JP5374945B2 - Gas discharge panel manufacturing method and manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve a method and device for manufacturing a gas discharge panel, with usage of high-scarcity-value Xe gas restrained. <P>SOLUTION: The method for manufacturing the gas discharge panel includes a step of exhausting air between opposed substrates, and a step of introducing discharge gas between the opposed substrates, and further, a step of collecting discharge gas in a pipe used in the air exhausting process. The device for manufacturing the gas discharge panel, used for a step of exhausting air between the opposed substrates or for a step of introducing discharge gas between the opposed substrates, separates a system for exhausting air of the gas discharge panel and a system for introducing the discharge gas, and is provided with an outlet capable of connecting with the system for exhausting air. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a manufacturing method and a manufacturing apparatus including a step of exhausting gas from a gas discharge panel.

  In recent years, gas discharge panels typified by plasma display panels (hereinafter referred to as PDPs) have attracted attention as thin display devices with excellent visibility. For example, PDPs have high definition, large screens, and manufacturing. In terms of simplicity and the like, it is also spreading in the home.

  This PDP has a structure in which a front substrate having a plurality of display electrodes composed of scan electrodes and sustain electrodes and a rear substrate having a plurality of data electrodes orthogonal to the display electrodes are sandwiched by a partition formed on the rear substrate. By facing each other, a discharge cell is formed at the intersection of the display electrode and the data electrode, and a phosphor layer is provided in the discharge cell.

  In addition, a discharge gas is sealed in the discharge cell, and a discharge is generated by a periodic voltage applied between the display electrode and the data electrode. Light is emitted and image display is performed.

  In the manufacture of this PDP, there are a sealing step in which the front substrate and the rear substrate on which the respective parts are formed are arranged to face each other and the periphery is sealed, and an exhaust step in which the gas in the PDP is exhausted. In the sealing step, after forming a sealing member made of, for example, low-melting glass around the front substrate or the back substrate, the front substrate and the back substrate are arranged to face each other, and after positioning, the periphery is made of a metal clip or the like By heating while being held by the holding member, the sealing member is softened and fluidized and sealed to form a panel which is a vacuum container. In addition, in order to supply and exhaust gas in the panel in the subsequent exhaust process, an air supply / exhaust hole is formed in the panel, and a glass exhaust pipe is also sealed in the air supply / exhaust hole in this sealing process. Bonded with a member.

  In the exhaust process, first, a gas supply / exhaust head is connected to a glass exhaust pipe attached to the supply / exhaust hole. The gas supply / exhaust head unit connects the gas supply / exhaust unit for supplying and exhausting the gas in the panel to the exhaust pipe described above. Then, the gas in the panel is exhausted by the gas supply / exhaust section while heating the entire panel, and then the discharge gas is introduced into the panel to a predetermined pressure, and the exhaust pipe is melted and sealed.

In addition, since this sealing / exhaust process is continuously performed, the gas supply / exhaust head part and the supply / exhaust hole are connected from the start of the sealing process via an exhaust pipe or the like (see Patent Document 1).
JP 2004-356038 A

  In the sealing / exhaust process, the position of the gas supply / exhaust head (hereinafter referred to as the exhaust head) is fixed as a part of the device, while the panel is installed on a support base fixed as a part of the device. Has been. The procedure at the start of the sealing process is as follows. First, an exhaust pipe is connected to the exhaust head. When the exhaust pipe is connected, the inside of the exhaust pipe is cleaned with a discharge gas introduced later into the panel. And the position of an exhaust pipe and the position of the air supply / exhaust hole currently formed in the panel are match | combined, and it installs. At this time, a seal member is provided around the exhaust pipe and the air supply / exhaust hole, the seal member is melted by the heat history of the sealing process, and the exhaust pipe and the air supply / exhaust hole are hermetically connected.

  Thereafter, the process proceeds to an exhaust process, and the gas in the panel is exhausted while being heated. After the exhaust, introduction of a discharge gas (for example, a pressure of about 530 hPa to 800 hPa in the case of Ne-Xe) is performed through the exhaust pipe. Thereafter, the exhaust pipe is locally heated at an appropriate portion, melted and sealed to close and cut the exhaust pipe (hereinafter referred to as chip-off).

Thus, the discharge gas is introduced into the discharge space. After tip-off, removed excess portion of the exhaust pipe from the exhaust head, in order to supply the exhaust pipe of the next connection, removed the exhaust pipe from the pressure recovery to atmospheric pressure by introducing once discharge gas and supplies .

  However, this configuration has a problem that a large amount of luminescent gas intended to be introduced into the panel is released into the atmosphere. Xe gas used for the luminescent gas is very rare and has a limited production volume in the world and is expensive.

  Therefore, when the exhaust device is provided with a gas supply system for supplying an inert gas different from the discharge gas supplied to the gas discharge panel, and when a new exhaust pipe is supplied by removing the excess exhaust pipe after chip-off, Although the use efficiency of the discharge gas can be increased by supplying the inert gas, the discharge gas remaining in the introduction path still has to be exhausted.

In order to solve the above problems, a method for manufacturing a gas discharge panel according to the present invention includes a step of exhausting between opposing substrates and a step of introducing a discharge gas between the opposing substrates. And having a step of recovering the gas of the piping system used in the step of exhausting or introducing the discharge gas, and further storing the recovered gas, purifying the recovered gas, or recovering It has the process of reusing gas for manufacture of another gas discharge panel . Here, in the process of recovering the gas, it is desirable to connect the piping system used in the process of recovering the gas to the piping system used in the exhausting process. Further, in the process of introducing the discharge gas, the piping system used only for the process of exhausting is separated from the piping system used for the process of introducing the discharge gas, and the process of recovering the gas is used only for the exhausting process. It is desirable to connect the piping system and the piping system used in the step of introducing the discharge gas, and connect the piping system used in the step of recovering the gas to the piping used in the exhausting step.

The gas discharge panel manufacturing apparatus of the present invention is a gas discharge panel manufacturing apparatus used in a process of exhausting between opposing substrates or a process of introducing a discharge gas between opposing substrates, the exhausting process. The piping system used only for the process and the piping system used for the process of introducing the discharge gas can be separated, and the piping system used for the exhaust process is provided with a discharge port that enables connection of the piping system that recovers the gas. The piping system to be recovered is configured to be connected to a piping system for storing, purifying, or reusing the recovered gas .

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of a gas discharge panel which suppressed the usage-amount of Xe gas with a high rare value is realizable.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, taking as an example a PDP which is a kind of gas discharge panel.

  FIG. 1 is a cross-sectional perspective view showing a schematic structure of a PDP according to an embodiment of the present invention.

  The PDP 1 has a structure in which a pair of front substrate 2 and rear substrate 3 face each other with a partition wall 4 interposed therebetween. The front substrate 2 includes a display electrode 8 formed of a plurality of pairs of scanning electrodes 6 and sustain electrodes 7 formed on the front glass substrate 5, a dielectric layer 9 formed so as to cover the display electrode 8, and a dielectric thereof. For example, the protective layer 10 made of, for example, MgO is formed so as to cover the body layer 9. The scan electrode 6 and the sustain electrode 7 have a structure in which the bus electrodes 6b and 7b are stacked on the transparent electrodes 6a and 7a.

  The back substrate 3 includes a plurality of data electrodes 12 formed on the main surface of the back glass substrate 11, a dielectric layer 13 formed so as to cover the data electrodes 12, and the data electrodes 12 on the dielectric layer 13. In this structure, the barrier ribs 4 are formed at positions corresponding to each other, and the phosphor layers 14R, 14G, and 14B are formed between the adjacent barrier ribs 4. Then, the front substrate 2 and the rear substrate 3 are arranged to face each other to form a discharge space 15 and display an image. An arrow in the figure indicates the image display direction 16.

  Next, the manufacturing method of PDP1 by embodiment of this invention is demonstrated.

  FIG. 2 is a flowchart of the manufacturing process schematically showing the manufacturing method of the PDP 1. In FIG. 2, it is divided roughly into the formation process S10 of the front substrate 2, the formation process S20 of the back substrate 3, and these assembly processes S30. The front substrate 2 forming step S10 includes a scanning electrode / sustain electrode forming step S11, a dielectric layer forming step S12, and a protective film forming step S13. On the other hand, the back substrate forming step S20 includes a data electrode forming step S21, a base dielectric layer forming step S22, a partition wall forming step S23, and a phosphor layer forming step S24. The assembly process S30 includes a panel forming process S31 for performing a sealing / exhaust / gas introduction process, an aging process S32, and a PDP panel completion process S33, and the PDP 1 is completed through these processes.

  Hereinafter, this panel formation process S31 is demonstrated in detail. In this process, the front substrate 2 and the rear substrate 3 are arranged to face each other and the periphery of each substrate is sealed with a sealing material, the exhaust process for exhausting the gas in the PDP 1, and the discharge gas is introduced into the PDP 1. A gas introducing step for sealing is performed.

  First, a process performed as a previous stage of the sealing process will be described with reference to FIG. FIG. 3 is a plan view in which the front substrate 2 and the rear substrate 3 of the PDP 1 are arranged to face each other. As described above, the sealing member 17 is formed so as to surround the image display region 18 in the peripheral portion of either the front substrate 2 or the rear substrate 3, and both the substrates are disposed to face each other. The aligned substrates are temporarily fixed by a gripping member 20 such as a clip so as not to be displaced. The sealing member 17 is made of frit glass or the like, and is applied to the aforementioned position by a screen printing method or an injection method. Then, after heating to such an extent that the resin component can be removed, the front substrate 2 and the rear substrate 3 are arranged to face each other.

  In order to exhaust the gas in the PDP 1, a supply / exhaust hole 19 is formed in the PDP 1 in advance. The air supply / exhaust hole 19 is generally formed in a corner portion of the PDP 1. This is because the air supply / exhaust hole 19 cannot be formed in the image display region 18 where the partition wall 4 is formed, and it is necessary to avoid a flexible circuit board attached to the lead portion of each electrode. Therefore, it is inevitably formed at the corner.

  On the other hand, since the PDP 1 is used as an image display device such as a television, it is required to make this frame portion, that is, an area other than the image display area 18 of the PDP 1 as small as possible. As a result, the air supply / exhaust hole 19 is located close to the sealing member 17.

  FIG. 4 is an enlarged cross-sectional view of the dotted line portion of FIG. 3, that is, the peripheral portion of the air supply / exhaust hole 19 of the PDP 1. This shows a state in which the PDP 1 is installed in the apparatus used in the panel forming step S31. Thus, the exhaust pipe 21 is attached to the air supply / exhaust hole 19 via the tablet 22 which is a sealing material. As a material of the tablet 22, for example, low melting point frit glass or the like can be used.

  Then, the center of the air supply / exhaust hole 19 and the center of the hole of the tablet 22 are aligned. At this time, it is positioned and attached so that the center of the opening at one end of the exhaust pipe 21 and the center of the air supply / exhaust hole 19 substantially coincide with each other, and another fixing jig (see FIG. Press and hold with (not shown). An exhaust head 23 is connected to the other end of the exhaust pipe 21. The exhaust head 23 serves to connect a gas supply / exhaust portion for supplying and exhausting gas in the panel and the supply / exhaust hole 19 via an exhaust pipe 21 and the like.

  Next, the manufacturing apparatus and flow used in the panel forming step S31 will be described. FIG. 5 is a schematic configuration diagram showing a PDP manufacturing apparatus used in the panel forming step S31 in the prior art. FIG. 6 is a flowchart of sealing, exhaust, and gas introduction. Thereby, each process of sealing, exhaust, and gas introduction can be performed consistently.

  The PDP manufacturing apparatus 31 has a configuration in which a vacuum exhaust system 34 and a gas introduction system 35 that are gas supply and exhaust units are connected to a furnace body 33 having a heating mechanism 32. Further, in FIG. 5, a portion surrounded by a dotted line is the vacuum exhaust device system 34, and a portion surrounded by a broken line corresponds to the gas introduction device system 35.

  The vacuum exhaust system 34 includes a valve 36a such as a pump, a manifold 37a, a vacuum exhaust system 38, and a main valve 39. The gas introduction system 35 includes a gas introduction apparatus 40a such as a gas cylinder, a valve 36b, a manifold 37a, and a main valve 39. It is composed of The manifold 37a and the main valve 39 are shared by both the vacuum exhaust device system 34 and the gas introduction device system 35. In FIG. 5, the description of the peripheral portions of the air supply / exhaust hole 19 and the exhaust pipe 21 is omitted.

  Next, it demonstrates along the flowchart of FIG. First, the PDP 1 temporarily fixed by the gripping member 20 is placed in the furnace body 33 of the PDP manufacturing apparatus 31, heated to a temperature at which the sealing member 17 is melted by the heating mechanism 32, and then cooled and solidified. By doing so, the front substrate 2 and the rear substrate 3 are hermetically sealed, and the exhaust pipe 21 and the rear substrate 3 are hermetically sealed (S34).

  The furnace body 33 is again heated to a predetermined temperature by the heating mechanism 32, and the gas in the PDP 1 is evacuated through the exhaust head 23 by the vacuum exhaust system 34 (S35). At this time, the valve 36a of the vacuum exhaust system 34 is open, and the valve 36b of the gas introduction system 35 is closed.

  Then, after evacuation, the temperature is lowered to near room temperature (S36), the valve 36a is closed, the valve 36b of the gas introduction device system 35 is opened, and a discharge gas of a predetermined pressure (for example, Ne-Xe mixed gas) , A pressure of about 530 hPa to 800 hPa) is introduced (S37).

  Finally, a predetermined portion of the exhaust pipe 21 is locally heated and melted, and the blocked portion is cut (S38). In this way, the exhaust pipe 21 is sealed and hermetically sealed (chip off). Then, PDP1 is taken out after chip-off (S39).

  Here, chip-off will be described with reference to FIG. FIG. 7 is a diagram showing an outline of chip-off. As shown in FIG. 7A, the flame 63 caused by the gas ejected from the gas ejection hole 61 of the gas burner 60 heats the side surface of the exhaust pipe 21. When the temperature of the exhaust pipe 21 reaches the softening point temperature (about 630 ° C.) by this heating, the exhaust pipe 21 starts to melt gradually.

  At this time, since the inside of the exhaust pipe 21 has the same atmospheric pressure (about 530 hPa to 800 hPa) as the discharge space and is depressurized from the external atmospheric pressure (about 1013 hPa), as shown in FIG. Are gradually sucked into the exhaust pipe 21.

  When the heating by the gas burner 60 is further continued, the melted wall portions of the exhaust pipe 21 are fused and closed. Then, as shown in FIG.7 (c), the closed part of the exhaust pipe 21 is cut | disconnected. In this way, the exhaust pipe 21 is sealed and hermetically sealed (chip off). Here, the portion remaining on the side opposite to the PDP 1 becomes the exhaust pipe surplus portion 21a.

  Then, returning to the flowchart of FIG. 6, after the PDP 1 is taken out, preparations for manufacturing the next PDP 1 are started. First, gas is further introduced to atmospheric pressure (about 101.3 kPa) (S40), and the exhaust pipe surplus portion 21a is removed (S41). Here, the gas is introduced to the atmospheric pressure in order to avoid mixing an impurity gas in the atmosphere into the vacuum exhaust device system 34 and the gas introduction device system 35 when removing the exhaust pipe surplus portion 21a. .

  Next, the exhaust pipe 21, the tablet 22, and the PDP 1 are set (S42), and gas is flowed for the purpose of cleaning the exhaust pipe 21 (S43). Thus, a series of cycles is completed, and the sealing step S43 is performed again.

  Cleaning of the exhaust system and the like performed before and after the removal of the exhaust pipe surplus portion 21a is very important. If this is not performed, the inside of the vacuum exhaust system 34 and the gas introduction system 35 may be contaminated with impure gas in the atmosphere, and sufficient exhaust capability may not be exhibited. As a result, impurities remain in the PDP 1 or impurities are mixed into the PDP 1 when gas is introduced, and problems such as a decrease in brightness and color unevenness occur when the PDP 1 displays an image. .

  However, in the conventional technique shown in FIG. 5, the gas introduction is formed in one system, and the discharge gas is the only gas used for gas introduction and exhaust pipe cleaning before the exhaust pipe surplus portion 21a is removed.

  As the discharge gas, for example, a mixed gas of Ne-Xe is used, but as described above, the Xe gas contained therein is a rare value with only 0.087 ppm contained in the atmosphere, and the production volume is worldwide. There is a limit, and it is difficult to obtain due to increasing demand. On the other hand, it is possible to reduce the pipe diameter and reduce the amount remaining in the pipe. In this case, however, the exhaust capacity of the PDP 1 is reduced, and if the pipe length is shortened, high pressure objects must be placed in the furnace. Therefore, it is difficult to reduce the piping volume. For this reason, it is important to suppress the amount of Xe gas used.

  FIG. 8 is a schematic configuration diagram of a manufacturing apparatus for PDP 1 in the embodiment of the present invention. In the figure, parts having the same configuration as in the prior art are shown using the same symbols.

  As shown in the figure, the PDP 1 manufacturing apparatus according to the embodiment of the present invention includes a connection part 41 connected to a vacuum exhaust gas introduction apparatus that evacuates the PDP 1 and introduces a discharge gas, and a downstream of the connection part 41. An exhaust device 42, a tank 44, a pressure increasing part 45 for pressurizing the discharge gas recovered in the tank 44, and a recovery part 48 having a recovery container 47 for storing the pressurized discharge gas are provided. The gas introduction device system 35 is configured by adding one system to a discharge port 43 provided with a valve 36d and a gas introduction device 40b.

  First, in step S39, after the PDP 1 is taken out, the connecting portion 41 is connected to the exhaust port 43 of the vacuum exhaust gas introducing device. Then, after opening the valve 36d and confirming that there is no leakage from the connection part 41 using the exhaust device 42 of the recovery part 48, the discharge gas remaining in the pipe is temporarily recovered in the tank 44, and the valve 36d Close. Thereafter, the connection of the connecting portion 41 is released, the pressure is increased by the pressure increasing portion 45, and stored in the collection container 47.

  In addition, when introducing the gas before removing the exhaust pipe surplus portion 21a in S40 and when cleaning the exhaust pipe in S43, the gas is introduced from the gas introduction device 40b by opening the valve 36c.

  In FIG. 8, a furnace body 33 having a heating mechanism 32 is formed in a tunnel shape, and the PDP 1, the vacuum exhaust device system 34, and the gas introduction device system 35 move together. On the other hand, the collection unit 48 is fixed, and when the PDP 1 arrives in front of the collection unit 48 after the chip is turned off in S38, the connection unit 41 is connected to the discharge port 43 of the vacuum exhaust gas introduction device. Become.

  As described above, in the embodiment of the present invention, the discharge gas remaining in the pipe as the introduction path is stored in the recovery container 47 of the recovery unit 48 and purified again to improve the purity. To do.

  In addition, in the case where the inside of the evacuation device system 34 and the gas introduction device system 35 is filled with excess discharge gas, another gas introduction device 40b and a valve 36c are added to use Xe gas contained in the discharge gas. The amount can be reduced. Next, this operation will be described.

  In the prior art, as described above, before the exhaust pipe surplus portion 21a is removed in step S40 of FIG. 6, the valve 36b is opened to fill the discharge gas from the gas introduction device 40a to atmospheric pressure. On the other hand, in the embodiment of the present invention, the procedure is changed as follows.

  First, after connecting the connection part 41, it is evacuated by the exhaust device 42 of the recovery part 48, and it is confirmed by a nearby pressure gauge (not shown) that the pressure of the connection part 41 drops to 50 kPa or less in 20 seconds. The value of 50 kPa or less in 20 seconds is the relationship between the attached exhaust capacity and the allowable leak amount, and it is sufficient that it is less than the impurity mixing amount regulation at the time of repurification described later.

  Next, the valve 36d is opened, and the discharge gas remaining in the pipe is exhausted to the tank 44 provided at the rear. When exhaust is completed, the valve 36d is closed and the connection of the connection part 41 is released. The pressure increasing section 45 increases the pressure of the discharge gas stored in the tank 44 and packs it into the recovery container 47. The inside of the piping is kept in a vacuum, and if the exhaust pipe surplus portion is removed as it is, contamination in the atmosphere will be mixed in the piping, so the valve 36c is opened and a large amount of inert gas is supplied from the gas introduction device 40b. Fill to atmospheric pressure.

Further, in the pipe cleaning in S43, in the prior art, the valves 36b and 39 are opened and the discharge gas is allowed to flow from the gas introduction device 40a for a certain period of time (about 30 seconds here). However, in the embodiment of the present invention, the valve 36c and 39 are opened, and an inert gas is flowed from the gas introducing device 40b. This can further reduce the amount of discharge gas used.

  The amount of discharge gas to be used, which is an effect of the present invention, is about 4L and pipe cleaning amount that are discharged to the atmosphere other than the discharge gas introduced into the discharge panel, assuming that the recovered discharge gas can be 100% repurified. About 0.5L, about 4.5L in total can be realized. However, this depends on the pipe volume.

As the inert gas which is an alternative gas, various gases such as N ₂ , He, Ne, Ar, Kr, Xe, Rn can be used. In PDP1, a mixed gas of Ne—Xe is used as a discharge gas in most cases, and in order to reduce the amount of rarely used Xe, Xe should be avoided and another material should be selected.

  In the embodiment of the present invention, Ne is used as the inert gas. At the same time, Ne is inexpensive, and even if it is mixed in the PDP 1, Ne is a component of the constituent material of the discharge gas, so that the influence on the light emission characteristics can be eliminated.

  Further, in the manufacturing apparatus according to the embodiment of the present invention, the following measures are taken to prevent the inert gas from flowing into the PDP 1 due to a malfunction of the valve 36c and the like.

First, a vacuum pressure gauge 46 is provided in a part of the manifold 37a so that the degree of vacuum in the pipe satisfies a certain standard. Specifically, in a state where only the valve 36a is opened and the valves 36b and 36c and the main valve 39 are closed, the inside of the pipe is evacuated by the vacuum evacuation device 38, and the pressure of the vacuum pressure gauge 46 is 1.0 × 10 ⁻⁵ Pa. Make sure that: Thereby, even if the valve 36c leaks and the inert gas flows into the PDP 1, the image display quality of the PDP 1 can be maintained as long as the degree of vacuum is not more than the above degree.

  Second, the pressure of the gas introduction device 40b is set lower than the pressure of the gas introduction device 40a. As a result, when the discharge gas is introduced into the PDP 1, the discharge gas of the gas introduction device 40a is preferentially introduced into the panel even if the valve 36c leaks.

Third, the manifold 37b dedicated to the gas introduction system and the manifold 37a dedicated to the exhaust system are separated, and the manifold 37a and the connection part 41 for gas recovery can be connected. Thereby, when the discharge gas is introduced into the PDP 1, even if the valve 36d leaks , the discharge port 43 for connection with the connection part 41 of the recovery part 48 is provided at a position separated from the gas introduction system. Therefore, it is possible to impurities other than the discharge gas is prevented from entering the discharge gas inside the panel.

  In the PDP 1 manufactured according to the embodiment of the present invention, an appropriate discharge gas is introduced as specified, and there are no problems such as uneven light emission and reduced brightness, and the amount of discharge gas used is also large. It was confirmed that the effect of the present invention was exhibited with a significant reduction.

  As described above, the apparatus and method for manufacturing a gas discharge panel such as the PDP of the present invention is characterized in that the discharge gas remaining in the pipe without being able to fill the gas discharge panel is recovered.

  By having this manufacturing apparatus and manufacturing method, an appropriate discharge gas is introduced as specified, problems such as uneven light emission and reduced brightness do not occur, and the amount of discharge gas used can be greatly reduced.

  As described above, the present invention is industrially useful as an invention that can provide a manufacturing apparatus and a manufacturing method that improve the use efficiency of discharge gas in manufacturing a gas discharge panel.

Sectional perspective view showing a part of a plasma display panel according to an embodiment of the present invention Flow chart of the manufacturing process schematically showing the manufacturing method of the panel The top view which shows the attachment state of the holding member at the time of sealing and exhausting the panel Sectional drawing which shows the state which attached the exhaust pipe to the air supply / exhaust hole of the panel Schematic showing the configuration of the plasma display panel manufacturing equipment Flow chart of sealing and exhausting process of plasma display panel Cross-sectional view showing the chip-off state of the sealing and exhausting process of the plasma display panel Schematic which shows the structure of the manufacturing apparatus of the plasma display panel by embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plasma display panel 19 Supply / exhaust hole 21 Exhaust pipe 21a Exhaust pipe surplus part 22 Tablet 23 Exhaust head 31 PDP manufacturing apparatus 32 Heating mechanism 33 Furnace body 34 Vacuum exhaust apparatus system 35 Gas introduction apparatus system 36a, 36b, 36c, 36d, 36e Valve 37a, 37b Manifold 38 Vacuum exhaust device 39 Main valve 40a, 40b Gas introduction device 41 Connection portion 42 Exhaust device 43 Discharge port 44 Tank 45 Pressure increase portion 46 Vacuum pressure gauge 47 Recovery container 48 Recovery portion

Claims (4)

A method for manufacturing a gas discharge panel, comprising the steps of exhausting between opposing substrates and introducing a discharge gas between the opposing substrates,
A step of recovering a gas of a piping system used in the step of exhausting or the step of introducing the discharge gas;
A method for manufacturing a gas discharge panel, comprising a step of storing the recovered gas, a step of purifying the recovered gas, or a step of using the recovered gas for manufacturing another gas discharge panel . 2. The gas discharge panel manufacturing method according to claim 1, wherein in the step of recovering the gas, a piping system used in the step of recovering the gas is connected to a piping system used in the exhausting step. Method. In the step of introducing the discharge gas, a piping system used only for the exhausting step and a piping system used for the step of introducing the discharging gas are separated,
In the step of recovering the gas, a piping system used only for the exhausting step and a piping system used for the step of introducing the discharge gas are connected,
2. The method of manufacturing a gas discharge panel according to claim 1, wherein a piping system used in the step of recovering the gas is connected to piping used in the exhausting step. An apparatus for manufacturing a gas discharge panel used for a step of exhausting between opposing substrates or a step of introducing a discharge gas between the opposing substrates,
The gas path between the piping system used only for the exhausting process and the piping system used for the process of introducing the discharge gas can be divided,
In the piping system used for the exhausting process, a discharge port that enables connection of a piping system for collecting gas is provided,
The apparatus for manufacturing a gas discharge panel, wherein the recovered piping system is configured to store the recovered gas, purify the recovered gas, or connect to a piping system for using the recovered gas.

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