JP4893601B2 - Light source device - Google Patents

Description

  The present invention relates to a light source device including a plurality of linear light source units on which a plurality of glass-sealed LEDs are mounted.

  Conventionally, a linear light source is known in which a plurality of light emitting diode (LED) elements are mounted on an elongated wiring board, and each LED is sealed with a resin sealing material on the wiring board (for example, (See paragraph [0005] of Patent Document 1). However, in this linear light source, due to the heat generated in each LED element, the resin sealing material is yellowed due to deterioration and the amount of light decreases with time, or the wiring board and the resin sealing material are separated. As a result, there is a problem that an electrical failure occurs.

In order to solve this problem, a linear light source including a wiring board, a plurality of LED elements arranged on the wiring board, and a glass material that is formed on the wiring board and covers the LED elements has been proposed. (For example, see paragraph [0021] of Patent Document 1). In Patent Document 1, glass has a thermal conductivity about 5 times greater than that of conventional resins, so that the amount of heat released from the light emitting element (LED element) is increased to suppress the temperature rise of the light emitting element (LED element). It is described that it is possible.
JP 2006-344450 A

  However, glass and resin have extremely low thermal conductivity compared to metals and the like, and in the linear light source of Patent Document 1, although the thermal conductivity of glass is larger than that of resin, the heat dissipation performance by the sealing material is low. That is no different. That is, the linear light source disclosed in Patent Document 1 is not improved in terms of heat dissipation with respect to the conventional resin-encapsulated linear light source. It is equivalent to a stop linear light source. Therefore, in the linear light source of Patent Document 1, although the encapsulating material is made of glass, the LED element as a whole is radiated by the encapsulating material, although an increase in the amount of heat generated by the LED element is allowed. As a result, a thermal load is eventually applied to the LED element. For this reason, it is not possible to adopt a configuration in which the amount of heat generation increases, such as increasing the light amount of each LED element or concentrating each LED element, and the performance of each LED element cannot be fully exploited.

  This invention is made | formed in view of the said situation, The place made into the objective is providing the light source device which can dissipate the heat which arises from several glass sealing LED exactly.

The present invention, in order to achieve the above object, a plurality of linear light source section in which a plurality of glass sealed LED is mounted, respectively, provided in each of the plurality of linear light sources portions to those the plurality of linear light sources section A plurality of radiator plates to which end faces are respectively connected, and a rectangular parallelepiped radiator block having the same longitudinal dimension as the radiator plate having the largest longitudinal dimension among the plurality of radiator plates, the longitudinal dimension being A heat radiating portion in which the heat radiating block is disposed between the plurality of heat radiating plates including the largest heat radiating plate and in surface contact with the heat radiating plate having the largest longitudinal dimension over the entire surface; and a member having a lower thermal conductivity than the heat radiating portion A plurality of linear light source units and a side wall arranged with a predetermined distance from the heat radiation unit, and a side wall that is formed continuously with the side wall, and is located on the inner side of the boundary part with the side wall. For each of the plurality of heat sinks Together are formed of a bottom wall having the formed convex portion, and a case in which the vent and the side wall support part formed by being connected to the heat radiating portion bending portions of the sidewall inward The heat dissipating block has a plurality of through-holes penetrating up and down and formed side by side in the longitudinal direction of the plurality of linear light source units, and the convex portions are the plurality of the plurality of heat sinks in the plurality of heat dissipating plates. that provides a light source device you characterized by having a bottom wall supporting portion for supporting the linear light source portion end surface of the opposite side.

The light source device may further include a spring member interposed between the case and the heat radiating plate located outside the plurality of heat radiating plates, and biasing the case and the plurality of heat radiating plates in a direction away from each other. It is good also as a structure.

  According to the light source device of the present invention, heat generated from a plurality of glass-sealed LEDs can be accurately dissipated.

  1 to 8 show a first embodiment of the present invention, and FIG. 1 is an external perspective view of a light source device.

  As shown in FIG. 1, the light source device 1 includes a case 5 formed in a hexagonal cylinder shape with a lower end closed, a lens holding plate 8 that closes the upper end of the case 5, and a plurality of pieces held by the lens holding plate 8. And a lens 7. Each lens 7 radiates the light emitted in the case 5 to the outside. In addition, a predetermined side surface 5 a of the case 5 is formed with a vent 5 c that communicates the inside and outside of the case 5.

FIG. 2 is a cross-sectional view of the light source device.
As shown in FIG. 2, the light source device 1 includes a linear light source unit 3 on which a plurality of glass-sealed LEDs 2 are mounted on the upper surface, and a lower surface of the linear light source unit 3 connected downward. And a heat dissipating section 4 having a heat dissipating plate 41 and a heat dissipating block 42 joined to the heat dissipating plate 41. The case 5 is formed on six side walls 5a formed at intervals from the linear light source part 3, a support part 5b connecting the predetermined side wall 5a and the heat radiating part 4, and the predetermined side wall 5a. And vent hole 5c.

  The lens 7 is made of, for example, acrylic resin, and is formed in a circular shape centering on the glass-sealed LED 2 of the light source unit 3 when viewed from above. That is, the lens 7 has a circular shape when viewed from the light emission side. The lens 7 is configured to receive the incident portion 71 into which the white light from the light source portion 3 is incident and the light incident from the incident portion 71 into the lens 7. The reflective surface 72 to reflect, the output surface 73 which radiate | emits the light in the lens 7 to the exterior, and the collar part 74 hold | maintained at the lens holding plate 8 are provided.

  The incident portion 71 has a concave shape that is recessed upward at the lower portion of the lens 7 and is formed so as to cover the upper side of the glass-sealed LED 2. The incident part 71 has a curved surface 71a that forms a downwardly convex spherical surface and is formed directly above the light source unit 3, and a cylindrical surface 71b that extends downward from the periphery of the curved surface 71a. The reflecting surface 72 has a parabolic shape with the LED element 22 of the glass-sealed LED 2 as a focal point. The flange 74 is formed at the upper end of the reflecting surface 72 so as to protrude radially outward, and is held by the lens holding plate 8. The lens holding plate 8 engages with a recess 5 e formed on the upper end side of the side wall 5 a of the case 5. The exit surface 73 of the lens 7 is formed flat on the top of the lens 7.

FIG. 3 is an exploded perspective view of the light source device. In FIG. 3, the case, the lens, and the lens holding plate are omitted for illustration.
As shown in FIG. 3, a plurality of linear light source units 3 and a heat radiating plate 41 are arranged in parallel to each other, and the heat radiating unit 4 is disposed between each heat radiating plate 41 and connects two adjacent heat radiating plates 41. The heat dissipation block 42 is provided. In the present embodiment, three linear light source units 3 are provided side by side, and the inner linear light source unit 3 is formed to be longer than the two outer linear light source units 3. The linear light source unit 3 has the same horizontal dimension as the heat sink 41 and is fixed to the upper end surface of the heat sink 41 via a solder material (not shown). The radiator plate 41 and the radiator block 42 are both formed of copper (thermal conductivity: 380 W · m ⁻¹ · K ⁻¹ ), and the radiator block 42 is in surface contact with the main surface of the radiator plate 41.

FIG. 4 is an external perspective view of the linear light source unit.
As shown in FIG. 4, the linear light source unit 3 includes a mounting substrate 31 extending in the front-rear direction and a plurality of glass-sealed LEDs 2 mounted in a row on the upper surface of the mounting substrate 31. In the present embodiment, three glass-sealed LEDs 2 are electrically connected in series for the inner linear light source unit 3, and two glass-sealed LEDs 2 are electrically connected in series for the outer linear light source unit 3. Has been implemented. FIG. 4 illustrates a linear light source unit 3 on which three glass-sealed LEDs 2 are mounted. Each glass-sealed LED 2 is mounted with three LED elements 22 arranged in the front-rear direction on a ceramic substrate 21 to be described later, and the LED elements 22 are electrically connected in series. Each LED element 22 emits light having a peak wavelength of 460 nm when the forward direction is 4.0 V and the forward current is 100 mA.

FIG. 5 is a longitudinal sectional view of the linear light source section.
As shown in FIG. 5, the glass-sealed LED 2 includes an LED element 22 made of a flip-chip type GaN-based semiconductor material, a ceramic substrate 21 on which the LED element 22 is mounted, and a ceramic substrate 21 that is formed with power. A circuit pattern 24 for supplying to the substrate and a glass sealing portion 23 for sealing the LED element 22 on the ceramic substrate 21 are provided.

The LED element 22 has a buffer layer, an n-type layer, an MQW layer, and a p-type layer by epitaxially growing a group III nitride semiconductor on the surface of a growth substrate made of sapphire (Al ₂ O ₃ ). They are formed in this order. The LED element 22 is epitaxially grown at 700 ° C. or higher, its heat-resistant temperature is 600 ° C. or higher, and is stable with respect to the processing temperature in the sealing process using the low melting point heat-sealing glass. The LED element 22 includes a p-side electrode provided on the surface of the p-type layer and a p-side pad electrode formed on the p-side electrode, and a part of the LED element 22 is etched from the p-type layer to the n-type layer. The n-side electrode is formed on the exposed n-type layer. Bumps 25 are respectively formed on the p-side pad electrode and the n-side electrode. In the present embodiment, the LED element 22 is formed in a 346 μm square with a thickness of 100 μm.

The ceramic substrate 21 is made of a polycrystalline sintered material of alumina (Al ₂ O ₃ ), has a thickness direction (vertical direction) dimension of 0.25 mm, a longitudinal direction (front-rear direction) dimension of 3.25 mm, and a width direction (left and right). (Direction) dimension is formed to 0.9 mm. As shown in FIG. 5, the circuit pattern 24 is formed on the upper surface of the ceramic substrate 21 and electrically connected to the LED element 22, and is formed on the lower surface of the ceramic substrate 21 and electrically connected to the mounting substrate 31. Electrode pattern 24b to be electrically connected, and via pattern 24c to electrically connect upper surface pattern 24a and electrode pattern 24b. The electrode pattern 24b is formed at both ends in the longitudinal direction of the ceramic substrate 21, and one of them forms a positive electrode and the other forms a negative electrode. A heat radiation pattern 26 is formed between the electrode patterns 24 b on the back surface of the ceramic substrate 21.

  The upper surface pattern 24a, the electrode pattern 24b, and the heat dissipation pattern 26 are formed of a W layer formed on the surface of the ceramic substrate 21, a thin film Ni plating layer that covers the surface of the W layer, and a thin film shape that covers the surface of the Ni plating layer. An Ag plating layer. The via pattern 24c is made of W, and is provided in a via hole that penetrates the ceramic substrate 21 in the thickness direction. In the present embodiment, the electrode pattern 24b and the heat dissipation pattern 26 are formed in a rectangular shape in plan view. Each electrode pattern 24 b is formed to have a dimension of 0.4 mm in the longitudinal direction of the ceramic substrate 21 and 0.65 mm in the width direction of the ceramic substrate 21. The heat radiation pattern 26 is formed to have a dimension of 1.8 mm in the longitudinal direction of the ceramic substrate 21 and 0.65 mm in the width direction of the ceramic substrate 21. Each electrode pattern 24 b and the heat dissipation pattern 26 are formed 0.2 mm apart in the longitudinal direction of the ceramic substrate 21. In the present embodiment, the heat radiation pattern 26 is formed directly below each LED element 22 so as to overlap each LED element 22 in plan view.

The glass sealing portion 23 is made of ZnO—B ₂ O ₃ —SiO ₂ —Nb ₂ O ₅ —Na ₂ O—Li ₂ O-based heat fusion glass. The composition of the glass is not limited to this. For example, the heat-sealing glass may not contain Li ₂ O, or may contain ZrO ₂ , TiO ₂ or the like as an optional component. Good. Further, the heat fusion glass may be a sol-gel glass using a metal alkoxide as a starting material. As shown in FIG. 5, the glass sealing portion 23 is formed in a rectangular parallelepiped shape on the ceramic substrate 21, and the height from the upper surface of the ceramic substrate 21 is 0.5 mm. The side surface of the glass sealing portion 23 is formed by cutting a plate glass bonded to the ceramic substrate 21 by hot pressing together with the ceramic substrate 21 with a dicer. Moreover, the upper surface of the glass sealing part 23 is one surface of the plate glass bonded to the ceramic substrate 21 by hot pressing. This heat-fusible glass has a glass transition temperature (Tg) of 490 ° C., a yield point (At) of 520 ° C., a coefficient of thermal expansion (α) at 100 ° C. to 300 ° C. of 6 × 10 ⁻⁶ / ° C., and a refractive index. It is 1.7.

  In addition, the phosphor 23 a is dispersed in the glass sealing portion 23. The phosphor 23a is a yellow phosphor that emits yellow light having a peak wavelength in a yellow region when excited by blue light emitted from the MQW layer. In the present embodiment, a YAG (Yttrium Aluminum Garnet) phosphor is used as the phosphor 23a. The phosphor 23a may be a silicate phosphor or a mixture of YAG and silicate phosphor in a predetermined ratio.

  As shown in FIG. 5, the mounting substrate 31 includes a substrate body 32 made of metal, an insulating layer 33 made of resin formed on the substrate body 32, a circuit pattern 34 made of metal formed on the insulating layer 33, And a resist layer 35 made of resin and formed on the circuit pattern 34.

The substrate body 32 is made of, for example, copper (thermal conductivity: 380 W · m ⁻¹ · K ⁻¹ ), and is connected via the heat radiation pattern 26 of each glass-sealed LED 2 and the solder material 36. The insulating layer 33 is made of, for example, a polyimide resin, an epoxy resin, or the like, and insulates the conductive substrate body 32 from the circuit pattern 34. The circuit pattern 34 is made of, for example, copper having a thin gold film on the surface (upper surface), and is connected to the electrode pattern 24b of each glass-sealed LED 2 via a solder material 37. The resist layer 35 is made of, for example, an epoxy resin mixed with a titanium oxide filler, and exhibits a white color. Thereby, the reflectance of the upper surface of the linear light source part 3 is improved.

FIG. 6 is a top view of the mounting substrate.
The mounting substrate 31 is formed with a width direction of 1.0 mm and a thickness direction of 1.0 mm. That is, the mounting substrate 31 has a slightly larger dimension in the width direction than the glass-sealed LED 2 mounted on the upper surface. The mounting substrate 31 on which the three glass-sealed LEDs 2 are mounted has a longitudinal direction of 50 mm, and the mounting substrate 31 on which the two glass-sealed LEDs 2 are mounted has a longitudinal direction of 30 mm. As shown in FIG. 6, the mounting substrate 31 has first pattern exposed portions 31 a where the circuit pattern 34 is exposed at both ends in the longitudinal direction (front-rear direction). In the present embodiment, a pair of first pattern exposed portions 31 a is formed at both ends in the longitudinal direction of the mounting substrate 31 with a gap in the width direction (left-right direction). Each first pattern exposed portion 31a is formed in a rectangular shape extending in the front-rear direction.

  In addition, the mounting substrate 31 has a second pattern exposed portion 31b where the circuit pattern 34 is exposed and a heat radiating exposed portion 31c where the substrate body 32 is exposed at a portion where the glass-sealed LED 2 is mounted. The second pattern exposed portion 31b is formed corresponding to the electrode pattern 24b of the glass-sealed LED2, and the heat-radiating exposed portion 31c is formed corresponding to the heat-radiating pattern 26 of the glass-sealed LED2. The exposed portion 31c for heat dissipation extends in the longitudinal direction at the center in the width direction of the mounting substrate 31, and a pair of second pattern exposed portions 31b are formed outside the exposed portion 31c for heat dissipation in the longitudinal direction. Each heat radiation exposed portion 31c and each second pattern exposed portion 31b are formed in the same dimensions as the heat radiation pattern 26 and each electrode pattern 24b of each glass-sealed LED 2 in plan view. In the present embodiment, the distance between the central portions of the adjacent heat radiation exposed portions 31c is 11.5 mm, and the distance from the longitudinal ends of the mounting substrate 31 at the central portion of the heat radiation exposed portions 31c at both ends in the longitudinal direction is 11.5 mm. The distance is 4.5 mm.

FIG. 7 is a top view of the light source device.
As shown in FIG. 7, the light source device 1 is formed in a regular hexagonal shape when viewed from above and has seven lenses 7. One of the lenses 7 is arranged at the center in the top view, and the other six are arranged circumscribing the lens arranged at the center. Each lens 7 is fixed to the case 5 via a lens holding plate 8. The lens holding plate 8 is formed in a regular hexagonal shape when viewed from above, and is fitted into the recess 5 e of the side wall 5 a of the case 5. The lens holding plate 8 has a holding hole 8 a for holding the lens 7.

FIG. 8 is a top view of the light source device in which the lens and the lens holding plate are omitted.
As shown in FIG. 8, the case 5 is made of, for example, stainless steel (thermal conductivity: 25 W · m ⁻¹ · K ⁻¹ ), and includes six side walls 5 a that cover the linear light source unit 3 and the heat radiating unit 4, and A bottom wall 5d that connects the lower ends of the side walls 5a and covers the lower side of the linear light source unit 3 and the heat radiation unit 4; The case 5 is configured by a member having a smaller thermal conductivity than the heat radiating unit 4.

  As shown in FIG. 8, by bending a part of the predetermined side wall 5 a to the inside of the case 5, a support part 5 b that connects the side wall 5 a and the heat radiating part 4 is formed. In the present embodiment, support portions 5b are respectively formed on a pair of side walls 5a that extend in parallel to the respective linear light source portions 3 and face each other. Each support portion 5b includes an extending portion extending from the side wall 5a to the inside of the case 5, and a contact portion extending in the longitudinal direction of the linear light source portion 3 along the surface of the heat radiation plate 41 from the tip of the extending portion. Have.

  As shown in FIG. 8, each support portion 5 b is connected to the outer heat radiating plate 41 among the three heat radiating plates 41 arranged in parallel. Each support portion 5b is formed shorter and shorter than the heat radiating plate 41 (see FIG. 2), and supports the heat radiating portion 4 on the upper and lower central sides of the heat radiating plate 41. Further, a vent hole 5c is formed in the side wall 5a with the formation of the support portion 5b. Each vent 5c is formed in a rectangular shape extending vertically.

  As shown in FIG. 8, each heat radiation block 42 is formed in a rectangular parallelepiped shape, and is disposed between three heat radiation plates 41 arranged in parallel. Each heat dissipating block 42 is equal in length in the longitudinal direction to the linear light source unit 3 and the heat dissipating plate 41 on the center side, and is shorter than the heat dissipating plate 41 (see FIG. 2). Connected to the heat sink 41. Each heat radiation block 42 is formed with a plurality of heat radiation holes 42a formed so as to penetrate vertically. In the present embodiment, the heat radiating holes 42 a are formed side by side in the longitudinal direction of the linear light source unit 3.

  Further, the bottom wall 5d is formed with a convex portion 5e that supports the heat sink 41. The convex portion 5e is formed for each heat radiating plate 41 so that the support portion of each heat radiating plate 41 is above the connection portion of the bottom wall 5d with each side wall 5a. Each convex part 5e has a protrusion extending in the longitudinal direction of the linear light source part 3, and its upper surface is slightly curved so as to receive the heat radiating plate 41 (see FIG. 2). The convex part 5e of the bottom wall 5d is in direct contact with the heat radiating part 4 so that heat is easily transmitted, but is located above the other part of the bottom wall 5d, so that it is difficult to touch directly from the outside of the case 5. It has become.

  In the light source device 1 configured as described above, when a voltage is applied to the first pattern exposed portion 31 a of each linear light source unit 3, blue light is emitted from each LED element 22 of each glass-sealed LED 2. A part of the blue light is converted to yellow by the phosphor 23a, and white light is emitted from each glass-sealed LED 2 by a combination of blue light and yellow light. Since the glass-sealed LEDs 2 are arranged in the longitudinal direction on the mounting substrate 31, the linear light source unit 3 emits light in a linear shape. In the present embodiment, a plurality of LED elements 22 are arranged in the longitudinal direction even inside each glass-sealed LED 2.

  Of the white light emitted from the glass-sealed LED 2 and entering the lens 7 from the incident portion 71, the light incident on the reflecting surface 72 of the lens 7 is controlled to be reflected upward by the reflecting surface 72. As a result, white light controlled to have a circular shape in plan view for each lens 7 is emitted from the light source device 1 to the outside. Note that some of the white light emitted from the glass-sealed LED 2 is slightly incident on the mounting substrate 31, but since it is reflected by the surface of the white resist layer 34, there is almost no optical loss.

  In this embodiment, since the lens 7 is provided for each glass-sealed LED 2, the light emitted from each glass-sealed LED 2 can be optically controlled independently for each glass-sealed LED 2, It is possible to make the light intensity uniform by suppressing variations in the light intensity in the irradiation region. Moreover, since it controls for every glass-sealed LED2, the light emitted from each glass-sealed LED2 can be taken out efficiently. Moreover, since the glass-sealed LED 2 becomes a long light source in the mounting direction of the plurality of LED elements 22, the light distribution angle in a predetermined direction can be widened even if the lens 7 has an axisymmetric shape.

Here, if the LED is resin-sealed as in the conventional case, deterioration such as yellowing occurs not only by light but also by heat, so that the amount of light and chromaticity change with time. In addition, since the thermal expansion coefficient of the sealing material is large (for example, 150 to 200 × 10 ⁻⁶ / ° C. for silicone), expansion and contraction due to temperature change occurs, and thus disconnection occurs at an electrical connection point such as an LED element. End up.
On the other hand, if the glass sealing as in the present embodiment, there is no deterioration with respect to light and heat, and since the coefficient of thermal expansion is relatively close to the LED element 22, no electrical disconnection occurs. .

  Further, the heat generated in each LED element 22 of each glass-sealed LED 2 is transmitted to the substrate body 32 via the heat radiation pattern 26. At this time, each LED element 22 of the glass-sealed LED 2 is located immediately above the formation site of the heat dissipation pattern 26, and is further bonded to the substrate body 32 without the insulating layer 23 having a large thermal resistance. The heat generated in each LED element 22 is accurately transmitted from the heat radiation pattern 26 to the substrate body 32. The heat transmitted to the substrate body 32 is transmitted to the heat radiating plate 41 of the heat radiating unit 4. At this time, since the substrate body 32 and the heat radiating plate 41 are both made of copper having a relatively high thermal conductivity, heat is smoothly transferred between them. A part of the heat transmitted to the heat radiating plate 41 is further transmitted to the heat radiating block 42 and dissipated from the surface of the heat radiating block 42 into the air.

  Here, since the heat radiating block 42 is in surface contact with the main surface of the heat radiating plate 41, heat is smoothly transferred between the heat radiating plate 41 and the heat radiating block 42. Moreover, since each heat radiating block 42 is formed with a plurality of heat radiating holes 42a, the contact area between the heat radiating portion 4 and air can be increased, and a high heat radiating effect can be obtained. Moreover, since the upper and lower sides of the heat radiation hole 42a of the heat radiation block 42 are open, air easily flows in the vertical direction. As a result, when the air in the heat radiation hole 42a is heated by heat exchange with the heat radiation block 42, the heated air rises and flows upward from the heat radiation hole 42a, and air at a relatively low temperature radiates from below. It flows into the hole 42a. Further, since the vent 5c is formed in the side wall 5a of the case 5, air easily flows in and out between the inside and the outside of the case 5, and heat exchange with the air in the heat radiating portion 4 can be promoted.

  As described above, according to the light source device 1 of the present embodiment, the heat radiating performance of the linear light source unit 3 is remarkably improved while the heat radiating unit 4 is not exposed, and a plurality of glasses arranged linearly. Heat generated from the sealed LED 2 can be accurately dissipated. Therefore, it is possible to adopt a configuration in which the amount of heat generation increases, such as increasing the amount of light of each LED element 22 or concentrating each LED element 22, and the performance of each LED element 22 can be fully extracted.

Here, if it is set as the structure where the heat sink 41 does not exist, there exists a possibility that the temperature of the LED element 22 may rise to such an extent that it affects reliability. The temperature that affects the reliability varies depending on the LED element 22, but is, for example, 150 ° C. or higher, 200 ° C. or higher. Moreover, since the luminous efficiency of the LED element 22 decreases as the temperature rises, a stable amount of light cannot be obtained if the temperature of the LED element 22 rises excessively. Further, even if it is attempted to ensure the heat dissipation performance with the mounting substrate 31 itself, the thickness of the mounting substrate 31 is limited by manufacturing requirements (for example, about twice the width dimension), so the heat dissipation area is reduced. Thereby, the power supplied to the LED element 22 is limited, and a large amount of light cannot be obtained.
On the other hand, by providing the heat sink 41 as in the present embodiment, the reliability of the LED element 22 itself is not affected, and a large amount of light can be obtained. The heat radiation plate 41 has a high temperature within a range that does not affect the reliability of the LED element 22 itself, and obtains a heat radiation effect due to a difference from the ambient temperature.
Further, since the linear light source unit 3 on which the electrode pattern 24b is formed is configured to be connected to the end face of the heat sink 41, for example, when a circuit configuration for obtaining a desired light amount is used, only the circuit pattern 24b of the light source is changed. good. This effect cannot be obtained when the LED element 22 is simply mounted on the heat sink 41.

In addition, since the side walls 5 a of the case 5 are spaced apart from the linear light source unit 3, heat is not directly transmitted from the linear light source unit 3. Although the heat radiating plate 41 and the side wall 5a are connected by the support portion 5b, the support portion 5b is made of stainless steel having a lower thermal conductivity than the heat radiating plate 41. Transmission is suppressed. Therefore, the temperature rise of the case 5 can be suppressed. For example, it is safe to hold the case 5 directly by hand.
Further, heat transfer from the convex portion 5e in the bottom wall 5d to other portions is suppressed, and the convex portion 5e is recessed when viewed from the outside and hardly comes into contact with the outside. The temperature rise can be suppressed.

Furthermore, since the side wall 5a of the case 5 and the heat radiating part 4 are connected by the support part 5b, the heat radiating part 4 can be positioned in the left-right direction with respect to the side wall 5a. Further, since the support portion 5b is formed by bending a part of the side wall 5a, the number of parts can be reduced, the case 5 can be easily manufactured, and the manufacturing cost can be reduced.
Although the glass-sealed LED 2 has a plurality of LED elements 22 mounted thereon, the heat radiation pattern 26 has a highly heat-radiating configuration directly above each LED element 22, and the LED elements 22 are arranged in series. Therefore, it is possible to provide a small light source with reduced anode and cathode electrode areas. As a result, even if a relatively large amount of current is passed through the glass-sealed LED 2, the temperature rise of each LED element 22 can be suppressed, high light output can be achieved, and a compact high-intensity light source can be obtained. Thus, by using a compact high-intensity light source, the optical control accuracy by the lens 7 can be increased, which is extremely advantageous in practical use.

9 to 11 show a second embodiment of the present invention, and FIG. 9 is a top view of the light source device.
As shown in FIG. 9, the light source device 101 is held in a case 105 that has a square shape in a top view, a lens holding plate 108 that closes the upper surface of the case 105, and a holding hole 108 a in the lens holding plate 108. A lens 107. The lens 107 is made of, for example, an acrylic resin, and is a cylindrical type that extends along the longitudinal direction of the linear light source unit 3. In the present embodiment, the plurality of lenses 107 are arranged in parallel to each other.

FIG. 10 is a top view of the light source device in which the lens holding plate and the lens are omitted.
As shown in FIG. 10, each linear light source unit 3 of the light source device 101 has five glass-sealed LEDs 2 mounted at equal intervals, and is formed longer in the longitudinal direction than the linear light source unit 3 of the first embodiment. The In the present embodiment, three linear light source units 3 and heat radiating plates 41 having the same longitudinal dimension are provided, and the adjacent heat radiating plates 41 are connected by a heat radiating block 42 having a square shape in a top view. Each of the heat dissipation blocks 42 is in surface contact with the main surface of the heat dissipation plate 41. Each of the heat sinks 41 of the light source device 101 is connected to the linear light source unit 3 on the outer side in the left-right direction and has the same longitudinal dimension as that of the linear light source unit 3 and is connected to the central linear light source unit 3. What is to be formed is longer than the linear light source unit 3 in the longitudinal direction.

  The heat dissipation block 42 has a plurality of heat dissipation holes 42a penetrating vertically. In the present embodiment, each heat radiation hole 42 a extends in the width direction of the linear light source unit 3 and is formed side by side in the longitudinal direction of the linear light source unit 3. The heat dissipating block 42 is the same as the linear light source unit 3 in the longitudinal direction, and the end surface in the longitudinal direction is flush with the heat dissipating plate 41 on the outer side in the left-right direction.

As shown in FIG. 10, the light source device 101 includes spring members 106 and 109 interposed between the side walls 105 a of the case 105 and the heat radiating portion 104.
The two spring members 106 that come into contact with the left and right side walls 105a of the case 105 are made of an iron alloy (thermal conductivity: 50 W · m ⁻¹ · K ⁻¹ ), and are screwed at the center in the longitudinal direction of the heat radiating plate 41 on the outer side in the left and right direction. 110 is fixed. The spring member 106 includes a fixed end 162 fixed to the side surface of the heat radiating plate 41, a pair of contact ends 163 that contact the side wall 105 a of the case 105, and a pair of slopes that connect the fixed end 162 and the contact end 163. Part 164. The spring member 106 is formed by bending a single plate member, and urges the heat radiating portion 104 and the side wall 105a in a direction separating them from each other.

  The four spring members 109 that come into contact with the front and rear side walls 105a of the case 105 are made of an iron alloy, and are fixed to the longitudinal ends of the heat sink 41 at the center of the left and right by screws 110. In the present embodiment, two symmetrical spring members 109 are attached to the longitudinal ends of the heat sink 41, respectively. The spring material 109 includes a fixed end 192 fixed to the side surface of the heat sink 41, a contact end 193 that contacts the side wall 105a of the case 105, a curved portion 194 that connects the fixed end 192 and the contact end 193, Consists of The spring material 109 is formed by bending a single plate material, and urges the heat radiating portion 104 and the side wall 105a to be separated from each other.

FIG. 11 is a longitudinal sectional view of the light source device.
As shown in FIG. 11, the light source device 101 includes a linear light source unit 3 on which a plurality of glass-sealed LEDs 2 are mounted on the upper surface, and is connected to the lower surface of the linear light source unit 3 and downward from the linear light source unit 3. A heat radiating part 104 having a heat radiating plate 41 extending, and a case 105 for accommodating the linear light source part 3 and the heat radiating part 104 are provided. In the present embodiment, the plurality of linear light source units 3 and the heat radiating plate 41 are arranged in parallel to each other, and the heat radiating unit 104 is disposed between the heat radiating plates 41 and connects the two adjacent heat radiating plates 41. have. The case 105 has a thermal conductivity smaller than that of the heat radiating part 104, and includes four side walls 105a formed at intervals from the linear light source part 3 and the heat radiating part 104, and a bottom wall 105b connecting the lower ends of the side walls 105a. ,have. Furthermore, the light source device 101 includes a plurality of lenses 107 that are fixed to the side walls 105 a of the case 105 via the lens holding plate 108 and optically control light emitted from the linear light source units 103.

  Each lens 107 includes an incident portion 171 on which white light from the linear light source unit 3 is incident, a reflection surface 172 that reflects light incident on the lens 107 from the incident portion 171, and emits the light in the lens 107 to the outside. And a flange 174 held by the lens holding plate 108.

  The incident part 171 has a concave shape that is recessed upward at the lower part of the lens 107, and is formed so as to cover the upper part of the linear light source part 3. The incident portion 171 includes a curved surface 171a that is formed directly above the linear light source unit 3 and protrudes downward, and a pair of flat surfaces 171b that extend downward from both ends of the curved surface 171a in the width direction. The reflective surface 172 is formed on the left and right side portions of the lens 107 and has a parabolic shape with the LED element 22 of the glass-sealed LED 2 as a focal point when viewed from the front. The flange 174 is formed at the upper end of the reflecting surface 172 so as to protrude outward in the left-right direction, and is fitted into a recess 105 e formed on the upper end side of the side wall 105 a of the case 105. The emission surface 173 is formed flat on the upper portion of the lens 107. In this embodiment, the upper side of the case 105 is closed by the lens 107 and the lens holding plate 108, and the lens 107, the lens holding plate 108, each side wall 105a and the bottom wall 105d form a closed cross section.

  In the light source device 101 configured as described above, since a plurality of linear light source units 3 and lenses 107 that are parallel to each other are arranged, a plurality of parallel white lights having a predetermined width in the left-right direction are emitted from the light source device. 101 is irradiated to the outside.

  Further, the heat generated in each LED element 22 of each glass-sealed LED 2 is transmitted to the heat radiating plate 41 and the heat radiating block 42 of the heat radiating portion 104 through the substrate body 32. Here, since the heat radiating block 42 is in surface contact with the main surface of the heat radiating plate 41, heat is smoothly transferred between the heat radiating plate 41 and the heat radiating block 42. The heat transmitted to the heat radiating plate 41 and the heat radiating block 42 is dissipated into the air from the surfaces of the heat radiating plate 41 and the heat radiating block 42. At this time, the heat dissipation holes 42a of the heat dissipation block 42 are open upward and downward, so that air can easily flow in the vertical direction. As a result, when the air in the heat radiation hole 42a is heated by heat exchange with the heat radiation block 42, the heated air rises and flows upward from the heat radiation hole 42a, and air at a relatively low temperature radiates from below. It flows into the hole 42a.

  As described above, according to the light source device 101 of the present embodiment, the heat radiation performance of the linear light source unit 3 is markedly improved while the heat radiation unit 104 is not exposed, and a plurality of linearly arranged glasses. Heat generated from the sealed LED 2 can be accurately dissipated. Therefore, it is possible to adopt a configuration in which the amount of heat generation increases, such as increasing the amount of light of each LED element 22 or concentrating each LED element 22, and the performance of each LED element 22 can be fully extracted.

  Further, since the side wall 105a of the case 105 and the heat radiating portion 104 are connected by the spring members 106 and 109, the heat radiating portion 104 can be positioned in the front-rear direction and the left-right direction with respect to the side wall 105a. Furthermore, elastic deformation of the spring members 106 and 109 can absorb dimensional errors of each component, assembly errors when assembling each component, and the like, and can improve the yield of the apparatus. Furthermore, when each component of the heat dissipating part 104 is thermally expanded by the heat generated in each glass-sealed LED 2, the spring materials 106 and 109 are elastically deformed to relieve the stress generated in each component. be able to. In particular, the spring members 106 and 109 are not restrained with respect to the case 105, and when an excessive load is generated on the spring members 106 and 109, the contact ends 163 and 193 of the spring members 106 and 109 are against the side wall 105a. It is possible to slide, and excessive stress does not occur in the heat radiating portion 104, the case 105 and the like including the spring members 106 and 109. Therefore, it is possible to reduce the stress of each component generated during energization of each glass-sealed LED 2 and to suppress deformation of each component, and to reduce the difference in repeated stress during energization and non-energization. Reliability can be improved.

  In the first and second embodiments, the thickness direction of the mounting substrate 31 is described as the vertical direction, the longitudinal direction is the front-rear direction, and the width direction is the left-right direction. Of course, for example, the posture may be such that light is emitted downward, horizontally, or the like.

  Further, in the second embodiment, the case 105 and the heat radiating portion 104 are connected by the spring members 106 and 109. However, as in the first embodiment, the case and the heat radiating portion protrude from the case. It may be connected by a supporting part. Further, in the light source device 1 of the first embodiment, the case 5 and the heat radiating portion 4 may be connected by a spring material instead of the support portion 5b. In addition, the shape, number, arrangement, and the like of the spring material and the support portion can be changed as appropriate.

  In the first and second embodiments, the light source devices 1 and 101 have the cases 5 and 105. However, as shown in FIG. 12, for example, the light source device 201 has a wall 205 such as a building. It may be configured integrally. The light source device 201 has a wall portion 205 in which a gap for accommodating the lens holding plate 208 is formed, and the plurality of lenses 7 are held in the holding holes 208 of the lens holding plate 208. As shown in FIG. 13, in the light source device 201, a plurality of linear light source units 3 are arranged in parallel, and heat radiating plates (not shown) of the adjacent linear light source units 3 are connected by a heat radiating block 42. The heat radiation plate (not shown) of the linear light source unit 3 on the wall 205 side and the wall 205 are also connected by the heat radiation block 42. According to the light source device 201, the heat dissipation efficiency is further improved by the heat dissipation block 42 connected to the wall portion 205, and the heat dissipation performance can be drastically improved because heat can be released to the wall portion 205.

  Further, in each of the above embodiments, the case 5, 105 using stainless steel is shown, but for example, a resin material may be used, and the material of the case 5, 105 is arbitrary. The shapes of the cases 5 and 105 are also arbitrary.

  Moreover, in each said embodiment, although the copper plate was shown as the heat sink 41, you may use the board | plate material which consists of other metal materials, such as an aluminum plate and a brass plate, for example. Furthermore, although the radiator plate 41 has a rectangular shape, the shape of the radiator plate 41 is arbitrary. Furthermore, the structure of the heat radiating units 4 and 104 is also arbitrary, and may include, for example, fins connected to the heat radiating plate 41.

  Moreover, in each said embodiment, although the heat radiation block 42 formed what was formed in the rectangular parallelepiped was shown, the shape of the heat radiation block 42 is arbitrary. Further, although the heat radiating plates 41 are arranged in parallel to each other, for example, a configuration in which the rectangular parallelepiped heat radiating block 42 is in surface contact with the main surfaces of two orthogonal heat radiating plates 41 may be employed. In short, the heat dissipation block 42 only needs to be in surface contact with the main surface of at least two heat dissipation plates 41. In addition, the shape, the formation direction, and the like of the through hole 42a of the heat dissipation block 42 are arbitrary, and the through hole 42a may not be formed.

  In each of the above embodiments, the case where air naturally convects inside the cases 5 and 105 has been described. However, for example, an electric fan may be provided to circulate air forcibly. Thereby, since the heat exchange efficiency with the thermal radiation part 4104 and air improves, big electric power can be thrown into each glass-sealed LED2.

In each of the above embodiments, a copper base substrate in which the substrate body 32 is copper is shown as the mounting substrate 31, but the mounting substrate may be a substrate based on another metal such as an aluminum base substrate. Good. Furthermore, the mounting substrate may be a flexible substrate based on polyimide or liquid crystal polymer, and may be disposed between the glass-sealed LED 2 and the heat sink 41. When a relatively thin film-like substrate is used as the mounting substrate, the heat radiation pattern 26 of the glass-sealed LED 2 and the heat radiation plate 41 are soldered by forming holes at positions corresponding to the heat radiation pattern 26 of the glass-sealed LED 2. From the viewpoint of heat dissipation, it is preferable to directly bond via a wire. Here, an insulating layer of a metal base substrate such as copper or aluminum, or a relatively thin film-like insulating portion such as polyimide or liquid crystal polymer has a hole compared to an insulating portion having a relatively large plate thickness such as a glass epoxy substrate. There are few shape restrictions for formation. For this reason, like the said embodiment, the hole corresponding to the heat dissipation pattern of the glass-sealed LED with a comparatively small size and the mounting substrate with a comparatively narrow width | variety can be formed.
Moreover, although what each glass-sealed LED2 was electrically connected in series was shown, each glass-sealed LED2 may be connected in parallel. Moreover, although the example in which the glass-sealed LED 2 and the heat radiating plate 41 are joined without the insulating layer 23 is shown, although the restriction on the energization current and the like is increased, it is through the insulating layer and the flexible substrate. May be.

  Moreover, in each said embodiment, although what emitted white light from glass-sealed LED2 was shown, for example as a structure by which the fluorescent substance 23a is not included in the glass-sealing part 23, blue light is emitted from glass-sealed LED. May be emitted. Moreover, although the LED element 22 is shown as a flip-chip type, it may be a face-up type. Furthermore, the number of LED elements 22 mounted on one glass-sealed LED 2 and the arrangement state of the LED elements 22 are arbitrary. As described above, the detailed configuration, emission color, and the like of the glass-sealed LED can be appropriately changed. Furthermore, although the reliability and the like are inferior to those of the glass-sealed LED, a resin-sealed LED may be used, and it is needless to say that a specific detailed structure can be appropriately changed.

It is an external appearance perspective view of the light source device which shows the 1st Embodiment of this invention. It is sectional drawing of a light source device. It is a disassembled perspective view of a light source device. It is an external appearance perspective view of a linear light source part. It is a longitudinal cross-sectional view of a linear light source part. It is a top view of a mounting substrate. It is a top view of a light source device. It is a top view of the light source device which abbreviate | omitted the lens and the lens holding plate. It is a top view of the light source device which shows the 2nd Embodiment of this invention. It is a top view of the light source device which abbreviate | omitted the lens holding plate and the lens. It is a longitudinal cross-sectional view of a light source device. It is a top view of the light source device which shows a modification. It is a top view of the light source device which abbreviate | omitted the lens holding plate and lens which show a modification.

Explanation of symbols

1 Light source device 2 Glass-sealed LED
DESCRIPTION OF SYMBOLS 3 Linear light source part 4 Heat radiation part 41 Heat sink 42 Heat radiation block 101 Light source device 104 Heat radiation part 201 Light source device

Claims (2)

A plurality of linear light source sections each mounted with a plurality of glass-sealed LEDs;
A plurality of radiator plate end face is connected respectively to those the plurality of linear light source section is provided for each of the plurality of linear light source section, and the same longitudinal dimension and the maximum of the heat radiating plate in the plurality of radiator plates A radiating block having a rectangular parallelepiped shape having a longitudinal dimension, and the radiating block is disposed between the plurality of radiating plates including the radiating plate having the largest longitudinal dimension, and the entire surface of the radiating plate having the largest longitudinal dimension. a heat radiating portion which is in surface contact over,
The side wall is formed of a member having a lower thermal conductivity than the heat radiating portion, and is formed continuously with the plurality of linear light source portions and the heat radiating portion with a predetermined interval, and the side wall. And a bottom wall having a convex portion formed for each of the plurality of heat radiating plates so as to be located on the inner side of the boundary portion between the radiating portion and the heat radiating portion by bending a part of the side wall inward. A case in which vents and side wall support portions are formed by being connected , and
The heat dissipation block has a plurality of through holes penetrating vertically and formed in the longitudinal direction of the plurality of linear light source units,
The convex portion, the light source device you characterized by having a bottom wall supporting portion for supporting the opposite end surfaces of the plurality of linear light source section in the plurality of the heat radiating plate. 2. The light source according to claim 1 , further comprising a spring material interposed between the case and the heat radiating plate located outside the plurality of heat radiating plates, and biasing the case and the plurality of heat radiating plates in a direction away from each other. apparatus.