JP5367664B2 - Method for producing functional film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of producing a functional film, which subjects a base material to film formation process or the like by: using a laminate configured by applying a protective film to the base material; and peeling the protective film off in vacuum, wherein the protective film is prevented from being peeled off from the base material due to a gas remaining between the base material and the protective film, and the peeling electrification that obstructs a process for the base material is prevented. <P>SOLUTION: The protective film 14 on which through-holes are formed while scattered all over the surface of the protective film. Moreover the application area of the protective film 14 and base material 12 is reduced. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a method for producing a functional film in which a protective film is peeled off from a laminate formed by laminating a base material and a protective film in vacuum, and the surface of the base material is processed.

A function in which a film that expresses a desired function (hereinafter referred to as a “functional film” for convenience) such as a gas barrier film, a light reflection film, a light reflection prevention film, and a surface protection film is formed on the surface of the substrate. The adhesive film is used for various applications.
Furthermore, in the production of a functional film, various surface treatments such as smoothing, activation, cleaning, roughening, surface modification, and adhesion imparting may be performed on the surface of the substrate. ing.

  In addition, as a method for enabling the production of functional films with high productivity and production efficiency, a gas barrier is formed by feeding a long base material from a base material roll that is wound in a roll shape and conveying it in the longitudinal direction. 2. Description of the Related Art An apparatus for forming a film by so-called roll-to-roll (hereinafter also referred to as RtoR) is known, in which a film is formed and the film-formed base material is wound into a roll.

In the production of such a functional film, if the surface of the substrate (surface to be treated) is damaged due to conveyance by a pair of conveyance rollers, contact with other members, or the like, the functional film having the intended performance May become impossible to manufacture.
In particular, in the RtoR apparatus described above, since the front surface and the back surface of the base material are in sliding contact with each other by winding the base material, the base material is easily damaged. Furthermore, if the loading space of the base material roll is evacuated for film formation or the like, the air between the base materials escapes, so-called winding tightening occurs, and the front and back surfaces of the wound base material are in strong sliding contact. The possibility of damaging the substrate surface and making it impossible to produce a functional film having the intended performance increases.
In order to produce a high quality product, it is preferable to keep the surface of the substrate clean.

Therefore, in the production of a functional film such as a gas barrier film, in order to protect the surface of the substrate, a protective film (laminate film) may be adhered to the surface of the substrate to protect the surface of the substrate. Has been done.
In the production of a functional film using such a laminate, the laminate of the substrate and the protective film is usually loaded in a substrate processing apparatus such as a film forming apparatus or a surface treatment apparatus. Inside, the protective film is peeled off and the substrate surface is treated.

By the way, film formation of various functional films such as a gas barrier film is often performed in a vacuum such as plasma CVD or vacuum deposition. Further, surface treatment of the substrate such as activation treatment and cleaning treatment is often performed by plasma irradiation or ion irradiation in a vacuum.
Here, if there is a gap (gap) between the base material and the protective film, the air (gas) present in the gap expands in vacuum, and the base material and the protective film are naturally peeled before peeling. As a result, the surface of the base material may not be properly protected.

  As a method for preventing such a problem, Patent Literature 1 discloses that the residual air between the base material and the protective film is completely eliminated by performing lamination of the base material and the protective film in a vacuum. In addition, it is described that lamination is performed by sticking the entire surface with no gap between them.

JP-A-2005-47244

  As described in Patent Document 1, by laminating the base material and the protective film in a vacuum, without forming a gap between them (without the presence of air), the base material and the protective film Can be obtained. As a result, natural peeling due to the expansion of air when the laminate is placed in a vacuum can be prevented.

However, when the base material and the protective film are laminated and adhered in a state where they are completely adhered to each other as described above, the peeling charge when the base material and the protective film are peeled off becomes large. .
As a result, this peeling electrification may cause poor transport of the substrate after peeling or adversely affect film formation, surface treatment, etc., resulting in the production of a functional film with the desired performance. There is a possibility of becoming impossible.

  An object of the present invention is to solve the above-described problems of the prior art, and is caused by a gap between the base material and the protective film in the production of a functional film using a laminate on which the base material and the protective film are attached. An object of the present invention is to provide a method for producing a functional film, which can prevent natural peeling between a substrate and a protective film, and can greatly suppress peeling electrification that occurs during peeling between the substrate and the protective film.

  In order to achieve the above object, the method for producing a functional film of the present invention comprises a laminate formed by laminating a protective film having adhesive properties on a surface to be treated of a base material in a vacuum. When the laminate is pulled out from a laminate roll wound in a roll and transported in the longitudinal direction, the protective film is peeled off from the laminate, and the treatment is performed on the surface to be treated of the substrate. The film has a plurality of through-holes, and the total area of the through-holes is 5% or more of the surface area of the protective film when it is assumed that there are no through-holes. Provided is a method for producing a functional film, which uses a protective film smaller than 1 N / 25 mm.

  In such a method for producing a functional film of the present invention, the bonding area between the protective film and the substrate is 70% or less of the surface area of the protective film when it is considered that there are no through holes. It is preferable that the adhesion area between the protective film and the base material is 50% or more of the contact area between the protective film and the base material. It is preferable that the contact area is not more than the contact area between the protective film and the substrate.

Moreover, it is preferable that the through-hole of the said protective film is formed in the non-sticking part of the said protective film.
Further, the laminate is pulled out from a laminate roll formed by winding the long laminate in a roll shape, and the protective film is peeled off and the surface to be treated of the substrate is processed while being conveyed in the longitudinal direction. In addition, it is preferable that the treatment of the surface to be treated of the base material is film formation.
Further, the protective film is preferably formed with irregularities on the contact surface with the base material, and this convex part is an adhesive part, and the protective film has a continuous non-adhesive part. The above through-holes are preferably formed, and the protective film sticking portions are preferably scattered in an island shape.

  As described above, the method for producing a functional film of the present invention uses a laminate in which a protective film (laminate film) is laminated / adhered on the surface of a base material to protect the base material, and is protected in a vacuum. In the production of a functional film that peels the film and further processes the substrate, a protective film having a through-hole and having an adhesive strength of a predetermined value or less is used.

Therefore, when there is a gap between the substrate and the protective film (air (gas) exists), even if the air in the gap expands in a vacuum, this air will escape from the through hole. The natural separation of the two due to the expansion of air between the substrate and the protective film can be prevented.
Moreover, even if the protective film and the substrate are in close contact with each other and are laminated / adhered, the peeling charge can be significantly suppressed by having the through holes.

Therefore, according to the production method of the present invention, it is possible to prevent damage to the base material due to natural peeling between the base material and the protective film in vacuum, film formation or surface treatment defects due to peeling charging, and the like. Thus, a functional film having the performance to perform can be stably produced.
Moreover, in the roll-to-roll apparatus as described above, the higher the conveyance speed of the base material (laminated body), the higher the tension (tension) needs to be applied to the base material in order to stabilize the conveyance. The force on the body is increased and natural peeling is likely to occur, and the peeling speed is increased and peeling electrification is likely to occur. However, according to the present invention, such natural peeling and peeling electrification are suitably suppressed. Since it can do, the conveyance speed of a base material can be improved and productivity and production efficiency can be made high.

It is a figure which shows notionally an example of the apparatus which enforces the manufacturing method of the functional film of this invention. It is a figure which shows notionally the laminated body of the base material used for the manufacturing method of the functional film of this invention, and a protective film. (A)-(C) are the conceptual diagrams of an example of the protective film used for the manufacturing method of the functional film of this invention.

  Hereinafter, the method for producing a functional film of the present invention will be described in detail based on preferred examples shown in the accompanying drawings.

In FIG. 1, the conceptual diagram of an example of the processing apparatus of the base-material surface which implements an example of the manufacturing method of the functional film of this invention is shown.
The processing apparatus 10 shown in FIG. 1 uses the laminated body 16 which contact | abuts to the surface 12a of the base material 12, and laminates | stacks and adheres the protective film 14 as conceptually shown in FIG. 1, the protective film 14 is peeled from the base material 12, and the surface 12 a of the base material 12 is processed to produce a functional film (including an intermediate of the functional film) 20.
The surface 12a of the substrate 12 is a surface to be processed, that is, a surface to be subjected to processing such as film formation and various surface treatments described later.

  The processing apparatus 10 in the illustrated example performs processing of the base material 12 by so-called roll-to-roll (hereinafter also referred to as RtoR), and a long base material 12 (web-shaped base material) The laminate 16 is pulled out from the base roll 24 formed by laminating the long laminate 16 formed by laminating the long protective film 14 in a roll shape, and conveyed in the longitudinal direction. Then, the protective film 14 is peeled off, the surface 12a of the substrate 12 is treated, and the treated substrate 12, that is, the functional film 20 according to the production method of the present invention is again wound into a roll.

The processing apparatus 10 in the illustrated example includes, as an example, a vacuum chamber 26, a rotating shaft 28, a peeling roll 30, a drum 32, a processing unit 34, a winding shaft 36, a guide roller 38, and the like disposed in the vacuum chamber 26. And it has the 2nd winding shaft 40, and the vacuum exhaust means 42 which exhausts the inside of the vacuum chamber 26, and is comprised.
In addition, in the processing apparatus 10 which implements the manufacturing method of the functional film of this invention, in addition to these members, the laminated body 16 and the conveyance guide of the base material 12, various sensors, etc. are used in vacuum. And while conveying the base material 12 to a longitudinal direction, you may have various members arrange | positioned at the apparatus which peels the protective film 14 and processes the surface 12a of the base material 12. FIG.

In the present invention, the base material (substrate) 12 is not particularly limited, and various sheet-like materials can be used as long as film formation and surface treatment in vacuum can be performed.
Specifically, plastic (resin) films made of organic substances such as polyethylene terephthalate (PET), polyethylene naphthalate, polyethylene, polypropylene, polystyrene, polyamide, polyvinyl chloride, polycarbonate, polyacrylonitrile, polyimide, polyacrylate, polymethacrylate, Metal sheets such as aluminum and stainless steel can be suitably used as the substrate 12.

In the present invention, such a plastic film is used as a support, and a protective layer, an adhesive layer, a light reflection layer, a light shielding layer, a planarization layer, a buffer layer, a stress relaxation layer, a gas barrier film, etc. Those having films (layers) for obtaining various functions may be used as the substrate 12. In this case, the surface of these films is usually the surface 12a of the substrate 12.
In this case, a substrate in which only one layer is formed on the support may be used as the substrate 12, or a substrate in which a plurality of layers of the support is formed may be used as the substrate 12. Good. Further, in the case where the substrate 12 is a film in which a plurality of layers are formed on a support, it may have a plurality of the same layers. For example, a combination of a planarization layer and a gas barrier film A film formed by repeatedly stacking a plurality of layers may be repeatedly stacked a plurality of times.

The protective film (laminate film) 14 is for protecting the surface 12a of such a base material 12, and is contact | abutted to the surface 12a and is laminated | stacked on the base material 12.
In the production method of the present invention, as shown in FIG. 2, the protective film 14 has a plurality of through holes 50 and is not particularly limited except that it has a characteristic of sticking force. Various protective films having adhesiveness that are used in the above are available. The through hole 50 and the sticking force will be described in detail later.
Therefore, even if the protective film 14 has an adhesive layer (adhesive layer / adhesive layer) formed on the contact surface with the surface 12a of the substrate 12, the protective film 14 itself has adhesiveness. You may have.

  In consideration of protection of the surface 12a of the base material 12 and prevention of transfer of the unevenness of the protective film 14 to the base material 12, the protection film 14 is more rigid and harder than the base material 12 (surface 12a). It is common to use a low product.

Here, in order to further improve the effect of preventing the peeling electrification, a material (at least the surface of which is less likely to cause peeling electrification between the base 12 and the base 12 or the material of the surface 12a (formation material)). It is preferable to use a protective film 14 formed of a material close to the charged column.
For example, when the substrate 12 is a PET film, the material of the protective film 14 is preferably a polyethylene or polyester material, and when the substrate 12 (the surface) is an acrylic resin, the protective film The material 14 is also preferably an acrylic resin. Further, when the surface of the substrate 12 is silicon nitride or aluminum oxide, the material of the protective film 14 is preferably a nylon resin.

In the processing apparatus 10 of the illustrated example, the base roll 24 formed by winding such a laminate 24 is loaded on the rotary shaft 28.
The laminated body 24 is pulled out from the base roll 24 loaded on the rotary shaft 28 and conveyed in the longitudinal direction, and the protective film 14 is peeled from the base 12 by the peeling roller 30. The base material 12 is conveyed from the peeling roller 30 to the drum 32, and processing such as film formation and surface treatment is performed by the processing device 34.
On the other hand, the protective film 14 peeled off from the base material 12 by the peeling roller 30 is wound up by the second winding shaft 40.

FIG. 3A conceptually shows a contact surface of the protective film 14 with the surface 12a of the base 12.
As shown in FIG. 3A, as an example, the protective film 14 has a plurality of through-holes 50 that are uniformly scattered in a zigzag pattern.
Further, the protective film 14 in the illustrated example is formed, for example, by forming an adhesive layer (adhesive layer / adhesive layer) 54 indicated by hatching in FIG. 3 on the contact surface with the surface 12a. is there. Moreover, as for this protective film 14, the adhesive layer 54 is not formed in the predetermined area | region 52 surrounding the through-hole 50 as a preferable aspect. That is, in this example, as a preferred embodiment, the bonding area between the surface 12 a and the protective film 14 is narrower than the contact area between the surface 12 a and the protective film 14.

  As described above, the production method of the present invention provides a through hole in the protective film 14, and the adhesive strength of the protective film 14 is less than a predetermined value. Preferably, the bonding area between the substrate 12 and the protective film 14 is By setting the contact area to be equal to or smaller than both, the base material 12 and the protective film 14 before peeling are prevented from being spontaneously peeled in vacuum, and the base material 12 and the protective film 14 are peeled off. Peeling electrification can be greatly suppressed.

In order to protect the surface 12a of the base material 12 used for film formation, surface treatment, etc., the protective film is laminated / attached to the base material 12 as described above.
However, it is difficult to completely adhere the base material 12 and the protective film over the entire contact surface, and a gap, that is, a portion where air remains remains between them. When the laminated body (roll of laminated body) of the base material 12 and the protective film having such a gap is loaded into a processing apparatus such as a film forming apparatus and the inside of the apparatus is evacuated, the air remaining in the gap between the two is It expand | swells and the base material 12 and a protective film will peel naturally before a peeling process by expansion | swelling of this air.
On the other hand, as described in Patent Document 1, by laminating / sticking the substrate 12 and the protective film in a vacuum, the gap between the two (that is, residual air between the two) is eliminated, The entire surface can be attached. However, if the base material 12 and the protective film are stuck on the entire surface without any gap, the peeling charge at the time of peeling the base material 12 and the protective film will increase. As a result, due to electrification, the conveyance failure of the base material 12 and the protective film occurs, and there is a possibility that the subsequent processing such as film formation of the base material 12 may be adversely affected.

On the other hand, according to the manufacturing method of the present invention, since the protective film 14 has a large number of through-holes 50, there is a gap (air) between the adhered base 12 and the protective film 14. Thus, even if the air in the gap expands in a vacuum, this air is discharged from the through hole 50. Therefore, before the peeling process of the base material 12 and the protective film 14, it can prevent suitably that natural peeling resulting from the air which exists in both gaps arises.
Moreover, by opening the through-hole 50 in the protective film 14 and further making the adhesive force of the protective film 14 less than 0.1 N / 25 mm, there is no gap between the substrate 12 and the protective film 14, Even if the entire surface of the sticking part is stuck, the peeling charge can be greatly suppressed, and the peeling charge can be stably suppressed to 3 kV or less which is generally preferred.

In the production method of the present invention, the through holes of the protective film 14 may be scattered over the entire surface of the protective film 14, and it is particularly preferable that the through holes are scattered uniformly or substantially uniformly.
In particular, the through hole of the protective film 14 is a through hole 50 shown in FIG. 3A (a through hole 58 in FIG. 3B described later) or a so-called punching metal. It is preferable to form it uniformly on the entire surface. In addition, the arrangement | sequence of the through-hole 50 is not limited to zigzag form, Various arrangement | sequences, such as square parallel, can be utilized.

In the manufacturing method of the present invention, the shape of the through hole is not limited to the circular through hole 50 as shown in FIG. 3A, and various shapes such as a rectangular shape and a polygonal shape can be used. is there.
For example, a long through hole 58 extending in the longitudinal direction (or the direction perpendicular to the longitudinal direction = the width direction of the protective film), such as the protective film 14b shown in FIG. In the example shown in FIG. 3B as well, as a preferred embodiment, the adhesive layer 54 is not formed in the predetermined region 60 surrounding the through hole 58.
Furthermore, the through-holes of the protective film are not limited to the obvious holes (holes) as shown in the illustrated example, and a mesh-like sheet-like material may be used as the protective film 14. Such a porous material may be used as the protective film 14.

Further, the size of the through-hole 50 is not particularly limited, and the protective film 14 can maintain sufficient strength and appropriately protect the surface 12a of the substrate 12 according to the thickness of the protective film 14, and the like. What is necessary is just to set suitably the size which can act as an air vent between the base material 12 and the protective film 14. FIG. Here, according to the study of the present inventor, in order to remove the expanded air quickly and sufficiently, the size of the through hole 50 is preferably 4 mm ² or more.
Further, the sizes (and shapes) of the through holes 50 may be different from each other, but are preferably uniform (substantially uniform) in all the through holes 50.

Here, in the present invention, the total area of the through holes 50 (the total area of all the through holes 50) is 5% or more of the surface area of the protective film 14 when the through holes 50 are considered not to be present. In particular, it is preferably 10% or more. That is, in other words, the total area of the through holes 50 is set to 5% or more, particularly preferably 10% or more, of the projected area of the protective film 14 closing the through holes 50.
By setting the total area of the through-holes 50 within the above range, a sufficient number of through-holes 50 are interspersed on the entire surface of the protective film 14, and natural peeling between the base material 12 and the protective film 14 is more reliably performed. Can be prevented. Moreover, the contact area of the base material 12 and the protective film 14 can be reduced, and peeling electrification can also be reduced more suitably.

Further, the total area of the through holes 50 is 50% or less of the surface area of the protective film 14 (hereinafter, simply referred to as “the area without the protective film 14”), It is preferably 30% or less.
If the total area of the through holes 50 exceeds 50%, the effect of preventing the peeling between the base material and the protective film and the effect of suppressing the peeling charge increase, but the protective area of the base material by the protective film 14 becomes less than half. Therefore, depending on the thickness of the protective film 14, the strength of the base material Z, and the like, there is a high possibility that the protective film 14 cannot sufficiently express the protective function of the base material 12, which is not preferable.

Moreover, the adhesion area of the base material 12 and the protective film 14 is preferably equal to or less than the contact area of the base material 12 and the protective film 14 (the actual surface area of the protective film 14 or less, also referred to as the effective area). It is preferably 70% or less, and more preferably 60% or less of the area of only 14. Moreover, it is preferable that the sticking area of the base material 12 and the protective film 14 is 50% or more of an effective area.
By making the adhesion area of the base material 12 and the protective film 14 within this range, it is possible to more suitably suppress peeling electrification after ensuring sufficient adhesion between the base material 12 and the protective film 14. A favorable result can be obtained in terms of being able to do so.

If the adhesive area of the said base material 12 and the protective film 14 is the protective film 14 which forms an adhesive agent layer on the surface of a support body like the example shown to FIG. 3 (A), as an example It can be easily realized if the adhesive layer is formed by patterning so that it is 70% or less of the assumed area of the protective film 14 and 50% or more of the effective area.
Moreover, as shown in the protective film 14c conceptually shown in FIG. 3C, irregularities are formed on the surface (a contact surface with the substrate surface), and this convex portion is used as a sticking portion. By reducing the contact area itself between the protective film 14c and the protective film 14c, the bonding area of the base material 12 and the protective film 14c is 70% or less of the assumed area of the protective film 14 and 50% or more of the effective area. It may be. In addition, you may make the one part into an adhesion part instead of making all the convex parts into an adhesion part.
Furthermore, you may use together the patterning of an adhesive agent layer, and the unevenness | corrugation on the surface of a protective film.

Here, in the illustrated example, as a preferred embodiment, the adhesive layer 54 is not formed in a predetermined region 52 surrounding the through hole 50 (in the vicinity of the through hole 50). In other words, the protective film 14 of the example of illustration has the through-hole 50 formed in the non-sticking part of the base material 12 and the protective film 14 as a preferable aspect.
In the manufacturing method of the present invention, by having such a configuration, it remains between the base material 12 expanded in vacuum and the protective film 14 and more reliably penetrates the air expanded in vacuum. It becomes possible to discharge from the hole 50.
For the same reason, in the present invention, it is preferable that the non-adhering portion continuous in the surface direction of the contact surface between the substrate 12 and the protective film 14 has at least one through hole.

Furthermore, if the base material 12 and the protective film 14 can be adhered to the entire surface with sufficient adhesive force, the adhesive layer is applied to the entire surface excluding the region 52 as shown in FIG. Instead of coating, the sticking portions may be scattered in an island shape over the entire surface.
According to this structure, since the non-sticking part of the base material 12 and the protective film 14 becomes a state which continues substantially entirely in the surface direction of the contact surface, the base material 12 expanded in vacuum. And the air between the protective film 14 can be more reliably discharged from the through hole 50.

In the production method of the present invention, the adhesive strength of the protective film 14 is less than 0.1 N / 25 mm.
By setting the adhesive strength of the protective film 14 to less than 0.1 N / 25 mm, the peeling charging between the substrate 12 and the protective film 14 can be more reliably prevented.

  There is no particular limitation on the lower limit of the adhesive strength, and it is sufficient that sufficient adhesive strength between the base material 12 and the protective film 14 is obtained. However, in terms of ensuring reliable adhesive strength between the two, 0.01 N / It is preferably 25 mm or more.

As described above, in the processing apparatus 10, the laminated body 16 of the base material 12 and the protective film 14 is pulled out from the base material roll 24 that is pivotally supported by the rotation shaft and is transported in the longitudinal direction, while the peeling roller 30. As a result, the protective film 14 is peeled off from the substrate 12. The base material 12 from which the protective film 14 has been peeled is wound around the drum 32, and the protective film 14 is wound up in a roll shape by the second winding shaft 40.
In the processing apparatus 10, the peeling roller 30 is a known peeling roller that peels off the stuck laminate. That is, in the production method of the present invention, the peeling method (peeling means) between the substrate 12 and the protective film 14 is not particularly limited, and various known peeling methods for the laminated body can be used. is there.

In the manufacturing method of the present invention, as described above, the peeling charge between the base material 12 and the protective film 14 can be greatly suppressed, so the peeling speed between the base material 12 and the protective film 14, that is, the conveyance of the base material 12. The speed can be improved and the productivity of the functional film can be further improved.
Here, the peeling rate between the base material 12 and the protective film 14 is not particularly limited, but is preferably about 0.1 to 10 m / min.
The faster the peeling speed between the base material 12 and the protective film 14 (that is, the transport speed of the base material 12) is, the more easily the peeling electrification occurs. A favorable result can be obtained in terms of ensuring good productivity and the like.

As described above, in the processing apparatus 10, the protective film 14 peeled off by the peeling roller 30 is wound around the second winding shaft 40, and the substrate 12 is conveyed to the drum 32.
The drum 32 is a cylindrical object that conveys the base material 12 in the longitudinal direction while being positioned at a predetermined processing position. The base material 12 is wound around a predetermined region of the drum 32 and is subjected to processing such as film formation and surface treatment by the processing means 34 while being conveyed in the longitudinal direction.

In the method for producing a functional film of the present invention, the treatment applied to the surface 12a of the substrate 12 is not particularly limited, and various film formations and surface treatments performed in a vacuum can be used. These processes may be performed by a known method.
Therefore, the processing means 34 has a known configuration corresponding to the processing applied to the surface of the base material 12 by the processing apparatus 10.

As an example, if the processing apparatus 10 is an apparatus that performs film formation by ICP-CVD (inductively coupled plasma CVD), the processing means 34, an induction coil for forming an induction magnetic field, and a source gas in the film formation region It has a gas supply means and the like for supplying the gas.
If the processing apparatus 10 is an apparatus that forms a film by the CCP-CVD method (capacitive coupling type plasma CVD), the processing means 34 has a hollow shape with a large number of small holes and functions as an electrode and a source gas supply unit. It has a shower electrode, a high-frequency power supply (13.56 MHz, etc.) for supplying plasma excitation power, a source gas supply means, and the like.
If the processing apparatus 10 is an apparatus that forms a film by sputtering, the processing means 34 includes a target holding means, a high-frequency electrode, a sputtering gas supply means, and the like. If the processing means 34 forms a film by reactive sputtering, the processing means 34 is further configured to have a reaction gas supply means.
If the processing apparatus 10 is an apparatus in which the film forming chamber performs film formation by vacuum deposition, the processing means 34 includes an evaporation source (crucible), a heating means for film forming materials such as an electron gun and a resistance heating power source, and an evaporation source. It has a shutter and the like.

Further, the treatment of the surface 12a of the substrate 12 is not limited to film formation, and known surface treatments such as activation, cleaning, roughening, and flattening are also suitable if the treatment is performed in a vacuum. Moreover, the degassing process of the base material 12 can also be suitably used.
As an example, when the processing apparatus 10 is an apparatus that activates or cleans the surface 12a by plasma, the shower electrode, a high-frequency power source (such as 13.56 MHz) that supplies plasma excitation power, and a process gas It has a supply means and the like.
Further, when the processed image value 10 is a device for flattening the surface 12a by thermal annealing or degassing from the base material 12, it has a sheath heater, a thermocouple for measuring temperature, and the like.

Here, according to the manufacturing method of this invention, the surface 12a of the base material 12 can be protected with the protective film 14 until it peels by a predetermined peeling process.
Therefore, it is suitable for applications that require high smoothness on the substrate surface, such as the production of a gas barrier film by forming a gas barrier film.

The vacuum exhaust means 42 exhausts the inside of the vacuum chamber 26 to a predetermined pressure corresponding to the processing to be performed.
The vacuum evacuation means 42 is not particularly limited, and a vacuum pump such as a turbo pump, a mechanical booster pump, a dry pump, and a rotary pump, an auxiliary means such as a cryocoil, a means for adjusting the ultimate vacuum and the exhaust amount, etc. Various known (vacuum) evacuation means used in the vacuum film forming apparatus can be used.

  The base material 12 that has been subjected to processing such as film formation by the processing means 34 while being wound around the drum 32 and conveyed in the longitudinal direction, that is, the functional film 20 according to the manufacturing method of the present invention is guided by the guide roller 38. Then, it is wound around the winding shaft 36 and is again rolled.

Hereinafter, the operation of the processing apparatus 10 shown in FIG. 1 will be described.
As described above, the long laminate 16 is wound into a roll and supplied as the base roll 24.
The substrate roll 24 is rotatably loaded on the rotation shaft 28 of the processing apparatus 10. When the base material roll 24 is loaded on the rotary shaft 28, the laminate 16 is pulled out, and the base material 12 and the protective film 14 are peeled off by the peeling roller 30. The protective film 14 peeled off from the substrate 12 is fed (inserted) through a predetermined transport path that is sent from the peeling roller 30 to the second winding shaft 40 and wound around. On the other hand, the base material 12 is wound around a predetermined region of the drum 32 from the peeling roller 30, guided by the guide roller 38, and passed through a predetermined conveyance path wound around the winding shaft 36.

When the passing of the laminate 16, the base material 12, and the protective film 14 is finished, the vacuum chamber 26 is closed, and the vacuum exhaust means 42 is driven to start exhausting the vacuum chamber 26. In parallel, in the processing means 34, preparation for processing to be performed on the surface 12a of the substrate 12 is started.
When the inside of the vacuum chamber 26 is stabilized at a predetermined pressure and the processing means 34 is ready to perform processing, winding by the winding shaft 36 and the second winding shaft 40 and transport of the substrate 12 by the drum 32 are performed. In addition, the feeding of the laminated body 16 from the base material roll 24 by the rotating shaft 28 is performed in synchronization, and the transport of the base material 12 and the like is started.

If conveyance of the base material 12 etc. is stabilized, the process of the surface 12a of the base material 12 will be started.
Thereby, peeling the base material 12 and the protective film 14 while transporting the laminate 16 in the longitudinal direction, winding the protective film 14 around the second winding shaft 40, and transporting the base material 12 in the longitudinal direction. However, the processing means 34 processes the substrate 12 such as film formation. In addition, the processed base material 12, that is, the functional film 20 by the manufacturing method of the present invention is wound around the winding shaft 36 to be a roll of the functional film 20.

Here, in the processing apparatus 10 that implements the manufacturing method of the present invention, since the protective film 14 has the through hole 50, the pressure between the substrate 12 and the protective film 14 of the laminate 16 is reduced by the reduced pressure in the vacuum chamber 26. Even if air expands, it is suitably excluded from the through hole 50. Therefore, before the base material 12 and the protective film 14 are peeled off by the peeling roller 30, the base material 12 and the protective film 14 are not naturally peeled off. Can protect properly.
Moreover, since it has the through-hole 50 and the sticking area is equal to or smaller than the contact area between the base material 12 and the protective film 14, it is possible to greatly suppress peeling charging that occurs when peeling by the peeling roller 30. it can. Therefore, the conveyance of the base material 12 and the protective film 14 does not become unstable due to charging, and the processing of the base material 12 by the processing means 34 can be stably performed without adverse effects due to the charging.

  As mentioned above, although the manufacturing method of the functional film of this invention was demonstrated in detail, this invention is not limited to the said Example, Even if various improvement and a change are performed in the range which does not deviate from the summary of this invention. Of course it is good.

  For example, the example shown in FIG. 1 is an example in which the manufacturing method of the present invention is applied to an apparatus that performs processing while winding a substrate around a drum 32 and transporting it in the longitudinal direction. There is no limitation. For example, the present invention can be suitably used for an apparatus that peels off a protective film and processes the surface of a substrate while conveying a long laminate linearly in the longitudinal direction using a pair of conveying rollers or the like. It is.

Hereinafter, the present invention will be described in more detail with reference to specific examples of the present invention.
[Example 1]
A polyethylene terephthalate film having a thickness of 100 μm and a width of 700 mm was prepared as the substrate 12.
Moreover, as a pressure-sensitive adhesive sheet for the protective film 14, PAC-3-50THK manufactured by Sanei Kaken Co., Ltd. having a width of 700 mm was prepared. The adhesive strength of this adhesive sheet is 0.05 N / 25 mm.
In this adhesive sheet, through holes 50 were formed in a staggered manner as shown in FIG. The total area of the through holes 50 was 5% of the area where only the protective film 14 (adhesive sheet) before the through holes 50 were formed. Furthermore, as shown in FIG. 3A, the adhesive layer around the through hole 50 was removed, and the adhesive area between the protective sheet 14 and the substrate 12 was adjusted. In this example, the sticking area was 75% of the non-existing area of the protective film 14 and 79% of the effective area of the protective film 14.

The adhesive layer of the protective film 14 was brought into contact with the surface 12a of the substrate 12 and laminated, and pressed with a roller to form a laminate 16.
Moreover, this laminated body 16 was wound in roll shape, and it was set as the base material roll 24. FIG.

The substrate roll 24 is attached to the rotating shaft 28 of the processing apparatus 10 shown in FIG. 1, and the laminate 16 is pulled out from the substrate roll 24 to the peeling roller 30 as described above. And the protective film 14 are peeled off, the protective film 14 is passed from the peeling roller 30 to the second winding shaft 40, and the substrate 12 is passed from the peeling roller 30 through the drum 32 and the guide roller 38 to the winding shaft 36. I passed the paper.
In addition, a charge amount measuring unit 64 is disposed in the vicinity of the conveyance path of the base material 12 from the peeling roller 30 to the drum 32. The charge amount measuring means 64 used was a precision static electricity measuring device “STATIRON DS3” manufactured by Sicid Static.

After completing the sheet passing, the vacuum chamber 26 was closed and the vacuum exhaust means 42 was driven.
When the pressure in the vacuum chamber 26 was stabilized at 5 × 10 ⁻⁴ Pa, conveyance of the laminate 16, the base material 12, and the protective film 14 was started.
The presence / absence of bubbles, adhesive strength, and peel charge amount were evaluated. Moreover, comprehensive evaluation was also performed from these evaluation results.
The evaluation is as follows. The presence / absence of air bubbles and the adhesive strength were evaluated by visually observing the laminate 16 in the path from the removal window formed in the vacuum chamber 26 to the base roll 24 to the peeling roll 30. The amount is evaluated from the charge amount of the substrate 12 measured by the charge amount measuring means 64.

Air bubbles: A case where no air bubbles were generated between the substrate 12 and the protective film 14 was evaluated as “◯”, and a case where air bubbles were generated was evaluated as “X”.
Adhesive strength: The case where there was no peeling between the substrate 12 and the protective film 14 not caused by bubbles at the end was evaluated as “◯”, and the case where there was peeling was evaluated as “X”.
Release charge amount: Less than 2 kV was evaluated as “◯”, 2-3 kV as “Δ”, and over 3 kV as “×”.
Comprehensive evaluation: All the above three evaluations were evaluated as “◯” for those with “◯”, “△” for those with at least one “△”, and “×” with at least one “×”.
Table 1 below shows the area of the through holes with respect to the area where only the protective film 14 is present, the adhesion area with respect to the deemed area, the adhesion area with respect to the effective area, and the evaluation results.

[Examples 2 to 15 and Comparative Examples 1 to 3]
The size of the through-hole 50 is adjusted to adjust the total area of the through-hole 50 relative to the area where only the protective film 14 is present, and the removal amount of the adhesive layer of the protective film 14 is adjusted to A substrate roll 24 was produced in the same manner as in Example 1 except that the sticking area with respect to the deemed area and the effective area was adjusted.
The base material roll 24 was passed through / conveyed to the processing apparatus 10 in the same manner as in Example 1, and bubbles, adhesive strength, and charge amount were evaluated in the same manner as in Example, and overall evaluation was performed.
The area of the through-hole with respect to the area where only the protective film 14 is present, the adhesion area with respect to the deemed area, the adhesion area with respect to the effective area, and the evaluation results are also shown in Table 1 below.

[Comparative Example 4 and Comparative Example 5]
The protective film 14 is changed to PAC-4-50 (adhesive strength 0.1 N / 25 mm) manufactured by Sanei Kaken Co., Ltd., and the size of the through-hole 50 is adjusted, so that the total area of the through-hole is protected. 14 and 10% of the area where only the adhesive layer is removed, and the removal amount of the adhesive layer is adjusted so that the adhesive area is 60% of the area where only the adhesive sheet is present and 67% of the effective area ( In Comparative Example 4), the protective film 14 was changed to PAC-4K-50 (adhesive strength 0.19 N / 25 mm) manufactured by Sanei Kaken Co., Ltd. The total area is set to 30% of the area where only the protective film 14 is present, and the removal amount of the adhesive layer is adjusted, so that the adhesive area is 70% of the area where only the adhesive sheet is present and 100% of the effective area. % (Comparative Example 4) was the same as in Example 1 except that It was produced Lumpur 24.
The base material roll 24 was passed through / conveyed to the processing apparatus 10 in the same manner as in Example 1, and bubbles, adhesive strength, and charge amount were evaluated in the same manner as in Example, and overall evaluation was performed.
The area of the through-hole with respect to the area where only the protective film 14 is present, the adhesion area with respect to the deemed area, the adhesion area with respect to the effective area, and the evaluation results are also shown in Table 1 below.

As shown in Table 1 above, the method for producing the functional film of the present invention in which the area of the through-hole 50 is 5% or more with respect to the area of the protective film and the adhesive strength is less than 0.1 N / 25 mm. According to the above, generation of bubbles between the base material 12 and the protective film 14, separation of the two can be suitably prevented, and peeling charging can be suppressed.
In particular, Examples 2, 3, 6, 7, 10, 11, 13, and 14 in which the sticking area is 70% or less of the assumed area of the protective film 14 and 50% or more of the effective area are bubbles, adhesion Good results have been obtained for both strength and peel charge.
On the other hand, in Comparative Examples 1 to 3 in which the area of the through-hole 50 is less than 5% with respect to the area without the protective film, bubbles are generated between the base material 12 and the protective film 14, Comparative Examples 4 and 5 in which the adhesive strength of the protective film 14 is too strong have a large peel charge.
From the above results, the effects of the present invention are clear.

  The present invention can be suitably used for the production of a functional film for forming a film that exhibits a predetermined function on the surface of the substrate, such as the production of a gas barrier film for forming a gas barrier film on the surface of the substrate.

DESCRIPTION OF SYMBOLS 10 Processing apparatus 12 Base material 14 Protective film 16 Laminated body 20 Functional film 24 Base material roll 26 Vacuum chamber 28 Rotating shaft 30 Peeling roller 32 Drum 36 Winding shaft 38 Guide roller 40 2nd winding shaft 42 Vacuum exhaust means 50, 58 Through-hole 52, 60 area 54 Adhesive layer 64 Charge amount measuring means

Claims (9)

In a vacuum, a laminate formed by laminating a protective film having adhesive properties on the surface to be treated of the substrate is drawn out from a laminate roll obtained by winding the laminate into a roll shape, and the length While transporting in the direction, peeling the protective film from the laminate, and when processing the surface to be processed of the substrate,
The protective film has a plurality of through-holes, and the total area of the through-holes is 5% or more of the surface area of the protective film when it is considered that there are no through-holes. The manufacturing method of the functional film characterized by using the protective film smaller than 0.1 N / 25mm.   2. The method for producing a functional film according to claim 1, wherein an adhesion area between the protective film and the substrate is 70% or less of a surface area of the protective film when it is considered that there is no through hole.   The method for producing a functional film according to claim 1 or 2, wherein an adhesion area between the protective film and the substrate is 50% or more of a contact area between the protective film and the substrate.   The method for producing a functional film according to any one of claims 1 to 3, wherein an adhesion area between the protective film and the substrate is equal to or less than a contact area between the protective film and the substrate.   The manufacturing method of the functional film in any one of Claims 1-4 in which the through-hole of the said protective film is formed in the non-sticking part of the said protective film.   The method for producing a functional film according to claim 1, wherein the treatment of the surface to be treated of the substrate is film formation.   The said protective film is a manufacturing method of the functional film in any one of Claims 1-6 in which an unevenness | corrugation is formed in the contact surface with a base material, and this convex part is a sticking part.   The method for producing a functional film according to claim 1, wherein one or more through-holes are formed in a continuous non-sticking portion of the protective film.   The manufacturing method of the functional film in any one of Claims 1-8 to which the sticking part of the said protective film is dotted in island shape.