JP5696314B2 - Capacitor unit - Google Patents

Description

  The present invention relates to a capacitor unit used in various electronic devices.

  As a capacitor, there is a capacitor configured to dissipate heat generated by energization by a heat dissipating component (for example, see Patent Document 1). An example is shown in FIG.

  The capacitor 9 shown in the figure has a heat radiating member 92 fixed to an outer bottom surface 91 </ b> A of a resin case 91 containing a capacitor element 90. A pair of electrode plates 93 and 94 are disposed between the inner bottom surface 91 </ b> B of the resin case 91 and the capacitor element 90. The pair of electrode plates 93 and 94 are stacked via an insulating layer 95. These electrode plates 93 and 94 include main body portions 93A and 94A, internal connection terminals 93B (94B), and external connection terminals 93C (94C).

  The main body portions 93 </ b> A and 94 </ b> A are portions below the capacitor element 90 and are in contact with the insulating layer 95. The internal connection terminal 93B (94B) is a part connected to the electrode 96 of the capacitor element 90. The external connection terminal 93 </ b> C (94 </ b> C) is a portion connected to an external device and extends from the case 91.

JP 2007-134612 A

  In the capacitor 9 described in Patent Document 1, the heat generated by the capacitor element 90 and the heat generated at the body portions 93A and 94A and the internal connection terminals 93B (94B) of the electrode plates 93 and 93 are efficiently radiated by the heat radiating member 92. Can do.

  On the other hand, since the external connection terminal 93C (94C) is pulled out from the case 91 and is far away from the heat dissipation member 92, the heat dissipation effect by the heat dissipation member 92 cannot be expected. Further, since the external connection terminal 93C (94C) is connected to an external device, the external connection terminal 93C (94C) may be affected by the heat generated by the external device, and it is difficult to efficiently dissipate heat in that respect.

  In view of the above problems, an object of the present invention is to provide a capacitor unit that can efficiently dissipate heat generated from an electrode such as an electrode plate while reducing inductance.

  The capacitor unit according to the present invention is a capacitor unit in which a plurality of capacitor elements are connected to each other and housed in a case. The plurality of capacitor elements are anode plates that connect end faces located on one terminal side of each capacitor element to each other. And the cathode plate connecting the end faces located on the other terminal side of each capacitor element to each other, and the anode plate and the cathode plate are close to each other along the inner bottom surface of the case with the insulating plate interposed therebetween. The case is opened in such a manner that one side is opened so that the plurality of capacitor elements can be accommodated, the other end side is finished to have a bottom, and the anode plate and the cathode plate are respectively connected to terminals outside the unit. Connected to the anode lead and cathode lead, the anode lead and cathode lead are provided so that part of them protrudes from the inside of the case to the outer bottom surface of the case It is, so as to surround said anode lead and the cathode lead, the cooler is characterized in that provided in contact with the outer bottom surface of the case.

  According to such a configuration, the P electrode plate and the N electrode plate are disposed adjacent to each other with the insulating plate interposed therebetween so as to cover a part of the element excluding the end face of each capacitor element. Low inductance can be achieved.

  Moreover, the P electrode plate and the N electrode plate are arranged along the inner bottom surface of the case, and the cooler is provided in contact with the outer bottom surface of the case. That is, the electrode plate and the cooler are arranged to face each other with the outer bottom surface and the inner bottom surface (bottom wall) of the case interposed therebetween. Therefore, the cooler can efficiently cool the electrode plate through the outer bottom surface and the inner bottom surface of the case (via the bottom wall) and suppress the heat generation of the capacitor unit. In order to obtain such an effect more reliably, the cooler is preferably provided so as to cover the entire bottom surface of the case.

  Preferably, each of the plurality of capacitor elements is formed in a flat shape, and the plurality of capacitor elements are arranged in a line so that the major axis directions of the end faces of the capacitor elements are aligned. The plurality of capacitor element rows are arranged and stored in the case so that the end surfaces of the capacitor elements constituting each capacitor element row face each other.

  According to such a configuration, it is possible to reduce the inductance of the capacitor unit and suppress the temperature rise while compactly housing a plurality of capacitor elements in the case. In particular, since the capacitor elements constituting the capacitor element array are arranged in a line so that the major axis directions of the end faces coincide with each other, the height of the case is set to the length in the minor axis direction of the end face of the flat capacitor element. It is possible to provide a capacitor unit having a low inductance, a high-efficiency cooling structure, and a low profile.

  In the capacitor according to the present invention, the anode plate and the cathode plate are provided for each capacitor element array, and the anode lead and the cathode lead are connected to the anode plate and the cathode plate, respectively, The cooler may be provided so as to surround the external connection portion, having external connection portions that are connected to terminals outside the unit and are spaced apart from each other.

  According to such a configuration, since the cooler is provided so as to surround the external connection portion, the external connection portion is independently cooled, and the temperature rise of the capacitor unit can be effectively suppressed.

  Preferably, a resin portion formed of a resin filled between the plurality of capacitor elements is provided.

  According to such a configuration, it is possible to securely fix each of the plurality of capacitor elements housed in the case, increase the thermal conductivity from each capacitor element to the cooler, and improve the heat dissipation efficiency.

  As the cooler, for example, water cooling, oil cooling, or air cooling can be used. The cooler has, for example, an inlet and an outlet, and is configured to discharge the cooling medium flowing in from the inlet to the outlet. In this case, the cooler is preferably provided so as to cover the entire bottom surface of the case. Since such a cooler can be achieved with a simple configuration, an increase in cost due to the adoption of the cooler can be suppressed.

  According to the present invention, it is possible to efficiently cool the electrode plate and suppress the heat generation of the capacitor unit while reducing the inductance.

1 is an overall perspective view showing a capacitor unit according to the present invention. It is sectional drawing which follows the II-II line of FIG. It is the perspective view which showed the several capacitor | condenser element which fixed the internal electrode with the lead electrode. FIG. 4 is an exploded perspective view of FIG. 3. It is a whole perspective view of the state where the 2nd electrode was fixed to the case. It is the whole perspective view which looked at the case shown in FIG. 5 from the back surface. It is sectional drawing which follows the VII-VII line of FIG. It is a disassembled perspective view of an internal electrode. It is sectional drawing which expanded and showed the principal part of FIG. (A) is sectional drawing which follows the Xa-Xa line | wire of FIG. 3, (b) is sectional drawing which follows the Xb-Xb line | wire of FIG. It is a disassembled perspective view of a cooler. It is sectional drawing of the cooler corresponding to the part which follows the XII-XII line | wire of FIG. It is sectional drawing which shows an example of the conventional capacitor | condenser.

  Embodiments of the present invention will be described below with reference to the drawings.

  As shown in FIGS. 1 and 2, the capacitor unit 1 includes a capacitor body 2 and a cooler 3.

  As shown in FIG. 2, the capacitor body 2 includes a plurality of capacitor elements 4, a case 5, a plurality of internal electrodes 6, and a pair of lead electrodes 7.

  As shown in FIG. 3 and FIG. 4, the plurality of capacitor elements 4 are integrated by the internal electrode 6 as a capacitor element array as a group.

  As shown in FIG. 2, the plurality of capacitor elements 4 are accommodated in the case 5 in an aligned state and are encapsulated by the sealing resin portion 10.

  As shown in FIG. 4, each capacitor element 4 has an anode 41 and a cathode 42 formed so as to cover the entire end face. An example of the capacitor element 4 is a metallized film capacitor element.

  For example, a metallized film capacitor is formed by winding a plurality of metallized films, each having an insulating region having a predetermined width along a side edge, in a state where the respective insulating regions do not overlap with each other. The anode 41 and the cathode 42 are provided on the end surface constituted by the side surface of the fluorinated film.

  In addition, a metallized film capacitor is obtained by laminating a plurality of metallized films so that their insulating regions do not overlap each other, and providing an electrode on the end surface constituted by the side surfaces of each metallized film after lamination. May be.

  The metallized film can be formed, for example, by vapor-depositing a metal (for example, aluminum or zinc) so that an insulating region (non-metal region) having a predetermined width is provided on one surface of the dielectric film.

  The metallized film may be formed by attaching a metal foil (for example, an aluminum foil, a tin foil, or a copper foil) to one side of the dielectric film instead of depositing a metal.

  As a material for the dielectric film, for example, polypropylene (PP), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), or polyethylene naphthalate (PEN) can be used.

  The anode 41 and the cathode 42 are formed as, for example, a metallicon electrode. The metallicon electrode can be formed by metal spraying. This metal spraying method is a plating method in which molten metal is atomized with compressed air and sprayed onto the surface of an article.

  The anode 41 and the cathode 42 can be formed by adopting various known film forming methods instead of the metal spraying method, and are not necessarily metallized electrodes.

  Of course, in the capacitor unit 1, the capacitor element 4 is not limited to the metallized film capacitor but may be another known capacitor.

  As shown in FIGS. 2, 5, and 6, the case 5 accommodates the capacitor element 4 and the internal electrode 6 and holds the lead electrode 7.

  The case 5 has a peripheral wall 51 extending from a rectangular base 50, a plurality of projecting portions 52, and arm portions 53, and these portions 51 to 54 are integrally formed by resin molding.

  The peripheral wall 51, together with the base 50, defines a space for accommodating the capacitor element 4 and the internal electrode 6. The peripheral wall 51 extends vertically or substantially vertically from the peripheral edge of the base 50.

  The plurality of projecting portions 52 hold first external connection portions 75 and 76 of the lead electrode 7 described later, and are used for positioning the cooler 3. The protruding portion 52 protrudes on the side opposite to the peripheral wall in the base 50.

  The arm portion 53 holds second external connection portions 77 and 78 of the lead electrode 7 described later. The arm portion 53 extends laterally from the peripheral wall 51.

  As shown in FIGS. 3 and 7, the plurality of internal electrodes 6 are connected to the anode 41 or the cathode 42 of the capacitor element 4 while being connected to the lead electrode 7 (the anode lead 71 and the cathode lead 72). Is.

  As shown in FIGS. 8 and 9, each internal electrode 6 includes an anode plate 61 and a cathode plate 62, and an insulating plate 63 is interposed between the anode plate 61 and the cathode plate 62 so as to be insulated. Is secured.

  Each of the plurality of internal electrodes 6 is connected to the four capacitor elements 4 and is spaced apart from each other to ensure an insulation state between the internal electrodes 6. Each internal electrode 6 is accommodated in the case 5 so as to be positioned between the capacitor element 4 and the base 50 of the case 5 in a state in which the insulation state with the other internal electrodes 6 is maintained (FIG. 2). And FIG. 3).

  The anode plate 61 has a main body portion 64, an element connection portion 65, and a lead electrode connection portion 66.

  The main body 64 is formed in a plate shape having a long rectangular shape, and covers the side surfaces of the four capacitor elements 4 in series (see FIG. 3).

  The element connection portion 65 is a portion connected to the anode 41 of the capacitor element 4 and has a base portion 65A and a plurality of connection pieces 65B. The element connection portion 65 extends vertically or substantially vertically from one side edge of the main body portion 64.

  The base portion 65 </ b> A extends along the side edge of the main body portion 64. The plurality of connection pieces 65B includes two connection pieces 65B as a pair, and includes four pairs of connection pieces 65B, and is composed of a total of eight connection pieces 65B.

  Each pair of connection pieces 65 </ b> B is connected to the anode 41 of one capacitor element 4 corresponding to each pair. Each connection piece 65B and the capacitor element 4 are connected using a conductive metal such as solder.

  As shown in FIG. 8, the lead electrode connection portion 66 is a portion connected to the anode lead 71 of the lead electrode 7 and extends laterally from the other side edge of the main body portion 64. The lead electrode connecting portion 66 extends in a direction perpendicular to the extending direction of the element connecting portion 65 with respect to the main body portion 64, and has a through hole 66A.

  As shown in FIGS. 8 and 9, the cathode plate 62 is basically in the same form as the anode plate 61, and has a main body portion 67, an element connection portion 68, and a lead electrode connection portion 69.

  The main body portion 67 is formed in a plate shape having a long rectangular shape, and covers the main body portion 64 of the anode plate 61 via the insulating plate 63.

  The element connection portion 68 is a portion connected to the capacitor element 4 and has a base portion 68A and a plurality of connection piece pairs 68B. The element connection portion 68 extends vertically or substantially vertically from one side edge of the main body portion 67.

  The base portion 68 </ b> A extends along the side edge of the main body portion 67. The plurality of connection pieces 68B include four pairs of connection pieces 68B with two connection pieces 68B as a pair, and are composed of a total of eight connection pieces 68B.

  Each pair of connection pieces 68B is connected to the cathode 42 of one capacitor element 4 corresponding to each pair. Each connection piece 68B and the capacitor element 4 are connected using, for example, a conductor metal such as solder.

  As shown in FIG. 8, the lead electrode connecting portion 69 is a portion connected to a cathode lead 72 of the lead electrode 7 described later, and extends from one side edge of the main body portion 67 to the side. That is, the lead electrode connecting portion 69 extends from the same side edge as the element connecting portion 68. The lead electrode connecting portion 69 extends in a direction perpendicular to the extending direction of the element connecting portion 68 with respect to the main body portion 67, and the lead electrode connecting portion 66 of the anode plate 61 is on the side edge of the main body portions 64 and 67. The through holes 69 </ b> A are provided.

  As shown in FIGS. 3, 10 (a), and 10 (b), the pair of lead electrodes 7 is used for electrical connection between the capacitor element 4 and an external device via the internal electrode 6. And connected to the internal electrode 6. The pair of lead electrodes 7 includes an anode lead 71 and a cathode lead 72 and is fixed to the case 5.

  These leads 71 and 72 have a similar form and are substantially mirror images of each other. The anode lead 71 has an internal connection portion 73 and a plurality of external connection portions 75 and 77, and the cathode lead 72 has an internal connection portion 74 and a plurality of external connection portions 76 and 78. The plurality of external connection portions 75, 76, 77, 78 are embedded in the case 5 except for the end portions 75B, 76B, 77B, 78B (see FIGS. 2 and 5).

  As shown in FIGS. 3 and 4, the internal connection portions 73 and 74 are portions connected to the internal electrode 6, and are arranged so as to cross the internal electrode 6.

  The internal connection portions 73 and 74 are formed with through holes 73A and 74A at positions corresponding to the through holes 66A and 69A of the lead electrode connection portions 66 and 69 of the internal electrode 6, respectively. As shown in FIGS. 7 and 10, a bolt B1 is inserted through the through holes 73A and 74A. The bolt B1 is insert-molded in the base 50 of the case 5 although it does not clearly appear on the drawing.

  As shown in FIG. 2, the internal electrode 6 is fixed to the lead electrode 7 and thus the case 5 by fastening the bolt B1 with the nut N1 with the bolt B1 inserted into the through holes 66A and 69A. Since the internal electrode 6 is fixed to the plurality of capacitor elements 4 in advance, the capacitor element 4 is fixed to the case 5 together with the internal electrodes 6. At this time, the internal electrode 6 is located between the base 50 of the case 5 and the capacitor element 4.

  Thus, in the capacitor unit 1, the capacitor element 4 and the internal electrode 6 can be easily incorporated into the case 5.

  As shown in FIGS. 3, 10 (a), and 10 (b), the plurality of external connection portions 75 to 78 include first external connection portions 75 and 76 and second external connection portions 77 and 78.

  As shown in FIG. 2, the first external connection portions 75 and 76 extend from the internal connection portions 73 and 74 at positions corresponding to the protruding portions 52 of the case 5. The first external connecting portions 75 and 76 are connecting portions 75A and 76A that stand up and extend from the internal connecting portions 73 and 74, and the surfaces of the anode plate 61 and the cathode plate 62 of the internal electrode 6 from the connecting portions 75 and 76. End portions 75B and 76B extending in the plane direction parallel to the.

  The connecting portions 75A and 76A are embedded in the protruding portion 52. On the other hand, the end portions 75B and 76B are exposed from the protruding portion 52. The end portions 75B and 76B constitute terminals of the capacitor unit 1.

  As can be seen from FIGS. 4 and 5, the second external connection portions 77 and 78 extend from the internal connection portions 73 and 74 at positions corresponding to the arm portions 53 of the case 5. The second external connection portions 77 and 78 have connecting portions 77A and 78A extending in accordance with the shape of the arm portion 53, and end portions 77B and 78B extending in a planar direction from the connecting portions 77A and 78A.

  The connecting portions 77A and 78A are embedded in the arm portion 53. On the other hand, the end portions 77B and 78B are exposed from the arm portion 53. The end portions 77B and 78B constitute terminals of the capacitor unit 1.

  As shown in FIGS. 2 and 4, the end portions 75B and 76B of the first external connection portions 75 and 76 and the end portions 77B and 78B of the second external connection portions 77 and 78 are formed in the through holes 75Ba, 76Ba, and 77Ba. , 78Ba are formed, and connecting members J1, J2 are fixed to portions corresponding to the through holes 75Ba to 78Ba.

  The connecting members J1 and J2 are used when the capacitor unit 1 is connected to an external device. When the lead electrode 7 is fixed to the case 5 while forming the case 5, the connecting members J1 and J2 are formed on the protrusion 52 (case 5). Insert molded. The connecting members J1 and J2 are insert-molded in the arm portion 53 (case 5). The connecting members J1 and J2 can be simply and accurately provided by insert molding. Therefore, if the connecting members J1 and J2 are provided, the fixed position of the capacitor unit 1 with respect to the external device can be accurately defined.

  As shown in FIGS. 1 and 2, the cooler 3 is for cooling the capacitor body 2 and is joined to the base 50 of the case 5 so as to surround the protruding portion 52 of the case 5. As shown in FIGS. 11 and 12, the cooler 3 has a flow path substrate 30 and a cover 31.

  As shown in FIGS. 11 and 12, the flow path substrate 30 has a through hole 32 </ b> A, a plurality of pools 33, 34, 35, an inflow port 36, and a discharge port 37. The through hole 32A is a portion through which the protruding portion 52 of the case 5 is inserted, and has a shape corresponding to the protruding portion 52 (FIG. 1). The plurality of pools 33 to 35 circulate the cooling medium, and are provided adjacent to the protrusion 52 of the case 5 (see FIG. 2). The pool 34 communicates with the adjacent pools 33 and 35 via the communication path 38.

  The inflow port 36 is for introducing a cooling medium from the outside of the cooler 3 and communicates with the pool 33 via the communication path 39A. The discharge port 37 is for discharging the cooling medium to the outside of the cooler 3 and communicates with the pool 35 via the communication path 39B.

  In the flow path substrate 30, a plurality of pools 33, 34, and 35 are connected in series via communication paths 38, 39A, and 39B, and a flow path is formed by these. That is, the cooling medium is introduced from the inflow port 36, moves through the plurality of pools 33 to 35 (flow paths), and is discharged from the discharge port 37.

  Here, for example, water is used as the cooling medium. Of course, liquids other than water, such as oil, and gases, such as air, can also be used.

  The cover 31 is for closing the plurality of pools 33 to 35 and preventing leakage of the cooling medium to the outside. The cover 31 has a through hole 32B, and is fixed to the flow path substrate 30 so as to cover the upper openings of the plurality of pools 33 to 35. The through hole 32B is a portion through which the protruding portion 52 of the case 5 is inserted, and has a shape corresponding to the protruding portion 52 at a position corresponding to the through hole 32B.

  The cooler 3 is positioned with respect to the case 5 (capacitor main body 2) by inserting the protrusion 52 into the through holes 32A and 32B. The cooler 3 is also positioned and fixed with respect to the case 5 while being in close contact with the case 5 using bolts or the like.

  The cooler 3 surrounds the protruding portion 52 of the case 5. Since the protruding portion 52 is provided with a plurality of external connection portions 75 to 78, these external connection portions 75 to 78 can be efficiently cooled. In particular, since the plurality of pools 33 to 35 are provided adjacent to the protruding portion 52 (external connection portions 75 to 78), the external connection portions 75 to 78 are efficiently connected by the cooling medium that moves through the pools 33 to 35. Can be cooled.

  Further, since the cooler 3 is in close contact with the base, heat generated in the main body portions 64 and 67 of the internal electrode 6 and the internal connection portions 73 and 74 of the lead electrode 7 that are disposed in the vicinity of the base 50 is transferred to the base 50. And can be absorbed in the cooler 3. Heat generated by the capacitor element 4 can also be absorbed by the cooler 3 via the main body portions 64 and 67 and the internal connection portions 73 and 74.

  Moreover, since the cooler 3 distribute | circulates a cooling medium, a cooling medium is replaced at any time. Therefore, the temperature rise of a cooling medium can be suppressed, the cooling efficiency resulting from the temperature rise of a cooling medium can be suppressed, and the external connection parts 75-78 can be cooled efficiently.

DESCRIPTION OF SYMBOLS 1 Capacitor unit 10 Sealing resin part 3 Cooler 32A Through-hole (part of through-hole of cooler)
32B Through hole (of cover) (part of through hole of cooler)
4 Capacitor element 40 (capacitor element) end face (one terminal side)
41 (capacitor element) end face (the other terminal side)
5 Case 50 (having outer bottom surface and inner bottom surface) 52 Protruding portion 61 P electrode plate 62 N electrode plate 63 Insulating plate 73, 74 Internal connection portion (connection terminal)
75A, 76A (first external connection part) connecting part (drawer terminal part)
75B, 76B (first external connection part) end (external terminal)

Claims (6)

In a capacitor unit in which a plurality of capacitor elements are connected to each other and stored in a case,
The plurality of capacitor elements are connected by an anode plate that connects end faces located on one terminal side of each capacitor element to each other and a cathode plate that connects end faces located on the other terminal side of each capacitor element,
The anode plate and the cathode plate are disposed adjacent to each other along the inner bottom surface of the case with an insulating plate interposed therebetween,
The case is opened on one side so that the plurality of capacitor elements can be accommodated, and the other end side is finished with a bottom,
The anode plate and the cathode plate are respectively connected to an anode lead and a cathode lead connected to a terminal outside the unit,
A part of the anode lead and the cathode lead are provided to protrude from the inside of the case to the bottom surface of the case,
A capacitor unit, wherein a cooler is provided in contact with the outer bottom surface of the case so as to surround the anode lead and the cathode lead. Each of the plurality of capacitor elements is formed into a flat shape,
The plurality of capacitor elements have a plurality of capacitor element rows arranged in a line so that the major axis directions of the end faces of the capacitor elements are aligned.
2. The capacitor unit according to claim 1, wherein the plurality of capacitor element rows are stored side by side in the case so that end faces of the capacitor elements constituting each capacitor element row face each other. The anode plate and the cathode plate are provided for each capacitor element row,
The anode lead and the cathode lead each have an internal connection portion connected to the anode plate and the cathode plate, and an external connection portion arranged to be separated from each other and connected to a terminal outside the unit,
The capacitor unit according to claim 2, wherein the cooler is provided so as to surround the external connection portion.   5. The capacitor unit according to claim 1, further comprising a resin portion formed of a resin filled between the plurality of capacitor elements. 6.   The condenser unit according to any one of claims 1 to 4, wherein an inlet and an outlet are formed in the cooler, and a cooling medium flowing in from the inlet is discharged to the outlet.   The capacitor unit according to claim 1, wherein the cooler is provided so as to cover the entire bottom surface of the case.

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