JP5236397B2 - 非化学量論的正方晶系アルカリ土類シリケート蛍光体を用いた発光装置 - Google Patents
非化学量論的正方晶系アルカリ土類シリケート蛍光体を用いた発光装置 Download PDFInfo
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- JP5236397B2 JP5236397B2 JP2008219130A JP2008219130A JP5236397B2 JP 5236397 B2 JP5236397 B2 JP 5236397B2 JP 2008219130 A JP2008219130 A JP 2008219130A JP 2008219130 A JP2008219130 A JP 2008219130A JP 5236397 B2 JP5236397 B2 JP 5236397B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
(化学式1)
(BauSrvCawCux)3−y(Zn,Mg,Mn)zSi1+bO5+2b:Eua
ここで、u+v+w+x=1、y=z+a、z≦2、0<x≦1、0<a≦0.5、及び0<b<0.5である。また、銅が基本的にマトリクスの必須部分である正方晶系の非化学量論的シリケートが提供され得る。
図1は、本発明の一実施例による発光装置100を説明するための断面図である。図1は、少なくとも一つの発光ダイオードと発光物質とが組み合わせられたチップ型パッケージを示す。
以下、本発明の実施例に用いられる発光物質3について説明する。
(化学式1)
(BauSrvCawCux)3−y(Zn,Mg,Mn)zSi1+bO5+2b:Eua
ここで、u+v+w+x=1、y=z+a、z≦2、0<x≦1、0<a≦0.5、及び0<b<0.5である。
本発明の発光装置に用いられる発光物質の一実施例である下記の化学式2で表される発光物質の製造方法について説明する。
(化学式2)
Cu0.05Sr2.91Si1.05O5.1:Eu0.04
本発明の発光装置に用いられる発光物質の一実施例である下記の化学式3で表される発光物質の製造方法について説明する。
(化学式3)
Cu0.02Sr2.54Ba0.4Si1.03O5.06:Eu0.04
本発明の発光装置に用いられる発光物質の一実施例である下記の化学式4で表される発光物質の製造方法について説明する。
(化学式4)
Cu0.03Sr2.92Ca0.01Si1.03O5.06:Eu0.04
2 導電性ワイヤ
3 発光物質
5 電極パターン
6 発光ダイオード
9 伝導性接着剤
21 リフレクター
31、32 リード電極
33 コップ部
34 硬化性樹脂成形部
41 ヒートシンク
43 ハウジング
44 リード端子
51、52 ヒートシンク
53 ハウジング
54 リード端子
Claims (17)
- 発光ダイオードと、
前記発光ダイオードの周囲に配置され、前記発光ダイオードから放出された光の少なくとも一部を吸収し、吸収した光とは異なる波長の光を放出する非化学量論的発光物質とを備え、
前記非化学量論的発光物質は、正方晶系結晶構造を有し、結晶格子内に、化学量論的結晶構造のシリケート蛍光体に比べて、より多量のシリコンを有し、そのマトリクス内に2価の銅を含有し、活性剤としてユウロピウムを含有し、
且つ化学式(Ba u Sr v Ca w Cu x ) 3−y (Zn、Mg、Mn) z Si 1+b O 5+2b :Eu a で表されるシリケートを含み、u+v+w+x=1、y=z+a、z≦2、0<x≦1、0<a≦0.5及び0<b<0.5であることを特徴とする発光装置。 - 前記発光物質が、波長250nm以上500nm以下の範囲の光により励起されることを特徴とする請求項1に記載の発光装置。
- 前記発光物質が、前記発光ダイオードから放出した光の波長よりもより長波長の光を放出することを特徴とする請求項1に記載の発光装置。
- 前記発光物質が、500nm以上630nm以下に発光ピーク波長を有する光を放出することを特徴とする請求項3に記載の発光装置。
- 前記発光ダイオードから放出された光と、前記発光物質から放出された光との混合により、白色光または所望の色相の光が生成されることを特徴とする請求項1に記載の発光装置。
- 前記発光ダイオードは、青色光を放出する発光ダイオードであり、
前記発光装置が、前記発光ダイオードと前記発光物質とにより、Ra=80〜95である演色指数(CRI)を有する白色光を生成することを特徴とする請求項1に記載の発光装置。 - 前記発光物質が、前記発光ダイオードの側面、上面、及び下面の少なくとも一面に配置されることを特徴とする請求項1に記載の発光装置。
- 前記発光物質が、接着剤または成形剤に混合されることを特徴とする請求項7に記載の発光装置。
- 前記発光ダイオード及び前記発光物質が、一つのパッケージ内に配置されていることを特徴とする請求項1に記載の発光装置。
- 前記パッケージ内に配置された他の発光ダイオードをさらに含み、前記他の発光ダイオードは、前記発光物質の発光ピーク波長よりもより長波長の光を放出することを特徴とする請求項9に記載の発光装置。
- 前記パッケージが、基板を含み、前記発光ダイオードが、基板上に実装されたことを特徴とする請求項9に記載の発光装置。
- 前記基板が、印刷回路基板またはリードフレームを含むことを特徴とする請求項11に記載の発光装置。
- 前記パッケージが、リフレクターをさらに含み、前記発光ダイオードが、前記リフレクター内に実装されることを特徴とする請求項11に記載の発光装置。
- 前記基板上において、前記発光ダイオードを封止する成形部をさらに含むことを特徴とする請求項11に記載の発光装置。
- 前記発光物質が、前記成形部内に分布されていることを特徴とする請求項14に記載の発光装置。
- 前記パッケージが、ヒートシンクを含み、前記発光ダイオードが、前記ヒートシンク上に実装されることを特徴とする請求項9に記載の発光装置。
- 前記発光ダイオードが、複数個の発光セルを有する交流駆動型の発光ダイオードであることを特徴とする請求項1に記載の発光装置。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20070086483 | 2007-08-28 | ||
| KR10-2007-0086483 | 2007-08-28 | ||
| KR1020080075181A KR101055769B1 (ko) | 2007-08-28 | 2008-07-31 | 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치 |
| KR10-2008-0075181 | 2008-07-31 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013063880A Division JP5599483B2 (ja) | 2007-08-28 | 2013-03-26 | 非化学量論的正方晶系アルカリ土類シリケート蛍光体を用いた発光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009055043A JP2009055043A (ja) | 2009-03-12 |
| JP5236397B2 true JP5236397B2 (ja) | 2013-07-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008219130A Expired - Fee Related JP5236397B2 (ja) | 2007-08-28 | 2008-08-28 | 非化学量論的正方晶系アルカリ土類シリケート蛍光体を用いた発光装置 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP2031039B1 (ja) |
| JP (1) | JP5236397B2 (ja) |
| WO (1) | WO2009028818A2 (ja) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100655894B1 (ko) | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
| KR100658700B1 (ko) | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Rgb 발광소자와 형광체를 조합한 발광장치 |
| US8318044B2 (en) | 2004-06-10 | 2012-11-27 | Seoul Semiconductor Co., Ltd. | Light emitting device |
| KR100665298B1 (ko) | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광장치 |
| KR100665299B1 (ko) | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광물질 |
| KR101258397B1 (ko) | 2005-11-11 | 2013-04-30 | 서울반도체 주식회사 | 구리 알칼리토 실리케이트 혼성 결정 형광체 |
| KR101055772B1 (ko) | 2005-12-15 | 2011-08-11 | 서울반도체 주식회사 | 발광장치 |
| KR100875443B1 (ko) | 2006-03-31 | 2008-12-23 | 서울반도체 주식회사 | 발광 장치 |
| KR101258227B1 (ko) | 2006-08-29 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
| CN101784636B (zh) | 2007-08-22 | 2013-06-12 | 首尔半导体株式会社 | 非化学计量四方铜碱土硅酸盐磷光体及其制备方法 |
| KR101055769B1 (ko) | 2007-08-28 | 2011-08-11 | 서울반도체 주식회사 | 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치 |
| KR101055762B1 (ko) | 2009-09-01 | 2011-08-11 | 서울반도체 주식회사 | 옥시오소실리케이트 발광체를 갖는 발광 물질을 채택한 발광 장치 |
| JP5624616B2 (ja) * | 2009-06-24 | 2014-11-12 | ソウル セミコンダクター カンパニー リミテッド | オキシオルトシリケート発光体を有する発光物質を用いる発光装置 |
| DE102009030205A1 (de) | 2009-06-24 | 2010-12-30 | Litec-Lp Gmbh | Leuchtstoffe mit Eu(II)-dotierten silikatischen Luminophore |
| EP2599852B1 (en) * | 2010-07-30 | 2016-03-02 | Ocean's King Lighting Science&Technology Co., Ltd. | Metal nano particles doped with silicate luminescent materials and preparation methods thereof |
| US9234129B2 (en) | 2010-08-14 | 2016-01-12 | Seoul Semiconductor Co., Ltd. | Surface-modified quantum dot luminophores |
| US9196785B2 (en) | 2010-08-14 | 2015-11-24 | Seoul Semiconductor Co., Ltd. | Light emitting device having surface-modified quantum dot luminophores |
| US9614129B2 (en) | 2010-08-14 | 2017-04-04 | Seoul Semiconductor Co., Ltd. | Light emitting device having surface-modified luminophores |
| DE102010034322A1 (de) * | 2010-08-14 | 2012-02-16 | Litec-Lp Gmbh | Oberflächenmodifizierter Silikatleuchtstoffe |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW459403B (en) | 2000-07-28 | 2001-10-11 | Lee Jeong Hoon | White light-emitting diode |
| AT410266B (de) | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
| JP2003306674A (ja) * | 2002-04-15 | 2003-10-31 | Sumitomo Chem Co Ltd | 白色led用蛍光体とそれを用いた白色led |
| WO2004085570A1 (en) | 2003-03-28 | 2004-10-07 | Korea Research Institute Of Chemical Technology | Strontium silicate-based phosphor, fabrication method thereof, and led using the phosphor |
| JP2006012770A (ja) * | 2004-05-27 | 2006-01-12 | Hitachi Ltd | 発光装置及び該発光装置を用いた画像表示装置 |
| US7601276B2 (en) * | 2004-08-04 | 2009-10-13 | Intematix Corporation | Two-phase silicate-based yellow phosphor |
| JP4880892B2 (ja) * | 2004-10-18 | 2012-02-22 | 株式会社東芝 | 蛍光体,蛍光体の製造方法およびこれを用いた発光装置 |
| KR100697822B1 (ko) * | 2005-06-23 | 2007-03-20 | 한국화학연구원 | Uv led용 스트론튬마그네슘실리케이트계 청색 형광체 및 이의 제조방법 |
| KR101055772B1 (ko) * | 2005-12-15 | 2011-08-11 | 서울반도체 주식회사 | 발광장치 |
| CN101784636B (zh) * | 2007-08-22 | 2013-06-12 | 首尔半导体株式会社 | 非化学计量四方铜碱土硅酸盐磷光体及其制备方法 |
-
2008
- 2008-08-14 WO PCT/KR2008/004734 patent/WO2009028818A2/en not_active Ceased
- 2008-08-27 EP EP08015119A patent/EP2031039B1/en not_active Not-in-force
- 2008-08-28 JP JP2008219130A patent/JP5236397B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP2031039A2 (en) | 2009-03-04 |
| WO2009028818A2 (en) | 2009-03-05 |
| EP2031039A3 (en) | 2010-09-29 |
| WO2009028818A3 (en) | 2009-04-23 |
| JP2009055043A (ja) | 2009-03-12 |
| EP2031039B1 (en) | 2012-01-11 |
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