JP5363892B2 - Capacitor device - Google Patents

Capacitor device Download PDF

Info

Publication number
JP5363892B2
JP5363892B2 JP2009158926A JP2009158926A JP5363892B2 JP 5363892 B2 JP5363892 B2 JP 5363892B2 JP 2009158926 A JP2009158926 A JP 2009158926A JP 2009158926 A JP2009158926 A JP 2009158926A JP 5363892 B2 JP5363892 B2 JP 5363892B2
Authority
JP
Japan
Prior art keywords
capacitor
conductor plate
series
conductor
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009158926A
Other languages
Japanese (ja)
Other versions
JP2011014788A (en
Inventor
巌 倉田
和久 松永
昇 亀田
敏夫 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP2009158926A priority Critical patent/JP5363892B2/en
Publication of JP2011014788A publication Critical patent/JP2011014788A/en
Application granted granted Critical
Publication of JP5363892B2 publication Critical patent/JP5363892B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

この発明は誘導加熱装置,電縫管溶接機などに適用し、その高周波電源(インバータ装置)の出力回路に接続する整合用コンデンサを対象としたコンデンサ装置の組立構造に関する。   The present invention relates to an assembly structure of a capacitor device that is applied to an induction heating device, an electric resistance welder, and the like, and is intended for a matching capacitor connected to an output circuit of the high-frequency power source (inverter device).

よく知られているように、頭記の誘導加熱装置では高周波電源の出力端と誘導加熱コイル(ワークコイル)との間に配線した主回路導体(ブスバー)に整合用コンデンサを接続し、この整合用コンデンサとワークコイルとで負荷インピーダンスの変動に対応する整合回路(マッチング用の共振回路)を構成してワークコイルに供給する電力の効率化を図るようにしている(例えば、非特許文献1参照)。   As is well known, in the induction heating device described above, a matching capacitor is connected to the main circuit conductor (bus bar) wired between the output end of the high frequency power supply and the induction heating coil (work coil). A matching circuit (matching resonance circuit) corresponding to fluctuations in load impedance is configured by the capacitor for work and the work coil so as to increase the efficiency of power supplied to the work coil (for example, see Non-Patent Document 1). ).

この整合用のコンデンサは、誘導加熱装置の出力(電力,電流)に対応する容量を確保するために、導体板に複数のコンデンサ素子を実装して直,並列に接続したコンデンサ装置が使用されており、次にその従来例の組立構造を図7、および図8に示す。なお、各図において(a)は組立構造の平面図、(b)はその側視断面図であり、1は外部電極を両端に備えた円筒形,あるいは角筒形のコンデンサ素子(例えば、フィルムコンデンサ)、2,3はそれぞれ導体端部に主回路のブスバーに接続する入出力の端子部2a,3aを設けたL形の導体板、4は前記端子部2a,3aとの中間に配した直列接続用の渡り接続板を表す。   In order to secure a capacity corresponding to the output (power, current) of the induction heating device, a capacitor device in which a plurality of capacitor elements are mounted on a conductor plate and connected in parallel is used as this matching capacitor. Next, the assembly structure of the conventional example is shown in FIGS. In each figure, (a) is a plan view of the assembly structure, (b) is a side sectional view thereof, and 1 is a cylindrical or rectangular tube capacitor element (for example, a film) having external electrodes at both ends. (Capacitors), 2 and 3 are L-shaped conductor plates provided with input / output terminal portions 2a and 3a connected to the bus bars of the main circuit at the conductor ends, respectively, and 4 is arranged in the middle of the terminal portions 2a and 3a. Represents a connecting plate for series connection.

図示例は12個のコンデンサ素子1を前記導体板2,3とU字形の渡り接続板4との間に配列して「6並列」,「2直列」のコンデンサユニット(コンデンサ素子の単位集合体)を構成しており、このコンデンサ装置は前記の端子導体板2,3の端子部2a,3aを介して主回路(例えば、誘導加熱装置の高周波電源の出力回路)のブスバーに接続して使用する。なお、前記端子部2a,3aは主回路のブスバー導体幅に合わせた寸法幅とし、コンデンサ素子1を実装する部分の導体幅はコンデンサ素子の並列数に対応して端子部2a,3aから扇状に拡大させている。   In the illustrated example, twelve capacitor elements 1 are arranged between the conductor plates 2 and 3 and the U-shaped cross connection plate 4 to form “6 parallel” and “2 series” capacitor units (unit assembly of capacitor elements). This capacitor device is connected to the bus bar of the main circuit (for example, the output circuit of the high frequency power source of the induction heating device) via the terminal portions 2a and 3a of the terminal conductor plates 2 and 3 and used. To do. The terminal portions 2a and 3a are sized to match the bus bar conductor width of the main circuit, and the conductor width of the portion where the capacitor element 1 is mounted is fanned from the terminal portions 2a and 3a corresponding to the number of capacitor elements in parallel. It is expanding.

そして、図7の構成では導体板2,3と渡り接続板4との間にそれぞれ6個のコンデンサ素子1を横一列に並べて実装している。これに対して、図8の構成では6個のコンデンサ素子1を上下二段に並べて装置のコンパクト化を図るようにしている。   In the configuration of FIG. 7, six capacitor elements 1 are mounted in a horizontal row between the conductor plates 2 and 3 and the cross connection plate 4. On the other hand, in the configuration of FIG. 8, the six capacitor elements 1 are arranged in two upper and lower stages to make the apparatus compact.

また、前記構造とは別に、コンデンサ装置全体の低インダクタンス化を狙いに、その入,出力端子の導体板を向かい合わせに近接配置した上で、この導体板に並列接続するコンデンサ素子を導体板の長手方向に沿ってその側方に近接並置し、入,出力端子導体板の間,および該導体板とコンデンサ素子との間で相互インダクタンスのキャンセル分を大きくしてコンデンサ装置全体のインダクタンス値を低減するようにした組立構造も知られている(特許文献1参照)。   In addition to the above structure, with the aim of lowering the inductance of the entire capacitor device, the conductor plates of the input and output terminals are arranged in close proximity to each other, and a capacitor element connected in parallel to this conductor plate is arranged on the conductor plate. Adjacent to each other along the longitudinal direction, and the mutual inductance cancellation between the input and output terminal conductor plates and between the conductor plate and the capacitor element is increased to reduce the inductance value of the entire capacitor device. An assembly structure is also known (see Patent Document 1).

特開 平9-260180号公報JP-A-9-260180

倉田 巖、他2名、「誘導加熱用高周波インバータ」、富士時報、Vol.80 No.2 P.135−140 2007年3月、富士電機ホールディングス株式会社発行Atsushi Kurata and two others, "High Frequency Inverter for Induction Heating", Fuji Jiho, Vol.80 No.2 P.135-140 March 2007, published by Fuji Electric Holdings Co., Ltd.

ところで、前記した従来装置の組立構造では、入出力端子の導体板2,3を経て各コンデンサ素子1に流れる電流がアンバランスとなって一部のコンデンサ素子に電流が集中し、このためにコンデンサ素子に流れるリップル電流が許容値を超えて素子の寿命が低下したり、破壊されるといったトラブルを引き起こすことがある。   By the way, in the assembly structure of the conventional device described above, the current flowing through the capacitor elements 1 via the conductor plates 2 and 3 of the input / output terminals becomes unbalanced, and the current concentrates on some capacitor elements. The ripple current flowing through the element may exceed a permissible value, leading to a problem that the life of the element is reduced or destroyed.

すなわち、図7(a),(b)の構成では入出力の端子部から導体板2,3および渡り接続板4を経て各コンデンサ素子1に流れる電流Iは図中に矢印で表すようなルートを辿る。ここで、入出力の端子部2a,3aを起点として各コンデンサ素子1を経由するルートの距離を比較すると、明らかに導体板2,3の中央側に並ぶコンデンサ素子1と比べて導体板の外側(両サイド)に並ぶコンデンサ素子を通るルートの距離が大である。一方、前記の各ルートに沿った導体のインダクタンス値はルートの距離に比例することから、このインダクタンス値の差異により電流Iは導体板2,3の中央部位(図中に点線で表した領域P)に並ぶコンデンサ素子1に集中して流れるようになる。このような電流の集中現象は、特に主回路に高周波電流を流した場合に顕著に現れる。   That is, in the configuration of FIGS. 7A and 7B, the current I flowing from the input / output terminal portion to each capacitor element 1 through the conductor plates 2 and 3 and the cross connection plate 4 is a route represented by an arrow in the figure. Follow. Here, when comparing the distances of the routes passing through the capacitor elements 1 starting from the input / output terminal portions 2a and 3a, it is clear that the outer side of the conductor plate is larger than the capacitor elements 1 arranged on the center side of the conductor plates 2 and 3. The distance of the route that passes through the capacitor elements arranged on both sides is large. On the other hand, since the inductance value of the conductor along each route is proportional to the distance of the route, the current I is caused by the difference in the inductance value in the central portion of the conductor plates 2 and 3 (region P indicated by the dotted line in the figure). ) Flow in a concentrated manner on the capacitor elements 1 arranged in a row. Such a current concentration phenomenon becomes prominent particularly when a high-frequency current is passed through the main circuit.

なお、図7(c)は前記した電流ルートをモデル化した定数回路を表す図で、図中に表したL2,L3,L4はそれぞれ導体板2,3および渡り接続板4の各コンデンサ素子1に通じるルートに沿った導体インダクタンスを表し、その濃淡はインダクタンス値の大きさ(濃淡の濃い方がインダクタンス値大)を表している。   FIG. 7C is a diagram showing a constant circuit in which the above-described current route is modeled. L2, L3, and L4 shown in the figure are the capacitor elements 1 of the conductor plates 2 and 3 and the transition connection plate 4, respectively. Represents the conductor inductance along the route leading to, and the shading represents the magnitude of the inductance value (the darker the shading, the larger the inductance value).

また、図8(a),(b)の組立構造においても、上下二段に分けてL形導体板2,3およびU形渡り接続板4の間に実装した各コンデンサ素子1に流れる電流の経路について、前記と同様に導体板2,3の入出力端子部2a,3aを起点とした各コンデンサ素子を通るルートの距離を比較すると、下段側に比べて上段側のコンデンサ素子を経由するルートの距離が長くなり、この電流経路の長さの差に起因して電流は下段側に並ぶコンデンサ素子に集中するようになる。   8A and 8B, the current flowing through each capacitor element 1 mounted between the L-shaped conductor plates 2 and 3 and the U-shaped cross-connecting plate 4 is divided into two upper and lower stages. As for the routes, when the distances of the routes through the capacitor elements starting from the input / output terminal portions 2a and 3a of the conductor plates 2 and 3 are compared in the same manner as described above, the route passing through the capacitor elements on the upper stage side compared to the lower stage side. , And the current concentrates on the capacitor elements arranged on the lower side due to the difference in the length of the current path.

さらに、先記の特許文献1に開示の組立構造においても、その入出力端子導体の端子部を起点として入出力端子導体の長手方向に並べて並列接続した各コンデンサ素子を経由する電流経路の距離、したがって導体のインダクタンスが異なるため、このインダクタンスの差に起因して端子部に近い領域に接続したコンデンサ素子に電流が集中し易くなる。   Further, in the assembly structure disclosed in the above-mentioned Patent Document 1, the distance of the current path passing through the capacitor elements arranged in parallel in the longitudinal direction of the input / output terminal conductor starting from the terminal portion of the input / output terminal conductor, Therefore, since the inductances of the conductors are different, current tends to concentrate on the capacitor element connected to the region close to the terminal portion due to the difference in inductance.

この発明は上記の点に鑑みなされたものであり、その目的は入出力端子に連なる導体板に実装して直列,並列に接続したコンデンサ素子について、各コンデンサ素子に流れる電流のアンバランスを低減して一部のコンデンサ素子に電流が集中するのを防ぐように組立構造を改良したコンデンサ装置を提供することにある。   The present invention has been made in view of the above points, and an object of the present invention is to reduce the unbalance of the current flowing through each capacitor element in a capacitor element that is mounted on a conductor plate connected to an input / output terminal and connected in series and in parallel. Another object of the present invention is to provide a capacitor device having an improved assembly structure so as to prevent current from concentrating on some capacitor elements.

前記の目的を達成するために、この発明によれば、それぞれ上下両端に外部電極を備えた複数個のコンデンサ素子を導体板に実装して各コンデンサ素子の間を直,並列に接続したコンデンサ装置であって、
並列数に対応する個数のコンデンサ素子を二つの並列グループに分け、そのコンデンサ素子を左右列に振り分けて主導体板上にその下端の電極を接して並置搭載し、前記主導体板を中央に挟んでその左右両側に直列導体板を近接配置し、この直列導体板上にそれぞれ前記主導体板に搭載した左右各列のコンデンサ素子に直列接続するコンデンサ素子を、その下端の端子を接して搭載し、この直列導体板上に搭載したコンデンサ素子と前記主導体板に搭載した左右列のコンデンサ素子の間に跨って前記各コンデンサの上端の端子に接して渡り接続板を配設してコンデンサの集合ユニットを構成し、入出力端子の一方の端子部は前記主導体板の一端側から引き出し、他方の端子部は、前記主導体板の端子部と反対側から引き出し、これらの入出力端子部を介して主回路に接続する(請求項1)。

In order to achieve the above object, according to the present invention, a capacitor device in which a plurality of capacitor elements each having external electrodes on both upper and lower ends are mounted on a conductor plate and the capacitor elements are connected directly and in parallel. Because
The number of capacitor elements corresponding to the number in parallel is divided into two parallel groups, the capacitor elements are divided into left and right columns, and the lower electrode is in contact with the main conductor plate and mounted in parallel, with the main conductor plate sandwiched in the center. in the series conductor plate closely placed on the left and right sides, a capacitor element connected in series with the capacitor element of the right and left columns mounted in the series conductor plate on each of the main body plate, mounted in contact with the terminals of the lower end The capacitor assembly is formed by disposing a connecting plate in contact with the upper terminal of each capacitor across the capacitor elements mounted on the series conductor plate and the left and right capacitor elements mounted on the main conductor plate. configure unit, one terminal of the input and output terminals drawn out from one end of the main body plate, the other terminal portion, the drawer from the side opposite the terminal portion of the main body plate, these input and output Connected to the main circuit via the terminal portion (claim 1).

また、この発明によれば、前記構成になるコンデンサの集合ユニットを基本として、コンデンサ装置を次記のような態様で構成することができる。
(1)前記した入出力端子の一方の端子部を主導体板の長手方向の一端に設けるとともに、他方の端子部は主導体板の左右側方に配置した直列導体板のうち最外側に並ぶ直列導体板の相互間に跨って主導体板の端子部と反対側に引き出す(請求項2)。
(2)主導体板,直列導体板の背面を対向させて2組のコンデンサ集合ユニットを背中合わせに近接配置した上で、各組の集合ユニットをそのユニットに設けた入出力端子部を介して主回路の往路導体,復路導体に直列接続して使用する(請求項3)。
(3)主導体板,直列導体板の背面を対向させて2組のコンデンサ集合ユニットを背中合わせに近接配置し、かつ各組の集合ユニットの最外側に並ぶ直列導体板の間に接続板を介挿してユニット相互間を接続した上で、各組のコンデンサ集合ユニットの主導体板に設けた入出力端子部を介して主回路に並列接続して使用する(請求項4)。
(4)前記の主導体板の左右側方に配した直列導体板をそれぞれ複数の導体板に分けた上で、各導体板に直列のコンデンサ素子を搭載するとともに、隣接する導体板の相互間に跨って該導体板に搭載したコンデンサ素子の間に渡り接続板を配設する(請求項5)。
In addition, according to the present invention, the capacitor device can be configured in the following manner on the basis of the capacitor aggregate unit configured as described above.
(1) One terminal portion of the input / output terminal described above is provided at one end in the longitudinal direction of the main conductor plate, and the other terminal portion is arranged on the outermost side among the serial conductor plates arranged on the left and right sides of the main conductor plate. It is drawn out to the opposite side of the terminal portion of the main conductor plate across the series conductor plates (Claim 2).
(2) Two sets of capacitor aggregate units are placed close to each other with the back surfaces of the main conductor plate and series conductor plate facing each other, and each set of aggregate units is connected to the main via the input / output terminal section provided on the unit. It is used by being connected in series with the forward conductor and the return conductor of the circuit.
(3) Two sets of capacitor assembly units are placed close to each other with the back surfaces of the main conductor plate and the series conductor plate facing each other, and a connection plate is interposed between the series conductor plates arranged on the outermost side of each set of assembly units. The units are connected to each other and then used in parallel with the main circuit via input / output terminal portions provided on the main conductor plate of each set of capacitor assembly units.
(4) After dividing the series conductor plates arranged on the left and right sides of the main conductor plate into a plurality of conductor plates, a series capacitor element is mounted on each conductor plate, and between adjacent conductor plates A connecting plate is disposed between the capacitor elements mounted on the conductor plate across the gap (Claim 5).

上記したこの発明の構成により次記の効果を奏する。
(1)コンデンサ集合ユニットの入出力端子部を起点として主導体板,直列導体板に実装した各コンデンサ素子を経由する電流経路のルートに対応する導体インダクタンスのバラツキを抑えて各コンデンサ素子に流れる電流のバランス性を高め、一部のコンデンサ素子に電流が集中して通流する不具合を防いで信頼性の向上が図れる。
(2)また、2組のコンデンサ集合ユニットを背中合わせに近接配置した上で、その集合ユニットに設けた入出力端子部を介して主回路に接続するようにした請求項3,4の構成によれば、互いに近接対向するコンデンサ集合ユニットの導体板の間で、その導体インダクタンスのキャンセル分を高めてコンデンサ装置全体のインダクタンスを低減できる。
(3)さらに、主導体板の左右側方に配置した直列導体板をそれぞれ複数枚の導体板に分けて各導体板に直列コンデンサ素子を搭載した上で、隣接する導体板の相互間に跨って該導体板に搭載したコンデンサ素子の間に渡り接続板を配設した請求項5の構成によれば、導体板の分割数に合わせてコンデンサ素子の直列接続数を増減することが可能となる。
The above-described configuration of the present invention provides the following effects.
(1) Current flowing through each capacitor element while suppressing variations in conductor inductance corresponding to the route of the current path passing through each capacitor element mounted on the main conductor plate and series conductor plate starting from the input / output terminal portion of the capacitor assembly unit This improves the balance and improves the reliability by preventing the trouble that current flows through some capacitor elements.
(2) Further, according to the configuration of claims 3 and 4, two capacitor aggregate units are arranged close to each other and connected to the main circuit via an input / output terminal portion provided in the aggregate unit. For example, it is possible to reduce the inductance of the entire capacitor device by increasing the amount of cancellation of the conductor inductance between the conductor plates of the capacitor assembly units that are close to each other.
(3) Furthermore, the series conductor plates arranged on the left and right sides of the main conductor plate are divided into a plurality of conductor plates, and a series capacitor element is mounted on each conductor plate, and straddles between adjacent conductor plates. According to the structure of claim 5 in which the connecting plate is disposed between the capacitor elements mounted on the conductor plate, the number of capacitor elements connected in series can be increased or decreased in accordance with the number of divisions of the conductor plate. .

この発明の第1実施例によるコンデンサ装置を表す図であり、(a)は組立構造の斜視図、(b)は(a)の正面図、(c)は等価回路図である。It is a figure showing the capacitor | condenser apparatus by 1st Example of this invention, (a) is a perspective view of an assembly structure, (b) is a front view of (a), (c) is an equivalent circuit schematic. 図1(c)に対応する定数回路図である。FIG. 2 is a constant circuit diagram corresponding to FIG. 図1のコンデンサ装置を整合用コンデンサとして誘導加熱装置の出力回路に接続した状態を表す回路図である。It is a circuit diagram showing the state which connected the capacitor | condenser apparatus of FIG. 1 to the output circuit of the induction heating apparatus as a matching capacitor. 本発明の第2実施例によるコンデンサ装置を表す図であり、(a)は組立構造の斜視図、(b)は(a)の正面図、(c)は誘導加熱装置の出力回路に接続したコンデンサ装置の等価回路図である。It is a figure showing the capacitor | condenser apparatus by 2nd Example of this invention, (a) is a perspective view of an assembly structure, (b) is a front view of (a), (c) is connected to the output circuit of the induction heating apparatus. It is an equivalent circuit diagram of a capacitor device. 図1における渡り接続板を変更した応用実施例の模式平面図である。It is a schematic plan view of the application Example which changed the transition connection board in FIG. 図1における直列導体板の枚数を変更した応用実施例の構成図であり、(a)は導体板,コンデンサ素子の配列を表す模式平面図、(b)はその等価回路図である。FIG. 2 is a configuration diagram of an application example in which the number of series conductor plates in FIG. 1 is changed, (a) is a schematic plan view showing an arrangement of conductor plates and capacitor elements, and (b) is an equivalent circuit diagram thereof. コンデンサ装置の従来例の構成図であり、(a)は平面図、(b)は側視断面図、(c)定数回路図である。It is a block diagram of the prior art example of a capacitor | condenser apparatus, (a) is a top view, (b) is side sectional drawing, (c) It is a constant circuit diagram. 図7と異なる従来例の構成図であり、(a)は平面図、(b)は側視断面図である。It is a block diagram of the prior art example different from FIG. 7, (a) is a top view, (b) is side sectional drawing.

以下、この発明によるコンデンサ装置の実施の形態を図1〜図6に示す実施例に基づいて説明する。   DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a capacitor device according to the present invention will be described below based on the examples shown in FIGS.

まず、この発明の請求項1,2,4に対応する実施例1の組立構造を図1(a),(b)に示す。この実施例は同じ組立構造になる2組のコンデンサ集合ユニットAとBを背中合わせに近接配置してコンデンサ装置を構成している。なお、このコンデンサ装置の等価回路を図1(c)に示す。   First, the assembly structure of Embodiment 1 corresponding to claims 1, 2, and 4 of the present invention is shown in FIGS. In this embodiment, two capacitor assembly units A and B having the same assembly structure are arranged close to each other back to back to constitute a capacitor device. An equivalent circuit of this capacitor device is shown in FIG.

ここで、コンデンサ集合ユニットA,Bは、図7,図8に示した従来例の装置と同じく12個のコンデンサ素子1を次記のように主導体板5,直列導体板6に振り分けて搭載し、そのコンデンサ素子の間を渡り接続板7により直列接続して「6並列」,「2直列」のコンデンサ回路を形成しており、次にその詳細構造を説明する。   Here, in the capacitor assembly units A and B, 12 capacitor elements 1 are distributed and mounted on the main conductor plate 5 and the series conductor plate 6 as described below, as in the conventional apparatus shown in FIGS. The capacitor elements are connected in series by the connecting plate 7 to form “6-parallel” and “2-series” capacitor circuits. Next, the detailed structure will be described.

すなわち、主導体板5は前後方向に長い短冊状の銅板でその長手方向の一端には入出力端子の端子部5aが形成されており、この主導体板5の板面上には並列個数(6個)のコンデンサ素子1を3個ずつ二つのグループに分けた上で、各グループのコンデンサ素子1を左右列に振り分けて主導体板5の上に並置搭載し、コンデンサ素子1の電極面を導体板に半田接合している。また、主導体板5を中央に挟んでその左右側方には板面を揃えて2枚の直列導体板6を近接配置し、この直列導体板6にはそれぞれ直列のコンデンサ素子1を3個ずつ前後方向に並べて実装している。   That is, the main conductor plate 5 is a strip-shaped copper plate that is long in the front-rear direction, and a terminal portion 5a of an input / output terminal is formed at one end in the longitudinal direction. (6) capacitor elements 1 are divided into two groups of three, and the capacitor elements 1 of each group are divided into left and right rows and mounted side by side on the main conductor plate 5. Soldered to the conductor plate. Further, two series conductor plates 6 are arranged in close proximity with the main conductor plate 5 sandwiched in the center on the left and right sides, and three series capacitor elements 1 are arranged on each series conductor plate 6. They are mounted side by side in the front-rear direction.

そして、主導体板5に実装した左列の3個のコンデンサ素子1と左側の直列導体板6に実装した3個のコンデンサ素子1との間、および主導体板5に実装した右列の3個のコンデンサ素子1と右側の直列導体板6に実装した3個のコンデンサ素子1との間に跨ってその上に一枚板の渡り接続板7を配設し、この渡り接続板7を各コンデンサ素子1の電極に接合する。さらに、主導体板5の左右側方に配置した直列導体板6の間に跨がり、主導体板5の端子部5aとは反対側の端部にU字形導体で作られた入出力端子板8を接合してコンデンサ集合ユニットA,Bを構築している。   And between the three capacitor elements 1 in the left column mounted on the main conductor plate 5 and the three capacitor elements 1 mounted in the left series conductor plate 6 and in the right column 3 mounted on the main conductor plate 5. A single jumper connection plate 7 is disposed between the capacitor elements 1 and the three capacitor elements 1 mounted on the right series conductor plate 6. Bonded to the electrode of the capacitor element 1. Further, an input / output terminal plate which is formed of a U-shaped conductor at the end opposite to the terminal portion 5a of the main conductor plate 5 and straddling between the series conductor plates 6 arranged on the left and right sides of the main conductor plate 5. The capacitor assembly units A and B are constructed by joining 8 together.

ここで、図7(c)に示した従来例の定数回路と対比して、図1(a),(b)の構成になるコンデンサ集合ユニットA,Bの定数回路を表すと図2のようになる。図2において、L5,L6,L7はそれぞれ直,並列に接続した各コンデンサ素子1を経由するルート(電流経路)に対応する前記主導体板5,直列導体板6,渡り接続板7の導体インダクタンスを表している。この定数回路においては、入出力の端子部5a,8を起点として各ルートに沿った導体インダクタンスの合計(L5+L6+L7)はどのルートを経由しても一定であり、これにより図7,図8の従来例で述べたような電流のアンバランスに起因して一部のコンデンサ素子1に電流が集中して流れる不具合を解消できる。   Here, in contrast to the constant circuit of the conventional example shown in FIG. 7C, the constant circuit of the capacitor aggregate units A and B configured as shown in FIGS. 1A and 1B is shown in FIG. become. In FIG. 2, L5, L6, and L7 are conductor inductances of the main conductor plate 5, the series conductor plate 6, and the crossover connection plate 7 corresponding to the route (current path) passing through the capacitor elements 1 connected in series and in parallel, respectively. Represents. In this constant circuit, the total of the conductor inductances (L5 + L6 + L7) along each route starting from the input / output terminal portions 5a, 8 is constant regardless of the route, and as a result, the conventional circuit shown in FIGS. It is possible to solve the problem that current concentrates on some capacitor elements 1 due to current imbalance as described in the example.

また、先記のように主導体板5,直列導体板6の背面(コンデンサ素子1の搭載面と反対側)を互いに対向させてコンデンサ集合ユニットAとBを向かい合わせに近接配置したコンデンサ装置(図1参照)を例えば誘導加熱装置に適用し、図3のように誘導加熱装置の高周波電源(インバータ装置)9の出力端と誘導加熱コイル(ワークコイル)10との間に配線したバー導体の往路と復路に直列接続して整合回路を構成することにより下記のような効果も得られる。すなわち、図3の回路では集合ユニットAと集合ユニットBには互いに逆方向に電流が流れるので、導体間の近接効果により集合ユニットAとBの間で導体インダクタンスがキャンセルされ、コンデンサ装置全体のインダクタンスを低減できる。   Further, as described above, a capacitor device (capacitor assembly unit A and B are arranged in close proximity to each other with the back surfaces of the main conductor plate 5 and the series conductor plate 6 (opposite the mounting surface of the capacitor element 1) facing each other (see FIG. 1) is applied to, for example, an induction heating device, and a bar conductor wired between an output end of a high frequency power source (inverter device) 9 of the induction heating device and an induction heating coil (work coil) 10 as shown in FIG. The following effects can also be obtained by configuring the matching circuit by connecting the forward path and the backward path in series. That is, in the circuit of FIG. 3, currents flow in the opposite directions to the collective unit A and the collective unit B, so the conductor inductance is canceled between the collective units A and B due to the proximity effect between the conductors, and the inductance of the entire capacitor device Can be reduced.

なお、この実施例では2組のコンデンサ集合ユニットAとBを近接配置するように組み合わせて誘導加熱装置の回路に接続しているが、その配置,用途これに限定されるものではなく、例えばコンデンサ集合ユニットAとBを個別に分けて単独使用するようにしてもよい。また、コンデンサ素子1の並列接続数についても、図示実施例のように必ずしも偶数に決めて半分に分けたコンデンサ素子1のグループを主導体板5の左右に等分ずつ分けて実装する必要はなく、主導体板5の左右列に配分して実装するコンデンサ素子1の個数が異なっていてもよい。   In this embodiment, the two capacitor assembly units A and B are combined so as to be closely arranged and connected to the circuit of the induction heating device. However, the arrangement and application are not limited to this, for example, a capacitor The collective units A and B may be individually used separately. Also, the number of capacitor elements 1 connected in parallel does not necessarily need to be divided into equal parts on the left and right sides of the main conductor plate 5 and mounted in half as in the illustrated embodiment. The number of capacitor elements 1 to be distributed and mounted on the left and right rows of the main conductor plate 5 may be different.

次に、この発明の請求項4に係わる実施例2を図4(a)〜(c)に基づいて説明する。この実施例では、先記の実施例1と同様にコンデンサ素子1を主導体板5,直列導体板6に搭載し、渡り接続板7によりコンデンサ素子1の間を相互接続して構築した2組のコンデンサ集合ユニットAとBを互いに背中合わせに近接配置した上で、各組の集合ユニットAとBとの間を、直列導体板6の間に介挿したユニット接続板11(直列導体5と同じ長さの導体片)により相互接続してコンデンサ装置を構築するようにしている。その上で、この実施例のコンデンサ装置を例えば誘導加熱装置の整合用コンデンサとして、図2(c)で示すようにその高周波電源回路9の出力回路に並列接続して使用する。   Next, a second embodiment according to the fourth aspect of the present invention will be described with reference to FIGS. In this embodiment, the capacitor element 1 is mounted on the main conductor plate 5 and the series conductor plate 6 in the same manner as in the first embodiment, and the capacitor elements 1 are connected to each other by the crossover connection plate 7. Unit connection plates 11 (same as the series conductors 5), the capacitor assembly units A and B of the first and second units are arranged close to each other back to back, and the assembly units A and B of each set are interposed between the series conductor plates 6. The capacitor device is constructed by interconnecting the conductor pieces with a length). Then, the capacitor device of this embodiment is used as a matching capacitor for an induction heating device, for example, connected in parallel to the output circuit of the high frequency power supply circuit 9 as shown in FIG.

この実施例においても、先記実施例1で述べたと同様に各コンデンサ素子1に流れる電流のアンバランスを低減して一部のコンデンサ素子に電流が集中する不具合を防ぐことができ、また2組のコンデンサ集合ユニットAとBを背中合わせに近接配置することで、コンデンサ装置の低インダクタンス化が図れる。   In this embodiment as well, as described in the first embodiment, it is possible to reduce the unbalance of the current flowing through each capacitor element 1 to prevent the current from being concentrated on some capacitor elements. By arranging the capacitor assembly units A and B close to each other back to back, the inductance of the capacitor device can be reduced.

次に、実施例1,2で述べたコンデンサ集合ユニットA,Bの組立構造おいて、その渡り接続板7を変更した応用実施例を図5に示す。すなわち、図1,図4に示した組立構造では、主導体板5と直列導体板6との間に跨って3個のコンデンサ素子1の上に配設した渡り接続板7を一枚の板で構成しているが、これを図5の破線で表すように複数枚(3枚)の渡り接続板7a〜7cに分けて直列接続するコンデンサ素子1の間を個別に接続することもできる。   Next, FIG. 5 shows an application example in which the connecting plate 7 is changed in the assembly structure of the capacitor assembly units A and B described in the first and second embodiments. That is, in the assembly structure shown in FIG. 1 and FIG. 4, the cross connection plate 7 disposed on the three capacitor elements 1 across the main conductor plate 5 and the series conductor plate 6 is provided as a single plate. However, as shown by a broken line in FIG. 5, it is also possible to individually connect the capacitor elements 1 that are connected in series by dividing into a plurality (three) of the transition connection plates 7 a to 7 c.

次に、先記の各実施例で主導体板5の左右側方に近接配置した直列導体6の枚数,配列を変更してコンデンサ素子の直列接続数を変えるようにしたこの発明の請求項5に対応する実施例を図6(a),(b)で説明する。   Next, in each of the embodiments described above, the number and arrangement of the series conductors 6 arranged close to the left and right sides of the main conductor plate 5 are changed to change the number of series connection of the capacitor elements. An embodiment corresponding to the above will be described with reference to FIGS.

すなわち、先記の実施例1,2ではコンデンサ素子1の直列数を「2」として2枚の直列導体6を主導体板5の左右側方に振り分けて配置している。これに対して、図6の実施例ではコンデンサ素子1の直列接続数を「2」から「4」に変更するために、主導体板5とその左右側方に配した直列導体板6bとの間に新たな直列導体板6aを介挿して直列導体板の枚数を合計4枚とし、かつ新たに追加した直列導体板6aには6個のコンデンサ素子1を左右二列に分けて実装した上で、主導体板5/直列導体板6a/直列導体板6bの間に跨って配設した渡り接続板7を介してコンデンサ素子1の間を直列接続するようにしている。これにより、コンデンサ装置の等価回路は図6(b)のようになる。   That is, in the first and second embodiments, the number of series of capacitor elements 1 is “2”, and the two series conductors 6 are distributed and arranged on the left and right sides of the main conductor plate 5. On the other hand, in the embodiment of FIG. 6, in order to change the number of capacitor elements 1 connected in series from “2” to “4”, the main conductor plate 5 and the series conductor plates 6b arranged on the left and right sides thereof are arranged. A new series conductor plate 6a is interposed in between, so that the total number of series conductor plates is four, and six capacitor elements 1 are mounted on the newly added series conductor plate 6a in two left and right rows. Thus, the capacitor elements 1 are connected in series via the cross connection plate 7 disposed between the main conductor plate 5 / the series conductor plate 6a / the series conductor plate 6b. Thereby, an equivalent circuit of the capacitor device is as shown in FIG.

なお、図6の実施例では直列接続板の合計枚数を4枚としてコンデンサ素子1の直列数を「4」としているが、直列導体板の枚数をさらに変えることにより、先記実施例と同様に各コンデンサ素子に流れる電流のアンバランス,局部集中を抑制しつつ、直列導体板の枚数に合わせてコンデンサ素子の直列数を増減することができる。   In the embodiment of FIG. 6, the total number of series connection plates is 4 and the number of series of capacitor elements 1 is “4”. However, by changing the number of series conductor plates further, the same as in the previous embodiment. The number of capacitor elements in series can be increased or decreased according to the number of series conductor plates while suppressing unbalance and local concentration of currents flowing through the capacitor elements.

1 コンデンサ素子
5 主導体板
5a 主導体板の入出力端子部
6,6a,6b 直列導体板
7,7a,7b,7c 渡り接続板
8 直列導体板の入出力端子板
9 コンデンサ集合ユニット間の接続板
A,B コンデンサ集合ユニット
DESCRIPTION OF SYMBOLS 1 Capacitor element 5 Main conductor plate 5a Input / output terminal part of main conductor plate 6, 6a, 6b Series conductor plate 7, 7a, 7b, 7c Cross connection plate 8 Input / output terminal plate of series conductor plate 9 Connection between capacitor assembly units Plate A, B Capacitor assembly unit

Claims (5)

それぞれ上下両端に外部電極を備えた複数個のコンデンサ素子を導体板に実装して各コンデンサ素子の間を直,並列に接続したコンデンサ装置であって、
並列数に対応する個数のコンデンサ素子を二つの並列グループに分け、そのコンデンサ素子を左右列に振り分けて主導体板上にその下端の電極を接して並置搭載し、前記主導体板を中央に挟んでその左右両側に直列導体板を近接配置し、この直列導体板上にそれぞれ前記主導体板に搭載した左右各列のコンデンサ素子に直列接続するコンデンサ素子を、その下端の端子を接して搭載し、この直列導体板上に搭載したコンデンサ素子と前記主導体板に搭載した左右列のコンデンサ素子の間に跨って前記各コンデンサの上端の端子に接して渡り接続板を配設してコンデンサの集合ユニットを構成し、入出力端子の一方の端子部は前記主導体板の一端側から引き出し、他方の端子部は、前記主導体板の端子部と反対側から引き出し、これらの入出力端子部を介して主回路に接続することを特徴とするコンデンサ装置。
A capacitor device in which a plurality of capacitor elements each having external electrodes on both upper and lower ends are mounted on a conductor plate, and the capacitor elements are connected directly and in parallel,
The number of capacitor elements corresponding to the number in parallel is divided into two parallel groups, the capacitor elements are divided into left and right columns, and the lower electrode is in contact with the main conductor plate and mounted in parallel, with the main conductor plate sandwiched in the center. in the series conductor plate closely placed on the left and right sides, a capacitor element connected in series with the capacitor element of the right and left columns mounted in the series conductor plate on each of the main body plate, mounted in contact with the terminals of the lower end The capacitor assembly is formed by disposing a connecting plate in contact with the upper terminal of each capacitor across the capacitor elements mounted on the series conductor plate and the left and right capacitor elements mounted on the main conductor plate. configure unit, one terminal of the input and output terminals drawn out from one end of the main body plate, the other terminal portion, the drawer from the side opposite the terminal portion of the main body plate, these input and output Capacitor and wherein the connecting to the main circuit through the terminal part.
請求項1に記載のコンデンサ装置において、入出力端子の一方の端子部を主導体板の長手方向の一端に設けるとともに、他方の端子部は主導体板の左右側方に配置した直列導体板のうち最外側に並ぶ直列導体板の相互間に跨って主導体板の端子部と反対側に引き出したことを特徴とするコンデンサ装置。   2. The capacitor device according to claim 1, wherein one terminal portion of the input / output terminal is provided at one end in the longitudinal direction of the main conductor plate, and the other terminal portion is a series conductor plate disposed on the left and right sides of the main conductor plate. The capacitor | condenser apparatus characterized by pulling out on the opposite side to the terminal part of the main conductor board across between the serial conductor boards arranged in the outermost among them. 請求項1または2に記載のコンデンサ装置において、主導体板,直列導体板の背面を対向させて2組のコンデンサ集合ユニットを背中合わせに近接配置した上で、各組のコンデンサ集合ユニットをその集合ユニットに設けた入出力端子部を介して主回路の往路導体,復路導体に直列接続して使用することを特徴とするコンデンサ装置。   3. The capacitor device according to claim 1 or 2, wherein two sets of capacitor aggregate units are arranged close to each other with the back surfaces of the main conductor plate and the series conductor plate facing each other, and each set of capacitor aggregate units is set to the aggregate unit. A capacitor device, wherein the capacitor device is used by being connected in series to the forward conductor and the return conductor of the main circuit via the input / output terminal portion provided in the circuit. 請求項1に記載のコンデンサ装置において、主導体板,直列導体板の背面を対向させて2組のコンデンサ集合ユニットを背中合わせに近接配置し、かつ各組のコンデンサ集合ユニットの最外側に並ぶ直列導体板の間にユニット接続板を介挿して集合ユニット相互間を接続した上で、各組のコンデンサ集合ユニットの主導体板に設けた入出力端子部を介して主回路に並列接続したことを特徴とするコンデンサ装置。   2. The capacitor device according to claim 1, wherein two sets of capacitor assembly units are arranged close to each other back to back with the main conductor plate and the back surface of the series conductor plate facing each other, and are arranged on the outermost side of each set of capacitor assembly units. The unit connecting plates are inserted between the plates to connect the collective units, and then connected in parallel to the main circuit via the input / output terminal portions provided on the main conductor plate of each set of capacitor collective units. Capacitor device. 請求項1ないし4のいずれかの項に記載のコンデンサ装置において、主導体板の左右側方に配置した直列導体板をそれぞれ複数の導体板に分けた上で、各導体板に直列のコンデンサ素子を搭載するとともに、隣接する導体板の相互間に跨って該導体板に搭載したコンデンサ素子の間に渡り接続板を配設したことを特徴とするコンデンサ装置。   5. The capacitor device according to claim 1, wherein a series conductor plate arranged on the left and right sides of the main conductor plate is divided into a plurality of conductor plates, and a capacitor element in series with each conductor plate. And a connecting plate disposed between the capacitor elements mounted on the conductor plate across the adjacent conductor plates.
JP2009158926A 2009-07-03 2009-07-03 Capacitor device Active JP5363892B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009158926A JP5363892B2 (en) 2009-07-03 2009-07-03 Capacitor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009158926A JP5363892B2 (en) 2009-07-03 2009-07-03 Capacitor device

Publications (2)

Publication Number Publication Date
JP2011014788A JP2011014788A (en) 2011-01-20
JP5363892B2 true JP5363892B2 (en) 2013-12-11

Family

ID=43593385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009158926A Active JP5363892B2 (en) 2009-07-03 2009-07-03 Capacitor device

Country Status (1)

Country Link
JP (1) JP5363892B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6128924B2 (en) * 2013-04-11 2017-05-17 三菱電機株式会社 High frequency noise countermeasure power supply circuit

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825034U (en) * 1981-08-08 1983-02-17 ティーディーケイ株式会社 Capacitor mounting structure
JP2564858Y2 (en) * 1991-06-19 1998-03-11 株式会社東芝 Inverter device
JPH07307244A (en) * 1994-05-12 1995-11-21 Toshiba Corp Capacitor unit
JP3697594B2 (en) * 1996-03-19 2005-09-21 株式会社指月電機製作所 Low inductance capacitor
JPH09320891A (en) * 1996-05-27 1997-12-12 Nissin Electric Co Ltd Capacitor device
JP2000082635A (en) * 1998-09-04 2000-03-21 Toshiba Corp Capacitor circuit device

Also Published As

Publication number Publication date
JP2011014788A (en) 2011-01-20

Similar Documents

Publication Publication Date Title
JP3906440B2 (en) Semiconductor power converter
CN103545282B (en) Insulated gate bipolar thyristor module and electrode power terminal
EP3203625A1 (en) Electric power conversion apparatus
JP4668301B2 (en) Power converter
JP6805865B2 (en) Output side connection structure of single-phase inverter
CN107425737B (en) Power module, converter and wind generating set
JP2015139270A (en) Power conversion device
JP2006203974A (en) Wiring structure of power converter
JP2017118693A (en) Power supply device for induction heating
JP5363892B2 (en) Capacitor device
EP1433204B1 (en) Device with power semiconductor components for controlling the power of high currents and use of said device
JPH114584A (en) Inverter device
JP2007151286A (en) Power conversion device
JPH01194344A (en) Parallel connection of power transistors
JP6997345B2 (en) Smoothing circuit and smoothing circuit board
JP5138714B2 (en) Power semiconductor device
JP7062979B2 (en) Power supply
JP6658915B2 (en) Power converter
JP4587378B2 (en) Laminated conductor
JP2017112682A (en) Three-level power conversion device
JP7354629B2 (en) Flying capacitor circuits, circuit modules and power conversion equipment
JP7313976B2 (en) caseless film capacitor
JPH07307244A (en) Capacitor unit
JP6786943B2 (en) Capacitor device
JP4828170B2 (en) Power converter

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120601

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20130422

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20130422

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130529

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130618

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130813

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130903

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130906

R150 Certificate of patent or registration of utility model

Ref document number: 5363892

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250