JP5260404B2 - Touch panel, display device and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a touch panel, which can be operated smoothly by a finger, a pen or the like with a sufficiently small operating force, while minimizing irregularities on the surface, and a display device and an electronic device provided with the same. <P>SOLUTION: The resistance film type touch panel 1 includes an upper substrate 10 including a transparent substrate having a resistance film and a wiring layer provided on one side thereof; and a lower substrate 20 including a transparent substrate having a resistance film and a wiring layer provided on one side thereof, both the substrate being adhered through a first adhesive layer 40 so that the respective resistance films are opposed to each other. A transparent plate 15 is provided on the side opposite to the resistance film of the transparent substrate of the upper substrate 10 through a second adhesive layer 14, and the thickness of the second adhesive layer 14 is 50-300 &mu;m. As the transparent plate 15, a PMMA plate or PET plate 100-500 &mu;m in thickness is used. The upper surface of the transparent plate 15 forms a contact surface 10a. This touch panel 1 is disposed on an image display surface of the display device. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a touch panel, a display device, and an electronic device, and more particularly, to a resistive film type touch panel, a display device including the touch panel, and an electronic device including the touch panel.

  Conventionally, a technique for detecting a position where a detection target object such as a finger or a pen contacts a display surface of a display device is known. Among display devices using this technique, a display device provided with a touch panel is a typical and widely used display device. There are various types of touch panels, but a resistive film type is widely used (see, for example, Patent Document 1). In this resistive film system, for example, the panel surface has a laminated structure in which very small spacers are sandwiched between glass and film facing each other, and transparent electrode grids are formed on the surfaces facing each other of glass and film. Is provided. Then, by touching the surface of the film with a finger or a pen, the film bends, the transparent electrode on the film surface and the transparent electrode on the glass surface come into contact with each other, and current flows. For this reason, the position of a finger or a pen can be detected by measuring the partial pressure ratio due to the resistance of the transparent electrodes on the glass surface and the film surface. Therefore, the user can operate intuitively by using such a touch panel.

  FIG. 18 shows a schematic configuration of the above-described resistive film type touch panel 100. FIG. 19 is an exploded perspective view of the touch panel 100 shown in FIG. As shown in FIGS. 18 and 19, the touch panel 100 includes, for example, a pair of an upper substrate 110 and a lower substrate 120 that are arranged to face each other with a predetermined gap therebetween. A flexible printed wiring board (FPC) 130 and an adhesive layer 140 are provided between the upper substrate 110 and the lower substrate 120.

  The upper substrate 110 has a transparent substrate 111 serving as a contact surface 110a with which a finger, a pen, or the like contacts. A resistance film 112 is provided on the surface (lower surface) of the transparent substrate 111 opposite to the contact surface 110a. Around the resistance film 112 on the lower surface of the transparent substrate 111, strip-shaped wiring layers 113a and 113b connected to and electrically connected to the resistance film 112 are provided. One end of each of the wiring layers 113a and 113b is provided in a region facing the end portion 130a of the FPC 130, and is in contact with an electrode (not shown) of the FPC 130.

  The lower substrate 120 includes a transparent substrate 121 that supports a resistance film 122 (described later) with which the resistance film 112 comes into contact when the upper substrate 110 is contacted with a finger or a pen. The resistance film 122 described above is provided on the surface (upper surface) of the transparent substrate 121 facing the upper substrate 110 and in the region facing the resistance film 112. Band-shaped wiring layers 123 a and 123 b connected to and electrically connected to the resistance film 122 are provided around the resistance film 122 on the upper surface of the transparent substrate 121. One end of these wiring layers 123 a and 123 b is provided in a region facing the end portion 130 a of the FPC 130, and is in contact with the electrode of the FPC 130.

  The adhesive layer 140 has a ring shape having an opening 140a in a region facing the resistance film 112, and is disposed between the wiring layers 113a and 113b on the transparent substrate 111 and the wiring layers 123a and 123b on the transparent substrate 121. Has been. Thus, the adhesive layer 140 bonds the upper substrate 110 and the lower substrate 120 to each other while insulating and separating the wiring layers 113a and 113b and the wiring layers 123a and 123b from each other. This adhesive layer 140 has a notch 140b in a region corresponding to the FPC 130 so that it does not overlap with the FPC 130 when viewed from the thickness direction. The adhesive layer 140 is made of, for example, a double-sided tape.

JP 2002-182854 A

  By the way, the touch panel 100 shown in FIGS. 18 and 19 presses the upper substrate 110 and the lower substrate 120 from the stacking direction with the upper substrate 110 and the lower substrate 120 sandwiching the end portion 130a of the FPC 130 and the adhesive layer 140. It is formed by doing. Here, the adhesive layer 140 is disposed between the wiring layers 113a and 113b and the wiring layers 123a and 123b as described above. For this reason, in the manufacturing process, when the upper substrate 110 and the lower substrate 120 are pressed from the stacking direction, the contact surface 110a of the upper substrate 110 becomes uneven along the wiring layers 113a and 113b. As a result, when the entire contact surface 110a is used as a part of the housing of the display device, there is a problem that the flatness of the housing surface is impaired.

Accordingly, the problem to be solved by the present invention is to provide a touch panel that can be operated with a sufficiently small operating force, can be operated smoothly with a finger, a pen, etc., and can reduce unevenness on the surface. It is to be.
Another problem to be solved by the present invention is to provide a touch panel that can be operated with a sufficiently small operating force, can be operated smoothly with a finger or a pen, and can reduce unevenness on the surface. Display device and electronic device.

As a result of intensive studies to solve the above problems, the present inventors have come up with the present invention. The outline will be described as follows.
That is, in order to prevent unevenness on the surface of the touch panel due to the wiring layer formed on the opposing surface of the upper substrate and the lower substrate, a hard and sufficiently rigid transparent plate is used. It is conceivable to provide it. However, if it does in this way, the rigidity of an upper board will become high too much, the operating force required for the action | operation of a touchscreen will become high, and it cannot operate smoothly. The present inventors have intensively studied to solve this problem. As a result, by providing a transparent plate having sufficient rigidity so that the unevenness generated on the contact surface can be sufficiently reduced via the adhesive layer having a sufficient thickness on the transparent substrate of the upper substrate, The present inventors have found that the above problems can be solved at once, and have come up with the present invention.

A touch panel according to an aspect of the present invention includes a first and second transparent substrate, a first and second resistance film, a first and second wiring layer, a first and a second adhesive layer, And a transparent plate.
The first transparent substrate and the second transparent substrate are spaced apart from each other.
The first resistance film is provided on a surface of the first transparent substrate facing the second transparent substrate, and the first wiring layer is electrically connected to the first resistance film. .
The second resistance film is provided on a surface of the second transparent substrate facing the first transparent substrate, and the second wiring layer is electrically connected to the second resistance film. .
The first adhesive layer is an outer peripheral portion including a facing region between the first wiring layer and the second wiring layer in a gap between the first transparent substrate and the second transparent substrate. Is provided in the area. The first adhesive layer bonds the first transparent substrate and the second transparent substrate.
The second adhesive layer is provided on the surface of the first transparent substrate opposite to the surface facing the second transparent substrate.
The transparent plate is bonded to the surface of the first transparent substrate opposite to the surface facing the second transparent substrate via the second adhesive layer.
The cross-sectional second moment with respect to the neutral plane of the transverse plane of the transparent plate, the second adhesive layer, the first transparent substrate and the first resistive film is the first cross-sectional second moment and the second cross-section. Between the second moment. The first moment of inertia of the first cross section is that the transparent plate is made of a polymethylmethacrylate plate having a thickness of 500 μm, the second adhesive layer is made of an acrylic pressure-sensitive adhesive having a thickness of 50 μm, and the first transparent The sectional moment of inertia when the substrate and the first resistive film are made of an indium tin oxide film having a thickness of 100 μm. The second moment of inertia of the second cross section is such that the transparent plate is made of a polyethylene terephthalate plate having a thickness of 125 μm, the second adhesive layer is made of an acrylic adhesive having a thickness of 300 μm, and the first transparent substrate And the second moment of inertia when the first resistive film is made of an indium tin oxide film having a thickness of 100 μm.

A display device according to one embodiment of the present invention includes a display panel having an image display surface, and a touch panel arranged on the image display surface.
The touch panel includes first and second transparent substrates, first and second resistance films, first and second wiring layers, first and second adhesive layers, and a transparent plate.
The first transparent substrate and the second transparent substrate are spaced apart from each other.
The first resistance film is provided on a surface of the first transparent substrate facing the second transparent substrate, and the first wiring layer is electrically connected to the first resistance film. .
The second resistance film is provided on a surface of the second transparent substrate facing the first transparent substrate, and the second wiring layer is electrically connected to the second resistance film. .
The first adhesive layer is an outer peripheral portion including a facing region between the first wiring layer and the second wiring layer in a gap between the first transparent substrate and the second transparent substrate. Is provided in the area. The first adhesive layer bonds the first transparent substrate and the second transparent substrate.
The second adhesive layer is provided on the surface of the first transparent substrate opposite to the surface facing the second transparent substrate.
The transparent plate is bonded to the surface of the first transparent substrate opposite to the surface facing the second transparent substrate via the second adhesive layer.
The cross-sectional second moment with respect to the neutral plane of the transverse plane of the transparent plate, the second adhesive layer, the first transparent substrate and the first resistive film is the first cross-sectional second moment and the second cross-section. Between the second moment. The first moment of inertia of the first cross section is that the transparent plate is made of a polymethylmethacrylate plate having a thickness of 500 μm, the second adhesive layer is made of an acrylic pressure-sensitive adhesive having a thickness of 50 μm, and the first transparent The sectional moment of inertia when the substrate and the first resistive film are made of an indium tin oxide film having a thickness of 100 μm. The second moment of inertia of the second cross section is such that the transparent plate is made of a polyethylene terephthalate plate having a thickness of 125 μm, the second adhesive layer is made of an acrylic adhesive having a thickness of 300 μm, and the first transparent substrate And the second moment of inertia when the first resistive film is made of an indium tin oxide film having a thickness of 100 μm.

An electronic device according to one embodiment of the present invention includes a display panel having an image display surface, a touch panel disposed on the image display surface, and a housing that supports the display panel and the touch panel.
The touch panel includes first and second transparent substrates, first and second resistance films, first and second wiring layers, first and second adhesive layers, and a transparent plate.
The first transparent substrate and the second transparent substrate are spaced apart from each other.
The first resistance film is provided on a surface of the first transparent substrate facing the second transparent substrate, and the first wiring layer is electrically connected to the first resistance film. .
The second resistance film is provided on a surface of the second transparent substrate facing the first transparent substrate, and the second wiring layer is electrically connected to the second resistance film. .
The first adhesive layer is an outer peripheral portion including a facing region between the first wiring layer and the second wiring layer in a gap between the first transparent substrate and the second transparent substrate. Is provided in the area. The first adhesive layer bonds the first transparent substrate and the second transparent substrate.
The second adhesive layer is provided on the surface of the first transparent substrate opposite to the surface facing the second transparent substrate.
The transparent plate is bonded to the surface of the first transparent substrate opposite to the surface facing the second transparent substrate via the second adhesive layer.
The cross-sectional second moment with respect to the neutral plane of the transverse plane of the transparent plate, the second adhesive layer, the first transparent substrate and the first resistive film is the first cross-sectional second moment and the second cross-section. Between the second moment. The first moment of inertia of the first cross section is that the transparent plate is made of a polymethylmethacrylate plate having a thickness of 500 μm, the second adhesive layer is made of an acrylic pressure-sensitive adhesive having a thickness of 50 μm, and the first transparent The sectional moment of inertia when the substrate and the first resistive film are made of an indium tin oxide film having a thickness of 100 μm. The second moment of inertia of the second cross section is such that the transparent plate is made of a polyethylene terephthalate plate having a thickness of 125 μm, the second adhesive layer is made of an acrylic adhesive having a thickness of 300 μm, and the first transparent substrate And the second moment of inertia when the first resistive film is made of an indium tin oxide film having a thickness of 100 μm.

  In the touch panel, the display device, and the electronic device configured as described above, the secondary moment of inertia related to the neutral axis in the entire transverse cross section of the transparent plate, the second adhesive layer, the first transparent substrate, and the first resistive film. Is set to an appropriate range. For this reason, the touch panel can be operated with a sufficiently small operating force. Further, by using a hard plate having a sufficiently high Young's modulus as the transparent plate, the surface of the touch panel, that is, the first wiring layer on the first transparent substrate, the second wiring layer on the second transparent substrate, or the like, It is possible to prevent unevenness on the contact surface.

  According to the present invention, it is possible to realize a touch panel that can be operated with a sufficiently small operating force, can be operated smoothly with a finger, a pen, or the like, and can reduce unevenness generated on the surface. In addition, it is possible to realize a display device and an electronic device that are provided with this touch panel and are excellent in operability.

1 is a perspective view showing a touch panel according to a first embodiment of the present invention. It is a disassembled perspective view of the touch panel shown in FIG. It is sectional drawing along the AA line and BB line of the touch panel shown in FIG. It is sectional drawing along CC line and DD line of the touch panel shown in FIG. It is sectional drawing along the EE line of the touch panel shown in FIG. It is sectional drawing of the edge part by the side of FPC of the touch panel shown in FIG. It is a basic diagram which shows the measuring system used for evaluation of the operating force of a touch panel in 1st Embodiment of this invention. It is a basic diagram which shows the relationship between the thickness of the 2nd contact bonding layer measured using the measuring system shown in FIG. 7, and an operating force. It is sectional drawing which shows the touchscreen by 2nd Embodiment of this invention. It is sectional drawing which shows the touchscreen by 3rd Embodiment of this invention. It is sectional drawing which shows the touchscreen by 4th Embodiment of this invention. It is a basic diagram which shows the relationship between the thickness of the 2nd contact bonding layer of the touchscreen by 4th Embodiment of this invention, and an operating force. It is a basic diagram which shows the relationship between the thickness of the 2nd contact bonding layer of the touchscreen by 4th Embodiment of this invention, and an operating force. It is a basic diagram which shows the relationship between the thickness of the 2nd contact bonding layer of the touchscreen by 4th Embodiment of this invention, and an operating force. It is a basic diagram which shows the relationship between the thickness of the 2nd contact bonding layer measured in 4th Embodiment of this invention, and an operating force. It is sectional drawing which shows the touchscreen by 5th Embodiment of this invention. It is sectional drawing which shows the display apparatus by 6th Embodiment of this invention. It is a perspective view which shows the conventional touch panel. FIG. 19 is an exploded perspective view of the touch panel shown in FIG. 18. It is sectional drawing which shows the touchscreen by the 7th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First Embodiment>
[Touch panel]
FIG. 1 is a perspective view showing a schematic configuration of a resistive touch panel 1 according to the first embodiment, and FIG. 2 is an exploded perspective view of the touch panel 1. 3A is a cross-sectional view showing an enlarged cross-sectional structure along the AA line at the outer edge of the touch panel 1 shown in FIG. 2, and FIG. 3B is a cross-sectional view along the BB line at the outer edge of the touch panel 1 shown in FIG. It is sectional drawing which expands and shows a cross-section. 4A is an enlarged cross-sectional view of the outer edge of the touch panel 1 shown in FIG. 2 taken along the line CC, and FIG. 4B is an enlarged view taken along the line DD of the outer edge of the touch panel 1 shown in FIG. It is sectional drawing which expands and shows a cross-section. FIG. 5 is an enlarged cross-sectional view showing a cross-sectional structure along the line EE of the touch panel 1 shown in FIG. FIG. 6 is an enlarged cross-sectional view showing a cross-sectional structure in the vicinity of an end portion of a flexible printed wiring board (FPC) described later in the touch panel 1.

  The touch panel 1 is used as a screen input display device by being superimposed on a display device including, for example, a liquid crystal panel or an organic EL panel. The touch panel 1 is used to directly select a display on the display screen of the display device when the user presses the surface of the touch panel 1 with a finger or a pen.

  For example, as shown in FIGS. 1 and 2, the touch panel 1 includes a pair of an upper substrate 10 and a lower substrate 20 that are disposed to face each other while being separated from each other. A flexible printed wiring board (FPC) 30 and a first adhesive layer 40 are provided between the upper substrate 10 and the lower substrate 20. The upper substrate 10 and the lower substrate 20 have the same size.

  The upper substrate 10 has a transparent substrate 11 (first transparent substrate). A resistance film 12 (first resistance film) is provided on a surface (lower surface) facing the lower substrate 20 of the transparent substrate 11. On the outer edge of the resistance film 12 on the lower surface of the transparent substrate 11, as shown in FIGS. 2, 3A and B and FIGS. 4A and B, strip-like wiring layers 13a and 13b (first wiring layers) are provided. It has been. The wiring layer 13a is connected to and electrically connected to one end of the resistance film 12. As shown in FIG. 2, the wiring layer 13a has a T-shape. The wiring layer 13 b is connected to and electrically connected to the other end of the resistance film 12. As shown in FIG. 2, the wiring layer 13b has a U-shape.

The transparent substrate 11 is made of, for example, a soft flexible transparent resin and has flexibility. The resistance film 12 is made of, for example, indium tin oxide (ITO). The wiring layers 13a and 13b are made of, for example, silver (Ag).
The transparent substrate 11 and the resistance film 12 are preferably configured so as to be able to prevent reflection of light incident on the contact surface 10a of the touch panel 1 by performing polarization control.

  A transparent plate (top plate) 15 is provided on the surface (upper surface) opposite to the lower surface on which the resistive film 12 is provided of the transparent substrate 11 via the second adhesive layer 14. For example, the transparent plate 15 has the same size as the upper substrate 10 and the lower substrate 20. The surface of the transparent plate 15 opposite to the second adhesive layer 14 is a contact surface 10a with which a finger, a pen, or the like contacts. The second adhesive layer 14 and the transparent plate 15 will be described in detail later.

  The lower substrate 20 has a transparent substrate 21 (second transparent substrate) that supports the resistive film 22 (second resistive film) with which the resistive film 12 comes into contact when the upper substrate 10 is contacted with a finger or a pen. doing. For example, as shown in FIG. 2, a resistance film 22 is provided in a region facing the resistance film 12 in a surface (upper surface) of the transparent substrate 21 facing the upper substrate 10. On the outer edge of the resistance film 22 on the upper surface of the transparent substrate 21, for example, as shown in FIGS. 2, 3A and B and FIGS. 4A and B, strip-like wiring layers 23a and 23b (second wiring layers) Is provided. The wiring layer 23 a is connected to and electrically connected to one end of the resistance film 22. As shown in FIG. 2, the wiring layer 23a has a shape close to an L shape. The wiring layer 23 b is connected to and electrically connected to the other end of the resistance film 22. As shown in FIG. 2, the wiring layer 23 b has a shape close to a shape in which the L shape is reversed. On the resistance film 22, dot spacers 24 made of a conventionally known insulator having a predetermined height that does not reach the resistance film 12 of the upper substrate 10 are arranged at a predetermined pitch, for example, in a two-dimensional array (FIG. 5). reference).

  The transparent substrate 21 is made of, for example, a soft flexible transparent resin, a hard transparent resin such as an acrylic plate, a hard transparent glass, or the like. The resistance film 22 is made of, for example, ITO. The wiring layers 23a and 23b are made of, for example, Ag.

  The first adhesive layer 40 has a rectangular ring shape having an opening 40 a in a region where the resistance film 12 and the resistance film 22 face each other, and is formed along the outer edges of the resistance films 12 and 22. The first adhesive layer 40 is formed at least in a region facing the wiring layers 13a, 13b, 23a, and 23b. Therefore, the first adhesive layer 40 adheres the upper substrate 10 and the lower substrate 20 to each other while insulating and separating the wiring layers 13a and 13b and the wiring layers 23a and 23b from each other. The first adhesive layer 40 has a notch 40b in a region corresponding to the FPC 30, and does not overlap the FPC 30 when viewed from the thickness direction. The first adhesive layer 40 is made of, for example, a double-sided tape.

  As shown in FIG. 6, the FPC 30 has a strip-like base film 31 extending in one direction. As shown in FIG. 2, the base film 31 has a pair of end portions 30 a and 30 b that face each other in the extending direction of the base film 31. For example, the end 30 a has a width wider than the width of the central portion of the base film 31, and is sandwiched between the transparent substrate 11 and the transparent substrate 21. On the other hand, the end 30b has a width wider than the width of the central portion of the base film 31, for example, as with the end 30a, and can be connected to a processing device (not shown) that processes an output signal from the touch panel 1. It has become. The base film 31 is made of, for example, polyimide.

  Four wiring layers 32 made of, for example, copper foil are provided on the surface of the base film 31 on the upper substrate 10 side. These wiring layers 32 are formed in contact with the surface of the base film 31 on the upper substrate 10 side, and are formed in the same plane. Of these wiring layers 32, the end portion on the end portion 30a side has a pad shape. Therefore, a flexible substrate having a double-sided structure in which conductor patterns are formed on both sides is used for the FPC 30.

  Four wiring layers 33 made of, for example, copper foil are provided on the surface of the base film 31 on the lower substrate 20 side. These wiring layers 33 are formed in contact with the surface on the lower substrate 20 side of the base film 31 and are formed in the same plane. These wiring layers 33 are formed in a line shape from the end 30a to the end 30b. Further, the end portion on the end portion 30 a side of these wiring layers 33 has a pad shape, and a portion other than the end portion on the end portion 30 a side of these wiring layers 33 is formed on the wiring layer 33. The width is slightly narrower than the width of the end on the end 30a side.

  Further, the FPC 30 is formed with, for example, two through holes 35 penetrating the end 30a of the base film 31 and the wiring layers 32 and 33. Of the four wiring layers 33, two wiring layers (hereinafter referred to as “through-hole non-contact wiring layers 33”) provided in the regions facing the wiring layers 23 a and 23 b avoid the through-holes 35. Extending from the end 30a to the end 30b. In addition, two wiring layers (hereinafter referred to as “wiring layer 33 in contact with a through hole”) provided in a region facing the wiring layers 13 a and 13 b among the four wiring layers 33 are in contact with the through hole 35. It extends from the end 30a to the end 30b. Note that the thickness of the through-hole non-contact wiring layer 33 is, for example, substantially the same as the thickness of the through-hole contact wiring layer 33.

  On the other hand, two wiring layers (hereinafter referred to as “through-hole non-contact wiring layer 32”) provided in regions facing the wiring layers 23a and 23b among the four wiring layers 32 avoid the through-hole 35. In this way, it is formed at the end 30a. In addition, two wiring layers (hereinafter referred to as “wiring layer 32 in contact with a through hole”) provided in a region facing the wiring layers 13 a and 13 b of the four wiring layers 32 are in contact with the through hole 35. Is formed. The thickness of the wiring layer 32 that is not in contact with the through hole is, for example, substantially the same as the thickness of the wiring layer 32 that is in contact with the through hole.

  Further, for example, a plating layer 34 is formed in the through hole 35 and on the surface in the vicinity of the through hole 35 of the wiring layers 32 and 33 in contact with the through hole. Further, for example, a plating layer 36 is formed on the surface of the end portion 30a of the wiring layers 32 and 33 that are not in contact with the through hole. The plating layer 36 is formed at the same time when forming the plating layer 34 in the manufacturing process, for example, and the thickness of the plating layer 36 is, for example, the wiring layers 32 and 33 of the plating layer 34. The thickness is substantially the same as the thickness of the portion formed on the surface. A plating layer 37 is formed on the surfaces of the plating layers 34 and 36.

  An anisotropic conductive film 38 is formed on the surface of the transparent substrate 11 on the plating layer 37 side, and the anisotropic conductive film 38 is in contact with the ends of the wiring layers 13a and 13b. On the other hand, an anisotropic conductive film 39 is formed on the surface of the transparent substrate 21 on the plating layer 37 side, and the anisotropic conductive film 39 is in contact with the ends of the wiring layers 23 a and 23 b and the spacer layer 24.

  Here, the anisotropic conductive films 38 and 39 are made of, for example, a sheet-like anisotropic conductive film (ACF), have conductivity in the thickness direction, It has insulation in the orthogonal direction. Therefore, as shown in FIG. 6, even if the anisotropic conductive film 38 is physically in contact with the wiring layers 13a and 13b, it does not conduct in the in-plane direction of the anisotropic conductive film 38. The same applies to the anisotropic conductive film 39. Even if the anisotropic conductive film 39 is physically in contact with the wiring layers 23a and 23b, the anisotropic conductive film 39 does not conduct in the in-plane direction. As a result, the wiring layer 13a is electrically connected only to the plating layer 37 facing the wiring layer 13a via the anisotropic conductive film 38, and the wiring layer 13b is connected to the wiring layer 13b via the anisotropic conductive film 38. Only the opposing plating layer 37 is electrically connected. Further, the wiring layer 23 a is electrically connected only to the plating layer 37 facing the wiring layer 23 a through the anisotropic conductive film 39, and the wiring layer 23 b is opposed to the wiring layer 23 b through the anisotropic conductive film 39. It is electrically connected only to the plating layer 37 to be performed.

  Therefore, in this touch panel 1, the two wiring layers 13 a and 13 b connected to the resistance film 12 on the transparent substrate 11 side are in contact with each other through the base film 31 and the through holes 35 provided in the wiring layers 32 and 33. The two wiring layers 33 are electrically connected. Further, the two wiring layers 23a and 23b connected to the resistance film 22 on the transparent substrate 21 side do not pass through the through-hole 35 but pass through the anisotropic conductive film 38 and the plating layers 35 and 36 so as not to contact the through-hole. The two wiring layers 33 are electrically connected.

  Although not shown, an isotropic conductive film may be used instead of the anisotropic conductive films 38 and 39. However, in that case, since conduction occurs in the in-plane direction of the conductive film, it is necessary to provide the conductive film separately for each wiring layer.

  2 and 5, the portions of the wiring layers 13a, 13b, 23a, and 23b that are in contact with the anisotropic conductive films 38 and 39 are the wiring layer 23a and the wiring in the X-axis direction in FIGS. The layer 13a, the wiring layer 23b, and the wiring layer 13b are arranged in this order, but the present invention is not limited to this. That is, the wiring layer 23a, the wiring layer 13a, the wiring layer 23b, and the wiring layer 13b may be arranged in a different order. For example, portions of the wiring layers 13a, 13b, 23a, and 23b that are in contact with the anisotropic conductive films 37 and 38 are arranged in the order of the wiring layer 23a, the wiring layer 23b, the wiring layer 13a, and the wiring layer 13b in the X-axis direction. You may go out.

Here, the second adhesive layer 14 and the transparent plate 15 will be described.
In the touch panel 1, when a user's finger or pen touches the contact surface 10 a which is the upper surface of the transparent plate 15, the touch panel 1 includes the transparent plate 15, the second adhesive layer 14, and the resistance film 12 in the vicinity of the contact portion. The entire transparent substrate 11 bends. At this time, it is necessary to operate the touch panel 1 by bringing the resistance film 12 of the transparent substrate 11 into contact with the resistance film 22 of the transparent substrate 21 with a sufficiently small operating force. On the other hand, in order to prevent the contact surface 10a from being uneven due to the wiring layers 13a and 13b on the transparent substrate 11 and the wiring layers 23a and 23b on the transparent substrate 21, the transparent plate 15 has sufficiently high rigidity. It is necessary to do so.

From this point of view, the results of studying the material and thickness of the transparent plate 15 and the second adhesive layer 14 will be described.
Here, as the transparent substrate 11 and the resistance film 12, an ITO film (resin film with an ITO film) having a total thickness of 100 μm in which an ITO film having a thickness of about 20 nm is formed on a ZEONOR film (registered trademark) made of a cycloolefin polymer. Consider the case of using. As the second adhesive layer 14, an acrylic pressure-sensitive adhesive (manufactured by Sony Chemical & Information Device Co., Ltd., trade name: CC8702, storage rigidity G ′: 90000 Pa, loss rigidity G ″: 38000 Pa, Young's modulus: about 0.8. The thickness of the second adhesive layer 14 was changed to 25 μm, 75 μm, 100 μm, and 125 μm, and the transparent plate 15 was a PMMA (thickness: 500 μm (0.5 mm)). (Polymethylmethacrylate) plate. The dot spacers 24 have a pitch of 2.5 mm and a height of 13 μm.

  The operating force characteristics (finger input characteristics) of the touch panel 1 in this case were measured as follows. As shown in FIG. 7, the lower substrate 20 side of the touch panel 1 is bonded to a sufficiently rigid glass substrate (not shown), and the FPC 30 of the touch panel 1 is connected to a personal computer 51 (TP) (touch panel). Connect to evaluation kit 52. Then, the evaluator actually draws on the contact surface 10a of the touch panel 1 in a mode in which a picture is drawn with a finger. Drawing was performed by changing the thickness of the second adhesive layer 14 to 25 μm, 75 μm, 100 μm, and 125 μm, and the operating force at that time was measured. As a result, the operating force was 0.75 N, 0.54 N, 0.44 N, and 0.32 N for the thicknesses of the second adhesive layer 14 of 25 μm, 75 μm, 100 μm, and 125 μm, respectively. The result is shown in FIG. A regression line was determined based on these data. The thickness of the second adhesive layer 14 was x (μm), the actuation force was y (N), and y = ax + b, and a and b were obtained by the least square method. As a result, a = −0.00426 and b = 0.858 were obtained. Thus, a regression line y = −0.00426x + 0.858 was obtained.

  When the thickness of the second adhesive layer 14 is 25 μm, the operating force is as high as 0.75 N, and it cannot be operated unless it is operated by applying a strong force to the contact surface 10a. There was a flying phenomenon that did not work. On the other hand, when the thickness of the second adhesive layer 14 is 75 to 125 μm, the operating force is 0.54 to 0.32 N, and the input can be smoothly performed, and the flying phenomenon does not occur. Further, even when the thickness of the second adhesive layer 14 is 50 to 75 μm, the operating force is 0.63 to 0.54 N, and similarly, the input can be smoothly performed, and the flying phenomenon does not occur.

  From the above results, in the touch panel 1 in which the transparent plate 15 is installed on the transparent substrate 11 with the second adhesive layer 14 interposed therebetween, the operating force may be reduced when the thickness of the second adhesive layer 14 is increased. I understand. And with this touch panel 1, it is possible to input smoothly with a finger. In addition, since the PMMA plate having a sufficient rigidity and thickness of 500 μm is used as the transparent plate 15, the wiring layers 13a and 13b of the transparent substrate 11 and the wiring layer 23a of the transparent substrate 21 are formed on the contact surface 10a. It is possible to prevent unevenness due to 23b or the like.

From the above experimental results, the conditions necessary for the transparent substrate 11 having the transparent plate 15, the second adhesive layer 14, and the resistance film 12 can be obtained more generally.
The whole of the transparent plate 15, the second adhesive layer 14, the transparent substrate 11, and the resistance film 12 is considered as a synthetic beam (a beam composed of two or more kinds of materials). It is assumed that the layers of the composite beam that are in contact with each other are completely bonded to each other. By the way, according to the simple theory of bending, M / I = σ / y = E / R holds. Where M is the bending moment acting on the beam, I is the secondary moment of inertia about the neutral axis (straight line passing through the centroid of the beam and parallel to the plane of the beam), and σ is the stress generated on the beam's cross section. , Y is the vertical distance from the neutral axis in the cross section of the beam, E is the Young's modulus of the beam, and R is the radius of curvature of the beam. This bending formula can be applied to the composite beam as it is.

  Now consider two composite beams with different constituent materials and thicknesses for each layer. If the second moments of section about the neutral axes of the two composite beams are the same, the behavior of the two composite beams with respect to bending can be considered to be the same.

  Therefore, the whole of the transparent plate 15, the second adhesive layer 14, the transparent substrate 11, and the resistance film 12 in the touch panel 1 used in the above-described experiment is considered as a synthetic beam (synthetic beam A). In this case, as the transparent substrate 11 and the resistance film 12, an ITO film (resin film with an ITO film) having a total thickness of 100 μm in which an ITO film having a thickness of about 20 nm was formed on a ZEONOR film (registered trademark) was used. As the second adhesive layer 14, an acrylic pressure-sensitive adhesive (manufactured by Sony Chemical & Information Device Co., Ltd., trade name: CC8702, storage rigidity G ′: 90000 Pa, loss rigidity G ″: 38000 Pa, Young's modulus: about 0.8. A PMMA plate having a thickness of 500 μm was used as the transparent plate 15. In this case, in addition to what has already been described, the results of FIG. If the thickness of the adhesive layer 14 is 50 to 300 μm, it is possible to obtain a sufficiently low operating force of 0.63 N or less, since the second adhesive layer 14 does not need to be thicker than necessary, for example, 100 μm. On the other hand, if the transparent plate 15, the second adhesive layer 14, the transparent substrate 11, and the resistance film 12, which are not limited to the above-described material limitations and thicknesses, are synthesized, This composite beam B has the same bending characteristics as the composite beam A, so that the secondary moment of inertia with respect to the neutral axis of the composite beam B is equal to the secondary cross section of the composite beam A with respect to the neutral axis. Therefore, it is sufficient that the second moment of section with respect to the neutral axis of the composite beam B is the second moment of inertia (referred to as M1) when the thickness of the second adhesive layer 14 in the composite beam A is 50 μm. And a second moment of section (M2) when the thickness of the second adhesive layer 14 is 300 μm, a low operating force of 0.63 N or less can be obtained. The thickness is generally selected to be 100 μm or more.

  The cross-sectional second moment about the neutral axis in the composite beam A can be obtained as follows. The Young's moduli of the transparent plate 15, the second adhesive layer 14, the transparent substrate 11 and the resistance film 12 of the composite beam A are E1, E2, E3, E4, the thicknesses are t1, t2, t3, t4, respectively, in the cross section. Let W be the width in the direction parallel to the vertical axis. Assuming that the transparent plate 15 having Young's modulus E1 is used as a reference, the width of the second adhesive layer 14 having Young's modulus E2 is (E2 / E1) × W, and the width of the transparent substrate 11 having Young's modulus E3 is (E3 / E1). It is assumed that the width of the resistance film 12 having × W and Young's modulus E4 is equal to (E4 / E1) × W. Therefore, the effective cross-sectional area of each element in the cross section of the composite beam A in calculating the cross-sectional secondary moment is as follows. That is, the area of the transparent plate 15 is W × t1, the area of the second adhesive layer 14 is (E2 / E1) × W × t2, the area of the transparent substrate 11 is (E3 / E1) × W × t3, and the resistance film 12 The area of (E4 / E1) × W × t4. The cross-sectional second moment can be easily calculated using these areas.

  The cross-sectional secondary moment about the neutral axis in the composite beam B can be obtained in the same manner. The width in the direction parallel to the neutral axis in the cross section of the composite beam B is the same W as that of the composite beam A. The Young's modulus of the transparent plate 15, the second adhesive layer 14, the transparent substrate 11 and the resistance film 12 of the composite beam B is E1 ', E2', E3 ', E4', and the thicknesses are t1 ', t2', t3 '. , T4 ′. In this case, based on the transparent plate 15 having the Young's modulus E1 of the composite beam A, the width of the transparent plate 15 having the Young's modulus E1 'of the composite beam B is (E1' / E1) × W and the second of the Young's modulus E2 '. The width of the adhesive layer 14 is (E2 ′ / E1) × W, the width of the transparent substrate 11 with Young's modulus E3 ′ is (E3 ′ / E1) × W, and the width of the resistive film 12 with Young's modulus E4 ′ is (E4 ′ / E1) is considered to be equal to W. Therefore, the effective cross-sectional area of each element in the cross section of the composite beam B in calculating the cross-sectional secondary moment is as follows. That is, the area of the transparent plate 15 is (E1 ′ / E1) × W × t1 ′, the area of the second adhesive layer 14 is (E2 ′ / E1) × W × t2 ′, and the area of the transparent substrate 11 is (E3 ′ / E1) × W × t3 ′, and the area of the resistance film 12 is (E4 ′ / E1) × W × t4 ′.

  The thickness and materials of the transparent plate 15, the second adhesive layer 14, the transparent substrate 11 and the resistance film 12 of the composite beam B are basically such that the secondary moments of the cross section about the neutral axis of the composite beam B are M1 and M2. As long as it is between, you can choose arbitrarily. Among these, regarding the transparent plate 15, since the upper surface of the transparent plate 15 becomes the contact surface 10a, it is desirable to use a material having a sufficiently large Young's modulus and high hardness. In this case, as the transparent plate 15, one having a Young's modulus equal to or higher than that of a PET (polyethylene terephthalate) plate is used. Various materials can be used as the material of the transparent plate 15 and are selected as necessary. Specific examples include PMMA, PET, polystyrene, polycarbonate, Sylplus (registered trademark) (high heat and transparency made by Nippon Steel Chemical Co., Ltd.). Material). The Young's modulus of some of these materials is as follows:

Material Young's modulus (GPa)
PMMA 3.4
PET 2-2.5 or 2.8-3.1
Polystyrene 3-3.5
Polycarbonate 2.6

[Method for manufacturing touch panel]
An example of the manufacturing method of the touch panel 1 will be described.
First, the resistance film 12 made of, for example, ITO is formed on one surface of the transparent substrate 11 by a conventionally known film forming method such as a sputtering method. Next, on the outer edge of the resistance film 12 of the transparent substrate 11, wiring layers 13a and 13b made of Ag, for example, are formed by applying an Ag paste by a conventionally known method such as a screen printing method. Next, the second adhesive layer 14 is applied to the entire surface of the transparent substrate 11 opposite to the resistance film 12 by a conventionally known method such as a screen printing method. Next, the transparent plate 15 is adhered by the second adhesive layer 14. In this way, the upper substrate 10 is formed.

  On the other hand, the resistance film 22 is formed on one surface of the transparent substrate 21 in the same manner as the method for forming the resistance film 11. Next, on the outer edge of the resistance film 22 of the transparent substrate 21, wiring layers 23a and 23b made of, for example, Ag are formed by applying an Ag paste by a conventionally known method such as a screen printing method. In this way, the lower substrate 20 is formed.

  Next, the lower substrate 20 is arranged on the mounting table so that the resistance film 22 side faces upward, and the rectangular first adhesive layer 40 is formed on the outer edge of the resistance film 22 of the lower substrate 20; It arrange | positions on the surface of the wiring layers 23a and 23b. Thereafter, the upper substrate 10 is disposed on the lower substrate 20 via the first adhesive layer 40 so that the resistance film 12 side faces downward, and the upper substrate 10 and the lower substrate 20 are connected to the first adhesive layer. Adhere by 40. At this time, the upper substrate 10 is disposed on the lower substrate 20 so that the upper surface of the first adhesive layer 40 is in contact with the surfaces of the wiring layers 13a and 13b.

Next, the end 30 a of the FPC 30 is inserted into the notch 40 b of the first adhesive layer 40. Thereafter, the end 30a is pressed by the pressure bonding head, and the wiring layers 13a, 13b and the ACF layer (a layer to be the anisotropic conductive film 38 later), the wiring layers 23a, 23b and the ACF layer (the anisotropic conductive film 39 later). Are connected to each other by pressure bonding. Thus, since the ACF layer becomes the anisotropic conductive films 38 and 39, the wiring layer 13a is electrically connected only to the plating layer 37 facing the wiring layer 13a via the anisotropic conductive film 38. Further, the wiring layer 13b is electrically connected only to the plating layer 37 facing the wiring layer 13b through the anisotropic conductive film 38. Further, the wiring layer 23 a is electrically connected only to the plating layer 37 facing the wiring layer 23 a through the anisotropic conductive film 39. Furthermore, the wiring layer 23 b is electrically connected only to the plating layer 37 facing the wiring layer 23 b through the anisotropic conductive film 39.
The touch panel 1 is manufactured as described above.

  According to the first embodiment, the following advantages can be obtained. That is, since the transparent plate 15 is provided on the transparent substrate 11 via the second adhesive layer 14, and the upper surface of the transparent plate 15 is used as the contact surface 10a of the touch panel 1, the operating force of the touch panel 1 is 0.63 N or less. It can be made sufficiently small. For this reason, operation of the touch panel 1 can be smoothly performed without what is called a jump in the middle. Further, since the transparent plate 15 has a Young's modulus equal to or higher than the Young's modulus of the PET plate and is sufficiently rigid and hard, the wiring layers 13a and 13b of the transparent substrate 11 and the wiring layer 23a of the transparent substrate 21 are formed on the contact surface 10a. , 23b or the like can prevent the unevenness from occurring. For this reason, even if it is a case where the whole contact surface 10a of the touch panel 1 is used as a part of the housing | casing of a display apparatus, there is no possibility that the flat feeling of the housing | casing surface may be impaired. Furthermore, since the transparent plate 15 has a Young's modulus equal to or higher than the Young's modulus of the PET plate, and has sufficient rigidity and is hard, the pencil hardness of the contact surface 10a can be improved. For example, when a PMMA plate is used as the transparent plate 15, the pencil hardness can be 6H or higher, and when a PET plate is used as the transparent plate 15, the pencil hardness can be 4H or higher.

<Second Embodiment>
[Touch panel]
As shown in FIG. 9, in the touch panel 1 according to the second embodiment, a polarizing plate 53 is provided between the transparent plate 15 and the second adhesive layer 14 in the touch panel 1 according to the first embodiment. Yes. As the polarizing plate 53, for example, a commercially available polarizing plate (SRW062AP7 manufactured by Sumitomo Chemical Co., Ltd.) having a thickness of 100 μm can be used.
In this case, a synthetic beam composed of the transparent plate 15, the polarizing plate 53, the second adhesive layer 14, the transparent substrate 11 and the resistance film 12 is considered, and the sectional moments about the neutral axis in the transverse section of the synthetic beam are M1 and M2. To be between.
The polarizing plate 53, the transparent substrate 11, and the resistance film 12 are preferably configured such that the polarization control can be performed to prevent reflection of light incident on the contact surface 10 a of the touch panel 1.
Other than the above are the same as in the first embodiment.
According to the second embodiment, advantages similar to those of the first embodiment can be obtained.

<Third Embodiment>
[Touch panel]
As shown in FIG. 10, in the touch panel 1 according to the third embodiment, a polarizing plate 53 is provided between the second adhesive layer 14 and the transparent substrate 11 in the touch panel 1 according to the first embodiment. Yes. As the polarizing plate 53, for example, a commercially available polarizing plate (SRW062AP7 manufactured by Sumitomo Chemical Co., Ltd.) having a thickness of 100 μm can be used.
In this case, a synthetic beam composed of the transparent plate 15, the second adhesive layer 14, the polarizing plate 53, the transparent substrate 11 and the resistance film 12 is considered, and the sectional moments about the neutral axis in the transverse section of the synthetic beam are M1 and M2. To be between.
The polarizing plate 53, the transparent substrate 11, and the resistance film 12 are preferably configured such that the polarization control can be performed to prevent reflection of light incident on the contact surface 10 a of the touch panel 1.
Other than the above are the same as in the first embodiment.
According to the third embodiment, advantages similar to those of the first embodiment can be obtained.

<Fourth embodiment>
[Touch panel]
As shown in FIG. 11, in the touch panel 1 according to the fourth embodiment, a polarizing plate 53 is provided between the transparent plate 15 and the second adhesive layer 14 in the touch panel 1 according to the first embodiment. Yes. In addition, a conventionally known anti-Newton ring film 53 is provided between the transparent substrate 21 and the resistance film 22. The anti-Newton ring film 53 has an air layer between the resistance film 12 of the transparent substrate 11 and the resistance film 22 of the transparent substrate 21, so that when the contact surface 10 a of the touch panel 1 is pressed with a finger or the like, the Newton ring This is to prevent the occurrence of. Here, the anti-Newton ring film 53 may be provided between the transparent substrate 11 and the resistance film 12, or between the transparent substrate 21 and the resistance film 22 and between the transparent substrate 11 and the resistance film 12. You may provide in both.
The polarizing plate 53, the transparent substrate 11, and the resistance film 12 are preferably configured such that the polarization control can be performed to prevent reflection of light incident on the contact surface 10 a of the touch panel 1.

  Consider a case where a PMMA plate or a PET plate is used as the transparent plate 15. PMMA plates with thicknesses of 200 μm, 300 μm, and 500 μm were used. A PET plate having a thickness of 50 μm, 125 μm, and 188 μm was used. As the transparent substrate 11 and the resistance film 12, an ITO film (1 / 4λ retardation film) having a total thickness of 100 μm in which an ITO film having a thickness of about 20 nm was formed on a ZEONOR film (registered trademark) was used. The same ITO film was used as the transparent substrate 21 and the resistance film 22. As the second adhesive layer 14, an acrylic pressure-sensitive adhesive (manufactured by Sony Chemical & Information Device Co., Ltd., trade name: CC8702, storage rigidity G ′: 90000 Pa, loss rigidity G ″: 38000 Pa, Young's modulus: about 0.8. For example, a commercially available polarizing plate having a thickness of 100 μm (SRW062AP7 manufactured by Sumitomo Chemical Co., Ltd.) was used as the polarizing plate 53. The pitch and height of the dot spacers 24 were 2 mm, Two types, a height of 15 μm, a pitch of 2.5 mm, and a height of 8.5 μm, were used.

  The operating force characteristic of the touch panel 1 was measured as follows by the same method as in the first embodiment. However, the operation of the touch panel 1 was performed using a pen. As a pen, a pseudo finger (a square prism with a cross section of 1 cm × 1 cm made of a plastic eraser and a flat tip) or a POM (polyoxymethylene) made of a tip with a radius of curvature of 0.8 mm is used. A pen was used.

  The measurement results of the operating force are shown in FIGS. Here, the operating force characteristics shown in FIG. 12 are data when the dot spacers 24 have a pitch of 2 mm and a height of 15 μm, and a POM pen is used for the operation. The operating force characteristics shown in FIG. 13 are data when the pitch of the dot spacers 24 is 2.5 mm and the height is 8.5 μm, and a POM pen is used for the operation. The operating force characteristics shown in FIG. 14 are data when the pitch of the dot spacers 24 is 2.5 mm and the height is 8.5 μm and a pseudo finger is used for the operation. The operating force characteristics shown in FIG. 15 are data when the pitch of the dot spacers 24 is 2 mm and the height is 15 μm and a pseudo finger is used for the operation.

  From the results shown in FIG. 12, when the thickness of the second adhesive layer 14 is 50 to 300 μm, the operating force is as low as 1.0 N or less when using any thickness PMMA plate or PET plate, I was able to input smoothly. In addition, there was no flying phenomenon that did not work depending on the location during operation.

  From the results shown in FIG. 13, when the thickness of the second adhesive layer 14 is 50 to 300 μm, the working force is as low as 0.43 N or less even when any thickness PMMA plate or PET plate is used, I was able to input smoothly. In addition, there was no flying phenomenon that did not work depending on the location during operation.

  From the results shown in FIG. 14, when the thickness of the second adhesive layer 14 is 100 to 300 μm, even when a PMMA plate having a thickness of 300 μm is used, the operating force is as low as 1.0 N or less and the input is smoothly performed. I was able to. In addition, there was no flying phenomenon that did not work depending on the location during operation.

  From the results shown in FIG. 15, when the thickness of the second adhesive layer 14 is about 300 μm, the operating force is about 1.0 N regardless of the thickness of the PMMA plate and the PET plate, and smoothly I was able to enter. In addition, there was no flying phenomenon that did not work depending on the location during operation.

From the experimental results shown in FIG. 12, the conditions necessary for the transparent plate 15, the polarizing plate 53, the second adhesive layer 14, the resistance film 12, the anti-Newton ring film 54 and the transparent substrate 11 can be obtained more generally. .
The whole of the transparent plate 15, the polarizing plate 53, the second adhesive layer 14, the resistance film 12, the anti-Newton ring film 54, and the transparent substrate 11 is considered as a synthetic beam (synthetic beam C). On the other hand, the transparent plate 15, the polarizing plate 53, the second adhesive layer 14, the resistance film 12, and the anti-Newton ring film 54, which are not limited to the above-described material limitations and thicknesses, are referred to as a composite beam D. In order for this composite beam D to have the same bending characteristics as the composite beam C, it is sufficient if it is the same as the cross-sectional secondary moment about the neutral axis of the composite beam C. The cross sectional moment about the neutral axis of the composite beam C is the largest when a PMMA plate having a thickness of 500 μm is used and the thickness of the second adhesive layer 14 is 50 μm, and the smallest is the thickness. Is a case where a 125 μm PET plate is used and the thickness of the second adhesive layer 14 is 300 μm. Therefore, if the cross-sectional secondary moment about the neutral axis of the composite beam D is between the former maximum value (M3) and the latter minimum value (M4), a low operating force of 1.0 N or less is obtained. Can be obtained. As the transparent plate 15, for example, a PMMA plate or a PET plate having a thickness of 100 μm or more and 500 μm or less is used. As the second adhesive layer 14, for example, a layer made of an acrylic pressure-sensitive adhesive having a thickness of 50 μm or more and 300 μm or less is used. As the first transparent substrate 11 and the resistance film 12, for example, an ITO film (resin film with an ITO film) having a thickness of 25 μm or more and 150 μm or less is used.

Here, the above-mentioned condition that the cross-sectional secondary moment about the neutral axis of the composite beam D is between M3 and M4 is the first condition that the cross-sectional secondary moment of the composite beam B is between M1 and M2. This is more general than the conditions described in the embodiment. The above-mentioned condition that the cross-sectional second moment with respect to the neutral axis is between M3 and M4 can be applied not only to the composite beam B but also to other composite beams having a layer configuration different from that of the composite beams B and D. It is a general thing that can be done.
Other than the above are the same as in the first embodiment.
According to the fourth embodiment, the same advantages as in the first embodiment can be obtained.

<Fifth embodiment>
[Touch panel]
As shown in FIG. 16, in the touch panel 1 according to the fifth embodiment, a polarizing plate 53 is provided between the second adhesive layer 14 and the transparent substrate 11 in the touch panel 1 according to the first embodiment. Yes. A transparent core film 55 is inserted in the second adhesive layer 14. As the core material film 55, for example, a ¼λ phase difference film or a light isotropic film can be used. As the 1 / 4λ retardation film, for example, a commercially available 1 / 4λ retardation film (SEF460138 manufactured by Sumitomo Chemical Co., Ltd.) having a thickness of 60 μm can be used.
In this case, a synthetic beam composed of the transparent plate 15, the polarizing plate 53, the second adhesive layer 14, the core material film 55, the second adhesive layer 14, the transparent substrate 11 and the resistance film 12 is considered, and the cross section of this synthetic beam So that the moment of inertia of the cross section about the neutral axis is between M3 and M4.
The polarizing plate 53, the core material film 55, the transparent substrate 11, and the resistance film 12 are preferably configured so as to be able to prevent reflection of light incident on the contact surface 10 a of the touch panel 1 by performing polarization control.
Other than the above are the same as in the first embodiment.
According to the fifth embodiment, the same advantages as those of the first embodiment can be obtained.

<Sixth Embodiment>
[Display device (electronic equipment)]
The display device according to the sixth embodiment is a display device using the touch panel 1 according to the first to fifth embodiments as a screen input display device, and is an embodiment of an electronic apparatus according to the invention.
As shown in FIG. 17, the display device 2 includes a display panel 3 (a liquid crystal display panel, an organic EL panel, or the like) having an image display surface 3a, a touch panel 1 disposed on the image display surface 3a, and the display panel 3. And a housing 5 that supports the display panel 3, the touch panel 1, and the backlight 4.

  According to the sixth embodiment, since the touch panel 1 according to the first to fifth embodiments is used for the screen input display device of the display device 2, as shown in FIG. Even when the entire contact surface 10a of the touch panel 1 is used as a part of the housing 5, the contact surface 10a has almost no unevenness, and the flatness of the housing surface may be impaired. There is no.

<Seventh embodiment>
[Touch panel]
20A and 20B show a seventh embodiment of the present invention. A touch panel 6 shown in FIG. 20A includes a first transparent substrate 11 having a first resistance film 12 and a second transparent substrate 21 having a second resistance film 22. The transparent substrates 11 and 21 are bonded via an adhesive layer 40 (first adhesive layer) so that the resistance films 12 and 22 face each other in the vertical direction. A polarizing plate 53 is bonded to the upper surface of the transparent substrate 11, and a transparent plate 15A (first transparent plate) is laminated on the upper surface of the polarizing plate 53 via an adhesive layer 14A (second adhesive layer). . On the other hand, a transparent plate 15B (second transparent plate) is bonded to the lower surface of the transparent substrate 21 via an adhesive layer 14B (third adhesive layer). Further, a transparent film 60 made of the same material as the transparent substrate 21 (for example, cycloolefin polymer) is laminated on the lower surface of the transparent plate 15B.

  The touch panel 1 of the present embodiment corresponds to a configuration in which a PMMA plate 15B as a second transparent plate is bonded to the transparent substrate 21 side based on the touch panel of the third embodiment shown in FIG. . According to the touch panel 1 of the present embodiment, it is possible to provide a touch panel with high rigidity and excellent impact resistance by sandwiching the transparent substrates 11 and 21 between the two transparent plates 15A and 15B.

  The touch panel 1 of the present embodiment includes a first step of bonding the transparent substrates 11 and 21 with the adhesive layer 40, a second step of bonding the transparent substrate 21 and the transparent plate 15B with the adhesive layer 15B, and a transparent substrate. 11 and the transparent plate 15A are manufactured by sequentially passing through a third step of bonding the transparent plate 15A with the adhesive layer 15A. FIG. 20B shows the touch panel 6 manufactured in the second step. The transparent plate 15B functions to prevent the transparent substrates 11 and 21 from warping and to adhere the transparent plate 15A to the transparent substrate 11 appropriately. Note that the touch panel 6 may be a final product.

  The transparent plate 15B is made of, for example, a PMMA (polymethylmethacrylate) plate, and is mainly provided to give a predetermined rigidity to the transparent substrates 11 and 21. The thickness of the transparent plate 15B can be set to, for example, 0.3 mm to 3 mm. PMMA has isotropic optical properties and relatively high impact resistance, but has relatively low heat resistance and humidity resistance. For this reason, the transparent plate 15B may be deformed by the influence of heat or humidity, and the transparent substrates 11 and 21 may be warped. Therefore, in the present embodiment, the transparent film 60 is laminated on the transparent plate 15B to prevent warping of the transparent plate 15B. Accordingly, the transparent plate 15A can be appropriately bonded without causing the transparent substrates 21 and 22 to be warped.

  The thickness of the transparent film 60 is not specifically limited, For example, it can comprise by the thickness equivalent to the transparent substrate 21. The transparent film 60 is not limited to the example configured with the same kind of material as the transparent substrate 21. For example, even when the transparent film 60 is made of the same kind of material as that of the polarizing plate 53, the same effect as described above can be obtained.

Although the embodiment of the present invention has been specifically described above, the present invention is not limited to the above-described embodiment, and various modifications based on the technical idea of the present invention are possible.
For example, the numerical values, structures, configurations, shapes, materials, and the like given in the above-described embodiments are merely examples, and different numerical values, structures, configurations, shapes, materials, and the like may be used as necessary.

DESCRIPTION OF SYMBOLS 1 ... Touch panel 2 ... Display apparatus 3 ... Liquid crystal display panel 3a ... Image display surface 4 ... Backlight 5 ... Case 10 ... Upper side substrate 10a ... Contact surface 11, 21 ... Transparent substrate 12, 22 ... Resistive film 13a, 13b, 23a , 23b ... wiring layer 14 ... second adhesive layer 15, 15A, 15B ... transparent plate 20 ... lower substrate 30 ... flexible printed wiring board 30a, 30b ... end 31 ... base film 32, 33 ... wiring layer 34, 36 37 ... plating layer 35 ... through hole 38, 39 ... anisotropic conductive film 40 ... first adhesive layer 40a ... opening 53 ... polarizing plate 54 ... anti-Newton ring film 55 ... core material film 60 ... transparent film

Claims (13)

A first transparent substrate and a second transparent substrate which are arranged opposite to each other and spaced apart from each other;
A first resistance film provided on a surface of the first transparent substrate facing the second transparent substrate, and a first wiring layer electrically connected to the first resistance film;
A second resistance film provided on a surface of the second transparent substrate facing the first transparent substrate, and a second wiring layer electrically connected to the second resistance film;
Provided in a region of an outer peripheral portion in a gap between the first transparent substrate and the second transparent substrate and including a facing region between the first wiring layer and the second wiring layer; A first adhesive layer that bonds the transparent substrate of 1 and the second transparent substrate;
A second adhesive layer provided on a surface of the first transparent substrate opposite to the surface facing the second transparent substrate;
A transparent plate bonded to the surface opposite to the surface facing the second transparent substrate of the first transparent substrate via the second adhesive layer;
The second moment of section with respect to the neutral axis of the transverse plane of the transparent plate, the second adhesive layer, the first transparent substrate, and the first resistive film is the second sectional moment and the second sectional moment. Next moment,
The first moment of inertia of the first cross section is that the transparent plate is made of a polymethyl methacrylate plate having a thickness of 500 μm, the second adhesive layer is made of an acrylic adhesive having a thickness of 50 μm, and the first transparent The transparent plate, the second adhesive layer, the first transparent substrate, and the first resistive film when the substrate and the first resistive film are made of an indium tin oxide film having a thickness of 100 μm. Next moment,
In the second moment of inertia of the second cross section, the transparent plate is made of a polyethylene terephthalate plate having a thickness of 125 μm, the second adhesive layer is made of an acrylic adhesive having a thickness of 300 μm, and the first transparent substrate And the cross section secondary of the transparent plate, the second adhesive layer, the first transparent substrate, and the first resistance film when the first resistance film is made of an indium tin oxide film having a thickness of 100 μm. Touch panel that is moment. The touch panel according to claim 1,
The thickness of the said 2nd contact bonding layer is a touch panel which is 50 micrometers or more and 300 micrometers or less. The touch panel according to claim 2,
The touch panel has a thickness of 100 μm or more. The touch panel according to claim 3,
The touch panel whose Young's modulus of the said transparent board is more than the Young's modulus of a polyethylene terephthalate board. The touch panel according to claim 4,
The transparent plate is a touch panel made of a polyethylene terephthalate plate or a polymethyl methacrylate plate. The touch panel according to claim 5,
A touch panel further comprising a polarizing plate provided between the transparent plate and the second adhesive layer. The touch panel according to claim 5,
A touch panel further comprising a polarizing plate provided between the second adhesive layer and the first transparent substrate. The touch panel according to claim 6,
A touch panel further comprising an anti-Newton ring film provided between the first transparent substrate and the first resistance film and / or between the second transparent substrate and the second resistance film. The touch panel according to claim 1,
The transparent plate is a polymethyl methacrylate plate or a polyethylene terephthalate plate having a thickness of 100 μm or more,
The second adhesive layer is made of an acrylic pressure-sensitive adhesive having a thickness of 50 μm or more,
The first transparent substrate and the first resistance film are touch panels made of an indium tin oxide film having a thickness of 25 μm or more. The touch panel according to claim 9,
The transparent plate is a polymethyl methacrylate plate or a polyethylene terephthalate plate having a thickness of 100 μm or more and 500 μm or less,
The second adhesive layer is made of an acrylic pressure-sensitive adhesive having a thickness of 50 μm or more and 300 μm or less,
The first transparent substrate and the first resistance film are touch panels made of an indium tin oxide film having a thickness of 25 μm to 150 μm. The touch panel according to claim 1,
A third adhesive layer provided on a surface of the second transparent substrate opposite to the surface facing the first transparent substrate;
A second transparent plate bonded to the surface opposite to the surface facing the first transparent substrate of the second transparent substrate via the third adhesive layer;
A touch panel further comprising a film made of the same material as that of the second transparent substrate, which is laminated on a surface opposite to the surface facing the third adhesive layer of the second transparent plate. A display panel having an image display surface;
A touch panel disposed on the image display surface,
The touch panel
A first transparent substrate and a second transparent substrate which are arranged opposite to each other and spaced apart from each other;
A first resistance film provided on a surface of the first transparent substrate facing the second transparent substrate, and a first wiring layer electrically connected to the first resistance film;
A second resistance film provided on a surface of the second transparent substrate facing the first transparent substrate, and a second wiring layer electrically connected to the second resistance film;
Provided in a region of an outer peripheral portion in a gap between the first transparent substrate and the second transparent substrate and including a facing region between the first wiring layer and the second wiring layer; A first adhesive layer that bonds the transparent substrate of 1 and the second transparent substrate;
A second adhesive layer provided on a surface of the first transparent substrate opposite to the surface facing the second transparent substrate;
A transparent plate bonded to the surface opposite to the surface facing the second transparent substrate of the first transparent substrate via the second adhesive layer;
The second moment of section with respect to the neutral axis of the transverse plane of the transparent plate, the second adhesive layer, the first transparent substrate, and the first resistive film is the second sectional moment and the second sectional moment. Next moment,
The first moment of inertia of the first cross section is that the transparent plate is made of a polymethyl methacrylate plate having a thickness of 500 μm, the second adhesive layer is made of an acrylic adhesive having a thickness of 50 μm, and the first transparent The transparent plate, the second adhesive layer, the first transparent substrate, and the first resistive film when the substrate and the first resistive film are made of an indium tin oxide film having a thickness of 100 μm. Next moment,
In the second moment of inertia of the second cross section, the transparent plate is made of a polyethylene terephthalate plate having a thickness of 125 μm, the second adhesive layer is made of an acrylic adhesive having a thickness of 300 μm, and the first transparent substrate And the cross section secondary of the transparent plate, the second adhesive layer, the first transparent substrate, and the first resistance film when the first resistance film is made of an indium tin oxide film having a thickness of 100 μm. A display device that is a moment. A display panel having an image display surface;
A touch panel disposed on the image display surface;
A housing that supports the display panel and the touch panel;
The touch panel
A first transparent substrate and a second transparent substrate which are arranged opposite to each other and spaced apart from each other;
A first resistance film provided on a surface of the first transparent substrate facing the second transparent substrate, and a first wiring layer electrically connected to the first resistance film;
A second resistance film provided on a surface of the second transparent substrate facing the first transparent substrate, and a second wiring layer electrically connected to the second resistance film;
Provided in a region of an outer peripheral portion in a gap between the first transparent substrate and the second transparent substrate and including a facing region between the first wiring layer and the second wiring layer; A first adhesive layer that bonds the transparent substrate of 1 and the second transparent substrate;
A second adhesive layer provided on a surface of the first transparent substrate opposite to the surface facing the second transparent substrate;
A transparent plate bonded to the surface opposite to the surface facing the second transparent substrate of the first transparent substrate via the second adhesive layer;
The second moment of section with respect to the neutral axis of the transverse plane of the transparent plate, the second adhesive layer, the first transparent substrate, and the first resistive film is the second sectional moment and the second sectional moment. Next moment,
The first moment of inertia of the first cross section is that the transparent plate is made of a polymethyl methacrylate plate having a thickness of 500 μm, the second adhesive layer is made of an acrylic adhesive having a thickness of 50 μm, and the first transparent The transparent plate, the second adhesive layer, the first transparent substrate, and the first resistive film when the substrate and the first resistive film are made of an indium tin oxide film having a thickness of 100 μm. Next moment,
In the second moment of inertia of the second cross section, the transparent plate is made of a polyethylene terephthalate plate having a thickness of 125 μm, the second adhesive layer is made of an acrylic adhesive having a thickness of 300 μm, and the first transparent substrate And the cross section secondary of the transparent plate, the second adhesive layer, the first transparent substrate, and the first resistance film when the first resistance film is made of an indium tin oxide film having a thickness of 100 μm. Electronic devices that are moments.

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