JP5297378B2 - スパッタリングターゲットアセンブリとそれを製造する方法 - Google Patents
スパッタリングターゲットアセンブリとそれを製造する方法 Download PDFInfo
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- JP5297378B2 JP5297378B2 JP2009528227A JP2009528227A JP5297378B2 JP 5297378 B2 JP5297378 B2 JP 5297378B2 JP 2009528227 A JP2009528227 A JP 2009528227A JP 2009528227 A JP2009528227 A JP 2009528227A JP 5297378 B2 JP5297378 B2 JP 5297378B2
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- backing plate
- target
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000005477 sputtering target Methods 0.000 title abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 49
- 238000003466 welding Methods 0.000 claims abstract description 20
- 238000003756 stirring Methods 0.000 claims abstract description 11
- 238000005304 joining Methods 0.000 claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 4
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 2
- 238000004880 explosion Methods 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 238000000462 isostatic pressing Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000035515 penetration Effects 0.000 claims 2
- 239000000463 material Substances 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 10
- 229910000838 Al alloy Chemical group 0.000 description 6
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000001513 hot isostatic pressing Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017532 Cu-Be Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229920006333 epoxy cement Polymers 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/129—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding specially adapted for particular articles or workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/14—Titanium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/26—Alloys of Nickel and Cobalt and Chromium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Description
110 バッキングプレート
120 界面
130 接合面
140 f.s.w.工具
150 f.s.w.パターン
160 アセンブリの外周によって包囲された領域
Claims (12)
- スパッターターゲット/バッキングプレートアセンブリを製造する方法であって、
a. 第一の接合面及び反対側の下面を有するバッキングプレートを用意し、
b. 第二の接合面を有するスパッターターゲットを用意し、
c. 前記第一および第二の接合面とを合わせて前記スパッターターゲットを前記バッキングプレートに摩擦攪拌溶接(f.s.w.)接合してアセンブリを形成し、該摩擦攪拌溶接接合が、該バッキングプレートの該下面を通るピンタイプのf.s.w.工具の貫通を特徴とする、
各ステップから成ることを特徴とする方法。 - 当該バッキングプレートがAlもしくはCuまたはこれらのものの合金から成ることを特徴とする請求項1に記載の方法。
- 当該Cu合金がCu/Zn合金であることを特徴とする請求項2に記載の方法。
- スパッターターゲット/バッキングプレートアセンブリを製造する方法であって、
a. 第一の接合面及び反対側の下面を有するバッキングプレートを用意し、
b. 第二の接合面を有するスパッターターゲットを用意し、
c. 前記第一および第二の接合面とを合わせて前記スパッターターゲット及び前記バッキングプレートを接合してアセンブリを形成し、
d. 該バッキングプレートの該下面を通るピンタイプのf.s.w.工具の貫通により該アセンブリを摩擦攪拌溶接(f.s.w.)接合する、
各ステップから成ることを特徴とする方法。 - 当該ステップ(c)が、ハンダ接合、拡散接合、高温静水圧圧縮、ホットプレス、爆発接合、およびTIG溶接から選択される接合法によって実施されることを特徴とする請求項4に記載の方法。
- 当該ステップ(c)が、当該ターゲットと当該バッキングプレートとを機械的にかみ合わせることによって実施されることを特徴とする請求項4に記載の方法。
- 当該バッキングプレートがAlもしくはCuまたはこれらのものの合金から成ることを特徴とする請求項6に記載の方法。
- 当該バッキングプレートがCu/Znから成ることを特徴とする請求項7に記載の方法。
- 当該ターゲットがAlまたはその合金から成ることを特徴とする請求項7に記載の方法。
- 当該ターゲットが、Al、Cu、Co、Ni、Ta、TiもしくはWまたはこれらのものの合金から成ることを特徴とする請求項4に記載の方法。
- 当該機械的にかみ合わせることが、当該ターゲットとバッキングプレートとの主要界面に溝パターンを形成し、100℃よりも低い温度で当該界面に沿って前記ターゲットとバッキングプレートとを圧縮することから成ることを特徴とする請求項6に記載の方法。
- 室温付近〜38℃の温度で当該ターゲットとバッキングプレートとを当該界面に沿って圧縮することを含むことを特徴とする請求項11に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US84402806P | 2006-09-12 | 2006-09-12 | |
US60/844,028 | 2006-09-12 | ||
PCT/US2007/017598 WO2008033192A1 (en) | 2006-09-12 | 2007-08-08 | Sputtering target assembly and method of making same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010503771A JP2010503771A (ja) | 2010-02-04 |
JP5297378B2 true JP5297378B2 (ja) | 2013-09-25 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009528227A Expired - Fee Related JP5297378B2 (ja) | 2006-09-12 | 2007-08-08 | スパッタリングターゲットアセンブリとそれを製造する方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8020748B2 (ja) |
JP (1) | JP5297378B2 (ja) |
KR (1) | KR20090051215A (ja) |
TW (1) | TWI391205B (ja) |
WO (1) | WO2008033192A1 (ja) |
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WO2008033192A1 (en) * | 2006-09-12 | 2008-03-20 | Tosoh Smd, Inc. | Sputtering target assembly and method of making same |
US20080145688A1 (en) | 2006-12-13 | 2008-06-19 | H.C. Starck Inc. | Method of joining tantalum clade steel structures |
US8197894B2 (en) | 2007-05-04 | 2012-06-12 | H.C. Starck Gmbh | Methods of forming sputtering targets |
US8246903B2 (en) | 2008-09-09 | 2012-08-21 | H.C. Starck Inc. | Dynamic dehydriding of refractory metal powders |
CN102059421A (zh) * | 2010-12-09 | 2011-05-18 | 宁波江丰电子材料有限公司 | 钛靶铝背板焊接方法 |
WO2013049274A2 (en) | 2011-09-29 | 2013-04-04 | H.C. Starck, Inc. | Large-area sputtering targets and methods of manufacturing large-area sputtering targets |
US10354846B2 (en) * | 2013-11-06 | 2019-07-16 | Jx Nippon Mining & Metals Corporation | Sputtering target-backing plate assembly |
CN113924383B (zh) * | 2019-07-01 | 2023-12-29 | 株式会社古屋金属 | 钌系溅镀靶材及其制造方法 |
CN111660003B (zh) * | 2020-06-22 | 2021-08-03 | 浙江最成半导体科技有限公司 | 一种溅射靶材焊接方法 |
CN112458419B (zh) * | 2020-11-25 | 2023-04-11 | 南京工程学院 | 一种多元难熔金属元素共掺杂纳米NiAl基合金薄膜及其制备方法和应用 |
CN112935521B (zh) * | 2021-03-02 | 2023-03-21 | 中国工程物理研究院材料研究所 | 一种铍铝合金板的搅拌摩擦焊接方法 |
WO2022272045A1 (en) * | 2021-06-24 | 2022-12-29 | Materion Corporation | Modular sputtering target with precious metal insert and skirt |
CN114959618A (zh) * | 2022-06-29 | 2022-08-30 | 浙江最成半导体科技有限公司 | 一种溅射靶材及其制备方法 |
CN115255596A (zh) * | 2022-09-06 | 2022-11-01 | 浙江最成半导体科技有限公司 | 一种靶材、靶材组件及其制作方法 |
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JP4784602B2 (ja) * | 2005-03-04 | 2011-10-05 | 日本軽金属株式会社 | スパッタリングターゲット及びその製造方法並びにこの方法を用いたスパッタリングターゲットの再生方法 |
US7652223B2 (en) * | 2005-06-13 | 2010-01-26 | Applied Materials, Inc. | Electron beam welding of sputtering target tiles |
WO2008033192A1 (en) * | 2006-09-12 | 2008-03-20 | Tosoh Smd, Inc. | Sputtering target assembly and method of making same |
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2007
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- 2007-08-08 JP JP2009528227A patent/JP5297378B2/ja not_active Expired - Fee Related
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US20100044415A1 (en) | 2010-02-25 |
TWI391205B (zh) | 2013-04-01 |
TW200815136A (en) | 2008-04-01 |
WO2008033192A1 (en) | 2008-03-20 |
KR20090051215A (ko) | 2009-05-21 |
JP2010503771A (ja) | 2010-02-04 |
US20120000594A1 (en) | 2012-01-05 |
US8235277B2 (en) | 2012-08-07 |
US8020748B2 (en) | 2011-09-20 |
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