JP5336664B2 - レーザーマッチホーニング加工システムおよび方法 - Google Patents
レーザーマッチホーニング加工システムおよび方法 Download PDFInfo
- Publication number
- JP5336664B2 JP5336664B2 JP2012529113A JP2012529113A JP5336664B2 JP 5336664 B2 JP5336664 B2 JP 5336664B2 JP 2012529113 A JP2012529113 A JP 2012529113A JP 2012529113 A JP2012529113 A JP 2012529113A JP 5336664 B2 JP5336664 B2 JP 5336664B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- injection needle
- dimension
- match honing
- injector body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B15/00—Machines or devices designed for grinding seat surfaces; Accessories therefor
- B24B15/08—Machines or devices designed for grinding seat surfaces; Accessories therefor for grinding co-operating seat surfaces by moving one over the other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Fuel-Injection Apparatus (AREA)
- Laser Beam Processing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910173534A CN102019504B (zh) | 2009-09-15 | 2009-09-15 | 激光适配珩磨系统和方法 |
| CN200910173534.3 | 2009-09-15 | ||
| PCT/CN2010/076940 WO2011032495A1 (en) | 2009-09-15 | 2010-09-15 | Laser match honing system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013504435A JP2013504435A (ja) | 2013-02-07 |
| JP5336664B2 true JP5336664B2 (ja) | 2013-11-06 |
Family
ID=43758112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012529113A Expired - Fee Related JP5336664B2 (ja) | 2009-09-15 | 2010-09-15 | レーザーマッチホーニング加工システムおよび方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8841575B2 (enExample) |
| EP (1) | EP2477787B1 (enExample) |
| JP (1) | JP5336664B2 (enExample) |
| CN (1) | CN102019504B (enExample) |
| BR (1) | BR112012005773B1 (enExample) |
| IN (1) | IN2012DN00276A (enExample) |
| WO (1) | WO2011032495A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111113203A (zh) * | 2019-12-26 | 2020-05-08 | 苏州信能精密机械有限公司 | 一种阀套精密配珩的加工工艺 |
| CN116493760A (zh) * | 2023-04-24 | 2023-07-28 | 中国长江电力股份有限公司 | 运用于水电机组导通部件表面的激光珩磨装置及方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH622204A5 (enExample) * | 1978-07-06 | 1981-03-31 | Sidco Sa | |
| US5112131A (en) * | 1981-02-27 | 1992-05-12 | Diffracto, Ltd. | Controlled machining of combustion chambers, gears and other surfaces |
| JPS6158951A (ja) | 1984-08-29 | 1986-03-26 | Daihatsu Motor Co Ltd | 内燃機関のシリンダブロック製造方法 |
| DE3932328A1 (de) * | 1989-09-28 | 1991-04-11 | Opel Adam Ag | Verfahren zur bearbeitung von durch reibung hochbeanspruchten flaechen in brennkraftmaschinen und vorrichtung zur durchfuehrung des verfahrens |
| JPH03146284A (ja) * | 1989-11-01 | 1991-06-21 | Ricoh Co Ltd | 動圧流体軸受の製造方法 |
| JPH0631469A (ja) * | 1992-06-19 | 1994-02-08 | Sony Corp | 動圧軸受用軸加工装置 |
| US5504303A (en) * | 1994-12-12 | 1996-04-02 | Saint-Gobain/Norton Industrial Ceramics Corp. | Laser finishing and measurement of diamond surface roughness |
| JP3728720B2 (ja) * | 2000-07-19 | 2005-12-21 | ミクロン精密株式会社 | エンジン用のピストンを研削する方法 |
| JP2002113641A (ja) * | 2000-10-10 | 2002-04-16 | Micron Seimitsu Kk | ニードルのマッチング研削方法、および同研削装置 |
| JP3721991B2 (ja) | 2001-01-29 | 2005-11-30 | 住友金属工業株式会社 | 渦電流式減速装置の制動力制御方法 |
| JP2002283196A (ja) * | 2001-03-26 | 2002-10-03 | Micron Seimitsu Kk | 適合研削方法および適合研削装置 |
| JP2004237399A (ja) * | 2003-02-06 | 2004-08-26 | Komatsu Ltd | 工作機械 |
| US7323657B2 (en) * | 2004-08-03 | 2008-01-29 | Matsushita Electric Industrial Co., Ltd. | Precision machining method using a near-field scanning optical microscope |
| DE202005011772U1 (de) * | 2005-04-07 | 2005-11-17 | Gehring Gmbh & Co. Kg | Laser-Honwerkzeug zum Erzeugen einer durch Mikrotaschen gebildeten Struktur auf einer tribologisch beanspruchten Fläche eines Werkstücks |
| DE202005005905U1 (de) * | 2005-04-07 | 2005-06-16 | Gehring Gmbh & Co. Kg | Vorrichtung zur Erzeugung von Vertiefungen in den zylindrischen Innenflächen von Bohrungen mit einem Laserstrahl |
| US20080000887A1 (en) * | 2006-06-28 | 2008-01-03 | Seagate Technology Llc | Method of laser honing |
| TW200936287A (en) * | 2007-11-26 | 2009-09-01 | Nat Inst Of Advanced Ind Scien | Mold removing method |
-
2009
- 2009-09-15 CN CN200910173534A patent/CN102019504B/zh active Active
-
2010
- 2010-09-15 US US13/496,295 patent/US8841575B2/en not_active Expired - Fee Related
- 2010-09-15 EP EP10816699.2A patent/EP2477787B1/en active Active
- 2010-09-15 WO PCT/CN2010/076940 patent/WO2011032495A1/en not_active Ceased
- 2010-09-15 IN IN276DEN2012 patent/IN2012DN00276A/en unknown
- 2010-09-15 BR BR112012005773-1A patent/BR112012005773B1/pt not_active IP Right Cessation
- 2010-09-15 JP JP2012529113A patent/JP5336664B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP2477787A4 (en) | 2013-07-17 |
| BR112012005773A2 (pt) | 2017-05-30 |
| EP2477787B1 (en) | 2014-11-12 |
| BR112012005773B1 (pt) | 2020-12-01 |
| CN102019504B (zh) | 2012-08-29 |
| US8841575B2 (en) | 2014-09-23 |
| US20120273471A1 (en) | 2012-11-01 |
| EP2477787A1 (en) | 2012-07-25 |
| WO2011032495A1 (en) | 2011-03-24 |
| IN2012DN00276A (enExample) | 2015-05-08 |
| CN102019504A (zh) | 2011-04-20 |
| JP2013504435A (ja) | 2013-02-07 |
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