JP5241640B2 - Component mounting apparatus and lighting device including the component mounting apparatus - Google Patents

Description

The present invention includes a LE D, and a mounting member for mounting the LED, a lighting apparatus comprising a component mounting apparatus and the component mounting apparatus mounting position of the LED is shown in said mounting member.

  In recent years, as the brightness of light-emitting diodes (hereinafter referred to as LEDs) has increased, and blue LEDs have been developed, white LEDs combining blue LEDs and phosphors have been put into practical use. In connection with this, a light emitting device including an LED having characteristics such as small size, low power consumption, and long life as a light source and an illumination device including the light emitting device are used.

  An LED, which is an electronic component, is generally mounted on one surface, which is a mounting surface of a substrate such as a printed circuit board, which is a mounting body, and the light emitted from the LED is efficiently used on the substrate on which the LED is mounted. In order to do this, a reflecting member such as a highly reflective reflecting sheet is disposed on one side of the substrate. The reflecting member has an opening for allowing light from the LED to pass through, and is arranged so that the position of the opening and the LED is aligned (preferably the center of the opening and the optical axis of the LED are aligned). It is. Thereby, the light emitted from the LED is emitted in a desired direction without being disturbed by the reflecting member. As described above, in the apparatus using the LED as the light source, there is a demand for disposing the LED on the substrate without misalignment.

By the way, the mounting of the LED on the surface of the substrate is arranged and reflowed using an automatic mounting machine when the production quantity is large. On the other hand, when the production quantity is small, the cost per product increases due to the trouble of changing the setting of the automatic mounting machine. Note that the condition that the profit is greater when mounting manually than when mounting using an automatic mounting machine is expressed by the following equation based on quality engineering.
(Α1-α2) · Q <(C1-C2) · N
Here, C1 is the cost per product when the LED is manually mounted on the printed circuit board, and C2 is per product when using the automatic mounting machine including the change cost such as the setting of the automatic mounting machine. , Α1 is a product failure rate in the case of manual work, α2 is a product failure rate when using an automatic mounting machine, Q is a loss cost due to product failure, and N is a production number.

  When an electronic component such as an LED is mounted on a mounting body such as a substrate, a pattern indicating the mounting position of the electronic component is generally printed on a mounting surface on which the electronic component of the mounting body is mounted (for example, Patent Literature 1). In the electronic device disclosed in Patent Document 1, a symbol mark, a character, a number, or the like for instructing the type and position of an electronic component to be mounted on one surface of a substrate is printed as a pattern.

  The display of the position of the electronic component is such that the electronic component on the board is mounted with a component outer shape pattern formed in substantially the same shape as the projected outer shape of the electronic component on one surface of the substrate on which the electronic component is mounted. This is done by printing on one side with silk printing. As a result, the mounting position of the electronic component can be clearly indicated, and it can be confirmed that the electronic component is not forgotten to be mounted or the component is not mistaken after the mounting operation of the electronic component.

JP 2005-142405 A

  However, when only the component outline pattern of the electronic component to be mounted on the board is displayed on the board, after the electronic component is mounted on the board, the line of the component outline pattern is hidden by the electronic component and is difficult to see. For this reason, when an electronic component is mounted on a substrate by an automatic mounting machine and manual operation, there is a problem that it is difficult to visually check the positional deviation of the electronic component after mounting. In addition, when electronic components are mounted on a board by manual work, it is difficult to align the electronic component on the board if it is only the component outline pattern, and misalignment is likely to occur compared to an automatic mounting machine. There was a problem.

The present invention has been made in view of such circumstances, the alignment of the LED mounting body can be facilitated, the component mounting apparatus of the positional deviation of the instrumentation After wearing can be easily visually confirmed It is another object of the present invention to provide a lighting device including the component mounting device.

A component mounting apparatus according to the present invention includes an LED and a mounting body having a mounting surface on which the LED is mounted, and the component mounting apparatus in which a pattern indicating the mounting position of the LED is provided on the mounting surface of the mounting body. The LED includes an LED main body having an LED element and a terminal portion, and the LED main body and / or the terminal portion has a linear line segment in at least a part of the projected outer shape on the mounting surface. And at least a part of the pattern is formed on the outer side of the projected outer shape of the LED on the mounting surface, and is an outer edge pattern that is a part of an extension line of the linear line segment, and the light of the LED element. It has a center pattern that is a part of a straight line that passes through the intersection of the shaft and the mounting surface and intersects the outer shape projected onto the mounting surface of the LED main body .

In the present invention, some even without less of patterns indicating a mounting position of the LED provided on the instrumentation wearing surface of the instrumentation adherend is formed outside of the projection contour of the mounting surface the LED. From at least a portion of said pattern when mounting the LED to the mounting body is not hidden by the LED, the deviation of the mounting position of the LED can be easily visually confirmed. Moreover, when attaching LED to a mounting body by manual work, position alignment can be made easy.

In addition, the pattern is an outer edge pattern that is a part of an extension of a straight line segment of the outer shape projected onto the mounting surface of the mounting body of the LED body and / or terminal portion, and a center pattern corresponding to the optical axis of the LED element since with the door, by arranging the LED by using both patterns, it is possible to facilitate the alignment of the optical axis of the terminal portion and the LED elements, easily confirmed visually misalignment of instrumentation After wearing It becomes possible.

  An illumination device according to the present invention includes the component mounting device according to the above-described invention.

In the present invention, because they comprise a component mounting apparatus according to the foregoing invention, the LE D as a light source appropriately mounted on the mounting member, is provided in order to efficiently utilize the light from the L ED reflection It becomes possible to align with the member, and the luminous efficiency can be improved.

According to the present invention, the alignment of the LED on the instrumentation adherend, it is possible to easily implement, including the position of the terminal portion and the optical axis, is possible to easily confirm visually the position shift after wearing it can.

1 is a schematic external view of a light emitting device according to Embodiment 1 of the present invention. It is typical sectional drawing by the II-II line of FIG. It is a schematic plan view of a printed circuit board. It is an example of an illuminating device provided with a light-emitting device. 6 is a schematic plan view of a printed circuit board of a light emitting device according to Embodiment 2. FIG. 6 is a schematic plan view of a printed circuit board of a light emitting device according to Embodiment 3. FIG. It is the elements on larger scale of a printed circuit board. 6 is a partially enlarged view of a printed circuit board of a light emitting device according to Embodiment 4. FIG. It is a typical fragmentary sectional view of a light-emitting device provided with other LED. It is a schematic plan view of a printed circuit board. It is a figure which shows the attachment state to the heat sink of a printed circuit board. It is a typical bottom view of a printed circuit board.

Hereinafter, the present invention will be described in detail with reference to the drawings illustrating embodiments thereof. In the following embodiments, a light emitting device will be described as an example of a component mounting device.
(Embodiment 1)
FIG. 1 is a schematic external view of a light emitting device 10 according to Embodiment 1 of the present invention. 2 is a schematic cross-sectional view taken along the line II-II in FIG. In FIG. 2, the illustration of a reflecting member to be described later is omitted for convenience of explanation.

  In the figure, reference numeral 1 denotes a printed circuit board (mounting body) having a disk shape. The printed circuit board 1 has a printed circuit board copper foil pattern 11 formed on one surface (mounting surface) 1a thereof. A plurality of surface-mounted LEDs (electronic components) 2, 2... Are mounted on one surface 1a of the printed circuit board 1. The LED 2 includes an LED main body (electronic component main body) 21 having an LED element 21a. The LED main body 21 includes an LED element 21a and a resin-made holding portion that holds the LED element 21a in a recess provided on one surface side of the LED main body 21. Terminal portions 22 and 22 are provided on the opposite side of the concave portion of the two parallel side walls of the LED main body 21.

  As shown in FIG. 2, the LED 2 is arranged on the one surface 1a so that the terminal portions 22 and 22 are positioned on the land portions 3 and 3 provided on the one surface 1a of the printed board 1, respectively. The terminal portions 22 and 22 of the LED 2 are electrically connected to the land portions 3 and 3 by being fixed to the rectangular land portions 3 and 3 which are larger than the terminal portion 22 with solders 31 and 31. The land portion 3 is a copper foil for soldering and is provided to reinforce the strength of the solder 31.

  As described above, the reflection member 4 is concentrically disposed on the printed circuit board 1 on the side of the one surface 1a of the printed circuit board 1 on which the plurality of LEDs 2, 2... Are mounted. The reflection member 4 is made of a material having a high light reflectance, and is, for example, a disk-shaped reflection sheet having a larger diameter than the printed board 1. The reflecting member 4 has a plurality of circular openings 4a, 4a,... Provided to allow light from the LEDs 2, 2,. The openings 4a, 4a,... Are provided at the mounting positions of the LEDs 2, 2... (LED elements 21a of the LED main body 21) on the one surface 1a of the printed circuit board 1, in other words, aligned with the optical axes of the LEDs 2, 2,.

  FIG. 3 is a schematic plan view of the printed circuit board 1. In the figure, LED 2 is indicated by a two-dot chain line. A plurality of component external patterns 55, 55... Formed in accordance with the external shape of the LEDs 2, 2... To be mounted are formed on the one surface 1 a of the printed circuit board 1 at an appropriate distance in the circumferential direction of the printed circuit board 1. The component outer shape pattern 55 is printed on the printed circuit board 1 by silk printing, and the projected outer shape of the LEDs 2, 2... To be mounted on the one surface 1a of the printed circuit board 1 (the shape of the LED 2 indicated by a two-dot chain line in FIG. 3) Are formed in a rectangular frame shape so as to surround the projected outer shape. The land portions 3 and 3 are located inside the component outer shape pattern 55. By providing the component outer shape pattern 55 in this manner, it can be confirmed that there is no LED forgetting to mount, no component error, and the like. In the drawing, the LED 2, the land portions 3 and 3, and the component outer shape pattern 55 are drawn with an interval for convenience of explanation.

  On one surface 1 a of the printed circuit board 1, a long-side line segment (a straight line segment of the projected contour) that is a part of the projected contour of the LED 2 on the one surface 1 a of the terminal portion 22 faces the outside of the projected contour. A pattern 51 which is a part of the extended extension line (toward the part outline pattern 55) is formed. Also, on the one surface 1a of the printed circuit board 1, a line segment on the terminal portion 22 side (a straight line segment of the projected contour) that is a part of the projected contour of the LED 2 onto the one surface 1a of the LED main body 21 is placed outside the projected contour. A pattern 52 which is a part of an extended line extending toward the component outer shape pattern 55 is formed. The component outline pattern 55 and the patterns 51 and 52 constitute a part of the mounting position display unit 5 that indicates the mounting position of the LED 2 on the printed circuit board 1. The patterns 51 and 52 of the mounting position display unit 5 It functions as a mounting position deviation confirmation unit for confirming the mounting position deviation, and a visual confirmation unit that enables visual confirmation of the mounting position deviation after the LED 2 is mounted.

  In this way, on the printed circuit board 1 on which the patterns 51 and 52 are formed by silk printing, the projection line (outer edge) on the long side of the terminal portion 22 coincides with the pattern 51 on the terminal portion 22 side of the LED main body 21. The LED 2 is arranged and fixed inside the component outline pattern 55 so that the terminal portions 22 and 22 are positioned on the land portions 3 and 3 so that the projection line (outer edge) matches the pattern 52. Since the outer edges on the long side of the terminal portion 22 and the outer edge on the terminal portion 22 side of the LED main body 21 are arranged on the patterns 51 and 52 in this way, the positional deviation can be easily performed after the LED is mounted. It can be visually confirmed.

  In the case of manual mounting, this alignment is performed by an operator, and the operator needs to arrange the LED 2 in accordance with the patterns 51 and 52 using tweezers or the like. For example, in the case of manual soldering, it is necessary to hold the LED 2 until it hardens while being pressed by tweezers or the like after the LED 2 is arranged in accordance with the patterns 51 and 52 and the solder 31 is supplied to the connecting portion. As described above, the alignment may be performed so that the outer edge on the terminal portion 22 side of the LED main body 21 matches the pattern 52 so that the outer edge on the long side of the terminal portion 22 matches the pattern 51. Positioning of the terminal portion 22 can be facilitated. Thereby, the terminal portions 22 and 22 are appropriately disposed on the land portions 3 and 3, and the LED element 21a of the LED main body 21 of the LED 2 is also disposed at an appropriate position. As a result, the position of the opening 4a of the reflecting member 4 and the optical axis (center) of the LED 2 can be matched, and the light from the LEDs 2, 2,. The luminous efficiency can be increased. Further, since the terminal portions 22 and 22 are appropriately disposed on the land portions 3 and 3, the terminal portions 22 and 22 are securely connected to the land portions 3 and 3, and the strength of the solder 31 is reliably reinforced by the land portions 3 and 3. Can do.

  The light emitting device 10 configured as described above can be used as a light source unit of a lighting device. FIG. 4 is an example of a lighting device 100 including the light emitting device 10. The illumination device 100 will be described below by taking a downlight as an example of an embedded illumination device embedded in a ceiling mounting hole.

  In the figure, 6 is a heat sink made of metal such as aluminum. The heat sink 6 includes a cylindrical cylinder 61 and a flange 62 provided on the outer peripheral surface on one end side of the cylinder 61. The cylindrical body 61 of the heat sink 6 is provided with a heat transfer plate (not shown) on one end side. A light emitting device 10 is attached to the heat transfer plate by a printed circuit board 1. A translucent plate 7 is provided on the flange portion 62 of the heat sink 6 so as to cover the LEDs 2, 2... (Reflection member 4) of the light emitting device 10. A plurality of leaf springs 8 are attached to the cylindrical body 61 of the heat sink 6. The lighting device 100 configured as described above is fixed to a mounting hole provided in the ceiling with the flange 62 side of the heat sink 6 on the lower side via leaf springs 8, so-called downlights. Used. The reflective member 4 used for the downlight has a plurality of substantially hemispherical concave portions so as to surround the LEDs 2, 2... At positions corresponding to the LEDs 2, 2... When the reflective member 4 is attached to the heat sink 6. It is more desirable to form so that it may have a reflective part (not shown).

  In the illumination device 100, as described above, the LEDs 2, 2,... Are aligned and fixed to the printed circuit board 1, and the opening 4a of the reflecting member 4 and the optical axis of the LED 2 are aligned. All the light emitted from the LEDs 2, 2,... Is emitted to the outside without being disturbed. As described above, the light from the LEDs 2, 2,... Can be used efficiently, so that the light emission efficiency can be improved.

  In the present embodiment, the patterns 51 and 52 are provided so as to extend the projection line on the long side of the terminal portion 22 and the projection line on the terminal portion 22 side of the LED main body 21, but are not limited thereto. Instead, it may be provided outside the projected outer shape of the LED 2 in a direction protruding from the projected outer shape. The patterns 51 and 52 may be provided at an appropriate distance from the projected outer shape of the LED 2, and the direction is not limited to the direction shown in the present embodiment.

(Embodiment 2)
FIG. 5 is a schematic plan view of the printed circuit board of the light emitting device 20 according to the second embodiment. On the one surface 1a of the printed circuit board 1, a pattern 53 that is part of a line that passes through the intersection of the optical axis of the LED 2 and the one surface 1a (the center of the LED 2) and is orthogonal to the projected outer shape on the one surface 1a of the LED 2 is the projected outer shape. It is formed on the outside by silk printing. In other words, the pattern 53 is provided with a projection line (outer edge) on the long side of the projected outer shape on the one surface 1a of the terminal portion 22 of the LED 2 and a terminal portion 22 of the projected outer shape on the one surface 1a of the LED body 21 of the LED 2. It is formed in a direction orthogonal to the projection line (outer edge) on the non-side. The component outline pattern 55 and the pattern 53 constitute a part of the mounting position display portion 5a indicating the mounting position of the LED 2 on the printed circuit board 1. The pattern 53 of the mounting position display portion 5a indicates the mounting position shift of the LED 2. It functions as a mounting position deviation confirmation unit for confirming, and a visual confirmation unit that allows visual confirmation of the mounting position deviation after the LED 2 is mounted. Since the other configuration is the same as that of the first embodiment shown in FIG. 3, the same reference numerals as those in FIG. 3 are given to the corresponding components, and the detailed description of the configuration is omitted.

  Thus, on the printed circuit board 1 on which the pattern 53 is formed by silk printing, the optical axis (center) of the LED 2 is aligned with the pattern 53 (so that the intersection of the four patterns 53 and the center of the LED 2 match) The LED 2 is arranged and fixed inside the component outer shape pattern 55 so that the terminal portions 22 and 22 are positioned on the land portions 3 and 3, respectively. As described above, the pattern 53 is arranged so that the optical axis (center) of the LED 2 coincides with the pattern 53, so that the positional deviation can be easily visually confirmed after the LED is mounted.

  In the case of manual attachment, the operator can easily align the center of the LED 2 by arranging the LED 2 in accordance with the pattern 53. As a result, the position of the opening 4a of the reflection member 4 and the optical axis of the LED 2 can be matched, and the light from the LEDs 2, 2,... Can be used efficiently. Can be increased.

  In the present embodiment, the pattern 53 is provided on two orthogonal straight lines that pass through the center of the LED 2. However, the present invention is not limited to this, and the center of the LED 2 can be clearly shown outside the projected outer shape of the LED 2. What is necessary is just to provide.

(Embodiment 3)
FIG. 6 is a schematic plan view of a printed circuit board of the light emitting device 30 according to Embodiment 3. FIG. 7 is a partially enlarged view of the printed circuit board 1. In addition to the patterns 51 and 52 described in the first embodiment, the pattern 53 described in the second embodiment is formed on the one surface 1a of the printed board 1 by silk printing. Note that an anode (A) and a cathode (K) that are polarities of the terminal portions 22 are formed on one surface 1a of the printed board 1 by silk printing. In order to clearly indicate the polarities of the terminal portions 22 and 22, the LED 2 is provided with a recess 21 b in which one corner of the upper surface of the LED body 21 is notched in a triangular shape. The component outline pattern 55 and the patterns 51, 52, and 53 constitute a part of the mounting position display unit 5b that indicates the mounting position of the LED 2 on the printed circuit board 1, and the patterns 51, 52, and 53 of the mounting position display unit 5b. Functions as a mounting position deviation confirmation unit for confirming the mounting position deviation of the LED 2 and a visual confirmation unit that allows visual confirmation of the deviation of the mounting position after the LED 2 is mounted. Since the other configuration is the same as that of the first embodiment shown in FIG. 3, the same reference numerals as those in FIG. 3 are given to the corresponding components, and the detailed description of the configuration is omitted.

  As described in the first and second embodiments, the LED 2 is arranged and fixed on the printed circuit board 1 on which the patterns 51, 52, and 53 are formed as described above so as to be aligned with the patterns 51, 52, and 53. . As a result, the positional deviation can be more easily visually confirmed after the LED is mounted. Further, the alignment of the LED 2 to the printed circuit board 1 can be further facilitated. As a result, the position of the opening 4a of the reflection member 4 and the optical axis of the LED 2 can be matched, and the light emission efficiency of the light emitting device 30 can be further increased.

  In the first embodiment and the third embodiment, both the pattern 51 and the pattern 52 are formed so as to protrude to the outside of the component outer shape pattern 55. However, the present invention is not limited to this. Since the pattern 51 is used for alignment of the terminal portion 22 of the LED 2, it may be formed so as to protrude from the edge of the terminal portion 22 (L 2> 0). Since the pattern 52 is used for alignment with the edge of the LED body 21 of the LED 2, it is necessary to form the pattern 52 so as to be larger than the interval L1 between the terminal portion 22 and the component outer shape pattern 55 (L3). > L1).

(Embodiment 4)
FIG. 8 is a partially enlarged view of the printed circuit board of the light emitting device 40 according to the fourth embodiment. A rectangular pattern 54 is formed on one surface 1a of the printed board 1 by silk printing instead of the patterns 51 and 52 described in the fourth embodiment. The pattern 54 is formed so as to have the patterns 51 and 52 as a part of the contour. Moreover, the linear recessed part 21c for center alignment of LED2 is provided in the upper surface of LED main body 21 of LED2. In the present embodiment, the LED 2 has an example in which a cylindrical recess 21d is provided at one corner of the upper surface of the LED main body 21 in order to clearly indicate the polarities of the terminal portions 22 and 22. The component outline pattern 55 and the patterns 53 and 54 constitute a part of the mounting position display unit 5c indicating the mounting position of the LED 2 on the printed circuit board 1. The patterns 53 and 54 of the mounting position display unit 5c It functions as a mounting position deviation confirmation unit for confirming the mounting position deviation, and a visual confirmation unit that enables visual confirmation of the mounting position deviation after the LED 2 is mounted. Since other configurations are the same as those of the fourth embodiment shown in FIG. 7, the same reference numerals as those in FIG. 7 are given to corresponding components, and detailed description of the configurations is omitted.

  The LED 2 is arranged and fixed on the printed circuit board 1 on which the patterns 53 and 54 are formed in this manner so as to be aligned with the patterns 53 and 54. As a result, the positional deviation can be more easily visually confirmed after the LED is mounted. Further, the alignment of the LED 2 to the printed circuit board 1 can be further facilitated. As a result, the position of the opening 4a of the reflecting member 4 and the optical axis of the LED 2 can be matched, and the light emission efficiency of the light emitting device 40 can be further increased.

  In the present embodiment, the pattern 54 is formed in a rectangular shape. However, the pattern 54 is not limited to a rectangular shape, and may be a shape having the patterns 51 and 52 as a part of the contour.

  In the above embodiment, the LED 2 having the two terminal portions 22 is used, but an LED having a heat radiating terminal portion in addition to the two terminal portions 22 can be used. FIG. 9 is a schematic partial cross-sectional view of a light emitting device 50 including another LED. Between the terminal portions 22 and 22 on the lower surface of the LED main body 21 of the LED 2a, a heat radiating terminal portion 23 is provided. On the other hand, on one surface 1a of the printed circuit board 1, a land portion 3a is provided between the two land portions 3 and 3 so as to be aligned with the terminal portion 23 for heat dissipation. For example, the LED 2a is attached to the printed circuit board 1 by the following procedure. First, as shown in FIG. 9A, preliminary solders 32, 32, 32 are arranged in advance on the land portions 3, 3, 3a. Next, after the preliminary solders 32, 32, 32 are heated by the soldering iron 110, the LED 2 a is placed on the one surface 1 a of the printed board 1. Thereafter, the terminal portions 22 and 22 are fixed to the land portions 3 and 3 with the solders 31 and 31 (see FIG. 9B). Since the other configuration is the same as that of the first embodiment shown in FIG. 2, the same reference numerals as those in FIG. 2 are attached to the corresponding components, and detailed description of the configuration is omitted.

  As described above, since the LED 2 a is provided with the terminal portion 23 for heat dissipation, and the terminal portion 23 is connected to the land portion 3 by soldering, the heat generated by the LED 2 a is printed via the terminal portion 23 and the land portion 3. Since it can transmit efficiently to the board | substrate 1, the temperature rise of LED2a can be suppressed. Further, since the preliminary solder 32, 32, 32 is provided between the land portions 3, 3, 3 a and the terminal portions 22, 22, 23, the LED 2 a can be securely fixed by the printed circuit board 1.

  In the light emitting device according to the above-described embodiment, the connection terminals for supplying power to the LEDs 2, 2... Are attached from the other surface side of the printed circuit board 1 on which the LEDs 2, 2. FIG. 10 is a schematic plan view of the printed circuit board 1. FIG. 11 is a diagram illustrating a state in which the printed circuit board 1 is attached to the heat sink 6. FIG. 12 is a schematic bottom view of the printed circuit board 1. FIG. 11 is a conceptual diagram illustrating a case where the light emitting device is attached to the heat sink 6 of the lighting device 100 described in the first embodiment. As shown in FIG. 10, on the one surface 1a of the printed circuit board 1, the component symbols (LED1, etc.) of the LEDs 2, 2,.

  In the figure, 9 is a connection terminal for supplying power to the LEDs 2, 2. The connection terminal 9 includes two terminal portions 91 and 91. The connection terminal 9 has a terminal portion 91 in a hole provided in the printed circuit board 1 from the other surface (non-mounting surface of the LEDs 2, 2...) 1b of the printed circuit board 1 on which the LEDs 2, 2. , 91 are inserted, and terminal portions 91, 91 are fixed to the other surface 1b of the printed circuit board 1 by fixing them with solders 33, 33 to land portions provided on the one surface 1a side of the printed circuit board 1. Thereby, the terminal portions 91 and 91 of the connection terminal 9 and the land portion provided on the one surface 1 a side of the printed circuit board 1 are connected by the solders 33 and 33. The connection terminal 9 supplies power supplied from a power supply circuit (not shown) provided inside the heat sink 6 to the LEDs 2, 2.

  On the other surface 1b of the printed circuit board 1, as shown in FIG. 12, a copper foil pattern 12 is provided over substantially the entire other surface 1b. The copper foil pattern 12 is not formed around the terminal portion 91 on the other surface 1b of the printed circuit board 1. This is to ensure a predetermined distance D required in the electric safety law between the terminal portion 91 and the copper foil pattern 4.

  In this way, the printed circuit board 1 in which the LEDs 2, 2... Are mounted on the one surface 1a and the copper foil pattern 12 is formed on the other surface 1b is provided on the cylinder 61 of the heat sink 6 on the other surface 1b side. Installed on the board. The heat transfer plate of the cylindrical body 61 of the heat sink 6 is provided with an opening 61 a so as not to interfere with the connection terminal 9. As described above, the heat sink 6 is made of metal such as aluminum, and the printed circuit board 1 is in contact with the heat transfer plate of the cylindrical body 61 of the heat sink 6 over substantially the entire other surface 1b. The heat from the LEDs 2, 2... Mounted on the substrate 1 is efficiently transferred to the heat sink 6 from the other surface 1 b side through the printed circuit board 1.

  By the way, on the other surface 1b, which is a non-mounting surface of the LEDs 2, 2... To which the connection terminals 9 are attached, as shown in FIG. (CN1) and polarity (1,2) are often specified. Conventionally, the symbols and polarities of such connection terminals are clearly indicated by silk printing. However, silk printing of a printed circuit board has a problem that a large space and man-hours are required for managing the plate, and the cost is increased. Therefore, in the present embodiment, the letters (CN1, 1, 2) indicating the component symbol 12a and the polarity 12b in the copper foil pattern 12 on the other surface 1b side of the printed board 1 have a thickness of 0.1-0. At 5 (mm), the conductor pattern is formed by removing the copper foil portion of the copper foil pattern.

  By configuring in this way, it is possible to make the worker recognize the component symbols and polarities of the connection terminals 9 as in the case of silk printing without using silk printing, and reduce the man-hours for silk printing. Cost can be reduced. Moreover, in this structure, since the part which contacts the heat sink 61 can be comprised with the copper foil pattern 12 as large as possible similarly to the case of silk printing, heat dissipation can also be ensured.

  In the above embodiment, the patterns 51, 52, 53 formed on the one surface 1a of the printed circuit board 1 to indicate the mounting positions of the LEDs 2, 2,... Are linear, but are not limited thereto. Any shape that allows alignment of the LED main body 21, the terminal portion 22 and / or the center of the LED 2 may be used. For example, the position may be indicated by an arrow, a triangle, or the like.

  Moreover, in the above embodiment, surface mount type LED is used as LED, However, It is not limited to this, You may use LED of another type, EL (Electro Luminescence), etc. In the above embodiment, the printed board is taken as an example of the mounting body, and the LED is taken as an example of a component to be mounted on the mounting body. However, the present invention is not limited to this. The component may be a member that is positioned and mounted on the mounting body. The mounting body on which the component is mounted is not limited to the printed board, and may be a member that holds the component such as the heat sink 6.

  In the above embodiment, the light emitting device has been described as an example of the component mounting device. However, the present invention is not limited to this, and any device including a component and a mounting body on which the component is mounted may be used. Further, in the above embodiment, the example in which the light emitting device as the component mounting device is applied to the downlight has been described. However, the component mounting device is also applied to the lighting device other than the downlight and the device other than the lighting device. Needless to say, the invention can be implemented in variously modified forms within the scope of the matters described in the claims.

1 Printed circuit board (mounted body)
1a One side (mounting side)
2 LED (parts, electronic parts)
21 LED body (electronic parts body)
22 Terminal part 5, 5a, 5b, 5c Mounting position display part (pattern)
51, 52, 53, 54 patterns (mounting position deviation checking section, visual checking section, mounting position display section)
55 Component outline pattern (Mounting position display)
10, 20, 30, 40, 50 Light emitting device (component mounting device)
100 lighting equipment

Claims (3)

In a component mounting apparatus comprising an LED and a mounting body having a mounting surface for mounting the LED , wherein a pattern indicating the mounting position of the LED is provided on the mounting surface of the mounting body.
The LED includes an LED body having a LED element and a terminal portion,
The LED main body and / or terminal portion has a straight line segment in at least a part of the projected outer shape on the mounting surface,
The pattern is
At least a portion is formed outside the projected outer shape of the LED on the mounting surface ,
An outer edge pattern that is part of an extension of the linear line segment;
A component mounting apparatus , comprising: a central pattern that is a part of a straight line that passes through an intersection of the optical axis of the LED element and the mounting surface and intersects a projected outer shape of the LED main body on the mounting surface . The outer edge pattern is:
The component mounting apparatus according to claim 1, wherein the component mounting apparatus is formed for each of the LED main body and the terminal portion. Lighting apparatus comprising: a component mounting apparatus according to claim 1 or 2.

Images