JP5277163B2 - 複数の部分を有する窓をもつ研磨パッド - Google Patents

複数の部分を有する窓をもつ研磨パッド Download PDF

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Publication number
JP5277163B2
JP5277163B2 JP2009518606A JP2009518606A JP5277163B2 JP 5277163 B2 JP5277163 B2 JP 5277163B2 JP 2009518606 A JP2009518606 A JP 2009518606A JP 2009518606 A JP2009518606 A JP 2009518606A JP 5277163 B2 JP5277163 B2 JP 5277163B2
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Japan
Prior art keywords
polishing
layer
polishing pad
light transmissive
outer portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2009518606A
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English (en)
Japanese (ja)
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JP2009542451A5 (enExample
JP2009542451A (ja
Inventor
ドミニック ベンヴェグヌ，
ボグスロウ スウェデック，
ジミン チャン，
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Publication of JP2009542451A publication Critical patent/JP2009542451A/ja
Publication of JP2009542451A5 publication Critical patent/JP2009542451A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2009518606A 2006-07-03 2007-07-02 複数の部分を有する窓をもつ研磨パッド Active JP5277163B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US81842306P 2006-07-03 2006-07-03
US60/818,423 2006-07-03
PCT/US2007/072690 WO2008005951A2 (en) 2006-07-03 2007-07-02 Polishing pad with window having multiple portions

Publications (3)

Publication Number Publication Date
JP2009542451A JP2009542451A (ja) 2009-12-03
JP2009542451A5 JP2009542451A5 (enExample) 2010-08-12
JP5277163B2 true JP5277163B2 (ja) 2013-08-28

Family

ID=38895428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009518606A Active JP5277163B2 (ja) 2006-07-03 2007-07-02 複数の部分を有する窓をもつ研磨パッド

Country Status (4)

Country Link
US (2) US7942724B2 (enExample)
JP (1) JP5277163B2 (enExample)
TW (1) TWI370039B (enExample)
WO (1) WO2008005951A2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
TWI521625B (zh) * 2010-07-30 2016-02-11 應用材料股份有限公司 使用光譜監測來偵測層級清除
US20130237136A1 (en) * 2010-11-18 2013-09-12 Cabot Microelectronics Corporation Polishing pad comprising transmissive region
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
JP2014113644A (ja) * 2012-12-06 2014-06-26 Toyo Tire & Rubber Co Ltd 研磨パッド
US8961266B2 (en) 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
US9475168B2 (en) * 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
EP3420579B1 (en) * 2016-02-26 2022-10-19 Applied Materials, Inc. Window in thin polishing pad
KR20190039171A (ko) * 2016-08-31 2019-04-10 어플라이드 머티어리얼스, 인코포레이티드 환형 플래튼 또는 연마 패드를 갖는 연마 시스템
JP7022647B2 (ja) 2018-05-08 2022-02-18 株式会社荏原製作所 光透過性部材、研磨パッドおよび基板研磨装置
US11633830B2 (en) * 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window
US12275116B2 (en) 2020-12-29 2025-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with window having transparency at low wavelengths and material useful in such window

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
JP3367496B2 (ja) * 2000-01-20 2003-01-14 株式会社ニコン 研磨体、平坦化装置、半導体デバイス製造方法、および半導体デバイス
WO2000060650A1 (en) * 1999-03-31 2000-10-12 Nikon Corporation Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
US6685537B1 (en) 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
US6641470B1 (en) 2001-03-30 2003-11-04 Lam Research Corporation Apparatus for accurate endpoint detection in supported polishing pads
KR100858392B1 (ko) 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
AU2003207834A1 (en) * 2002-02-04 2003-09-02 Kla-Tencor Technologies Corp. Systems and methods for characterizing a polishing process
JP2003285259A (ja) * 2002-03-28 2003-10-07 Toray Ind Inc 研磨パッド、研磨装置及び半導体デバイスの製造方法
US20040224611A1 (en) 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
US6997777B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US7264536B2 (en) 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
WO2005104199A1 (ja) * 2004-04-23 2005-11-03 Jsr Corporation 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法

Also Published As

Publication number Publication date
US20080003923A1 (en) 2008-01-03
TWI370039B (en) 2012-08-11
US8475228B2 (en) 2013-07-02
WO2008005951A2 (en) 2008-01-10
US7942724B2 (en) 2011-05-17
JP2009542451A (ja) 2009-12-03
TW200824841A (en) 2008-06-16
US20110212673A1 (en) 2011-09-01
WO2008005951A3 (en) 2009-04-09

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