JP5319310B2 - Processing apparatus and processing method for plate member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing device that can smoothly peel an adhesion sheet from the plate-like member in postprocessing, and to provide a method for processing a plate-like member. <P>SOLUTION: In a process of forming a peel-cut-hook part on a wafer W by the wafer processing device 1 and peeling a protection sheet S from the wafer W thereafter, the protection sheet S can be reliably peeled only by drawing the peel-cut-hook part at the start of the peeling. Therefore, raising of the wafer W can be suppressed by reliably peeling the protection sheet S from a peeling start position along the peel-cut-hook part without drawing the protection sheet S at a position apart from an end thereof or drawing a sheet for mounting at the start of the peeling of the protection sheet S, so that while the wafer W is prevented from being broken, the protection sheet S can be smoothly peeled. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a plate member processing apparatus and a processing method for processing a plate member such as a semiconductor wafer.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a wafer processing apparatus that grinds the back surface of a wafer in order to reduce the thickness of a semiconductor wafer that is a plate-like member (hereinafter simply referred to as a wafer) is known (for example, see Patent Document 1). . In this processing apparatus, the inner side of the wafer is ground deeper than the outer edge part, so that the inner side is formed thinner than the outer edge part, that is, the outer edge part has an annular convex part protruding in the thickness direction. A wafer having a recess on the inner side surrounded by is manufactured. Moreover, in the processing apparatus of Patent Document 1, in order to protect the surface of the wafer on which the circuit surface is formed in the grinding process, a protective sheet is attached to the wafer surface, and the protective sheet is peeled off after the grinding process. It has become.

  On the other hand, as a peeling device that peels off the protective sheet affixed to the wafer surface from the wafer, the peeling tape and the wafer are moved relative to each other while the peeling tape is fed out and adhered to the surface of the protective sheet. There has been proposed one that winds a protective sheet together with a tape for use in peeling off the protective sheet from the wafer (see, for example, Patent Document 2). In this peeling apparatus, a peeling tape is bonded to the edge of the protective sheet corresponding to the outer edge of the wafer, and the protective sheet is wound up while sequentially bonding the peeling tape from the edge toward the center. It comes to peel off from the surface.

JP 2007-19461 A JP 2007-311612 A

By the way, when the peeling tape is bonded to the protective sheet and peeled off as in the conventional peeling device, the peeling tape is not adhered correctly to the edge of the protective sheet, which is the adhesion starting point. The edge of the protective sheet pulled in step cannot be peeled off from the wafer, causing a peeling failure.
On the other hand, if the peeling tape protrudes from the edge of the protective sheet and adheres to the mounting sheet, the wafer is pulled together with the mounting sheet, and the wafer may rise up and be damaged. There is.

  The present invention has been devised by paying attention to the inconveniences as described above, and its purpose is to process a plate-like member that enables the adhesive sheet to be smoothly peeled from the plate-like member in a later step. It is to provide an apparatus and a processing method.

In order to achieve the above object, the plate-like member processing apparatus of the present invention comprises a holding means for holding a plate-like member having an adhesive sheet affixed on one surface from the side of the adhesive sheet, and the vicinity of the outer edge of the plate-like member. And a control means for controlling the holding means and the hook portion forming means in conjunction with each other, and a hooking portion forming means for forming a peeling hook portion for peeling the adhesive sheet from the plate-like member. And the notch portion forming means includes a grinding means for grinding the plate-like member to a predetermined thickness from the other surface of the plate-like member, and the control means is an outer edge of the plate-like member. And controlling the holding means and the grinding means so as to grind the end region surrounded by the line connecting the two predetermined points and the outer edge of the plate-like member with different thicknesses relative to other regions, The peeling notch by the end region Ru is constructed, it has adopted the configuration that.

  On the other hand, the processing method of the plate-shaped member of the present invention includes a step of holding a plate-shaped member having an adhesive sheet affixed on one surface from the side of the adhesive sheet, and a portion of the plate-shaped member near the outer edge. A notch portion forming step for forming a peeling notch portion for peeling the adhesive sheet from the shaped member, and in the notch portion forming step, a line connecting predetermined two points on the outer edge of the plate-like member; An end region surrounded by the outer edge of the plate-like member is ground with a thickness different from that of the other regions, and the end cut region is configured by the end region.

  According to the present invention as described above, when the adhesive sheet is peeled off from the plate-like member in a subsequent step, the edge of the adhesive sheet is formed by forming a peeling cut-off portion near the outer edge of the plate-like member such as a semiconductor wafer. Peeling can be easily started from a peeling notch located at the edge. And by starting peeling from a peeling notch part, the rising of the plate-shaped member at the time of a peeling start can be suppressed, and an adhesive sheet can be peeled smoothly, preventing damage to a plate-shaped member.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a side view of a wafer processing apparatus 1 that processes a semiconductor wafer that is a plate-like member.
In FIG. 1, a wafer processing apparatus 1 is an apparatus for processing a semiconductor wafer (hereinafter simply referred to as a wafer W) on which a circuit is formed on a surface WA, which is one surface, and a protective sheet (adhesive sheet) S is attached. The holding means 2 for holding the wafer W from the side of the protective sheet S, and a wafer folding as a peeling cut-off portion on a part near the outer edge WC of the wafer W from the back surface WB side which is the other surface of the wafer W. Grinding means 3 and cutting means 4 as notch forming means for forming a curved portion WD (described later), and control means 5 for controlling these tables 2, grinding means 3 and cutting means 4 in conjunction with each other. Configured.

  The holding means 2 has a table 22 having a holding surface 21 that holds and holds the wafer W from the side of the protective sheet S with a plurality of suction ports (not shown), and the table 22 in the XY directions (the left and right directions in FIG. And a table moving unit 23 that rotates the table 22 around the Z-axis direction. In the holding means 2, the table moving unit 23 can move the table 22 and the wafer W held on the upper surface thereof in an appropriate position in the XY direction and in an appropriate direction.

  The grinding means 3 grinds the wafer W from the back surface WB of the wafer W to a predetermined thickness. The grinding unit 3 is provided with a Z-axis motor 31 provided on the back side of the paper surface of FIG. The rotary motor 33 is fixed to the slider 32 and rotates the output shaft 34 around the Z-axis direction, and the grinding wheel 35 is fixed to the output shaft 34.

  The cutting means 4 cuts the wafer W from the back surface WB of the wafer W to a predetermined depth. The cutting means 4 is provided on the left side of FIG. 1 with respect to the table 22 and extends vertically (Z-axis direction). A single-axis robot 43 that is fixed to the slider 42 of the single-axis robot 41 and extends in the depth direction (Y-axis direction) of FIG. 1 and a slider 44 of the single-axis robot 43 that is fixed around the X-axis direction. A cutting motor 45 for rotating the output shaft and a rotating blade 46 attached to the output shaft are provided.

  The control means 5 is configured to control the movement of the table 22 in an appropriate position in the XY direction and in an appropriate direction by transmitting a command to the table moving unit 23 of the holding means 2. The control means 5 transmits a command to the Z-axis motor 31 of the grinding means 3 to control the movement of the grinding wheel 35 to an appropriate position in the vertical direction, and also transmits a command to the rotary motor 33. The grinding wheel 35 is configured to rotate. Further, the control means 5 transmits a command to the single-axis robot 41 of the cutting means 4 so as to control the movement of the rotary blade 46 to an appropriate position in the vertical direction, and also transmits a command to the single-axis robot 43. The rotary blade 46 is rotationally driven by moving the rotary blade 46 in the Y-axis direction and further sending a command to the cutting motor 45.

The wafer processing apparatus 1 described above processes the wafer W as follows to form the wafer bent portion WD.
First, as an example of forming the wafer bent portion WD using only the grinding means 3, as shown in FIG. 2, a line connecting predetermined two points A and B on the outer edge of the wafer W, and the outer edge of the wafer W A configuration in which a substantially D-shaped end region surrounded by WC is ground with a grinding wheel 35 so as to have a thickness different from that of the grinding target region WE, which is another region, can be employed. At this time, the control means 5 rotates the table 22 in a predetermined direction and lowers the grinding wheel 35 rotated by the rotary motor 33 while moving it in the XY directions by the Z-axis motor 31, thereby bending the wafer. The holding means 2 and the grinding means 3 are controlled so that the area other than the part WD is ground excessively than the wafer bent part WD. By such processing, the wafer bent portion WD protrudes from the back surface WB1 of the wafer W after being ground and is substantially D-shaped in plan view surrounded by a line connecting the two points A and B and the outer edge WC. A shaped end region is formed. Here, the width dimension L of the most protruding portion of the outer edge WC in the wafer bent portion WD is set to about 3 mm or less of the width of the surplus region where no circuit is formed.

  On the other hand, as an example of forming the wafer bent portion WD using only the cutting means 4, as shown in FIG. 3, the wafer W is moved along a line connecting predetermined two points A and B on the outer edge of the wafer W. A configuration in which a cut groove WF that reaches the protective sheet S by cutting with the rotating blade 46 is formed can be employed. At this time, the control means 5 moves the table 22 in the Y-axis direction, lowers the rotary blade 46 rotated by the cutting motor 45 by the single-axis robot 41, and further moves the rotary blade 46 by the single-axis robot 43 to Y. By moving in the axial direction, the holding means 2 and the cutting means 4 are controlled so that the wafer W is cut to form the cut grooves WF. By such processing, the wafer bent portion WD is formed with an end region having a substantially D shape in plan view surrounded by a line connecting the two points A and B and the outer edge WC. The cut groove WF does not necessarily reach the protective sheet S, and may be formed at a depth from the back surface WB of the wafer W to a middle position in the thickness direction.

Further, the wafer bent portion WD may be formed by using both the grinding means 3 and the cutting means 4, and in that case, the wafer W is cut by the rotating blade 46 as shown in FIG. After forming the cut groove WF reaching the protective sheet S, the grinding target area WE is ground with the grinding wheel 35. By such processing, the wafer folding having a substantially D-shaped end region projecting from the back surface WB1 of the ground wafer W after grinding and having a cut groove WF at the boundary position with the ground back surface WB1. A curved portion WD is formed.
Further, the grinding target region WG, which is a substantially D-shaped end region surrounded by a line connecting predetermined two points A and B on the outer edge of the wafer W and the outer edge WC of the wafer W, is ground using the grinding means 3. By grinding with the grindstone 35, a wafer bent portion WD thinner than the back surface WB portion of the wafer W before grinding may be formed as shown in FIG. 4B.
Furthermore, by forming the cut groove WF using both the grinding means 3 and the cutting means 4, and then grinding the grinding target area WG with the grinding wheel 35, as shown in FIG. Wafer bent portion WD is formed which is thinner than the back surface WB portion of wafer W and has cut groove WF at the boundary position.

  On the other hand, as an example of forming the wafer bent portion WD without using the grinding means 3 and the cutting means 4, as shown in FIG. 4D, a weakened portion WH that weakens a predetermined portion of the wafer W is provided. The structure to form can be employ | adopted. As shown in FIG. 5, such a weakened portion WH is formed by using a weakening unit 6 as a notch forming unit provided in the wafer processing apparatus 1. The weakening means 6 irradiates a laser beam along a line connecting the two points A and B (see FIGS. 2 and 3) from the back surface WB of the wafer W to weaken the wafer W to form a weakened portion WH. A single-axis robot 61 provided on the left side of FIG. 5 with respect to the table 22 and extending vertically (in the Z-axis direction), and fixed to a slider 62 of the single-axis robot 61 and fixed in the depth direction of FIG. A single-axis robot 63 extending in the Y-axis direction) and a laser irradiation unit 65 fixed to the slider 64 of the single-axis robot 63 are configured. Then, the control unit 5 controls the holding unit 2 and the weakening unit 6 to move the table 22 in the Y-axis direction and to irradiate the laser irradiation unit 65 lowered by the single-axis robot 61 with a laser beam. The laser irradiation unit 65 is moved in the Y-axis direction by the axis robot 63. As a result, a weakened portion WH is formed along a line connecting the two points A and B, and the wafer bent portion WD which is an end region having a substantially D shape in plan view surrounded by the weakened portion WH and the outer edge WC. Is formed.

  The wafer W on which the wafer bent portion WD is formed as described above is transferred to a sheet sticking device (not shown) and integrated with a mounting sheet MS described later, and then transferred to the sheet peeling device 7 shown in FIG. Then, the protective sheet S is peeled off from the surface WA of the wafer W. In the sheet sticking apparatus, a mounting sheet MS is stuck to the back surface WB of the wafer W and the ring frame RF installed so as to surround the wafer W, and the wafer W and the ring frame RF are connected via the mounting sheet MS. Integrated. In addition, before sticking the mounting sheet MS, an adhesive tape T having a peeling process applied to the back surface (the opposite surface of the adhesive layer) on the opposite surface to which the adhesive sheet S of the wafer bent portion WD is previously attached. Is attached so that the wafer bent portion WD and the mounting sheet MS are not bonded. Thus, the wafer W is conveyed to the sheet peeling apparatus 7 in a state integrated with the ring frame RF.

  The sheet peeling apparatus 7 includes a holding table 71 that holds the wafer W integrated with the ring frame RF, a single-axis robot 72 that is provided below the holding table 71, an upper side of the holding table 71, and a back side of FIG. A single-axis robot 73 provided on the side, and suction holding means 74 slidably supported by the single-axis robot 73 are provided.

  The holding table 71 is configured to be able to suck and hold the wafer W and the ring frame RF from the mounting sheet MS side through a suction port (not shown). In the holding table 71, a push-up means 75 for raising the wafer bent portion WD is provided below the wafer bent portion WD of the wafer W. The push-up means 75 has an air cylinder 751 provided inside the holding table 71 and a push-up pin 752 supported by the air cylinder 751 so as to be able to protrude and retract from the upper surface of the holding table 71. By projecting upward, the wafer bent portion WD is raised via the mounting sheet MS.

  The single-axis robot 72 is configured such that its slider 76 is fixed to the lower surface of the holding table 71, and the holding table 71 is slid in the left-right direction in FIG. Further, the suction holding means 74 includes a turning arm 741 supported by the slider 77 of the single-axis robot 73 and a suction pad 742 fixed to the tip of the turning arm 741. The suction holding means 74 is configured to suck and hold the wafer bent portion WD from the protective sheet S side by the suction pad 742 and to be slidable in the left-right direction in FIG. 6 by the single-axis robot 73.

  In the above sheet peeling apparatus 7, as shown in FIG. 6A, the wafer bent portion WD is sucked and held by the suction pad 742, and the wafer bent portion WD is raised by the push-up pin 752 of the push-up means 75. At this time, as described above, since the peel-treated surface of the adhesive tape T is not bonded to the mounting sheet MS, the wafer bent portion WD is easily raised. Next, as shown in FIG. 6B, the holding table 71 is slid in the left direction in FIG. 6 by the single-axis robot 72, and the suction holding means 74 is slid in the right direction in FIG. Thus, the protective sheet S can be moved relative to the wafer W, and the protective sheet S can be peeled off from the surface WA of the wafer W.

According to the present embodiment as described above, the following effects are obtained.
That is, by forming the wafer bent portion WD on the wafer W by the wafer processing apparatus 1, in the process of peeling the protective sheet S from the wafer W after that, the wafer bent portion WD is simply held and pulled at the start of peeling. The protective sheet S can be reliably peeled off. Therefore, at the start of peeling of the protective sheet S, the protective sheet along the wafer bent portion WD is not pulled without pulling the position away from the end of the protective sheet S or pulling the mounting sheet MS. By reliably peeling from the peeling start position of S, the rising of the wafer W can be suppressed, and the protective sheet S can be smoothly peeled while preventing the wafer W from being damaged.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, although the case where the plate-like member is a semiconductor wafer is shown in the embodiment, the plate-like member is not limited to the semiconductor wafer W, and other plates such as a glass plate, a steel plate, or a resin plate are used. A semiconductor wafer can be exemplified as a silicon wafer, a compound wafer, and the like. The adhesive sheet attached to the plate-like member is not limited to the protective sheet S, but any other sheet, film, It may be an adhesive sheet having an arbitrary use and shape such as a tape.
Further, the peeling notch formed on the plate-like member is not limited to that of the above-described embodiment. For example, if the plate-like member is a flat rectangular shape, the form of the peeling notch is also rectangular or triangular. If the plate-like member is a plane triangle shape, the form of the peeling notch may be triangular or trapezoidal, that is, the form of the peeling notch is the outer edge shape of the plate-like member. It can be arbitrarily selected according to.

  Moreover, in the said embodiment, as a formation method of a peeling notch part, the method using the grinding means 3, the method using the cutting means 4, the method using both the grinding means 3 and the cutting means 4, and the weakening means 6, the grinding means 3 and the weakening means 6 may be combined, the cutting means 4 and the weakening means 6 may be combined, or the grinding means 3 and the cutting means. 4 and the weakening means 6 may be combined to form a peeling notch. Furthermore, as a method for forming the peeling cut portion, a method other than the grinding means 3, the cutting means 4, and the weakening means 6 can be used, and the forming method is not particularly limited.

  Moreover, in the said embodiment, after integrating with the sheet | seat for mounting MS with the sheet sticking apparatus with respect to the wafer W which formed the wafer bending part WD with the wafer processing apparatus 1, the protective sheet S is peeled with the sheet peeling apparatus 7. FIG. Although the procedure has been described, it is not limited to such a procedure. That is, the protective sheet S may be peeled from the wafer W without integrating the wafer W and the mounting sheet MS. Further, the configuration of the sheet peeling apparatus 7 is not limited to that of the above embodiment, and for example, a peeling tape is attached to the protective sheet S corresponding to the wafer bent portion WD, and the peeling tape and the wafer W are relatively moved. By doing so, a peeling device configured to peel the protective sheet S from the wafer W may be used.

  In the above-described embodiment, the configuration other than the grinding target region WE is described as not being ground. However, as long as the wafer bent portion WD has a thickness different from that of the other region, the configuration other than the grinding target region WE is ground. May be. Further, the line connecting the two predetermined points A and B on the outer edge of the wafer W may not be a straight line, and may be formed to be a curve or a non-straight line between the curve and the curve.

The side view of the processing apparatus which concerns on one Embodiment of this invention. The perspective view and fragmentary sectional view of the plate-shaped member processed with the processing apparatus of FIG. The perspective view and fragmentary sectional view of the other plate-shaped member processed with the processing apparatus of FIG. The fragmentary sectional view of the plate-shaped member different from FIG. The side view of the other form in the processing apparatus of FIG. Operation | movement explanatory drawing of the sheet peeling apparatus used in the post process of the processing apparatus of FIG.

1 Wafer processing equipment (processing equipment)
2 Holding means 3 Grinding means (slipping part forming means)
4 Cutting means (cutting portion forming means)
5 Control means 6 Vulnerability means (slipping part forming means)
S protective sheet (adhesive sheet)
W wafer (plate-like member)
WA surface (one side)
WB back side (the other side)
WC Outer edge WD Wafer bent part (peeling part)

Claims (2)

Holding means for holding the plate-like member having the adhesive sheet affixed on one surface from the adhesive sheet side;
A notch portion forming means for forming a peeling notch portion for peeling the adhesive sheet from the plate-like member in a part near the outer edge of the plate-like member;
Control means for controlling the holding means and the notch portion forming means in conjunction with each other ,
The notch portion forming means comprises a grinding means for grinding the plate member from the other surface of the plate member to a predetermined thickness,
The control means includes
The holding means and the grinding so as to grind an end region surrounded by a line connecting two predetermined points on the outer edge of the plate-like member and the outer edge of the plate-like member with different thicknesses relative to other regions. Control means,
Processing apparatus of the plate-like member, characterized in Rukoto constructed that the release hap portion by said end region. Holding the plate-like member having the adhesive sheet affixed on one side thereof from the adhesive sheet side;
A notch portion forming step for forming a peeling notch portion for peeling the adhesive sheet from the plate-like member in a part near the outer edge of the plate-like member;
In the notch forming step,
Grinding the end region surrounded by the line connecting two predetermined points on the outer edge of the plate-like member and the outer edge of the plate-like member with different thicknesses relative to other regions,
The method for processing a plate-like member, wherein the peeling cut-off portion is constituted by the end region.

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