JP5279345B2 - Power conversion device storage structure - Google Patents

Power conversion device storage structure Download PDF

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Publication number
JP5279345B2
JP5279345B2 JP2008138541A JP2008138541A JP5279345B2 JP 5279345 B2 JP5279345 B2 JP 5279345B2 JP 2008138541 A JP2008138541 A JP 2008138541A JP 2008138541 A JP2008138541 A JP 2008138541A JP 5279345 B2 JP5279345 B2 JP 5279345B2
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circuit board
control circuit
resin
main circuit
insulating material
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JP2009289831A (en
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弘行 芳原
洋一 五藤
正喜 後藤
清文 北井
恒雄 小松
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inverter Devices (AREA)

Description

この発明は、民生機器や産業用機器等で用いられる電力変換装置の例えば樹脂ケースへの収納構造に関するものである。   The present invention relates to a storage structure of, for example, a resin case of a power conversion device used in consumer equipment, industrial equipment, and the like.

近年、電力変換装置は、家庭用エアコンや冷蔵庫など民生機器だけでなく、インバータやサーボコントローラなどの産業機器、さらに電気自動車など、広範囲の分野で使用されている。   In recent years, power conversion devices have been used in a wide range of fields such as household appliances such as air conditioners and refrigerators, industrial equipment such as inverters and servo controllers, and electric vehicles.

このような電力変換装置の収納構造としては、例えば、特許文献１に示されたものがある。すなわち、従来の収納構造は、金属ベース、主端子、制御端子、入出力端子がインサート成形された樹脂ケースに、底部の金属ベース上に主回路基板を配置し、制御回路基板をこの主回路基板の一側端側に立設した配線部材に片側を保持させて主回路基板の直上に配置し、制御回路基板の表裏面を絶縁樹脂で樹脂封止すると、底部側の主回路基板の表面も樹脂封止される構造である。そして、前記主回路基板を冷却するための放熱板（ヒートシンク）が、前記金属ベースの外面に露出して取り付けられる構造である。なお、主回路基板には主回路を構成するパワー素子が金属ワイヤにて配線した状態で搭載されている。また、制御回路基板には、前記パワー素子を駆動する制御回路が搭載されている。   As a storage structure for such a power conversion device, for example, there is one disclosed in Patent Document 1. That is, in the conventional storage structure, the main circuit board is disposed on the bottom metal base in a resin case in which the metal base, main terminal, control terminal, and input / output terminal are insert-molded, and the control circuit board is disposed on the main circuit board. If one side is held by a wiring member erected on one side end side and placed right above the main circuit board, and the front and back surfaces of the control circuit board are sealed with insulating resin, the surface of the main circuit board on the bottom side will also be This is a resin-sealed structure. A heat sink (heat sink) for cooling the main circuit board is attached to be exposed on the outer surface of the metal base. Note that power elements constituting the main circuit are mounted on the main circuit board in a state of being wired with metal wires. A control circuit for driving the power element is mounted on the control circuit board.

特開平１１−６８０３５号公報（図９）Japanese Patent Laid-Open No. 11-68035 (FIG. 9)

しかし、従来の収納構造では、制御回路基板は主回路基板の表面側に配線された金属ワイヤとの絶縁距離を大きくする必要があることから離間距離が大きくなるので、樹脂量が多くなり、また、制御回路基板を支持する配線部材も長くなる。樹脂量が多くなるということは、装置の重量化を意味する他に、樹脂の加熱硬化時間が長くなる結果、生産性を圧迫するので、コストの増加を意味する。   However, in the conventional storage structure, since the control circuit board needs to increase the insulation distance from the metal wire wired on the surface side of the main circuit board, the separation distance increases, so the amount of resin increases, and The wiring member that supports the control circuit board also becomes longer. An increase in the amount of resin means an increase in cost because it increases the weight of the apparatus and, as a result, the heat-curing time of the resin becomes longer, resulting in pressure on productivity.

また、充填した絶縁樹脂は、樹脂ケースの振動に伴って揺動するので、制御回路基板を支持する配線部材が長くなると、配線部材は振動時に起こる樹脂の揺れと共振しやすくなり、制御回路基板の揺れが大きくなる。この場合に、配線部材に掛かる負荷が大きくなって配線部材が折れ曲がると、主回路基板上の金属ワイヤと制御回路基板との間で短絡不良が発生する可能性がある。そして、このような振動共振によって樹脂ケースや主回路基板が撓むと、主回路基板上の金属ワイヤが断線する可能性がある。   Also, since the filled insulating resin swings with the vibration of the resin case, if the wiring member that supports the control circuit board becomes long, the wiring member tends to resonate with the resin shaking that occurs during vibration, and the control circuit board The shaking becomes larger. In this case, if the load applied to the wiring member is increased and the wiring member is bent, a short circuit failure may occur between the metal wire on the main circuit board and the control circuit board. When the resin case or the main circuit board is bent by such vibration resonance, the metal wire on the main circuit board may be disconnected.

さらに、樹脂封止時に発生する気泡は、絶縁樹脂の加熱硬化時に、気泡体積膨張とともに大気中に放出されるが、従来の収納構造では、充填樹脂層が厚いために、大気放出までの距離が長くなるので、気泡が絶縁樹脂層内に残存して加熱硬化時にボイドとなる可能性が高いと言える。つまり、制御回路基板と主回路基板間の絶縁性能が低下する可能性があり、問題である。   Furthermore, the bubbles generated during resin sealing are released into the atmosphere along with the expansion of the bubbles when the insulating resin is heat-cured. However, in the conventional storage structure, since the filled resin layer is thick, the distance to the atmosphere release is small. Since it becomes long, it can be said that there is a high possibility that bubbles remain in the insulating resin layer and become voids during heat curing. That is, there is a possibility that the insulation performance between the control circuit board and the main circuit board may deteriorate, which is a problem.

なお、別構造として、制御回路基板を縦置きにする場合があるが、ボイドが抜けやすくなる反面、樹脂量が多いことによる上記の重量化等の問題がある。   As another structure, there is a case where the control circuit board is placed vertically, but the void is easily removed, but there is a problem such as the above-mentioned weight increase due to a large amount of resin.

加えて、制御回路基板は発熱部品を有する主回路基板の直上に配置されるため、主回路基板での発熱が樹脂を介して制御回路基板に伝導される。これによって、制御回路基板の熱に弱い部品（コンデンサ等）が損傷する可能性があり、問題である。   In addition, since the control circuit board is disposed immediately above the main circuit board having the heat generating component, heat generated in the main circuit board is conducted to the control circuit board through the resin. This can cause damage to heat-sensitive components (such as capacitors) on the control circuit board, which is a problem.

この発明は、上記に鑑みてなされたものであり、必要絶縁材量を少なくして、装置の軽量化、耐振動性の向上、生産性の向上、低コスト化を実現可能な電力変換装置の収納構造を得ることを目的とする。   The present invention has been made in view of the above, and is a power conversion device that can reduce the amount of necessary insulating material and realize weight reduction, vibration resistance improvement, productivity improvement, and cost reduction of the device. The purpose is to obtain a storage structure.

上述した目的を達成するために、この発明にかかる電力変換装置の収納構造は、ケースの底部に、電力変換装置の主回路を搭載する主回路基板及び制御回路を搭載する制御回路基板を横並びに固定配置する電力変換装置の収納構造であって、前記制御回路基板は、裏面が前記ケースの底部に突設した台座に接着固定され、前記主回路基板は、表面を前記ケースの底部面と略同一の位置に位置させて固定され、前記ケースに充填した絶縁材によって、前記制御回路基板の表裏面と前記主回路基板の表面とがそれぞれ絶縁材による封止がなされており、前記制御回路基板の前記主回路基板と対面しない側端側と前記ケースとの間に、注入された絶縁材を当該制御回路基板の裏面側に流入させるための流入口が設けられていることを特徴とする。 In order to achieve the above-described object, the storage structure for a power converter according to the present invention has a main circuit board on which a main circuit of the power converter is mounted and a control circuit board on which a control circuit is mounted side by side at the bottom of the case. The control circuit board is fixedly disposed on a pedestal whose rear surface protrudes from the bottom of the case, and the main circuit board has a surface substantially the same as the bottom surface of the case. is fixed by positioning the same position, by an insulating material filled in the casing, the front and back surfaces and the main circuit board of the surface of the control circuit board have been made sealing with each insulating material, said control circuit board An inflow port for allowing the injected insulating material to flow into the back side of the control circuit board is provided between the side end side that does not face the main circuit board and the case .

この発明によれば、主回路基板及び制御回路基板を、必要樹脂量を少なくする横並びに固定配置としたので、装置の軽量化、耐振動性の向上、生産性の向上、低コスト化を実現可能な電力変換装置の収納構造が得られるという効果を奏する。   According to the present invention, the main circuit board and the control circuit board are arranged side by side and fixedly arranged so as to reduce the amount of resin required, thereby realizing lighter equipment, improved vibration resistance, improved productivity, and lower cost. There is an effect that a storage structure of a possible power converter is obtained.

以下に図面を参照して、この発明にかかる電力変換装置の収納構造の好適な実施の形態を詳細に説明する。   Exemplary embodiments of a storage structure for a power converter according to the present invention will be described below in detail with reference to the drawings.

実施の形態１．
図１は、電力変換装置の一般的な電気的構成を示す回路図である。図２及び図３は、この発明の実施の形態１による電力変換装置の収納構造を示す平面図及び断面図である。 Embodiment 1 FIG.
FIG. 1 is a circuit diagram showing a general electrical configuration of a power converter. 2 and 3 are a plan view and a cross-sectional view showing the storage structure of the power conversion device according to Embodiment 1 of the present invention.

（電力変換装置の電気的構成と動作）
まず、電力変換装置の電気的構成と動作について簡単に説明する。図１に示すように、電力変換装置は、三相交流電源２７が接続される入力端子５ａと、三相モータ（Ｍ）２８が接続される出力端子５ｂと、入力端子５ａと出力端子５ｂの間に配置される主回路２２と、主回路２２を制御等する制御回路２３と、制御回路２３の動作電源を生成する電源回路２４とを備えている。制御回路２３には、マイクロコンピュータを主要素として構成される主回路駆動回路及び保護回路が含まれている。 (Electric configuration and operation of power converter)
First, the electrical configuration and operation of the power converter will be briefly described. As shown in FIG. 1, the power converter includes an input terminal 5a to which a three-phase AC power supply 27 is connected, an output terminal 5b to which a three-phase motor (M) 28 is connected, an input terminal 5a, and an output terminal 5b. A main circuit 22 disposed therebetween, a control circuit 23 for controlling the main circuit 22, and a power supply circuit 24 for generating an operating power supply for the control circuit 23 are provided. The control circuit 23 includes a main circuit driving circuit and a protection circuit configured with a microcomputer as a main element.

主回路２２は、入力端子５ａが接続されるコンバータ部２２ａと、出力端子５ｂが接続されるインバータ部２２ｃと、それらの間に配置される平滑コンデンサ２２ｂとで構成される。   The main circuit 22 includes a converter unit 22a to which the input terminal 5a is connected, an inverter unit 22c to which the output terminal 5b is connected, and a smoothing capacitor 22b disposed therebetween.

コンバータ部２２ａは、ダイオードなどの整流素子（パワー素子）９のブリッジで構成され、入力端子５ａからの三相交流電圧を全波整流して出力する。平滑コンデンサ２２ｂは、コンバータ部２２ａの直流出力端間の整流電圧を平滑化して保持する。インバータ部２２ｃは、平滑コンデンサ２２ｂの端子間に直列に接続された２個のスイッチング素子（パワー素子）１０の３組が、制御回路２３における主回路駆動回路からのＰＷＭ信号に従って平滑コンデンサ２２ｂの端子間電圧をスイッチングして所定周波数の交流電圧に変換し、出力端子５ｂを介して三相モータ２８に供給する。   The converter unit 22a is configured by a bridge of a rectifying element (power element) 9 such as a diode, and rectifies and outputs a three-phase AC voltage from the input terminal 5a. The smoothing capacitor 22b smoothes and holds the rectified voltage between the DC output terminals of the converter unit 22a. The inverter unit 22c includes three sets of two switching elements (power elements) 10 connected in series between terminals of the smoothing capacitor 22b, and the terminals of the smoothing capacitor 22b according to the PWM signal from the main circuit drive circuit in the control circuit 23. The inter-voltage is switched to be converted into an AC voltage having a predetermined frequency and supplied to the three-phase motor 28 via the output terminal 5b.

（電力変換装置の回路基板構成）
電力変換装置の回路基板は、大きく分けて、主回路２２のコンバータ部２２ａ及びインバータ部２２ｃを搭載する主回路基板と、制御回路２３を搭載する制御回路基板と、電源回路２４を搭載する電源回路基板とで構成される。主回路２２の平滑コンデンサ２２ｂは電源回路基板に搭載されるが、図２、図３では、電源回路基板の図示を省略してある。なお、主回路基板は、例えばセラミックス基板や金属基板を用いて形成されている。また、多層構成の制御回路基板は、例えばガラエポ基板を用いて形成されている。 (Circuit board configuration of power converter)
The circuit board of the power converter is roughly divided into a main circuit board on which the converter unit 22a and the inverter unit 22c of the main circuit 22 are mounted, a control circuit board on which the control circuit 23 is mounted, and a power circuit on which the power circuit 24 is mounted. It consists of a substrate. Although the smoothing capacitor 22b of the main circuit 22 is mounted on the power circuit board, the power circuit board is not shown in FIGS. The main circuit board is formed using, for example, a ceramic substrate or a metal substrate. The multilayer control circuit board is formed using, for example, a glass epoxy substrate.

（この実施の形態１による電力変換装置の収納構造）
図２及び図３において、符号１は、この実施の形態では、例えば樹脂ケースであり、例えばＰＰＳ樹脂やＰＢＴ樹脂などを用いて、図１に示した構成の電力変換装置を基板単位で収納できる形状に形成された樹脂成型品である。樹脂ケース１は、その外周囲に、配線部材である主回路端子台５、主端子６及び制御端子７がインサート成形されている。但し、図３に示すように樹脂ケース１の底部には、従来例のような金属ベースはインサート成形されていない。 (Storage structure of power conversion device according to Embodiment 1)
2 and 3, reference numeral 1 in this embodiment is a resin case, for example, and the power conversion device having the configuration shown in FIG. 1 can be stored in units of substrates using, for example, PPS resin or PBT resin. It is a resin molded product formed into a shape. The resin case 1 has a main circuit terminal block 5, a main terminal 6, and a control terminal 7, which are wiring members, formed by insert molding around the outer periphery thereof. However, as shown in FIG. 3, the metal base as in the conventional example is not insert-molded at the bottom of the resin case 1.

この樹脂ケース１の底部側に、主回路基板２と制御回路基板３とが水平横方向に並んで固定配置されている。具体的には、図３に示すように、制御回路基板３は、その裏面が樹脂ケース１の底部に突設した台座１１に接着固定されている。つまり、制御回路基板３の裏面と樹脂ケース１の底部面との間には、台座１１の高さだけの隙間が形成される構造になっている。なお、台座１１の高さは、制御回路基板３の裏面に載置される電子部品（図示せず）の高さよりも高くなっている。   On the bottom side of the resin case 1, the main circuit board 2 and the control circuit board 3 are fixedly arranged side by side in the horizontal horizontal direction. Specifically, as shown in FIG. 3, the back surface of the control circuit board 3 is bonded and fixed to a pedestal 11 that protrudes from the bottom of the resin case 1. That is, a gap corresponding to the height of the base 11 is formed between the back surface of the control circuit board 3 and the bottom surface of the resin case 1. Note that the height of the pedestal 11 is higher than the height of an electronic component (not shown) placed on the back surface of the control circuit board 3.

また、主回路基板２は、樹脂ケース１の底部に開けた開口部に嵌め込まれ、その外周囲が当該開口部の内周縁に接着固定されている。つまり、主回路基板２の表面位置は、制御回路基板３の裏面位置よりも低い樹脂ケース１の底部面と略同一面上にあり、主回路基板２の裏面は、外部に露出している。この配置態様で樹脂ケース１に絶縁材としての絶縁樹脂４が充填され、制御回路基板３の表裏面と主回路基板２の表面とが樹脂封止される構造になっている。なお、絶縁樹脂４は、例えばシリコーン樹脂やエポキシ樹脂などである。   The main circuit board 2 is fitted into an opening opened at the bottom of the resin case 1, and the outer periphery thereof is bonded and fixed to the inner periphery of the opening. That is, the front surface position of the main circuit board 2 is substantially flush with the bottom surface of the resin case 1 lower than the back surface position of the control circuit board 3, and the back surface of the main circuit board 2 is exposed to the outside. In this arrangement, the resin case 1 is filled with an insulating resin 4 as an insulating material, and the front and back surfaces of the control circuit board 3 and the front surface of the main circuit board 2 are sealed with resin. The insulating resin 4 is, for example, a silicone resin or an epoxy resin.

主回路端子台５には、図１に示した入力端子５ａと出力端子５ｂとが割り当てられている。主端子６と主回路基板２との間、制御端子７と制御回路基板３との間、主回路基板２と制御回路基板３との間は、それぞれ、金属ワイヤ（例えばアルミワイヤ）で電気的に接続されている。また、主端子６と制御端子７は、平滑コンデンサ２２ｂが搭載される図示しない電源回路基板に接続されている。   The main circuit terminal block 5 is assigned the input terminal 5a and the output terminal 5b shown in FIG. Metal wires (for example, aluminum wires) are electrically connected between the main terminal 6 and the main circuit board 2, between the control terminal 7 and the control circuit board 3, and between the main circuit board 2 and the control circuit board 3, respectively. It is connected to the. The main terminal 6 and the control terminal 7 are connected to a power circuit board (not shown) on which the smoothing capacitor 22b is mounted.

主回路基板２の表面には、コンバータ部２２ａのパワー素子９とインバータ部２２ｃのパワー素子１０とが配置され、また金属パターン２１が形成されている。パワー素子９，１０は、金属パターン２１に半田接合されているとともに、金属パターン２１との間が金属ワイヤ８で電気的に接続され、また主回路端子台５との間が金属ワイヤ８で電気的に接続されている。また、主回路基板２と制御回路基板３との間も金属ワイヤ８で電気的に接続されている。これらの金属ワイヤ８による配線長は、いずれも短いものになっている。なお、主回路基板２の外部に露出している裏面には、ヒートシンク（図示せず）が取り付けられ、パワー素子９，１０の発熱を放散できるようになっている。   On the surface of the main circuit board 2, the power element 9 of the converter part 22a and the power element 10 of the inverter part 22c are arranged, and a metal pattern 21 is formed. The power elements 9 and 10 are soldered to the metal pattern 21, electrically connected to the metal pattern 21 by the metal wire 8, and electrically connected to the main circuit terminal block 5 by the metal wire 8. Connected. The main circuit board 2 and the control circuit board 3 are also electrically connected by metal wires 8. The wiring lengths of these metal wires 8 are all short. A heat sink (not shown) is attached to the back surface exposed to the outside of the main circuit board 2 so that the heat generated by the power elements 9 and 10 can be dissipated.

制御回路基板３の表面には、制御回路２３の主回路駆動回路及び保護回路を実現するマイクロコンピュータ１２が載置され、また、背の低い部品の他に、背の高いフォトカプラ１８が載置されている。制御回路基板３の表面上に充填される絶縁樹脂４の層厚は、フォトカプラ１８の高さを少し超えた程度になっている。   On the surface of the control circuit board 3, a microcomputer 12 that realizes a main circuit driving circuit and a protection circuit for the control circuit 23 is placed. In addition to a short component, a tall photocoupler 18 is placed. Has been. The layer thickness of the insulating resin 4 filled on the surface of the control circuit board 3 is a little over the height of the photocoupler 18.

そして、樹脂封止に関わる構成として、制御回路基板３の主回路基板２と対面しない側端側と樹脂ケース１との間に、流入口１３が設けられ、注入樹脂を制御回路基板３の裏面側に流入させ得るようになっている。具体的には、図３に示すように、制御回路基板３の主回路基板２と対面しない側端側における樹脂ケース１の底部は、制御回路基板３が配置される底部よりも１段高くなっていて、その段差部と制御回路基板３の主回路基板２と対面しない側端側との間に流入口１３となる隙間を設けてある。   In addition, as a configuration related to resin sealing, an inlet 13 is provided between the side end of the control circuit board 3 that does not face the main circuit board 2 and the resin case 1, and the injection resin is disposed on the back surface of the control circuit board 3. It can be made to flow into the side. Specifically, as shown in FIG. 3, the bottom of the resin case 1 on the side end side of the control circuit board 3 that does not face the main circuit board 2 is one step higher than the bottom where the control circuit board 3 is disposed. In addition, a gap serving as the inlet 13 is provided between the stepped portion and the side end of the control circuit board 3 that does not face the main circuit board 2.

そして、流入口１３が設けられている側の樹脂ケース１の外周には、注入樹脂を一時滞留する樹脂だまり２６が設けられ、流入口１３への定期的な樹脂注入が行えるようになっている。また、制御回路基板３の主回路基板２と対面する側端側に、排出口１４ａ，１４ｂ，１４ｃが設けられ、制御回路基板３の裏面側から出る樹脂を主回路基板２の表面上へ押し出せるようになっている。排出口１４ａ，１４ｂ，１４ｃは、台座１１の配置態様を工夫して作られている。さらに、制御回路基板３の表面の制御端子７側に、流入穴１７が設けられ、表面を流れる樹脂を裏面側へ流入させ得るようになっている。   A resin reservoir 26 for temporarily retaining the injected resin is provided on the outer periphery of the resin case 1 on the side where the inlet 13 is provided, so that periodic resin injection into the inlet 13 can be performed. . Further, discharge ports 14 a, 14 b and 14 c are provided on the side end facing the main circuit board 2 of the control circuit board 3, and pushes the resin coming out from the back side of the control circuit board 3 onto the surface of the main circuit board 2. It can be put out. The discharge ports 14a, 14b, and 14c are made by devising the arrangement mode of the base 11. Further, an inflow hole 17 is provided on the surface of the control circuit board 3 on the control terminal 7 side so that the resin flowing on the surface can flow into the back surface side.

（絶縁樹脂４の充填方法）
絶縁樹脂４を主回路基板２側から注入すると、注入樹脂は、主回路基板２の表面を覆いつつ制御回路基板３に向かって流れる。この場合、制御回路基板３の表面は主回路基板２の表面と同様に問題なく樹脂封止できるが、制御回路基板３の裏面側は流動抵抗が高く、樹脂の流れが悪くなり、ボイドが発生する。 (Filling method of insulating resin 4)
When the insulating resin 4 is injected from the main circuit board 2 side, the injected resin flows toward the control circuit board 3 while covering the surface of the main circuit board 2. In this case, the surface of the control circuit board 3 can be resin-sealed without any problem as with the surface of the main circuit board 2, but the back side of the control circuit board 3 has a high flow resistance and the flow of the resin becomes poor and voids are generated. To do.

そこで、絶縁樹脂４を樹脂だまり２６に滞留させて、矢印２５で示すように、流入口１３から制御回路基板３の主回路基板２と対面しない側端側に向けて樹脂が定期的に流れ込むように樹脂注入を行う。これを、樹脂だまり２６に絶縁樹脂４を補充しながら行う。   Therefore, the insulating resin 4 is retained in the resin reservoir 26 so that the resin periodically flows from the inlet 13 toward the side end of the control circuit board 3 that does not face the main circuit board 2 as indicated by an arrow 25. Resin injection is performed. This is performed while replenishing the resin reservoir 26 with the insulating resin 4.

これによって、制御回路基板３の裏面側には流入口１３から樹脂注入が定期的に行われるので、制御回路基板３の裏面樹脂流れは、一定圧で制御されることになる。これによって、制御回路基板３の裏面側は、流動抵抗の高い狭い空間であるが、その高い流動抵抗に打ち勝って狭い空間を安定的に充填できるようになる。   As a result, resin injection is periodically performed from the inlet 13 to the back surface side of the control circuit board 3, so that the back surface resin flow of the control circuit board 3 is controlled at a constant pressure. As a result, the back surface side of the control circuit board 3 is a narrow space having a high flow resistance, but can overcome the high flow resistance and stably fill the narrow space.

そして、制御回路基板３の表面樹脂流れは、裏面樹脂流れよりも早いので、主回路基板２の表面は、制御回路基板３の表面を流れる樹脂によって充填されていき、その間に、制御回路基板３の裏面側でも樹脂を排出口１４ａ，１４ｂ，１４ｃから主回路基板２の表面側へ押し出しつつ充填されていくことになる。   Since the front surface resin flow of the control circuit board 3 is faster than the back surface resin flow, the surface of the main circuit board 2 is filled with the resin flowing on the surface of the control circuit board 3, and in the meantime, the control circuit board 3 The resin is filled while being pushed out from the discharge ports 14a, 14b, 14c to the front surface side of the main circuit board 2 also on the back surface side.

制御回路基板３の表面と主回路基板２の表面とが充填されると、その後は、制御回路基板３の表面に搭載されるフォトカプラ１８が絶縁樹脂４に埋まるまで樹脂注入を継続し、フォトカプラ１８が絶縁樹脂４に埋まったタイミングで、樹脂注入作業は終了となる。   After the surface of the control circuit board 3 and the surface of the main circuit board 2 are filled, resin injection is continued until the photocoupler 18 mounted on the surface of the control circuit board 3 is buried in the insulating resin 4. At the timing when the coupler 18 is buried in the insulating resin 4, the resin injection operation is completed.

このとき、制御回路基板３の裏面充填時間は、制御回路基板３の裏面樹脂流れは遅いので、制御回路基板３の表面と主回路基板３の表面との両体積分の充填時間となる。つまり制御回路基板３の裏面側では、充填時間を長く保つことができるので、ボイドの発生を無くして充填することができる。   At this time, the back surface filling time of the control circuit board 3 is the filling time for both volumes of the surface of the control circuit board 3 and the surface of the main circuit board 3 because the back surface resin flow of the control circuit board 3 is slow. That is, on the back surface side of the control circuit board 3, the filling time can be kept long, so that it is possible to fill without generating voids.

ここで、制御回路基板３の裏面充填時間を短縮して生産性を向上させるには、制御回路基板３の裏面側での樹脂流量を増加させるようにすればよい。この実施の形態１では、つぎのような裏面充填時間短縮措置を講じている。   Here, in order to shorten the back surface filling time of the control circuit board 3 and improve the productivity, the resin flow rate on the back surface side of the control circuit board 3 may be increased. In this Embodiment 1, the following back surface filling time shortening measures are taken.

（１）流入口１３は、制御回路基板３の周囲間隙面積の３０％を占有するようにし、樹脂充填距離を短くして樹脂充填の高速化を図り、樹脂流量を増加させている。なお、流入口１３に代えて、流入ノズルを単数または複数設けてもよい。（２）絶縁樹脂４に低粘度（例えば１００Ｐａ・ｓ以下）のものを用いて流路抵抗を小さくすることで、樹脂充填の高速化を図り、樹脂流量を増加させている。（３）図２に示すように流入穴１７を設け、制御回路基板３の表面を流れる樹脂が流入穴１７から裏面側に入り込める措置を講ずることで、樹脂流量を増加させている。   (1) The inflow port 13 occupies 30% of the peripheral gap area of the control circuit board 3, shortens the resin filling distance, speeds up the resin filling, and increases the resin flow rate. Note that one or more inflow nozzles may be provided in place of the inflow port 13. (2) By using the insulating resin 4 having a low viscosity (for example, 100 Pa · s or less) to reduce the flow path resistance, the resin filling speed is increased and the resin flow rate is increased. (3) The flow rate of the resin is increased by providing an inflow hole 17 as shown in FIG. 2 and taking measures to allow the resin flowing on the surface of the control circuit board 3 to enter the back side from the inflow hole 17.

なお、流入穴１７に関しては、図２では、円形状の穴を示してあるが、スリット状の穴でもよい。そして、制御回路基板３の表面上に実装された電子部品の下側にスリット状穴を設けるようにすれば、制御回路基板３の実装面積を損なうことなく流入穴１７を形成できる。これによって、制御回路基板３の小型化、低コスト化が図れるようになる。また、電子部品の下側にスリット状穴を設けることで、部品間の絶縁強度を大きくすることもできる。   In addition, regarding the inflow hole 17, although the circular hole is shown in FIG. 2, a slit-shaped hole may be sufficient. If a slit-like hole is provided below the electronic component mounted on the surface of the control circuit board 3, the inflow hole 17 can be formed without impairing the mounting area of the control circuit board 3. As a result, the control circuit board 3 can be reduced in size and cost. Further, by providing a slit-like hole on the lower side of the electronic component, the insulation strength between the components can be increased.

また、この実施の形態１では、制御回路基板３の裏面側でのボイドが発生するのを抑制するために、樹脂の注入方向を矢印２５の方向と定め、台座１１の配置を工夫することで制御回路基板３の裏面側から樹脂を押し出す排出口を１４ａ，１４ｂ，１４ｃの３箇所に設けてある。各排出口は、制御回路基板３の周囲間隙面積の約８％であり、空気抜きを行うとともに、制御回路基板３の表面を流れる樹脂が裏面側に入り込むのを低減している。   Further, in the first embodiment, in order to suppress the occurrence of voids on the back surface side of the control circuit board 3, the resin injection direction is determined as the direction of the arrow 25, and the arrangement of the base 11 is devised. Discharge ports for extruding the resin from the back side of the control circuit board 3 are provided at three locations 14a, 14b and 14c. Each discharge port is about 8% of the peripheral gap area of the control circuit board 3, and performs air venting and reduces the resin flowing on the surface of the control circuit board 3 from entering the back side.

このボイド発生の抑制に関しては、樹脂充填を真空条件下で行えば、初期の巻き込み気泡を排出することができ、ボイド発生の抑制の相乗効果が得られる。   Regarding the suppression of the void generation, if the resin filling is performed under a vacuum condition, the initial entrained bubbles can be discharged, and a synergistic effect of suppressing the void generation can be obtained.

以上のように、この実施の形態１によれば、樹脂ケースの底部に、制御回路基板を台座で浮かして固定配置し、その横に主回路基板を底部面とほぼ同一の位置に固定配置したので、制御回路基板の裏面の充填樹脂量を大幅に少なくすることができる。   As described above, according to the first embodiment, the control circuit board is floated and fixed on the bottom of the resin case on the pedestal, and the main circuit board is fixedly disposed on the side of the control circuit board at substantially the same position as the bottom surface. Therefore, the amount of filled resin on the back surface of the control circuit board can be greatly reduced.

したがって、装置の軽量化、絶縁樹脂費用の低コスト化が図れるとともに、樹脂ケースの振動時に樹脂が揺動しても、金属ワイヤの揺れを低減できるので、金属ワイヤ切れによるリークや金属ワイヤ間の絶縁不良を低減でき、対振動性の向上が図れる。   Therefore, the weight of the device can be reduced and the cost of the insulating resin can be reduced, and even if the resin oscillates when the resin case vibrates, the metal wire can be prevented from swaying. Insulation defects can be reduced and vibration resistance can be improved.

また、発熱部品を搭載する主回路基板から熱に弱い部品を搭載する制御回路基板への絶縁樹脂を媒介とした熱伝導ルートを無くすことができるので、制御回路基板上に配置される熱に弱い部品の熱的信頼性を向上させることができる。   In addition, the heat conduction route through the insulating resin from the main circuit board on which the heat generating component is mounted to the control circuit board on which the heat-sensitive component is mounted can be eliminated, so that the heat circuit is weak against the heat disposed on the control circuit board. The thermal reliability of the parts can be improved.

そして、絶縁樹脂の注入工程では、制御回路基板の裏面側を充填しつつ制御回路基板の表面と主回路基板の表面とを充填することができるので、ボイド発生の抑制と生産性の向上とを両立させることができる。   In the process of injecting the insulating resin, the surface of the control circuit board and the surface of the main circuit board can be filled while filling the back side of the control circuit board. Both can be achieved.

実施の形態２．
図４は、この発明の実施の形態２による電力変換装置の収納構造を示す平面図である。なお、図４では、図２（実施の形態１）に示した構成要素と同一ないしは同等である構成要素には同一の符号が付されている。ここでは、この実施の形態２に関わる部分を中心に説明する。 Embodiment 2. FIG.
FIG. 4 is a plan view showing a storage structure for a power conversion device according to Embodiment 2 of the present invention. In FIG. 4, the same or similar components as those shown in FIG. 2 (Embodiment 1) are denoted by the same reference numerals. Here, the description will be focused on the portion related to the second embodiment.

図４に示すように、この実施の形態２による電力変換装置の収納構造では、図２（実施の形態１）に示した構成において、制御回路基板３の主回路基板２と対面しない側端側に切り欠き部１５が設けられている。図４では、図２に示した流入口１３と流入穴１７は示してないが、それらも同様に設けてもよい。   As shown in FIG. 4, in the power converter housing structure according to the second embodiment, the side end side of the control circuit board 3 that does not face the main circuit board 2 in the configuration shown in FIG. 2 (first embodiment). A notch portion 15 is provided in the upper portion. In FIG. 4, the inlet 13 and the inlet hole 17 shown in FIG. 2 are not shown, but they may be provided in the same manner.

この実施の形態２によれば、切り欠き部１５は、絶縁樹脂４の制御回路基板３の裏面側への流入面積を拡大することができるので、樹脂だまり２６に注入した樹脂を矢印２５の方向から切り欠き部１５に定期的に流し込むことで、制御回路基板３の裏面側に実施の形態１よりも積極的に流入させることができる。これによって、制御回路基板３の裏面樹脂流れを一層高速化することができ、絶縁樹脂の充填工程の短縮化が図れ、生産性の向上が図れる。   According to the second embodiment, the notch 15 can enlarge the inflow area of the insulating resin 4 to the back surface side of the control circuit board 3, so that the resin injected into the resin reservoir 26 is in the direction of the arrow 25. By periodically flowing into the notch 15, it is possible to more actively flow into the back surface side of the control circuit board 3 than in the first embodiment. As a result, the flow rate of the resin on the back surface of the control circuit board 3 can be further increased, the filling process of the insulating resin can be shortened, and the productivity can be improved.

なお、図４では、制御回路基板３に、フォトカプラ１８の他に、トランス１９、コイル２０が配置される場合が示されている。用途によっては、このように、高さが４ｍｍ以上の部品が配置される可能性がある。これらの部品は、樹脂流を妨げる壁として作用し、制御回路基板３の表面側の樹脂流れを偏った流れにする。これは、制御回路基板３の表面にボイドを発生させる一因となるので、このような背の高い部品は、分散配置することが望ましい。   FIG. 4 shows a case where a transformer 19 and a coil 20 are disposed on the control circuit board 3 in addition to the photocoupler 18. Depending on the application, a part having a height of 4 mm or more may be arranged in this way. These parts act as walls that obstruct the resin flow, and make the resin flow on the surface side of the control circuit board 3 an uneven flow. This contributes to the generation of voids on the surface of the control circuit board 3, and it is desirable to disperse such tall components.

実施の形態３．
図５は、この発明の実施の形態３による電力変換装置の収納構造を示す断面図である。なお、図５では、図３（実施の形態１）に示した構成要素と同一ないしは同等である構成要素には同一の符号が付されている。ここでは、この実施の形態３に関わる部分を中心に説明する。 Embodiment 3 FIG.
FIG. 5 is a sectional view showing a storage structure for a power conversion device according to Embodiment 3 of the present invention. In FIG. 5, the same or similar components as those shown in FIG. 3 (Embodiment 1) are denoted by the same reference numerals. Here, the description will be focused on the portion related to the third embodiment.

図５に示すように、この実施の形態３による電力変換装置の収納構造では、図３（実施の形態１）に示した構成において、流入口１３の樹脂ケース１側段差部がテーパ部１６で構成されている。   As shown in FIG. 5, in the power converter housing structure according to the third embodiment, the stepped portion on the resin case 1 side of the inlet 13 is a tapered portion 16 in the configuration shown in FIG. 3 (first embodiment). It is configured.

テーパ部１６は、斜面角度が４５°以下の鈍角で形成されている。この構成によれば、流入口１３に注入された絶縁樹脂４を、テーパ部１６に沿って、効率よく、かつ、勢いよく制御回路基板３の裏面側に流れ込ませることができる。   The taper portion 16 is formed with an obtuse angle with a slope angle of 45 ° or less. According to this configuration, the insulating resin 4 injected into the inflow port 13 can be efficiently and vigorously flowed into the back surface side of the control circuit board 3 along the tapered portion 16.

この実施の形態３によれば、テーパ部１６は、流入口１３の流入口面積の拡大に寄与するとともに、制御回路基板３の裏面樹脂流れを高速化する作用を営むので、絶縁樹脂の充填工程の短縮化が図れ、生産性の向上が図れる。   According to the third embodiment, the tapered portion 16 contributes to the enlargement of the inlet area of the inlet 13 and also serves to increase the speed of the back surface resin flow of the control circuit board 3. Can be shortened and productivity can be improved.

なお、図５では、制御回路基板３上に、トランス１９も搭載されているが、これは、実施の形態２にて説明したように、制御回路基板３上に、フォトカプラ１８の他に背の高い部品が搭載される場合があることの一例を示したものである。   In FIG. 5, the transformer 19 is also mounted on the control circuit board 3, but this is not limited to the back of the photocoupler 18 on the control circuit board 3 as described in the second embodiment. This shows an example in which a high-priced component may be mounted.

以上のように、この発明にかかる電力変換装置の収納構造は、必要樹脂量を少なくして、装置の軽量化、耐振動性の向上、生産性の向上、低コスト化を実現する電力変換装置の収納構造として有用である。   As described above, the storage structure of the power conversion device according to the present invention reduces the required resin amount, and realizes power reduction of the device, improvement of vibration resistance, improvement of productivity, and cost reduction. It is useful as a storage structure.

電力変換装置の一般的な電気的構成を示す回路図である。It is a circuit diagram which shows the general electrical structure of a power converter device. この発明の実施の形態１による電力変換装置の収納構造を示す平面図である。It is a top view which shows the storage structure of the power converter device by Embodiment 1 of this invention. 図１に示す電力変換装置の収納構造の断面図である。It is sectional drawing of the storage structure of the power converter device shown in FIG. この発明の実施の形態２による電力変換装置の収納構造を示す平面図である。It is a top view which shows the accommodation structure of the power converter device by Embodiment 2 of this invention. この発明の実施の形態３による電力変換装置の収納構造を示す断面図である。It is sectional drawing which shows the storage structure of the power converter device by Embodiment 3 of this invention.

符号の説明Explanation of symbols

１ 樹脂ケース
２ 主回路基板
３ 制御回路基板
４ 絶縁樹脂
５ 主回路端子台
５ａ 入力端子
５ｂ 出力端子
６ 主端子
７ 制御端子
８ 金属ワイヤ
９ コンバータ部のパワー素子
１０ インバータ部のパワー素子
１１ 台座
１２ マイクロコンピュータ
１３ 流入口
１４ａ，１４ｂ，１４ｃ 排出口
１５ 制御回路基板の切り欠き部
１６ 樹脂ケースのテーパ部
１７ 流入穴
１８ フォトカプラ
１９ トランス
２０ コイル
２１ 金属パターン
２２ 主回路
２２ａ コンバータ部
２２ｂ 平滑コンデンサ
２２ｃ インバータ部
２３ 制御回路
２４ 電源回路
２５ 制御回路基板の裏面側への樹脂流入方向
２６ 樹脂ケースに設けた樹脂だまり
２７ 三相交流電源
２８ 三相モータ（Ｍ） DESCRIPTION OF SYMBOLS 1 Resin case 2 Main circuit board 3 Control circuit board 4 Insulation resin 5 Main circuit terminal block 5a Input terminal 5b Output terminal 6 Main terminal 7 Control terminal 8 Metal wire 9 Power element of converter part 10 Power element of inverter part 11 Base 12 Micro Computer 13 Inlet 14a, 14b, 14c Outlet 15 Notch of control circuit board 16 Tapered part of resin case 17 Inflow hole 18 Photocoupler 19 Transformer 20 Coil 21 Metal pattern 22 Main circuit 22a Converter part 22b Smoothing capacitor 22c Inverter part 23 Control circuit 24 Power supply circuit 25 Resin inflow direction to the back side of the control circuit board 26 Resin pool provided in the resin case 27 Three-phase AC power supply 28 Three-phase motor (M)

Claims (5)

ケースの底部に、電力変換装置の主回路を搭載する主回路基板及び制御回路を搭載する制御回路基板を横並びに固定配置する電力変換装置の収納構造であって、前記制御回路基板は、裏面が前記ケースの底部に突設した台座に接着固定され、前記主回路基板は、表面を前記ケースの底部面と略同一の位置に位置させて固定され、前記ケースに充填した絶縁材によって、前記制御回路基板の表裏面と前記主回路基板の表面とがそれぞれ絶縁材による封止がなされており、前記制御回路基板の前記主回路基板と対面しない側端側と前記ケースとの間に、注入された絶縁材を当該制御回路基板の裏面側に流入させるための流入口が設けられている、ことを特徴とする電力変換装置の収納構造。 A housing structure of a power converter device in which a main circuit board on which a main circuit of a power converter device is mounted and a control circuit board on which a control circuit is mounted are arranged side by side at a bottom portion of the case, and the control circuit board has a back surface The main circuit board is fixed with its surface positioned substantially at the same position as the bottom surface of the case, and is controlled by an insulating material filled in the case. The front and back surfaces of the circuit board and the front surface of the main circuit board are each sealed with an insulating material , and injected between the side end of the control circuit board that does not face the main circuit board and the case. A storage structure for a power converter, wherein an inflow port is provided for allowing the insulating material to flow into the back side of the control circuit board . 前記制御回路基板の前記主回路基板と対面しない側端側に、注入された絶縁材を当該制御回路基板の裏面側に流入させるための切り欠き部が設けられている、ことを特徴とする請求項１に記載の電力変換装置の収納構造。 A notch for allowing the injected insulating material to flow into the back side of the control circuit board is provided on a side end side of the control circuit board that does not face the main circuit board. The storage structure for a power conversion device according to Item 1 . 前記制御回路基板には、表面を流れる絶縁材を裏面側へ流入させるための流入穴が設けられている、ことを特徴とする請求項１または２に記載の電力変換装置の収納構造。 Holder for a power converter according the to the control circuit board, the inflow hole for flowing the insulating material through the surface to the rear surface side is provided, in claim 1 or 2, characterized in that. 前記制御回路基板の前記主回路基板と対面しない側端側における前記ケースに、注入する絶縁材を前記制御回路基板の前記側端側に定期的に流入させるために、注入する絶縁材を滞留させる絶縁材だまりが設けられている、ことを特徴とする請求項１〜３のいずれか一つに記載の電力変換装置の収納構造。 Insulating material to be injected is retained in order to periodically flow the insulating material to be injected into the side end side of the control circuit board into the case on the side end side of the control circuit board that does not face the main circuit board. The storage structure for a power converter according to any one of claims 1 to 3, wherein a pool of insulating material is provided. 前記制御回路基板の前記主回路基板と対面しない側端側における前記ケースの底部に、注入された絶縁材を前記制御回路基板の裏面側に流入させるためのテーパ部が設けられている、ことを特徴とする請求項１〜４のいずれか一つに記載の電力変換装置の収納構造。 A taper portion is provided at the bottom of the case on the side end side that does not face the main circuit board of the control circuit board so as to allow the injected insulating material to flow into the back side of the control circuit board. The storage structure for a power conversion device according to any one of claims 1 to 4 , characterized in that:
JP2008138541A 2008-05-27 2008-05-27 Power conversion device storage structure Expired - Fee Related JP5279345B2 (en)

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