JP5346353B2 - Substrate manufacturing apparatus and printing machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate manufacturing device and a printing machine capable of inhibiting production efficiency from being lowered while enhancing the degree of freedom in a work form when an open/close cover of one of work devices is opened and preparation thereof is performed in a configuration having a plurality of the work devices. <P>SOLUTION: This printing machine 100 (substrate manufacturing device) includes: a first printing device 1 including a substrate conveyance part 11 for conveying a substrate 200, and a conveyor cover 14 movable between an open position and a shielding position, and a second printing device 2 disposed adjacent to the first printing device 1. The conveyor cover 14 is formed in a shape in which the maximum interval D1 of an open gap 500 communicated with the side of the second printing device 2 between the conveyor cover 14 when the conveyor cover 14 is located in the open position and the substrate conveyance part 11 located in a position at the preparing time has a predetermined value or less (for example 6 mm or less) smaller than the maximum interval D2 of the open gap 500 when the conveyor cover 14 is located in the shielding position. <P>COPYRIGHT: (C)2013,JPO&amp;INPIT

Description

  The present invention relates to a substrate manufacturing apparatus and a printer, and more particularly to a substrate manufacturing apparatus and a printer provided with an opening / closing cover.

  Conventionally, a substrate manufacturing apparatus provided with an opening / closing cover is known (see, for example, Patent Document 1).

  Patent Document 1 discloses a component mounting apparatus (board manufacturing apparatus) including two mounting apparatuses (working apparatuses). In this component mounting apparatus, each of the two mounting apparatuses is provided with a board transfer path (board transfer part) and a door (opening / closing cover), and the work space is separated between the two mounting apparatuses. A removable partition member is provided. Further, in this component mounting apparatus, when the work spaces of the two work devices are separated from each other by the partition member, one work device cannot enter the work space of the other work device and operate. On the other hand, when the work spaces of the two work devices are not separated from each other, one work device can enter and operate in the work space of the other work device, thereby increasing the degree of freedom of the work form. In addition, in the component mounting apparatus, when the work space is separated from each other by the partition member, the setup can be performed by opening the door portion of the other mounting apparatus while one of the mounting apparatuses is operating. When the work space is not separated from each other, the operation of both mounting devices is stopped when opening the door of one of the mounting devices and performing setup. ing. In this component mounting apparatus, when the partition member is not mounted, when opening the door portion of one mounting apparatus and performing the setup, the operation part of the other mounting apparatus is greatly exposed, The operation of both mounting devices is stopped.

JP 2010-251450 A

  However, in Patent Document 1 described above, when the work spaces of the two mounting apparatuses are not separated from each other, the degree of freedom of the work form is increased, while both are performed when opening the door portion of any of the mounting apparatuses. Since the operation of the mounting apparatus is stopped, there is a problem that the production efficiency is lowered.

  SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and one object of the present invention is to set up by opening the open / close cover of any of the work devices in a configuration including a plurality of work devices. It is an object of the present invention to provide a substrate manufacturing apparatus and a printing machine that can suppress a reduction in production efficiency while increasing the degree of freedom of work modes.

Means for Solving the Problems and Effects of the Invention

  In order to achieve the above object, the substrate manufacturing apparatus according to the first aspect of the present invention includes a substrate transfer unit that transfers a substrate, an open position that exposes the substrate transfer unit when performing setup, and a shielding position that covers the substrate transfer unit. A first working device including a movable opening / closing cover and a second working device arranged adjacent to the first working device, wherein the opening / closing cover is open / closed when the open / close cover is located in the open position. And the maximum gap of the opening gap leading to the second working device side between the substrate transfer unit located at the setup position and a predetermined value smaller than the maximum gap of the opening gap when the open / close cover is located at the shielding position It is formed into a shape.

  In the substrate manufacturing apparatus according to the first aspect of the present invention, as described above, on the second working device side between the opening / closing cover when the opening / closing cover is located at the open position and the substrate transport unit located at the setup position. By providing an opening / closing cover formed in a shape in which the maximum interval of the opening gap to be communicated is a predetermined value smaller than the maximum interval of the opening gap when the opening / closing cover is located at the shielding position, the opening / closing cover is brought to the open position. Since the exposure range on the second working device side can be reduced on the first working device side when it is positioned, the working space is not separated even when the opening / closing cover of the first working device is opened Thus, the second working device can be continuously operated without stopping. As a result, it is possible to suppress a decrease in production efficiency while increasing the degree of freedom of the work mode when performing the setup by opening the opening / closing cover of the first work device.

  In the substrate manufacturing apparatus according to the first aspect, preferably, the first work device is configured to be able to perform setup by moving the open / close cover to an open position while the second work device is operating. Yes. If comprised in this way, when opening the opening-and-closing cover of a 1st working apparatus and performing a setup, since it can be made to operate | move continuously without stopping a 2nd working apparatus, it is ensured that production efficiency falls. Can be suppressed.

  In the substrate manufacturing apparatus according to the first aspect, preferably, the opening / closing cover has an opening gap between the lower end portion of the opening / closing cover when the opening / closing cover is located at the open position and the substrate transport portion located at the set-up position. The maximum interval is formed in a shape that is equal to or smaller than a predetermined value smaller than the maximum interval of the opening gap when the opening / closing cover is located at the shielding position. If comprised in this way, the opening clearance which leads to the 2nd working device side between the lower end part of an opening-and-closing cover and a board | substrate conveyance part can be made small.

  The substrate manufacturing apparatus according to the first aspect preferably further includes at least a control unit that controls the operation of the first work device, and the control unit is configured to operate the first work device while the second work device is operating. When the setup is performed, the substrate transport unit is controlled to be moved to the setup position. With this configuration, in the configuration in which the substrate transfer unit is movable, when the control unit sets up the first work apparatus, the substrate transfer unit is automatically moved to the set-up position. Can be reliably set to a predetermined value or less.

  In this case, preferably, the apparatus further includes a detection unit that detects that the substrate transfer unit has moved to the setup position, and the control unit has the substrate transfer unit disposed at the setup position based on the detection result of the detection unit. It is configured to determine whether or not. If comprised in this way, since a control part can judge whether a substrate transportation part is arranged in a position at the time of setup based on an actual position of a substrate transportation part detected by a detection part, The accuracy of judgment can be improved.

  In the configuration including the detection unit, preferably, the control unit prevents the opening / closing cover from being moved to the open position based on the detection result of the detection unit when the substrate transport unit is not disposed at the setup position. Control to lock the open / close cover, and control to unlock the open cover so that the open / close cover can be moved to the open position when the substrate transport unit is located at the setup position. Has been. According to this configuration, by controlling the lock state of the opening / closing cover based on whether or not the substrate transport unit is disposed at the setup position, the substrate transport unit is opened and closed without being disposed at the setup position. It is possible to reliably prevent the cover from being moved to the open position. As a result, the opening cover can be moved to the open position only when the opening gap is in a state where it can be reliably set to a predetermined value or less.

  The configuration including the control unit preferably further includes a drive source for moving the substrate transfer unit, and the control unit is arranged so that the substrate transfer unit is arranged at a setup position when the first work apparatus is set up. After the drive source is operated, the control for applying a brake to the drive source is performed. According to this configuration, when the first work apparatus is set up, the movement of the substrate transfer unit is restricted after the substrate transfer unit is moved to the set-up position, so that the substrate transfer unit is moved from the set-up position. It can suppress shifting. Also by this, the opening gap when the opening / closing cover is located at the open position can be surely set to a predetermined value or less.

  In the substrate manufacturing apparatus according to the first aspect, preferably, the first working device further includes an opening mechanism that holds a state in which the opening / closing cover is positioned at the open position when the first working device is set up. If comprised in this way, when opening a 1st working apparatus, it can suppress that an opening / closing cover shifts | deviates from an open position by an open mechanism.

  In the substrate manufacturing apparatus according to the first aspect, the opening / closing cover is preferably formed in a shape such that the maximum gap of the opening gap is 6 mm or less when the opening / closing cover is located at the open position. If comprised in this way, the opening clearance gap in case an opening-and-closing cover is located in an open position can be made small.

  A printing machine according to a second aspect of the present invention includes a substrate transport unit that transports a substrate, an open position that exposes the substrate transport unit when performing setup, and an open / close cover that can be moved to a shielding position that covers the substrate transport unit. A first printing device that includes the second printing device disposed adjacent to the first printing device, and a solder printing unit that prints solder on the substrate, and the opening / closing cover is located in the open position. The maximum gap of the opening gap that leads to the second work device side between the opening / closing cover and the substrate transfer unit located at the setup position is smaller than the maximum gap of the opening gap when the opening / closing cover is located at the shielding position. It is formed in a shape that is less than or equal to the value.

  In the printing press according to the second aspect of the present invention, as described above, the second working apparatus side between the opening / closing cover when the opening / closing cover is located at the open position and the substrate transport unit located at the set-up position is communicated. By providing an opening / closing cover having a shape in which the maximum gap of the opening gap is not more than a predetermined value smaller than the maximum gap of the opening gap when the opening / closing cover is located at the shielding position, the opening / closing cover is positioned at the opening position. Since the exposure range on the second working device side can be reduced on the first working device side, the work space is not separated even when the opening / closing cover of the first working device is opened. The second working device can be continuously operated without stopping. As a result, it is possible to suppress a decrease in production efficiency while increasing the degree of freedom of the work mode when performing the setup by opening the opening / closing cover of the first work device.

1 is a perspective view showing an overall configuration of a printing press according to an embodiment of the present invention. It is the front view which showed the inside of the 1st printing apparatus of the printing press by one Embodiment of this invention. FIG. 3 is a partial cross-sectional view taken along line 300-300 in FIG. 2. It is the partial front view which showed the printing machine by one Embodiment of this invention. It is a schematic sectional drawing in alignment with line 400-400 of FIG. It is a schematic sectional drawing when the conveyor cover of the printing press by one Embodiment of this invention is located in the shielding position. 1 is a block diagram illustrating an overall configuration of a printing press according to an embodiment of the present invention. It is the schematic which showed the state in which the printing apparatus of the one side of the printing press by one Embodiment of this invention got into the other side. 5 is a flowchart illustrating processing during setup of the printing press according to the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  With reference to FIGS. 1-6, the structure of the printing press 100 by one Embodiment of this invention is demonstrated. The printing press 100 is an example of the “substrate manufacturing apparatus” in the present invention.

  A printing press 100 according to an embodiment of the present invention includes a first printing apparatus 1 disposed on the Y1 direction side and a second printing apparatus 2 disposed on the Y2 direction side. The first printing device 1 and the second printing device 2 are arranged adjacent to each other in the front-rear direction (Y direction). Further, both the first printing device 1 and the second printing device 2 have a function of performing solder printing on the substrate 200 (see FIG. 6). The first printing device 1 and the second printing device 2 are examples of the “first working device” and the “second working device” in the present invention, respectively.

  As shown in FIG. 2, the first printing apparatus 1 includes a board transport unit 11 and a solder printing unit 12 disposed above the board transport unit 11. Similar to the first printing apparatus 1, the second printing apparatus 2 includes a board transport unit 21 and a solder printing unit 22 (see FIG. 7). In the present embodiment, the first printing device 1 and the second printing device 2 have the same configuration. For this reason, below, the structure of the 1st printing apparatus 1 is demonstrated in detail, and description is abbreviate | omitted about the detailed structure of the 2nd printing apparatus 2. FIG.

  As shown in FIGS. 2 and 3, the substrate transport unit 11 includes a main body 111 (see FIG. 2), a pair of conveyors 112 extending in the X direction, and a support table 113 that supports the substrate 200 (see FIGS. 2 and 3). And a transport unit cover 114 that covers the substrate transport unit 11 on the second printing apparatus 2 side (Y2 direction side). The pair of conveyors 112 and the support table 113 are both supported by the main body 111. The main body 111 is supported by the base 3 so as to be movable in the Y direction via four rails 31 extending in the front-rear direction (Y direction). Specifically, the main body 111 is provided with a slider 111a that engages the rail 31 so as to be slidable in the Y direction. The main body 111 is configured to be driven by a Y-axis drive unit 115 formed of a servo motor. The Y-axis drive unit 115 is configured to rotationally drive a ball screw shaft 115a (see FIG. 3) extending in the Y direction. The substrate transport unit 11 is configured to linearly move in the Y direction when the ball screw shaft 115a is rotationally driven. At this time, the pair of conveyors 112 and the support table 113 supported by the main body 111 are also moved in the Y direction along the rails 31 together with the main body 111. The rail 31 provided on the base 3 is also used on the second printing apparatus 2 side, and the substrate transport unit 21 is configured to be movable along the rail 31 in the Y direction. The Y-axis drive unit 115 is an example of the “drive source” in the present invention.

  The pair of conveyors 112 conveys the substrate 200 supplied from the upstream side (X2 direction side) of the first printing apparatus 1 to a position supported by the support table 113, and the printed substrate 200 on the downstream side (X1 direction). Side). Further, the pair of conveyors 112 is configured to be able to change the interval between them according to the width of the substrate 200. Specifically, the front side (Y1 direction side) conveyor 112 is moved in the Y direction along the two rails 112a provided in the main body 111 by the movable conveyor driving unit 116 (see FIG. 7). It is configured. Accordingly, the pair of conveyors 112 can correspond to the substrates 200 having different widths by moving the front side (Y1 direction side) conveyor 112 closer to or away from the back side (Y2 direction side) conveyor 112. It is.

  The support table 113 is configured to be moved relative to the main body 111 in the X direction by a table driving unit 117 (see FIG. 7). The support table 113 is configured to support the substrate 200 through support pins 118 (see FIG. 6). As shown in FIG. 2, the support table 113 supports and fixes the substrate 200 conveyed from the upstream side (X2 direction side) of the first printing apparatus 1 at the substrate fixing position (the position indicated by the solid line). It is configured to move to a printing position (position indicated by a two-dot chain line) with the substrate 200 supported. The support table 113 is configured to release the support of the substrate after the printing is completed, and to support the next substrate 200 by moving from the printing position to the substrate fixing position.

  Further, as shown in FIGS. 2 and 3, a position sensor 119 made up of a magnetic sensor is provided below the substrate transport unit 11. The position sensor 119 includes two elements. One element 119 a is fixedly attached to the main body 111, and the other element 119 b is fixedly attached to the base 3. . The position sensor 119 is configured to detect that the substrate transport unit 11 is located at a setup position which will be described later. The position sensor 119 is an example of the “detection unit” in the present invention.

  As shown in FIG. 2, the solder printing unit 12 includes a printing unit main body 121, a printing unit 122, and a mask support unit 123 that supports the mask 110. The printing unit main body 121 supports the printing unit 122 and the mask support unit 123 in a suspended state. Further, the printing unit main body 121 is supported by two support bases 4 on the base 3 via two rails 41 extending in the Y direction. The two support bases 4 are formed so as to extend in the Y direction when seen in a plan view, and similarly support the mechanism main body on the second printing apparatus 2 side. In addition, the printing unit main body 121 is configured to be moved in the horizontal direction by two Y-axis driving units 124 formed of servomotors. Specifically, the two Y-axis drive units 124 are arranged on both sides in the X direction of the printing unit main body 121, and each Y-axis drive unit 124 is provided with a ball screw shaft 124a extending in the Y direction. Yes. The printing unit main body 121 is attached by screwing the vicinity of both ends in the X direction to the ball screw shaft 124a. As a result, when the drive amounts of the two Y-axis drive units 124 are the same, both sides in the X direction of the printing unit main body 121 are moved in the Y direction by the same distance. Is linearly moved in the Y direction. Further, when the driving amounts of the two Y-axis driving units 124 are different from each other, the movement distances on both sides in the X direction of the printing unit main body 121 are different from each other, and accordingly, the printing unit main body 121 is R in the horizontal plane. Rotated in the direction. The rail 41 provided on the support base 4 is also used on the second printing apparatus 2 side.

  The printing unit 122 is configured to supply solder to the upper surface of the mask 110 by a solder supply unit 122a (see FIG. 7) and stretch the supplied solder by a squeegee 122b (see FIG. 2). Specifically, the printing unit 122 is suspended by two rails 121a provided in the printing unit main body 121 and extending in the Y direction, and is configured to be movable in the Y direction along the rails 121a. . The printing unit 122 is configured so that the squeegee 122b can be vertically moved by a squeegee lifting drive unit 122c (see FIG. 7). The printing unit 122 is configured to move in the Y direction with the squeegee 122b pressed against the mask 110 when the supplied solder is stretched on the upper surface of the mask 110. Thereby, the solder is printed on the upper surface of the substrate 200 through the opening provided in the mask 110. The printing unit 122 is configured to move in the Y direction and the R direction together with the printing unit main body 121 when the printing unit main body 121 is moved in the Y direction and the R direction.

  The mask support portion 123 is configured to be movable relative to the printing unit main body 121 in the vertical direction (up and down direction). Further, as shown in FIGS. 2 and 3, the mask support portion 123 includes a mask placement portion 123a on which the mask 110 is placed and two side walls connected to both ends of the mask placement portion 123a in the X direction. Part 123b. The mask placement portion 123a is formed in a hollow substantially rectangular shape (substantially rectangular frame shape) when seen in a plan view. The two side wall parts 123b are fixedly connected to the mask placing part 123a. Further, ball screw shafts (not shown) that are rotationally driven by a mask vertical driving unit 123c (see FIG. 7) each composed of a servo motor are provided at four corners of the printing unit main body 121 in plan view. . The four ball screw shafts are configured to be rotationally driven in synchronization with each other using a transmission belt (not shown) by the driving force of one mask vertical driving unit 123c. The mask support 123 is configured to move in the vertical direction relative to the printing unit main body 121 when the ball screw shaft is rotationally driven. With the above-described configuration, the mask support unit 123 can move relative to the substrate transport unit 11 in both the horizontal direction (Y direction and R direction) and the vertical direction (Z direction).

  Further, as shown in FIG. 2, two air cylinders 123d are attached to the two side wall portions 123b, respectively. The four air cylinders 123d are provided to press and fix the mask 110 placed on the mask placing portion 123a from above.

  In addition, position sensors 125 each including a magnetic sensor are provided at both ends in the X direction of the solder printing unit 12. The two position sensors 125 are provided in the vicinity of the extension line of the ball screw shaft 124a disposed on the side of the solder printing unit 12 in the X direction. Each position sensor 125 includes two elements. One element 125 a is fixedly attached to the side wall part 123 b of the mask support part 123, and the other element 125 b is fixed to the support base 4. Attached. The position sensor 125 is configured to be able to detect both the vertical and horizontal positions. The position sensor 125 is configured to detect that the solder printing unit 12 is located at a setup position which will be described later.

  Further, as shown in FIG. 3, the solder printing unit 12 further includes a mechanism cover 126 that covers the second printing apparatus 2 side (Y2 direction side) of the solder printing unit 12. In addition, the second printing apparatus 2 includes a substrate transport unit 21 and a solder printing unit 22, similarly to the first printing apparatus 1.

  As shown in FIG. 1, the first printing apparatus 1 is further provided with an upper opening / closing cover 13, a conveyor cover 14, gas springs 15 and 16, and a cover member 17. The upper opening / closing cover 13 is configured to be movable between an open position (see FIG. 1) where the board transport unit 11 and the solder printing unit 12 are exposed, and a shielding position covering the board transport unit 11 and the solder printing unit 12. The conveyor cover 14 is configured to be movable between an open position (see FIGS. 1 and 5) that exposes the substrate transport unit 11 and a shielding position (see FIG. 6) that covers the substrate transport unit 11. Specifically, when the conveyor cover 14 is positioned at the open position (see FIG. 5), the substrate transfer unit 11 is exposed. Further, when the conveyor cover 14 is located at the shielding position (see FIG. 6), the substrate transport unit 11 is covered by the conveyor cover 14. The conveyor cover 14 is an example of the “open / close cover” in the present invention. The gas spring 16 is an example of the “opening mechanism” in the present invention. Similarly to the first printing apparatus 1, the second printing apparatus 2 is provided with an upper opening / closing cover 23, a conveyor cover 24, and gas springs 25 and 26, as shown in FIG.

  Both the upper opening / closing cover 13 and the conveyor cover 14 are locked at the shielding position when the first printing apparatus 1 is operating. Further, the upper opening / closing cover 13 and the conveyor cover 14 are configured to be in a state in which the lock is released only in a predetermined case by the main control unit 101 to be described later and can be moved to the open position. The user can perform various setups such as replacement work of the mask 110 and the squeegee 122b by opening the upper opening / closing cover 13. Further, the user can perform backup setup such as replacement of the support pins 118 that support the substrate 200 by opening the conveyor cover 14.

  Here, the configuration of the conveyor cover 14 will be described in more detail. As shown in FIGS. 5 and 6, the conveyor cover 14 has a hinge 141, a first portion 142, and a second portion 143. The conveyor cover 14 is attached to the printing press 100 by a hinge 141. Further, the conveyor cover 14 is configured to rotate about the hinge 141 and move to an open position (see FIG. 5) and a shielding position (see FIG. 6). As shown in FIG. 6, the first portion 142 is disposed closer to the front side (Y1 direction side) than the hinge 141 in a state where the conveyor cover 14 is located at the closed position. The second portion 143 is disposed on the back side (Y2 direction side) of the hinge 141 in a state where the conveyor cover 14 is located at the closed position.

  As shown in FIG. 1, two magnets 144 a are provided on the front side (Y1 direction side) of the inner surface of the conveyor cover 14. Further, two magnets 144b are provided at positions facing the two magnets 144a in a state where the conveyor cover 14 is located at the closed position. In a state where the conveyor cover 14 is located at the closed position, the magnets 144a and 144b are configured to be attracted to each other by magnetic force. Thereby, it is possible to prevent the conveyor cover 14 from being displaced from the closed position.

  Further, as shown in FIG. 1, a lock mechanism 145 is provided. One convex portion 145 a is provided on the front side (Y1 direction side) of the inner surface of the conveyor cover 14. The other concave portion 145b is provided at a position facing the convex portion 145a in a state where the conveyor cover 14 is located at the closed position. The convex part 145a and the concave part 145b are configured to lock the conveyor cover 14 in the closed position by engaging with each other. The lock mechanism 145 is configured to be unlocked only in a predetermined case by the main control unit 101 described later.

  Here, in the present embodiment, as shown in FIG. 5, when the conveyor cover 14 is located at the open position, the conveyor cover 14 is disposed on the second printing device 2 between the substrate transport unit 11 located at the setup position described later. It is formed in a shape in which the maximum distance D1 of the opening gap 500 to be communicated is a predetermined value or less (for example, 6 mm or less (4 mm in the present embodiment)). Further, as shown in FIG. 6, when the conveyor cover 14 is positioned at the closed position, the maximum opening gap 500 leading to the second printing apparatus 2 between the conveyor cover 14 and the substrate transport unit 11 positioned at the setup position described later. The distance D2 is formed to be larger than D1.

  Specifically, when the conveyor cover 14 is positioned at the open position, an opening gap 500 that leads to the second printing apparatus 2 between the conveyor cover 14 and the substrate transport unit 11 positioned at the setup position is illustrated in FIG. As described above, the gap is formed between the lower end portion 14a of the second portion (Z2 direction side) and the substrate transport portion 11 located at the setup position. In the present embodiment, since the second printing apparatus 2 side of the board conveyance section 11 is covered with the conveyance section cover 114, when the conveyor cover 14 is located at the open position, the first printing apparatus 1 side is provided. Is substantially the gap between the end portion 14a on the lower side (Z2 direction side) of the second portion and the substrate transport unit 11 located at the setup position.

  As shown in FIGS. 1 and 4 to 6, the gas springs 16 (15) are respectively provided at both ends in the X direction of the conveyor cover 14 (upper opening / closing cover 13). The gas spring 16 (15) is filled with high-pressure nitrogen gas in a sealed cylinder, and biases the conveyor cover 14 (upper opening / closing cover 13) toward the open position by the reaction force of the nitrogen gas. It is configured. The gas spring 16 is configured to move the conveyor cover 14 to the open position by the restoring force immediately after the operator starts the opening operation of the conveyor cover 14 (immediately after the magnet 144a and the magnet 144b are separated). Further, the gas spring 16 (15) is configured to maintain a state where the conveyor cover 14 (upper opening / closing cover 13) is located at the open position.

  As shown in FIG. 1, the cover member 17 is formed so as to cover the board transport unit 11 and the solder printing unit 12.

  Next, the internal configuration of the printing press 100 according to the present embodiment will be described with reference to FIG.

  As shown in FIG. 7, the printing press 100 includes a main control unit 101 that controls the entire printing press 100, a display unit 102, a storage unit 103, and a first control unit that controls the first printing apparatus 1. 104 and a second control unit 105 that controls the second printing apparatus 2 are provided. The main control unit 101 is an example of the “control unit” in the present invention.

  The main control unit 101 is configured to transmit an instruction signal to the first control unit 104 and the second control unit 105 based on an instruction from the user. As shown in FIG. 1, the display unit 102 is provided on the front side of each device and has a touch panel function. The main control unit 101 is configured to receive an instruction from the user via the display unit 102. The storage unit 103 stores various operation programs, substrate data including information such as a substrate size, and a position coordinate program including position information of each unit during each operation. The main control unit 101 causes the first control unit 104 and the second control unit 105 to execute predetermined processing based on the substrate data and the position coordinate program.

  The first control unit 104 includes a drive control unit 104a, a solder supply control unit 104b, and a monitoring unit 104c. The drive control unit 104a is configured to control the operations of the Y-axis drive unit 115, the movable conveyor drive unit 116, and the table drive unit 117 of the substrate transport unit 11 based on the instruction signal transmitted from the main control unit 101. ing. Furthermore, the drive control unit 104a controls the operations of the squeegee lifting drive unit 122c, the mask vertical drive unit 123c, and the two Y-axis drive units 124 of the solder printing unit 12 based on the instruction signal transmitted from the main control unit 101. Is configured to do. The solder supply control unit 104b is configured to control the solder supply unit 122a based on an instruction signal transmitted from the main control unit 101. The monitoring unit 104c is configured to acquire detection results of the position sensor 119 of the board transport unit 11 and the position sensor 125 of the solder printing unit 12, and to transmit the acquired detection results to the main control unit 101. Note that the second control unit 105 has the same configuration as the first control unit 104, and a description thereof will be omitted.

  Here, in this embodiment, the work space of the first printing apparatus 1 and the work space of the second printing apparatus 2 are not separated by a partition wall or the like. That is, the work space of the first printing apparatus 1 and the work space of the second printing apparatus 2 are in communication with each other. Thereby, in the printing press 100 of this embodiment, as shown in FIG. 8, it is possible to move the board | substrate conveyance part 21 of the 2nd printing apparatus 2 to the 1st printing apparatus 1 side by moving to the Y1 direction. Then, it is possible to perform printing on the substrate supported by the substrate transport unit 21 by the solder printing unit 12 of the first printing apparatus 1. It is also possible to move the substrate transport unit 11 of the first printing apparatus 1 in the Y2 direction and enter the second printing apparatus 2 side. With such a configuration, for example, after printing is performed by one solder printing unit on a substrate supported by one substrate transport unit, the other printing apparatus side is supported while the substrate is supported by one substrate transport unit. It is possible to take a printing process (printing form) in which printing is further performed by the other solder printing unit. Thereby, it is possible to easily perform two-layer printing.

  Next, with reference to FIG. 9, processing during setup of the printing press 100 according to the present embodiment will be described. Here, the process when the setup is performed on the first printing apparatus 1 side will be described, and the process when the setup is performed on the second printing apparatus 2 side is the same as the case of the first printing apparatus 1 side, so the description thereof will be given. Is omitted. In the printing press 100 according to the present embodiment, when the setup is performed on the first printing apparatus 1 side, a normal operation such as a printing operation can be continuously performed on the second printing apparatus 2 side. In other words, the printing press 100 is configured to be able to execute processing at the time of setup on the first printing apparatus 1 side while continuing normal operation on the second printing apparatus 2 side.

  First, the main control unit 101 determines whether or not the setup start button has been pressed by the user in step S1. The setup start button is displayed on the touch panel display unit 102. In step S2, the main control unit 101 moves the board transport unit 11 and the solder printing unit 12 to the setup position. Here, the setup position is a preset fixed position, and is a position where each of the board transport unit 11 and the solder printing unit 12 is arranged when setup is performed on the first printing apparatus 1 side.

  The main control unit 101 moves the substrate transport unit 11 to the setup position by controlling the Y-axis drive unit 115 of the substrate transport unit 11 via the first control unit 104. In parallel with this, the main control unit 101 controls the mask vertical driving unit 123c and the two Y-axis driving units 124 of the solder printing unit 12 via the first control unit 104 to set up the solder printing unit 12 during setup. Move to position. More specifically, the main control unit 101 moves the mask support unit 123 of the solder printing unit 12 in both the vertical direction and the horizontal direction to place the solder printing unit 12 at the setup position.

  In step S3, the main control unit 101 determines whether or not the board transfer unit 11 is located at the setup position based on the detection result of the position sensor 119 of the board transfer unit 11, and the solder printing unit. Based on the detection result of the twelve position sensors 125, it is determined whether or not the solder printing unit 12 is disposed at the setup position. The main control unit 101 repeats the operations of steps S2 and S3 until each of the board transport unit 11 and the solder printing unit 12 is arranged at the setup position.

  When each of the board transport unit 11 and the solder printing unit 12 is disposed at the setup position, the main control unit 101, in step S4, passes through each of the drive units on the first printing apparatus 1 side via the first control unit 104. Stop driving. Specifically, the main control unit 101 stops the driving of the Y-axis driving unit 115, the movable conveyor driving unit 116, and the table driving unit 117 of the board transport unit 11, and the squeegee lifting / lowering driving unit 122c of the solder printing unit 12. The driving of the mask vertical drive unit 123c and the two Y-axis drive units 124 is stopped. Further, in step S5, the main control unit 101 performs control to apply a brake to each stopped driving unit. That is, the main control unit 101 includes a Y-axis driving unit 115, a movable conveyor driving unit 116, and a table driving unit 117 of the board transport unit 11, a squeegee lifting / lowering driving unit 122c of the solder printing unit 12, a mask vertical driving unit 123c, and two A brake is applied to the Y-axis drive unit 124. Thereby, it is possible to prevent each of the board transport unit 11 and the solder printing unit 12 from being displaced from the setup position. And the main control part 101 performs control which cancels | releases the lock | rock of the upper opening / closing cover 13 and the conveyor cover 14 in step S6. Accordingly, the user can open the upper opening / closing cover 13 and the conveyor cover 14, and the first printing apparatus 1 can be set up.

  As a result of the above processing, when the conveyor cover 14 is moved to the open position, the maximum distance D1 of the gap 500 leading to the second printing apparatus 2 side between the conveyor cover 14 and the substrate transport unit 11 is equal to or less than a predetermined value (for example, 6 mm or less (4 mm in the present embodiment)).

  In the present embodiment, as described above, the opening gap 500 leading to the second printing apparatus 2 side between the conveyor cover 14 when the conveyor cover 14 is located at the open position and the substrate transport unit 11 located at the setup position. Is formed in a shape that is a predetermined value or less (for example, 6 mm or less (4 mm in the present embodiment)) smaller than the maximum distance D2 of the opening gap 500 when the conveyor cover 14 is located at the shielding position. By providing the conveyor cover 14, the exposure range on the second printing device 2 side can be reduced on the first printing device 1 side when the conveyor cover 14 is located at the open position. Even when the setup is performed with the conveyor cover 14 opened, the second printing apparatus 2 is continuously operated without being separated from each other's work space. Door can be. As a result, when opening the conveyor cover 14 of the 1st printing apparatus 1 and performing a setup, it can suppress that production efficiency falls, raising the freedom degree of a work form.

  In the present embodiment, the first printing apparatus 1 is configured such that the first cover 1 can be set up by moving the conveyor cover 14 to the open position while the second printing apparatus 2 is operating. When the conveyor cover 14 of the printing apparatus 1 is opened and the setup is performed, the second printing apparatus 2 can be continuously operated without being stopped, so that it is possible to reliably suppress a reduction in production efficiency.

  In the present embodiment, the maximum width of the opening gap 500 between the lower end portion 14a of the conveyor cover 14 when the conveyor cover 14 is located at the open position and the substrate transfer portion 11 located at the setup position is determined. By forming the interval D1 into a shape that is a predetermined value or less (for example, 6 mm or less (4 mm in the present embodiment)) smaller than the maximum interval D2 of the opening gap 500 when the conveyor cover 14 is located at the shielding position, The opening gap 500 leading to the second printing apparatus 2 side between the lower end part 14a of the conveyor cover 14 and the substrate transport part 11 can be reduced.

  In the present embodiment, a main control unit 101 that controls the operations of the first printing apparatus 1 and the second printing apparatus 2 is provided, and the main control unit 101 is in the state where the second printing apparatus 2 is operating. In the configuration in which the substrate transport unit 11 is movable by performing the control to move the substrate transport unit 11 to the setup position when the printing apparatus 1 is set up, the main control unit 101 performs the first control. When the setup of the printing apparatus 1 is performed, the substrate transport unit 11 is automatically moved to the setup position, so that the opening gap 500 when the conveyor cover 14 is located at the open position is reliably set to a predetermined value or less (for example, 6 mm or less (4 mm in the present embodiment).

  In the present embodiment, a position sensor 119 that detects that the substrate transport unit 11 has moved to the setup position is provided, and the main controller 101 controls the substrate transport unit 11 based on the detection result of the position sensor 119. By configuring so as to determine whether or not it is arranged at the time position, the substrate transport unit 11 is set up based on the actual position of the substrate transport unit 11 detected by the position sensor 119 by the main control unit 101. Since it can be determined whether or not it is arranged at the hour position, the accuracy of the determination can be improved.

  In the present embodiment, the main controller 101 determines that the conveyor cover 14 is not moved to the open position based on the detection result of the position sensor 119 when the substrate transport unit 11 is not disposed at the setup position. Control to lock the conveyor cover 14 and to release the lock of the conveyor cover 14 so that the conveyor cover 14 can be moved to the open position when the substrate transport unit 11 is disposed at the setup position. By configuring so that the substrate transport unit 11 is placed at the setup position by controlling the lock state of the conveyor cover 14 based on whether or not the substrate transport unit 11 is placed at the setup position. Thus, it is possible to reliably prevent the conveyor cover 14 from being moved to the open position. As a result, the conveyor cover 14 can be moved to the open position only when the opening gap 500 can be reliably set to a predetermined value or less (for example, 6 mm or less (4 mm in the present embodiment)). .

  In the present embodiment, a Y-axis drive unit 115 that moves the substrate transport unit 11 is provided, and when the main control unit 101 performs the setup of the first printing apparatus 1, the substrate transport unit 11 is arranged at the setup position. After the Y-axis drive unit 115 is operated as described above, the substrate transport unit 11 is configured to set up the first printing apparatus 1 by performing control to apply a brake to the Y-axis drive unit 115. Since the movement of the substrate transport unit 11 is regulated after the position is moved to the setup position, the substrate transport unit 11 can be prevented from being displaced from the setup position. Also by this, the opening gap 500 when the conveyor cover 14 is located at the open position can be reliably set to a predetermined value or less (for example, 6 mm or less (4 mm in the present embodiment)).

  In the present embodiment, the first printing apparatus 1 is provided with the gas spring 16 that holds the state in which the conveyor cover 14 is located at the open position when the first printing apparatus 1 is set up. The shift of the conveyor cover 14 from the open position can be suppressed by the gas spring 16 when setting up 1.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above embodiment, a printing machine is shown as an example of the substrate manufacturing apparatus of the present invention, but the present invention is not limited to this. In the present invention, for example, a board manufacturing apparatus other than a printing machine such as a component mounting apparatus may be used.

  Moreover, in the said embodiment, the example of the structure which controls both a 1st printing apparatus (1st working apparatus) and a 2nd printing apparatus (2nd working apparatus) by the main control part as a control part of this invention is shown. However, the present invention is not limited to this. In the present invention, a separate control unit may be provided for each of the first working device and the second working device, and they may be configured to separately execute the processing at the time of setup shown in FIG.

  In the above embodiment, for convenience of explanation, the processing operation of the main control unit as the control unit of the present invention has been described using a flow-driven flowchart in which processing is performed in order along the processing flow. It is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

  Further, in the above embodiment, the maximum gap of the opening gap leading to the second working apparatus side between the opening / closing cover when the opening / closing cover is located at the open position and the substrate transport unit located at the setup position is 6 mm or less (4 mm). However, the present invention is not limited to this. In the present invention, the maximum gap of the opening gap when the opening / closing cover is located at the open position may be a predetermined value or less that is smaller than the maximum gap of the opening gap when the opening / closing cover is located at the shielding position. However, it is preferable that the maximum gap of the opening gap when the opening / closing cover is located at the open position is 6 mm or less.

  Moreover, although the example of the structure which can move a board | substrate conveyance part was shown in the said embodiment, this invention is not limited to this. In the present invention, the substrate transfer unit may not move.

  Moreover, although the example which uses a gas spring as an open mechanism was shown in the said embodiment, this invention is not limited to this. In the present invention, the opening mechanism may be other than a gas spring. For example, a leaf spring or a coil spring may be used.

1 First printing device (first working device)
2 Second printing device (second working device)
11 Board transport section 12 Solder printing unit 14 Conveyor cover (open / close cover)
16 Gas spring (opening mechanism)
100 printing machine (substrate manufacturing equipment)
101 Main control unit (control unit)
115 Y-axis drive unit (drive source)
119 Position sensor (detector)
200 Substrate 500 Opening gap

Claims (10)

A first working device including a substrate transport unit that transports a substrate; an open position that exposes the substrate transport unit when performing setup; and an open / close cover that is movable to a shielding position that covers the substrate transport unit;
A second working device disposed adjacent to the first working device;
The opening / closing cover has a maximum interval of an opening gap between the opening / closing cover when the opening / closing cover is located at the open position and the substrate transport unit located at the set-up position, which leads to the second working device side, The substrate manufacturing apparatus, wherein the opening / closing cover is formed in a shape that is smaller than a predetermined value smaller than a maximum interval of the opening gap when the opening / closing cover is located at the shielding position.   2. The substrate manufacturing apparatus according to claim 1, wherein the first working device is configured to perform setup by moving the open / close cover to an open position while the second working device is operating. 3. .   The opening / closing cover has a maximum gap of the opening gap between a lower end portion of the opening / closing cover and the substrate transport unit positioned at the setup position when the opening / closing cover is located at the open position. 3. The substrate manufacturing apparatus according to claim 1, wherein the substrate manufacturing apparatus is formed in a shape that is equal to or smaller than a predetermined value that is smaller than a maximum interval of the opening gap when the is positioned at the shielding position. A control unit that controls at least the operation of the first working device;
The control unit is configured to perform control to move the substrate transfer unit to the setup position when the first work device is set up while the second work device is operating. The board | substrate manufacturing apparatus of any one of Claims 1-3. A detection unit for detecting that the substrate transport unit has moved to the setup position;
The substrate manufacturing apparatus according to claim 4, wherein the control unit is configured to determine whether or not the substrate transport unit is disposed at the setup position based on a detection result of the detection unit. .   The control unit locks the open / close cover based on the detection result of the detection unit so that the open / close cover is not moved to the open position when the substrate transport unit is not disposed at the setup position. And when the substrate transport unit is disposed at the setup position, control is performed to unlock the open cover so that the open cover can be moved to the open position. The board | substrate manufacturing apparatus of Claim 5 comprised. A drive source for moving the substrate transport unit;
The controller controls the brake to be applied to the drive source after operating the drive source so that the substrate transport unit is disposed at the setup position when the first work apparatus is set up. The board | substrate manufacturing apparatus of any one of Claims 4-6 comprised so that it might perform.   The said 1st working device further contains the open mechanism which hold | maintains the state in which the said opening-and-closing cover is located in the said open position when setting up the said 1st working device. Board manufacturing equipment.   The substrate manufacturing method according to claim 1, wherein the opening / closing cover is formed in a shape such that a maximum interval of the opening gap is 6 mm or less when the opening / closing cover is located at the open position. apparatus. A first printing apparatus including a substrate transport unit that transports a substrate, an open position that exposes the substrate transport unit when performing setup, and an open / close cover that can be moved to a shielding position that covers the substrate transport unit;
A second printing device disposed adjacent to the first printing device;
A solder printing unit for printing solder on the substrate;
The opening / closing cover has a maximum interval of an opening gap between the opening / closing cover when the opening / closing cover is located at the open position and the substrate transport unit located at the set-up position, which leads to the second working device side, A printing machine, wherein the opening / closing cover is formed in a shape that is smaller than a predetermined value smaller than a maximum interval of the opening gap when the opening / closing cover is located at the shielding position.

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