JP5268688B2 - Power converter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce noise in power converter by simplifying the electrical connection structure thereof. <P>SOLUTION: In a power converter, the inner space of a metal housing 12 is divided into two spaces by a metal base plate 11. A control circuit 172 is mounted in one of the divided spaces, while a driver circuit 174 and a power module 300 are mounted in the other space. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a power converter.

  2. Description of the Related Art Conventionally, there is known a power conversion device in which a main circuit storage chamber including a switching element and a control circuit storage chamber that generates a control signal for driving the switching element are divided into two by a shielding member in a housing ( Patent Document 1). In this power conversion device, noise generated from the switching element is prevented from entering the control circuit by the shielding member.

JP 2005-235929 A

  When converting high-voltage DC power to AC power in the power conversion device disclosed in Patent Document 1, a high-voltage circuit is required to generate a control signal. This high voltage circuit becomes a source of noise and may adversely affect the operation of the power converter.

One aspect of a power conversion device according to the present invention includes a metal casing, a metal base plate for dividing an internal space of the casing into a first space and a second space, and a microcomputer. A control circuit that outputs a control signal based on the result of an operation performed by the microcomputer, a driver circuit that outputs a drive signal based on the control signal output from the control circuit, and a drive signal output from the driver circuit A power module having a switching element for performing a switching operation, a first connection part penetrating the base plate and provided on the first space side, and a second space side electrically connected to the first connection part and a through connector and a second connecting portion provided on, is a control circuit in the first space is mounted, the driver circuit and the power module is mounted on the second space Cage, the driver circuit is mounted between the control circuit and the power module, the distance between the control circuit and the driver circuit is determined according to the carrier frequency of the drive signal, the control circuit and the driver circuit, The control circuit and the first connection part are connected, and the driver circuit and the second connection part are electrically connected by being connected .
Another aspect of the power conversion device according to the present invention includes a metal housing, a metal base plate for dividing the internal space of the housing into a first space and a second space, and a microcomputer. A control circuit that outputs a control signal based on the result of an operation performed by the microcomputer, a driver circuit that outputs a drive signal based on the control signal output from the control circuit, and a drive signal output from the driver circuit And a power module having a switching element that performs a switching operation based on the control circuit. The control circuit is mounted in the first space, and the driver circuit and the power module are mounted in the second space. It is mounted between the circuit and the power module, and the distance between the control circuit and the driver circuit is determined according to the carrier frequency of the drive signal. , The control circuit and the driver circuit are electrically connected by the second connector and is engaged with the first connector and the driver circuit included in the control circuit.
Another aspect of the power conversion device according to the present invention includes a metal housing, a metal base plate for dividing the internal space of the housing into a first space and a second space, and a microcomputer. A control circuit that outputs a control signal based on the result of an operation performed by the microcomputer, a driver circuit that outputs a drive signal based on the control signal output from the control circuit, and a drive signal output from the driver circuit And a power module having a switching element that performs a switching operation based on the control circuit. The control circuit is mounted in the first space, and the driver circuit and the power module are mounted in the second space. It is mounted between the circuit and the power module, and the distance between the control circuit and the driver circuit is determined according to the carrier frequency of the drive signal. , The base plate, openings of a size corresponding to the carrier frequency of the drive signal is is provided, the control circuit and the driver circuit are electrically connected via a signal line passing through the opening.

  According to the present invention, noise can be reduced in a power conversion device.

It is a figure which shows the control block of a hybrid vehicle. It is a figure for demonstrating the electric circuit structure of an inverter apparatus, an inverter apparatus, or an inverter apparatus. It is an appearance perspective view of the whole composition of the power converter concerning the embodiment of the present invention. It is the perspective view which decomposed | disassembled the whole structure of the power converter device which concerns on embodiment of this invention into each component. It is the figure which attached the cooling water inlet piping and the outlet piping to the aluminum casting of the housing | casing which has a cooling water flow path, (a) is a perspective view of a housing | casing, (b) is a top view of a housing | casing, (c) is It is a bottom view of a housing | casing. It is detail drawing of the bottom view of a housing | casing. It is sectional drawing (AA sectional reference of FIG. 6) of a power converter device. It is sectional drawing (BB sectional reference of FIG. 6) of a power converter device. (a) is the upper perspective view of the power module regarding this embodiment, (b) is a top view of a power module. FIG. 2 is an exploded perspective view of a DC terminal of a power module 300 according to the present embodiment, and (a) is a diagram in which one of a metal base and three upper and lower arm series circuits as components of the power module is extracted, b) is an exploded perspective view of a metal base, a circuit wiring pattern, and an insulating substrate. (a) is sectional drawing which made the power module case transparent partially in order to make the structure of a DC bus bar easy to understand, and (b) is an enlarged view showing the main part. (a) is a figure for demonstrating an upper-lower arm series circuit, (b) is a figure for demonstrating the electric current path of a power module. It is a perspective view which shows the external appearance structure of a capacitor | condenser module. It is a perspective view which shows the state of the capacitor | condenser module before filling with fillers 522, such as resin. It is a figure for demonstrating the structure of a capacitor cell. (a) is the perspective view which extracted only the capacitor module, the DC side conductor plate, and the two power modules 300 in the power converter device 200 which concerns on this embodiment, (b) is the decomposition | disassembly of a DC side conductor plate. It is a perspective view. The enlarged view of the connection location of the power module shown in FIG. 16 and a DC side conductor board is shown. It is a figure for demonstrating the noise countermeasure in the power converter device 200 which concerns on this embodiment. It is a block diagram which shows schematic structure of the power converter device 200 which concerns on this embodiment. 2 is a plan view of a metal base plate 11. FIG. 3 is a side view of a metal base plate 11. FIG. 4 is a graph showing the relationship between the frequency of an electromagnetic field and the shielding effect of the electromagnetic field by the metal base plate 11. It is a figure which shows an analysis model when the opening part 222 is comparatively large. It is a figure which shows an analysis model when the opening part 222 is comparatively small. It is a figure which shows the analysis result of electric field strength distribution. It is a figure which shows the modification of the opening part 222. FIG. It is a diagram showing a method of directly connecting a control circuit 172 and a driver circuit 174 without going through a signal line 176.

  A power converter according to an embodiment of the present invention will be described below in detail with reference to the drawings. The power conversion device according to the embodiment of the present invention can be applied to a hybrid vehicle or a pure electric vehicle. As a representative example, the power conversion device according to the embodiment of the present invention is applied to a hybrid vehicle. The control configuration and the circuit configuration of the power converter will be described with reference to FIGS. 1 and 2. FIG. 1 is a diagram showing a control block of a hybrid vehicle.

  The power conversion device according to the embodiment of the present invention is used in a vehicle-mounted power conversion device for a vehicle-mounted electrical system mounted on an automobile, in particular, a vehicle drive electrical system, and has a very severe mounting environment and operational environment. The inverter device will be described as an example. A vehicle drive inverter device is provided in a vehicle drive electrical system as a control device that controls the drive of a vehicle drive motor, and a DC power supplied from an onboard battery or an onboard power generator that constitutes an onboard power source is a predetermined AC power. Then, the AC power obtained is supplied to the vehicle drive motor to control the drive of the vehicle drive motor. Further, since the vehicle drive motor also has a function as a generator, the vehicle drive inverter device also has a function of converting the AC power generated by the vehicle drive motor into DC power according to the operation mode. Yes. The converted DC power is supplied to the on-vehicle battery.

  The configuration of the present embodiment is optimal as a power conversion device for driving a vehicle such as an automobile or a truck, but other power conversion devices such as a power conversion device such as a train, a ship, and an aircraft, as well as factory equipment, Applicable to industrial power converters used as drive motor control devices, or home power conversion devices used in home solar power generation systems and motor control devices that drive household appliances It is.

  In FIG. 1, a hybrid electric vehicle (hereinafter referred to as “HEV”) 110 is one electric vehicle and includes two vehicle drive systems. One of them is an engine system that uses an engine 120 that is an internal combustion engine as a power source. The engine system is mainly used as a drive source for HEV. The other is an in-vehicle electric system using motor generators 192 and 194 as a power source. The in-vehicle electric system is mainly used as an HEV drive source and an HEV power generation source. The motor generators 192 and 194 are, for example, synchronous machines or induction machines, and operate as both a motor and a generator depending on the operation method.

  A front wheel axle 114 is rotatably supported at the front portion of the vehicle body. A pair of front wheels 112 are provided at both ends of the front wheel axle 114. A rear wheel axle (not shown) is rotatably supported on the rear portion of the vehicle body. A pair of rear wheels are provided at both ends of the rear wheel axle. The HEV of this embodiment employs a so-called front wheel drive system in which the main wheel driven by power is the front wheel 112 and the driven wheel to be driven is the rear wheel. You may adopt.

  A front wheel side differential gear (hereinafter referred to as “front wheel side DEF”) 116 is provided at the center of the front wheel axle 114. The front wheel axle 114 is mechanically connected to the output side of the front wheel side DEF 116. The output shaft of the transmission 118 is mechanically connected to the input side of the front wheel side DEF 116. The front wheel side DEF 116 is a differential power distribution mechanism that distributes the rotational driving force that is shifted and transmitted by the transmission 118 to the left and right front wheel axles 114. The output side of the motor generator 192 is mechanically connected to the input side of the transmission 118. The output side of the engine 120 and the output side of the motor generator 194 are mechanically connected to the input side of the motor generator 192 via the power distribution mechanism 122. Motor generators 192 and 194 and power distribution mechanism 122 are housed inside the casing of transmission 118.

  The motor generators 192 and 194 are synchronous machines having a permanent magnet on the rotor, and the AC power supplied to the armature windings of the stator is controlled by the inverter devices 140 and 142, thereby the motor generators 192 and 194. Is controlled. A battery 136 is electrically connected to the inverter devices 140 and 142, and power can be exchanged between the battery 136 and the inverter devices 140 and 142.

  In the present embodiment, two motor generator units, a first motor generator unit composed of a motor generator 192 and an inverter device 140, and a second motor generator unit composed of a motor generator 194 and an inverter device 142 are provided. ing. That is, in the case where the vehicle is driven by the power from the engine 120, when assisting the driving torque of the vehicle, the second motor generator unit is operated as the power generation unit by the power of the engine 120 to generate power. The first electric power generation unit is operated as an electric unit by the obtained electric power. Further, in the same case, when assisting the vehicle speed of the vehicle, the first motor generator unit is operated by the power of the engine 120 as a power generation unit to generate power, and the second motor generator unit is generated by the electric power obtained by the power generation. Operate as an electric unit.

  In the present embodiment, the vehicle can be driven only by the power of the motor generator 192 by operating the first motor generator unit as an electric unit by the electric power of the battery 136. Further, in the present embodiment, the battery 136 can be charged by generating power by operating the first motor generator unit or the second motor generator unit as a power generation unit by the power of the engine 120 or the power from the wheels.

  The battery 136 is also used as a power source for driving an auxiliary motor 195. The auxiliary machine is, for example, a motor that drives a compressor of an air conditioner or a motor that drives a hydraulic pump for control. DC power is supplied from the battery 136 to the inverter device 43 and converted into AC power by the inverter device 43. To the motor 195. The inverter device 43 has the same function as the inverter devices 140 and 142 and controls the phase, frequency, and power of alternating current supplied to the motor 195. For example, the motor 195 generates torque by supplying AC power having a leading phase with respect to the rotation of the rotor of the motor 195. On the other hand, by generating the delayed phase AC power, the motor 195 acts as a generator, and the motor 195 is operated in a regenerative braking state. The control function of the inverter device 43 is the same as the control function of the inverter devices 140 and 142. Since the capacity of the motor 195 is smaller than the capacity of the motor generators 192 and 194, the maximum conversion power of the inverter device 43 is smaller than the inverter devices 140 and 142, but the circuit configuration of the inverter device 43 is basically the circuit of the inverter devices 140 and 142. Same as the configuration.

  The inverter device 140, the inverter device 142, the inverter device 43, and the capacitor module 500 are in an electrical close relationship. Furthermore, there is a common point that measures against heat generation are necessary. It is also desired to make the volume of the device as small as possible. From these points, the power conversion device described in detail below includes the inverter devices 140 and 142, the inverter device 43, and the capacitor module 500 in the casing of the power conversion device. With this configuration, a small and highly reliable device can be realized.

  Further, by incorporating the inverter device 140, the inverter device 142, the inverter device 43, and the capacitor module 500 in one housing, it is effective in simplifying wiring and taking measures against noise. Further, the inductance of the connection circuit between the capacitor module 500 and the inverter device 140, the inverter device 142, and the inverter device 43 can be reduced, the spike voltage can be reduced, and heat generation can be reduced and heat radiation efficiency can be improved.

  Next, the electric circuit configuration of the inverter device 140, the inverter device 142, or the inverter device 43 will be described with reference to FIG. In the embodiment illustrated in FIGS. 1 to 2, the case where the inverter device 140, the inverter device 142, or the inverter device 43 is individually configured will be described as an example. Since the inverter device 140, the inverter device 142, or the inverter device 43 performs the same function and has the same function, the inverter device 140 will be described here as a representative example.

  The power conversion device 200 according to the present embodiment converts DC power supplied from the battery 136 into AC power, supplies the AC power to the motor generator 192, and converts AC power generated by the motor generator 192 into DC power. The battery 136 is supplied, and the battery 136 is charged. The power conversion device 200 includes an inverter device 140 and a capacitor module 500. The inverter device 140 includes an inverter circuit 144 that is a semiconductor circuit and a control unit 170. Further, the inverter circuit 144 includes a plurality of upper and lower arm series circuits 150 including an IGBT 328 (insulated gate bipolar transistor) and a diode 156 that operate as an upper arm, and an IGBT 330 and a diode 166 that operate as a lower arm (FIG. 2). In this example, three upper and lower arm series circuits 150) are connected to an AC power line (AC bus bar) 186 from the middle point (intermediate electrode 169) of each upper and lower arm series circuit 150 through an AC terminal 159 to the motor generator 192. is there. In addition, the control unit 170 includes a driver circuit 174 that drives and controls the inverter circuit 144 and a control circuit 172 that supplies a control signal to the driver circuit 174 via the signal line 176.

  The IGBTs 328 and 330 of the upper arm and the lower arm are switching power semiconductor elements, operate in response to the drive signal output from the control unit 170, and convert DC power supplied from the battery 136 into three-phase AC power. . The converted electric power is supplied to the armature winding of the motor generator 192.

  The inverter circuit 144 is configured by a three-phase bridge circuit, and a DC positive terminal 314 to which upper and lower arm series circuits 150, 150, 150 for three phases are electrically connected to the positive side and the negative side of the battery 136, respectively. And DC negative electrode terminal 316 are electrically connected in parallel.

  In the present embodiment, the use of IGBTs 328 and 330 as switching power semiconductor elements is exemplified. The IGBTs 328 and 330 include collector electrodes 153 and 163, emitter electrodes (signal emitter electrode terminals 155 and 165), and gate electrodes (gate electrode terminals 154 and 164). Diodes 156 and 166 are electrically connected between the collector electrodes 153 and 163 of the IGBTs 328 and 330 and the emitter electrode as shown. The diodes 156 and 166 have two electrodes, a cathode electrode and an anode electrode. The cathode electrode serves as the collector electrode of the IGBTs 328 and 330 so that the direction from the emitter electrode to the collector electrode of the IGBTs 328 and 330 is the forward direction. The anode electrodes are electrically connected to the emitter electrodes of the IGBTs 328 and 330, respectively. A MOSFET (metal oxide semiconductor field effect transistor) may be used as the switching power semiconductor element. In this case, the diode 156 and the diode 166 are not necessary.

  Upper and lower arm series circuit 150 is provided for three phases corresponding to each phase winding of the armature winding of motor generator 192. The three upper and lower arm series circuits 150 correspond to the U-phase, V-phase, and W-phase, respectively, and are connected to the motor generator 192 via the intermediate electrode 169 that connects the emitter electrode of the IGBT 328 and the collector electrode 163 of the IGBT 330 and the AC terminal 159. U phase, V phase, and W phase are formed. The upper and lower arm series circuits are electrically connected in parallel. The collector electrode 153 of the upper arm IGBT 328 is connected to the positive capacitor electrode of the capacitor module 500 via the positive terminal (P terminal) 157, and the emitter electrode of the lower arm IGBT 330 is connected to the capacitor module 500 via the negative terminal (N terminal) 158. Are respectively electrically connected (connected by a DC bus bar). An intermediate electrode 169 corresponding to the middle point portion of each arm (the connection portion between the emitter electrode of the IGBT 328 of the upper arm and the collector electrode of the IGBT 330 of the lower arm) is connected to the corresponding phase winding of the armature winding of the motor generator 192 by alternating current. The terminals 159 and the AC connector 188 are electrically connected.

  Capacitor module 500 is for configuring a smoothing circuit that suppresses fluctuations in DC voltage caused by the switching operation of IGBTs 328 and 330. That is, the capacitor module 500 is mounted on the power conversion device 200 in order to smooth the DC power from the battery 136 and supply it to the IGBTs 328 and 330. The positive electrode side of the battery 136 is electrically connected to the positive electrode side capacitor electrode of the capacitor module 500, and the negative electrode side of the battery 136 is electrically connected to the negative electrode side capacitor electrode of the capacitor module 500 via the DC connector 138. Thus, the capacitor module 500 is connected between the collector electrode 153 of the upper arm IGBT 328 and the positive electrode side of the battery 136, and between the emitter electrode of the lower arm IGBT 330 and the negative electrode side of the battery 136. Electrically connected in parallel to the series circuit 150.

  The control unit 170 is for operating the IGBTs 328 and 330, and generates a timing signal for controlling the switching timing of the IGBTs 328 and 330 based on input information from other control devices or sensors. And a drive circuit 174 that generates a drive signal for switching the IGBTs 328 and 330 based on the timing signal output from the control circuit 172.

  The control circuit 172 includes a microcomputer (hereinafter referred to as “microcomputer”) for calculating the switching timing of the IGBTs 328 and 330. The microcomputer receives as input information a target torque value required for the motor generator 192, a current value supplied to the armature winding of the motor generator 192 from the upper and lower arm series circuit 150, and a magnetic pole of the rotor of the motor generator 192. The position has been entered. The target torque value is based on a command signal output from a host controller (not shown). The current value is detected based on the detection signal output from the current sensor 180. The magnetic pole position is detected based on a detection signal output from a rotating magnetic pole sensor (not shown) provided in the motor generator 192. In the present embodiment, the case where the current values of three phases are detected will be described as an example, but the current values for two phases may be detected.

  The microcomputer in the control circuit 172 calculates the d and q axis current command values of the motor generator 192 based on the target torque value, and the calculated d and q axis current command values and the detected d and q The voltage command values for the d and q axes are calculated based on the difference from the current value of the shaft, and the calculated voltage command values for the d and q axes are calculated based on the detected magnetic pole position. Convert to W phase voltage command value. Then, the microcomputer generates a pulse-like modulated wave based on a comparison between the fundamental wave (sine wave) and the carrier wave (triangular wave) based on the voltage command values of the U phase, V phase, and W phase, and the generated modulation wave The wave is output to the driver circuit 174 as a PWM (pulse width modulation) signal. That is, the control circuit 172 outputs a PWM signal, which is a control signal for controlling the operation of the driver circuit 174, to the driver circuit 174 based on the result of the calculation performed by the microcomputer.

  When driving the lower arm, the driver circuit 174 amplifies the PWM signal, and when the driver circuit 174 drives the upper arm to the gate electrode of the corresponding IGBT 330 of the lower arm, the driver circuit 174 sets the level of the reference potential of the PWM signal. After shifting to the level of the reference potential of the upper arm, the PWM signal is amplified and output as a drive signal to the gate electrode of the corresponding IGBT 328 of the upper arm. As a result, each IGBT 328, 330 performs a switching operation based on the input drive signal. As a result, in inverter circuit 144, DC power from battery 136 is converted to AC power, or AC power from motor generator 192 is converted to DC power. That is, the driver circuit 174 outputs a drive signal that is a drive signal for driving the IGBTs 328 and 330 that are switching elements based on the control signal output as a PWM signal from the control circuit 172. Based on this drive signal, the IGBTs 328 and 330 perform a switching operation for converting DC power into AC power or converting AC power into DC power.

  In addition, the control unit 170 performs abnormality detection (overcurrent, overvoltage, overtemperature, etc.) to protect the upper and lower arm series circuit 150. For this reason, sensing information is input to the control unit 170. For example, information on the current flowing through the emitter electrodes of the IGBTs 328 and 330 is input to the corresponding drive units (ICs) from the signal emitter electrode terminals 155 and 165 of each arm. Thereby, each drive part (IC) detects overcurrent, and when overcurrent is detected, the switching operation of corresponding IGBT328,330 is stopped, and corresponding IGBT328,330 is protected from overcurrent. Information on the temperature of the upper and lower arm series circuit 150 is input to the microcomputer from a temperature sensor (not shown) provided in the upper and lower arm series circuit 150. In addition, voltage information on the DC positive side of the upper and lower arm series circuit 150 is input to the microcomputer. The microcomputer performs over-temperature detection and over-voltage detection based on such information, and when an over-temperature or over-voltage is detected, stops the switching operation of all the IGBTs 328 and 330, and the upper and lower arm series circuit 150 (subtract) The semiconductor module including the circuit 150 is protected from overtemperature or overvoltage.

  The conduction and cut-off operations of the IGBTs 328 and 330 of the upper and lower arms of the inverter circuit 144 are switched in a certain order, and the current generated in the stator winding of the motor generator 192 at this switching flows through a circuit including the diodes 156 and 166.

  As shown in the figure, the upper and lower arm series circuit 150 includes a positive terminal (P terminal, positive terminal) 157, a negative terminal (N terminal, negative terminal) 158, an AC terminal 159 connected to the intermediate electrode 169 of the upper and lower arms, An arm signal terminal (signal emitter electrode terminal) 155, an upper arm gate electrode terminal 154, a lower arm signal terminal (signal emitter electrode terminal) 165, and a lower arm gate terminal electrode 164 are provided. The power conversion device 200 has a DC connector 138 on the input side and an AC connector 188 on the output side, and is connected to the battery 136 and the motor generator 192 through the connectors 138 and 188, respectively. Further, as a circuit for generating an output of each phase of the three-phase alternating current to be output to the motor generator, a power conversion device having a circuit configuration in which two upper and lower arm series circuits are connected in parallel to each phase may be used.

  3-7, 200 is a power converter, 10 is an upper case, 11 is a metal base plate, 12 is a metal casing, 13 is a cooling water inlet pipe, 14 is a cooling water outlet pipe, and 420 is a lower cover. , 16 is a lower case, 17 is an AC terminal case, 18 is an AC terminal, 19A is a cooling jacket, 19 is a cooling water passage in the cooling jacket 19A, and 20 is a control circuit board that holds the control circuit 172. Reference numeral 21 denotes a connector for connection to the outside, and reference numeral 22 denotes a drive circuit board that holds a driver circuit 174. Two power modules (semiconductor module units) 300 are provided, and an inverter circuit 144 is built in each power module. 700 is a laminated conductor plate, 800 is an O-ring, 304 is a metal base, 188 is an AC connector, 314 is a DC positive terminal, 316 is a DC negative terminal, 500 is a capacitor module, 502 is a capacitor case, 504 is a positive capacitor terminal, Reference numeral 506 denotes a negative side capacitor terminal, and 514 denotes a capacitor cell.

  FIG. 3 is an external perspective view of the overall configuration of the power conversion device according to the embodiment of the present invention. The power conversion device 200 according to this embodiment includes a casing 12 having a substantially rectangular top or bottom surface, and a cooling water inlet pipe 13 and a cooling water outlet pipe 14 provided on one of the outer circumferences on the short side of the casing 12. And an upper case 10 for closing the upper opening of the housing 12 and a lower case 16 for closing the lower opening of the housing 12. Since the shape of the bottom surface or the top surface of the housing 12 is substantially rectangular, it is easy to attach to the vehicle and is easy to produce.

  Two sets of AC terminal cases 17 used for connection to the motor generators 192 and 194 are provided on the outer periphery of the long side of the power conversion device 200. AC terminal 18 is used to electrically connect power module 300 and motor generators 192 and 194. The AC current output from the power module 300 is output and transmitted to the motor generators 192 and 194 outside the power conversion device 200 via the AC terminal 18 connected to the power module 300. The AC terminal 18 is disposed on the side surface of the housing 12 that faces the side surface of the housing 12 that is closest to the positive-side capacitor terminal 504 and the negative-side capacitor terminal 506. With such an arrangement, it is possible to prevent the AC power output from the power module 300 and the DC power input from the battery 136 via the capacitor module 500 from affecting each other.

  The connector 21 is connected to a control circuit board 20 (control circuit 172) built in the housing 12. Various signals from the outside are transmitted to the control circuit 172 mounted on the control circuit board 20 via the connector 21. The direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512 are direct current input terminals for inputting direct current power from the battery 136 to the capacitor module 500. 500 is electrically connected. Here, in the present embodiment, the connector 21 is provided on one side of the outer peripheral surface on the short side of the housing 12. On the other hand, the direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512 are provided on the outer peripheral surface on the short side opposite to the surface on which the connector 21 is provided. That is, the connector 21, the direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512 are arranged separately on the side surfaces of the casing 12 facing each other. As a result, noise that enters the housing 12 from the direct current (battery) negative electrode side connection terminal portion 510 and further propagates to the connector 21 can be reduced, and the controllability of the motor by the control circuit board 20 can be improved. .

  FIG. 4 is a perspective view in which the entire configuration of the power conversion device according to the embodiment of the present invention is disassembled into components.

  As shown in FIG. 4, a cooling jacket 19 </ b> A in which a cooling water channel 19 is formed is provided in the middle of the housing 12. The cooling jacket 19 </ b> A (cooling water flow path 19) is installed between the power module 300 and the capacitor module 500. Two sets of openings 400 and 402 are formed on the upper surface of the cooling jacket 19A side by side in the flow direction. Two power modules 300 are fixed to the upper surface of the cooling jacket 19A so as to close the two sets of openings 400 and 402. Each power module 300 is provided with fins 305 for heat dissipation (see FIG. 7), and the fins 305 (see FIG. 7) of each power module 300 are respectively connected to the cooling water flow path 19 from the openings 400 and 402 of the cooling jacket 19A. It protrudes inside. A structure for fixing the power module 300 to the housing 12 will be described later.

  An opening 404 for facilitating aluminum casting is formed on the lower surface of the cooling jacket 19A, and the opening 404 is closed by the lower cover 420. An auxiliary inverter 43 is attached to the lower surface of the cooling jacket 19A. The inverter device 43 for auxiliary machines has a built-in circuit similar to the inverter circuit 144 shown in FIG. 2, and has a power module with a built-in power semiconductor element constituting the inverter circuit 144. The auxiliary inverter device 43 is fixed to the lower surface of the cooling jacket 19 </ b> A so that the heat radiating metal surface of the built-in power module faces the lower surface of the cooling water passage 19. Further, an O-ring 800 for sealing is provided between the power module 300 and the housing 12, and an O-ring 802 is also provided between the lower cover 420 and the housing 12. In this embodiment, the sealing material is an O-ring, but a resin material, a liquid seal, a packing, or the like may be used instead of the O-ring. In particular, when the liquid seal is used, the power converter 200 can be easily assembled. Can be improved.

  Further, a lower case 16 is provided below the cooling jacket 19A, and a capacitor module 500 is provided in the lower case 16. Capacitor module 500 is fixed to the inner surface of the bottom plate of lower case 16 such that the heat dissipation surface of the metal case is in contact with the inner surface of the bottom plate of lower case 16. With this structure, the power module 300 and the inverter device 43 can be efficiently cooled using the upper surface and the lower surface of the cooling jacket 19A, which leads to a reduction in the size of the entire power conversion device. The capacitor module 500 is provided with a plurality of positive electrode side capacitor terminals 504 and negative electrode side capacitor terminals 506 alternately.

  When the cooling water from the cooling water inlet / outlet pipes 13 and 14 flows through the cooling water flow path 19, the radiation fins of the two power modules 300 provided are cooled, and the entire two power modules 300 are cooled. The The auxiliary inverter device 43 provided on the lower surface of the cooling jacket 19A is also cooled at the same time.

  Further, the casing 12 provided with the cooling water flow path 19 is cooled, so that the lower case 16 provided at the lower part of the casing 12 is cooled, and the heat of the capacitor module 500 causes the lower case 16 and the casing 12 to be cooled. The capacitor module 500 is cooled by being thermally conducted to the cooling water.

  A laminated conductor plate 700 for electrically connecting the power module 300 and the capacitor module 500 is disposed above the power module 300. That is, the capacitor module 500 is connected to the power module 300 via the positive-side capacitor terminal 504, the negative-side capacitor terminal 506 and the laminated conductor plate 700. The positive-side capacitor terminal 504, the negative-side capacitor terminal 506, and the laminated conductor plate 700 are the drive circuit board 22 (driver circuit 174), power, and power among the two spaces in the housing 12 divided by the metal base plate 11 described later. The module 300 and the capacitor module 500 are provided in a space in which the module 300 and the capacitor module 500 are mounted. The laminated conductor plate 700 is configured to be wide in the width direction of the two power modules 300 across the two power modules 300. Further, the laminated conductor plate 700 includes a positive electrode side conductor plate 702 connected to the positive electrode side terminal of the capacitor module 500, a negative electrode side conductor plate 704 connected to the negative electrode side terminal, and a space between the positive electrode side terminal and the negative electrode side terminal. It is comprised by the insulating member arrange | positioned. As a result, the laminated area of the laminated conductor plate 700 can be increased, so that the parasitic inductance from the power module 300 to the capacitor module 500 can be reduced. In addition, since one laminated conductor plate 700 is placed on the two power modules 300, the laminated conductor plate 700, the power module 300, and the capacitor module 500 can be electrically connected. Even if it is a power converter provided, the assembly man-hour can be suppressed.

  A control circuit board 20 and a drive circuit board 22 are disposed above the laminated conductor plate 700. A driver circuit 174 shown in FIG. 2 is mounted on the drive circuit board 22, and a control circuit 172 having a CPU shown in FIG. 2 is mounted on the control circuit board 20. A metal base plate 11 is disposed between the drive circuit board 22 and the control circuit board 20. With such an arrangement, the internal space of the housing 12 is divided into two spaces by the metal base plate 11. Also, the control circuit board 20 (control circuit 172) is mounted in one of the two divided spaces, and the drive circuit board 22 (driver circuit 174) and the power module 300 are installed in the other space. The capacitor module 500 is mounted. The driver circuit 174 is mounted between the control circuit 172 and the power module 300.

  The metal base plate 11 functions as an electromagnetic shield for a circuit group mounted on both the boards 22 and 20 and also has an action of releasing and cooling the heat generated in the drive circuit board 22 and the control circuit board 20. Yes. The metal base plate 11 is sandwiched and installed between the upper case 10 and the housing 12. In this way, the cooling jacket 19A is provided at the center of the housing 12, the power module 300 for driving the vehicle is disposed on one side thereof, and the power module 43 for auxiliary machines is disposed on the other side. Cooling can be efficiently performed in a small space, and the entire power conversion device can be downsized. By making the cooling jacket 19A integrally with the housing 12 by aluminum casting, the cooling jacket 19A has an effect of increasing the mechanical strength in addition to the cooling effect. Further, since the casing 12 and the cooling jacket 19A are integrally formed by aluminum casting, heat conduction is improved and cooling efficiency is improved.

  The drive circuit board 22 is provided with an inter-board connector 23 that passes through the metal base plate 11 and is connected to a circuit group of the control circuit board 20. The control circuit board 20 is provided with a connector 21 for electrical connection with the outside. The connector 21 is used to transmit a signal to and from the in-vehicle battery 136 provided outside the power converter, that is, a lithium battery module. A signal representing the state of the battery and a signal such as the state of charge of the lithium battery are sent from the lithium battery module to the control circuit board 20. A signal line 176 (not shown in FIG. 4) shown in FIG. 2 is connected to the board-to-board connector 23, and a switching timing signal of the inverter circuit is transmitted from the control circuit board 20 to the drive circuit board 22. The drive circuit board 22 is gate-driven. A signal is generated and applied to each gate electrode of the power module.

  Openings are formed in the upper end and lower end of the housing 12. These openings are closed by fixing the upper case 10 and the lower case 16 to the housing 12 with fastening parts such as screws and bolts, for example. A cooling jacket 19 </ b> A in which a cooling water channel 19 is provided is formed in the center of the casing 12 in the height direction. By covering the upper surface opening of the cooling jacket 19A with the power module 300 and covering the lower surface opening with the lower cover 420, the cooling water channel 19 is formed inside the cooling jacket 19A. A water leakage test of the cooling water passage 19 is performed during the assembly. When the water leak test is passed, the work of attaching the substrate and the capacitor module 500 from the upper and lower openings of the housing 12 can be performed next. In this way, the cooling jacket 19A is arranged in the center of the housing 12, and then a structure that allows the necessary parts to be fixed from the openings at the upper and lower ends of the housing 12 is adopted, thereby improving productivity. To do. Moreover, it becomes possible to complete the cooling water flow path 19 first and to attach other parts after the water leak test, which improves both productivity and reliability.

  FIG. 5 is a view in which a cooling water inlet pipe and an outlet pipe are attached to an aluminum casting of the casing 12 having a cooling jacket 19A. FIG. 5 (a) is a perspective view of the casing 12, and FIG. FIG. 5C is a bottom view of the housing 12. As shown in FIG. 5, a cooling jacket 19 </ b> A in which a cooling water passage 19 is formed is integrally cast in the housing 12. A cooling water inlet pipe 13 and a cooling water outlet pipe 14 for taking in cooling water are provided on one side surface of the short side of the housing 12 having a substantially rectangular shape in plan view.

  The cooling water that has flowed into the cooling water channel 19 from the cooling water inlet pipe 13 flows along the long side of the rectangle in the direction of the arrow 418, and in the vicinity of the front side of the other side of the short side of the rectangle, the arrows 421a and 421b. Then, it flows again in the direction of the arrow 422 along the long side of the rectangle, and flows out from the outlet hole (not shown) to the cooling water outlet pipe 14. Four openings 400 and 402 are opened on the upper surface of the cooling jacket 19A. One opening 400 is provided for each of the outward and return paths of the cooling water. The opening 402 is the same. The power modules 300 are fixed to the openings 400 and 402, respectively, and the heat radiation fins of the power modules 300 protrude into the cooling water flow from the respective openings. Two sets of power modules 300 arranged in the direction of the flow of the cooling water, that is, the direction along the long side of the housing 12 are fixed so as to block the opening of the cooling jacket 19A through a sealing material such as an O-ring 800, for example. Is done.

  The cooling jacket 19A is integrally formed with the casing 12 across the middle stage of the casing peripheral wall 12W. Four openings 400 and 402 are provided on the upper surface of the cooling jacket 19A, and one opening 404 is provided on the lower surface. Around each of the openings 400 and 402, a power module mounting surface 410S is provided. A portion between the openings 400 and 402 of the attachment surface 410S is referred to as a support portion 410. One power module 300 is fixed toward the inlet / outlet side of the cooling water with respect to the support portion 410, and another one power module 300 is fixed toward the return side of the cooling water with respect to the support portion 410.

  The screw hole 412 and the bolt through hole 412A shown in FIG. 5B are used for fixing the power module 300 on the cooling water inlet / outlet side to the mounting surface 410S, and the opening 400 is sealed by this fixing. The screw hole 414 and the bolt through hole 414A are used to fix the power module 300 on the cooling water return side to the mounting surface 410S, and the opening 402 is sealed by this fixing. By arranging the power modules 300 so as to straddle both the forward path and the return path of the cooling water flow path 19 as described above, the inverter circuit 144 can be integrated on the metal base 304 at a high density. Therefore, the power conversion device 200 can be greatly reduced in size.

  The power module 300 on the inlet / outlet side is cooled by the cold cooling water from the cooling water inlet pipe 13 and the cooling water heated near the outlet side by the heat from the heat generating components. On the other hand, the folded-back power module 300 is cooled by a slightly warmed cooling water and a cooling water that is slightly cooler than the cooling water near the outlet hole 403. As a result, the arrangement relationship between the folded cooling passage and the two power modules 300 has an advantage that the cooling efficiency of the two power modules 300 is balanced.

  The support portion 410 is used for fixing the power module 300 and is necessary for sealing the openings 400 and 402. Further, the support portion 410 has a great effect on strengthening the strength of the housing 12. The cooling water channel 19 has a folded shape as described above, and is provided with a partition wall 408 that separates the forward path of the channel and the return path of the channel, and this partition wall 408 is formed integrally with the support portion 410. The partition 408 is a member that separates the forward path of the flow path from the return path of the flow path, and has a function of increasing the mechanical strength of the housing 12. In addition, the heat of the cooling water in the return path of the flow path is transferred to the cooling water in the forward path of the flow path to make the temperature of the cooling water uniform. If the temperature difference between the inlet side and the outlet side of the cooling water is large, uneven cooling efficiency increases. Although the temperature difference to some extent is unavoidable, the partition wall 408 is formed integrally with the support portion 410, so that there is an effect of suppressing the temperature difference of the cooling water.

  As described above, since the cooling jacket 19 </ b> A is provided across the housing 12 at the middle position of the housing 12, the cooling jacket 19 </ b> A functions as a strength member of the housing 12. In addition, the support portion 410 and the partition 408 function as the cooling jacket 19 </ b> A and eventually the strength member of the housing 12.

  FIG. 5C shows the back surface of the cooling jacket 19 </ b> A, and an opening 404 is formed on the back surface corresponding to the support portion 410. The opening 404 is for improving the yield when the support portion 410 formed by casting the casing and the casing 12 are integrally formed. The formation of the opening 404 eliminates the double structure of the support portion 410 and the bottom portion of the cooling water channel 19, facilitates casting, and improves productivity.

  Further, a through hole 406 is formed between the cooling water channel 19 and the side surface of the housing 12. Electrical components (the power module 300 and the capacitor module 500) installed on both sides of the cooling water channel 19 are connected via the through hole 406.

  Since the housing 12 can be manufactured as an integral structure with the cooling jacket 19A, it is suitable for casting production, particularly aluminum die casting production.

  FIG. 6 shows a state where the power module 300 is fixed to the upper surface opening of the jacket 19A and the lower cover 420 is fixed to the rear surface opening. On one long side of the rectangle of the housing 12, an AC power line 186 and an AC connector 188 protrude from the housing 12.

  In FIG. 6, a through hole 406 is formed inside the other long side of the rectangle of the housing 12, and a part of the laminated conductor plate 700 connected to the power module 300 through the through hole 406 can be seen. The auxiliary inverter device 43 is disposed in the vicinity of the side surface of the housing 12 to which the DC positive electrode side connection terminal portion 512 is connected. Further, a capacitor module 500 is disposed below the auxiliary inverter device 43 (on the side opposite to the side where the cooling water flow path 19 is present). The auxiliary machine positive terminal 44 and the auxiliary machine negative terminal 45 protrude downward (in the direction in which the capacitor module 500 is disposed), and are connected to the auxiliary machine positive terminal 532 and the auxiliary machine negative terminal 534 on the capacitor module 500 side, respectively. Is done. As a result, the wiring distance from the capacitor module 500 to the auxiliary device inverter 43 is shortened, so that the auxiliary device positive terminal 532 and the auxiliary device negative terminal 534 on the capacitor module 500 side through the metal casing 12. Noise that enters the control circuit board 20 can be reduced.

  In addition, the auxiliary inverter device 43 is disposed in the gap between the coolant channel 19 and the capacitor module 500, and the auxiliary inverter device 43 is approximately as high as the lower cover 420. Therefore, the auxiliary inverter device 43 can be cooled and an increase in the height of the power conversion device 200 can be suppressed.

  In FIG. 6, the cooling water inlet pipe 13 and the cooling water outlet pipe 14 are fixed by screws. In the state of FIG. 6, the water leakage inspection of the cooling water channel 19 can be performed. The auxiliary inverter device 43 is attached to the one that has passed this inspection, and the capacitor module 500 is further attached.

  7 and 8 are cross-sectional views of the power conversion device 200. FIG. 7 is a cross-sectional view based on the AA cross section of FIG. 6, and FIG. 8 is a cross-sectional view based on the BB cross section of FIG. The basic structure of these sectional views is as already described with reference to FIGS.

  A cooling jacket 19A (indicated by a dotted line in FIG. 7) made of aluminum die-casting integrally with the casing 12 is provided at the center in the vertical direction in the cross section of the casing 12, and is formed on the upper surface side of the cooling jacket 19A. The power module 300 (the chain line portion in FIGS. 7 and 8) is installed in the opening. The left side of FIG. 7 is the cooling water forward path 19a, and the right side of FIG. As described above, the openings are respectively provided above the forward path 19a and the return path 19b. The openings are blocked by the metal base 304 for heat dissipation of the power module 300 so as to straddle both the forward path 19a and the return path 19b. A heat radiation fin 305 provided on the base 304 protrudes from the opening in the flow of the cooling water. In addition, an auxiliary inverter device 43 is fixed to the lower surface side of the cooling water passage 19.

  One end of the plate-like AC power line 186 bent substantially at the center is connected to the AC terminal 159 of the power module 300, and the other end protrudes from the power converter 200 to form an AC connector. Positive electrode side capacitor terminal 504 and negative electrode side capacitor terminal 506 are electrically and mechanically connected to positive electrode side conductor plate 702 and negative electrode side conductor plate 704, respectively, through through-hole 406 (two-dot chain line portion in FIG. 7). The That is, the capacitor module 500 is connected to the power module 300 via the positive electrode side capacitor terminal 504 and the negative electrode side capacitor terminal 506 that pass through the through hole 406 and the laminated conductor plate 700. An AC connector 188, a positive-side capacitor terminal 504, and a negative-side capacitor terminal 506 are arranged in a direction substantially perpendicular to the flow direction of the cooling water in the cooling water flow path 19 provided in the housing 12. Therefore, the electrical wiring is arranged in an orderly manner, which leads to a reduction in size of the power conversion device 200. The positive electrode side conductor plate 702, the negative electrode side conductor plate 704, and the AC side power line 186 of the multilayer conductor plate 700 project outside the power module 300 to form connection terminals. Therefore, the electrical connection structure is very simple, and the size is reduced because no other connection conductor is used. This structure improves productivity and improves reliability.

  Further, the through hole 406 is isolated from the cooling water flow path 19 by a frame inside the housing 12, and the positive side conductor plate 702 and the negative side conductor plate 704, the positive side capacitor terminal 506, and the negative side capacitor terminal 504 are connected. Since the connecting portion exists in the through hole 406, the reliability is improved.

  In the cooling structure described above, the power module 300 having a large calorific value is fixed to one surface of the cooling jacket 19A, and the fins 305 of the power module 300 are protruded into the cooling water flow path 19 to efficiently cool the power module 300. To do. Next, the auxiliary inverter device 43 having a large heat radiation amount is cooled on the other surface of the cooling jacket 19A. Further, the capacitor module 500 having the next largest heat generation amount is cooled via the housing 12 and the lower case 16. Thus, since it is set as the cooling structure match | combined with much heat dissipation, while cooling efficiency and reliability improve, the power converter device 200 can be reduced more in size.

  Further, since the auxiliary inverter device 43 is fixed to the bottom surface of the cooling jacket 19A facing the capacitor module 500, when the capacitor module 500 is used as a smoothing capacitor of the auxiliary inverter device 43, the wiring distance is short. There is an effect. In addition, since the wiring distance is short, the inductance can be reduced.

  A drive circuit board 22 on which a driver circuit 174 is mounted is disposed above the power module 300. Further, a control circuit board is disposed above the drive circuit board 22 with a metal base plate 11 that enhances the effects of heat dissipation and electromagnetic shielding. 20 is arranged. The control circuit board 20 is mounted with the control circuit 172 shown in FIG. By fixing the upper case 10 to the housing 12, the power conversion device 200 according to the present embodiment is configured.

  As described above, since the drive circuit board 22 is arranged between the control circuit board 20 and the power module 300, the operation timing of the inverter circuit is transmitted from the control circuit board 20 to the drive circuit board 22, and based on that. A gate signal is generated by the drive circuit board 22 and applied to each gate of the power module 300. Since the control circuit board 20 and the drive circuit board 22 are thus arranged along the electrical connection relationship, the electrical wiring can be simplified and the power converter 200 can be downsized. The drive circuit board 22 is disposed at a distance closer to the control circuit board 20 than the power module 300 and the capacitor module 500. Therefore, the wiring distance from the drive circuit board 22 to the control circuit board 20 is shorter than the wiring distance between other components (such as the power module 300) and the control circuit board 20. Therefore, electromagnetic noise transmitted from the DC positive electrode side connection terminal portion 512 and electromagnetic noise due to the switching operation of the IGBTs 328 and 330 can be prevented from entering the wiring from the drive circuit board 22 to the control circuit board 20.

  The power module 300 is fixed to one surface of the cooling jacket 19A and the auxiliary device inverter device 43 is fixed to the other surface, whereby the power module 300 and the auxiliary device 43 are connected with the cooling water flowing through the cooling water passage 19. Cool at the same time. In this case, the power module 300 has a greater cooling effect because the fins for heat dissipation are in direct contact with the cooling water in the cooling water passage 19. Further, the casing 12 is cooled by the cooling water flowing through the cooling water passage 19, and the lower case 16 and the metal base plate 11 fixed to the casing 12 are cooled. Since the metal case of the capacitor module 500 is fixed to the lower case 16, the capacitor module 500 is cooled with cooling water via the lower case 16 and the housing 12. Further, the control circuit board 20 and the drive circuit board 22 are cooled via the metal base plate 11. The lower case 16 is also made of a material having good thermal conductivity, receives heat generated from the capacitor module 500, conducts heat to the housing 12, and the heat transferred is dissipated by the cooling water in the cooling water passage 19. . A relatively small-capacity auxiliary inverter device 43 that is used for an in-vehicle air conditioner, an oil pump, and a pump for other purposes is installed on the lower surface of the cooling jacket 19A. The heat generated from the auxiliary inverter device 43 is radiated by the cooling water in the cooling water passage 19 through the intermediate frame of the housing 12. In this way, the cooling jacket 19A is provided in the center of the housing 12, the metal base plate 11 is provided on one side of the cooling jacket 19A, that is, the upper side, and the lower case 16 is provided on the other side, that is, the lower side. It is possible to efficiently cool the components necessary for the configuration according to the heat generation amount. Also, the components are neatly arranged inside the power conversion device 200, and the size can be reduced.

  The heat radiator that performs the heat radiation function of the power conversion device is first the cooling water flow path 19, but the metal base plate 11 also has that function. The metal base plate 11 performs an electromagnetic shielding function, receives heat from the control circuit board 20 and the drive circuit board 22, conducts heat to the housing 12, and is radiated by the cooling water in the cooling water flow path 19.

  As described above, the power conversion device according to the present embodiment has a laminated structure in which the radiator is a three-layered structure, that is, the metal base plate 11, the cooling water channel 19, the (cooling jacket 19 </ b> A), and the lower case 16. ing. These heat radiators are installed in a hierarchy adjacent to the respective heat generators (power module 300, control circuit board 20, drive circuit board 22, and capacitor module 500). In the center of the hierarchical structure, there is a cooling water flow path 19 that is a main radiator, and the metal base plate 11 and the lower case 16 are structured to transmit heat to the cooling water in the cooling water flow path 19 through the housing 12. . Three radiators (cooling water channel 19, metal base plate 11, and lower case 16) are accommodated in the casing 12, thereby improving heat dissipation and contributing to reduction in thickness and size.

  In FIG. 8, the connector 21 passes through the housing 12 and reaches a space on the side where the control circuit board 20 is located, out of two spaces in the housing 12 divided by the metal base plate 11. On the other hand, the direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512 pass through the housing 12 and the other space, that is, the drive circuit board 22, the power module 300, and the capacitor module. It reaches the space on the side where 500 is located. By arranging the connector 21, the direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512 in this way, the direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side. Noise that enters the housing 12 from the connection terminal portion 512 and propagates to the connector 21 can be reduced. As a result, the accuracy of the control operation by the control circuit 172 mounted on the control circuit board 20 can be improved.

  Further, the direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512 are arranged in the housing 12 at a position closer to the capacitor module 500 than the power module 300. As a result, the influence of noise on the power module 300 caused by direct current power from the battery 136 that is input to the capacitor module 500 through the direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512. Can be reduced.

  The metal base plate 11 is provided with an opening 430 (dotted line portion in FIG. 8). A metal partition plate 440 is disposed adjacent to the opening 430. The partition plate 440 is installed closer to the power module 300 than the opening 430 (on the right side in FIG. 8), and in cooperation with the metal base plate 11, the internal space of the housing 12 is divided into two spaces as described above. It is divided into. The connector 21 penetrates the housing 12 and reaches a space on the side where the control circuit board 20 is located, out of the two spaces in the housing 12 thus divided. At least a part of the connector 21 is located between the opening 430 and the partition plate 440 as shown in FIG.

  FIG. 9A is an upper perspective view of the power module 300 according to the present embodiment, and FIG. 9B is a top view of the power module 300. FIG. 10 is an exploded perspective view of a DC terminal of the power module 300 according to the present embodiment. FIG. 11 is a cross-sectional view in which the power module case 302 is partially transparent to make the structure of the DC bus bar easier to understand. FIG. 10A is a diagram in which one of the metal base 304 and the three upper and lower arm series circuits that are components of the power module 300 is extracted. FIG. 10B is an exploded perspective view of the metal base 304, the circuit wiring pattern, and the insulating substrate 334.

  In FIG. 9A, 302 is a power module case, 304 is a metal base, 305 is a fin (see FIG. 11), 314a is a DC positive terminal connection, 316a is a DC negative terminal connection, and 318 is an insulating paper (FIG. 10). 320U / 320L is the control terminal of the power module, 328 is the IGBT for the upper arm, 330 is the IGBT for the lower arm, 156/166 is the diode, 334 is the insulating substrate (see FIG. 11), 334k is the insulating substrate 334 The upper circuit wiring pattern (see FIG. 11), 334r represents a circuit wiring pattern under the insulating substrate 334 (see FIG. 11), and 337 represents solder for joining the circuit wiring pattern 334r to the metal base 304, respectively.

  The power module 300 mainly includes, for example, a semiconductor module portion including wiring in a power module case 302 made of a resin material, a metal base 304 made of a metal material such as Cu, Al, AlSiC, and the like, and a connection terminal (DC). Positive electrode terminal 314 and control terminal 320U). As terminals to be connected to the outside, the power module 300 includes a U, V, W phase AC terminal 159 for connection to the motor, a DC positive terminal 314 and a DC negative terminal 316 for connection to the capacitor module 500 (see FIG. 10). ).

  The semiconductor module portion is provided with upper and lower arms IGBTs 328 and 330, diodes 156/166, etc. on an insulating substrate 334, and is protected by a resin or silicon gel (not shown). The insulating substrate 334 may be a ceramic substrate or a thinner insulating sheet.

  FIG. 9B shows an arrangement configuration showing the specific arrangement of the upper and lower arm series circuits on the insulating substrate 334 made of ceramic with good thermal conductivity fixed to the metal base 304. FIG. The IGBTs 328 and 330 and the diodes 327 and 332 shown in FIG. 9B respectively connect two chips in parallel to form an upper arm and a lower arm, and increase the current capacity that can be supplied to the upper and lower arms.

  As shown in FIG. 10, the DC terminal 313 built in the power module 300 has a laminated structure of a DC negative terminal 316 and a DC positive terminal 314 with an insulating paper 318 interposed therebetween (dotted line portion in FIG. 10). The ends of the DC negative electrode terminal 316 and the DC positive electrode terminal 314 are bent in opposite directions to form a negative electrode connecting portion 316a and a positive electrode connecting portion 314a for electrically connecting the laminated conductor plate 700 and the power module 300. ing. By providing two connection portions 314a and 316a with the multilayer conductor plate 700, the average distances from the negative electrode connection portion 316a and the positive electrode connection portion 314a to the three upper and lower arm series circuits are substantially equal. The parasitic inductance variation can be reduced.

  When the DC positive electrode terminal 314, the insulating paper 318, and the DC negative electrode terminal 316 are stacked and assembled, the negative electrode connecting portion 316a and the positive electrode connecting portion 314a are bent in opposite directions. The insulating paper 318 is bent along the negative electrode connecting portion 316a to ensure the insulating creepage distance between the positive and negative terminals. As the insulating paper 318, when heat resistance is required, a sheet in which polyimide, meta-aramid fiber, polyester having improved tracking properties, or the like is used is used. In addition, in consideration of defects such as pin fall, two sheets are stacked to increase reliability. Also, in order to prevent tearing or tearing, the corners are rounded or the sag surface at the time of punching faces the insulating paper so that the edge of the terminal does not touch the insulating paper. In this embodiment, insulating paper is used as the insulator, but as another example, the terminal may be coated with the insulator. In order to reduce the parasitic inductance, for example, in the case of a 600V withstand voltage power module, the distance between the positive electrode and the negative electrode is 0.5 mm or less, and the thickness of the insulating paper is half or less.

  The DC positive terminal 314 and the DC negative terminal 316 have connection ends 314k and 316k for connecting to the circuit wiring pattern 334k. Two connection ends 314k and 316k are provided for each phase (U, V, W phase). As a result, as will be described later, each arm of each phase can be connected to a circuit wiring pattern in which two small loop current paths are formed. Each connection end 314k, 316k protrudes in the direction of the circuit wiring pattern 334k, and its tip is bent to form a joint surface with the circuit wiring pattern 334k. The connection ends 314k and 316k and the circuit wiring pattern 334k are connected via solder or the like, or the metals are directly connected by ultrasonic welding.

  The power module 300, particularly the metal base 304, expands and contracts due to the temperature cycle. Due to the expansion and contraction, the connection portion between the connection ends 314k and 316k and the circuit wiring pattern 334k may be cracked or broken. Therefore, in the power module 300 according to the present embodiment, as shown in FIG. 10, the laminated flat surface portion 319 formed by laminating the DC positive electrode terminal 314 and the DC negative electrode terminal 316 is the side on which the insulating substrate 334 is mounted. Thus, the laminated flat surface portion 319 can be warped in response to the warping of the metal base 304 caused by the expansion and contraction described above. It becomes. Therefore, the rigidity of the connection ends 314k and 316k formed integrally with the laminated flat surface portion 319 can be reduced with respect to the warp of the metal base 304. Therefore, the stress applied in the vertical direction of the joint surface between the connection ends 314k and 316k and the circuit wiring pattern 334k can be relieved, and the joint surface can be prevented from cracking or breaking.

  In addition, the lamination plane part 319 according to the present embodiment has the width in the width direction of the lamination plane part 319 so that the metal base 304 can be bent in response to both the width direction and the depth direction of the metal base 304. The length in the depth direction is increased to 130 mm and the length in the depth direction to 10 mm. In addition, the thickness of each of the laminated flat surface portions 319 of the DC positive electrode terminal 314 and the DC negative electrode terminal 316 is set to be relatively thin as 1 mm so as to facilitate the warping operation.

  As shown in FIG. 11, the metal base 304 has fins 305 on the opposite side of the insulating substrate 334 in order to efficiently dissipate heat to the cooling water flowing through the cooling water channel 19. The metal base 304 is mounted with an IGBT or a diode constituting an inverter circuit on one surface thereof, and includes a resin power module case 302 on the outer periphery of the metal base 304. A fin 305 is projected by brazing on the other surface of the metal base 304. The metal base 304 and the fin 305 may be integrally formed by forging. In this manufacturing method, the productivity of the power module 300 is improved, the thermal conductivity from the metal base 304 to the fins 305 is improved, and the heat dissipation of the IGBT and the diode can be improved. In addition, by manufacturing the metal base 304 with a material having a Vickers hardness of 60 or more, ratchet deformation of the metal base 304 caused by a temperature cycle can be suppressed, and the sealing performance between the metal base 304 and the housing 12 can be improved. Further, as shown in FIG. 11 (a), two sets of fin groups 305G are provided so as to correspond to the upper and lower arms, respectively, and these fin groups 305G have openings 400, 402 above the reciprocating cooling water channel 19. Protrudes into the waterway. The metal surface around the fin group 305G of the metal base 304 is used to close the openings 400 and 402 provided in the cooling jacket 19A.

  In addition, although the shape of the fin 305 of this embodiment is a pin type, as another embodiment, the straight type formed along the flow direction of cooling water may be sufficient. When the shape of the fin 305 is a straight type, the pressure for flowing cooling water can be reduced. On the other hand, when a pin type fin is used, the cooling efficiency can be improved.

  An insulating substrate 334 is fixed to one surface of the metal base 304, and an upper arm IGBT 328 and an upper arm diode 156, and a lower arm IGBT 330 and a lower arm are fixed on the insulating substrate 334 from a solder 337. The chip having the diode 166 is fixed.

  As shown in FIG. 12A, the upper and lower arm series circuit 150 includes an upper arm circuit 151, a lower arm circuit 152, a terminal 370 for connecting the upper and lower arm circuits 151.152, and an AC power for output. An AC terminal 159 is provided. As shown in FIG. 12B, the upper arm circuit 151 includes an insulating substrate 334 on which a circuit wiring pattern 334k is formed on a metal base 304, and an IGBT 328 and a diode 156 are provided on the circuit wiring pattern 334k. Implemented and configured.

  The IGBT 328 and the diode 156 have their backside electrodes and the circuit wiring pattern 334k joined together by solder. The insulating substrate 334 forms a so-called solid pattern having no pattern on the surface (back surface) opposite to the circuit wiring pattern surface. The solid pattern on the back surface of the insulating substrate 334 and the metal base 304 are joined by solder. Similarly to the upper arm, the lower arm circuit 152 is mounted on the insulating substrate 334 disposed on the metal base 304, the circuit wiring pattern 334k wired on the insulating substrate 334, and the circuit wiring pattern 334k. IGBT 330 and diode 166 are provided.

  The electrodes on the back side of the IGBT 330 and the diode 166 are also joined to the circuit wiring pattern 334k by solder. In addition, each arm of each phase in the present embodiment is configured by connecting two sets of circuit units in which IGBT 328 and diode 156 are connected in parallel to each other in parallel. The required number of sets of circuit units is determined by the amount of current supplied to the motor 192. When a current larger than the current supplied to the motor 192 according to the present embodiment is required, three circuit units or more are connected in parallel. On the other hand, when the motor can be driven with a small current, each arm of each phase is configured by only one set of circuit units.

A current path of the power module 300 will be described with reference to FIG. A path of a current flowing through the upper arm circuit 151 of the power module 300 is shown below.
(1) One side electrode of the upper arm IGBT 328 and the upper arm diode 156 (element side) from the DC positive electrode terminal 314 (not shown) through the connection conductor portion 371U and (2) from the connection conductor portion 371U through the element side connection conductor portion 372U. (3) Connection conductor portion 373U from the other electrode of upper arm IGBT 328 and upper arm diode 156 via wire 336, (4) Connection from connection conductor portion 373U The connection conductor portion 371D flows through the connection portions 374U and 374D of the terminal 370. As described above, the upper arm is configured by connecting two sets of circuit units in which IGBT 328 and diode 156 are connected in parallel, in parallel. Therefore, in the current path of (2) above, the current is branched into two at the element side connection conductor portion 372U, and the branched current flows to the two sets of circuit portions.

A current path flowing in the lower arm circuit 152 of the power module 300 is shown below.
(1) One side electrode of the lower arm IGBT 330 and the upper arm diode 166 from the connection conductor portion 371D through the element side connection conductor portion 372D (the electrode on the side connected to the element side connection conductor portion 372D), (2) The other side electrodes of the lower arm IGBT 330 and the lower arm diode 166 flow through the connection conductor portion 373D via the wire 336, and (3) the DC negative electrode terminal 316 (not shown) flows from the connection conductor portion 373D. In addition, since the lower arm is configured by connecting two sets of circuit units in which the IGBT 330 and the diode 166 are connected in parallel in the same manner as the upper arm, in the current path of (1) above, the current is the element side connecting conductor. It is branched into two at the section 371D, and the branched current flows to two sets of circuit sections.

  Here, the connection conductor portion 371U for connecting the IGBT 328 (and the diode 156) of the upper arm circuit and the DC positive terminal 314 (not shown) is disposed near the substantially central portion of one side of the insulating substrate 334. The IGBT 328 (and the diode 156) is mounted in the vicinity of the other side opposite to the one side of the insulating substrate 334 on which the connection conductor portion 371U is disposed. In the present embodiment, the two connecting conductor portions 373U are arranged in a row on one side of the insulating substrate 334 with the connecting conductor portion 371U described above interposed therebetween.

  Such a circuit pattern and a mounting pattern, that is, a circuit wiring pattern on the insulating substrate 334, has two wiring patterns (371U) on both sides of a substantially T-shaped wiring pattern and a substantially T-shaped vertical bar (371U). By mounting the terminals from the connection ends 371U and 373U, the transient current path at the time of switching of the IGBT 328 is an M-shaped current path as indicated by an arrow 350 (broken line) in FIG. It becomes two small loop current paths (the direction of the arrow is when the lower arm is turned on). A magnetic field 350H in the direction of the arrow 350H (solid line) in FIG. 12B is generated around the two small loop current paths. The magnetic field 350H induces an induced current, so-called eddy current 340, in the metal base 304 disposed below the insulating substrate 334. The eddy current 340 generates a magnetic field 340H in a direction that cancels the magnetic field 350H, and can reduce the parasitic inductance generated in the upper arm circuit.

  The two small loop currents described above are two U-turn currents such that currents flowing on the insulating substrate 334 cancel each other. For this reason, as shown by a magnetic field 350H in FIG. 12B, a smaller loop magnetic field is generated inside the power module 300, and thus the parasitic inductance can be reduced. In addition, the magnetic field loop that occurs during switching is small, and the magnetic field loop can be confined inside the power module, reducing the induced current to the case outside the power module, malfunctioning of the circuit on the control circuit board, and power conversion Electromagnetic noise to the outside of the device can also be prevented.

  The lower arm circuit also has a circuit wiring pattern and a mounting pattern similar to the upper arm circuit described above. That is, the connection conductor portion 371D for connecting the IGBT 330 (and the diode 166) of the lower arm circuit and the DC negative electrode terminal 316 (not shown) is disposed near the substantially central portion of one side of the insulating substrate 334. The IGBT 330 (and the diode 166) is mounted in the vicinity of the other side opposite to the one side of the insulating substrate 334 on which the connection conductor portion 371D is disposed. In the present embodiment, the two connecting conductor portions 373D are arranged in a line on one side of the insulating substrate 334 with the connecting conductor portion 371D described above interposed therebetween.

  By using such a circuit wiring pattern and a mounting pattern, the above-described parasitic inductance is also reduced on the lower arm circuit side. In the present embodiment, the entrance of the current path of each arm of each phase is, for example, the connection conductor part 371U sandwiched between the two connection conductor parts 373U, while the exit of the current path is the two connection conductor parts 373U. It has become. However, even if these inlets and outlets are reversed, the aforementioned small loop current path is formed in each arm of each phase. Therefore, as in the case described above, it is possible to reduce the parasitic inductance of each arm of each phase and prevent electromagnetic noise.

  The detailed structure of the capacitor module 500 of the present embodiment will be described below with reference to FIGS. FIG. 13 is a perspective view showing an external configuration of the capacitor module according to this embodiment. FIG. 14 is a perspective view showing a state before filling with a filler 522 such as a resin so that the inside of the capacitor module 500 shown in FIG. 13 can be seen. FIG. 15 is a diagram showing a structure in which the capacitor cell 514 is fixed to the laminated conductor, which is a detailed structure of the capacitor module 500.

  13 to 15, 500 is a capacitor module, 502 is a capacitor case, 504 is a negative side capacitor terminal, 506 is a positive side capacitor terminal, 510 is a direct current (battery) negative side connection terminal, and 512 is a direct current (battery) positive electrode. Side connection terminal portions 532 are positive terminals for auxiliary machines, 534 are negative terminals for auxiliary machines, and 514 is a capacitor cell.

  As shown in FIGS. 13 and 15, a plurality of laminated conductor plates each including a negative electrode conductor plate 505 and a positive electrode conductor plate 507, four in this embodiment, a direct current (battery) negative electrode side connection terminal portion 510 and a direct current ( Battery) It is electrically connected in parallel to the positive electrode side connection terminal portion 512. The negative electrode plate 505 and the positive electrode plate 507 are provided with a plurality of terminals 516 and terminals 518 for connecting the positive and negative electrodes of the plurality of capacitor cells 514 in parallel.

  As shown in FIG. 15, a capacitor cell 514 that is a unit structure of the power storage unit of the capacitor module 500 is formed by laminating and winding two films each having a metal such as aluminum deposited thereon and winding them. Each is constituted by a film capacitor 515 having a positive electrode and a negative electrode. The positive and negative electrodes are manufactured by spraying a conductor 508 such as tin, with the wound shaft surfaces being the positive electrode and the negative electrode, respectively.

  Further, as shown in FIG. 15, the negative electrode conductor plate 505 and the positive electrode conductor plate 507 are formed of thin plate-like wide conductors and adopt a laminated structure in which the insulating paper 517 is laminated to reduce parasitic inductance. Terminals 516 and 518 for connecting to the electrode 508 of the capacitor cell are provided at the end of the laminated conductor. Terminals 516 and 518 are electrically connected to electrodes 508 of two capacitor cells 514 by soldering or welding. In order to facilitate the soldering operation by the soldering apparatus or the welding operation by the welding machine, and to facilitate the inspection of the capacitor cell, that is, the electrode surface connected to the terminals 516 and 518 is outside the cell. Thus, the capacitor cells are arranged and the structure of the conductor plate is designed to constitute one capacitor cell group. By using such a capacitor cell group, the number of capacitor cell groups can be arbitrarily increased or decreased to meet the required capacitor capacity. As a result, a common capacitor cell can be used for a wide variety of capacitor modules, and a capacitor module suitable for mass production can be obtained. In order to reduce the parasitic inductance and to dissipate heat, it is preferable to provide a plurality of terminals 516 and 518, respectively.

  A negative electrode side capacitor terminal 504 and a positive electrode side capacitor terminal 506 for connection to the laminated conductor plate 700 are provided at one end of a negative electrode conductor plate 505 and a positive electrode conductor plate 507 which are thin plate-like wide conductors. At the other end of the negative electrode conductor 505 and the positive electrode conductor 507, a direct current negative electrode side connection terminal 510 and a direct current positive electrode side connection terminal 512 that are connected to a terminal that receives battery power are provided.

  A capacitor module 500 shown in FIG. 14 includes a total of eight capacitor cells 514 in which four capacitor cell groups each having two capacitor cells as one unit are arranged vertically. As connection terminals to the outside of the capacitor module 500, four pairs of positive and negative capacitor terminals 504 and 506 connected to the laminated conductor plate 700, DC positive and negative electrode side connection terminals 510 and 512 for receiving battery power, and an auxiliary machine inverter Auxiliary positive and negative terminals 532 and 534 for supplying power to the power module are used. Openings 509 and 511 are formed in the positive and negative capacitor terminals 504 and 506, and nuts are welded to the back sides of the openings 509 and 511 so that the DC positive and negative terminals 316 and 314 of the power module 300 can be bolted.

  The capacitor case 502 includes a terminal cover 520. The terminal cover 520 determines the position of the terminal and insulates the casing of the power converter. The capacitor case 502 is provided with a partition for positioning each capacitor cell group between the capacitor cell groups. A material having excellent thermal conductivity is used for the capacitor case 502. Furthermore, a material having good thermal conductivity for heat dissipation may be embedded in the partition between the capacitor cell group.

  In the capacitor module 500, heat is generated when a ripple current at the time of switching flows due to the electrical resistance of the metal thin film and the internal conductor (terminal) deposited on the film inside the capacitor cell. For the moisture resistance of the capacitor cell, the capacitor cell and the inner conductor (terminal) are impregnated (molded) with resin in the capacitor case 502. For this reason, the capacitor cell and the internal conductor are in close contact with the capacitor case 502 through the resin, and the heat generated by the capacitor cell is easily transmitted to the case. Furthermore, in this structure, since the negative electrode conductor plate 505, the positive electrode conductor plate 507, the capacitor cell 508, and the terminals 516 and 518 are directly connected, the heat generated in the capacitor cell is directly transmitted to the negative electrode and the positive electrode conductor, and the wide conductor conducts heat to the mold resin. The structure is easy to convey. For this reason, as shown in FIG. 7, heat is transferred well from the capacitor case 502 to the lower case 16, from the lower case 16 to the housing 12, and further to the cooling water flow path 19, thereby ensuring heat dissipation.

  As shown in FIG. 14, in this embodiment, the capacitor module is configured by independently arranging the laminated structure of the negative electrode conductor plate 505 and the positive electrode conductor plate 507 vertically in four rows. The four rows of negative electrode conductors 505 and positive electrode conductors 507 may be configured as an integral wide conductor plate, and all capacitor cells 514 may be connected to the wide conductor plate. As a result, the number of components can be reduced, productivity can be improved, and the capacitances of all capacitor cells 514 can be used substantially evenly, thereby extending the component life of the entire capacitor module 500. be able to. Furthermore, parasitic inductance can be reduced by using a wide conductor plate.

  FIG. 16A is a perspective view in which only the capacitor module 500, the laminated conductor plate 700, and the two power modules 300 are extracted from the power conversion device 200 according to the present embodiment. FIG. 16B is an exploded perspective view of the laminated conductor plate 700.

  As shown in FIG. 16A, the two power modules 300 are arranged side by side with the AC terminals 159 aligned on one side. On the side opposite to these AC terminals 159, electrical connection portions between the two power modules 300 and the capacitor module 500 are provided. Electrical connection between the two power modules 300 and the capacitor module 500 is performed by a laminated conductor plate 700 on a flat plate.

  A large number of capacitor cells 514 (not shown) are accommodated in the capacitor case 502 fixed on the lower case 16, and the positive electrode side capacitor terminal 504 and the negative electrode side capacitor terminal 506 of the capacitor module 500 are connected to one side of the capacitor case 502. It is arranged along the long side. The positive electrode connection portion and the negative electrode connection portions 504 c and 506 b at the upper ends of the positive electrode side capacitor terminal 504 and the negative electrode side capacitor terminal 506 are arranged at positions protruding from the upper surface of the capacitor cell 514.

  The laminated conductor plate 700 connected to the power module 300 is disposed so as to cover the two power modules 300. The positive-side capacitor terminal 504 and the negative-side capacitor terminal 506 form an L-shaped structure that rises from the opening surface of the capacitor case 502. The L-shaped positive-side capacitor terminal 504 and the negative-side capacitor terminal The positive electrode connecting portion 506b and the negative electrode connecting portion 504c at the upper end of 506 are in direct contact with the laminated conductor plate 700 and connected with bolts when the power converter 200 is assembled.

  As shown in FIG. 16 (b), this laminated conductor plate 700 is composed of a flat positive electrode side conductor plate 702 and a negative electrode side conductor plate 704, and an insulation sandwiched between these positive electrode side conductor plate 702 and negative electrode side conductor plate 704. The sheet 706 is configured. That is, since the laminated conductor plate 700 is formed as a laminated structure, the parasitic inductance from the power module 300 to the capacitor module 500 can be reduced.

  As shown in FIGS. 16 (a) and 9 (b), the plurality of upper arm control terminals 320U are arranged near the central portion on the side A (see FIG. 9 (b)) of the power module 300. . That is, the U-phase control pin is brought closer to the V-phase control pin, the W-phase control pin is brought closer to the V-phase control pin, and the upper arm control terminals 320U are arranged in a row near the central portion on the A side of the power module 300. . The laminated conductor plate 700 has through holes 705 for penetrating the plurality of upper arm control terminals 320U, and the positive electrode side conductor plate 702 and the negative electrode side conductor plate 704 are provided on both sides of the through hole 705. Are stacked. With these configurations, the lamination area of the negative electrode side conductor plate 704 and the positive electrode side conductor plate 702 can be increased, and further, the parasitic inductance from the power module 300 to the capacitor module 500 can be reduced.

  A boss 321 is arranged in the vicinity of the central portion on the A side of the power module 300 shown in FIG. 9B, that is, in the vicinity of the upper arm control terminal 320U. The drive circuit board 22 on which the driver board 174 is mounted is fixed to the boss 321, and the upper arm control terminal 320 </ b> U is passed through a hole formed in the drive circuit board 22. Thereafter, the terminal on the drive circuit board 22 and the arm control terminal 320U are joined by welding or the like. With such a configuration, the joint portion between the upper arm control terminal 320U and the terminal on the drive circuit board 22 is a short distance from the boss 321, so that vibration resistance during vehicle travel is improved.

  The drive circuit board 22 is disposed above the laminated conductor plate 700. Therefore, as shown in FIG. 16B, the laminated conductor plate 700 includes a negative-side conductor plate 704 on the drive circuit board 22 side, and a positive-side conductor plate 702 on the power module 300 side. As a result, the low voltage negative electrode conductor plate 704 and the insulating sheet 706 are present between the high voltage positive electrode conductor plate 702 and the drive circuit board 22 to prevent the drive circuit board 22 from being exposed to the high voltage. be able to.

  As shown in FIG. 16 (b), the positive conductor plate 702 is disposed over the two power modules 300, and further connects the two power modules 300 and the capacitor module 500. Similarly, the negative electrode conductor plate 704 is disposed over the two power modules 300, and further connects the two power modules 300 and the capacitor module 500. Thereby, since the laminated conductor plate 700 becomes wide, the parasitic inductance from the power module 300 to the capacitor module 500 can be reduced. In addition, since there are four connection locations of the capacitor module 500 for one power module, the parasitic inductance can be reduced. Further, by sharing the connection conductor from the two power modules 300 to the capacitor module 500 between the two power modules 300, the number of parts of the entire power conversion device 200 can be reduced, and the productivity can be improved. Can do.

  As shown in FIG. 9, the power module 300 includes a positive electrode side connection portion 314a and a negative electrode side connection portion 316a as a set, and a pair of connection portions 314a and 316a are arranged on one side of the power module 300, and the opposite side. Another set of connection portions 314a and 316a is arranged on the side of the. The laminated conductor plate 700 is disposed over the two sets of connection portions 314a and 316a, and is further connected to the connection portions 314a and 316a by bolts. As a result, the direct current supplied from the capacitor module 500 is not concentrated on the pair of connection portions 314a and 316a, that is, the direct current is distributed to the two sets of connection portions 314a and 316a. Therefore, the inductance from the power module 300 to the capacitor module 500 can be reduced.

  As described above, the capacitor module 500 has a plurality of capacitor cells 514 built therein. In this embodiment, a plurality of capacitor cells 514 constitute a capacitor cell group, and four sets of this capacitor cell group are provided. Further, wide conductors (positive conductor plate 507 and negative conductor plate 505) corresponding to each set are provided. As shown in FIG. 14, the negative-side capacitor terminal 504 and the positive-side capacitor terminal 506 are connected to the wide conductors one by one. In the present embodiment, all these negative capacitor terminals 504 and positive capacitor terminals 506 are electrically connected to a set of laminated conductor plates 700. As a result, all the capacitor cells 514 are electrically connected to the two power modules 300, and the capacitances of all the capacitor cells 514 can be used substantially evenly. Can extend the service life of parts. Further, by using this set of laminated conductor plates 700, the inside of the capacitor module 500 can be divided for each capacitor cell group constituted by two capacitor cells 514, and the current capacity of the motor 192 can be increased. In addition, the number of units of the capacitor cells 514 constituting the capacitor cell group can be easily changed.

  It is desirable that the positive electrode side conductor plate 702 and the negative electrode side conductor plate 704 constituting the laminated conductor plate 700 have a gap distance as small as possible in order to reduce the parasitic inductance. For example, when the laminated conductor plate 700 has a bent structure portion for connecting the power module 300 and the capacitor module 500, a larger gap distance than that of the flat plate portion is generated in the bent structure portion. Inductance will increase.

  Therefore, the positive electrode side connection portion 314a and the negative electrode side connection portion 316a of the power module 300 according to the present embodiment, and the positive electrode side connection portion 504c and the negative electrode side connection portion 504b of the capacitor module 500 are arranged on substantially the same plane. Configure. Thereby, since the flat laminated conductor plate 700 can be used, the gap distance between the positive electrode side conductor plate 702 and the negative electrode side conductor plate 704 can be reduced, and the parasitic inductance can be reduced.

  FIG. 17A shows an enlarged view of a connection portion 380 (see FIG. 16A) between the power module 300 and the laminated conductor plate 700 shown in FIG.

  As shown in FIG. 17A, the negative electrode side connection portion 316a and the positive electrode side connection portion 314a are configured by bending the ends of the DC positive electrode terminal 314 and the DC negative electrode terminal 316 in the opposite directions, and these negative electrode side connections. The negative electrode conductor plate 704 and the positive electrode conductor plate 702 of the laminated conductor plate 700 are connected to the part 316a and the positive electrode side connection part 314a, respectively. As a result, the current on the negative electrode side that instantaneously flows during switching of the IGBTs 328 and 330 becomes like a current path 382 shown in FIG. 17A, and therefore, the connection between the connection portion 704a of the negative electrode conductor plate and the negative electrode side connection portion 316a. A U-turn current is formed. Therefore, since the magnetic flux generated around the connection portion 704a of the negative electrode side conductor plate 704 and the magnetic flux generated around the negative electrode side connection portion 316a cancel each other, the inductance can be reduced.

  On the other hand, the current of the positive electrode conductor plate connection portion 702a passes through a current path 384 as shown in FIG. Since the negative electrode conductor plate 704 is disposed above the connection portion 702a of the positive electrode conductor plate, the current direction of the connection portion 702a of the positive electrode conductor plate and the current direction of the negative electrode conductor plate 704 are opposite to each other. The magnetic flux generated by the current will cancel out. As a result, the parasitic inductance of the connecting portion 702a of the positive conductor plate can be reduced.

  In addition, as shown in FIG. 17A, the insulating paper 318 and the insulating sheet 706 are arranged so as to have regions overlapping in the vertical direction. Furthermore, when the laminated conductor plate 700 is fixed to the negative electrode side connecting portion 316a and the positive electrode side connecting portion 314a with bolts or the like, the insulating paper 318 and the insulating sheet 706 are sandwiched between the laminated conductor plate 700 and the positive electrode side connecting portion 314a. It arrange | positions so that it may have an area | region which does not have, ie, an area | region where a compressive stress is not applied. Thereby, the insulation between the positive electrode and the negative electrode in the connection part, specifically, the insulation between the positive electrode side connection part 314a and the negative electrode conductor plate 704 can be ensured.

  FIG. 17B shows an enlarged view (see FIG. 16A) of the connection location 390 of the laminated conductor plate 700.

  As shown in FIG. 17 (b), the positive electrode side connection portion 506b and the negative electrode side connection portion 504c of the capacitor module 500 are configured to be bent in opposite directions, and the positive electrode conductor plate of the multilayer conductor plate 700 is formed on each upper surface. 702 and the negative electrode conductor plate 704 are connected to each other. As a result, the current on the negative electrode side that instantaneously flows during switching of the IGBTs 328 and 330 becomes like a current path 392 shown in FIG. 17B, so that the connection portion 704c of the negative electrode conductor plate 704 and the negative electrode side connection of the capacitor module 500 are connected. A U-turn current is formed with the portion 504c. Therefore, since the magnetic flux generated around the connection portion 704a of the negative electrode conductor plate 704 and the magnetic flux generated around the negative electrode side connection portion 504c cancel each other, the inductance can be reduced.

  Similarly, the current on the positive electrode side that instantaneously flows during switching of the IGBTs 328 and 330 passes through a current path 394 as shown in FIG. That is, a U-turn current is formed between the connecting portion 702 b of the positive electrode conductor plate and the positive electrode side connecting portion 506 b of the capacitor module 500. Therefore, since the magnetic flux generated around the connection portion 702b of the positive electrode side conductor plate 702 and the magnetic flux generated around the positive electrode side connection portion 506b cancel each other, the inductance can be reduced.

  In addition, as shown in FIG. 17B, the insulating sheet 517 and the insulating sheet 706 are arranged so as to have regions overlapping in the vertical direction. Furthermore, when the laminated conductor plate 700 is fixed to the positive electrode side connecting portion 506b and the negative electrode side connecting portion 504c of the capacitor module 500 with bolts or the like, the insulating sheet 517 and the insulating sheet 706 are connected to the laminated conductor plate 700 and the positive electrode side connecting portion 506b. It arrange | positions so that it may have the area | region which is not pinched | interposed by, ie, the area | region where a compressive stress is not added. Thereby, the insulation between the positive electrode and the negative electrode in the connection part, specifically, the insulation between the positive electrode side connection part 506b and the negative electrode conductor plate 704 can be ensured.

  Next, noise countermeasures in the power conversion apparatus according to the present embodiment will be described with reference to FIG. A low voltage battery 201, an external device 204, a battery 136, and a motor generator 192 are connected to the power conversion device 200. Further, the housing 12 of the power conversion device 200 is connected to the chassis ground 208 of the HEV 110 at the ground terminal 207.

  The low voltage battery 201 supplies power for operating the control circuit 172 to the control circuit 172 in the power converter 200. The low voltage battery 201 and the control circuit 172 are connected via a power line 202.

  The external device 204 is a device that outputs information for the control circuit 172 to generate a timing signal (PWM signal) to the control circuit 172. Information from the external device 204 is output to the control circuit 172 via the signal line 203. A timing signal generated by the control circuit 172 based on this information is output from the control circuit 172 to the driver circuit 174 via the signal line 176, and used for controlling the switching timing of the IGBTs 328 and 330 performed by the driver circuit 174.

  The battery 136 and the power conversion device 200 are connected via a shield cable 205. Motor generator 192 and power conversion device 200 are connected via shielded cable 206. One end of the shield of the shielded cables 205 and 206 is connected to the chassis ground 208 via the housing 12, and the other end is connected to the chassis ground 208 via the battery 136 or the motor generator 192. Yes. Therefore, noise generated by the current flowing through the shielded cables 205 and 206 is suppressed.

  On the other hand, the current flowing through the power line 202 connected to the low voltage battery 201 and the current flowing through the signal line 203 connected to the external device 204 are very small compared to the current flowing through the shielded cables 205 and 206. Therefore, noise can be sufficiently suppressed without using a shield structure.

  FIG. 19 is a block diagram illustrating a schematic configuration of the power conversion apparatus according to the present embodiment. In the power conversion device 200, the internal space of the housing 12 is divided into two by the metal base plate 11 as described above, the control circuit 172 is mounted in one space, and the driver circuit is mounted in the other space. 174, the power module 300 and the capacitor module 500 are mounted.

  The control circuit 172 includes an angle detection circuit 211, a current detection circuit 212, a transceiver 213, a power supply circuit 214, a microcontroller 215, and a filter 216. The angle detection circuit 211 detects the rotation angle of a motor generator 192 (not shown in FIG. 19) connected to the power conversion device 200. Current detection circuit 212 detects the amount of current flowing to motor generator 192. The transceiver 213 communicates with the external device 204 illustrated in FIG. 18 and receives information output from the external device 204. The power supply circuit 214 generates and supplies necessary power to each part of the control circuit 172 based on the power supplied from the low voltage battery 201 shown in FIG. The microcontroller 215 controls the operation of the angle detection circuit 211, the current detection circuit 212, the transceiver 213, and the power supply circuit 214, and generates a timing signal. The timing signal generated by the microcontroller 215 is output to the driver circuit 174 via the signal line 176 after the noise component is removed by the filter 216.

  The driver circuit 174 includes a power supply circuit 217, a temperature / voltage detection circuit 218, a gate signal generation circuit 219, and an insulating element 220. The power supply circuit 217 generates and supplies necessary power to each part of the driver circuit 174 based on the power supplied from the battery 136 shown in FIG. The temperature / voltage detection circuit 218 detects the temperature and voltage of the three upper and lower arm series circuits 150 included in the power module 300. The detection result is output to the microcontroller 215 of the control circuit 172, and is used for overtemperature protection and overvoltage protection of the upper and lower arm series circuit 150 performed by the control circuit 172. The gate signal generation circuit 219 controls a gate signal (drive) for controlling the switching operation of the IGBTs 328 and 330 included in the upper and lower arm series circuits 150 based on the timing signal from the microcontroller 215 transmitted through the insulating element 220. Signal) is generated and output to each of the upper and lower arm series circuits 150. The insulating element 220 transmits the timing signal from the microcontroller 215 to the gate signal generation circuit 219. At this time, the timing signal is transformed to the high voltage side and output as a high voltage signal. In the insulating element 220, the input side and the output side of the timing signal are insulated.

  The power module 300 has three upper and lower arm series circuits 150 respectively corresponding to the U phase, the V phase, and the W phase. Each upper and lower arm series circuit 150 switches the electric power from the battery 136 smoothed by the capacitor module 500 based on the gate signal from the gate signal generation circuit 219. Thus, three-phase AC power corresponding to the switching cycle is supplied to motor generator 192, and the rotation operation of motor generator 192 is controlled.

  In FIG. 19, signal lines through which low voltage signals flow are shown as thin lines, and lines through which high voltage signals flow are shown as thick lines. For example, a low voltage signal is about 1 to 15V, and a high voltage signal is about 15 to several hundred volts. The high-voltage signal line is preferably as short as possible in order to prevent generated noise and signal degradation during transmission.

  Next, the shape of the metal base plate 11 will be described. FIG. 20 is a plan view of the metal base plate 11, and FIG. 21 is a side view of the metal base plate 11. The metal base plate 11 is provided with a plurality of heat dissipation bosses 221 and openings 222. The heat radiating boss 221 is a protruding portion for releasing heat generated by the heat generating components (the power supply circuit 214, the microcontroller 215, etc. in FIG. 19) included in the control circuit 172 to the outside through the metal base plate 11. The positions and shapes of the heat radiating bosses 221 are formed so as to come into contact with the corresponding heat generating components when the control circuit 172 and the metal base plate 11 are attached to the housing 12. In other words, the power supply circuit 214 and the microcontroller 215 are arranged at positions corresponding to the heat dissipation boss 221 provided on the metal base plate 11 in the control circuit 172. Thereby, heat dissipation of the heat-generating component can be achieved, and vibration resistance can be improved. Furthermore, as described above, the metal base plate 11 is sandwiched and installed between the upper case 10 and the housing 12. Thereby, the heat from the heat-generating component on the control circuit 172 can be efficiently released to the housing 12 via the metal base plate 11, and the heat dissipation can be improved.

  The opening 222 is a part through which various cables connecting the control circuit 172 and the driver circuit 174 are passed. When the metal base plate 11 is attached to the housing 12, a gap is generated between the opening 222 and the inner surface of the housing 12. By passing the cable through this gap, the control circuit 172 and the driver circuit 174 are connected.

  If noise generated from the drive circuit 174 or the power module 300 leaks from the opening 222 and turns around to the control circuit 172 side, there is a risk of inconvenience such as malfunction of the control circuit 172. Therefore, in order to prevent such noise leakage, the size of the opening 222 is determined as follows. FIG. 22 is a graph showing the relationship between the frequency of the electromagnetic field and the shielding effect of the electromagnetic field by the metal base plate 11 when the size of the opening 222 is 72 mm. As shown in this graph, it can be seen that the shielding effect decreases as the frequency of the electromagnetic field increases. Here, in order to simplify the description, an example in which the electromagnetic field is a plane wave is shown by the graph in FIG.

  23, 24, and 25 are diagrams illustrating a state in which a difference in electromagnetic shielding effect due to a difference in size of the opening 222 is analyzed by a three-dimensional electromagnetic field simulation. FIG. 23 shows an analysis model when the opening 222 is relatively large, and FIG. 24 shows an analysis model when the opening 222 is relatively small. 23 and 24, the control circuit board 20 on which the control circuit 172 is arranged, the metal base plate 11 provided with a plurality of openings 222, and the noise generation source 223 are arranged in the housing 12. Has been. 23 and 24, (a) is a three-dimensional view showing the internal arrangement of the housing 12, (b) is a cross-sectional view of the housing 12 as viewed from above, and (c) is the housing 12 from the lateral direction. FIG.

  The analysis result of the electric field strength distribution obtained by the analysis model shown in FIGS. 23 and 24 is shown in FIG. FIGS. 25A and 25B are analysis results when the frequency of noise generated from the noise generation source 223 is 10 MHz, FIG. 25A is the analysis result of the analysis model of FIG. 24, and FIG. The analysis results by the analysis model of FIG. 23 are shown respectively. FIGS. 25C and 25D are analysis results when the frequency of noise generated from the noise generation source 223 is 300 MHz. FIG. 25C is an analysis result based on the analysis model of FIG. The analysis results by the analysis model of FIG. 23 are shown respectively. 25 (e) and (f) are analysis results when the frequency of noise generated from the noise generation source 223 is 1 GHz. FIG. 25 (e) is an analysis result based on the analysis model of FIG. The analysis results by the analysis model of FIG. 23 are shown respectively. Note that the frequency of noise generated by the noise generation source 223 is determined according to the carrier frequency of the drive signal output from the driver circuit 174 to the IGBTs 328 and 330.

  Comparing the above analysis results, the electric field strength above the metal base plate 11 is about ½ (−6 dB) in FIG. 25B compared to FIG. Similarly, the electric field strength above the metal base plate 11 in FIG. 25C is also lower by about 6 dB than that in FIG. However, when the electric field strength above the metal base plate 11 in FIG. 25 (e) and FIG. 25 (f) is compared, the difference is less than 6 dB. From these comparison results, it can be seen that when the opening 222 is small, the shielding effect of the electromagnetic field is increased, but when the frequency is about 1 GHz, the shielding effect is lowered. The size of the opening 222 in the metal base plate 11 is determined in consideration of the electromagnetic field shielding effect according to the frequency as described above.

  The size of the opening 222 may be determined in consideration of the secondary radiation efficiency from the opening 222, that is, the electromagnetic field leakage when the opening 222 has a half wavelength of noise. . In addition, the size of the opening 222 may be determined in consideration of the frequency of noise generated by other devices mounted on the HEV 110 together with the power conversion device 200. As a result, for example, the size of the opening 222 is determined to be 47 mm or less.

  Further, in order to reduce noise leakage from the driver circuit 174 and the power module 300 to the control circuit 172, the driver circuit 174 and the control circuit board 20 (control circuit 172) according to the carrier frequency of the drive signal output to the IGBTs 328 and 330. The distance between the drive circuit boards 22 (driver circuits 174) may be determined. For example, the distance between the control circuit 172 and the driver circuit 174 is determined so as to be less than ½ of the reciprocal of the carrier frequency of the drive signal, that is, less than a half wavelength of the carrier wave.

  An opening 222 as shown in FIG. 26 may be provided in the metal base plate 11. Here, the connector 230 is mounted on the control circuit board 20 (control circuit 172), and the signal line 176 is extended from the connector 230 to be connected to the drive circuit board 22 (driver circuit 174). Further, a protrusion 231 is provided inside the housing 12 so that the signal line 176 passes through the opening 222 and the gap between the metal base plate 11 and the protrusion 231. In this way, the electromagnetic field blocking effect can be further enhanced. If the width of the gap between the metal base plate 11 and the protrusion 231 at this time is a, the cutoff frequency fc of the electromagnetic field due to this gap is expressed as fc = c / {2π / (π / a)}. Here, c represents the speed of light, and π represents the circumference.

  Alternatively, the control circuit 172 and the driver circuit 174 may be directly connected without using the signal line 176 by a method as shown in FIG. The through connector 232 shown in FIG. 27A has a base 233, a plurality of connection pins 234 extending upward from the base 233, and a plurality of connection pins 235 extending downward from the base 233. Corresponding connection pins 234 and connection pins 235 are electrically connected to each other via a base 233. Such a through connector 232 is attached to the metal base plate 11 through the opening 222 as shown in FIG. Then, the control circuit board 20 (control circuit 172) is connected to the connection pins 234 of the through connector 232, and the drive circuit board 22 (driver circuit 174) is connected to the connection pins 235. At this time, as shown in FIG. 27C, the connection pins 234 and 235 are inserted into the through holes provided in the control circuit board 20 and the drive circuit board 22, respectively, and soldering is performed as indicated by reference numeral 236. . Thereby, the control circuit 172 and the driver circuit 174 are electrically connected. In this way, the assembly process can be simplified and the manufacturing cost can be reduced.

  Alternatively, a connector for connection is mounted on each of the control circuit 172 and the driver circuit 174, and the two connectors are fitted to each other with the metal base plate 11 interposed therebetween, so that the control circuit 172 and the driver circuit 174 are electrically connected. You may make it do. Even if it does in this way, like the connection method shown in FIG. 27, an assembly process can be simplified and reduction of manufacturing cost can be aimed at.

  According to the embodiment described above, the following effects can be obtained.

(1) In the power conversion device 200, the internal space of the metal housing 12 is divided into two spaces by the metal base plate 11. A control circuit 172 is mounted in one space, and a driver circuit 174 and a power module 300 are mounted in the other space. Since it did in this way, the noise which has a bad influence on operation | movement of the power converter device 200 can be reduced.

(2) The driver circuit 174 is mounted between the control circuit 172 and the power module 300. Thereby, it is possible to prevent the noise generated by the power module 300 from affecting the operation of the driver circuit 174.

(3) The distance between the control circuit 172 and the driver circuit 174 can be determined according to the carrier frequency of the drive signal output from the driver circuit 174. In this way, leakage of noise generated from the driver circuit 174 and the power module 300 to the control circuit 172 can be reduced.

(4) In the power conversion device 200, the connector 21 passes through the housing 12, reaches the space where the control circuit 172 is mounted, and is connected to the control circuit 172. Further, the direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512 penetrate the housing 12 and are mounted with the driver circuit 174 and the power module 300 among the two spaces. Reach the space. Since it did in this way, the noise which penetrate | invades into the housing | casing 12 from the direct current (battery) negative electrode side connection terminal part 510 and the direct current (battery) positive electrode side connection terminal part 512, and propagates to the connector 21 can be reduced. .

(5) The connector 21, the direct current (battery) negative electrode side connection terminal portion 510, and the direct current (battery) positive electrode side connection terminal portion 512 are respectively disposed on the side surfaces of the housing 12 facing each other. Therefore, further noise reduction can be achieved.

(6) In the power conversion device 200, the control circuit 172 and the driver circuit 174 can be directly connected without passing through the signal line 176. That is, the control circuit 172 and the connection pin 234 of the through connector 232 are connected, and the driver circuit 174 and the connection pin 235 of the through connector 232 are connected, so that the control circuit 172 and the driver circuit 174 are electrically connected. It may be connected. At this time, the through connector 232 penetrates the metal base plate 11. The connection pin 234 is provided on the space side where the control circuit 172 is mounted in the two spaces, and the connection pin 235 is mounted on the driver circuit 174 and the power module 300 in the two spaces. Provided on the space side. If it does in this way, the assembly process of power converter 200 can be simplified and reduction of manufacturing cost can be aimed at.

(7) Alternatively, the control circuit 172 and the driver circuit 174 may be electrically connected by fitting a connector included in the control circuit 172 and a connector included in the driver circuit 174. Even if it does in this way, an assembly process can be simplified similarly to the above, and the reduction of manufacturing cost can be aimed at.

(8) The direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512 are disposed at a position closer to the capacitor module 500 than the power module 300 in the housing 12. Since it did in this way, the noise by the direct-current power from the battery 136 input into the capacitor | condenser module 500 through the direct current (battery) negative electrode side connection terminal part 510 and the direct current (battery) positive electrode side connection terminal part 512 is sent to the power module 300. The effect on it can be reduced.

(9) The AC terminal 18 is disposed on the side surface of the housing 12 facing the side surface of the housing 12 closest to the positive electrode side capacitor terminal 504 and the negative electrode side capacitor terminal 506. Thus, the AC power output from the power module 300 via the AC terminal 18 and the DC power input from the battery 136 via the capacitor module 500, the positive capacitor terminal 504 and the negative capacitor terminal 506 are mutually Can be prevented from adversely affecting each other.

(10) In the power conversion device 200, the cooling water channel 19 for flowing cooling water is installed between the power module 300 and the capacitor module 500. Thereby, the power module 300 and the capacitor module 500 can be efficiently cooled.

(11) The capacitor module 500 is a power module via the positive-side capacitor terminal 504 and the negative-side capacitor terminal 506 provided in the space in which the driver circuit 174 and the power module 300 are mounted among the two spaces. 300 is connected. The positive side capacitor terminal 504 and the negative side capacitor terminal 506 pass through a through hole 406 formed between the cooling water flow path 19 and the side surface of the housing 12. Since it did in this way, while arranging electrical wiring in order, the power converter device 200 can be reduced in size, and an electrical connection structure can be simplified and productivity and reliability of the power converter device 200 can be improved.

(12) The metal base plate 11 is sandwiched and installed between the upper case 10 and the housing 12. Therefore, the heat from the heat-generating component on the control circuit 172 can be efficiently released to the housing 12 via the metal base plate 11, and the heat dissipation can be improved.

(13) The microcomputer 215 on the control circuit 172 is disposed at a position corresponding to the heat dissipation boss 221 provided on the metal base plate 11 in the control circuit 172. Thereby, heat dissipation of the microcomputer 215 can be achieved, and the vibration resistance of the power conversion device 200 including the control circuit 172 can be improved.

(14) The metal base plate 11 is provided with an opening 430, and a metal partition plate 440 is installed adjacent to the opening 430. The partition plate 440 cooperates with the metal base plate 11 to divide the internal space of the housing 12 into two spaces. In addition, at least a part of the connector 21 is located between the opening 430 and the partition plate 440. Since it did in this way, the space in which the control circuit 172 is mounted among the two spaces can be expanded in a direction perpendicular to the surface of the metal base plate 11, and the connector 21 and the control circuit 172 can be connected. .

  Note that it is possible to combine one or a plurality of the embodiments and the modified examples described above. Any combination of the modified examples is possible.

  The above description is merely an example, and the present invention is not limited to the configuration of the above embodiment.

9... Cooling section, 10... Upper case, 11... Metal base plate, 12. Inlet piping, 14 ... Cooling water outlet piping, 16 ... Lower case, 17 ... AC terminal case, 18 ... AC terminal, 19 ... ... Cooling water flow path, 20 ... Control circuit board, 21 ... Connector, 22 ... Drive circuit board, 23 ... Inter-board connector, 43・ ・ ・ ・ ・ ・ Inverter for auxiliary equipment, 110 ・ ・ ・ ・ ・ ・ Hybrid electric vehicle, 112 ・ ・ ・ ・ ・ ・ Front wheel, 114 ・ ・ ・ ・ ・ ・ Front axle, 116 ・ ・ ・ ・ ・ ・ Front wheel Side DEF, 118 ... Transmission, 120 ... Engine, 122 ... Power distribution mechanism, 123 130... Gears, 136... Battery, 138... DC connector, 140, 142 .. Inverter device, 144. 150... Series circuit of upper and lower arms, 153... Collector electrode of upper arm, 154... Gate electrode terminal of upper arm, 155. Signal emitter electrode terminal, 156... Upper arm diode, 157... Positive electrode (P) terminal, 158... Negative electrode (N) terminal, 159.・ AC terminal, 163... Lower arm collector electrode, 164... Lower arm gate electrode terminal, 165... Lower arm signal emitter electrode terminal, 166. .... Lower arm diodes, 169 ... ..Intermediate electrode, 170... Controller, 172... Control circuit, 174... Driver circuit, 176. .... Detector, 182 ... Signal line, 186 ... AC power line, 188 ... AC connector, 192 ... Motor generator, 194 ... ··· Motor generator, 195 ··· Motor (auxiliary = air conditioner, oil pump, cooling pump), 200 · · · Power converter, 201 · · · Low voltage battery, 202 · · ...... Power supply line, 203 ... Signal line, 204 ... External equipment, 205, 206 ... Shield cable, 207 ... Ground terminal, 208 ・ ・ ・ ・ ・ ・ Chassis ground, 211 ・ ・ ・ ・ ・ ・ Angle detection Circuit 212, Current sensing circuit 213 Transceiver 214 Power circuit 215 Microcontroller 216 Filter 217 ... Power supply circuit, 218 ... Temperature / voltage detection circuit, 219 ... Gate signal generation circuit, 220 ... Insulation element, 221 ... ... Heat dissipation boss, 222 ... Open, 223 ... Noise generating source, 230 ... Connector, 231 ... Projection, 232 ...・ ・ ・ Penetration connector, 233 ・ ・ ・ ・ ・ ・ Base, 234,235 ・ ・ ・ ・ ・ ・ Connection pin, 236 ・ ・ ・ ・ ・ ・ ・ ・ Solder, 300 ・ ・ ・ ・ ・ ・ Power module (semiconductor module), 302 ... Power module case, 304 ...・ ・ Metal base, 305 ・ ・ ・ ・ ・ ・ Fin, 306 ・ ・ ・ ・ ・ ・ AC bus bar, 308 ・ ・ ・ ・ ・ ・ U phase AC bus bar, 310 ・ ・ ・ ・ ・ ・ V phase AC bus bar, 312 ... W-phase AC bus bar, 314 ... DC positive terminal, 315 ... Positive conductor plate, 316 ... DC negative terminal, 317 ... Negative electrode conductor plate, 318 ... Insulating paper, 320 ... Power module control terminal, 322 ... Chip protection resin or silicone gel, 324 ... AC bus bar Holding (positioning) pins, 326... IGBT, 328... Upper arm IGBT, 329... Conductor, 330... Lower arm IGBT 331・ ・ ・ ・ ・ ・ Conductor, 333 ・ ・ ・ ・ ・ ・ Conductor, 33 4 .... Insulating substrate, 335 ... Inductance component (equivalent circuit), 337 ... Conductor, 338 ... Current flow, 339 ... · Junction (for DC positive bus bar), 340 ··· Eddy current, 341 ··· Joint (for DC negative bus bar), 350, 360, 370 ······, 351 361 ······· Bolt head 380 ········································································ ······· Opening portion, 403 ···································································································・ ・ ・ ・ ・ Supporting part, 412 ・ ・ ・ ・ ・ ・ Bolt hole (for fixing power joule), 414 ・ ・ ・ ・ ・ ・ Bolt hole (power Joule fixing), 416... Bolt hole (for water channel cover fixing), 418... Refrigerant flow (inflow direction), 420... Cover, 421.・ ・ Refrigerant flow (U-turn part), 422 ・ ・ ・ ・ ・ ・ Refrigerant flow (outflow direction), 430 ・ ・ ・ ・ ・ ・ Opening part, 440 ・ ・ ・ ・ ・ ・ Partition plate, 500.・ ・ ・ Capacitor module, 502 ···· Capacitor case, 504 ···· Negative capacitor terminal, 505 ···· Negative conductor plate, 506 ···· Positive capacitor terminal 507 ········ Positive conductor plate, 508 ···· Conductive material, 509 ···· Opening (for terminal fixing), 510 ··· Direct current (battery) negative electrode side Connection terminal part, 511 ··· Opening part (for terminal fixing), 512 ··· Direct (Battery) Positive side connection terminal portion 514... Capacitor cell 515... Film capacitor 516... Terminal 517. ... Terminals, 520 ... Terminal cover, 522 ... Filler, 532 ... Auxiliary positive terminal, 534 ... Auxiliary equipment Negative terminal, 600 ... collector current, 602 ... gate voltage waveform at turn on, 604 ... collector voltage waveform at turn on, 606 ... collector current at turn on Waveform, 608 ... Diode, 610 ... Inductance load, 612 ... Return, 614 ... Current peak, 616 ... Miller period, 618 ・ ・ ・ ・ ・ ・ Current flow (positive side ), 620... Current flow (negative side), 622... Gate voltage waveform at turn-off, 624... Collector current waveform at turn-off, 626. Collector voltage waveform at turn-off, 628... Voltage peak, 700... Laminated conductor plate, 702... Positive side conductor plate, 704. , 800,802 ・ ・ ・ ・ ・ ・ O-ring

Claims (13)

A metal housing,
A metal base plate for dividing the internal space of the housing into a first space and a second space;
A control circuit that has a microcomputer and outputs a control signal based on a result of an operation performed by the microcomputer;
A driver circuit that outputs a drive signal based on a control signal output from the control circuit;
A power module having a switching element that performs a switching operation based on a drive signal output from the driver circuit ;
A first connection part penetrating the base plate and provided on the first space side, and a second connection provided on the second space side electrically connected to the first connection part A through connector having a portion ,
The control circuit is mounted in the first space, the driver circuit and the power module are mounted in the second space ,
The driver circuit is mounted between the control circuit and the power module,
The distance between the control circuit and the driver circuit is determined according to the carrier frequency of the drive signal,
The control circuit and the driver circuit are electrically connected by connecting the control circuit and the first connection part and connecting the driver circuit and the second connection part. The power converter characterized by the above-mentioned. A metal housing,
A metal base plate for dividing the internal space of the housing into a first space and a second space;
A control circuit that has a microcomputer and outputs a control signal based on a result of an operation performed by the microcomputer;
A driver circuit that outputs a drive signal based on a control signal output from the control circuit;
A power module having a switching element that performs a switching operation based on a drive signal output from the driver circuit,
The control circuit is mounted in the first space, the driver circuit and the power module are mounted in the second space,
The driver circuit is mounted between the control circuit and the power module,
The distance between the control circuit and the driver circuit is determined according to the carrier frequency of the drive signal,
The power conversion, wherein the control circuit and the driver circuit are electrically connected by fitting a first connector of the control circuit and a second connector of the driver circuit. apparatus. A metal housing,
A metal base plate for dividing the internal space of the housing into a first space and a second space;
A control circuit that has a microcomputer and outputs a control signal based on a result of an operation performed by the microcomputer;
A driver circuit that outputs a drive signal based on a control signal output from the control circuit;
A power module having a switching element that performs a switching operation based on a drive signal output from the driver circuit,
The control circuit is mounted in the first space, the driver circuit and the power module are mounted in the second space,
The driver circuit is mounted between the control circuit and the power module,
The distance between the control circuit and the driver circuit is determined according to the carrier frequency of the drive signal,
The base plate is provided with an opening having a size corresponding to the carrier frequency of the drive signal,
The power conversion device, wherein the control circuit and the driver circuit are electrically connected via a signal line passing through the opening. The power conversion device according to claim 3,
A protrusion is provided on the inside of the housing,
The power converter according to claim 1, wherein the signal line passes through a gap between the base plate and the protrusion. In the power converter according to any one of claims 1 to 4 ,
A control connector connected to the control circuit, penetrating the housing and reaching the first space;
A power conversion device comprising: a DC input terminal for inputting DC power that passes through the housing and reaches the second space. In the power converter according to any one of claims 1 to 4 ,
A control connector connected to the control circuit;
DC input terminal for inputting DC power,
The power converter according to claim 1, wherein the control connector and the DC input terminal are respectively disposed on side surfaces of the casing facing each other. In the power converter according to any one of claims 1 to 4 ,
A capacitor module for smoothing input DC power and supplying it to the switching element;
A DC input terminal for inputting the DC power to the capacitor module;
The power converter according to claim 1, wherein the DC input terminal is disposed at a position closer to the capacitor module than the power module in the housing. In the power converter according to any one of claims 1 to 4 ,
An AC output terminal connected to the power module and outputting AC power to the outside;
A capacitor module that is connected to the power module via a terminal provided in the second space, and that smoothes the input DC power and supplies it to the switching element;
The AC output terminal is disposed on a side surface of the casing that faces a side surface of the casing that is closest to the terminal portion. In the power converter according to any one of claims 1 to 4 ,
A capacitor module for smoothing input DC power and supplying it to the switching element;
A power converter, further comprising a cooling water flow path for flowing cooling water, which is installed between the power module and the capacitor module. The power conversion device according to claim 9 , wherein
The capacitor module is connected to the power module via a terminal portion provided in the second space,
The power converter according to claim 1, wherein the terminal portion passes through a through hole formed between the cooling water flow path and a side surface of the housing. In the power converter according to any one of claims 1 to 4 ,
The housing has an upper housing and a lower housing,
The power converter according to claim 1, wherein the base plate is interposed between the upper casing and the lower casing. In the power converter according to any one of claims 1 to 4 ,
The said microcomputer is arrange | positioned in the position corresponding to the thermal radiation boss | hub provided in the said base board in the said control circuit. In the power converter according to any one of claims 1 to 4 ,
A metal partition plate installed adjacent to an opening provided in the base plate and dividing the internal space of the housing into a first space and a second space in cooperation with the base plate;
A control connector connected to the control circuit, penetrating the housing and reaching the first space;
At least a part of the control connector is located between the opening and the partition plate.

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