JP5239688B2 - 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 - Google Patents

熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 Download PDF

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Publication number
JP5239688B2
JP5239688B2 JP2008246251A JP2008246251A JP5239688B2 JP 5239688 B2 JP5239688 B2 JP 5239688B2 JP 2008246251 A JP2008246251 A JP 2008246251A JP 2008246251 A JP2008246251 A JP 2008246251A JP 5239688 B2 JP5239688 B2 JP 5239688B2
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Japan
Prior art keywords
group
resin composition
optical semiconductor
light reflecting
thermosetting light
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Application number
JP2008246251A
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English (en)
Japanese (ja)
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JP2009141327A (ja
JP2009141327A5 (enExample
Inventor
勇人 小谷
直之 浦崎
真人 水谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2008246251A priority Critical patent/JP5239688B2/ja
Publication of JP2009141327A publication Critical patent/JP2009141327A/ja
Publication of JP2009141327A5 publication Critical patent/JP2009141327A5/ja
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Publication of JP5239688B2 publication Critical patent/JP5239688B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008246251A 2007-11-13 2008-09-25 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 Active JP5239688B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008246251A JP5239688B2 (ja) 2007-11-13 2008-09-25 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007294224 2007-11-13
JP2007294224 2007-11-13
JP2008246251A JP5239688B2 (ja) 2007-11-13 2008-09-25 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Publications (3)

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JP2009141327A JP2009141327A (ja) 2009-06-25
JP2009141327A5 JP2009141327A5 (enExample) 2011-12-08
JP5239688B2 true JP5239688B2 (ja) 2013-07-17

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009097005A (ja) * 2007-09-25 2009-05-07 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2009149845A (ja) * 2007-11-26 2009-07-09 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101671086B1 (ko) 2007-09-25 2016-10-31 히타치가세이가부시끼가이샤 열경화성 광반사용 수지 조성물, 이것을 이용한 광반도체 소자 탑재용 기판 및 그 제조 방법, 및 광반도체 장치
JP2013077794A (ja) * 2011-09-16 2013-04-25 Sekisui Chem Co Ltd 光半導体装置
JP2015211112A (ja) * 2014-04-25 2015-11-24 株式会社カネカ 発光ダイオード用硬化性樹脂組成物、発光ダイオードのパッケージ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5021151B2 (ja) * 2003-11-19 2012-09-05 株式会社カネカ 半導体のパッケージ用硬化性樹脂組成物および半導体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009097005A (ja) * 2007-09-25 2009-05-07 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2009149845A (ja) * 2007-11-26 2009-07-09 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

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