JP5262771B2 - Manufacturing method of magnetic sensor and magnetic sensor - Google Patents

Description

  The present invention relates to a method of manufacturing a magnetic sensor for detecting a magnetic pattern and magnetic information of a detection object passing over the top surface by a magnetoresistive element disposed on the top surface of a resin case, and a magnetic sensor manufactured by the manufacturing method. It is about.

  At present, various magnetic sensors for detecting a magnetic pattern and magnetic information of a detection target are used depending on applications. And as shown in patent document 1, the conventional magnetic sensor has the resin case which consists of a substantially rectangular parallelepiped, and has arrange | positioned the magnetoresistive element in the top | upper surface side of the said resin case. The magnetoresistive element arranged on the top surface is an element whose resistance value changes according to the change in magnetic flux to be magnetized, and by sensing the change in magnetic flux generated when the detected object passes through the top surface. Detect magnetic patterns and magnetic information. At this time, in order to detect the detection object, a circuit for applying a bias voltage to the magnetoresistive element is required, and an external input / output terminal for this purpose must be provided in the resin case. Here, in order to pass the object to be detected, an external input / output terminal cannot be installed on the top surface side of the resin case. Normally, the external input / output terminal has a pin or the like protruding from the bottom surface of the resin case. Used. In order to connect this external input / output pin terminal to the magnetoresistive element, the pin terminal has a shape penetrating the resin case from the bottom surface to the top surface, and the pin terminal and the magnetoresistive element are electrically conductive on the top surface. A shape connected by a lead terminal made of a material is used.

  Due to such a structure, conventionally, a magnetic sensor is manufactured by using a manufacturing method as shown in FIGS. FIG. 7 is a flowchart showing a conventional manufacturing method. FIG. 8 is a diagram for explaining a conventional manufacturing method.

  A conventional method for manufacturing a magnetic sensor generally includes the following steps. (1) A plurality of magnetoresistive elements are arranged on a jig, and a lead frame on which a plurality of lead terminals are arranged is arranged on the jig. (2) Each lead terminal of the lead frame is joined to the magnetoresistive element. (3) The lead frame is cut to be separated into magnetoresistive elements with lead terminals. (4) The magnetoresistive elements with lead terminals that are each individual pieces are placed in a resin case on which pin terminals are mounted. (5) Join the lead terminal and the pin terminal.

  Specifically, first, as shown in FIG. 8A, a plurality of magnetoresistive elements 11 are arranged in the element arrangement recess 311 formed in the lead terminal mounting jig 301 (FIG. 7: S901). The lead frame 201 in which the plurality of lead terminals 12 are arranged is arranged on the lead terminal mounting jig 301 (FIG. 7: S902). Then, the lead terminal 12 and the magnetoresistive element 11 are joined (FIG. 7: S903).

  Next, as shown in FIG. 8B, the magnetoresistive element 11 bonded to the lead terminal 12 is separated from the lead frame 201, taken out from the lead terminal mounting jig 301, and individualized (FIG. 7: S904).

  Next, the pin terminal 13 is mounted on the resin case 10 (FIG. 7: S905), and as shown in FIG. 8C, the magnetoresistive element 11 having the lead terminal 12 bonded to the element mounting recess 101 of the resin case 10. (FIG. 7: S906). Then, the lead terminal 12 and the pin terminal 13 are joined (FIG. 7: S907).

  After such a process, although not shown, a magnetic sensor is formed by attaching a cover made of metal or the like to the top surface side of the resin case 10 (FIG. 7: S908).

No. 8-769

  However, when a magnetic sensor is manufactured in the above manufacturing process, a separate jig is required to join the lead terminal to the magnetoresistive element. Further, by using the jig, (1) a step of mounting the magnetoresistive element on the jig, (2) a step of taking out the magnetoresistive element from the jig, (3) a step of mounting the magnetoresistive element on the resin case, That is, a minimum of three processes for handling the magnetoresistive element. For this reason, in the components of the magnetic sensor, there are many processes for handling a magnetoresistive element that is relatively easy to break, and defects due to the handling tend to occur.

  Accordingly, an object of the present invention is to provide a method of manufacturing a magnetic sensor that uses a simpler process than before and can reduce defects during manufacturing.

The present invention includes a substantially rectangular resin case, a magnetoresistive element disposed on the top surface of the resin case, a pin terminal attached to the resin case and having a connection portion for the magnetoresistive element on the top surface side, and the pin terminal And a lead terminal bonded to both the magnetoresistive element and a magnetic sensor. This method of manufacturing a magnetic sensor includes a step of installing a magnetoresistive element on the top surface side of the resin case. In addition, the magnetic sensor manufacturing method includes connecting a lead frame including a frame having a predetermined shape and a plurality of lead terminals arrayed in a shape integrated with the frame to the magnetoresistive element side of each lead terminal. A step of placing the end portion on the top surface side of the resin case so that the end portion is in a position in contact with the magnetoresistive element and the predetermined position on the connection side with the frame is in a position in contact with the connection portion of the pin terminal. Have. Further, the method of manufacturing the magnetic sensor includes a step of joining each lead terminal to the connection portion of the pin terminal, a step of cutting the frame body side from the connection portion of each lead terminal, and a connection of each lead terminal on the magnetoresistive element side Joining the end to the magnetoresistive element. Furthermore, in this method of manufacturing a magnetic sensor, after performing the step of joining each lead terminal to the connection portion of the pin terminal, the frame body side is cut from the connection portion of each lead terminal. Then, the magnetoresistive element side connection end of each lead terminal is joined to the magnetoresistive element.

  In this manufacturing method, the lead terminal, the magnetoresistive element, and the pin terminal are joined in a state where the magnetoresistive element and the lead frame are directly disposed on the resin case without using a jig. Thereby, it is not necessary to use a jig, and the magnetoresistive element is handled only once.

  In this manufacturing method, first, a pin terminal and a lead terminal are joined. At this time, since the pin terminal and the lead terminal are generally made of the same metal or the like, a bonding strength stronger than the bonding between the lead terminal and the magnetoresistive element can be obtained. For this reason, if a lead terminal is cut out from a lead frame after this process, it will become difficult to produce defects, such as exfoliation of a joined part of a pin terminal and a lead terminal by the cutting. In addition, since the lead terminal and the magnetoresistive element are not joined at the time of cutting, and the lead terminal and the magnetoresistive element are joined after cutting, there is an adverse effect due to the cutting of the lead terminal and the magnetoresistive element at the junction. Can be eliminated.

  The present invention also relates to a magnetic sensor manufactured by the above-described magnetic sensor manufacturing method. In the resin case of this magnetic sensor, a cutting groove is formed on the side opposite to the installation position of the magnetoresistive element with reference to the pin terminal.

  With such a configuration, it is possible to cut out the lead terminal from the lead frame using the cutting groove formed in the resin case while the magnetoresistive element is disposed in the resin case.

  The resin case of the magnetic sensor according to the present invention has a plurality of magnetoresistive elements arranged in an array. The cutting groove is formed in a shape extending along the arrangement direction of the magnetoresistive elements.

  In this configuration, in particular, if the resin case is provided with a plurality of magnetoresistive elements, the lead terminals corresponding to the magnetoresistive elements can be cut out simultaneously using the cutting grooves.

  In the resin case of the magnetic sensor of the present invention, positioning pins for positioning the lead frame are formed on the top surface.

  In this configuration, the lead frame is placed on the resin case with high accuracy by the positioning pins. Thereby, the lead terminal can be bonded to the pin terminal and the magnetoresistive element with high accuracy.

  In the resin case of the magnetic sensor of the present invention, a cover mounting groove is formed on the side opposite to the pin terminal with respect to the cutting groove.

  In this configuration, the cover can be easily installed on the top surface side of the resin case by mounting the cover in the cover mounting groove. In addition, since there is a cutting groove between the cover mounting groove and the magnetoresistive element, even if the object to be detected collides with the cover, vibration caused by this collision bypasses the cutting groove and propagates linearly in the resin case. do not do. Thereby, the vibration caused by the collision is greatly attenuated before being propagated to the magnetoresistive element, and the collision noise detected by the magnetoresistive element can be suppressed.

  According to this invention, it is not necessary to use a jig for joining the lead terminal to the magnetoresistive element, and the number of handling with respect to the magnetoresistive element can be reduced. Thereby, it is possible to manufacture the magnetic sensor with high accuracy while reducing the number of jigs for manufacturing, and to suppress defects that occur during the manufacturing.

It is a figure which shows the structure of the magnetic sensor which concerns on embodiment of this invention. It is a flowchart which shows the manufacturing process of the magnetic sensor of this embodiment. It is a figure for demonstrating the manufacturing method of this embodiment. It is a figure for demonstrating the manufacturing method of this embodiment. It is a figure for demonstrating the manufacturing method of this embodiment. It is a figure which shows the difference of the collision noise which the magnetoresistive element detects by the structure (structure with a cutting groove) of embodiment of this invention and the conventional structure (structure without a cutting groove). It is a flowchart which shows the conventional manufacturing method. It is a figure for demonstrating the conventional manufacturing method.

  A magnetic sensor manufacturing method according to an embodiment of the present invention and a magnetic sensor manufactured by the manufacturing method will be described with reference to the drawings.

  1A and 1B are diagrams illustrating the structure of the magnetic sensor according to the present embodiment, in which FIG. 1A is a top view, and FIG. 1B is a side surface of a short side viewed from an end in a long side direction of a resin case 10. FIG. 1C is a top view with the cover removed, FIG. 1D is a cross-sectional view taken along the line AA ′ in FIG. 1C, and FIG. 1E is the state with the cover removed. 4 is a side view of a long side surface viewed from an end portion in a short side direction of a resin case 10. FIG.

  The magnetic sensor 1 includes a resin case 10, a magnetoresistive element 11, a lead terminal 12, a pin terminal 13, a magnet 14, and a cover 15.

  The resin case 10 is formed of an insulating resin and has a shape in which two corners extending in the long side direction of the rectangular parallelepiped are obliquely cut off. Specifically, it has a rectangular top surface 110 and a bottom surface 113 that are parallel to each other and have the same long side direction. The top surface 110 and the bottom surface 113 have the same length of the long side as viewed from the top surface direction, but the length of the short side as viewed from the top surface direction is shorter for the top surface 110. Are opposed to each other in the state in which the centers in the short side direction coincide with each other. The top surface 110 and the bottom surface 113 have short side surfaces 112 that are perpendicular to the top surface 110 and the bottom surface 113 at both ends in the long side direction, and the bottom surface 113 and the top surface at both ends in the short side direction of the bottom surface 113. It has a long side surface 111 perpendicular to 110. The top surface 110 and the long side surface 111 have an inclined surface 114 so as to form a predetermined angle with respect to the top surface 110 when viewing the resin case 10 from the end in the long side direction.

  An element mounting recess 101 is formed on the top surface 110 of the resin case 10. The element mounting recess 101 is formed in a shape in which a plurality of long magnetoresistive elements 11 can be continuously arranged along the long side direction of the resin case 10 in the center of the top surface 110 in the short side direction. . In this case, the magnetoresistive element 11 is formed in a shape that can be arranged so that the longitudinal direction of the magnetoresistive element 11 coincides with the long side direction of the resin case 10. The depth of the element mounting recess 101 is set based on the thickness of the magnetoresistive element 11, and the heater bar 250 does not come into contact with the top surface 110 when a lead terminal 12 described later is thermocompression bonded to the magnetoresistive element 11. It is set so that the top surface of the magnetoresistive element 11 is arranged at a certain position.

  Further, a plurality of lead frame fixing pins 150 are formed on the top surface 110 of the resin case 10. At this time, the lead frame fixing pin 150 is formed on a plane formed at a position lower than the uppermost end of the top surface 110, and has a shape in which the tip of the pin does not protrude from the uppermost end of the top surface.

  A plurality of pin terminal insertion through holes 160 that penetrate from the top surface 110 to the bottom surface 113 are formed in the resin case 10. The pin terminal insertion through holes 16 are formed at predetermined intervals along the long side direction of the resin case 10 so as to sandwich the element mounting recess 101.

  The inclined surface 114 of the resin case 10 is formed with a cutting groove 120 that extends over the entire side in the long side direction of the resin case 10 (the arrangement direction of the magnetoresistive elements 11) and has a predetermined depth. The width of the cutting groove 120 (the length along the short side direction of the resin case 10) can be inserted based on the thickness of the blade 260 for separating the lead terminal 12 described later from the lead frame 201. It is set as narrow as possible. The depth of the cutting groove 120 is set based on the penetration depth of the blade 260. These cutting grooves 120 are formed on the long side surface 111 side from the center in the short side direction of the resin case 10 so as to sandwich the element mounting recess 101. Further, these cutting grooves 120 are inserted into the pin terminals. It is formed on the longer side end face 111 side than the installation position of the through-hole 160 for use.

  Further, a cover mounting groove 121 is formed along the cutting groove 120 on the inclined surface 114 of the resin case 10. Based on the thickness of the cover 15, the width of the cover mounting groove 121 is set as narrow as possible so that the cover 15 can be inserted into the cover mounting groove 121. These cover mounting grooves 121 are further formed on the long side surface 111 side than the cutting groove 120.

  The magnetoresistive element 11 is an element whose resistance value changes in accordance with a change in magnetic flux, and has a predetermined thickness and a long shape. The plurality of magnetoresistive elements 11 are installed in an element mounting recess 101 formed on the top surface 110 of the resin case 10. At this time, the plurality of magnetoresistive elements 11 are arranged on a straight line along the long side direction of the resin case 10 so that the long direction coincides.

  Each pin terminal 13 is mounted in each pin terminal insertion through hole 160. At this time, each pin terminal 13 is mounted such that the pin head 131 is exposed to the top surface 110 side, and the tip facing the pin head 131 protrudes from the bottom surface 113 of the resin case 10. The top position of the pin head 131 is set to be equal to or less than the top position of the magnetoresistive element 11 mounted in the element mounting recess 101 in a state where the pin terminal 13 is mounted in the pin terminal insertion through hole 160. ing.

  The lead terminal 12 has a structure in which an element bonding end and a pin bonding end are connected by a joint, and the element bonding end is bonded to the surface of the magnetoresistive element 11. Is joined to the top surface of the pin head 131 of the pin terminal 13.

  The magnet 14 applies a bias magnetic field to the magnetoresistive element 11 and is housed in the resin case 10 in a long shape along the long side direction.

  The cover 15 includes a top plate 50 and two side plates 51 having a plane perpendicular to the top plate 50, and is made of a metal plate having a shape covering substantially the entire top surface 110 and the inclined surface 114 of the resin case 10. The side plate 51 is inserted into the cover mounting groove 121 described above. The cover mounting groove 121 is coated with a curable resin 16. When the cover 15 is inserted and the resin 16 is cured, the cover 15 is fixed to the resin case 10 with the side plate 51.

  Such a magnetic sensor 1 can detect the magnetic pattern and magnetic information of the detected object by being conveyed along the short side direction (coinciding with the short side direction of the resin case 10). it can. Specifically, a circuit for applying a bias voltage to the magnetoresistive element 11 using the pin terminal 13 and the lead terminal 12 and a circuit for taking out the output voltage are formed. When the object to be detected is transported along the surface of the cover 15 with the bias voltage applied, the resistance value of the magnetoresistive element 11 changes, and the output voltage value also changes accordingly. In the subsequent circuit connected via the pin terminal 13, by detecting this change in output voltage value, the magnetic pattern and magnetic information of the detected object can be detected.

Next, a method for manufacturing the magnetic sensor 1 will be described with reference to the drawings.
FIG. 2 is a flowchart showing the manufacturing process of the magnetic sensor of this embodiment. Moreover, FIGS. 3-5 is a figure for demonstrating the manufacturing method of this embodiment. 3A and 3B show the mounting process of the pin terminal 13, and FIGS. 3C and 3D show the installation process of the magnetoresistive element 11. 4A and 4B show a first joining process for joining the lead terminal 12 and the pin terminal 13, and FIGS. 4C and 4D show a lead separating process for separating the lead terminal 12 from the lead frame 201. Indicates. 5A and 5B show a second joining process for joining the lead terminal 12 and the magnetoresistive element 11, and FIGS. 6A and 6B show a cover mounting process for mounting the cover 15.

  The method for manufacturing a magnetic sensor according to the present embodiment schematically includes the following steps. (1) The pin terminal 13 and the magnetoresistive element 11 are arranged on the resin case 10. (2) The lead frame 201 is arranged on the top surface 110 of the resin case 10 and the lead terminals 12 and the pin terminals 13 are joined. (3) Cut the lead frame. (4) The magnetoresistive element 11 and the lead terminal 12 are joined.

  Specifically, first, as shown in FIGS. 3A and 3B, the pin terminals 13 are respectively inserted into the plurality of pin terminal insertion through holes 160 formed in the resin case 10 in which the magnets 14 are installed. Wear (FIG. 2: S101). At this time, the pin terminal 13 is mounted so that the pin head 131 is on the top surface 110 side of the pin terminal insertion through hole 160.

  Next, as shown in FIGS. 3C and 3D, the magnetoresistive element 11 is disposed in the element mounting recess 101 of the resin case 10 (FIG. 2: S102).

  Next, as shown in FIGS. 4A and 4B, the lead frame 201 is installed on the top surface 110 of the resin case 10 (FIG. 2: S103). The lead frame 201 has a structure in which the lead terminals 12 are arranged inside the frame body 211. Further, the lead frame 201 has a positioning hole 212 formed in the frame 211. By inserting the positioning holes 212 into the lead frame fixing pins 150 formed on the top surface 110 of the resin case 10, the lead frame 201 can be fixedly installed on the resin case 10. Then, by fixing the lead frame 201 to the resin case 10 in this way, the pin joining end portions of the lead terminals 12 are arranged on the pin heads 131 of the pin terminals 13, and the element joining ends of the lead terminals 12 are arranged. Is disposed on the connection electrode on the surface of the magnetoresistive element 11. Thereby, the lead terminal 12 can be arrange | positioned with respect to the pin terminal 13 and the magnetoresistive element 11 with high precision.

  Next, after the lead frame 201 is fixedly installed on the resin case 10, the lead terminals 12 and the pin heads 131 of the pin terminals 13 are thermocompression bonded (FIG. 2: S104). At this time, a metal plating such as Sn is applied to the side surface of the pin terminal 13 of the lead terminal 12, and a pin joining end portion of the lead terminal 12 is performed by thermocompression bonding with the heater bar 250 from the opposite side. And the pin head 131 of the pin terminal 13 are joined. Here, since the lead terminal 12 and the pin terminal 13 are made of metal and the medium through which these thermocompression bonding is performed is a metal, it is possible to increase the bonding strength of the joint portion between the lead terminal 12 and the pin terminal 13. it can. Moreover, since it is joining by a metal, it is excellent in electroconductivity.

  Next, as shown in FIGS. 4C and 4D, each lead terminal 12 is separated from the lead frame 201 (FIG. 2: S105). At this time, the blade 260 used for cutting is inserted into the cutting groove 120 to cut the frame body 211 side of each lead terminal 12 in the lead frame 201. In other words, the side opposite to the element bonding end is cut with reference to the pin bonding end. As a result, the lead terminal 12 group for the plurality of magnetoresistive elements 11 can be separated from the lead frame 201 simultaneously. Furthermore, since the lead terminal 12 and the pin terminal 13 are already joined at this time, the lead terminal 12 does not fall apart even if the lead terminal 12 is not joined to the magnetoresistive element 11. The use end portion remains arranged on the magnetoresistive element 11.

  Next, as shown in FIGS. 5A and 5B, the element bonding end portion of the lead terminal 12 and the magnetoresistive element 11 are thermocompression bonded (FIG. 2: S106). Also at this time, the side surface of the magnetoresistive element 11 of the lead terminal 12 is plated with metal such as Sn, and by thermocompression with the heater bar 250 from the opposite side, the element for joining the lead terminal 12 is used. The end portion and the electrode pattern on the surface of the magnetoresistive element 11 are joined.

  Next, as shown in FIGS. 5C and 5D, the cover 15 is mounted from the top surface 110 side of the resin case 10 (FIG. 2: S107). Specifically, the cover 15 is installed at a predetermined position with respect to the resin case 10 by inserting the side plate 51 along the long side surface 111 of the resin case 10 into the cover mounting groove 121 of the resin case 10. . The cover mounting groove 121 is coated with a curable resin 16 before the cover 15 is inserted, and the cover 15 is secured to the resin case 10 with the side plate 51 by curing the resin 16 after the cover 15 is inserted. Fixed. At this time, the top plate 50 of the cover 15 is cured while being applied while being in contact with the uppermost end of the top surface of the resin case 10, thereby preventing warpage during and after the cover 15 is mounted. The cover 15 can be kept fixed in a state where the distance between the resistance element 11 and the cover 15 is maintained with high accuracy.

  By using the manufacturing method as described above, the following various effects can be obtained.

  First, by using the configuration and manufacturing method of the present embodiment, the lead terminals are separated from the lead frame after joining the lead terminals to the magnetoresistive element using a jig or the like separate from the resin case, and the separated leads. Without using the method of attaching the magnetoresistive element with terminal to the resin case, the lead terminal can be joined in a state where the magnetoresistive element is attached to the resin case, and can be separated from the lead frame while being attached to the resin case. Thereby, the frequency | count of handling with respect to a magnetoresistive element can be reduced, and handling failure can be suppressed. In addition, since it is not necessary to use a jig separate from the resin case, the manufacturing process can be reduced and the manufacturing cost can be reduced.

  Further, as shown in the manufacturing method of the present embodiment, after joining the pin terminal and the lead terminal, the lead terminal is separated from the lead frame, and after the separation, the lead terminal and the magnetoresistive element are joined, thereby the lead terminal. Even if a stress due to the cutting is generated at the time of disconnection, the joint strength between the lead terminal and the pin terminal is strong, so that the joint is hardly broken. Thereby, it is possible to significantly suppress the occurrence of manufacturing defects due to breakage at the time of cutting, as compared with the conventional method of performing separation after joining the lead terminal having a weak joint strength and the magnetoresistive element.

  Also, as shown in the configuration and manufacturing method of the present embodiment, each lead terminal is pinned by inserting the lead frame positioning hole into the lead frame fixing pin of the resin case and installing the lead frame in the resin case. It can arrange | position with high precision with respect to a terminal and a magnetoresistive element. Thereby, even on the resin case, each lead terminal can be bonded to the pin terminal and the magnetoresistive element with high accuracy.

  In addition, as shown in the configuration of the present embodiment, the presence of a cutting groove between the side plate of the cover and the magnetoresistive element causes the vibration generated when the detected object collides with the cover to cause a resin case. Does not reach the magnetoresistive element linearly. That is, the vibration due to the collision is propagated so as to bypass the cutting groove. As a result, as shown in FIG. 6, when reaching the magnetoresistive element, the vibration is attenuated much more than when propagating linearly, and collision noise can be greatly suppressed. FIG. 6 is a diagram showing a difference in collision noise between the configuration of this embodiment (configuration with a cutting groove) and the conventional configuration (configuration without a cutting groove). Thereby, a magnetic sensor with high detection accuracy can be configured.

  Further, as a structure in which the cover 15 is simply inserted along the side surface of the resin case 10, an engagement claw is formed on the cover 15 by fixing, and the cover 15 is engaged with the side surface of the resin case 10. There is no stress against the stress on the top plate of the cover. In particular, even when the top plate is installed flat while applying the weight to the top plate 50 of the cover 15, almost no stress remains and a flat top surface can be formed. Thereby, the structure which can hold | maintain the distance of a magnetoresistive element and a cover with high precision is realizable, and while highly accurate detection is attained, the detection variation for every magnetic sensor can be decreased.

  In the above-described embodiment, an example in which four magnetoresistive elements are arranged in the resin case has been described. However, the above-described configuration and manufacturing method can be applied even if other numbers of magnetoresistive elements are arranged. In particular, the effect of this embodiment becomes more effective as the configuration in which more magnetoresistive elements are arranged in one resin case.

  In the present invention, since the positioning pin for positioning the lead frame is provided on the top surface of the resin case, a jig for joining the lead terminal to the magnetoresistive element in advance is not required. Therefore, it is not denied that a jig for fixing the resin case is used for more stable holding.

1-magnetic sensor, 10-resin case, 11-magnetoresistive element, 110-top surface, 111-long side surface, 112-short side surface, 113-bottom surface, 114-inclined surface, 12-lead terminal, 13-pin Terminal, 130-pin head, 14-magnet, 15-cover, 50-top plate, 51-side plate, 16-resin, 101-element mounting recess, 120-cutting groove, 121-cover mounting groove, 150-lead frame fixing Pin, 160-pin terminal insertion hole, 201-lead frame, 211-frame body, 212-positioning hole, 250-heater bar, 260-blade, 301-lead terminal mounting jig

Claims (6)

A substantially rectangular resin case, a magnetoresistive element disposed on the top surface of the resin case, a pin terminal mounted on the resin case and having a connection portion for the magnetoresistive element on the top surface side, and the pin terminal And a lead terminal joined to both of the magnetoresistive elements, and a method of manufacturing a magnetic sensor comprising:
Installing the magnetoresistive element on the top side of the resin case;
A lead frame comprising a frame body having a predetermined shape and a plurality of the lead terminals arranged in a shape integrated with the frame body, the magnetoresistive element side connection end of each lead terminal being in contact with the magnetoresistive element And a step of arranging on the top surface side of the resin case such that a predetermined position on the connection side with the frame is a position in contact with the connection portion of the pin terminal,
Bonding each lead terminal to the connecting portion of the pin terminal;
Cutting the frame body side of the connecting portion of each lead terminal; and
Have a, and joining the magnetoresistive element side connection end portion of each lead terminals to said magnetoresistive element,
After performing the step of joining each lead terminal to the connection portion of the pin terminal, performing the step of cutting the frame body side relative to the connection portion of each lead terminal, and then, after that, the magnetism of each lead terminal A method of manufacturing a magnetic sensor, comprising performing a step of bonding a resistance element side connection end to the magnetoresistive element . A magnetic sensor manufactured by the method of manufacturing a magnetic sensor according to claim 1 ,
The resin case is a magnetic sensor in which a cutting groove is formed on a side opposite to the installation position of the magnetoresistive element with respect to the pin terminal. The magnetic sensor according to claim 2 , wherein the resin case includes a plurality of the magnetoresistive elements arranged in an array, and the cutting groove is formed in a shape extending along an array direction of the magnetoresistive elements. The resin case, a magnetic sensor according to claim 2 or claim 3 positioning pins for positioning the lead frame is formed on the top surface. The resin case, the cutting groove with respect to the said pin terminal opposite cover mounting groove in is formed, the magnetic sensor according to any of claims 2-4. A magnetic sensor manufactured by the method of manufacturing a magnetic sensor according to claim 1 ,
The resin case is a magnetic sensor in which positioning pins for positioning the lead frame are formed on the top surface.