JP5248588B2 - 電流センサ - Google Patents

電流センサ Download PDF

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Publication number
JP5248588B2
JP5248588B2 JP2010281841A JP2010281841A JP5248588B2 JP 5248588 B2 JP5248588 B2 JP 5248588B2 JP 2010281841 A JP2010281841 A JP 2010281841A JP 2010281841 A JP2010281841 A JP 2010281841A JP 5248588 B2 JP5248588 B2 JP 5248588B2
Authority
JP
Japan
Prior art keywords
current
conductor portion
substrate
current conductor
hall effect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2010281841A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011069838A (ja
Inventor
テイラー，ウィリアム・ピー
ドゥーグ，マイケル・シー
シャーマ，ニルマル
ギャグノン，ジェイ
マングタニ，ヴィジャイ
ディッキンソン，リチャード
フリードリッヒ，アンドレアス・ペー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Allegro Microsystems LLC
Original Assignee
Allegro Microsystems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/140,250 external-priority patent/US6995315B2/en
Priority claimed from US11/144,970 external-priority patent/US7166807B2/en
Priority claimed from US11/336,602 external-priority patent/US7075287B1/en
Priority claimed from US11/401,160 external-priority patent/US7476816B2/en
Priority claimed from US11/383,021 external-priority patent/US20060219436A1/en
Application filed by Allegro Microsystems LLC filed Critical Allegro Microsystems LLC
Publication of JP2011069838A publication Critical patent/JP2011069838A/ja
Application granted granted Critical
Publication of JP5248588B2 publication Critical patent/JP5248588B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/202—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Measurement Of Current Or Voltage (AREA)
JP2010281841A 2005-05-27 2010-12-17 電流センサ Expired - Lifetime JP5248588B2 (ja)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US11/140,250 US6995315B2 (en) 2003-08-26 2005-05-27 Current sensor
US11/140,250 2005-05-27
US11/144,970 2005-06-03
US11/144,970 US7166807B2 (en) 2003-08-26 2005-06-03 Current sensor
US11/336,602 US7075287B1 (en) 2003-08-26 2006-01-20 Current sensor
US11/336,602 2006-01-20
US11/401,160 US7476816B2 (en) 2003-08-26 2006-04-10 Current sensor
US11/401,160 2006-04-10
US11/383,021 2006-05-12
US11/383,021 US20060219436A1 (en) 2003-08-26 2006-05-12 Current sensor

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2008513632A Division JP5468776B2 (ja) 2005-05-27 2006-05-23 電流センサ

Publications (2)

Publication Number Publication Date
JP2011069838A JP2011069838A (ja) 2011-04-07
JP5248588B2 true JP5248588B2 (ja) 2013-07-31

Family

ID=44015214

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2010281841A Expired - Lifetime JP5248588B2 (ja) 2005-05-27 2010-12-17 電流センサ
JP2010281804A Expired - Lifetime JP5248587B2 (ja) 2005-05-27 2010-12-17 電流センサ
JP2010281828A Expired - Lifetime JP4904427B2 (ja) 2005-05-27 2010-12-17 電流センサ
JP2010281774A Expired - Lifetime JP5255046B2 (ja) 2005-05-27 2010-12-17 電流センサ

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2010281804A Expired - Lifetime JP5248587B2 (ja) 2005-05-27 2010-12-17 電流センサ
JP2010281828A Expired - Lifetime JP4904427B2 (ja) 2005-05-27 2010-12-17 電流センサ
JP2010281774A Expired - Lifetime JP5255046B2 (ja) 2005-05-27 2010-12-17 電流センサ

Country Status (1)

Country Link
JP (4) JP5248588B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8907437B2 (en) * 2011-07-22 2014-12-09 Allegro Microsystems, Llc Reinforced isolation for current sensor with magnetic field transducer
CH707687B1 (de) 2013-03-08 2016-09-15 Melexis Technologies Nv Stromsensor.
US9190606B2 (en) 2013-03-15 2015-11-17 Allegro Micosystems, LLC Packaging for an electronic device
US10345343B2 (en) 2013-03-15 2019-07-09 Allegro Microsystems, Llc Current sensor isolation
US9810721B2 (en) * 2015-12-23 2017-11-07 Melexis Technologies Sa Method of making a current sensor and current sensor
JP2017134022A (ja) * 2016-01-29 2017-08-03 旭化成エレクトロニクス株式会社 電流センサ及び製造方法
CN113866475B (zh) * 2021-09-30 2025-02-18 意瑞半导体（上海）有限公司 电流传感器的引线框架及电流传感器
US11644485B2 (en) 2021-10-07 2023-05-09 Allegro Microsystems, Llc Current sensor integrated circuits
US11768230B1 (en) 2022-03-30 2023-09-26 Allegro Microsystems, Llc Current sensor integrated circuit with a dual gauge lead frame

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4425596A (en) * 1980-09-26 1984-01-10 Tokyo Shibaura Denki Kabushiki Kaisha Electric circuit breaker
JP2001165963A (ja) * 1999-12-09 2001-06-22 Sanken Electric Co Ltd ホール素子を備えた電流検出装置
JP2002267692A (ja) * 2001-03-08 2002-09-18 Yazaki Corp 電流センサ
TWI273266B (en) * 2001-11-01 2007-02-11 Asahi Kasei Emd Corp Current sensor and current sensor manufacturing method
US7709754B2 (en) * 2003-08-26 2010-05-04 Allegro Microsystems, Inc. Current sensor

Also Published As

Publication number Publication date
JP2011075576A (ja) 2011-04-14
JP5248587B2 (ja) 2013-07-31
JP2011102807A (ja) 2011-05-26
JP4904427B2 (ja) 2012-03-28
JP2011069838A (ja) 2011-04-07
JP2011069837A (ja) 2011-04-07
JP5255046B2 (ja) 2013-08-07

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