JP5264327B2 - ダイモジュールアレイの位置決め方法 - Google Patents
ダイモジュールアレイの位置決め方法 Download PDFInfo
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- JP5264327B2 JP5264327B2 JP2008176554A JP2008176554A JP5264327B2 JP 5264327 B2 JP5264327 B2 JP 5264327B2 JP 2008176554 A JP2008176554 A JP 2008176554A JP 2008176554 A JP2008176554 A JP 2008176554A JP 5264327 B2 JP5264327 B2 JP 5264327B2
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- die
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- die module
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- individual die
- Prior art date
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- Expired - Fee Related
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- 238000000034 method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims description 27
- 238000005520 cutting process Methods 0.000 claims description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 21
- 229910052710 silicon Inorganic materials 0.000 claims description 21
- 239000010703 silicon Substances 0.000 claims description 21
- 238000003384 imaging method Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 20
- 238000005530 etching Methods 0.000 description 10
- 238000003491 array Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000003550 marker Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
イメージングアレイに於けるダイモジュールのアレイを位置決めする方法であって、
個別のシリコンダイモジュール上に物理的な参照基準面を直接形成するステップと、
アライメントツールを含む仮ホールダを提供するステップと、
前記アライメントツールに対して前記物理的な参照基準面を突合わせることによって、前記仮ホールダ上にダイを配置するステップと、
前記仮ホールダ上に配置された前記ダイを仮固定するステップと、
前記仮ホールダ上に配置された前記ダイに、永久基板を接着するステップと、
を含むことを特徴とするダイモジュールアレイの位置決め方法、が提供される。
前記接着のステップは、前記永久基板と前記ダイモジュールの間に接着剤を塗布するステップと、前記永久基板を前記仮ホールダから取り出すステップと、前記永久基板と前記ダイモジュールアレイとをキュアするステップをさらに含んでもよい。
前記物理的な参照基準面を形成するステップは、シリコンウェーハのノズル層にフォトリソグラフィによるパターンを形成するステップと、前記参照基準面を画定するために前記ウェーハ上の前記パターンをエッチングするステップと、を含んでもよい。
さらに、前記物理的な参照基準面をそれぞれに含む複数の個別のシリコンダイモジュールを形成するために、所定のパターンに沿って前記シリコンウェーハを切断するステップをさらに含み、前記物理的な参照基準面が長端アライメント構造および側端アライメント構造を備えてもよい。
110 ノズル穴
120 長端アライメント構造
130 側端アライメント構造
140a 水平切断代
140b 垂直切断代
150 ダイシングマーカ
160 電気相互接続領域
170 一段下がった領域
300 個別ダイモジュール
420 長端アライメント構造
430 側端アライメント構造
450 ダイモジュール
455 接着層
480 仮ホールダ
485 真空部品
490a 参照部材(長端アライメント用ピン)
490b 参照部材(側端アライメント用ピン)
495 永久基板
Claims (3)
- イメージングアレイに於けるダイモジュールのアレイを位置決めする方法であって、
シリコンウェーハに形成された個別のダイモジュール上に複数のノズル穴及び位置決め用の物理的な参照基準面を共通のフォトマスクを用いてエッチングにより直接形成するステップと、
アライメントツールを含む仮ホールダを提供するステップと、
所定のパターンに沿って前記シリコンウェーハを切断することにより、前記複数のノズル穴及び前記物理的な参照基準面がそれぞれに形成された複数の個別のダイモジュールに切断するステップと、
前記アライメントツールに対して前記個別のダイモジュールの前記物理的な参照基準面を突合わせることによって前記個別のダイモジュールを位置決めし、前記仮ホールダ上に前記個別のダイモジュールを配置するステップと、
前記仮ホールダ上に配置された前記個別のダイモジュールを仮固定するステップと、
前記仮ホールダ上に配置された前記個別のダイモジュールに、永久基板を接着するステップと、
を含むことを特徴とするダイモジュールアレイの位置決め方法。 - 前記接着のステップが、前記永久基板と前記個別のダイモジュールの間に接着剤を塗布するステップと、
前記永久基板を前記仮ホールダから取り出すステップと、
前記永久基板と前記個別のダイモジュールのアレイとをキュアするステップをさらに含むことを特徴とする請求項1に記載のダイモジュールアレイの位置決め方法。 - 前記物理的な参照基準面が長端アライメント構造および側端アライメント構造を備えることを特徴とする請求項1に記載のダイモジュールアレイの位置決め方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/777,475 US7571970B2 (en) | 2007-07-13 | 2007-07-13 | Self-aligned precision datums for array die placement |
US11/777,475 | 2007-07-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009018583A JP2009018583A (ja) | 2009-01-29 |
JP5264327B2 true JP5264327B2 (ja) | 2013-08-14 |
Family
ID=40244988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008176554A Expired - Fee Related JP5264327B2 (ja) | 2007-07-13 | 2008-07-07 | ダイモジュールアレイの位置決め方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7571970B2 (ja) |
JP (1) | JP5264327B2 (ja) |
KR (1) | KR101487214B1 (ja) |
CN (1) | CN101342813B (ja) |
TW (1) | TWI432334B (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010063744A1 (en) * | 2008-12-02 | 2010-06-10 | Oce-Technologies B.V. | Method of manufacturing an ink jet print head |
US8087752B2 (en) * | 2009-01-30 | 2012-01-03 | Fujifilm Corporation | Apparatus for printhead mounting |
JP2010264700A (ja) * | 2009-05-15 | 2010-11-25 | Seiko Epson Corp | 液体噴射ヘッドユニットの製造方法及び液体噴射装置 |
US8342659B2 (en) * | 2009-08-25 | 2013-01-01 | Canon Kabushiki Kaisha | Liquid discharge head and method for manufacturing the same |
US8567912B2 (en) * | 2010-04-28 | 2013-10-29 | Eastman Kodak Company | Inkjet printing device with composite substrate |
TWI474432B (zh) | 2012-11-15 | 2015-02-21 | Lextar Electronics Corp | 晶粒定位裝置、具有晶粒定位裝置的晶粒定位系統與發光二極體顯示板的晶粒定位方法 |
US11426900B2 (en) | 2013-02-28 | 2022-08-30 | Hewlett-Packard Development Company, L.P. | Molding a fluid flow structure |
RU2633224C2 (ru) | 2013-02-28 | 2017-10-11 | Хьюлетт-Паккард Дивелопмент Компани, Л.П. | Формованная печатающая штанга |
US10029467B2 (en) | 2013-02-28 | 2018-07-24 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US10821729B2 (en) | 2013-02-28 | 2020-11-03 | Hewlett-Packard Development Company, L.P. | Transfer molded fluid flow structure |
US9724920B2 (en) | 2013-03-20 | 2017-08-08 | Hewlett-Packard Development Company, L.P. | Molded die slivers with exposed front and back surfaces |
US20190279289A1 (en) * | 2013-08-05 | 2019-09-12 | Google Inc. | Content item distribution based on user interactions |
JP6433263B2 (ja) | 2014-01-14 | 2018-12-05 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
US10186467B2 (en) * | 2016-07-15 | 2019-01-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
JP6747552B1 (ja) * | 2019-06-28 | 2020-08-26 | 富士電機株式会社 | 排ガス処理装置およびスクラバ用ノズル |
CN117457536B (zh) * | 2023-11-01 | 2024-03-26 | 江苏新智达新能源设备有限公司 | 一种基于图像处理的芯片智能拾取方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4975143A (en) | 1989-11-22 | 1990-12-04 | Xerox Corporation | Keyway alignment substrates |
US5545913A (en) | 1994-10-17 | 1996-08-13 | Xerox Corporation | Assembly for mounting semiconductor chips in a full-width-array image scanner |
US6165813A (en) | 1995-04-03 | 2000-12-26 | Xerox Corporation | Replacing semiconductor chips in a full-width chip array |
US5738799A (en) | 1996-09-12 | 1998-04-14 | Xerox Corporation | Method and materials for fabricating an ink-jet printhead |
JPH10258512A (ja) * | 1997-03-18 | 1998-09-29 | Canon Inc | 液体噴射記録ヘッドの製造方法 |
US6655786B1 (en) * | 2000-10-20 | 2003-12-02 | Silverbrook Research Pty Ltd | Mounting of printhead in support member of six color inkjet modular printhead |
AUPR224300A0 (en) * | 2000-12-21 | 2001-01-25 | Silverbrook Research Pty. Ltd. | An apparatus (mj72) |
AUPR399601A0 (en) * | 2001-03-27 | 2001-04-26 | Silverbrook Research Pty. Ltd. | An apparatus and method(ART108) |
JP3788759B2 (ja) * | 2001-11-02 | 2006-06-21 | リコープリンティングシステムズ株式会社 | インクジェットプリンタ用ライン型記録ヘッド |
US6869166B2 (en) * | 2003-04-09 | 2005-03-22 | Joaquim Brugue | Multi-die fluid ejection apparatus and method |
-
2007
- 2007-07-13 US US11/777,475 patent/US7571970B2/en not_active Expired - Fee Related
-
2008
- 2008-07-07 JP JP2008176554A patent/JP5264327B2/ja not_active Expired - Fee Related
- 2008-07-10 TW TW097126005A patent/TWI432334B/zh active
- 2008-07-11 KR KR20080067421A patent/KR101487214B1/ko not_active IP Right Cessation
- 2008-07-11 CN CN2008101315836A patent/CN101342813B/zh not_active Expired - Fee Related
-
2009
- 2009-04-13 US US12/422,532 patent/US7681985B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009018583A (ja) | 2009-01-29 |
US7681985B2 (en) | 2010-03-23 |
CN101342813B (zh) | 2013-05-29 |
CN101342813A (zh) | 2009-01-14 |
KR101487214B1 (ko) | 2015-01-28 |
US7571970B2 (en) | 2009-08-11 |
KR20090007227A (ko) | 2009-01-16 |
US20090201328A1 (en) | 2009-08-13 |
US20090014413A1 (en) | 2009-01-15 |
TWI432334B (zh) | 2014-04-01 |
TW200906633A (en) | 2009-02-16 |
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