specified. Therefore, in the component mounting apparatus equipped with the tool stocker, tool arrangement data indicating the arrangement of the work tools is created in advance. The This tool arrangement data is conventionally obtained by associating data indicating the type of work tool from the operation panel with the address of the storage recess when the operator performs the operation of storing the work tool in the storage recess provided in the tool stocker. It was created by performing what is called teaching.
JP-A-4-188742

  In recent years, in the field of electronic equipment manufacturing, it is required to improve the versatility of production equipment so that a wide range of component types can be used as work objects. The number of is also increasing. For this reason, adopting a teaching method that inputs the type of the work tool when the worker performs the work of storing the work tool as in the above example increases the load on the worker and increases the manpower at the time of input. The possibility that incorrect tool sequence data is created due to mistakes cannot be excluded. As described above, the conventional component mounting apparatus has a problem that it is difficult to reduce the load on the operator and to ensure the accuracy of the tool arrangement data when creating the tool arrangement data in the tool stocker. It was.

  Accordingly, the present invention provides a component mounting apparatus and a tool array data creation method in a component mounting apparatus that can reduce the load on the operator and ensure the accuracy of the tool array data when creating tool array data in the tool stocker. The purpose is to provide.

  The component mounting apparatus according to the present invention includes a component supply unit that supplies a component, a substrate holding unit that holds a substrate, and the component supplied by the component supply unit that is mounted on the substrate held by the substrate holding unit. A paste application function for performing a predetermined operation on the substrate or a component mounted on the substrate by the first head, discharging a component bonding paste and supplying the paste to the substrate, and the paste A work unit having at least one of a paste transfer function for transferring the material and supplying the substrate to the substrate and a heating / pressing function for pressing the component mounted on the substrate against the substrate. The mountable second head and the first head and the second head are both disposed in an accessible area, and the first head and the second head are arranged in accordance with the type of the target component. A tool stocker provided with a plurality of storage recesses for storing a plurality of work tools that are interchangeably mounted on the head and the second head, and is located on the storage recesses of the tool stocker; A tool identification unit that optically detects an identification mark formed on the upper surface of the stored work tool to identify the type of the work tool, and a work tool in the tool stocker based on the identification result by the tool identification unit And an array data creating unit for creating tool array data indicating the array of

  The tool arrangement data creation method in the component mounting apparatus according to the present invention includes a component supply unit that supplies a component, a substrate holding unit that holds a substrate, and the component that is supplied by the component supply unit. A predetermined operation is performed on the first head to be mounted on the held substrate, and the substrate or a component mounted on the substrate by the first head, and a paste for component bonding is discharged and supplied to the substrate. It has at least one of a paste application function, a paste transfer function that transfers the paste and supplies it to the substrate, and a heating / pressing function that presses against the substrate while heating components mounted on the substrate. A second head capable of selectively mounting a work unit, and the first head and the second head are both disposed in an accessible area; In a component mounting apparatus comprising: a tool stocker provided with a plurality of storage recesses for storing a plurality of work tools that are exchangeably mounted on the first head and the second head according to the type of components to be A tool array data creation method in a component mounting apparatus for creating tool array data indicating an array state of work tools in the tool stocker, the tool identifying means being positioned above the storage recess of the tool stocker, A tool identification step for optically detecting an identification mark formed on the upper surface of the work tool housed in the housing recess to identify the type of work tool, and the tool stocker based on the identification result in the tool identification step And an array data creating step for creating tool array data indicating the array of work tools.

  According to the present invention, the tool identification means is positioned above the tool stocker, the identification mark formed on the upper surface of the work tool is optically detected to identify the type of the work tool, and based on the identification result, Tool array data that indicates the array of work tools in the tool stocker is automatically created by the tool array data creation unit, so that tool array data can be created for tool stockers that contain multiple different types of work tools. Thus, the load on the operator can be reduced and the accuracy of the tool arrangement data can be ensured.

Next, embodiments of the present invention will be described with reference to the drawings. 1 is an overall perspective view of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a partial perspective view of a component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is a component according to an embodiment of the present invention. 4 is a front view of the mounting apparatus, FIG. 4 is a perspective view of a unit assembly stage of the component mounting apparatus according to the embodiment of the present invention, and FIG. 5 is a configuration of a tool stocker provided in the component mounting apparatus according to the embodiment of the present invention. FIG. 6 is a perspective view of a working tool used in the component mounting apparatus according to the embodiment of the present invention, and FIG. 7 is a working unit mounted on the second head of the component mounting apparatus according to the embodiment of the present invention. FIG. 8 is a block diagram showing the configuration of the control system of the component mounting apparatus according to the embodiment of the present invention, and FIGS. 9 and 10 show the tool identification operation in the component mounting apparatus according to the embodiment of the present invention. It is explanatory drawing.

  First, the overall configuration of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 has a function of mounting a component such as a semiconductor chip on a substrate by bonding. In FIG. 1, a component supply stage 3 (component supply unit), a unit assembly stage 4 and a substrate holding stage 5 (substrate holding unit) are aligned on the Y direction (first direction) on the base 2. It is arranged. The wafer holding table 3a provided in the component supply stage 3 holds a semiconductor wafer 6 on which a plurality of semiconductor chips 6a, which are components to be mounted, are arranged.

  The unit assembly stage 4 has a tool stocker 15, a component collection unit 16, and a calibration, which will be described later, on a moving table 4 a that reciprocates in the X direction (second direction) by a linear movement mechanism (see the X axis movement mechanism 40 shown in FIG. 4). A functional unit such as the reference mark 17, the relay stage 18, and the component recognition camera 24 is collectively arranged. The substrate holding stage 5 is configured to horizontally drive a substrate holding stage 5 a that holds the substrate 7 by an XY table mechanism 53 (see FIG. 3), and a semiconductor chip 6 a is mounted on the substrate 7.

  Above the component supply stage 3, the unit assembly stage 4, and the substrate holding stage 5, the Y-axis frame 8 is positioned at the end of the base 2 in the X direction, and both ends are supported by the support posts 8a in the Y direction. It is built in. On the front surface of the Y-axis frame 8 is incorporated a head moving mechanism 9 that guides and drives a first head 11 and a second head 12 described below in the Y direction by linear motor driving. A mounting unit 19 having a function of holding the semiconductor chip 6a and mounting it on the substrate 7 is mounted on the first head 11, and a function of applying an adhesive for bonding electronic components to the substrate 7 on the second head 12. A coating unit 20 having the above is mounted.

  Above the component supply stage 3, the relay stage 18, and the substrate holding stage 5, a first camera 21, a second camera 22, and a third camera 23 are disposed for position recognition. The first camera 21 images the semiconductor chip 6a to be taken out in the component supply stage 3. The second camera 22 picks up an image of the semiconductor chip 6a taken out from the component supply stage 3 and temporarily placed on the relay stage 18 for position correction, and is stored in the tool stocker 15 disposed on the unit assembly stage 4. It has a function to identify the type by imaging the tool. The third camera 23 captures an image of the board 7 held on the board holding stage 5 and recognizes the position of the component mounting point. The component recognition camera 24 disposed on the unit assembly stage 4 images the semiconductor chip 6a taken out from the component supply stage 3 from below.

  Next, the structure of each part will be described with reference to FIGS. The component supply stage 3 includes an XY table mechanism 31, and a plurality of support members 33 are erected on a horizontal moving plate 32 mounted on the upper surface of the XY table mechanism 31. The support member 33 supports the wafer holding table 3a on which the semiconductor wafer 6 is mounted and held on the upper surface. The semiconductor wafer 6 has a configuration in which a plurality of semiconductor chips 6a are bonded to a wafer sheet 6b in a predetermined arrangement. On the wafer sheet 6b, a plurality of semiconductor chips 6a in a state of being divided into pieces in a face-up posture with the active surface facing upward are adhered and held.

  In the component supply stage 3, a pick-up work position [P1] for picking up the semiconductor chip 6a from the semiconductor wafer 6 is set. The position of the first camera 21 corresponds to the pickup work position [P1], and the position of the semiconductor chip 6a to be picked up is detected by recognizing the imaging result obtained by imaging the semiconductor wafer 6 by the first camera 21. The An ejector mechanism 34 is disposed at a position corresponding to the pickup work position [P1] inside the wafer holding table 3a.

  The ejector mechanism 34 has a function of promoting the peeling of the semiconductor chip 6a from the wafer sheet 6b by pushing up the semiconductor chip 6a with a pin from the lower surface side of the wafer sheet 6b. When the semiconductor chip 6a is taken out, the ejector mechanism 34 is moved up and down and brought into contact with the lower surface of the wafer sheet 6b, whereby the semiconductor chip 6a can be easily taken out from the wafer sheet 6b by the pickup head 14 described later.

  In the component take-out operation, the XY table mechanism 31 is driven to move the wafer sheet 6b horizontally in the XY direction (arrow a), so that a plurality of semiconductor chips 6a attached to the wafer sheet 6b are picked up. The desired semiconductor chip 6a is positioned at the pick-up work position [P1]. Here, an example is shown in which a wafer table of a system for supplying wafer-state components attached to the wafer sheet 6b is used as the component supply stage 3, but a component tray that supplies a plurality of components in a predetermined planar arrangement. May be arranged on the component supply stage 3 so as to be exchangeable with the wafer table.

  Above the component supply stage 3, there is disposed a pickup head 14 having a configuration in which a pickup nozzle 70 that sucks and holds the semiconductor chip 6a is detachably attached to the nozzle attachment portion 14a. The pickup head 14 is held by a pickup arm 13a. The pickup arm 13a extends from the pickup head moving mechanism 13 suspended from the lower surface of the Y-axis frame 8 and extends above the component supply stage 3. It has been. By driving the pickup head moving mechanism 13, the pickup arm 13a moves in the XYZ directions (arrow b) and rotates around the X direction axis (arrow c).

  As a result, the pickup head 14 moves in the Y direction between the upper part of the component supply stage 3 and the upper part of the unit assembly stage 4 and advances and retreats in the X direction. As a result, the pickup head 14 picks up the semiconductor chip 6 a from the component supply stage 3 and transfers it to the relay stage 18 provided in the unit assembly stage 4. Further, when necessary, the pickup head 14 can be retracted in the X direction from above the pickup work position [P1], and the pickup head 14 is reversed by rotating the pickup arm 13a, thereby picking up the pickup nozzle 70. It is possible to reverse the orientation of the semiconductor chip 6a held on the front and back.

  As shown in FIG. 3, the unit assembly stage 4 and the substrate holding stage 5 are provided on the upper surface of the base plate 52, and the base plate 52 is supported from below by a plurality of support posts 51 erected on the upper surface of the base 2. Has been. Here, the detailed structure of the unit assembly stage 4 will be described with reference to FIG. In FIG. 4, the X-axis moving mechanism 40 has a function of moving the moving table 4 a in the X direction, and is configured by disposing a mechanism element described below on the base portion 41. A guide rail 42a is disposed on the upper surface of the base portion 41 in the X direction, and a slider 42b slidably fitted to the guide rail 42a is fixed to the lower surface of the moving table 4a.

  A feed screw 45 is pivotally supported on brackets 43a and 43b erected on both ends of the base portion 41, and the feed screw 45 is rotationally driven by a motor 44 held on the bracket 43b. The feed screw 45 is screwed to a nut member (not shown) coupled to the lower surface of the moving table 4a, and the moving table 4a reciprocates in the X direction by rotating the motor 44 in the forward and reverse directions ( Arrow g). As a result, the following functional units arranged on the moving table 4a can be integrally moved in the X direction, and these functional units are positioned in an area accessible by the first head 11 and the second head 12. It is possible.

A tool stocker 15, a component collection unit 16, a calibration reference mark 17, a relay stage 18, and a component recognition camera 24 are collectively arranged on the moving table 4a. Here, the structure and operation function of the tool stocker 15 will be described with reference to FIG. As shown in FIG. 5A, the tool stocker 15 has an upper surface of a storage block 27 in which a plurality of storage recesses 27a for storing work tools are provided in a predetermined arrangement (here, a grid arrangement in the X direction and the Y direction). The locking plate 28 is arranged to be slidable in the X direction.

  The storage concave portion 27a is a cylindrical hole-shaped concave portion having a stepped portion 27b, and a flange portion provided in the work tool on the stepped portion 27b (for example, a flange portion provided in the component holding nozzle 71 shown in FIG. 5B). These work tools are stored in a posture in which 71b) is placed. Each row in the lattice arrangement of the storage recess 27a is assigned a row number of Y1, Y2, and each column is assigned a column number of X1, X2, X3..., And these row number / column number combinations are: This corresponds to the position of each storage recess 27a in the tool stocker 15. In this embodiment, as will be described later, tool arrangement data in which the position of each storage recess 27a is associated with the type of work tool stored in the storage recess 27a is created and stored. I have to.

  The locking plate 28 is provided with a row of mounting openings 28a corresponding to the row positions of the storage recesses 27a. The mounting openings 28a have locking claws 28b on both sides for each pitch of the storage recesses 27a. It extends from the inside to the inside. As shown in (a) of FIG. 5 (b), the hook plate 71b is moved by moving the locking plate 28 in the X direction so that the locking claw 28b is positioned in the middle of the two adjacent storage recesses 27a. Can pass through the mounting opening 28a (arrow k).

  On the other hand, as shown in (b), by moving the locking plate 28 in the X direction so that the locking claw 28b coincides with the position of the storage recess 27a, the component stored in the storage recess 27a. The main body 71a of the holding nozzle 71 is protruded upward from between the two locking claws 28b, and the flange 71b is locked by the locking claw 28b from above. Thus, by raising the mounting unit 19 from the state in which the component holding nozzle 71 mounted on the mounting portion 19a is positioned in the storage recess 27a, only the component holding nozzle 71 can remain in the storage recess 27a. it can. By combining such operations, the component holding nozzle 71 mounted on the mounting unit 19 is lowered and stored in the storage recess 27a, and the component holding nozzle 71 stored in the storage recess 27a is taken out by the mounting unit 19. Accordingly, the component holding nozzle 71 mounted on the mounting unit 19 can be replaced according to the target component.

  As shown in FIG. 4, the tool stocker 15 stores a plurality of work tools, such as a component holding nozzle 71 mounted on the mounting unit 19, that are exchanged according to the component type for each component type. The individually stored work tools include a pickup nozzle 70 attached to the pickup head 14, a transfer unit 54 shown in FIG. 7, a transfer tool 72 attached to the heating / pressing unit 57, and a heating / pressing tool 73, respectively. It is. Then, in a state where the tool stocker 15 is moved to an area accessible by the first head 11 and the second head 12, the first unit 11 and the second head 12 are moved to the unit assembly stage 4. The component holding nozzle 71, the transfer tool 72, and the heating / pressing tool 73 attached to the transfer unit 54 and the heating / pressing unit 57 can be exchanged with ones corresponding to the target component type. That is, the X-axis moving mechanism 40 moves the tool stocker 15 in the X direction (second direction) orthogonal to the Y direction (first direction), and is accessible to both the first head 11 and the second head 12. It is a stocker moving means to be located in the position.

That is, in the component mounting apparatus 1 shown in the present embodiment, the mounting unit 19 of the first head 11 is placed at a position accessible by both the first head 11 and the second head 12 according to the type of the target component. The component holding nozzle 71 and the work unit selectively mounted on the second head 12 in accordance with the type of the target component, that is, the transfer unit 54 and the heating / pressing unit 57 are interchangeably mounted. The tool stocker 15 storing work tools such as the transfer tool 72 and the heating / pressing tool 73 is arranged. By adopting such a configuration, even when a large number of work tools for replacement are required for a plurality of component types, the occupied area of the mechanism part required for the tool replacement function is minimized, It is possible to reduce the size of the apparatus.

  Next, with reference to FIG. 6, the identification mark formed on the work tool stored in the tool stocker 15 will be described. On the upper surface of the work tool such as the component holding nozzle 71, an identification mark indicating the type of each work tool is formed. FIG. 6A shows an example in which a shape mark provided in a different geometric shape for each type of work tool is used as the identification mark. That is, a shape mark M1 having a specific shape (here, an annular shape) is formed on the upper surface (here, the upper surface of the flange 71b) of the work tool (here, the component holding nozzle 71). Here, as the specific shape, in addition to the circular shape, simple circular shapes, squares, triangles, and other shapes that can be easily distinguished from each other by image recognition are selected, and these shapes are the types of work tools used in the apparatus. It corresponds to. In this way, the shape mark M1 associated with the type of work tool is imaged by the second camera 22, and the imaging result is recognized by the recognition processing unit 62 (see also FIG. 8), whereby the shape mark M1 becomes a circle. It is recognized that the work tool has an annular shape, and thereby, it is identified that the work tool is the component holding nozzle 71 corresponding to the annular shape.

  That is, the second camera 22 that is a mark imaging camera that captures the shape mark M1 and the recognition processing unit 62 that identifies the type of work tool by recognizing the imaging result of the second camera 22, the storage recess of the tool stocker 15 The tool identifying means is provided on the upper surface 27a for optically detecting the identification mark formed on the upper surface of the work tool housed in the housing recess 27a to identify the type of work tool. When the work tool is identified, the X-axis moving mechanism 40 serving as a stocker moving unit is driven to move the storage recess 27a to be imaged among the plurality of storage recesses 27a of the tool stocker 15 to the first head 11 and All of the second heads 12 are positioned within the imaging field of view of the second camera 22 fixedly arranged above the accessible area.

  Next, FIG. 6B shows an example in which a color mark with a different color for each type of work tool is adopted as the identification mark. That is, the upper surface of the work tool (here, the component holding nozzle 71) (here, the upper surface of the flange 71b) is given a specific color (colors such as red, green, and blue that can be easily distinguished from each other by color recognition). A mark M2 is formed. These colors correspond to the types of work tools used in the apparatus. In this way, by setting the color mark M2 of the color associated with the type of work tool as the color discrimination target of the color sensor 25 (see FIG. 2), it is determined that the color mark M2 is one of the specific colors. The Based on the determination result, the identification processing unit 63 (see also FIG. 8) identifies that the work tool is the component holding nozzle 71 corresponding to the specific color.

  That is, the color sensor 25 for determining the color of the color mark M2 and the identification processing unit 63 for identifying the type of the work tool based on the determination result of the color sensor 25 are located on the storage recess 27a of the tool stocker 15, and It is a tool identification means for optically detecting the identification mark formed on the upper surface of the work tool stored in the storage recess 27a to identify the type of the work tool. As the tool identification means, a combination of the second camera 22 and the recognition processing unit 62 shown in FIG. 6A and a combination of the color sensor 25 and the identification processing unit 63 are selectively provided. You may make it provide both of these.

The component collection unit 16 has a function of discarding and collecting components that are determined to be unsuitable for mounting on the substrate 7 such as defective components or mixed different components after being taken out from the component supply stage 3. The calibration reference mark 17 is provided for imaging and calibrating a mechanical position error caused by thermal expansion and contraction when the X-axis moving mechanism 40 is continuously driven by the second camera 22 disposed above. The reference mark.

  The relay stage 18 is disposed between the component supply stage 3 and the substrate holding stage 5 and is provided integrally with the tool stocker 15. The relay stage 18 includes a pickup head from the component supply stage 3. The semiconductor chip 6a taken out by 14 is placed for position correction. A relay position [P2] is set on the relay stage 18, and the second camera 22 is arranged corresponding to the relay position [P2]. By moving the relay stage 18 by the X-axis moving mechanism 40, the semiconductor chip 6a placed on the relay stage 18 can be positioned at the relay position [P2] and imaged by the second camera 22, thereby relaying. The position of the semiconductor chip 6a placed on the stage 18 is detected. The component recognition camera 24 is disposed with the imaging surface 24a adjacent to the relay stage 18, and similarly, by driving the X-axis movement mechanism 40, the imaging surface 24a can be positioned at the component recognition position [P3]. . The semiconductor chip 6a temporarily placed on the relay stage 18 and taken out after position recognition is imaged by the component recognition camera 24 at the component recognition position [P3], and position detection is performed.

  Further, the unit assembly stage 4 is provided with a cleaning unit 46 for cleaning the surface of the relay stage 18. As shown in FIG. 4, the cleaning unit 46 is arranged so that the horizontal bar-shaped cleaning member 46a is positioned above the relay stage 18 in a state where the moving table 4a is moved to the front side of the apparatus (left side in FIG. 2). Has been. A brush 46b extending downward is provided on the lower surface of the cleaning member 46a so as to be in sliding contact with the upper surface of the relay stage 18. In this state, the X-axis moving mechanism 40 is driven to reciprocate the moving table 4a. Thus, the foreign matter adhering and accumulating on the surface of the relay stage 18 is removed by the brush 46b. A suction hole is provided inside the cleaning member 46a. By vacuum suctioning the inside of the cleaning member 46a through the suction pipe 46c (arrow h), fine foreign matter removed by the brush 46b is sucked. Can be discharged.

  The substrate holding stage 5 has a configuration in which a substrate holding table 5 a for holding the substrate 7 is provided on the XY table mechanism 53. A mounting work position [P4] for mounting the semiconductor chip 6a on the substrate 7 held on the substrate holding table 5a is set on the substrate holding stage 5, and the third camera 23 is set at the mounting work position [P4]. Correspondingly arranged. By imaging the board 7 with the third camera 23, the position of the component mounting point 7 a set on the board 7 is detected. Then, by driving the XY table mechanism 53, the board holding table 5a moves horizontally in the XY direction together with the board 7 (arrow f), and an arbitrary component mounting point 7a set on the board 7 is placed at the mounting work position [P4]. Can be positioned.

  Next, the first head 11 and the second head 12 will be described. 2, two guide rails 9a for guiding the first head 11 and the second head 12 in the Y direction are provided on the front surface of the head moving mechanism 9 provided on the Y-axis frame 8. Between these guide rails 9a, a stator 9b constituting a linear motor for driving the first head 11 and the second head 12 described below in the Y direction is disposed. A slider (not shown) is fitted to the guide rail 9a so as to be slidable in the Y direction, and the slider is fixed to the back of the vertical moving plates 11a and 12a.

On the back surface of the movable plates 11a and 12a, a mover (not shown) constituting a linear motor is disposed facing the stator 9b. By driving these linear motors, the first head 11 and the second head 12 are guided by the guide rail 9a and each move in the Y direction (arrow d). Elevating mechanisms 11b and 12b are disposed on the front surfaces of the movable plates 11a and 12a, respectively, and elevating plates 11c and 12c are slidably disposed in the vertical direction on the front surfaces of the elevating mechanisms 11b and 12b. Driving the elevating mechanisms 11b and 12b raises and lowers the elevating plates 11c and 12c (arrow e). A mounting unit 19 having a component holding nozzle 71 at the bottom is detachably mounted on the lifting plate 11c, and two coating units 20 are detachably mounted on the lifting plate 12c.

  The mounting unit 19 has a function of holding the semiconductor chip 6a, which is a component to be mounted, by the component holding nozzle 71. The mounting unit 19 is mounted by moving the first head 11 horizontally in the Y direction and moving the lifting plate 11c up and down. The unit 19 mounts the semiconductor chip 6 a supplied from the component supply stage 3 on the substrate 7 held on the substrate holding stage 5. Here, as a mounting form by the first head 11 to which the mounting unit 19 is mounted, the semiconductor chip 6 a taken out from the component supply stage 3 by the pickup head 14 and placed on the relay stage 18 is held by the mounting unit 19. A pre-center mounting form to be mounted on the substrate 7, a direct mounting form in which the semiconductor chip 6a of the component supply stage 3 is directly held by the mounting unit 19 and mounted on the substrate 7, and a pick-up head 14 taken out from the component supply stage 3 and turned upside down The face-down mounting configuration in which the semiconductor chip 6a held in the pickup head 14 in the state is held by the mounting unit 19 and mounted on the substrate 7 can be selectively executed. That is, the first head 11 to which the mounting unit 19 is mounted has a function of receiving the semiconductor chip 6 a supplied from the component supply stage 3 and mounting it on the substrate 7 held on the substrate holding stage 5.

  The application unit 20 mounted on the second head 12 includes a syringe 20a that stores a paste that is a resin adhesive for bonding components, and an application nozzle 20b that discharges the paste. By moving the second head 12 above the substrate 7 held on the substrate holding stage 5 and performing the coating operation by the coating unit 20, the paste discharged from the coating nozzle 20b is applied to the component mounting point 7a of the substrate 7. Apply. In addition to the coating unit 20 shown in FIG. 2, the second head 12 includes two types of work units, a transfer unit 54 and a heating / pressing unit 57 described below, according to the mounting form of the target component type. Selectively installed.

  A color sensor 25 for discriminating the color of the color mark M2 shown in FIG. 6B is mounted on the elevating plate 11c in a posture in which the detection surface is vertically downward. By driving the head moving mechanism 9 and the X-axis moving mechanism 40 which is a stocker moving means, the color sensor 25 can be positioned above the storage recess 27a to be identified among the plurality of storage recesses 27a.

  In the present embodiment, an example in which the color sensor 25 is provided in the first head 11 has been described. However, the color sensor 25 may be provided in the second head 12, and the first head 11 and the second head. The color sensors 25 may be provided on both of them. Furthermore, an independent tool identification head may be provided above the tool stocker 15. That is, the same color sensor is disposed at a position where no positional interference occurs with the movement of the first head 11 and the second head 12 in the Y direction, and the tool stocker 15 is moved in the X direction by the X axis moving mechanism 40. Then, the color of the color mark M2 formed on the work tool in each storage recess 27a of the tool stocker 15 is determined. In this case, the color sensor is moved in the Y direction corresponding to the row position of the storage recess 27a in the tool stocker 15. In the example shown in FIG. 5, since the storage recesses 27a are provided in two rows, a mechanism for switching the position in the Y direction is required so that the color sensor is positioned above each row.

  Next, with reference to FIG. 7, the work unit that is selectively mounted on the second head 12 will be described. FIGS. 7A and 7B show a state in which the transfer unit 54 and the heating / pressing unit 57 are mounted on the second head 12, respectively. The transfer unit 54 has a function of supplying the paste 56 to the substrate 7 by transfer. The transfer unit 54 is selectively used when the target component is small and the supply amount of the paste 56 required is small. 2 is mounted on the head 12.

  As shown in FIG. 7A, the transfer unit 54 includes a transfer tool 72 that is detachably attached to the attachment portion 54a, and is used together with a transfer table 55 that supplies paste 56 in the form of a transfer film. The transfer table 55 is a substantially disk-shaped container having a smooth coating film forming surface 55a, and a coating film of a component bonding paste 56 is formed on the coating film forming surface 55a with a predetermined film thickness. When supplying the paste 56 by transfer by the transfer unit 54, first, the transfer tool 72 is lowered with respect to the transfer table 55, and the paste 56 is attached to the lower end portion of the transfer tool 72. Next, the second head 12 is moved to move the transfer unit 54 above the substrate 7 held on the substrate holding table 5a, the transfer tool 72 is lowered, and the paste 56 is transferred onto the upper surface of the substrate 7 by the transfer tool 72. Supply (arrow i).

  The heating / pressing unit 57 has a function to pressurize the semiconductor chip 6a after being mounted on the substrate 7 by the mounting unit 19 with a predetermined pressing force while heating the DAF (die attach film). This is used when the attached semiconductor chip 6a is to be mounted. The heating / pressing unit 57 includes a heating / pressing tool 73 that is detachably mounted on the mounting portion 57a. By attaching the heating / pressing unit 57 to the second head 12, as shown in FIG. Thus, after the first head 11 mounts the semiconductor chip 6a on the substrate 7 by the mounting unit 19, the second head 12 is immediately moved to the substrate 7, and the heating / pressing tool 73 is brought into contact with the semiconductor chip 6a. Heating and pressing can be performed (arrow j). As a result, the mounting unit 19 can shift to a work operation for mounting the next semiconductor chip 6a immediately after mounting the semiconductor chip 6a on the substrate 7, and all operations including heating and pressing can be performed by the mounting unit 19. Compared with the case where the operation is performed, the working efficiency can be greatly improved.

  That is, here, the second head 12 has a function of performing predetermined operations such as paste application, paste transfer, heating and pressing on the substrate 7 or the semiconductor chip 6a mounted on the substrate 7 by the first head 11. The first head 11 and the second head 12 alternately access the work position on the substrate 7. The linear motor composed of the head moving mechanism 9 provided on the Y-axis frame 8, that is, the stator 9 b, the first head 11, and the mover provided in the second head 12, includes the first head 11 and the first head 11. The two heads 12 are moved in the Y direction, which is the direction in which the component supply stage 3 and the substrate holding stage 5 are arranged, thereby providing a common head moving mechanism for alternately accessing the work position on the substrate 7.

  In the above configuration example, as a work unit that is replaceably mounted on the second head 12, a paste application function for supplying the component bonding paste 56 from the application nozzle 20b to the substrate 7 and supplying the paste 56 to the substrate 7 is a transfer tool. 72 is a single-function coating unit that individually has a paste transfer function that is transferred by 72 and supplied to the substrate 7, and a heating / pressing function that presses the semiconductor chip 6a mounted on the substrate 7 against the substrate 7 while heating. 20, an example using the transfer unit 54 and the heating / pressing unit 57 has been shown, but a multi-function work unit having two of these functions may be used.

That is, in the present invention, the second head 12 can selectively mount a work unit having at least one of a paste application function, a paste transfer function, and a heating / pressing function. The component holding nozzle 71, the transfer tool 72, and the heating / pressing tool 73 that are detachably attached to the mounting unit 19, the transfer unit 54, and the heating / pressing unit 57 according to the component type are the unit assembly stage as described above. 4 is stored in a tool stocker 15 (see FIG. 4), and the first head 11 and the second head 12 are made to access the tool stocker 15, so that the mounting unit 19, the transfer unit 54, and the heating / pressing unit. The component holding nozzle 71, the transfer tool 72, and the heating / pressing tool 73 that are mounted on the device 57 can be exchanged for those corresponding to the target component type.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 8, the control unit 60 controls the following mechanism units via the mechanism control unit 61. Thereby, the semiconductor chip 6 a is taken out from the component supply stage 3, and each operation for mounting the taken out semiconductor chip 6 a on the substrate 7 held on the substrate holding stage 5 is executed. First, by controlling the component supply stage 3, the unit assembly stage 4, and the substrate holding stage 5, the component supply operation by the XY table mechanism 31 and the ejector mechanism 34 in the component supply stage 3 is controlled, and the X in the unit assembly stage 4 is controlled. The operation of the axis moving mechanism 40 is controlled, and further, the operation of the XY table mechanism 53 in the substrate holding stage 5 is controlled.

  Next, by controlling the head moving mechanism 9, the first head 11, the second head 12, and the pickup head moving mechanism 13, the pick-up operation for taking out the semiconductor chip 6 a from the component supply stage 3, and the picked-up semiconductor chip 6 a as a substrate The mounting operation of transferring and mounting to 7 is performed. That is, the pickup operation is executed by controlling the pickup head moving mechanism 13, and the semiconductor chip 6 a is transferred to the substrate 7 by controlling the first head 11 with the mounting unit 19 mounted together with the head moving mechanism 9. The mounting operation to be mounted is executed.

  Further, by controlling the second head 12 on which the three types of work units of the coating unit 20, the transfer unit 54, and the heating / pressing unit 57 are selectively mounted together with the head moving mechanism 9, the paste for component bonding can be obtained. A paste application function for supplying the substrate by discharging from the application nozzle 19a, a paste transfer function for transferring the paste by the transfer tool 72 and supplying the substrate to the substrate, and the semiconductor chip 6a mounted on the substrate 7 while heating the substrate 7 Either the heating or pressing function of pressing is executed. When executing the paste transfer function, the transfer table 55 is also controlled.

  In the above-described various operation controls, the control unit 60 controls the recognition processing unit 62 so that the following recognition processing of imaging results by each camera is performed. The position of the semiconductor chip 6a on the semiconductor wafer 6 held on the component supply stage 3 is detected by recognizing the imaging result of the first camera 21, and the control unit 60 controls the XY table mechanism 31 based on the detection result. By controlling, the semiconductor chip 6a to be picked up can be correctly aligned with the pick-up work position [P1]. In addition, the position of the semiconductor chip 6a in the state of being placed on the relay stage 18 is detected by performing recognition processing on the imaging result of the second camera 22, and based on this detection result, the control unit 60 performs the first head 11 and X. By controlling the shaft moving mechanism 40, the component holding nozzle 71 can be correctly aligned with the semiconductor chip 6a to be picked up. Further, by imaging the work tool stored in the storage recess 27a of the tool stocker 15 by the second camera 22, the type of the work tool can be identified as described above.

Further, by performing recognition processing on the imaging result by the third camera 23, the position of the component mounting point 7a of the board 7 in the state of being held on the board holding table 5a is detected, and based on this detection result, the control unit 60 performs the XY table. By controlling the mechanism 53, the component mounting point 7a is aligned with the mounting work position [P4], and the semiconductor chip 6a held by the component holding nozzle 71 can be correctly mounted on the component mounting point 7a. . The position of the semiconductor chip 6a in the state of being held by the component holding nozzle 71 is detected by recognizing the imaging result of the component recognition camera 24. In the mounting operation by the mounting unit 19, this detection result is taken into account. Position correction at the time of mounting is performed. The identification processing unit 63 identifies the type of work tool stored in the storage recess 27a of the tool stocker 15 based on the determination signal of the color mark M2 output from the color sensor 25.

  The array data creating unit 64 creates tool array data indicating the work tool array in the tool stocker 15 based on the work tool identification results by the recognition processing unit 62 and the identification processing unit 63 which are tool identifying means. This tool array data is obtained from the work tool type A for each storage recess 27a specified by the row numbers Y1, Y2, column numbers X1, X2, X3... Of the grid of the storage recesses 27a in the tool stocker 15. , B,... The created tool array data is stored in the array data storage unit 65 in the form of a data table. When the first head 11 and the second head 12 are accessed to the tool stocker 15 and the work tools attached to the mounting unit 19, the transfer unit 54, and the heating / pressing unit 57 are exchanged, the control unit 60 is arranged. The operation of the first head 11 and the second head 12 is controlled after confirming the location of the work tool in the tool stocker 15 by referring to the tool arrangement data stored in the data storage unit 65.

  Next, a tool arrangement data creation method for creating tool arrangement data indicating the arrangement state of work tools in the tool stocker 15 in the component mounting apparatus 1 having the above-described configuration will be described. Here, the tool array data is automatically created for the tool stocker 15 in a state where a plurality of types of work tools are randomly stored by the operator. In this tool array data creation method, first, tool identification means are sequentially positioned above the plurality of storage recesses 27a of the tool stocker 15, and identification marks formed on the upper surface of the work tool stored in each storage recess 27a are displayed. The type of each work tool is identified by optical detection (tool identification step). Next, based on the identification result in the tool identification step, tool arrangement data indicating the arrangement of work tools in the tool stocker 15 is automatically created by the arrangement data creation unit 64 (array data creation step).

  FIG. 9 shows a case where the identification mark is a shape mark M1 (see FIG. 6A) provided with a different geometric shape for each type of work tool. Various working tools such as a pickup nozzle 70, a component holding nozzle 71, a transfer tool 72, and a heating / pressing tool 73 are stored in a random arrangement in a plurality of storage recesses 27a provided in the tool stocker 15. In the tool identification process for the tool stocker 15 in such a state, the recognition processing unit 62 recognizes the imaging result obtained by imaging the shape mark M1 by the second camera 22 that is a mark imaging camera, so that the work tool Identify the type. Here, by driving the X-axis moving mechanism 40 which is a stocker moving means, the moving table 4a is moved in the X direction (arrow l), and the storage recess 27a to be imaged among the plurality of storage recesses 27a is moved. The second camera 22 is positioned within the imaging field of view. Then, the tool identification process for each storage recess 27a is sequentially executed, and when the tool identification process is completed for all the storage recesses 27a, the tool array data is created based on these identification results.

FIG. 10 shows a case where the identification mark is a color mark M2 (see FIG. 6B) with a different color for each type of work tool. Similarly, various work tools such as a pickup nozzle 70, a component holding nozzle 71, a transfer tool 72, and a heating / pressing tool 73 are stored in a random arrangement in the plurality of storage recesses 27a provided in the tool stocker 15. ing. In the tool identification process for the tool stocker 15 in such a state, the type of the work tool is identified by the identification processing unit 63 based on the determination result obtained by determining the color of the color mark M2 by the color sensor 25. Here, by driving the X-axis moving mechanism 40 which is a stocker moving means, the moving table 4a is moved in the X direction (arrow l), and each storage recess 27a to be imaged among the plurality of storage recesses 27a. The color sensor 25 provided in the first head 11 is sequentially positioned above the head. Then, the tool identification process for each storage recess 27a is sequentially executed, and when the tool identification process is completed for all the storage recesses 27a, the tool array data is created based on these identification results.

  As described above, according to the present invention, the tool identification means is positioned above the tool stocker 15, and the identification mark formed on the upper surface of the work tool is optically detected to identify the type of the work tool. The tool array data creating unit 64 automatically creates tool array data indicating the work tool array in the tool stocker 15. As a result, there is no need for manual teaching as in the prior art, and even when a tool stocker containing a plurality of different types of work tools is targeted, it is possible for the operator to create tool array data. It is possible to reduce the load and ensure the accuracy of the tool arrangement data.

  The component mounting apparatus and the tool arrangement data creation method in the component mounting apparatus of the present invention can reduce the load on the operator and ensure the accuracy of the tool arrangement data when creating the tool arrangement data in the tool stocker. It can be used in the field of mounting components on a lead frame, a resin substrate, or the like.

1 is an overall perspective view of a component mounting apparatus according to an embodiment of the present invention. The fragmentary perspective view of the component mounting apparatus of one embodiment of this invention The front view of the component mounting apparatus of one embodiment of this invention The perspective view of the unit set stage of the component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the tool stocker provided in the component mounting apparatus of one embodiment of this invention The perspective view of the work tool used for the component mounting apparatus of one embodiment of this invention Explanatory drawing of the work unit with which the 2nd head of the component mounting apparatus of one embodiment of this invention is mounted | worn The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention Explanatory drawing of the tool identification operation | movement in the component mounting apparatus of one embodiment of this invention Explanatory drawing of the tool identification operation | movement in the component mounting apparatus of one embodiment of this invention

Explanation of symbols

1 Component mounting device 3 Component supply stage (component supply unit)
4 unit assembly stage 4a moving table 5 substrate holding stage (substrate holding unit)
5a Substrate holding table 6 Semiconductor wafer 6a Semiconductor chip 7 Substrate 9 Head moving mechanism 11 First head 12 Second head 13 Pickup head moving mechanism 14 Pickup head 15 Tool stocker 18 Relay stage 19 Mounting unit 20 Coating unit 20b Coating nozzle 21 First Camera 22 Second camera 23 Third camera 24 Component recognition camera 25 Color sensor 27a Storage recess 31 XY table mechanism 40 X-axis moving mechanism 53 XY table mechanism 54 Transfer unit 55 Transfer table 56 Paste 57 Heating / pressing unit 70 Pickup nozzle 71 Parts Holding nozzle 72 Transfer tool 73 Heating / pressing tool [P1] Pickup work position [P2] Relay position [P3] Component recognition position [P4] Mounting work position

Claims (10)

A component supply unit that supplies components, a substrate holding unit that holds a substrate, a first head that receives the components supplied by the component supply unit and mounts the components on the substrate held by the substrate holding unit;
A predetermined operation is performed on the substrate or a component mounted on the substrate by the first head, a paste application function for discharging a component bonding paste and supplying the paste to the substrate, and transferring the paste to the substrate. A second head capable of selectively mounting a work unit having at least one of a paste transfer function supplied to the substrate and a heating / pressing function of pressing the component mounted on the substrate against the substrate When,
Both the first head and the second head are arranged in an accessible area, and accommodate a plurality of work tools that are interchangeably mounted on the first head and the second head according to the type of the target component. A tool stocker provided with a plurality of storage recesses for,
A tool identifying means for optically detecting an identification mark formed on the upper surface of the work tool housed in the housing recess and positioned on the housing recess of the tool stocker to identify the type of work tool;
A component mounting apparatus comprising: an array data creating unit that creates tool array data indicating an array of work tools in the tool stocker based on a result of identification by the tool identifying means.   The identification mark is a shape mark provided in a different geometric shape for each type of work tool, and the tool identification means recognizes a mark imaging camera that images the shape mark and an imaging result of the mark imaging camera. The component mounting apparatus according to claim 1, further comprising: a recognition processing unit that identifies a type of the work tool. Stocker moving means for moving the tool stocker and positioning the tool stocker in an area accessible by both the first head and the second head;
By driving the stocker moving means, the storage concave portion to be imaged among the plurality of storage concave portions is positioned within the imaging field of view of the mark imaging camera fixedly arranged above the area. The component mounting apparatus according to claim 2.   The identification mark is a color mark with a different color for each type of work tool, and the tool identification means includes a color sensor for determining the color of the color mark and the determination result of the color sensor based on the determination result of the color sensor. The component mounting apparatus according to claim 1, further comprising an identification processing unit that identifies a type. A common head moving mechanism for moving the first head and the second head in a first direction which is an arrangement direction of the component supply unit and the substrate holding unit to access a work position on the substrate; and the tool stocker Stocker moving means for moving in a second direction orthogonal to the first direction and positioning the first head and the second head in an accessible area,
By driving the head moving mechanism and the stocker moving means, the color sensor provided in the first head and / or the second head is disposed above the storage concave portion to be determined among the plurality of storage concave portions. The component mounting apparatus according to claim 4, wherein the component mounting apparatus is positioned. A component supply unit that supplies components, a substrate holding unit that holds a substrate, a first head that receives the components supplied by the component supply unit and mounts the components on the substrate held by the substrate holding unit, and the substrate Alternatively, a predetermined operation is performed on a component mounted on the substrate by the first head, a paste application function for discharging a component bonding paste to supply the component to the substrate, and transferring the paste to supply to the substrate. A second head capable of selectively mounting a work unit having at least any one of a paste transfer function and a heating / pressing function of pressing the component mounted on the substrate against the substrate; Both the first head and the second head are arranged in an accessible area, and are exchanged with the first head and the second head according to the type of the target component. In a component mounting apparatus including a tool stocker provided with a plurality of storage recesses for storing a plurality of work tools to be freely mounted, tool array data indicating an array state of the work tools in the tool stocker is created A tool array data creation method in a component mounting apparatus,
A tool identifying means is positioned above the storage recess of the tool stocker, and the type of work tool is identified by optically detecting an identification mark formed on the upper surface of the work tool stored in the storage recess. A tool identification process;
A tool array data creation method in a component mounting apparatus, comprising: an array data creation step of creating tool array data indicating an array of work tools in the tool stocker based on an identification result in the tool identification step.   The identification mark is a shape mark provided in a different geometric shape for each type of work tool. In the tool identification step, the work is performed by recognizing an imaging result obtained by imaging the shape mark with a mark imaging camera. 7. The method for creating tool arrangement data in a component mounting apparatus according to claim 6, wherein the type of tool is identified. The component mounting apparatus includes stocker moving means for moving the tool stocker and positioning the tool stocker in an area where both the first head and the second head are accessible,
By driving the stocker moving means, the storage concave portion to be imaged among the plurality of storage concave portions is positioned within the imaging field of view of the mark imaging camera fixedly arranged above the area. A method for creating tool arrangement data in a component mounting apparatus according to claim 7.   The identification mark is a color mark with a different color for each type of work tool. In the tool identification step, the type of the work tool is identified based on a determination result obtained by determining the color of the color mark with a color sensor. The tool array data creation method in the component mounting apparatus according to claim 6. The component mounting apparatus includes a common head moving mechanism that moves the first head and the second head in a first direction connecting the component supply unit and the substrate holding unit to access a working position on the substrate, Stocker moving means for moving the tool stocker in a second direction orthogonal to the first direction and positioning the tool stocker in an area accessible by both the first head and the second head;
By driving the head moving mechanism and the stocker moving means, the color sensor provided in the first head and / or the second head is disposed above the storage concave portion to be determined among the plurality of storage concave portions. The tool arrangement data creation method in the component mounting apparatus according to claim 9, wherein the tool arrangement data is positioned.

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