JP5357816B2 - Identification mark applying method, printed circuit board drilling machine, and program - Google Patents

Description

  The present invention relates to a method for applying an identification mark in a workpiece that is processed by stacking a plurality of workpieces having the same shape, a printed circuit board drilling machine that implements the applying method, and a program for executing the applying method.

  When processing a printed circuit board, it is generally performed to improve processing efficiency by stacking a plurality of printed circuit boards and processing the plurality of printed circuit boards simultaneously. When drilling a hole in a printed circuit board, the drill may bend inside the workpiece. In such a case, even if the hole position processed in the printed circuit board on the surface side close to the drill is within the allowable tolerance, the hole position processed in the lower layer printed circuit board may deviate from the allowable tolerance.

  Moreover, when finishing the cutout part (cavity part) provided in the printed circuit board with the end mill, the end mill may be bent by the cutting resistance. In such a case, even if the dimension of the cut-out part processed on the printed circuit board on the front side is an allowable tolerance, the length of the cut-out part processed on the lower-layer printed board may be shortened and deviate from the allowable tolerance. .

  In this way, since it is the lowermost workpiece that is likely to deviate from the machining tolerance, if the lowermost workpiece is processed within the allowable tolerance, the remaining workpiece processed at the same time is processed within the allowable tolerance. Can be considered. Therefore, the inspection time can be shortened by first inspecting the lowermost workpiece.

  Therefore, conventionally, when a printed circuit board that has been processed is removed from the processing table, the operator displays the number of sheets such as the first sheet (bottom stage), the second sheet,... Was written.

  As a known technique, for example, the invention described in Patent Document 1 or 2 is known. However, Patent Document 1 (FIG. 8) proposes to identify stacked substrates (batch) using through holes, but the order of the substrates in the batch is unknown. Further, in Patent Document 2, it is proposed that the side end faces of the printed circuit boards stacked so that a V-shaped identification pattern appears is formed to form an identification mark to identify the type and order of the printed circuit boards. Since the printed circuit board drilling machine does not have a space for installing the printed circuit board so as to process the side end face, it is necessary to use a dedicated router processing machine or laser processing machine.

JP-A-4-82650 JP 2004-214472 A

  If the operator writes the number display on the margin of each printed circuit board as in the prior art described above, the operator may forget to write the order in which the printed circuit boards are stacked. In the case of a multi-axis printed circuit board processing machine, since the number of workpieces is large, writing takes time.

  Therefore, the problem to be solved by the present invention is to make it possible to attach the identification mark in a short time without causing the omission of the description of the identification mark and without using a dedicated processing machine.

  In order to solve the above-mentioned problems, the present invention is a method for applying an identification mark in which a plurality of workpieces having the same shape are stacked, and an identification mark is applied to a workpiece to be drilled by a punching means, wherein the workpieces are stacked In this state, a number of holes corresponding to the number of the workpieces are drilled from the surface of the workpiece to a predetermined depth corresponding to the number of workpieces, and a mark for identifying the overlapping position of the workpieces is given to each workpiece. It is characterized by that.

  In this case, the identification mark is formed as a number of through holes corresponding to the stacking order of the workpieces, or as a number of through holes obtained by subtracting 1 from the number corresponding to the stacking order of the workpieces. Further, the punching means for giving the identification mark is a tool used for machining the workpiece, and the identification mark is given between the start of machining of the workpiece and the end of machining.

  According to the present invention, the omission of the description of the identification mark does not occur, and the identification mark can be attached in a short time without using a dedicated processing machine, so that the processing efficiency is improved.

It is a figure showing the whole printed circuit board drilling machine composition concerning a 1st embodiment of the present invention. It is a flowchart which shows operation | movement of the CNC apparatus in the 1st Embodiment of this invention. It is sectional drawing of the workpiece | work which shows the formation process of an identification mark. It is a top view of the workpiece | work which attached the identification mark. It is a flowchart which shows operation | movement of the CNC apparatus in the 2nd Embodiment of this invention.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a diagram showing an overall configuration of a printed circuit board drilling machine according to an embodiment of the present invention. In the figure, a printed circuit board drilling machine includes a table 2 on which a workpiece 1 is placed, a linear guide device 3 for the table 2, a bed 4 for supporting the linear guide device 3, and an X-axis motor 5 for moving the table 2. A column 6 fixed on the bed 4, a slider 7 movably installed on the column 6, a Y-axis motor 8 that moves the slider 7, a saddle 10, and a Z-axis motor that moves the saddle 10. 11, a drill 20 rotatably held by the spindle 21, a pressure foot 23 disposed on the tip side of the spindle 21, a pair of cylinders 24 that respectively support both ends of the pressure foot 23, and a machining program instruction, A CNC device 25 for controlling the movement of the table 2, the slider 7 and the saddle 10 is provided.

  The table 2 on which the work 1 is placed is supported by a pair of linear guide devices 3 and is movable on the bed 4 in the front-rear X direction perpendicular to the paper surface. The X-axis motor 5 moves the table 2 via a ball screw (not shown). The column 6 is fixed on the bed 4. The slider 7 is supported by a linear guide device (not shown) and is movable on the column 6 in the left and right Y directions in the figure. The Y-axis motor 8 moves the slider 7 via the ball screw 9. The saddle 10 is supported by a linear guide device (not shown) and is movable on the slider 7 in the vertical ZY direction. The Z-axis motor 11 moves the saddle 10 via the ball screw 12. A drill 20 as a tool is rotatably held on a spindle 21. The spindle 21 is held by the saddle 10 via a holder 22. A pressure foot 23 is disposed on the tip side of the spindle 21. The other ends of the pair of cylinders 24 that respectively support both ends of the pressure foot 23 are fixed to the saddle 10. The cylinder 24 always urges the pressure foot 23 downward in the drawing. The CNC device 25 controls the movement of the table 2, the slider 7 and the saddle 10 in accordance with the instructions of the machining program.

  When machining, a drill having a diameter specified by a machining program is selected from a drill holding device (not shown) and held on the spindle 21, and then the table 2 and the slider 7 are moved to drill on the axis of the hole to be machined. After the 20 axes are matched, the saddle 10 is moved in the Z direction and drilling is performed with the drill 20.

  FIG. 2 is a flowchart showing the operation of the CNC device 25. Here, the identification mark is a through hole, the through hole is formed in parallel with the Y axis, and the opening of the through hole is arranged in the X axis direction. In the machining program, the coordinates P1 (x1, y1) of the center of the first through hole, the pitch m of the hole, the drill diameter d for machining the hole, and a margin allowance α described later, Is described. Further, a lower plate S having a thickness T is disposed between the lowermost (first) work 1 and the table 2 so as to prevent the surface of the table 2 from being damaged.

  Prior to the processing, the board thickness t (here, 1.6 mm) of the printed board and the number N (three here) of the printed board are input in advance. When the processing is started, it is checked whether or not the substrate overlap position information drilling command (ie, the command for attaching an identification mark to the workpiece) (step S10). Is set to N (step S20), and 1 is substituted for i representing the overlapping position of the substrates (step S30).

Next, the processing depth H is set to H = tn + α
(Step S40), the axis of the drill 20 is positioned at the coordinates Pi (x1, y1 + (i-1) m) of the first identification mark (Step S50), and then the machining depth H (H = tn + α) ) Is processed (step S60). In this operation, the process from step 40 to step 60 is repeated while i representing the overlapping position of the substrates is smaller than the overlapping number N (steps S70, S80, S90). Then, it is confirmed whether or not the processing can be completed when i representing the overlapping position of the substrates becomes equal to the number N of stacked substrates (step S100). If there is a next processing, the processing after step S10 is repeated. If the processing is finished, the processing is finished as it is. If it is not a substrate overlap position information drilling command in step S10, normal processing is performed in step S200, and the processing is continued until this processing is completed (step S100).

  FIG. 3 is a cross-sectional view of the work showing the process of forming the identification mark. FIG. 4 is a plan view of a workpiece with an identification mark. FIG. 4A shows the third printed board, FIG. 4B shows the second printed board, and FIG. 4C shows the first printed board.

  As shown in FIG. 3, when i = 1, through holes 50 are drilled at all coordinates P1 (x1, y1) of the first to third printed circuit boards 1-1, 1-2, 1-3. The When i = 2, the through hole 51 is drilled at the coordinates P2 (x1, y1 + m) of the second to third printed circuit boards 1-2 and 1-3. When i = 3, the through-hole 52 is processed at the coordinates P3 (x1, y1 + 2m) only on the third printed circuit board 1-3. As a result, as shown in FIG. 4, the first (bottom) printed circuit board has one through hole 50, and the second (middle) printed circuit board has two through holes 50 and 51. Three through holes 50, 51, and 52 are respectively formed in the third (uppermost) printed circuit board. Therefore, the processed through-hole 50 is one printed circuit board 1-1, and the processed through-holes 50 and 51 are two printed circuit boards 1-2. Thus, it can be easily identified that the three printed boards 1-3 having the processed through holes 50, 51, 52 are the uppermost printed boards. Note that one bottomed hole 51a and 52a are formed in the first and second printed boards 1-1 and 1-2, respectively, but here, the holes are identified by the number of through holes. The reason why the through hole is used as an identification mark is that it can be easily identified by, for example, a transmission type optical sensor.

  Thus, the bottomed holes 51a and 52a are formed in the first and second printed circuit boards 1-1 and 1-2, but the depth of cut of the drill 20 is set in consideration of the apex angle of the drill 20. It is necessary to decide. The apex angle of the drill 20 is usually 118 degrees. Accordingly, when the diameter of the drill 20 is d, if α is 0.3 d or more, through holes can be formed in n printed boards. When α is larger than the thickness t of the printed board and the thickness T of the lower plate S, it is sufficient to make the drill diameter d thinner.

  In this embodiment, the pitch of the through holes 50, 51, 52 is input assuming that the through holes are arranged in parallel with the Y axis. However, the coordinates of all the through holes can be specified by a machining program. .

  Moreover, it is not necessary to prepare the drill 20 which processes the through-holes 50, 51, 52 separately, and any of those used for processing the workpiece 1 may be used.

  Next, a second embodiment of the present invention will be described with reference to FIG. In addition, the same thing as 1st Embodiment attaches | subjects the same code | symbol, and abbreviate | omits the overlapping description.

  In the first embodiment, one through hole 50 is made in the first printed board. However, in the second embodiment, the first printed board has a hole of 0, One hole is made in the printed circuit board, and (N-1) holes are made in the Nth printed circuit board. In the case of punching in this way, the overlap number N may be set to (N-1), so the process shown in the flowchart of FIG. 5 may be executed with the overlap number being N-1 (step S25) ( Step S75). However, in the case of (N-1), the bottomed hole may not be formed in the first printed circuit board by performing the process of step S22.

1 Workpiece 1-1, 1-2, 1-3 Printed circuit board 20 Drill 21 Spindle 50, 51, 52 Through hole 50m, 51m, 52m Identification mark

Claims (7)

It is a method for applying an identification mark, in which a plurality of workpieces having the same shape are stacked, and an identification mark is added to a workpiece to be drilled by a punching means,
In a state where the workpieces are stacked, a number of holes corresponding to the number of the workpieces are drilled from the workpiece surface to a predetermined depth corresponding to the number of the workpieces,
A method for applying an identification mark, characterized in that a mark for identifying the overlapping position of the workpiece is added to each workpiece. An identification mark applying method according to claim 1,
The identification mark applying method, wherein the identification mark is the number of through holes corresponding to the order in which the workpieces are stacked. An identification mark applying method according to claim 1,
The identification mark applying method, wherein the identification mark is the number of through holes obtained by subtracting 1 from the number corresponding to the stacking order of the workpieces. A method for applying an identification mark according to any one of claims 1 to 3,
The method for providing an identification mark, wherein the punching means is a tool used for processing the workpiece. A method for applying an identification mark according to any one of claims 1 to 4,
A method for applying an identification mark, characterized in that the identification mark is attached between the start of processing of the workpiece and the end of processing. A printed circuit board drilling machine comprising a control device for performing the identification mark applying method according to claim 1. A program for controlling the identification mark applying method according to claim 1.

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