JP5298486B2 - Light source device and mounting member - Google Patents

Light source device and mounting member Download PDF

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JP5298486B2
JP5298486B2 JP2007250622A JP2007250622A JP5298486B2 JP 5298486 B2 JP5298486 B2 JP 5298486B2 JP 2007250622 A JP2007250622 A JP 2007250622A JP 2007250622 A JP2007250622 A JP 2007250622A JP 5298486 B2 JP5298486 B2 JP 5298486B2
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light source
mounting
portion
mounting member
formed
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JP2009081335A (en
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好伸 末広
浩二 田角
一恵 田形
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豊田合成株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting member excellent in heat dissipation and easy to make electrical connection in manufacturing, and a light source device including the member. <P>SOLUTION: A heat sink 2 having a threaded hole 21 having an internal thread formed on its inner periphery, the mounting member 3 including a thread 31 having an external thread screwed with the internal thread formed on its outer periphery, a mounting part 33 protruding from the thread 31 in the axial direction of the external thread and formed to be radially smaller than the thread 31 and a wiring hole 35 passing axially through the thread 31, and a light source part 4 mounted on the mounting part 33 of the mounting member 3 and having a LED element are provided. Heat transfer to the heat sink 2 is excellent since a contact area between the mounting member 3 and the heat sink 2 is large. In addition, the mounting member 3 can screw with the heat sink 2 while a wire 7 is connected with the light source part 4. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a mounting member on which a light source unit having an LED element is mounted, and also relates to a light source device including the mounting member.

  As a light source device using an LED element, an LED light source is attached to a planar substrate, and the planar substrate is screwed into a reflecting mirror (for example, see Patent Document 1). In the light source device described in Patent Document 1, the planar substrate includes at least one high heat conducting portion that is in thermal contact with the LED light source. In addition, the reflecting mirror is provided with an opening that opens toward the irradiated region. Further, Patent Document 1 illustrates a state in which a planar substrate and an external power supply source are electrically connected.

As another light source device, a light-emitting diode chip is attached to a metal base, and the metal base has a screw and is closely and thermally connected to a heat sink and mechanically connected (see, for example, Patent Document 2). ). The metal base screw has a smaller diameter than the light emitting diode chip mounting portion. In the light source device described in Patent Document 2, a circuit board is placed around a metal base, and a lead wire is connected to the conductive layer on the upper surface. The lead line penetrates an insulating layer formed on the metal base, extends vertically downward, and is connected to an external power source.
JP 2006-32348 A JP-A-2005-513815

However, in the light source device described in Patent Document 1, since the connection portion between the wiring and the planar substrate is exposed to the outside, the reliability of electrical connection is low. Moreover, since the heat generated in the LED light source is dissipated only by the portion having high heat conduction partially formed on the planar substrate, the heat dissipation performance is extremely low.
Further, in the light source device described in Patent Document 2, after the metal base is assembled to the heat sink, the leader line must be connected to the circuit board through the metal base insulating layer. The electrical connection work at the time of manufacture is extremely troublesome, and there is a problem that the manufacturing cost of the apparatus increases. Further, since the screw of the metal base has a smaller diameter than the mounting portion of the light emitting diode chip, the contact area of the screwed portion between the heat sink and the metal base is small, and heat transfer to the heat sink cannot be performed accurately.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a mounting member that is excellent in heat dissipation and that can be easily electrically connected at the time of manufacture, and a light source device including the mounting member. It is in.

According to the present invention, a plate-like heat radiating body having a screw hole in which an internal thread is formed on the inner periphery, and a threaded portion in which an external thread that engages with the internal thread is formed on the outer periphery and a flange is provided at one end in the axial direction And a mounting portion that protrudes from the screw portion in the axial direction of the male screw and is formed to be smaller in the radial direction than the screw portion, and a wiring hole that passes through the screw portion in the axial direction and communicates with the outside. A light source part having an LED element mounted on the mounting part of the mounting member, the flange part being in surface contact with the heat radiator, and the light source part sealing the LED element. A light source device that includes a glass sealing portion and includes a cover member that is fixed to the mounting portion of the mounting member, and light emitted from the light source portion is irradiated to the outside through the space between the radiator and the cover member. Is provided.

  The said light source device WHEREIN: It is preferable that the said light source part has a glass sealing part which seals the said LED element.

  The light source device may include a cover member fixed to the mounting portion of the mounting member, and light emitted from the light source portion may be irradiated to the outside through the space between the radiator and the cover member. it can.

  The light source device preferably includes an optical control member that is sandwiched between the mounting member and the cover member and optically controls light emitted from the light source unit.

  The said light source device WHEREIN: It is preferable that the said mounting member has a collar part extended in the radial direction outer side from the axial direction end of the said thread part, and surface-contacting with the said heat sink.

  The light source device preferably includes a blocking member that blocks relative rotation between the flange portion of the mounting member and the radiator.

  In addition, according to the present invention, a screw portion having a male screw formed on the outer periphery, and a light source that protrudes in the axial direction of the male screw from the screw portion and is smaller in the radial direction than the screw portion and has an LED element is mounted. There is provided a mounting member having a mounting portion for wiring and a wiring hole penetrating the screw portion in the axial direction.

  The mounting member preferably includes a flange portion extending radially outward from one axial end of the screw portion.

  ADVANTAGE OF THE INVENTION According to this invention, it is excellent in the heat dissipation at the time of heat_generation | fever of a light source part, and the electrical connection at the time of manufacture of a light source device is easy.

  1 to 5 show a first embodiment of the present invention, and FIG. 1 is a sectional view of a light source device.

  As shown in FIG. 1, the light source device 1 includes a heat radiating body 2 having a screw hole 21 in which an internal thread is formed on the inner periphery, and a mounting member having a threaded portion 31 in which an external thread that engages with the female screw is formed on the outer periphery. 3, a light source unit 4 having a glass-sealed LED 8 mounted on the mounting unit 32 of the mounting member 3, and an optical control unit 5 that optically controls light emitted from the light source unit 4.

The radiator 2 is made of, for example, aluminum (thermal conductivity: 200 W · m −1 · K −1 ), and has a main body 20 formed in a disk shape and a circular screw hole formed in the center of the main body 20 in a plan view. 21. A flange portion 22 extending upward is formed on the outer edge of the main body 20 in the circumferential direction.

FIG. 2 is a bottom view of the light source device.
As shown in FIG. 2, a plurality of fins 23 that extend downward and are parallel to each other are formed on the entire bottom surface of the main body 20. Each fin 23 is not formed within a predetermined range from the screw hole 21 so as not to interfere with the mounting member 3 screwed into the main body 20.

  The mounting member 3 has a flange portion 32 that extends radially outward from one axial end (the lower end in FIG. 1) of the screw portion 31. The flange portion 32 is formed over the circumferential direction of the screw portion 31 and is in contact with the lower surface of the main body 20 of the radiator 2.

  As shown in FIG. 1, the mounting member 3 includes a mounting portion 33 that is disposed at the center of the screw portion 31, protrudes upward from the upper surface of the screw portion 31, and is smaller in the radial direction than the screw portion 31. Yes. The mounting part 33 has a regular hexagonal shape when viewed from above, and the light source part 4 is mounted on each of the six side surfaces 33a. The upper surface of the mounting portion 33 is formed flat, and a cover member 6 to be described later is fixed. A female screw 34 for fixing the cover member 6 is formed on the upper surface of the mounting portion 33. In addition, a wiring hole 35 that penetrates the screw portion 31 in the vertical direction is formed in the screw portion 31 of the mounting portion 33. A wiring 7 for supplying power from the outside to the light source unit 4 is inserted into the wiring hole 35. In the present embodiment, a concave portion 36 is formed on the upper surface of the screw portion 31 along the mounting portion 33 in the circumferential direction. The wiring 7 inside the apparatus is accommodated in the recess 36.

FIG. 3 is a cross-sectional view of the light source unit. In FIG. 3, the mounting surface of the glass-sealed LED on the mounting substrate is shown as an upper surface.
As shown in FIG. 3, the light source unit 4 includes a mounting substrate 41 connected to the mounting unit 33 via a solder material (not shown), and a glass-sealed LED 8 mounted on the surface of the mounting substrate 41. Have. The glass-sealed LED 8 includes an LED element 82 made of a flip-chip GaN-based semiconductor material, a ceramic substrate 81 on which the LED element 82 is mounted, and a circuit pattern that is formed on the ceramic substrate 81 and supplies power to the LED element 82. 84 and a glass sealing portion 83 that seals the LED element 81 on the ceramic substrate 82. In this embodiment, three LED elements 82 arranged in a predetermined direction on a ceramic substrate 81 are mounted on one glass-sealed LED 8.

  In the LED element 82, an n-type layer, an MQW layer, and a p-type layer are formed in this order by epitaxially growing a group III nitride semiconductor on the surface of a growth substrate made of GaN. This LED element 82 is epitaxially grown at 700 ° C. or higher, its heat-resistant temperature is 600 ° C. or higher, and is stable with respect to the processing temperature in the sealing process using the low melting point heat-sealing glass. The LED element 82 has a p-side electrode provided on the surface of the p-type layer and a p-side pad electrode formed on the p-side electrode, and a part thereof is etched from the p-type layer to the n-type layer. The n-side electrode is formed on the exposed n-type layer. Bumps 85 are formed on the p-side pad electrode and the n-side electrode, respectively. In the present embodiment, the LED element 82 has a thickness of 250 μm and a 346 μm square. Further, the thickness dimension of the growth substrate of the LED element 22 is ½ or more of the dimension of one side of the LED element 22.

The ceramic substrate 81 is made of a polycrystalline sintered material of alumina (Al 2 O 3 ). As shown in FIG. 3, the circuit pattern 84 is formed on the upper surface of the ceramic substrate 81 and electrically connected to the LED element 82, and is formed on the lower surface of the ceramic substrate 81 and electrically connected to the mounting substrate 41. Electrode pattern 84b to be connected to each other, and via pattern 84c to electrically connect upper surface pattern 84a and electrode pattern 84b. The electrode pattern 84b is formed on both ends of the ceramic substrate 81 in a predetermined direction, one of which is a positive electrode and the other is a negative electrode. A heat radiation pattern 86 is formed between the electrode patterns 84 b on the back surface of the ceramic substrate 81.

  The upper surface pattern 84a, the electrode pattern 84b, and the heat dissipation pattern 86 are formed of a W layer formed on the surface of the ceramic substrate 81, a thin film Ni plating layer that covers the surface of the W layer, and a thin film shape that covers the surface of the Ni plating layer. An Ag plating layer. The via pattern 84c is made of W and is provided in a via hole penetrating the ceramic substrate 81 in the thickness direction. In the present embodiment, the electrode pattern 84b and the heat dissipation pattern 86 are formed in a rectangular shape. In the present embodiment, the heat radiation pattern 86 is formed so as to overlap the LED elements 82 in the thickness direction of the ceramic substrate 81.

The glass sealing portion 83 is made of ZnO—B 2 O 3 —SiO 2 —Nb 2 O 5 —Na 2 O—Li 2 O-based heat fusion glass. The composition of the glass is not limited to this. For example, the heat-sealing glass may not contain Li 2 O, or may contain ZrO 2 , TiO 2 or the like as an optional component. Good. Furthermore, the glass may be a sol-gel glass formed using a metal alkoxide as a starting material. The glass sealing portion 83 is formed in a rectangular parallelepiped shape on the ceramic substrate 81. The glass sealing portion 83 is formed by cutting a plate glass bonded to the ceramic substrate 81 by hot pressing together with the ceramic substrate 81 with a dicer. This heat-fusible glass has a glass transition temperature (Tg) of 490 ° C., a yield point (At) of 520 ° C., a coefficient of thermal expansion (α) at 100 ° C. to 300 ° C. of 6 × 10 −6 / ° C., and a refractive index. It is 1.7.

  Further, the phosphor 83 a is dispersed in the glass sealing portion 83. The phosphor 83a is a yellow phosphor that emits yellow light having a peak wavelength in a yellow region when excited by blue light emitted from the MQW layer. In the present embodiment, a YAG (Yttrium Aluminum Garnet) phosphor is used as the phosphor 83a. The phosphor 83a may be a silicate phosphor or a mixture of YAG and silicate phosphor in a predetermined ratio.

  As shown in FIG. 3, the mounting substrate 41 includes a substrate body 42 made of metal, an insulating layer 43 formed of resin formed on the substrate body 42, a circuit pattern 44 formed of metal formed on the insulating layer 43, And a resist layer 45 made of resin and formed on the circuit pattern 44.

The substrate body 42 is made of, for example, copper (thermal conductivity: 380 W · m −1 · K −1 ), and is connected via the heat radiation pattern 86 of each glass-sealed LED 8 and the solder material 46. The insulating layer 43 is made of, for example, polyimide resin, epoxy resin or the like, and insulates the substrate body 42 having conductivity and the circuit pattern 44. The circuit pattern 44 is made of, for example, copper having a thin film-like gold on the surface, and is connected to the electrode pattern 84 b of each glass-sealed LED 8 via a solder material 47. The resist layer 45 is made of, for example, an epoxy-based resin mixed with a titanium oxide filler and exhibits a white color. Thereby, the reflectance of the upper surface of the mounting substrate 41 is improved. The mounting substrate 41 has a pattern exposed portion where the circuit pattern 44 is exposed in order to be electrically connected to the wiring 7 disposed in the recess 36 of the mounting member 31.

FIG. 4 is a top view of the light source device.
As shown in FIG. 4, the optical control unit 5 is incident on the optical control member 51 for converting the light emitted from the glass-sealed LED 8 into light in the radial direction (horizontal direction in the figure) and the optical control member 51. And a light guide plate 52 for making the light in the axial direction (upward in the present embodiment) toward the outside of the apparatus. The optical control member 51 is disposed on the radially outer side of each glass-sealed LED 8, and the light guide plate 52 is disposed on the radially outer side of the optical control member 51. The optical control member 51 and the light guide plate 52 are fixed by being sandwiched between the screw portion 31 of the mounting member 3 and the cover member 6.

FIG. 5 is a cross-sectional view taken along the line AA in FIG. 5 shows a cross section different from FIG.
As shown in FIG. 5, the optical control member 51 is made of, for example, acrylic resin, surrounds the mounting portion 33 of the mounting member 3 in a plan view, and the radially outer edge contacts the flange portion 22 of the main body 20 of the radiator 2. Touch. The optical control member 51 includes an incident part 51a connected to the glass-sealed LED 8, a reflection surface 51b that reflects light incident on the optical control member 51, and an emission surface that emits light in the optical control member 51 to the outside. 51c. The incident part 51a has a shape for receiving each glass-sealed LED 8, and light emitted from each glass-sealed LED 8 is incident thereon. The reflection surface 51b is formed on the side of the optical control member 51 in the axial direction (vertical direction in FIG. 5), and exhibits a parabolic shape with the LED element 82 of the glass-sealed LED 8 as a focal point in the longitudinal section. The emission surface 51c is formed in parallel with the side surface 33a of the mounting portion 33 in the longitudinal section. In the present embodiment, the optical control member 51 is divided into six pieces in the circumferential direction corresponding to the six glass-sealed LEDs 8. The six divided bodies of the optical control member 51 have a trapezoidal shape that expands outward in the radial direction in a plan view, and the lower base forms an emission surface 51c. That is, the emission surface 51c of the optical control member 51 has a regular hexagonal shape in plan view (see FIG. 4).

  The light guide plate 52 is made of, for example, acrylic resin and is formed so as to surround the optical control member 51 in a plan view. The light guide plate 52 includes an incident surface 52a connected to the optical control member 51, a reflective surface 52b that reflects light incident on the light guide plate 52, and an output surface 52c that emits light in the light guide plate 52 to the outside. Have The incident surface 52a has the same shape as the emission surface 51c of the optical control member 51, and light emitted from the optical control member 51 is incident thereon. The reflection surface 52 b is formed in a stepped manner on one surface of the light guide plate 52, and the emission surface 52 c is formed flat on the other surface of the light guide plate 52. The light guide plate 52 is formed so as to become thinner outward in the radial direction.

  The reflection surface 52b alternately has parallel regions 52d parallel to the emission surface 52c and inclined regions 52e inclined by a predetermined angle with respect to the parallel region 52d in the radial direction. The parallel region 52d and the inclined region 52e are each formed in a ring shape in plan view. Each inclined region 52e is inclined by 45 ° with respect to the radial direction, and reflects the radial light incident from the incident surface 52a so as to become axial light toward the output surface 52c. The inclined regions 52e have the same radial dimension and are formed at equal intervals in the radial direction. In addition, the inclination angle, the radial dimension, and the interval of each inclined region 52e can be appropriately changed according to the use of the light source device 1. The innermost parallel region 52d in the radial direction is in contact with the main body 20 of the heat radiating body 2, and the reflection surface 52b is formed apart from the main body 20 except for the parallel region 52d. That is, a hollow portion S is formed between the reflecting surface 52 d and the main body 20 of the radiator 2.

  The cover member 6 is made of, for example, aluminum, is formed in a disk shape, and is fixed to the mounting member 3 with screws 61. In the present embodiment, the light emitted from the light source unit 4 is irradiated to the outside through the space between the radiator 2 and the cover member 6. The cover member 6 is made of, for example, aluminum, and a screw hole 62 through which the screw 61 is inserted is formed in the center in plan view. The cover member 6 contacts the radially outer end of the optical control member 51 and the radially inner end of the light guide plate 52.

  In the light source device 1 configured as described above, when a voltage is applied to each glass-sealed LED 8 through the wiring 7, blue light is emitted from each LED element 82 of each glass-sealed LED 8. A part of the blue light is converted to yellow by the phosphor 83a, and white light is emitted from each glass-sealed LED 8 by a combination of blue light and yellow light.

  The LED element 82 is flip-mounted using a GaN substrate having a thickness of ½ or more of the width of the element, and is further sealed with glass having a high refractive index (n = 1.7). Thereby, the light radiated | emitted upwards from the light emitting layer (MQW layer) of the LED element 82 reaches | attains the upper surface or side surface of the said element, without returning to a light emitting layer again. And there is nothing blocking the light such as electrodes and wires on the upper surface and side surface of the element, and it efficiently enters the glass from the interface with the glass having a critical angle of about 45 ° with respect to GaN (n = 2.4). Radiated externally. As a result, heat generation due to light recombination within the LED element 82 can be suppressed. Further, in the GaN crystal growth on the GaN substrate, the crystallinity is good and the LED element 82 has a high heat resistant temperature. Furthermore, since the GaN substrate is conductive, it is possible to increase the diffusibility of the current to the light emitting layer surface, and the luminous efficiency maintenance rate is increased even when the energization current is increased. Note that the same effect can be obtained by using a substrate other than a GaN substrate such as a SiC substrate, for example, regarding light extraction from the LED element 82 and diffusibility of current on the light emitting layer surface. Further, glass having a higher refractive index by adding Bi or the like may be used.

  Of the white light emitted from the glass-sealed LED 8 and entering the optical control member 51 from the incident portion 51a, the light incident on the reflection surface 51b of the optical control member 51 is reflected by the reflection surface 51a and is emitted to the emission surface 51c. Controlled to head. Thereby, most of the light emitted from each glass-sealed LED 8 is directed to the emission surface 51c. Note that some of the white light emitted from the glass-sealed LED 8 is slightly incident on the mounting substrate 41, but is reflected on the surface of the white resist layer 44, so there is almost no optical loss.

  The light incident on the exit surface 51c of the optical control member 51 enters the light guide plate 52 from the entrance surface 52a as light parallel to the exit slope 52c. When the light that has entered the light guide plate 52 enters the inclined regions 52d of the reflecting surface 52b, the light is reflected by the inclined regions 52d, enters the emitting surface 52c perpendicularly, and is emitted from the emitting surface 52c to the outside. In the present embodiment, since each inclined region 52d is ring-shaped, a plurality of concentric ring-shaped light emission is visually recognized in plan view.

  Further, a hollow portion S is formed between the reflecting surface 52b of the light guide plate 52 and the main body 20 of the heat radiating body 2, and the hollow portion S is air having a lower refractive index than the light guide plate 52 (refractive index: 1.0). Since it is satisfied, the condition for total reflection is satisfied at the reflection surface 52b, and almost all the light incident on the light guide plate 52 is extracted from the exit slope 52c. The light leaking from the reflecting surface 52 b to the region of the hollow portion S is reflected by the surface of the heat radiator 20 and then reenters the light guide plate 52.

Here, if the LED is resin-sealed as in the conventional case, deterioration such as yellowing occurs not only by light but also by heat, so that the amount of light and chromaticity change with time. In addition, since the thermal expansion coefficient of the sealing material is large (for example, 150 to 200 × 10 −6 / ° C. for silicone), expansion and contraction due to temperature change occurs, and thus disconnection occurs at an electrical connection point such as an LED element. End up.
On the other hand, in the case of glass sealing as in the present embodiment, there is no deterioration with respect to light and heat, and since the coefficient of thermal expansion is relatively close to that of the LED element 82, no electrical disconnection occurs. . The glass is not limited to a glass having a low melting point, and may be, for example, a sol-gel glass formed using an alkoxide as a starting material.

In addition, processing oil is used for processing metal members such as the heat radiating body 2, the mounting member 3, and the cover member 6, and a small amount of organic components contained in the processing oil may remain. In this case, the organic component volatilizes due to the heat generated when the light source device 1 is used. However, since the glass-sealed LED 8 is made of glass, the organic component penetrates into the sealing member and the sealing member deteriorates. There is nothing to do. Further, since the ceramic substrate 81 and the glass sealing portion 83 are joined by chemical bonding via an oxide, the volatile organic component does not enter these interfaces, and the ceramic substrate 81 and the glass sealing portion are not invaded. No delamination at the interface of 83 occurs. Therefore, the light source device 1 of the present embodiment maintains the desired characteristics over a long period.
In contrast, when a conventional resin-sealed LED is used, the volatilized organic component penetrates into the resin-sealed member, so that the deterioration of the sealing member is accelerated. In addition, since the resin material and the substrate are not bonded via an oxide such as glass sealing, but are in close contact with each other, the organic component penetrates into these interfaces, and the interface peels off. Promoted. That is, the light source device 1 of the present embodiment is a solution to the conventional problem when using a resin-sealed LED and a metal heat dissipation portion.

  Further, the heat generated in each LED element 82 of each glass-sealed LED 8 is transmitted to the substrate body 42 via the heat radiation pattern 86. At this time, each LED element 82 of the glass-sealed LED 8 is located immediately above the site where the heat radiation pattern 86 is formed, and further joined to the substrate body 42 without the insulating layer 83 having a large thermal resistance. The heat generated in each LED element 82 is accurately transmitted from the heat radiation pattern 86 to the substrate body 42. At this time, since each LED element 82 of the glass-sealed LED 8 is located immediately above the site where the heat radiation pattern 86 is formed, the heat generated in each LED element 82 is accurately transferred from the heat radiation pattern 86 to the substrate body 42. Communicated. Then, the heat transmitted to the board body 42 is transmitted to the mounting portion 33 of the mounting member 3. At this time, since the substrate body 42 and the mounting portion 33 are both formed of a metal having a relatively high thermal conductivity and joined with a metal material, heat is smoothly transferred between them. The heat transmitted to the mounting portion 33 is transmitted to the heat radiating body 2 through the screw portion 31 and the flange portion 32 and is dissipated from the surface of the heat radiating body 2 into the air. In this embodiment, since the heat radiator 2 has the plurality of fins 23, the contact area with air is large, and high heat radiation performance can be obtained. Further, the heat transmitted to the mounting portion 33 is also transmitted to the cover member 6 and is dissipated into the air from the surface of the cover member 6.

  In the present embodiment, the screw portion 31 and the mounting portion 33 are integrally formed on the mounting member 3 with the same material, and a combination of a plurality of materials does not cause thermal resistance between the plurality of materials. Since the screw part 31 is formed to have a larger diameter than the mounting part 33, the heat generated in the light source part 4 can be accurately transferred to the screw part 31, and the heat diffusion degree is increased. Can be. In addition, the contact area between the screw portion 31 and the heat radiating body 2 is increased, and heat transfer to the heat radiating body 2 through the screwed portion can be performed accurately with an increased degree of heat diffusion. Furthermore, since the flange portion 32 is provided at one end in the axial direction of the screw portion 31 and the flange portion 32 is in surface contact with the radiator 2, heat can be transmitted to the radiator 2 through the flange portion 32.

  Thus, according to the light source device 1 of the present embodiment, the heat radiation performance of the light source unit 4 can be significantly improved, and the heat generated from the plurality of glass-sealed LEDs 8 can be dissipated accurately. Therefore, it is possible to adopt a configuration in which the amount of heat generation is increased, such as increasing the amount of light of each LED element 82 or concentrating each LED element 82, and the performance of each LED element 82 can be sufficiently extracted.

  In addition, since the wiring hole 35 is formed in the mounting member 3, the mounting member 3 can be screwed to the radiator 2 in a state where the wiring 7 is electrically connected to the light source unit 4 in advance. Therefore, troublesome electrical connection work can be performed before the mounting member 3 is assembled to the heat radiating body 2, and the manufacturing cost can be reduced. In addition, there is no risk of damaging the wiring 7 during assembly, and the connection portion between the wiring 7 and the light source unit 4 is not exposed to the outside, so that the reliability of electrical connection is high. Moreover, since the collar part 32 is in surface contact with the radiator 2, the fastening force between the mounting member 3 and the radiator 2 is improved, and the loosening between the mounting member 3 and the radiator 2 due to a thermal load is suppressed. Can do. Since the screw portion 31 is formed to have a larger diameter than the mounting portion 33 and the wiring hole 35 is formed between the male screw portion and the mounting portion, a path for transmitting heat generated in the light source portion 4 to the male screw portion is provided. It is possible to cope with it without making it narrow, and with a simple straight hole.

  In addition, since the optical control member 51 and the light guide plate 52 are sandwiched between the screw portion 31 of the mounting member 3 and the cover member 6, it is possible to fix the optical control member and the light guide plate 52 with the minimum components constituting the apparatus. it can. Further, since the positions of the optical control member 51 and the light guide plate 52 are determined with reference to the mounting member 3, the optical control member 51 and the light guide plate 52 are accurately positioned with respect to the light source unit 4 mounted on the mounting member 3.

  In the first embodiment, the radiator 2 is made of aluminum. However, the radiator 2 may be made of another metal such as copper or iron. The shape of the heat radiating body 2 and the like are also arbitrary. For example, as shown in FIG. 6, the mounting member 3 is screwed into the screw hole 121 of the steel frame 102 using the steel frame 102 of the building as a heat radiating body. it can. The light source device 101 of FIG. 6 is provided on the steel frame 102 on the ceiling of a building, and is upside down from the above embodiment. In the light source device 101 of FIG. 6, the flange portion 32 is not formed on the mounting member 3, but other configurations are the same as those of the first embodiment.

  In addition, as shown in FIG. 7, when the flange portion 232 is formed on the mounting member 3 in the form provided on the steel frame 102, the screw portion 31 is formed on the same axial end as the mounting portion 33. In the light source device 201 of FIG. 7, the optical control member 51 and the light guide plate 52 are sandwiched between the flange portion 232 and the cover member 6. 7 includes a screw 225 that fastens and fixes the mounting member 3 and the steel frame 102 in a state where the mounting member 3 is screwed to the steel frame 102. A screw hole 224 that engages with the screw 225 is formed in the steel frame 102, and a screw hole 237 that engages with the screw 225 is formed in the flange portion 232. According to the light source device 201, since the relative rotation between the mounting member 3 and the steel frame 102 is prevented by the screw 225, the relative angle between the mounting member 3 and the steel frame 102 even when a thermal load is repeatedly applied to each member. Does not change, and the mounting member 3 and the steel frame 102 do not loosen each other. A pin or the like may be used instead of the screw 225 as a member that prevents relative rotation. Of course, the light source device 1 according to the first embodiment may include a blocking member that blocks the relative rotation between the flange portion 32 and the radiator 2.

  Further, as shown in FIG. 8, a nut 311 may be screwed onto the screw portion 31 on the side opposite to the mounting portion 33. According to this light source device 301, in addition to the flange portion 232, the nut 311 also makes surface contact with the steel frame 102, so that the fastening force between the mounting member 3 and the steel frame 102 is further improved, and the mounting member 3 is detached from the steel frame 102. Can be prevented more reliably. Note that the light source device 301 in FIG. 8 may have a configuration in which the nut 311 is provided without providing the screw 225. Further, in the light source device 1 of the first embodiment, a configuration in which the nut 311 is provided without providing the flange portion 32, or a configuration in which a male screw is formed on the outer peripheral surface of the flange portion 32 and the nut 311 is screwed into the male screw. Of course, it is also possible.

  As shown in FIG. 9, the light source device 401 may be hung by a hanging tool 412 hung on the ceiling of a building. In the light source device 401 of FIG. 9, the radiator 402 is made of aluminum and expands downward. The radiator 402 includes a main body 420 that forms a shade of the lighting fixture, and a screw hole 421 that is formed at the upper center of the main body 420 and to which the mounting member 3 is attached. The light source device 401 is not provided with the light guide plate 52 as in the first embodiment, and the light emitted from the optical control member 51 is reflected on the inner surface of the main body 420 of the heat dissipator 402, whereby the device The lower area is illuminated. The mounting member 3 has a mounting portion 438 protruding to the opposite side of the mounting portion 33, and the suspending tool 412 is inserted into the insertion hole formed in the mounting portion 438. Thus, the configuration of the optical control unit 5 is arbitrary, and the light guide plate 52 can be omitted as appropriate. In addition, for example, the optical control member 51 can be configured by a reflecting mirror such as a metal instead of a translucent resin.

10 to 12 show a second embodiment of the present invention, and FIG. 10 is a longitudinal sectional view of the light source device.
As shown in FIG. 10, the light source device 501 includes a heat dissipating body 502 having a screw hole 521 in which an internal thread is formed on the inner periphery, and a mounting member 3 having a screw portion 31 in which an external thread to be screwed with the internal thread is formed on the outer periphery. And a light source unit 4 having an LED element 82 mounted on the mounting unit 33 of the mounting member 3, and an optical control unit 505 that optically controls light emitted from the light source unit 4. The mounting member 3 includes a mounting portion 33 that protrudes from the screw portion 31 in the axial direction of the male screw and is formed to be smaller in the radial direction than the screw portion 31, and a wiring hole 35 that passes through the screw portion 31 in the axial direction. Yes. The mounting member 3 is the same as that of the first embodiment except that the flange portion 32 is not formed. The light source unit 4 has the same configuration as that of the first embodiment.

  The heat radiator 502 is made of aluminum and includes a cylindrical body 522 and a closing portion 520 that closes both ends of the cylindrical body 522. The closing part 520 is formed in a disk shape, and a screw hole 521 is formed at the center.

  The optical control unit 5 includes an optical control member 51 for converting light emitted from the glass-sealed LED 8 into light in the radial direction (horizontal direction in the figure), and guiding light incident from the optical control member 51 to the outside of the apparatus. A light plate 552. The optical control member 51 has the same configuration as that of the first embodiment.

FIG. 11 is a cross-sectional view of the light source device.
As shown in FIG. 11A, the light guide plate 552 is made of acrylic resin, for example, and is formed so as to surround the optical control member 51 in plan view. The light guide plate 552 has an incident surface 552a connected to the optical control member 51, and an output surface 552c that emits light incident on the light guide plate 552. The exit surface 552c is formed in parallel with the entrance surface 552a in a longitudinal section, and has a circular shape in plan view.

  As shown in FIG. 11B, the emission surface 552c has a curved waveform in plan view, and is formed so that the radial dimension from the center changes continuously. Thereby, the light emitted from the emission surface 552c is radiated to the outside while being scattered on the emission surface 552c.

FIG. 12 is an external perspective view of the light source device. In FIG. 12, the light guide plate 552 is shaded for explanation.
As shown in FIG. 12, the light guide plate 552 is sandwiched between the cover member 506 and the heat radiator 502. The cover member 506 is made of, for example, aluminum, is formed in a disk shape, and is fixed to the mounting member 3 with an adhesive or the like. The cover member 506 is in contact with one surface of the light guide plate 552.

  In the light source device 501 configured as described above, light incident on the exit surface 51c of the optical control member 51 is radiated to the outside from the entrance surface 552a of the light guide plate 552 through the exit surface 552c. Thereby, light emission of the part of the light-guide plate 552 in the light source device 501 formed in the column shape is visually recognized. In the present embodiment, since light is scattered on the emission surface 552c, the state where the light guide plate 552 emits light uniformly in the circumferential direction is visually recognized.

  Further, the heat generated in each LED element 82 of each glass-sealed LED 8 is transmitted to the mounting portion 33 of the mounting member 3 via the heat radiation pattern 86 and the substrate body 42. The heat transmitted to the mounting portion 33 is transmitted to the heat radiating body 502 through the screw portion 31 and is dissipated from the surface of the heat radiating body 502 into the air. Further, the heat transmitted to the mounting portion 33 is also transmitted to the cover member 506 and is dissipated from the surface of the cover member 506 into the air.

  Also in this embodiment, since the screw part 31 is formed with a larger diameter than the mounting part 33, the heat generated in the light source part 4 can be accurately transmitted to the screw part 31. Furthermore, the contact area between the screw portion 31 and the heat radiating body 502 is increased, and heat transfer to the heat radiating body 2 through the screwed portion can be performed accurately.

  Thus, according to the light source device 501 of the present embodiment, the heat dissipation performance of the light source unit 4 can be remarkably improved and the heat generated from the plurality of glass-sealed LEDs 8 can be dissipated accurately. Therefore, it is possible to adopt a configuration in which the amount of heat generation is increased, such as increasing the amount of light of each LED element 82 or concentrating each LED element 82, and the performance of each LED element 82 can be sufficiently extracted.

  Further, since the wiring hole 35 is formed in the screw portion 31, the mounting portion 3 can be screwed to the heat radiator 502 in a state where the wiring 7 is electrically connected to the light source portion 4 in advance. Therefore, troublesome electrical connection work can be performed before the mounting member 3 is assembled to the heat radiating body 502, and the manufacturing cost can be reduced. Moreover, since the connection part of the wiring 7 and the light source part 4 is not exposed outside, the reliability of electrical connection is high.

  In the first and second embodiments, the cover member 6506 having the cover member 6506 fixed to the mounting member 3 is shown. However, for example, as shown in FIG. 13, the cover member 6,506 is not provided. It can also be. In the first and second embodiments, the light source unit 4 is mounted on the side surface 33a of the mounting unit 33. However, for example, as illustrated in FIG. May be implemented. In the first and second embodiments, the optical control member 51 is provided adjacent to the light source unit 4. However, for example, as shown in FIG. 13, the optical control member 51 may not be provided. Good.

  A light source device 601 in FIG. 13 includes a heat radiator 502 similar to that of the second embodiment, and a screw hole 624 that engages with a screw 625 is formed in the closing portion 520 of the heat radiator 502. The part 632 is formed with a screw hole 637 that engages with the screw 625. As shown in FIG. 14, the light source device 601 includes a hemispherical translucent member 652 connected to the upper side of the closing portion 520. The translucent member 652 is colored white, and is configured such that the mounting member 3, the light source unit 4 and the like cannot be visually recognized from the outside. Note that a high reflectivity layer 623 having a higher reflectivity than the radiator 502 is formed on the upper surface of the blocking portion 520.

In the first and second embodiments, the mounting portion 33 of the mounting member 3 has a hexagonal shape in plan view. For example, the mounting portion 33 has a rectangular shape in plan view. The mounting portion 33 may have any shape.
In the first and second embodiments, the optical control member 51 has a hexagonal shape in plan view. For example, the optical control member 51 has a rectangular shape in plan view. It may have a circular shape, and the shape of the optical control member 51 is arbitrary. However, it is desirable to provide a flat portion on the side surface 33a of the mounting portion 33 so that the light source portion 4 can be easily mounted.

  In each of the above embodiments, a copper base substrate whose copper substrate is copper is shown as the mounting substrate 31, but the mounting substrate may be, for example, an aluminum base substrate or a glass epoxy substrate. Further, the number of glass-sealed LEDs 8 and the arrangement state on the mounting substrate are arbitrary. For example, when a plurality of glass-sealed LEDs are mounted on the mounting substrate, each glass-sealed LED may be electrically in series. It may be parallel.

  Moreover, in each said embodiment, although what emitted white light from the glass sealing LED8 was shown, for example, as a structure in which the fluorescent substance 83a is not included in the glass sealing part 83, blue light is emitted from the glass sealing LED. May be emitted. When blue light is emitted from the glass-sealed LED, the optical control unit may include a yellow phosphor to emit white light to the outside, or blue light may be emitted to the outside without wavelength conversion or the like. It is good also as a structure. Further, although the LED element 82 is shown as a flip chip type, it may be a face up type. Further, the number of LED elements 82 mounted on one glass-sealed LED 8 and the arrangement state of the LED elements 82 are arbitrary. Furthermore, the LED element 82 may be one using, for example, a sapphire substrate as the growth substrate, or may be one obtained by removing the growth substrate after forming the nitride semiconductor layer. As described above, the detailed configuration, emission color, and the like of the glass-sealed LED can be appropriately changed. Furthermore, although the reliability etc. are inferior to glass-sealed LED, you may use resin-sealed LED.

  Moreover, in each said embodiment, although the reflective surface 51b of the optical control member 51 showed what showed a parabola shape in a cross section, the reflective surface 51b may be a cross-sectional linear shape, for example. Of course, it is possible to appropriately change the detailed structure and the like.

It is sectional drawing of the light source device which shows the 1st Embodiment of this invention. It is a bottom view of a light source device. It is sectional drawing of a light source part. It is a top view of a light source device. It is AA sectional drawing of FIG. It is sectional drawing of the light source device which shows the modification of 1st Embodiment. It is sectional drawing of the light source device which shows the modification of 1st Embodiment. It is sectional drawing of the light source device which shows the modification of 1st Embodiment. It is sectional drawing of the light source device which shows the modification of 1st Embodiment. It is a longitudinal cross-sectional view of the light source device which shows the 2nd Embodiment of this invention. It is a cross-sectional view of a light source device, (a) is a cross-sectional view of the entire device, (b) is a partial cross-sectional view. It is an external appearance perspective view of a light source device. It is sectional drawing of the light source device which shows the modification of 2nd Embodiment. It is an external appearance perspective view of the light source device which shows the modification of 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light source device 2 Heat radiator 3 Mounting member 4 Light source part 8 Glass sealing LED
DESCRIPTION OF SYMBOLS 21 Screw hole 31 Screw part 33 Mounting part 35 Wiring hole 51 Optical control member 101 Light source device 102 Steel frame 121 Screw hole 201 Light source device 301 Light source device 401 Light source device 402 Heat radiator 421 Screw hole 501 Light source device 502 Heat radiator 521 Screw hole 601 Light source apparatus

Claims (4)

  1. A plate-like radiator having a screw hole in which an internal thread is formed on the inner periphery;
    A male screw threadedly engaged with the female screw is formed on the outer periphery and a flange portion is provided at one end in the axial direction, and protrudes from the screw portion in the axial direction of the male screw and is smaller in the radial direction than the screw portion. A mounting member having a mounting portion and a wiring hole that penetrates the screw portion in the axial direction and communicates with the outside;
    A light source part having an LED element mounted on the mounting part of the mounting member;
    With
    The flange portion is in surface contact with the radiator ,
    The light source part has a glass sealing part for sealing the LED element,
    A cover member fixed to the mounting portion of the mounting member;
    A light source device that emits light emitted from the light source unit to the outside through the space between the radiator and the cover member.
  2. The light source device according to claim 1 , further comprising an optical control member that is sandwiched between the mounting member and the cover member and optically controls light emitted from the light source unit.
  3. 3. The light source device according to claim 1, wherein the flange portion extends radially outward from one axial end of the screw portion and makes surface contact with the heat radiating body.
  4. The light source device according to claim 3 , further comprising a blocking member that blocks relative rotation between the flange portion of the mounting member and the radiator.
JP2007250622A 2007-09-27 2007-09-27 Light source device and mounting member Active JP5298486B2 (en)

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JP5374267B2 (en) * 2009-07-24 2013-12-25 三協立山株式会社 LED light source unit, planar illumination device, and signboard
JP5322820B2 (en) * 2009-07-24 2013-10-23 三協立山株式会社 Surface emitting device
JP4975136B2 (en) * 2010-04-13 2012-07-11 シャープ株式会社 Lighting device
JP2012043759A (en) * 2010-08-23 2012-03-01 Toshiba Lighting & Technology Corp Lighting fixture
JP5477592B2 (en) * 2010-11-15 2014-04-23 東芝ライテック株式会社 lighting equipment
JP5668920B2 (en) * 2010-12-22 2015-02-12 ミネベア株式会社 Lighting device
JP5202692B2 (en) * 2011-06-10 2013-06-05 シャープ株式会社 Lighting device
JP6310588B2 (en) * 2011-07-21 2018-04-11 アイリスオーヤマ株式会社 Lighting device
JP2014013765A (en) * 2013-08-26 2014-01-23 Sankyotateyama Inc Led light source unit, planar luminaire, and signboard

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KR100991830B1 (en) * 2001-12-29 2010-11-04 항조우 후양 신잉 띠앤즈 리미티드 A LED and LED lamp
JP3098687U (en) * 2003-06-20 2004-03-11 光鼎電子股▲ふん▼有限公司 Power led light source module
US20060013000A1 (en) * 2004-07-16 2006-01-19 Osram Sylvania Inc. Flat mount for light emitting diode source
JP2007067113A (en) * 2005-08-30 2007-03-15 Hamamatsu Photonics Kk Photoirradiation head and photoirradiation device
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