JP5368277B2 - Light emitting module and light source device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent unevenness of luminance of a plurality of LED chips arranged in a line on a support substrate. <P>SOLUTION: In a light emitting module, a plurality of LED chips 12 are arranged in a line on a support substrate 11, and a first wiring pattern 14 and a second wiring pattern 15 having a first feeding terminal 14c and a second feeding terminal 15c, respectively, are provided, wherein each of the first and second feeding terminals is provided at a center in the longitudinal direction of the support substrate 11. A current is supplied from the first feeding terminal 14c in the first wiring pattern 14 to each LED chip 12, and flows to the second feeding terminal 15c in the second wiring pattern 15. While each current route for each LED chip 12 has equal wiring resistance per unit length, the current route becomes longer as a distance between the center in the arrangement direction of the LED chips 12 and each LED chip 12 becomes longer, so that the entire wiring resistance becomes larger. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a light emitting module and a light source device using the light emitting module.

  In recent years, LED modules (light-emitting modules) in which semiconductor light-emitting elements such as LED (Light Emitting Diode) chips are mounted on a mounting substrate are used as light source devices that are mounted on various lighting fixtures. It has come to be used as alternative lighting for fluorescent lamps. Further, in a liquid crystal display device such as a liquid crystal television, an LED module is also used as a linear light source of a light source device (backlight unit) that irradiates light on the back of a liquid crystal panel.

  In the backlight unit, as disclosed in Patent Document 1, light is applied to the side surface of the light guide plate from a linear light source using a plurality of LED (Light Emitting Diode) chips, and the light passes through the side surface of the light guide plate. An edge light system is known in which light entering the inside is emitted from the surface of a light guide plate and irradiated onto a liquid crystal panel while being reflected and propagated on the front and back surfaces facing each other.

In the light source device disclosed in Patent Document 1, a linear light source in which a plurality of high-brightness LEDs are arranged in a line along the side surface of the light guide plate is used. The high-brightness LEDs are divided into two groups so that different voltages are applied, and are connected in series for each group.
When a large liquid crystal panel such as a liquid crystal television is used, the linear light source of the backlight unit is also large, and thus it is necessary to use a large number of LED chips. In such a case, a plurality of LED modules are used as a linear light source as disclosed in Patent Document 2 in order to simplify the manufacturing process. Each LED module is configured by linearly arranging a predetermined number of LED chips on a support substrate at a constant pitch.

FIG. 10 is a plan view showing a schematic configuration of the LED module 60 used as a linear light source of the backlight unit. The LED module 60 includes a support substrate 61 and a plurality of LED chips 62 arranged on the support substrate 61 in a line at a constant pitch along the longitudinal direction of the support substrate.
On the support substrate 61, a first wiring pattern 64 and a second wiring pattern 65 for energizing each LED chip 62 are provided on both sides of the support substrate 61 across the central portion in the width direction. The first wiring pattern 64 includes a first wiring bus 64a formed in a linear shape along the longitudinal direction of the support substrate 11, and a plurality of first bondings branched from the first wiring bus 64a toward the LED chips 62, respectively. Part 64b.

Similarly, the second wiring pattern 65 also includes a second wiring bus 65a formed in a straight line along the longitudinal direction of the support substrate 11, and a plurality of branches branched from the second wiring bus 65a toward the LED chips 62, respectively. And a second bonding portion 65b.
Each LED chip 62 is electrically connected to the respective leading end portions of the first bonding portion 64b and the respective leading end portions of the second bonding portion 65b by the first bonding wire 18a and the second bonding wire 18b. .

  The first wiring bus 64a and the second wiring bus 65a are provided with a first power feeding terminal 66 and a second power feeding terminal 67 to which a current for energizing each LED chip 62 is supplied. The first power supply terminal 66 and the second power supply terminal 67 are normally disposed at each end on both sides of the support substrate 11 in the longitudinal direction.

JP 2006-127798 A JP 2009-152209 A

  In the LED module 60 having such a configuration, the length of the current path formed by the first wiring pattern 64 and the second wiring pattern 65 for each LED chip 62 is the first power supply terminal in the first wiring bus 64a. The length is from one end connected to 64c to the other connected to the second power supply terminal 67 in the two wiring patterns 65 through each LED chip 62. Therefore, the length of each current path formed with respect to each LED chip 62 is equal.

  Further, it is known that each LED chip 62 generates light and emits light when it is in a light emitting state, so that the light emitting efficiency decreases and the luminance decreases when the temperature rises. For this reason, the LED module 60 configured as shown in FIG. 10 is usually configured such that the support substrate 61 is attached to a heat sink and the heat generated in each LED chip 62 is dissipated by the heat sink.

  In this case, each LED chip 62 on the support substrate 61 is as short as 1 mm or less between the adjacent LED chips 62, and when the adjacent LED chips 62 become high temperature, the heat is efficiently dissipated under the influence. There is a problem that can not be. The LED chips 62 arranged at both ends of the support substrate 61 are radiated relatively efficiently because the LED chips are arranged only on one side, but are arranged at the center in the longitudinal direction of the support substrate 61. The formed LED chip 62 is greatly affected by the heat generated by the surrounding LED chips 62 and is not efficiently dissipated.

Therefore, the LED chip 62 disposed at the center portion in the longitudinal direction of the support substrate 61 has a higher temperature and lower brightness than the LED chips disposed at each end portion of the support substrate 61 in the longitudinal direction.
FIG. 11A is a graph showing heat distribution and luminance distribution along the longitudinal direction of all LED chips 62 arranged along the longitudinal direction of the support substrate 61. The LED chip 62 disposed at each end in the longitudinal direction of the support substrate 61 is efficiently radiated to suppress a temperature rise and to have high luminance. On the other hand, the LED chip 62 disposed in the center portion in the longitudinal direction of the support substrate 61 has low heat dissipation efficiency and low brightness due to high temperature.

  In addition, since the first wiring pattern 64 and the second wiring pattern 65 are usually patterned with a constant width and a constant thickness by a conductive material (for example, copper, tungsten, etc.), the first wiring pattern 64 and In the second wiring pattern 65, the wiring resistance per unit length is constant throughout. Therefore, as described above, if the length of each current path for each LED chip 62 is equal, the overall wiring resistance of each current path for each LED chip 62 is shown in FIG. As a result, the luminance of each LED chip 62 does not change depending on the wiring resistance and becomes constant.

  From the above, the luminance of all the LED chips 62 in the LED module 60 is the sum of the luminance in the distribution state shown in each of FIGS. 11 (a) and 11 (b). As a result, as shown in FIG. 11C, each LED chip 62 has a low brightness at the center in the longitudinal direction of the support substrate 61 due to the influence of the heat dissipation efficiency, and the brightness increases as it approaches the ends on both sides. become. Therefore, the light emitted from the LED module 60 causes luminance unevenness along the longitudinal direction of the support substrate 61.

When uneven brightness occurs in the light emitted from the LED module 60, when the LED module 60 is used as a backlight unit, the LED module 60 enters the light guide plate and irradiates the liquid crystal panel from the surface of the light guide plate. As a result, luminance unevenness occurs in the emitted light, and the quality of an image displayed on the liquid crystal panel may be deteriorated.
Note that the LED module 60 is not limited to being used as a backlight unit, but also when used as alternative lighting such as a direct type or a straight tube type fluorescent lamp, the luminance unevenness occurs, so that the performance as an illumination light source is improved. Will be reduced.

  The present invention has been made in view of such a problem, and an object of the present invention is to emit light that can prevent uneven brightness from occurring in light emitted from a plurality of semiconductor light emitting elements arranged in a row. It is to provide a module and a light source device.

  In order to achieve the above object, a light emitting module according to the present invention is a light emitting module in which a plurality of semiconductor light emitting elements are arranged in a row on a substrate, and a wiring pattern including a pair of power supply terminals is formed on the substrate. The wiring pattern includes a plurality of current paths through which current flows from one power supply terminal to the other power supply terminal for one or a plurality of adjacent semiconductor light emitting elements. The wiring resistance has the lowest wiring resistance in the current path leading to the semiconductor light emitting element located at the center in the arrangement direction, and the wiring resistance is set to be larger for the current path leading to the semiconductor light emitting element with a larger distance from the center. It is characterized by.

  Moreover, the light source device according to the present invention includes the light emitting module.

  In the light emitting module of the present invention, the semiconductor light emitting element in which the wiring resistance of the current path for energizing each semiconductor light emitting element is the lowest in the semiconductor light emitting element located at the center in the arrangement direction, and the distance from the center is increased. Since the wiring resistance is set to be larger in the current path extending to, the semiconductor light emitting element arranged at the center in the arrangement direction has higher luminance. Thereby, as the semiconductor light emitting element located at the center in the arrangement direction has a lower heat dissipation efficiency and lower luminance, luminance unevenness generated along the arrangement direction of all the semiconductor light emitting elements can be suppressed.

The disassembled perspective view which shows schematic structure of the light source device (backlight unit) in which the LED module which concerns on embodiment of this invention was used. The perspective view which shows the structure of the principal part in the light source device. The perspective view which decomposes | disassembles and shows the principal part shown in FIG. The top view of the LED module used for the light source device. Sectional drawing in the AA of FIG. (A) is a graph showing the luminance distribution along the longitudinal direction based on the wiring resistance of the LED module, (b) is a graph showing the luminance distribution along the longitudinal direction based on the heat dissipation efficiency of the LED module, (c) ) Is a graph showing the luminance distribution along the longitudinal direction in consideration of the wiring resistance and heat dissipation efficiency of the LED module. The top view of the LED module in the modification of this embodiment. The top view of the LED module in another embodiment of this invention. The top view of the LED module in another embodiment of this invention. The top view of the conventional LED module. (A) is a graph showing the luminance distribution along the longitudinal direction based on the wiring resistance of the LED module, (b) is a graph showing the luminance distribution along the longitudinal direction based on the heat dissipation efficiency of the LED module, (c) ) Is a graph showing the luminance distribution along the longitudinal direction in consideration of the wiring resistance and heat dissipation efficiency of the LED module.

Hereinafter, embodiments of the present invention will be described.
<First Embodiment>
FIG. 1 is an exploded perspective view showing a schematic configuration of a light source device using a light emitting module (LED module) according to an embodiment of the present invention. In FIG. 1, the X-axis direction is the thickness direction of the light source device (the X-axis (+) direction is the light extraction direction of the light source device), the Y-axis direction is the left-right direction (longitudinal direction) of the light source device, and the Z-axis direction is the light source device. The vertical direction (width direction).

As shown in FIG. 1, the light source device according to the present embodiment is an edge light (side light) type backlight unit, and is a linear shape that irradiates light to a light guide plate 30 and one side surface 31 of the light guide plate 30. It has the some LED module (light emitting module) 10 which functions as a light source, and the housing | casing 41 which accommodates these light-guide plates 30 and LED module 10 inside.
Each LED module 10 has a plurality of LED chips (semiconductor light emitting elements) 12 (see FIG. 3) arranged in a line, and the light guide plate 30 emits light emitted from the LED module 10 in the light extraction direction. The light is emitted in a certain X-axis (+) direction.

The casing 41 is formed of a metal such as a galvanized steel plate, for example, in a box shape that is thin in the X-axis direction and opened in the X-axis (+) direction that is the light extraction direction.
A reflection sheet 46 is laminated on the back surface (back surface) opposite to the light extraction direction in the light guide plate 30 accommodated in the housing 41. On the surface (front surface) of the light guide plate 30 on the light extraction direction side, a diffusion sheet 42, a prism sheet 43, and a polarizing sheet 44 are laminated in that order. On the polarizing sheet 44, a frame body 45 formed in a rectangular frame shape by four frame members 42a, 42b, 42c, and 42d is disposed, and the light guide plate 30 is fixed in the housing 41 by the frame body 45. ing.

The plurality of LED modules 10 arranged along one side surface 31 of the light guide plate 30 are attached to a heat sink 21 provided inside the housing 41, and all the LED modules 10 are connected to an FPC (flexible printed wiring board). ) 22.
The light guide plate 30 is made of, for example, PC (polycarbonate) resin, and has a dimension (thickness) in the X-axis direction of about 4 mm, a dimension in the Y-axis direction (longitudinal dimension) of about 1040 mm, and a dimension in the Z-axis direction (short). The dimension in the direction) is approximately 600 mm. One side surface 31 of the light guide plate 30 is irradiated with light from the LED module 10, and the light enters the light guide plate 30. A dot pattern (not shown) is formed on the surface (front surface) of the light guide plate 30 so that the reflectance of the surface sequentially changes according to the distance from the LED module 10.

The reflection sheet 46 provided on the back surface of the light guide plate 30 is a substantially rectangular sheet made of, for example, PET (polyethylene terephthalate), and reflects light on the back surface of the light guide plate 30. The reflection sheet 46 may be a metallic foil having metallic luster, an Ag sheet, or the like.
The diffusion sheet 42 is formed in a substantially rectangular shape using, for example, PET or PC resin, and is in close contact with the front surface of the light guide plate 30.

The prism sheet 43 laminated on the diffusion sheet 42 is a substantially rectangular optical sheet having translucency obtained by forming a uniform prism pattern with an acrylic resin on one surface of a face material made of polyester resin, for example.
The polarizing sheet 44 laminated on the prism sheet 43 is obtained by bonding a retardation film obtained by stretching a polycarbonate (PC) film or a PEN (polyethylene naphthalate) film and a polyester film with an acrylic resin, for example. It is formed in a rectangle.

  The light that has entered the inside of the light guide plate 30 propagates through the light guide plate 30 by being repeatedly reflected on the front and back surfaces of the light guide plate 30, and is diffused and averaged during the propagation. Is emitted from the front. The light emitted from the front surface of the light guide plate 30 passes through the diffusion sheet 42, the prism sheet 43, and the polarizing sheet 44, and irradiates, for example, a liquid crystal panel from a light outlet that is surrounded by the frame body 45. Is done.

  A lighting circuit 48 is attached to the back surface of the casing 41. The lighting circuit 48 supplies a current to each LED module 10 and controls a current flowing through each LED module 10. The lighting circuit 48 may be provided inside the housing 41, and may be configured to be attached to any of the LED modules 10, for example. In such a configuration, the connection line between the lighting circuit 48 and the outside is only a power supply line for operating the lighting circuit 48 and a control signal line for adjusting the brightness, thereby simplifying the connection. Can do.

2 is a perspective view showing the configuration of the LED module 10, the heat sink 21, and the FPC 22 in the light source device (backlight unit), and FIG. 3 is an exploded view thereof.
As shown in FIG. 2 and FIG. 3, each LED module 10 has the same structure, and the plurality of LED modules 10 are opposed to the heat sink 21 over almost the entire length of one side 31 of the light guide plate 30. Are arranged in a straight line.

Each LED module 10 includes a support substrate 11 whose surface is elongated along one side surface 31 of the light guide plate 30, and a plurality of LEDs mounted on the surface of the support substrate 11 facing the one side surface 31 of the light guide plate 30. A chip (semiconductor light emitting element) 12 is provided, and all LED chips 12 are sealed with a phosphor-containing resin 19.
As shown in FIG. 3, the heat sink 21 has a mounting surface 21a on which each LED module 10 is mounted, and the FPC 22 is arranged along one side surface 21b continuous to the mounting surface 21a. The FPC 22 extends from the main body portion 22f so as to face the main body portion 22f arranged in a straight line along the LED modules 10 on the side surface 21b of the heat sink 21 and the back surface of the substantially central portion of each LED module 10 in the longitudinal direction. Each connection portion 22g is bent so as to be fitted into a recess 21a provided in the heat sink 21, and connected to the back surface of each support substrate 11. .

  4 is a plan view of the LED module 10, and FIG. 5 is a cross-sectional view taken along line AA of FIG. The support substrate 11 has a single-layer structure formed, for example, from ceramic into a strip shape having a length of 50 mm, a width of 5 mm, and a thickness of 10 mm. Each LED chip 12 provided on the support substrate 11 has a light emitting surface on the surface facing the side surface 31 of the light guide plate 30, and a constant interval (for example, 1 mm) is provided at the center in the width direction of the support substrate 11. In the opened state, each is die-bonded with a die attach agent 17 (see FIG. 5).

  A pair of first wiring patterns 14 and a second wiring pattern 15 are provided on the surface of the support substrate 11. As shown in FIG. 4, the first wiring pattern 14 provided on the surface of the support substrate 11 is formed linearly along the longitudinal direction on one side edge portion along the longitudinal direction of the support substrate 11. The first wiring bus 14a is also provided. Each end of the first wiring bus 14 a in the longitudinal direction is adjacent to the LED chip 12 disposed at each end located on both sides of the support substrate 11 in the width direction of the support substrate 11. Yes.

The first wiring bus 14 a is provided with a first bonding portion 14 b that branches along the width direction of the support substrate 11 for each LED chip 12. The first bonding portion 14b branches off with respect to each LED chip 12 at a pitch equal to the pitch of each LED chip 12 in a state along the width direction of the support substrate 11 on one side in the longitudinal direction.
The first bonding portions 14b have the same width dimension, and are also equal to the width dimension of the first wiring bus 14a. Each front end portion of the first bonding portion 14b passes through the side of each LED chip 12 and is in the vicinity of the side edge portion of the support substrate 11 opposite to the side edge portion on which the first wiring bus 14a is provided. Has reached.

  The first wiring bus 14a and the first bonding portions 14b are integrally patterned with a constant thickness and a constant width by a conductive material (eg, Ag paste) having a predetermined conductivity. Accordingly, the wiring resistance per unit length of the first wiring pattern 14 is constant. The conductive material that can be used in the present invention is not limited to Ag paste, and may be tungsten, copper, Ag-Pd paste, gold paste, or the like.

  The second wiring pattern 15 provided on the surface of the support substrate 11 extends along the longitudinal direction of the support substrate 11 on the side edge opposite to the side edge of the support substrate 11 on which the first wiring pattern 14 is provided. The second wiring bus 15a is formed in a straight line. Similar to the first wiring pattern 14, the second wiring bus 15 a is adjacent to each LED chip 12 disposed at each end on both sides in the longitudinal direction of the support substrate 11 in the width direction of the support substrate 11. ing.

Also in the second wiring bus 15a, a second bonding portion 15b that passes through the side opposite to the first bonding portion 14b with respect to each LED chip 12 is branched. The second bonding portions 15b have the same width direction dimensions, and the respective leading ends extend so as to be close to the first wiring bus 14a.
The second wiring bus 15a and each second bonding portion 15b are also made of the same material as the first wiring pattern 14 and are equal in thickness and width to the first wiring bus 14a and the first bonding portion 14b of the first wiring pattern 14, respectively. Thickness and width dimensions are formed. Accordingly, the wiring resistance per unit length of the second wiring pattern 15 is also constant, and is equal to the wiring resistance per unit length of the first wiring pattern 14.

Each LED chip 12 is, for example, a light emitting diode that emits blue light in which a GaN-based compound semiconductor layer is formed on a light-transmitting substrate, and a pair of first electrodes is formed on the light emitting side surface of each LED chip 12. And a second electrode (not shown).
The first electrode of each LED chip 12 is bonded to each first bonding portion 14b of the first wiring pattern 14 adjacent to each LED chip 12 by a first bonding wire 18a. The second electrode of each LED chip 12 is bonded to each second bonding portion 15b of the second wiring pattern 15 adjacent to each LED chip 12 by a second bonding wire 18a. The first bonding wire 18a and the second bonding wire 18b are made of, for example, gold (Au) wires.

  As shown in FIG. 5, each LED chip 12, first wiring pattern 14, second wiring pattern 15, first bonding wire 18 a and second bonding wire 18 b on the surface of the support substrate 11 is covered with the phosphor-containing resin 19. ing. In the phosphor-containing resin 19, for example, phosphor particles are dispersed in a translucent material such as silicone resin, and a part of blue light emitted by the LED chip 12 is longer than the blue light by the phosphor particles. The light is converted into light on the wavelength side, and white light is generated by mixing the converted long-wavelength side light and the blue light not converted by the phosphor particles. Examples of the phosphor particles include a mixture of a red phosphor and a green phosphor made of silicon nitride, a YAG phosphor, and the like.

  As shown in FIG. 4, the support substrate 11 is electrically connected to a first bonding portion 14b and a second bonding portion 15b provided with an LED chip 12 disposed in the central portion in the longitudinal direction. A first through hole 11a and a second through hole 11b are provided. The first through hole 11a and the second through hole 11b are formed at positions separated by an equal distance from the side edge adjacent to the first wiring bus 14a.

As shown in FIG. 5, a first power supply terminal for supplying power to the first bonding portion 14b and the second bonding portion 15b through the first through hole 11a and the second through hole 11b on the back surface of the support substrate 11, respectively. 14c and the 2nd electric power feeding terminal 15c are each provided.
The first power supply terminal 14c and the second power supply terminal 15c provided on the back surface of the support substrate 11 are connected to the FPC 22 arranged along the side edge portion of the support substrate 11 where the first wiring bus 14a is provided. . As shown in FIGS. 2 to 4, the FPC 22 includes a main body portion 22 f that extends linearly along each LED module 10, and a connection portion 22 g that branches toward a central portion in the longitudinal direction of each LED module 10. Is provided.

  A connector 22d is provided at one end of the main body 22f of the FPC 22. Further, a first wiring 22a and a second wiring 22b are provided in each connection portion 22g of the FPC 22. The first wiring 22a of the connection portion 22g adjacent to the connector 22d is connected to the connector 22d through the main body portion 22f. The second wiring 22b of each connection portion 22g passes through the main body portion 22f and is connected to the first wiring 22a of the connection portion 22g adjacent in the direction away from the connector 22d. The main body portion 22f is provided with a main wiring 22h connected to the second wiring 22b of the connection portion 22g.

The first wiring 22a, the second wiring 22b, and the main wiring 22h of the FPC 22 are made of, for example, copper (Cu), and these wirings are mutually connected by an insulating film 22c (see FIG. 5) made of, for example, polyimide. Covered in an insulated state.
As shown in FIGS. 4 and 5, each connection portion 22g of the FPC 22 is disposed along the back surface of the support substrate 11, and the first wiring 22a is connected to the first power supply terminal 14c at the tip portion thereof. The second wiring 22b is connected to the second power supply terminal 15c (see FIG. 4). Thus, the first wiring 22a is electrically connected to the first wiring bus 14a via the first power supply terminal 14c, the first through hole 11a, and the first bonding portion 14b, and the second wiring 22b is The second power supply terminal 15c, the second through hole 11b, the second bonding portion 15b, and the second bonding portion 15b are electrically connected to the second wiring bus 15a.

  The LED modules 10 arranged along the side surface 31 of the light guide plate 30 have the same configuration, and the central portion in the longitudinal direction on the back surface of the support substrate 11 faces the recess 21 c formed in the heat sink 21. As described above, the first power supply terminal 14c and the second power supply terminal 15c that are mounted on the mounting surface 21a of the heat sink 21 and are provided on the back surface of the support substrate 11 are connected to the first wiring 22a and the second wiring 22a in the respective connection portions 22g of the FPC 22. Each is connected to the wiring 22b. The support substrate 11 is usually attached to the heat sink 21 at both ends by screws 27.

  In the LED module 10 having such a configuration, for example, the current supplied from the connector 22d of the FPC 22 to the first wiring 22a is the length of the first wiring pattern 14 via the first power supply terminal 14c and the first through hole 11a. In addition to being supplied to the first bonding portion 14b disposed at the center of the direction, the first bonding bus 14a is connected to the first bonding portion 14b.

  The current supplied to the central portion in the longitudinal direction of the first wiring bus 14a flows toward each end on both sides of the first wiring bus 14a. In this case, the current flowing from the central portion toward each end of the first wiring bus 14a reaches each of the first bonding portions 14b that branch in order along the first wiring bus 14a in order, thereby It supplies to the 1st bonding part 14b in order.

  The current supplied to each of the first bonding portions 14b is supplied to the LED chips 12 by the first bonding wires 18a connected to the first bonding portions 14b, passes through the LED chips 12, and passes through the second bonding wires. 18 b flows to the second bonding portion 15 b of the second wiring pattern 15. The LED chip 12 generates light when an electric current flows through the LED chip 12, and the generated light is emitted from the light emitting surface.

  The current supplied to the second bonding portion 15b of the second wiring pattern 15 through each LED chip 12 flows into the second wiring bus 15a. The current that has flowed into the second wiring bus 15a flows toward the central portion in the longitudinal direction of the second wiring bus 15a, and is supplied to the second bonding portion 15b disposed in the central portion in the longitudinal direction of the second wiring bus 15a. The Then, it flows from the second bonding portion 15b to the second power supply terminal 15c through the second through hole 11b, and further passes through the second wiring 22b of the FPC 22 from the second power supply terminal 15c to the adjacent connection portion 22g. It is supplied to the first wiring 22a. The current that has passed through all the LED chips 12 flows through the main wiring 22h of the FPC 22 to the connector 22d.

As described above, a current path is formed by the first wiring pattern 14 and the second wiring pattern 15 with respect to each LED chip 12 on the support substrate 11, and each LED chip 12 is caused by a current flowing through each current path. Emits light.
In this case, a current path is formed in the LED chip 12 arranged at the center in the longitudinal direction of the support substrate 11 by the first bonding part 14b and the second bonding part 15b arranged on both sides of the LED chip 12.

  On the other hand, the current supplied from the central portion in the longitudinal direction of the first wiring bus 14a is sequentially supplied to each LED chip 12 other than the LED chip 12 arranged in the central portion in the longitudinal direction of the support substrate 11 in order. Longitudinal direction in the second wiring bus 15a is supplied from the second bonding portion 15b that is supplied through the first bonding portion 14b branched from the wiring bus 14a and passes through each LED chip 12 from the second bonding portion 15b. It flows toward the center of the.

Therefore, the length of the current path formed by the first wiring pattern 14 and the second wiring pattern 15 for each LED chip 12 is in the center of the longitudinal direction of the support substrate 11 (the arrangement direction of the LED chips 12). The LED chips 12 arranged close to each other are shorter, and the longer they are away from the central portion, the longer.
Since the first wiring pattern 14 and the second wiring pattern 15 provided on the support substrate 11 are formed of the same material with a certain thickness and width, the current path for each LED chip 12 is The resistance value per unit length of the wiring resistance is constant. Therefore, the entire wiring resistance from the first feeding terminal 14c to the second feeding terminal 15c of each current path is proportional to the length of each current path. And get bigger.

As a result, as shown in FIG. 6A, each LED chip 12 has the smallest wiring resistance of the entire current path with respect to the LED chip 12 arranged in the center portion of the support substrate 11 in the longitudinal direction, As the distance from the central portion to each LED chip 12 increases, the overall wiring resistance of the current path for each LED chip 12 increases.
The luminance in each LED chip 12 in this case is the current supplied to the LED chip 12 as the overall wiring resistance of the current path formed with respect to the LED chip 12 increases as shown in FIG. The value decreases, thereby reducing the brightness. Conversely, the luminance of the LED chip 12 increases as the overall wiring resistance of the current path formed for the LED chip 12 decreases.

Accordingly, the brightness of each LED chip 12 is maximized with respect to the length of the current path for each LED chip 12, and the LED chip 12 disposed at the center in the longitudinal direction of the substrate 11 is maximized. The LED chip 12 whose distance becomes longer decreases.
Note that, as described above, the LED chip 12 disposed in the central portion in the longitudinal direction of the support substrate 11 does not efficiently dissipate heat, but the LED chip 12 disposed in both end portions having a long distance from the central portion in the longitudinal direction. As shown in FIG. 6B, the brightness of each LED chip 12 increases as the LED chip 12 whose distance from the central portion in the longitudinal direction of the support substrate 11 becomes longer, as shown in FIG. become.

  Therefore, in the present embodiment, each LED chip 12 arranged along the longitudinal direction of the support substrate 11 has the luminance distribution shown in FIGS. 6A and 6B of each LED chip 12. Therefore, the luminance change due to heat dissipation cancels out the luminance change due to the wiring resistance in each current path. As a result, as shown in the graph of FIG. 6C, a substantially constant luminance distribution is obtained in the longitudinal direction of the LED module 10, and unevenness in luminance occurs along the longitudinal direction in the light emitted from the LED module 10. Is suppressed.

  The light irradiated from each LED chip 12 of the LED module 10 enters the light guide plate 30 from the side surface 31 of the light guide plate 30, and the inside of the light guide plate 30 is between the front surface and the back surface facing the liquid crystal panel. While propagating while reflecting, the light is emitted from the surface facing the liquid crystal panel and is irradiated onto the liquid crystal panel. All of the LED chips 12 are suppressed in luminance unevenness and have a substantially uniform luminance distribution, so that light with a uniform luminance distribution enters the light guide plate 30 and is irradiated on the liquid crystal panel. Therefore, the occurrence of luminance unevenness in the image displayed on the liquid crystal panel is suppressed, and a high-quality image can be obtained.

  FIG. 7 is a plan view of the LED module 10 in a modification of the present embodiment. In the LED module 10 shown in FIG. 7, the first bonding portions 14 b of the first wiring pattern 14 provided on the support substrate 11 are branched toward the LED chips 12. The tip of the first bonding portion 14b is close to the corresponding LED chip 12, and the tip and the first electrode of the corresponding LED chip 12 are respectively connected by the first bonding wire 18a. Bonded.

  The second bonding portion 15 b of the second wiring pattern 15 is also branched toward each LED chip 12. The tip of each second bonding portion 15b is also close to the corresponding LED chip 12 in the width direction, and the tip and the second electrode of the corresponding LED chip 12 are connected to the second bonding wire. Each of them is bonded by 18b.

  The support substrate 11 is provided with a first through hole 11a so as to face the central portion in the longitudinal direction of the first wiring bus 14a. The first through hole 11a is provided on the back surface of the support substrate 11 through the first through hole 11a. A first power supply terminal 11c electrically connected to the one wiring bus 14a is provided. Then, a current is supplied to the first power supply terminal 14c through the connection portion 25g branched from the main body portion 25f of the first FPC 25. A branch wiring 25 c branched from the first wiring 25 a provided in the main body portion 25 f is connected to each connection portion 25 g of the first FPC 25. A connector 25 c is provided at one end of the first FPC 25.

  Further, the support substrate 11 is provided with a second through hole 11b so as to face the central portion in the longitudinal direction of the second wiring bus 15a, and the back surface of the support substrate 11 is interposed via the second through hole 11b. A second power supply terminal 11d electrically connected to the second wiring bus 15a is provided. Then, a current is supplied to the second power supply terminal via the connection portion 26g branched from the main body portion 26f of the second FPC 26. A branch wiring 26 c branched from the second wiring 26 a provided in the main body portion 26 f is connected to each connection portion 26 g of the second FPC 26. A connector 26 c is provided at one end of the second FPC 26.

Other configurations are the same as those of the LED module 10 shown in FIGS. 4 and 5.
Even in the LED module 10 having such a configuration, the length of each current path for energizing each LED chip 12 arranged along the longitudinal direction of the support substrate 11 is different from the lengthwise central portion of the support substrate 11. Since the current path to the LED chip 12 with a longer distance is longer, the wiring resistance is larger. Therefore, each LED chip 12 arranged along the longitudinal direction of the support substrate 11 cancels out the luminance change based on the heat dissipation efficiency and the luminance change based on the wiring resistance in each current path. The luminance distribution of each LED chip 12 is substantially uniform as shown in the graph of FIG. Thereby, it can suppress that the brightness nonuniformity generate | occur | produces in the light irradiated from the LED module 10 along a longitudinal direction.

  In the present embodiment, the support substrate 11 having a single-layer structure is used. However, the first wiring bus 14a and the second wiring of the first wiring pattern 14 are formed using the support substrate 11 having a multilayer structure. The second wiring bus 15a of the pattern 15 is formed in the inner layer, the first bonding portion 14b and the second bonding portion 15b are formed on the surface of the multilayer substrate, and the first bonding portion 14b and the first wiring bus 14a are connected to each other. The second bonding part 15b and the second wiring bus 15a may be electrically connected by through holes or vias, and may be electrically connected by through holes or vias.

Second Embodiment
FIG. 8 is a plan view of an LED module 10 according to another embodiment of the present invention. In the LED module 10 illustrated in FIG. 8, the first wiring pattern 14 provided on the support substrate 11 is provided at one end in the longitudinal direction of the first wiring bus 14 a of the first wiring pattern 14 provided on the support substrate 11 having a single layer structure. A first power supply terminal 14c provided on the back surface of the support substrate 11 is electrically connected through the through hole 11a. One end of the first FPC 25 provided with only the first wiring 25a is connected to the first power supply terminal 14c. A connector 25 c is provided at the other end of the first FPC 25.

  Further, at the other end in the longitudinal direction of the second wiring bus 15a of the second wiring pattern 15 provided on the support substrate 11 (the end opposite to the end where the first power supply terminal 14c is arranged) A second power supply terminal 15 c provided on the back surface of the support substrate 11 is electrically connected through a second through hole 11 b provided in the support substrate 11. One end of the first FPC 25 provided with only the first wiring 25a is connected to the second power supply terminal 15c. A connector 25 c is provided at the other end of the first FPC 25.

  Each of the first bonding portion 14b of the first wiring pattern 14 and the second bonding portion 15b of the second wiring pattern 15 provided on the support substrate 11 is similar to the LED module 10 shown in FIG. 12, the width dimensions (dimensions along the longitudinal direction of the support substrate 11) of the first bonding portion 14b and the second bonding portion 15b are different depending on the respective arrangement positions on the support substrate 11. Yes.

  That is, the width dimension of the 1st bonding part 14b and the 2nd bonding part 15b arrange | positioned in the center part of the longitudinal direction of the support substrate 11 is the largest, and the 1st bonding part 14b and 2nd from the center part of a longitudinal direction. The longer the distance to the bonding part 15b, the smaller the width dimension becomes. Other configurations of the LED module 10 are the same as those of the LED module 10 shown in FIG.

  In the LED module 10 having such a configuration, for example, a current supplied from the connector 25c of the first FPC 25 to the first wiring 25a is transmitted to the first wiring pattern 14 via the first power supply terminal 14c and the first through hole 11a. It is supplied to one end of the first wiring bus 14a in the longitudinal direction. Then, the current supplied to the first wiring bus 14a flows in the first wiring bus 14a from one end portion in the longitudinal direction toward the other end portion.

  The current flowing in the first wiring bus 14a is shunted in turn with respect to the first bonding portions 14b that branch in order along the direction in which the current flows, and the first bonding wires connected to the first bonding portions 14b. After being supplied to the LED chip 12 by 18a and passing through each LED chip 12, it flows to the second bonding portion 15b of the second wiring pattern 15 by the second bonding wire 18b. The LED chip 12 generates light when an electric current flows through the LED chip 12, and the generated light is emitted from the light emitting surface.

  The current supplied to the second bonding portion 15b of the second wiring pattern 15 through each LED chip 12 flows into the second wiring bus 15a. The current flowing into the second wiring bus 15a flows in the second wiring bus 15a toward the end in the longitudinal direction where the second power supply terminal 15c is arranged, and at the end via the second through hole 11b. Then flows to the second power supply terminal 15c, and is further supplied from the second power supply terminal 15c to the connector 26c through the second wiring 26a of the second FPC 26.

  Therefore, the length of the current path formed by the first wiring pattern 14 and the second wiring pattern 15 for each LED chip 12 is the one end connected to the first power supply terminal 14c in the first wiring bus 14a. To the branch portion of each first bonding portion 14b, the length of the first bonding portion 14b, the length of the second bonding portion 15b, and the second wiring bus from which each second bonding portion 15b branches. The distance from the position of 15a to the end of the second wiring bus 15a connected to the second power supply terminal 15c is the sum, and the lengths of the respective current paths are equal.

  In this case, the width dimensions of the first bonding portion 14b and the second bonding portion 15b disposed at the center portion in the longitudinal direction of the support substrate 11 are the largest, respectively, and the first bonding portion 14b and the second bonding portion 14b from the center portion in the longitudinal direction. Since the width dimension becomes smaller as the distance to the bonding portion 15 b becomes longer, the total wiring resistance of each current path with respect to each LED chip 12 is the LED chip 12 arranged at the center in the longitudinal direction of the support substrate 11. As the distance from the central portion in the longitudinal direction to each LED chip 12 becomes longer, the wiring resistance sequentially increases (see FIG. 6A).

  As a result, as shown in FIG. 6A, the brightness of each LED chip 12 is maximized in the LED chip 12 arranged in the central part in the longitudinal direction, and from the central part in the longitudinal direction to each LED chip 12. As the distance becomes longer, the distance decreases with increasing distance. Further, as shown in FIG. 6B, the heat dissipation efficiency of each LED chip 12 is the lowest in the center portion in the longitudinal direction of the support substrate 11, and the LED chip 12 whose distance from the center portion in the longitudinal direction is longer. Since the heat dissipation efficiency increases, the luminance of each LED chip 12 increases as the distance from the central portion in the longitudinal direction of the support substrate 11 increases.

  Therefore, also in this embodiment, each LED chip 12 arranged along the longitudinal direction of the support substrate 11 cancels out the luminance change due to heat dissipation and the luminance change due to the wiring resistance of each current path. As a result, the luminance distribution of each LED chip 12 becomes substantially uniform as shown in the graph of FIG. Thereby, it can suppress that the brightness nonuniformity generate | occur | produces in the light irradiated from the LED module 10 along a longitudinal direction.

  In this embodiment, in order to change the wiring resistance of each current path for each LED chip 12 based on the position of each LED chip 12 along the longitudinal direction of the support substrate 11, the longitudinal length of the support substrate 11 is changed. Based on the arrangement positions of the first bonding portion 14b and the second bonding portion 15b along the direction, the respective width dimensions are made different. However, the present invention is not limited to such a configuration, for example, the longitudinal direction of the support substrate 11 The thicknesses of the first bonding portion 14b and the second bonding portion 15b may be different from each other based on the arrangement positions of the first bonding portion 14b and the second bonding portion 15b.

  That is, from the central portion in the longitudinal direction so that the first bonding portion 14b and the second bonding portion 15b for energizing the LED chip 12 disposed in the central portion in the longitudinal direction of the support substrate 11 have the maximum thickness. As the distance to each of the first bonding portion 14b and the second bonding portion 15b increases, the thickness may be sequentially reduced.

  Furthermore, it is also possible to use a material with different conductivity so that the respective wiring resistances change based on the arrangement positions of the first bonding portion 14b and the second bonding portion 15b along the longitudinal direction of the support substrate 11. Good. That is, a material having a high conductivity is used so that the first bonding portion 14b and the second bonding portion 15b for energizing the LED chip 12 disposed in the central portion in the longitudinal direction of the support substrate 11 have a minimum wiring resistance. The first and second bonding portions 14b and 15b from the central portion in the longitudinal direction are made longer by increasing the distance between the first bonding portion 14b and the second bonding portion 15b. Each of the first bonding part 14b and the second bonding part 15b may be configured.

  Furthermore, each of the first bonding portions 14b is usually formed with an Au plating layer on the surface to which the first bonding wire 18a is bonded, and each of the first bonding portions 14b is bonded to the first bonding wire 18a. An Au plating layer is formed on the surface of the first bonding portion 14b and the second bonding from the central portion in the longitudinal direction by changing the thickness of each Au plating layer (usually about 0.3 to 0.5 μm). The Au plating layer may be configured so that the thickness of the Au plating layer is sequentially reduced so that the resistance increases as the distance to each of the portions 15b increases.

  Also in this embodiment, the first wiring bus 14a of the first wiring pattern 14 and the second wiring bus 15a of the second wiring pattern 15 are formed in the inner layer using the support substrate 11 having a multilayer structure. A bonding portion 14b and a second bonding portion 15b are formed on the surface of the multilayer substrate, and the first bonding portion 14b and the first wiring bus 14a are electrically connected by a through hole or via, and the second bonding is performed. The part 15b and the second wiring bus 15a may be configured to be electrically connected by a through hole or a via.

  In this case, the through hole or via connected to the first bonding portion 14b and the second bonding portion 15b for energizing the LED chip 12 disposed in the center portion in the longitudinal direction of the support substrate 11 has a minimum resistance. In order to increase the diameter of the through hole or via or shorten the length, and the longer the distance from the central portion in the longitudinal direction to each of the first bonding portion 14b and the second bonding portion 15b, In order to increase the respective resistances, the diameters of the through holes or vias may be sequentially decreased, or the lengths may be sequentially increased.

<Third Embodiment>
FIG. 9 is a plan view of an LED module 10 according to still another embodiment of the present invention. In the LED module 10 shown in FIG. 9, the first power supply terminal 14 c connected to the first wiring bus 14 a of the first wiring pattern 14 and the second power supply terminal connected to the second wiring bus 15 a of the second wiring pattern 15. 15c are arranged side by side at one end of the support substrate 11 in the longitudinal direction.

  In this case, similarly to the LED module 10 shown in FIG. 8, the first wiring bus 14 a and the first power supply terminal 14 c of the first wiring pattern 14 are connected via the first through hole 11 a provided in the support substrate 11. The second wiring bus 15a of the second wiring pattern 15 and the second power supply terminal 15c are connected via a second through hole 11b provided in the support substrate 11.

The first power supply terminal 14c is connected to the first FPC 25 having the same configuration as the first FPC 25 in the LED module 10 shown in FIG. 7, and the second power supply terminal 15c is also connected to the second FPC 26 in the LED module 10 shown in FIG. A second FPC 26 having the same configuration is connected.
In this embodiment, the width dimensions (lengths along the longitudinal direction of the support substrate 11) of the first bonding portion 14b and the second bonding portion 15b for energizing the LED chip 12 are different from each other. Based on the length of the current path with respect to the chip 12 and the arrangement position of each LED chip 12 in the longitudinal direction of the support substrate 11, the width dimensions of the first bonding portion 14b and the second bonding portion 15b are set.

In this case, the length of the current path for each LED chip 12 is the length of the support substrate 11 from the end of the support substrate 11 provided with the first power supply terminal 14 c and the second power supply terminal 15 c to each LED chip 12. As the length along the direction becomes longer, it gradually increases.
On the other hand, the brightness of each LED chip 12 based on the heat dissipation efficiency is the highest in the LED chip 12 arranged in the center part of the support substrate 11 in the longitudinal direction, and the LEDs arranged apart from the center part on both sides. As the chip 12 becomes brighter.

In the present embodiment, the first bonding unit 14b and the first bonding unit 14b and the first bonding unit 14b are arranged so that the brightness of each LED chip 12 is substantially equal in consideration of the change in brightness of each LED chip 12 with respect to the length of the current path and the heat dissipation efficiency. The width dimension of each of the two bonding parts 15b is set.
For this purpose, for example, the width dimensions of the first bonding portion 14b and the second bonding portion 15b for energizing the LED chip 12 disposed in the center portion in the longitudinal direction of the support substrate 11 are set to be maximized. The first bonding part 14b and the second bonding part 15b arranged away from the central part in the direction approaching the first power supply terminal 14c and the second power supply terminal 15c are each increased as the distance from the central part becomes longer. The width dimension is gradually reduced.

  Similarly, the first bonding portion 14b and the second bonding portion 15b arranged in the direction away from the first power supply terminal 14c and the second power supply terminal 15c from the center portion in the longitudinal direction of the support substrate 11 are formed from the center portion. As the distance becomes longer, the respective width dimensions gradually decrease, but are arranged in order from the central portion in the longitudinal direction of the support substrate 11 in a direction approaching the first power supply terminal 14c and the second power supply terminal 15c. The width dimensions of the first bonding part 14b and the second bonding part 15b are successively reduced at a rate smaller than the rate of sequentially reducing the width dimension.

  With such a configuration, each LED chip 12 arranged along the longitudinal direction of the support substrate 11 cancels out the luminance distribution based on the heat dissipation efficiency and the luminance distribution based on the wiring resistance in each current path. Thus, the luminance distribution of each LED chip 12 is made uniform as shown in the graph of FIG. Thereby, it is suppressed that the brightness nonuniformity occurs in the light irradiated from the LED module 10 along the longitudinal direction.

  In the present embodiment as well, the first bonding portion 14b and the second bonding portion 15b are not limited to the configuration in which the width dimensions of the first bonding portion 14b and the second bonding portion 15b are changed. A configuration in which the thicknesses of the bonding portion 14b and the second bonding portion 15b are changed, a configuration in which the conductivity of the material forming the first bonding portion 14b and the second bonding portion 15b is changed, or the like may be employed.

  Furthermore, by using the support substrate 11 having a multilayer structure, as described above, each of the first wiring pattern 14 and the second wiring pattern 15 includes a through hole or via, and the diameter of the through hole or via is set. The wiring resistance of the current path for each LED chip 12 may be set by adjusting one or both of the length and the length.

<Modification>
In each of the embodiments described above, the first wiring bus 14a of the first wiring pattern 14 and the first power supply terminal 14c are connected via the first through hole 11a provided in the support substrate 11, and the second wiring pattern 15 is connected. The second wiring bus 15a and the second power supply terminal 15c are connected via the second through hole 11b provided in the support substrate 11. However, the first wiring bus 14a and the first power supply terminal 14c, The second wiring bus 15a and the second power supply terminal 15c may be connected directly or via an adhesive or the like.

  Furthermore, in each of the above embodiments, one LED chip 12 is connected in series between the first bonding portion 14b of the first wiring pattern 14 and the first bonding portion 15b of the second wiring pattern 15. Although there was, it is not restricted to such a structure. For example, a plurality of LED chips 12 adjacent to each other are connected in series by a wiring pattern, and the series circuit is connected to the first bonding part 14 b of the first wiring pattern 14 and the first bonding part 15 b of the second wiring pattern 15. It is good also as a structure connected in series.

  According to the present invention, in a light emitting module in which a plurality of semiconductor light emitting elements are arranged in a row on a support substrate, it is possible to suppress occurrence of luminance unevenness along the arrangement direction of the semiconductor light emitting elements. Therefore, the light source device using the light emitting module according to the present invention is useful as, for example, a linear light source of an image display device such as a liquid crystal television or a liquid crystal display, and a linear or planar light source for general illumination.

DESCRIPTION OF SYMBOLS 10 LED module 11 Support board 11a 1st through-hole 11b 2nd through-hole 12 LED chip 14 1st wiring pattern 14a 1st wiring bus 14b 1st bonding part 14c 1st electric power feeding terminal 15 2nd wiring pattern 15a 2nd wiring bus 15b 1st bonding part 15c 2nd electric power feeding terminal 18a 1st bonding wire 18b 2nd bonding wire 19 Phosphor containing resin 21 Heat sink 21a Recessed part 22 FPC
25 1st FPC
26 Second FPC
30 Light guide plate

Claims (13)

A light emitting module in which a plurality of semiconductor light emitting elements are arranged in a row on a substrate,
A wiring pattern including a pair of power supply terminals is provided on the substrate,
The wiring pattern includes a plurality of current paths through which current flows from one power supply terminal to the other power supply terminal for one or a plurality of adjacent semiconductor light emitting elements,
The wiring resistance in the plurality of current paths has the lowest wiring resistance in the current path leading to the semiconductor light emitting element located at the center in the arrangement direction, and the wiring resistance in the current path reaching the semiconductor light emitting element having a large distance from the center. A light emitting module characterized by being set large. The wiring pattern forming the current path has a constant wiring resistance per unit length,
The pair of power supply terminals is provided at a position corresponding to a central portion in the arrangement direction of the semiconductor light emitting elements,
The path length of the plurality of current paths is the shortest path length of the current path to the semiconductor light emitting element located at the center in the arrangement direction, and the current path to the semiconductor light emitting element having a larger distance from the center has a path length of The light emitting module according to claim 1, wherein the light emitting module is set long.   The light emitting module according to claim 2, wherein the pair of power supply terminals are arranged on one side edge portion of the substrate along the arrangement direction of the semiconductor light emitting elements.   3. The light emitting module according to claim 2, wherein each of the pair of power supply terminals is disposed on both side edges of the substrate along the arrangement direction of the semiconductor light emitting elements. The substrate provided with the current path has a single layer structure,
Each of the plurality of current paths has a wiring resistance adjusted by adjusting one or more of the length, width, thickness of the current path itself, and the conductivity of the material forming the current path. The light-emitting module according to claim 1. The substrate provided with the current path has a multilayer structure,
Each of the plurality of current paths includes a via or a through hole provided in each layer of the substrate,
Each of the plurality of current paths adjusts one or more of the length, width and thickness of the current path itself, the conductivity of the material forming the current path, and the diameter and length of the via or through hole. The light emitting module according to claim 1, wherein the wiring resistance is adjusted.   7. The light emitting module according to claim 5, wherein each of the pair of power supply terminals is provided at both end portions in the arrangement direction of the semiconductor light emitting elements. The wiring pattern is formed with a certain thickness by a material having a certain conductivity,
The plurality of current paths are set such that at least a part of the width of the current path is the thickest in the current path to the semiconductor light emitting element located at the center in the arrangement direction, and the current path to the semiconductor light emitting element having a large distance from the center is narrower. The light-emitting module according to claim 7.   The wiring pattern is formed with a certain width by a material having a certain conductivity, and the plurality of current paths are currents that reach at least a part of the thickness of the semiconductor light emitting element located at the center in the arrangement direction. The light emitting module according to claim 7, wherein the current path reaching the semiconductor light emitting element having the thickest path and the large distance from the center is set to be thinner. The wiring pattern is formed in a certain width dimension and thickness,
The plurality of current paths are set such that at least a part of the conductivity is the highest in the current path to the semiconductor light emitting element located in the center of the arrangement direction, and the current path to the semiconductor light emitting element having a large distance from the center is set lower. The light emitting module according to claim 7, wherein the light emitting module is provided. Each of the pair of power supply terminals is provided at one end of the semiconductor light emitting element in the arrangement direction,
The path length of the plurality of current paths is the shortest in the path length of the current path to the semiconductor light emitting element close to the end, and is longer for the current path to the semiconductor light emitting element having a large distance from the end. ,
The plurality of current paths have different one or more of the width, thickness, and conductivity of the material forming the current path in each current path. The light emitting module according to claim 1, wherein the wiring resistance is different.   The light emitting module according to claim 1, wherein the semiconductor light emitting elements are arranged on the substrate at regular intervals.   It has a light emitting module as described in any one of Claims 1-12, The light source device characterized by the above-mentioned.

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