JP5357100B2 - Force sensor package and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a force sensor package enabling cost reduction and a manufacturing method of the same. <P>SOLUTION: The force sensor package comprises: a sensor substrate where a plurality of piezoresistance elements are formed to detect electrically a displacement magnitude which is caused when a load is applied via pressure receiving parts protrusively provided on a substrate surface; and a base substrate on which an electric wiring part connecting with the plurality of piezoresistance elements is formed. The force sensor package is provided by fixedly bonding the base substrate joined by the sensor substrate to a package substrate. The sensor substrate and the base substrate on the package substrate are covered by encapsulation resin in a manner that a height of a front face of the encapsulation resin is lower than that of sensor substrate. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a force sensor package for measuring a load and a manufacturing method thereof.

  In recent years, force sensors for load measurement are used for user interfaces such as touch panels and controllers of mobile devices. There are various force sensors. For example, in the piezoresistive method shown in FIG. 11, a silicon substrate 110 having a diaphragm portion, a bridge circuit (not shown) including a plurality of gauge resistors provided on the diaphragm portion, and a diaphragm portion. A pressure receiving portion 112 made of a sphere projecting above, and the diaphragm portion is displaced according to the load received through the pressure receiving portion 112, and the output of the bridge circuit changes according to the displacement amount. Is detected. A force sensor having a conventional structure is also described in Patent Document 1.

Japanese Patent Publication No. 5-77304

  This force sensor is bonded and fixed to a plastic case 201, and a lead frame 126 provided on the case 201 and an electrode pad of a bridge circuit formed on the silicon substrate 110 are connected by a bonding wire 140 and then covered with a plastic cover 202. By exposing only the pressure receiving portion 112 from the hole 202a provided in the cover 202, the sensor package is obtained. However, if the plastic case 201 and the cover 202 are used, the cost is excessive.

  It is an object of the present invention to obtain a force sensor package and a manufacturing method thereof that can reduce the cost.

  According to the present invention, if a sealing resin is used, a package structure that covers the sensor structure portion with the pressure receiving portion exposed can be realized easily and inexpensively, and the sensor substrate is not completely covered with the sealing resin. It was completed by paying attention to the fact that if the step is provided between the surface and the surface of the sealing resin, the sensor structure is not affected by the sealing resin.

  That is, the present invention provides a sensor substrate on which a plurality of piezoresistive elements that are displaced when receiving a load via a pressure receiving portion projecting from the substrate surface and electrically detect the amount of displacement are formed; A sensor structure part that is joined to a base substrate on which an electrical wiring part electrically connected to the piezoresistive element is formed, and this sensor structure part is bonded and fixed to the package substrate via the base substrate In the force sensor package, the sensor substrate and the base substrate on the package substrate are covered with a sealing resin, and the surface of the sealing resin is provided lower than the surface of the sensor substrate.

  When the electrical wiring part of the base substrate and the package substrate are electrically connected by a bonding wire, it is practical to provide the bonding wire lower than the sensor substrate surface. According to this aspect, the bonding wire is completely covered and protected by the sealing resin.

  Preferably, the package substrate is provided with a fixing terminal on a surface opposite to the surface on which the sensor structure portion is bonded and fixed so as to overlap with the bonding fixing position of the sensor structure portion in a plane. According to this aspect, the package substrate can be fixed using the fixing terminals, and the sensor structure that receives the load can be stably supported.

  The package substrate is provided with a plurality of SMD terminals for electrically connecting the package substrate and an external circuit on a surface provided with the fixing terminals, and one of the plurality of SMD terminals and the fixing terminal are provided. Can also be used.

  According to the aspect of the manufacturing method of the present invention, there are formed a plurality of piezoresistive elements that are displaced when a load is received through a pressure receiving portion protruding from the substrate surface and that electrically detects the amount of displacement. A plurality of sensor structure parts formed by bonding a sensor substrate and a base substrate on which an electrical wiring part electrically connected to the plurality of piezoresistive elements is formed; and Bonding and fixing on the package substrate via the base substrate of the sensor structure portion, and electrically connecting the electrical wiring portion of the base substrate and the package substrate in each sensor structure portion, and a number of sensors on the package substrate A step of covering the substrate and the base substrate with a sealing resin and providing the surface of the sealing resin lower than the surface of the sensor substrate; and the package substrate comprising a single sensor structure unit. It is characterized by a step of cutting.

  The sealing step includes a step of installing a package substrate in which the plurality of sensor structures are bonded and fixed to a lower mold of the mold, and a surface of the upper mold on the side facing the package substrate Mounting a release film having a thickness larger than the protruding height of the pressure receiving portion, bringing the upper mold close to the lower mold, and placing the release film on the pressure receiving portions of the multiple sensor structures And a step of contacting the surface of the sensor substrate, a step of filling the cavity formed between the release film and the package substrate with the sealing resin in the contact state, and after the curing of the sealing resin, It is preferable to have a step of removing the release film and the upper and lower molds. According to this collective molding process, a large number of sensor structures can be simultaneously sealed on a single package substrate, and productivity is improved.

  According to the present invention, since the surface of the sealing resin covering the sensor substrate and the base substrate on the package substrate is provided lower than the sensor substrate surface, the package structure in which the pressure receiving part is exposed on the package surface can be easily and inexpensively realized. In addition, the sealing resin does not adversely affect the sensor characteristics. Thereby, it is possible to provide a force sensor package and a manufacturing method thereof that can reduce the cost.

It is sectional drawing which shows one Embodiment of the force sensor package to which this invention is applied. It is an external appearance perspective view which shows the force sensor package. It is a top view which shows the back surface (joint surface) of a sensor board | substrate. It is a top view which shows the surface (joining surface) of a base substrate. It is a top view which shows the terminal part of the outer surface of a package board | substrate. It is a top view which shows the modification (a)-(c) of a package terminal. It is sectional drawing which shows 1 process of the manufacturing method of the force sensor package by this invention. It is sectional drawing which shows the next process of FIG. It is sectional drawing which shows the next process of FIG. FIG. 10 is a cross-sectional view showing the next step of FIG. 9. It is the (a) perspective view and (b) sectional view showing the force sensor package of the conventional structure.

  FIG. 1 is a cross-sectional view showing an embodiment of a force sensor package to which the present invention is applied, FIG. 2 is an external perspective view showing the force sensor package, and FIG. 3 is a plan view showing the back surface of the sensor substrate (joint surface with the base substrate). 4 is a plan view showing the surface of the base substrate (bonding surface with the sensor substrate), and FIG. 5 is a plan view showing terminal portions on the outer surface of the package substrate.

  The force sensor package 1 is a mold package in which a piezoresistive force sensor is sealed with a sealing resin 50, and a sensor structure in which a pair of sensor substrate 10 and base substrate 20 are joined on a package substrate 30. Department.

  The sensor substrate 10 is formed of a silicon substrate having a flat rectangular shape with no unevenness when viewed macroscopically, and constitutes a displacement portion 11 whose central portion is displaced by receiving a load. As shown in FIGS. 1 and 2, the sensor substrate surface 10 a is provided with a pressure receiving portion 12 that receives a load from the outside. The pressure receiving portion 12 is a columnar convex pressure receiving portion raised above the displacement portion 11, and it is preferable that the upper surface periphery is rounded (R processing). The pressure receiving portion 12 is made of nickel alloy or silicon (the same material as the sensor substrate 10). Although the pressure receiving part 12 can be omitted, the sensor sensitivity can be stabilized by providing the pressure receiving part 12 on the displacement part 11. On the other hand, on the back surface 10b of the sensor substrate, as shown in FIGS. 1 and 3, a plurality of piezoresistive elements 13 as strain detection elements and a support part (sensor side support part) that supports the displacement part 11 so as to be displaceable. 14, a plurality of electrical connection portions (sensor-side electrical connection portions) 15 electrically connected to the plurality of piezoresistive elements 13, and a circuit wiring portion 16 that connects between the piezoresistive elements 13 and the electrical connection portions 15 are provided. It has been. FIG. 3 shows a planar positional relationship among the piezoresistive element 13, the support portion 14, the electrical connection portion 15, and the circuit wiring portion 16, and all are drawn with solid lines.

  The plurality of piezoresistive elements 13 are arranged along the peripheral edge of the displacement portion 11 with phases that are 90 ° different from each other (positions orthogonal to each other). When the displacement portion 11 is displaced by the load received by the pressure receiving portion 12, the electrical resistance of the plurality of piezoresistive elements 13 changes according to the amount of displacement, and the midpoint of the bridge circuit configured by the plurality of piezoresistive elements 13 The potential changes, and this midpoint potential is output as a sensor output to a known measuring device.

  The support portion 14 is formed so as to protrude from the sensor substrate back surface 10b, and is on the substrate peripheral side (outside) with respect to the plurality of piezoresistive elements 13 arranged along the peripheral portion of the displacement portion 11, and at least a part of the support portion 14 It is located so as to overlap with the resistive element 13 in plan view. As shown in FIG. 3, the support portion 14 of the present embodiment has a planar annular shape (a planar shape having a closed inner peripheral edge), and is in a symmetrical positional relationship with respect to the plane center of the displacement portion 11, so that the displacement portion 11 is stabilized. Can be supported. The support portion 14 is made of an underlayer and an alloy containing one or more of Al, Ti, Cr, Ni, Cu, Ru, Rh, Ir, Pt, Ta, Fe, and Au, or a laminated film of two or more layers. And a laminated structure with a metal bonding layer. The planar shape of the support part 14 is arbitrary as long as it is a closed shape.

  The plurality of electrical connection portions 15 are formed so as to protrude from the sensor substrate back surface 10 b in the same manner as the support portion 14, and are located further to the substrate peripheral side (outside) than the support portion 14. In the present embodiment, as shown in FIG. 3, each electrical connection portion 15 has a cylindrical shape, and is disposed at each of four corners of the sensor substrate back surface 10b having a planar rectangular shape. The plurality of electrical connection portions 15 are symmetrically positioned with respect to the plane center of the displacement portion 11 because the pair of the electrical connection portions 15 that are opposed to each other on the diagonal line of the sensor substrate 10 can stably support the displacement portion 11. Each electrical connection portion 15 includes a base layer, an alloy containing one or more of Al, Ti, Cr, Ni, Cu, Ru, Rh, Ir, Pt, Ta, Fe, Au, or a laminate of two or more layers. It is formed in a laminated structure with a metal bonding layer made of a film. The plurality of electrical connection portions 15 are electrically connected to the plurality of piezoresistive elements 13 via circuit wiring portions 16 formed on the sensor substrate back surface 10b. The plurality of piezoresistive elements 13 and the circuit wiring portion 16 are covered with the insulating film 17 and are not exposed to the sensor substrate back surface 10b. The planar shape of the plurality of electrical connection portions 15 is also arbitrary.

  The base substrate 20 is a support substrate for bonding and supporting the sensor substrate 10 with a flat rectangular shape, which is made of a silicon substrate having a certain thickness with no irregularities when viewed macroscopically. As shown in FIG. 4, the base substrate 20 has a planar ring shape (a planar shape having a closed inner peripheral edge) corresponding to the support portion 14 of the sensor substrate 10 on a surface 20 a serving as a joint surface with the sensor substrate 10. A plurality of support portions 24, a plurality of cylindrical electrical connection portions 25 corresponding to the plurality of electrical connection portions 15 of the sensor substrate 10, and a plurality of wires formed so as to be capable of wire bonding at the ends of the electrical wiring drawn out from the respective electrical connection portions 25. Electrode pad 26. The electrical wiring part with the sensor substrate 10 is constituted by an electrical connection part 25 and a plurality of electrode pads 26. The support portion 24 and the plurality of electrical connection portions 25 are formed so as to protrude from the base substrate surface 20a. Like the support portion 14 and the plurality of electrical connection portions 15 of the sensor substrate 10, the base layer, Al, Ti, Cr , Ni, Cu, Ru, Rh, Ir, Pt, Ta, Fe, Au, or an alloy containing two or more, or a laminated structure with a metal bonding layer made of two or more laminated films. The electrode pad 26 is composed of an underlayer, an alloy containing one or more of Al, Ti, Cr, Ni, Cu, Ru, Rh, Ir, Pt, Ta, Fe, Au, or a laminated film of two or more layers. And a laminated structure of a plated metal layer made of, for example, Cu, Au, Al or the like. The underlayer and the metal bonding layer of each of the support portion 24, the plurality of electrical connection portions 25, and the electrode pads 26 are formed at the same time.

  The sensor substrate 10 and the base substrate 20 are integrated by joining the support portions 14 and 24 and the plurality of electrical connection portions 15 and 25 to form a sensor structure portion. In this sensor structure, the base substrate 20 is die-bonded on the package substrate 30, and a plurality of electrode pads 26 provided on the base substrate 20 are connected to a plurality of relay electrode pads 36 of the package substrate 30 by bonding wires 40, respectively. The plurality of relay electrode pads 36 are electrically connected to the plurality of SMD terminals 31 provided on the outer surface of the package substrate 30 (the surface opposite to the surface on which the sensor structure is bonded and fixed). That is, the sensor structure can be mounted externally via the package substrate 30.

  The bonding wire 40 is provided lower than the sensor substrate surface 10a. The bonding wire 40 has a curved portion standing about 100 to 150 μm from the base substrate surface 20a on the connection side of the base substrate 20 with the electrode pad 26, and the surface height is the highest at the curved portion. On the other hand, the substrate thickness of the sensor substrate 10 is set so that the difference in surface height from the base substrate 20 is about 200 to 250 μm.

  As shown in FIG. 5, the plurality of SMD terminals 31 and fixing terminals (soldering terminals) 32 are formed as package terminals on the outer surface of the package substrate 30. The plurality of SMD terminals 31 are respectively arranged at corners of the package substrate 30 having a planar rectangular shape, and the fixing terminal 32 is provided at the center portion surrounded by the plurality of SMD terminals 31, and is indicated by a broken line in FIG. It overlaps in plan view with the adhesion fixing position of the structure part (base substrate 20). By fixing the package substrate 30 using the fixing terminals 32, the sensor structure that receives a load from the outside can be stably supported. The fixing terminal 32 may be used as a ground terminal.

  The arrangement of the package terminals provided on the outer surface of the package substrate 30 can be modified as appropriate. FIG. 6 shows a modification of the package terminal. FIG. 6A shows a modified example in which the adhesion fixing position of the sensor structure portion (base substrate 20) indicated by a broken line is different from that of the embodiment of FIG. 5 by 90 °, and FIG. 6B shows the SMD terminal 31x of FIG. FIG. 6C shows a modified example in which the fixing terminal 32 is made continuous and the dual-purpose terminal 33 that serves as both the SMD terminal and the fixing terminal is provided. FIG. 6C shows the SDM terminal 31x and the fixing terminal 32 shown in FIG. This is a modification in which a dual-purpose terminal 33 serving both as an SMD terminal and a fixing terminal is provided.

  The sealing resin 50 is set so that the sealing resin surface 50 a is about 10 to 100 μm lower than the sensor substrate surface 10 a and covers the sensor substrate 10 and the base substrate 20 on the package substrate 30. That is, only the sensor substrate surface 10a including the pressure receiving portion 12 is exposed on the package surface. By providing the sealing resin 50 lower than the sensor substrate surface 10a, the peripheral edge of the sensor substrate 10 is opened on the sensor substrate surface 10a, so that the displacement of the displacement portion 11 is not hindered by the sealing resin 50, and Further, it is possible to avoid a situation in which the sensor substrate 10 is distorted by the compressive stress generated when the sealing resin 50 is cured, and the sensor characteristics (sensor sensitivity and output zero point of the bridge circuit) fluctuate due to the distortion.

  Further, the sealing resin 50 enhances the bonding between the sensor substrate 10 and the base substrate 20 and the bonding between the base substrate 20 and the package substrate 30, and the bonding wire 40 provided lower than the sensor substrate surface 10 a is completely covered. The reliability of wiring connection can be secured without being exposed.

  Next, with reference to FIGS. 7-10, the manufacturing method of the force sensor package by this invention is demonstrated. 7-10 is sectional drawing which shows 1 process of the manufacturing method of a force sensor package.

  First, the sensor substrate 10 (FIG. 3) on which the pressure receiving portion 12, the plurality of piezoresistive elements 13, the support portion 14, the plurality of electrical connection portions 15, the circuit wiring portion 16, and the insulating film 17 are formed, and the support portion described above. 24, the base substrate 20 (FIG. 4) on which the plurality of electrical connection portions 25 and the plurality of electrode pads 26 are formed is joined with the support portions 14 and 24 and the plurality of electrical connection portions 15 and 25 being planarly aligned. A large number of sensor structures are formed. Since the support portions 14 and 24 of the present embodiment are formed in a plane ring shape, the space surrounded by the support portions 14 and 24 is sealed by bonding.

  Next, a single package substrate (FIGS. 1 and 5) is prepared in which a large number of package structures each including the plurality of SMD terminals 31, the fixing terminals 32, and the plurality of relay electrode pads 36 are formed.

  Next, as shown in FIG. 7, a large number of sensor structures are bonded and fixed on the package substrate 30, and the plurality of electrode pads 26 of the base substrate 20 and the plurality of relay electrode pads 36 of the package substrate 30 are bonded by bonding wires 40. Connect electrically. Here, the sensor structure is bonded and fixed by bonding and fixing the base substrate 20 to the package substrate 30. Moreover, the bonding wire 40 is provided so that the surface height is lower than the sensor substrate surface 10a. In the present embodiment, the bonding wire 40 is connected to the base substrate 20 on the connection side with the electrode pads 26 by standing up from the base substrate surface 20 a by about 100 to 150 μm. Since a difference of about 200 to 250 is secured, the height of the bonding wire 40 is surely lower than the sensor substrate surface 10a.

  Subsequently, as shown in FIG. 8, the package substrate 30 to which a large number of sensor structure parts are bonded and fixed is placed on the lower mold 61 of the mold die, and the sensor substrate 10 of the large number of sensor structure parts of the upper mold 62. A sheet-like release film 70 is mounted on the surface (the lower surface in the figure) facing the surface. The release film 70 can be elastically deformed and has a thickness larger than the protruding height of the pressure receiving portion 12 protruding from the sensor substrate surface 10a. In this embodiment, since the protruding height of the pressure receiving portion 12 is about 50 to 150 μm, a release film 70 having a thickness of about 100 to 300 μm is used. When the upper and lower molds 61 and 62 are pressed against each other with the release film 70 mounted, the release film 70 is pressed against the pressure receiving portion 12 having the highest surface height on the package substrate 30. As described above, since the thickness of the release film 70 is larger than the difference in surface height between the pressure receiving portion 12 and the sensor substrate surface 10a, the release film 70 extends along the sensor substrate surface 10a from the side surface of the pressure receiving portion 12. Further, on the outer periphery of the sensor substrate 10, the film lower surface 70a is positioned below the sensor substrate surface 10a. In this embodiment, the pressing of the upper and lower molds 61 and 62 is adjusted so that the film lower surface 70a is positioned about 10 to 100 μm below the sensor substrate surface 10a.

  Subsequently, a cavity formed between the release film 60 and the package substrate 30 as shown in FIG. 9 from a resin injection port (not shown) formed between the lower mold 61 and the upper mold 62 of the mold. The sealing resin 50 is filled. When the sealing resin 50 is cured, the release film 70 is removed together with the upper and lower molds 61 and 62. For the sealing resin 50, for example, an epoxy resin or an epoxy resin mixed with a filler is used. As described above, the release film 70 is pressed against the pressure receiving portion 12 and the sensor substrate surface 10a in an elastically deformed state, and the film lower surface 70a is positioned below the sensor substrate surface 10a on the outer periphery of the sensor substrate surface 10a. Therefore, the sealing resin 50 does not enter the sensor substrate surface 10a, and the sealing resin surface 50a is lower than the sensor substrate surface 10a. 8 to 10, a large number of sensor substrates 10, base substrates 20, and bonding wires 40 are collectively sealed on a single package substrate 30, and a pressure receiving portion 12 is included outside the sealing resin 50. Only the sensor substrate surface 10a is exposed.

  Then, as shown in FIG. 10, the package substrate 30 is cut in a package unit composed of one sensor structure (a pair of sensor substrate 10 and base substrate 20). Thereby, a large number of force sensor packages 1 shown in FIG. 1 can be obtained simultaneously.

  According to the above-described embodiment, the package structure in which the pressure receiving portion 12 is exposed on the package surface and the sensor substrate 10, the base substrate 20, and the bonding wire 40 excluding the pressure receiving portion 12 is protected and not exposed to the outside is used as the sealing resin. 50, it is possible to use a simple configuration and manufacturing process as compared with the conventional case using a plastic package case, thereby reducing costs and improving productivity. According to the present embodiment, since the sealing resin surface 50a is set lower than the sensor substrate surface 10a, the sealing resin 50 does not hinder the displacement of the displacement portion 11 and occurs when the sealing resin 50 is cured. It is possible to avoid a situation in which the sensor substrate 10 is distorted by the compressive stress and the sensor characteristics change due to the distortion. In addition, the example of the dimension of each part in embodiment shows an example in the present condition, and of course is not limited to this dimension.

DESCRIPTION OF SYMBOLS 1 Sensor package 10 Sensor board 10a Sensor board surface 10b Sensor board back surface 11 Displacement part 12 Pressure receiving part 13 Piezoresistive element 14 Support part 15 Electrical connection part 16 Circuit wiring part 20 Base board 20a Base board surface 24 Support part 25 Electrical connection part 26 Electrode pad 30 Package substrate 31 SMD terminal 32 Fixing terminal 36 Relay electrode pad 40 Bonding wire 50 Sealing resin 61 Upper mold 62 Lower mold 70 Release film

Claims (9)

A sensor substrate formed with a plurality of piezoresistive elements that are displaced when receiving a load via a pressure receiving portion projecting from the substrate surface and electrically detect the amount of displacement, and the plurality of piezoresistive elements and the electric In a force sensor package having a sensor structure unit bonded to a base substrate on which an electrical wiring unit to be connected is formed, and this sensor structure unit is bonded and fixed to a package substrate via the base substrate,
A force sensor package, wherein a sensor substrate and a base substrate on the package substrate are covered with a sealing resin, and the surface of the sealing resin is provided lower than the surface of the sensor substrate. 2. The force sensor package according to claim 1, wherein the electric wiring portion of the base substrate and the package substrate are electrically connected by a bonding wire, and the bonding wire is provided lower than the surface of the sensor substrate. 3. The force sensor package according to claim 1, wherein the package substrate has a surface opposite to a surface on which the sensor structure portion is bonded and fixed, overlapping with a bonding fixing position of the sensor structure portion in a plane. Force sensor package with fixed terminals. 4. The force sensor package according to claim 3, wherein the package substrate is provided with a plurality of SMD terminals for electrically connecting the package substrate and an external circuit on the surface provided with the fixing terminals. A force sensor package that combines one of the SMD terminals with the fixing terminal. A sensor substrate formed with a plurality of piezoresistive elements that are displaced when receiving a load via a pressure receiving portion projecting from the substrate surface and electrically detect the amount of displacement, and the plurality of piezoresistive elements and the electric Forming a large number of sensor structures formed by joining a base substrate on which electrical wiring portions to be connected are formed,
Bonding and fixing the plurality of sensor structures on a package substrate via a base substrate of the sensor structure, and electrically connecting the electrical wiring portion of the base substrate and the package substrate in each sensor structure;
Covering a large number of sensor substrates and base substrates on the package substrate with a sealing resin, and providing the sealing resin surface lower than the sensor substrate surface;
A step of cutting the package substrate in units of a package consisting of one sensor structure;
A method for manufacturing a force sensor package, comprising: 6. The method of manufacturing a force sensor package according to claim 5, wherein the sealing step includes
Installing a package substrate on which a plurality of sensor structures are bonded and fixed to a lower mold of a mold; and
Mounting a release film having a thickness larger than the protruding height of the pressure receiving portion on the surface of the upper mold of the mold that faces the package substrate;
Bringing the upper mold closer to the lower mold and bringing the release film into contact with the pressure receiving portions and sensor substrate surfaces of the multiple sensor structures; and
In this contact state, a step of filling a sealing resin into a cavity generated between the release film and the package substrate;
After curing of the sealing resin, removing the release film and the upper and lower molds;
A method for manufacturing a force sensor package. The force sensor package manufacturing method according to claim 5 or 6, wherein the electric wiring portion of the base substrate and the package substrate are electrically connected by a bonding wire, and the bonding wire is provided lower than the surface of the sensor substrate. Manufacturing method. The force sensor package manufacturing method according to any one of claims 5 to 7, wherein an adhesion fixing position of the sensor structure portion is provided on a surface of the package substrate opposite to a surface to which the sensor structure portion is adhesively fixed. A method of manufacturing a force sensor package in which fixing terminals are formed by overlapping in a planar manner. 9. The method of manufacturing a force sensor package according to claim 8, wherein an SMD terminal for electrically connecting the package substrate and an external circuit is provided on a surface of the package substrate opposite to a surface to which the sensor structure portion is bonded and fixed. A method of manufacturing a force sensor package, in which a plurality of SMD terminals are formed and also used as the fixing terminals.