JP5209689B2 - Ultrasonic probe - Google Patents

Description

  The present invention relates to an ultrasonic probe used in an ultrasonic diagnostic apparatus, an ultrasonic flaw detector, and the like.

  Conventionally, an ultrasonic probe used in an ultrasonic diagnostic apparatus functions to transmit and receive electrical signals between an ultrasonic sensor (ultrasonic transducer) that transmits and receives ultrasonic waves and the ultrasonic transducer and the ultrasonic diagnostic apparatus body. Cable assembly, and an integrated circuit module for processing electrical signals as required.

  In recent years, an ultrasonic probe that performs deflection and focusing of an ultrasonic beam in all directions and can perform three-dimensional scanning with ultrasonic waves, and three-dimensional based on ultrasonic information from a subject collected by the ultrasonic probe. An ultrasonic diagnostic apparatus that generates and displays a (three-dimensional) ultrasonic image has been studied.

  As an ultrasonic probe that realizes this omnidirectional focusing of ultrasonic waves and high-speed three-dimensional scanning, as shown in FIGS. 26A and 26B, an ultrasonic vibration element constituting an ultrasonic transducer is a matrix. There are two-dimensional array ultrasonic probes arranged in a large number.

  As shown in FIGS. 26A and 26B, the two-dimensional array ultrasonic transducer 10 includes an acoustic matching layer 12, a ground electrode 14, an ultrasonic vibration element (piezoelectric body) 16, a signal electrode 18, and a backing material 20 ( The load material phase) and the signal lead 22 are provided.

  The acoustic matching layer 12 is provided so as to be positioned between the subject (not shown) and the ultrasonic vibration element 16, and matches the acoustic impedance between the subject and the ultrasonic vibration element 16. is there.

  The ground electrode 14 is provided at one end of each ultrasonic vibration element 16. The ground electrode 14 is grounded.

  The ultrasonic vibration elements (piezoelectric bodies) 16 are piezoelectric elements made of two-component or three-component piezoelectric ceramics, and are arranged in a two-dimensional matrix. This two-dimensional arrangement of the ultrasonic vibration elements 16 enables omnidirectional focusing of ultrasonic waves and high-speed three-dimensional scanning.

  The signal electrode 18 is provided at the other end (that is, one end different from the ground electrode 14) of each ultrasonic vibration element 16, and is applied with electric power for the piezoelectric effect or electricity based on the ultrasonic wave received from the subject. An electrode for inputting a signal.

  The backing material 20 is provided on the back surface of the ultrasonic vibration element 16 and mechanically supports the ultrasonic vibration element 16.

  Further, the backing material 20 brakes the movement of the ultrasonic vibration element 16 in order to shorten the ultrasonic pulse.

  The backing material 20 has a signal lead 22 extending from the signal electrode 18 in a direction perpendicular to the arrangement surface of the ultrasonic vibration elements 16 so that end portions 221 of the signal leads 22 described later have the same arrangement pitch as the ultrasonic vibration elements 16. A path through which the material can be drawn is formed.

  The signal lead 22 has an end 221 of the signal lead 22 at one end thereof. Further, the other end is connected to the signal electrode 18 of each ultrasonic vibration element 16, and extends from the signal electrode 18 in a direction perpendicular to the arrangement surface of the ultrasonic vibration elements 16 to pass through the backing material 20. The end 221 of the signal lead 22 is pulled out. Therefore, the end portion 221 of the signal lead 22 is configured in a two-dimensional array on the surface of the backing material 20 on the side opposite to the ultrasonic vibration element 16.

  As described above, when the mounting density of the ultrasonic vibration element is increased, a connection relationship with an integrated circuit or the like that drives the ultrasonic vibration element or processes data from the ultrasonic vibration element becomes a problem.

  A number of proposals have been studied for a two-dimensional array ultrasonic probe that solves this problem. (For example, Patent Literature 1 to Patent Literature 3).

  According to Patent Document 1, a structure in which a hole structure is provided in a backing material and a signal is extracted is proposed. According to Patent Document 2, a signal extraction unit is formed by stacking substrates corresponding to the arrangement of ultrasonic vibration elements. A constructing structure has been proposed.

  The structure of the two-dimensional array ultrasonic probe disclosed in these documents makes it possible to keep the acoustic characteristics of one element good.

  Further, according to Patent Document 3, a structure in which a laminated substrate 80 for signal extraction is arranged directly below an ultrasonic vibration element has been proposed, and a structure in which a signal can be extracted relatively easily even if the element pitch is reduced. Is disclosed.

US Pat. No. 5,267,221 JP-A-62-2799 US Pat. No. 5,311,095

  However, since the ultrasonic probe has a basic configuration in which the ultrasonic transducer and the ultrasonic diagnostic apparatus main body are connected by a cable assembly, in the two-dimensional array ultrasonic probe having a fine ultrasonic vibration element, the ultrasonic transducer An integrated circuit or the like for efficiently extracting an ultrasonic signal from the ultrasonic transducer is required in the vicinity of the ultrasonic transducer.

  On the other hand, in the two-dimensional array ultrasonic probe, in the configuration in which the signal from the ultrasonic vibration element is transmitted to the ultrasonic diagnostic apparatus main body, the number of ultrasonic vibration elements is enormous, so the number of cable cores of the cable assembly becomes enormous. This does not match the usage of normal ultrasonic diagnostic equipment.

  Therefore, an integrated circuit or the like that functions to process an ultrasonic signal from the ultrasonic transducer and transmit it to the ultrasonic diagnostic apparatus after performing an operation to reduce the number of signals is necessary.

  That is, it is required not only to draw out a signal line but also to mount an integrated circuit or the like for processing an electrical signal guided by the signal line from the ultrasonic vibration element group at a high density in the vicinity of the ultrasonic transducer.

  As a technique for meeting this requirement, as disclosed in Japanese Patent Application Laid-Open No. 2001-292396 by the present inventors, two types of substrates are electrically and mechanically connected substantially orthogonally using signal leads. A configuration is proposed.

  However, even in this configuration, since it is impossible to sufficiently reduce the signal lead pitch to be formed, there has been a limit to mounting the connecting portion between the ultrasonic transducer and the integrated circuit at a high density. As a result, there is a problem that the outer shape of the ultrasonic probe becomes very large. In addition, in this configuration, it is very difficult to assemble a plurality of substrates three-dimensionally.

  The reason why the integrated circuit or the like is mounted on the ultrasonic transducer at a high density is that there is a limit between the signal lead 22 and the integrated circuit 45 as in the conventional configuration of the ultrasonic probe shown in FIG. The connection is made by the relay board 30 having only through holes (not shown), and the board 40 on which the integrated circuit 45 is mounted is directly installed in the through holes formed in the relay board 30. The hole structure is larger than the pitch of the signal leads 22.

  In addition, as shown in FIG. 27, the connection between the ultrasonic transducer 10 and the IC substrate 40 is provided on the signal lead pad 23 (not shown) provided on the back side of the ultrasonic transducer 10 and on the IC substrate 40 side. Made by connecting with protruding connecting pins. Accordingly, a space for projecting the connection pins on the IC substrate 40 is required, so that the number of connection pins to be installed is limited. Further, since the connecting pin has a protruding shape, alignment for connecting to the signal lead pad 23 (not shown) is difficult, and there is a risk that poor connection occurs.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to connect an ultrasonic transducer and an IC substrate without using a pin-shaped electrode whose forming area is enlarged, and to achieve a compact super It is to provide an acoustic probe.

  Another object of the present invention is to provide an ultrasonic probe in which an integrated circuit or the like for processing an electrical signal guided by a signal line from an ultrasonic vibration element group is mounted at a high density in the vicinity of the ultrasonic transducer. .

In order to solve the above-described problem, an ultrasonic probe according to the first aspect of the present invention includes a plurality of ultrasonic vibration elements arranged in a matrix and the electric signal transmitted from the ultrasonic vibration elements. A backing material that brakes the ultrasonic vibration element by inserting a plurality of signal leads provided so as to protrude from each of the ultrasonic vibration elements, and an integrated circuit that processes the electrical signal are mounted, and is pulled out from the integrated circuit And an IC substrate having a connection pad connected to the signal lead as an end of the signal line, wherein the connection pad is provided on the front surface and / or the back surface of the IC substrate. a first connection pad, the connection member having an end face to convert a connection surface of said first connection pads in a direction opposite to the signal lead pad as an end of the signal leads before Characterized in that provided on the connecting surface of the first connection pads.

  In order to solve the above-mentioned problem, the ultrasonic probe according to the invention described in claim 2 is the ultrasonic probe according to claim 1, wherein the second connection pad is provided on the end face of the IC substrate facing the signal lead pad. Is provided.

  In order to solve the above-mentioned problem, the ultrasonic probe according to the invention described in claim 3 is the ultrasonic probe according to claim 2, wherein the backing material includes the first connection pad and / or the second probe. A groove portion having an abutting surface with which the connection pad abuts is formed, the signal lead pad is formed on the abutting surface of the groove portion, and an end surface of the IC substrate is fitted into the groove portion, whereby the signal lead pad and the Conduction with the first connection pad and / or the second connection pad is performed.

In order to solve the above-described problem, an ultrasonic probe according to the invention described in claim 4 includes a plurality of ultrasonic vibration elements arranged in a matrix and the electric signal transmitted from the ultrasonic vibration elements. A backing material that inserts a plurality of signal leads provided so as to protrude from each of the ultrasonic vibration elements to brake the ultrasonic vibration element, and a first relay pad that has a flat plate shape and is electrically connected to the signal lead. A relay board formed on a surface facing the backing material, and a second relay pad electrically connected to the first relay pad formed on a surface opposite to the surface facing the backing material; An ultrasonic probe having an integrated circuit for processing signals and an IC substrate having a connection pad connected to the second relay pad, wherein the connection pad is formed on the IC substrate. A first connection pad provided on a surface and / or back surface, the first connection connecting member said first having an end face to be converted in the direction of the connection surface of the pad facing the second relay pads It is provided on the connection surface of the connection pad.

  In order to solve the above-described problem, an ultrasonic probe according to the invention described in claim 5 is the ultrasonic probe according to claim 4, wherein the second end face of the IC substrate facing the second relay pad is a second one. A connection pad is provided.

  In order to solve the above-mentioned problem, the ultrasonic probe according to the invention described in claim 6 is the ultrasonic probe according to claim 5, wherein the relay board includes the first connection pad and / or the second probe. A groove portion having an abutting surface with which the connection pad abuts is formed, the second relay pad is formed on the abutting surface of the groove portion, and an end surface of the IC substrate is fitted into the groove portion to thereby form the second The relay pad is electrically connected to the first connection pad and / or the second connection pad.

  In order to solve the above-mentioned problem, an ultrasonic probe according to the invention described in claim 7 is the ultrasonic probe according to any one of claims 2, 3, 5 and 6, wherein the first connection pad and the first probe 2 connection pads are connected.

  In order to solve the above-described problem, an ultrasonic probe according to an eighth aspect of the present invention is the ultrasonic probe according to any one of the first to seventh aspects, wherein a plurality of the ICs are disposed so that the connection surface is exposed. The resin is filled between the substrates.

  According to the present invention, since a pin-shaped electrode is not used as the electrode on the IC substrate side, the formation area of the electrode is not enlarged, and the ultrasonic transducer and the IC substrate are connected. A small ultrasonic probe can be provided.

The perspective view which shows the structure of the ultrasonic transducer in 1st Embodiment of the ultrasonic probe which concerns on this invention. The perspective view which shows the structure of the IC substrate connected to the ultrasonic transducer and ultrasonic transducer in 1st Embodiment of the ultrasonic probe which concerns on this invention. 1 is a perspective view showing a configuration of an ultrasonic transducer, a relay board, and an IC board connected to the relay board in the first embodiment of the ultrasonic probe according to the present invention. The perspective view which shows the structure of the relay board | substrate in 1st Embodiment of the ultrasonic probe which concerns on this invention. 1 is a perspective view showing a configuration of an IC substrate in an ultrasonic probe according to a first embodiment of the present invention. The perspective view which shows the connection aspect of the ultrasonic transducer or relay board | substrate in 1st Embodiment of the ultrasonic probe which concerns on this invention, and an IC board. The perspective view which shows the connection aspect of the ultrasonic transducer or relay board | substrate in 1st Embodiment of the ultrasonic probe which concerns on this invention, and an IC board. 1 is a perspective view showing a configuration of an IC substrate unit in a first embodiment of an ultrasonic probe according to the present invention. The perspective view which shows the structure of the IC substrate in 2nd Embodiment of the ultrasonic probe which concerns on this invention. The perspective view which shows the connection aspect of the ultrasonic transducer or relay board | substrate in 2nd Embodiment of the ultrasonic probe which concerns on this invention, and an IC board. The perspective view which shows the connection aspect of the ultrasonic transducer or relay board | substrate in 2nd Embodiment of the ultrasonic probe which concerns on this invention, and an IC board | substrate unit. The perspective view which shows the structure of the IC substrate unit in 2nd Embodiment of the ultrasonic probe which concerns on this invention. The perspective view which shows the structure of IC board in 3rd Embodiment of the ultrasonic probe which concerns on this invention. The perspective view which shows the connection aspect of the ultrasonic transducer or relay board | substrate in 3rd Embodiment of the ultrasonic probe which concerns on this invention, and an IC board. The perspective view which shows the connection aspect of the ultrasonic transducer or relay board | substrate in 3rd Embodiment of the ultrasonic probe which concerns on this invention, and an IC board | substrate unit. The perspective view which shows the structure of the IC substrate unit in 3rd Embodiment of the ultrasonic probe which concerns on this invention. The perspective view which shows the structure of the IC substrate in 4th Embodiment of the ultrasonic probe which concerns on this invention. The perspective view which shows the connection aspect of the ultrasonic transducer in 4th Embodiment of the ultrasonic probe which concerns on this invention, or a relay board | substrate, and an IC board. The perspective view which shows the connection aspect of the ultrasonic transducer in 4th Embodiment of the ultrasonic probe which concerns on this invention, or a relay board | substrate, and an IC board. The perspective view which shows the structure of the IC substrate unit in 4th Embodiment of the ultrasonic probe which concerns on this invention. The perspective view which shows the other structure of the IC board in 4th Embodiment of the ultrasonic probe which concerns on this invention. The perspective view which shows the structure of the IC substrate in 5th Embodiment of the ultrasonic probe which concerns on this invention. The perspective view which shows the connection aspect of the ultrasonic transducer or relay board | substrate in 5th Embodiment of the ultrasonic probe which concerns on this invention, and an IC board. The perspective view which shows the connection aspect of the ultrasonic transducer or relay board | substrate in 5th Embodiment of the ultrasonic probe which concerns on this invention, and an IC board | substrate unit. The perspective view which shows the structure of the IC substrate unit in 5th Embodiment of the ultrasonic probe which concerns on this invention. The perspective view which shows the structure of the conventional ultrasonic transducer. The perspective view which shows the structure of the conventional ultrasonic probe.

Embodiments of the present invention will be described below with reference to the drawings.
(First embodiment)

  FIG. 1 is a schematic diagram of a two-dimensional array ultrasonic transducer 10 included in a two-dimensional array ultrasonic probe according to the first embodiment of the present invention. FIG. 1A is a perspective view of the two-dimensional array ultrasonic transducer 10, and FIG. 1B is a cross-sectional view taken along line AA in FIG.

  As shown in FIG. 1A, the two-dimensional array ultrasonic transducer 10 includes an acoustic matching layer 12, an earth electrode 14, an ultrasonic vibration element (piezoelectric body) 16, a signal electrode 18, and a backing material 20 (loading material phase). And a signal lead 22.

  The acoustic matching layer 12 is provided so as to be positioned between the subject (not shown) and the ultrasonic vibration element 16, and matches the acoustic impedance between the subject and the ultrasonic vibration element 16. is there.

  The ground electrode 14 is provided at one end of each ultrasonic vibration element 16. The ground electrode 14 is grounded.

  The ultrasonic vibration elements (piezoelectric bodies) 16 are piezoelectric elements made of two-component or three-component piezoelectric ceramics, and are arranged in a two-dimensional matrix. This two-dimensional arrangement of the ultrasonic vibration elements 16 enables omnidirectional focusing of ultrasonic waves and high-speed three-dimensional scanning.

  The signal electrode 18 is provided at the other end of each ultrasonic vibration element 16 (that is, one end different from the ground electrode 14), and is received from the input electrode for applying electric power for the piezoelectric effect and the subject. It functions as an electrode that outputs an electrical signal based on the ultrasonic wave.

  The backing material 20 is provided on the back surface of the ultrasonic vibration element 16 and mechanically supports the ultrasonic vibration element 16.

  Further, the backing material 20 brakes the ultrasonic vibration element 16 in order to control the ultrasonic pulse in the installed direction.

  This backing material 20 is perpendicular to the array plane of the ultrasonic vibration elements 16 from the signal electrodes 18 so that signal lead pads 23 which are ends of signal leads 22 to be described later have the same array pitch as the ultrasonic vibration elements 16. A path through which the signal lead 22 can be pulled out is formed in the direction. A signal lead 22 is inserted in this path.

  Such a backing material 20 can be made by stacking thin backing materials such that the plate thickness is the same as the arrangement pitch.

  Further, the thickness of the backing material 20 is set to a sufficient thickness (thickness sufficiently attenuated) with respect to the wavelength of the ultrasonic frequency to be used in order to keep the acoustic characteristics of the ultrasonic transducer good. To do.

  One end of the signal lead 22 serves as a signal lead pad 23 in a matrix on the back surface of the backing material 20 (the surface on the opposite side of the backing material 20 where the ultrasonic vibration element 16 is installed). It is arranged.

  Further, the other end of the signal lead 22 is connected to the signal electrode 18 of each ultrasonic vibration element 16. That is, the signal lead 22 extends from the signal electrode 18 in a direction perpendicular to the arrangement surface of the ultrasonic vibration elements 16 and passes through the path in the backing material 20. Therefore, the signal lead pads 23 are arranged in a matrix (two-dimensional array) like the ultrasonic vibration element 16 on the surface of the backing material 20 opposite to the ultrasonic vibration element 16.

  In this embodiment, the signal lead pads 23 are arranged in the same arrangement pitch as that of the ultrasonic vibration elements 16, that is, in the same manner as the electrode arrangement. It is also possible to make it larger than the pitch. For example, in the case where a two-dimensional array of the signal leads 22 is made by pasting the plate-shaped backing material and the signal line pattern, the pattern of the signal lead 22 to be pasted spreads in the direction of the signal lead pad 23. This can be achieved.

  FIG. 2 is a perspective view showing the configuration of the ultrasonic probe according to the first embodiment of the present invention.

  As shown in FIG. 2, the cable connection board 50 is a board for connecting the above-described IC board 40 and a cable (not shown) for electrically connecting the ultrasonic diagnostic apparatus main body to the IC board 40 and the like. It is. The cable connection board 50 is made of flexible FPC, and one end of the cable connection board 50 is electrically connected to one end of the IC board 40 opposite to the one provided with signal leads (not shown). ing.

  The connectors 62 are provided at the other end of the cable connection board 50 and one end of the cable, respectively. With this connector 62, the cable connection board 50 and the cable are electrically connected.

  With such a configuration, a signal processed by each IC 45 on the IC substrate 40 is transmitted to the ultrasonic diagnostic apparatus body via the cable connection substrate 50.

  Further, as shown in FIG. 3, a relay substrate 30 may be interposed between the ultrasonic transducer 10 and the IC substrate 40. The relay board 30 is preferably a flat board made of resin or ceramic. As shown in FIGS. 4A and 4B, the relay board 30 is provided with a first relay pad 31 on the surface facing the ultrasonic transducer 10 in accordance with the signal lead. The second relay pad 32 is electrically connected to each of the first relay pads 31 on the opposite surface, that is, the surface facing the IC substrate 40.

  Here, the arrangement of the second relay pads 32 may be different from that of the first relay pads 31. That is, a plurality of first relay pads 31 can be connected in common, and the arrangement order of the first relay pads 31 can be changed, and the arrangement pitch of the first relay pads 31 can be changed. It is also possible.

  The signal lead 22 of the ultrasonic transducer 10 is electrically connected to the IC 45 by electrically connecting the second connection pad 32 and the first connection pad 401 formed at the end of the IC substrate 40. Thus, the signal generated from the ultrasonic vibration element 16 by the signal lead 22 is appropriately processed.

  Thus, by interposing the relay substrate 30 between the ultrasonic transducer 10 and the IC substrate 40, the electrodes connected to the connection pads formed on the IC substrate 40 are formed of a material such as rubber or resin. Since the second relay pad 32 formed on the relay substrate 3 can be connected more firmly than the signal lead pad 23 formed on the backing material 20, the ultrasonic transducer 10 and the IC substrate 40 can be securely connected. Can be realized.

  FIG. 5 is a perspective view showing the configuration of the IC substrate in the first embodiment of the ultrasonic probe according to the present invention. As shown in FIG. 5, the IC substrate 40 of the present embodiment has first connection pads 401 on the front surface (for example, the surface on which the IC 45 is mounted) and the back surface as end electrodes of signal lines led out from the ICs 45. Are formed side by side. These first connection pads 401 are the signal lead pads 23 on the bottom surface side of the ultrasonic transducer 10 (the side where the backing material 20 is installed when viewed from the ultrasonic vibration element 16) or the second relay pads of the relay substrate 30. 32 with a pitch corresponding to 32. In the figure, only the end portion of the IC substrate 40 is shown, and the other portions are omitted.

  In order to make the first connection pad 401 and the signal lead pad 23 (second relay pad 32) formed on the backing material 20 (or the relay substrate 30) conductive, in this embodiment, A groove portion 100 is formed in the backing material 20 (or the relay substrate 30). Each signal lead pad 23 (second relay pad 32) is exposed on the side surface of the groove portion 100.

  In the present embodiment, as shown in FIG. 6, the electrical connection between the backing material 20 (or the relay substrate 30) and the IC substrate 40 is provided with first connection pads 401 on the front and back surfaces of the IC substrate 40. By inserting the IC substrate 40 into the groove portion 100 in which the signal lead pad 23 (second relay pad 32) is disposed on the side surface, the first connection pad 401 and the signal lead 23 (second relay pad 32) are disposed. Are electrically connected.

  Each groove portion 100 is a recess formed with a bottom surface corresponding to the area of the end face of each IC substrate 40 (cross-sectional area of each IC substrate 40 in the installation direction), and each IC substrate 40 is installed in parallel at a predetermined interval. It is formed on the backing material 20 (or the relay substrate 30) as shown.

  The connection of the IC substrate 40 to the back side of the ultrasonic transducer 10 is performed by connecting the first connection pad 401 provided on the IC substrate 40 to the signal lead pad 23 or the relay substrate 30 as the connection destination. Contact is made according to the position of the relay pad 32 to make electrical connection.

  On the other hand, in this embodiment, as shown in FIG. 7, resin spacers 404 are filled (sealed) between the IC substrates 40 (so that the back surface of one IC substrate 40 and the surface of another IC substrate 40 are connected). May stop).

  As a desirable mode of the present embodiment, as shown in FIG. 8, an IC in which resin spacers 404 are pre-filled between the IC substrates 40 and the IC substrates 40 are sealed in parallel by the resin spacers 404. A substrate unit 400 can also be used. Here, in the shape of the IC substrate unit 400, since the first connection pads 401 formed on each IC substrate 40 are formed on the front surface and the back surface of the IC substrate 40, the resin spacer 404 is formed on each first substrate. The connection pad 401 is filled so as to be exposed.

  In this way, the IC board unit 400 and the backing material 20 (relay board 30) are connected, and the first connection pads 401 provided on each IC board 40 constituting the IC board unit 400 and the backing material 20 are connected. Conductivity with the signal lead pad 23 (second relay pad 32) of the (relay substrate 30) is also preferable in terms of assembly efficiency of the ultrasonic probe.

  When forming the IC substrate unit 400, the individual first connection pads 401 formed on each IC substrate 40, the signal lead pads 23 of the backing material 20, or the second relay pads of the relay substrate 30 The intervals between the IC substrates 40 are determined so as to be aligned with each other.

  As described above, in the present embodiment, the first connection pads 401 can be formed in the same process as the wiring pattern formed on the surface of the IC substrate 40. Therefore, the pitch in the arrangement direction of the first connection pads 401 is reduced. Thus, the IC substrate 40 can be miniaturized, and as a result, the ultrasonic probe can be miniaturized.

  In addition, since the first connection pads 401 are formed on the front surface and the back surface of the IC substrate 40, two rows of the first connection pads 401 can be formed for each IC substrate 40. The number of IC substrates 40 required for connection of the transducer 10 can be reduced, and the thickness of the IC substrates 40 in the arrangement direction can be reduced.

  Further, when the ultrasonic transducer 10 and the IC substrate 40 are connected, a plurality of groove portions 100 are formed in the backing material 20 (relay substrate 30), and each IC substrate 40 is fitted into the groove portions 100. The transducer 10 and the IC substrate 40 can be firmly connected.

  In addition, by forming an IC substrate unit 400 in which gaps between the plurality of IC substrates 40 are resin-sealed with resin spacers 404, the plurality of IC substrates 40 are connected to the first connection pads 401 formed on the IC substrates 40. And the signal lead pad 23 or the second relay pad 32 can be electrically connected at the same time, and the connection process is simplified.

  In the present embodiment, the first connection pads 401 connected to the signal lead pads 23 or the second relay pads 32 formed on the bottom surface side of the ultrasonic transducer 10 are provided on the front and back surfaces of the IC substrate 40. The connection pad 401 may be formed on either the front surface or the back surface of the IC substrate 40.

  In this embodiment, the signal lead pad 23 or the second relay pad 32 and the first connection pad 401 are connected by soldering. However, as another connection mode, for example, a conductive resin or a different material is used. You may connect by a direction conductive film.

  Furthermore, in this embodiment, after fixing each IC substrate 40 as the IC substrate unit 400, the IC substrate 40 is connected to the backing material 20 or the relay substrate 30. However, the present invention is not limited to this. It is also possible to connect a plurality of times as the IC substrate unit 400 fixed and divided into a plurality of groups.

(Second Embodiment)
Next, a second embodiment of the ultrasonic probe according to the present invention will be described with reference to the drawings.

  The present embodiment is characterized in that a connecting member for changing the connection direction is provided on each first connection pad with respect to the first embodiment described above. In the description of the present embodiment, the configuration of the IC substrate 40 will be mainly described, and the description of the portions overlapping with those of the first embodiment will be omitted.

  FIG. 9 is a perspective view showing a configuration of an IC substrate in the second embodiment of the ultrasonic probe according to the present invention. As shown in FIG. 9, the IC substrate 40 of the present embodiment has first connection pads 401 on the front surface (for example, the surface on which the IC 45 is mounted) and the back surface as end electrodes of signal lines drawn from the ICs 45. Are formed side by side, and a substantially rectangular parallelepiped connection member 403 is installed on each first connection member 401. In the figure, only the end portion of the IC substrate 40 is shown, and the other portions are omitted.

  That is, in this embodiment, the connection surface is directed to the ultrasonic transducer 10 in the first connection pad 401 in which the connection surface is formed on the front surface and / or the back surface of the IC substrate 40 in the first embodiment described above. A connecting member 403 for conversion is brazed.

  Then, as in the present embodiment, the connection member 403 is placed on the first connection pad 401 so that the end surface of the connection member 403 and the end surface of the IC substrate 40 are substantially flush with each other, as shown in FIG. As shown in the figure, when connecting the IC substrate 40 to the ultrasonic transducer 10, the end surface of the connection member 403 faces the connection surface of the signal lead pad 23 or the second relay pad 32, so that the connection is easy and the electrical connection is poor. Can also be reduced. Here, the term “level” means that the two surfaces have the same height, for example. Therefore, in the present embodiment, not only the height direction but also two surfaces (the end surface of the connection member 403 and the end surface of the IC substrate 40) are positioned so as to be substantially in the same plane.

  In this embodiment, as shown in FIG. 11, resin spacers 404 are filled (sealed) between the IC substrates 40 (so that the back surface of one IC substrate 40 and the surface of another IC substrate 40 are connected). May be. At this time, the resin spacer 404 is filled so that the connection surface of the connection member 403 is substantially flush with the end surface of the IC substrate 40 and is exposed in the direction of the ultrasonic transducer 10.

  As a desirable mode of the present embodiment, as shown in FIG. 12, an IC in which resin spacers 404 are filled in advance between the IC substrates 40 and the IC substrates 40 are sealed in parallel by the resin spacers 404. The substrate unit 400 is connected to the IC substrate unit 400 and the backing material 20 (relay substrate 30), and the first connection pad 401 provided on each IC substrate 40 constituting the IC substrate unit 400, and the backing material Conductivity with the signal lead pad 23 (second relay pad 32) of the 20 (relay substrate 30) is also preferable in terms of assembly efficiency of the ultrasonic probe.

  When forming the IC substrate unit 400, the individual first connection pads 401 formed on each IC substrate 40, the signal lead pads 23 of the backing material 20, or the second relay pads of the relay substrate 30 The intervals between the IC substrates 40 are determined so as to be aligned with each other.

  In this embodiment, unlike the first embodiment described above, an electrode (signal lead pad 23 or second relay pad 32) on the ultrasonic transducer 10 side and a first connection pad 401 (connection member 403) are provided. ) Are facing each other, it is not always necessary to form a groove in the backing material 20 or the relay substrate 30.

  Temporarily, in this embodiment, in order to make electrical connection between the first connection pad 401 and the signal lead pad 23 (second relay pad 32) formed on the backing material 20 (or the relay substrate 30), the backing material 20 is used. When the groove portion 100 is formed in the relay substrate 30 (or the relay substrate 30), the groove portion 100 has a cross-sectional shape on the ultrasonic transducer 10 side of each IC substrate 40 in which the connection member 403 is installed on the first connection pad 401. What is necessary is just to make it the shape according to. By forming the groove portion 100 in the backing material 20 or the relay substrate 30 in this manner, each IC substrate 40 is fixed so as to be fitted into each groove portion 100, so that the backing material 20 or the relay substrate 30 and each IC substrate 40 are The electrical connection is firmly performed.

  As described above, in the present embodiment, the first connection pads 401 can be formed in the same process as the wiring pattern formed on the surface of the IC substrate 40. Therefore, the pitch in the arrangement direction of the first connection pads 401 is reduced. Thus, the IC substrate 40 can be miniaturized, and as a result, the ultrasonic probe can be miniaturized.

  In addition, since the first connection pads 401 are formed on the front surface and the back surface of the IC substrate 40, two rows of the first connection pads 401 can be formed for each IC substrate 40. The number of IC substrates 40 necessary for connecting the transducer 10 can be reduced.

  Further, by forming an IC substrate unit 400 in which the gaps between the plurality of IC substrates 40 are resin-sealed with resin spacers 404, the plurality of IC substrates 40 are connected to the first connection pads 401 formed on the IC substrates 40. A plurality of the signal lead pads 23 or the second relay pads 32 can be electrically connected simultaneously via the connection member 403, and the connection process is simplified.

  In the present embodiment, the first connection pad 401 connected to the signal lead pad 23 or the second relay pad 32 formed on the bottom surface side of the ultrasonic transducer 10 via the connection member 403 is connected to the IC substrate 40. Although provided on the front surface and the back surface, the connection pad 401 may be formed on either the front surface or the back surface of the IC substrate 40.

  In the present embodiment, the signal lead pad 23 or the second relay pad 32 and the connection member 403 are connected by solder. However, as another connection mode, for example, a conductive resin or an anisotropic conductive film is used. You may connect by such as.

  Furthermore, in this embodiment, after fixing each IC substrate 40 as the IC substrate unit 400, the IC substrate 40 is connected to the backing material 20 or the relay substrate 30. However, the present invention is not limited to this. It is also possible to connect a plurality of times as the IC substrate unit 400 fixed and divided into a plurality of groups.

(Third embodiment)
Next, a third embodiment of the ultrasonic probe according to the present invention will be described with reference to the drawings.

  In the present embodiment, as in the second embodiment described above, a connection pad with a connection surface connected to the signal lead pad 23 or the second relay pad 32 facing the ultrasonic transducer 10 is provided on the IC substrate 40. As a connection pad, the second connection pad 402 is provided on the end face of the IC substrate 40. In the description of the present embodiment, the configuration of the IC substrate 40 will be mainly described, and the description of the parts overlapping with the first embodiment and the second embodiment will be omitted.

  FIG. 13 is a perspective view showing a configuration of an IC substrate in the third embodiment of the ultrasonic probe according to the present invention. As shown in FIG. 13, the IC substrate 40 of the present embodiment is an end surface of the IC substrate 40 (a surface facing the ultrasonic transducer 10 in the IC substrate 40) as an end electrode of a signal line drawn from each IC 45. The second connection pads 402 are formed side by side. In the figure, only the end portion of the IC substrate 40 is shown, and the other portions are omitted.

  In the second connection pad 402 in the present embodiment, for example, a through hole is previously formed in the IC substrate 40, the through hole is cut together with the IC substrate 40, and the cut surface of the through hole is formed on the IC substrate 40. It is formed by exposing to the end face.

  In addition to this, by cutting and grinding the IC substrate 40, the internal wiring of the IC substrate 40 is exposed to the end face, and then the second connection pads 402 are formed by a thin film forming method such as plating, vapor deposition, or sputtering. It is also possible to do. In the present embodiment, the second connection pads 402 formed on the end face are arranged in two rows, but formation in more rows is also possible.

  In this embodiment, the wiring connecting the IC 45 and the second connection pad 401 may be provided inside the IC substrate 40 or may be formed on the outside (the front surface and / or the back surface of the IC substrate 40). Good.

  That is, in the present embodiment, like the connection member 403 in the second embodiment described above, the second surface that opposes the connection surface of the signal lead pad 23 or the second relay pad 32 and electrically connects them to the IC 45. The connection pad 402 is provided on the end surface of the IC substrate 40.

  When the IC substrate 40 is connected to the ultrasonic transducer 10, the connection surface of the second connection pad formed on the end surface of the IC substrate 40 faces the connection surface of the signal lead pad 23 or the second relay pad 32. Therefore, it is easy to connect, and it is possible to reduce defective electrical connection.

  Here, in the present embodiment, the first connection pad 402 and the signal lead pad 23 (second relay pad 32) formed on the backing material 20 (or the relay substrate 30) are electrically connected to each other. Similar to the embodiment, the groove portion 100 is formed in the backing material 20 (or the relay substrate 30).

  Each groove portion 100 is a recess formed with a bottom surface corresponding to the area of the end face of each IC substrate 40 (cross-sectional area of each IC substrate 40 in the installation direction), and each IC substrate 40 is installed in parallel at a predetermined interval. It is formed on the backing material 20 (or the relay substrate 30) as shown.

  Each signal lead pad 23 (second relay pad 32) is exposed and formed on the bottom surface of the groove portion 100 facing the second connection pad 402, and the IC substrate 40 is fitted into the groove portion 100 having a concave shape. By doing so, each signal lead pad 23 (second relay pad 32) exposed on the bottom surface of the groove portion 100 is electrically connected to each second connection pad 402.

  That is, as shown in FIG. 14, in this embodiment, the electrical connection between the backing material 20 (or the relay substrate 30) and the IC substrate 40 is provided with the second connection pads 402 on the end surface of the IC substrate 40. The groove portion 100 in which the signal lead pad 23 (second relay pad 32) is disposed on the bottom surface is formed.

  Then, the connection of the IC substrate 40 to the back side of the ultrasonic transducer 10 is performed by connecting the second connection pad 402 provided on the IC substrate 40 to the signal lead pad 23 or the relay substrate 30 as the second connection pad. Contact is made according to the position of the relay pad 32 to make electrical connection.

  In this embodiment, as shown in FIG. 15, resin spacers 404 are filled (sealed) between the IC substrates 40 (so that the back surface of one IC substrate 40 and the surface of another IC substrate 40 are connected). May stop). At this time, the resin spacer 404 is filled so that the connection surface of the second connection pad 402 is substantially flush with the end surface of the IC substrate 40 and is exposed in the direction of the ultrasonic transducer 10.

  As a desirable mode of this embodiment, as shown in FIG. 16, an IC in which resin spacers 404 are pre-filled between the IC substrates 40 and the IC substrates 40 are sealed in parallel by the resin spacers 404. The substrate unit 400 is connected to the IC substrate unit 400 and the backing material 20 (relay substrate 30), and the second connection pads 402 provided on each IC substrate 40 constituting the IC substrate unit 400, and the backing material Conductivity with the signal lead pad 23 (second relay pad 32) of the 20 (relay substrate 30) is also preferable in terms of assembly efficiency of the ultrasonic probe.

  When the IC substrate unit 400 is formed, the individual second connection pads 402 formed on the end surface of each IC substrate 40 and the signal lead pad 23 of the backing material 20 or the second relay pad of the relay substrate 30 are formed. The intervals between the IC substrates 40 are determined so that they are aligned with each other.

  In the present embodiment also, since the connection surface between the electrode on the ultrasonic transducer 10 side (the signal lead pad 23 or the second relay pad 32) and the second connection pad 402 faces each other, the backing material 20 Alternatively, the groove portion 100 is not necessarily formed on the relay substrate 30.

  As described above, in the present embodiment, the second connection pads 402 can be formed on the end face without depending on the arrangement and the number of the ICs 45 installed on the surface of the IC substrate 40. The pitch in the arrangement direction can be freely designed, the IC substrate 40 can be downsized, and as a result, the ultrasonic probe can be downsized.

  Further, by forming the second connection pads 402 on the end face of the IC substrate 40, it is possible to form the second connection pads 402 in an arbitrary number of columns per one IC substrate 40. The number of IC substrates 40 required for connection of the transducer 10 can be reduced, and therefore the IC substrate 40 can be downsized in the arrangement direction.

  Further, by forming an IC substrate unit 400 in which the gaps between the plurality of IC substrates 40 are resin-sealed with resin spacers 404, the plurality of IC substrates 40 are connected to the second connection pads 402 formed on the IC substrates 40. A plurality of the signal lead pads 23 or the second relay pads 32 can be electrically connected simultaneously via the connection member 403, and the connection process is simplified.

  In this embodiment, after fixing each IC substrate 40 as the IC substrate unit 400, the IC substrate 40 is connected to the backing material 20 or the relay substrate 30. However, the present invention is not limited to this. The IC substrate unit 400 fixed in a plurality of groups can be connected a plurality of times.

(Fourth embodiment)
Next, a fourth embodiment of the ultrasonic probe according to the present invention will be described with reference to the drawings.

  In the present embodiment, the first connection pads 401 are provided on the front and back surfaces of the IC substrate 40 as connection pads on the side of each IC substrate 40 connected to the signal lead pad 23 on the ultrasonic transducer 10 side or the second relay pad 32. It is characterized in that the second connection pads 402 are provided on each IC substrate 40 on the end face on the ultrasonic transducer 10 side. In the description of the present embodiment, the configuration of the IC substrate 40 will be mainly described, and the description of the same parts as those in the first to third embodiments will be omitted.

  FIG. 17 is a perspective view showing a configuration of an IC substrate in the fourth embodiment of the ultrasonic probe according to the present invention. As shown in FIG. 17, the IC substrate 40 of the present embodiment has first connection pads 401 on the front surface (for example, the surface on which the IC 45 is mounted) and the back surface as end electrodes of signal lines led out from the ICs 45. Are formed side by side, and second connection pads 402 are formed side by side on the end surface (the surface facing the ultrasonic transducer 10) as the end electrode. The first connection pad 401 and the second connection pad 402 are the signal lead pad 23 or the relay board on the bottom side of the ultrasonic transducer 10 (the side on which the backing material 20 is installed when viewed from the ultrasonic vibration element 16). It is formed at a pitch corresponding to 30 second relay pads 32. In the figure, only the end portion of the IC substrate 40 is shown, and the other portions are omitted.

  In order to conduct the first connection pad 401 and the second connection pad 402 and the signal lead pad 23 (second relay pad 32) formed on the backing material 20 (or the relay substrate 30), Also in this embodiment, the groove part 100 is formed in the backing material 20 (or the relay substrate 30).

  That is, as shown in FIG. 18, each groove 100 is a recess in which a bottom surface corresponding to the area of the end face of each IC substrate 40 (cross-sectional area of each IC substrate 40 in the installation direction) is formed, and at a predetermined interval. It is formed on the backing material 20 (or the relay substrate 30) so that each IC substrate 40 is installed in parallel.

  Each signal lead pad 23 (second relay pad 32) is exposed and formed on the bottom and side surfaces of the groove portion 100. By fitting the IC substrate 40 into the groove portion 100, the signal lead pad 23 is exposed on the side surface of the groove portion 100. Each signal lead pad 23 (second relay pad 32) is electrically connected to each first connection pad 401, and each signal lead pad 23 (second relay pad 32) exposed on the bottom surface of the groove 100 is formed. And the second connection pads 402 are conducted.

  As described above, the connection of the IC substrate 40 to the back side of the ultrasonic transducer 10 is performed by connecting the first connection pad 401 and the second connection pad 402 provided on the IC substrate 40 to the signal lead pad to which the connection is made. 23 or the second relay pad 32 of the relay board 30 is brought into contact with each other to make electrical connection.

  On the other hand, in this embodiment, as shown in FIG. 19, resin spacers 404 are filled (sealed) between the IC substrates 40 (so that the back surface of one IC substrate 40 and the surface of another IC substrate 40 are connected). May stop).

  As a desirable mode of the present embodiment, as shown in FIG. 20, an IC in which resin spacers 404 are pre-filled between the IC substrates 40 and the IC substrates 40 are sealed in parallel by the resin spacers 404. A substrate unit 400 can also be used. Here, in the shape of the IC substrate unit 400, since the first connection pads 401 formed on each IC substrate 40 are formed on the front surface and the back surface of the IC substrate 40, the resin spacer 404 is formed on each first substrate. The connection pad 401 is filled so as to be exposed.

  In this way, the IC board unit 400 and the backing material 20 (relay board 30) are connected, and the first connection pad 401 and the second connection provided on each IC board 40 constituting the IC board unit 400. Conduction between the pad 402 and the signal lead pad 23 (second relay pad 32) of the backing material 20 (relay substrate 30) is also preferable in terms of assembly efficiency of the ultrasonic probe.

  When the IC substrate unit 400 is formed, the individual first connection pads 401 and the second connection pads 402 formed on each IC substrate 40 and the signal lead pads 23 of the backing material 20 or the relay substrate 30 are formed. The intervals between the IC substrates 40 are determined and sealed and fixed so that the positions of the second relay pads coincide with each other.

  As described above, in the present embodiment, the first connection pads 401 can be formed in the same process as the wiring pattern formed on the surface of the IC substrate 40. Therefore, the pitch in the arrangement direction of the first connection pads 401 is reduced. Thus, the IC substrate 40 can be miniaturized, and as a result, the ultrasonic probe can be miniaturized.

  Further, the second connection pad 402 in the present embodiment is formed, for example, by previously forming a through hole in the IC substrate 40, cutting the through hole together with the IC substrate 40, and setting the cut surface of the through hole to the IC substrate. It is formed by exposing to the end face of 40.

  In addition to this, by cutting and grinding the IC substrate 40, the internal wiring of the IC substrate 40 is exposed to the end face, and then the second connection pads 402 are formed by a thin film forming method such as plating, vapor deposition, or sputtering. It is also possible to do. In the present embodiment, the second connection pads 402 formed on the end face are arranged in two rows, but formation in more rows is also possible.

  In addition, the first connection pads 401 are formed on the front surface and the back surface of the IC substrate 40, and the second connection pads 402 are formed on the end surfaces, thereby further increasing the number of connection pads per IC substrate 40. Therefore, the number of IC substrates 40 required for connection can be further reduced, and the ultrasonic probe can be reduced in size.

  Further, when the ultrasonic transducer 10 and the IC substrate 40 are connected, a plurality of groove portions 100 are formed in the backing material 20 (relay substrate 30), and each IC substrate 40 is fitted into the groove portions 100. The transducer 10 and the IC substrate 40 can be firmly connected.

  In addition, by forming an IC substrate unit 400 in which gaps between the plurality of IC substrates 40 are resin-sealed with resin spacers 404, the plurality of IC substrates 40 are connected to the first connection pads 401 formed on the IC substrates 40. In addition, a plurality of second connection pads 402 and a plurality of signal lead pads 23 or second relay pads 32 can be electrically connected simultaneously, and the connection process is simplified.

  In the present embodiment, the first connection pads 401 connected to the signal lead pads 23 or the second relay pads 32 formed on the bottom surface side of the ultrasonic transducer 10 are provided on the front and back surfaces of the IC substrate 40. The connection pad 401 may be formed on either the front surface or the back surface of the IC substrate 40.

  In the present embodiment, the connection between the signal lead pad 23 or the second relay pad 32 and the first connection pad 401 and the second connection pad 402 is a solder connection. For example, connection using a conductive resin or an anisotropic conductive film may be performed.

  Furthermore, in this embodiment, after fixing each IC substrate 40 as the IC substrate unit 400, the IC substrate 40 is connected to the backing material 20 or the relay substrate 30. However, the present invention is not limited to this. It is also possible to connect a plurality of times as the IC substrate unit 400 fixed and divided into a plurality of groups.

  As another aspect of the present embodiment, as shown in FIG. 21, a third connection pad 405 linking the first connection pad 401 and the second connection pad 402 may be formed on the IC substrate 40.

  By adopting such a configuration, not only the second connection pad 402 but also the first connection pad 401 can be used for the conduction between each ultrasonic vibration element 16 and each IC 45, so that the area as a connection pad can be used. The electrical connection failure with the signal lead pad 22 (second relay pad 32) can be reduced.

(Fifth embodiment)
Next, a fifth embodiment of an ultrasonic probe according to the present invention will be described with reference to the drawings.

  The present embodiment is characterized in that a connection member for changing the connection direction is provided on each first connection pad with respect to the above-described fourth embodiment. In the description of the present embodiment, the configuration of the IC substrate 40 will be mainly described, and the description of the same parts as those in the first to fourth embodiments will be omitted.

  As shown in FIG. 22, the IC substrate 40 according to the present embodiment has a front surface (for example, a surface on which the IC 45 is mounted) and / or a back surface of the IC substrate 40 as an end electrode of a signal line drawn from each IC 45. A first connection pad 401 on which the above-described connection member 403 is installed is formed, and a second connection pad 402 is formed on the end face of the IC substrate 40. In the figure, only the end portion of the IC substrate 40 is shown, and the other portions are omitted.

  That is, in this embodiment, as in the second embodiment described above, the connection member 403 is brazed to the first connection pad 401 in which the connection surface is formed on the front surface and / or the back surface of the IC substrate 40. The connection surface of the IC substrate 40 is opposed to the direction of the ultrasonic transducer 10 together with the second connection pads 402 formed on the end surface of the IC substrate 40.

  Therefore, when the ultrasonic transducer 10 and each IC substrate 40 are connected, as shown in FIG. 23, the first connection pad 401 and the second connection pad 402 formed on the end face of each IC substrate 40 The intervals between the IC substrates 40 are determined and connected and fixed so that the signal lead pads 23 of the backing material 20 or the second relay pads of the relay substrate 30 are aligned.

  With such a configuration, each connection surface of the connection member 403 and the second connection pad 402 as a connection terminal on the IC substrate 40 side connected to the signal lead pad 22 (second relay pad 32). Is opposed to the ultrasonic transducer 10 side, the number of connection electrodes of one IC substrate 40 increases, and the thickness of the IC substrate 40 depends on the arrangement of the signal lead pads 22 (second relay pads 32). As a result, miniaturization of the ultrasonic probe can be realized.

  In this embodiment, as shown in FIG. 24, resin spacers 404 are filled (sealed) between the IC substrates 40 (so that the back surface of one IC substrate 40 and the surface of another IC substrate 40 are connected). May be. At this time, the resin spacer 404 is filled so that the connection surface of the connection member 403 is substantially flush with the end surface of the IC substrate 40 and is exposed in the direction of the ultrasonic transducer 10.

  As a desirable mode of the present embodiment, as shown in FIG. 25, an IC in which resin spacers 404 are pre-filled between the IC substrates 40 and the IC substrates 40 are sealed in parallel by the resin spacers 404. A board unit 400 is connected to the IC board unit 400 and the backing material 20 (relay board 30), and a first connection pad 401 and a second connection pad 401 provided on each IC board 40 constituting the IC board unit 400 are connected. Conductivity between the connection pad 402 and the signal lead pad 23 (second relay pad 32) of the backing material 20 (relay substrate 30) is also preferable in terms of assembly efficiency of the ultrasonic probe.

  When the IC substrate unit 400 is formed, the individual first connection pads 401 and the second connection pads 402 formed on each IC substrate 40 and the signal lead pads 23 of the backing material 20 or the relay substrate 30 are formed. The intervals between the IC substrates 40 are determined and sealed and fixed so that the positions of the second relay pads coincide with each other.

  In the present embodiment, the connection between the electrode (signal lead pad 23 or second relay pad 32) on the ultrasonic transducer 10 side, the first connection pad 401 (connection member 403), and the second connection pad 402 is provided. Since the surfaces are opposed to each other, it is not always necessary to form a groove in the backing material 20 or the relay substrate 30.

  In this embodiment, the first connection pad 401 and the second connection pad 402 are electrically connected to the signal lead pad 23 (second relay pad 32) formed on the backing material 20 (or the relay substrate 30). Therefore, when the groove portion 100 is formed in the backing material 20 (or the relay substrate 30), the groove portion 100 may be shaped according to the cross-sectional shape of each IC substrate 40 on the ultrasonic transducer 10 side. . By forming the groove portion 100 in the backing material 20 or the relay substrate 30 in this manner, each IC substrate 40 is fixed so as to be fitted into each groove portion 100, so that the backing material 20 or the relay substrate 30 and each IC substrate 40 are The electrical connection is firmly performed.

  As described above, in the present embodiment, the first connection pads 401 can be formed in the same process as the wiring pattern formed on the surface of the IC substrate 40. Therefore, the pitch in the arrangement direction of the first connection pads 401 is reduced. Thus, the IC substrate 40 can be miniaturized, and as a result, the ultrasonic probe can be miniaturized.

  Further, the second connection pad 402 in the present embodiment is formed, for example, by previously forming a through hole in the IC substrate 40, cutting the through hole together with the IC substrate 40, and setting the cut surface of the through hole to the IC substrate. It is formed by exposing to the end face of 40.

  In addition to this, by cutting and grinding the IC substrate 40, the internal wiring of the IC substrate 40 is exposed to the end face, and then the second connection pads 402 are formed by a thin film forming method such as plating, vapor deposition, or sputtering. It is also possible to do. In the present embodiment, the second connection pads 402 formed on the end face are arranged in two rows, but formation in more rows is also possible.

  In addition, the first connection pads 401 are formed on the front surface and the back surface of the IC substrate 40, and the second connection pads 402 are formed on the end surfaces, thereby further increasing the number of connection pads per IC substrate 40. Therefore, the number of IC substrates 40 required for connection can be further reduced, and the ultrasonic probe can be reduced in size.

  Further, when the ultrasonic transducer 10 and the IC substrate 40 are connected, a plurality of groove portions 100 are formed in the backing material 20 (relay substrate 30), and each IC substrate 40 is fitted into the groove portions 100. The transducer 10 and the IC substrate 40 can be firmly connected.

  In addition, by forming an IC substrate unit 400 in which gaps between the plurality of IC substrates 40 are resin-sealed with resin spacers 404, the plurality of IC substrates 40 are connected to the first connection pads 401 formed on the IC substrates 40. In addition, a plurality of second connection pads 402 and a plurality of signal lead pads 23 or second relay pads 32 can be electrically connected at the same time, and the connection process is simplified.

  In the present embodiment, the first connection pads 401 connected to the signal lead pads 23 or the second relay pads 32 formed on the bottom surface side of the ultrasonic transducer 10 are provided on the front and back surfaces of the IC substrate 40. The connection pad 401 may be formed on either the front surface or the back surface of the IC substrate 40.

  In the present embodiment, the connection between the signal lead pad 23 or the second relay pad 32 and the first connection pad 401 and the second connection pad 402 is a solder connection. For example, connection using a conductive resin or an anisotropic conductive film may be performed.

  Furthermore, in this embodiment, after fixing each IC substrate 40 as the IC substrate unit 400, the IC substrate 40 is connected to the backing material 20 or the relay substrate 30. However, the present invention is not limited to this. It is also possible to connect a plurality of times as the IC substrate unit 400 fixed and divided into a plurality of groups.

  Each above-mentioned embodiment is an example of the present invention, and the present invention is not limited to each embodiment. In addition, various modifications can be made according to the design and the like as long as they do not depart from the technical idea of the present invention.

DESCRIPTION OF SYMBOLS 10 Ultrasonic transducer 12 Acoustic matching layer 14 Ground electrode 16 Ultrasonic vibration element 18 Signal electrode 20 Backing material 22 Signal lead 23 Signal lead pad 30 Relay board 31 1st relay pad 32 2nd relay pad 40 IC board 400 IC board Unit 401 First connection pad 402 Second connection pad 403 Connection member 404 Resin spacer 405 Third connection pad 45 Integrated circuit (IC)
50 Cable connection board 62 Connector 100 Groove

Claims (8)

A plurality of ultrasonic vibration elements arranged in a matrix, and
A backing material for braking the ultrasonic vibration element by inserting a plurality of signal leads provided so as to protrude from each of the ultrasonic vibration elements in order to transmit an electrical signal from the ultrasonic vibration element;
An ultrasonic probe having an integrated circuit for processing the electrical signal, and having, as an end of a signal line drawn from the integrated circuit, an IC substrate having a connection pad connected to the signal lead,
A first connecting pad the connection pads are provided on the front and / or rear surface of the IC substrate, a direction opposite the connection surface of the first connection pads to the signal lead pad as an end of said signal leads An ultrasonic probe, characterized in that a connection member having an end surface to be converted into a surface is provided on a connection surface of the first connection pad.   The ultrasonic probe according to claim 1, wherein a second connection pad is provided on an end surface of the IC substrate facing the signal lead pad.   In the backing material, a groove portion having a contact surface with which the first connection pad and / or the second connection pad contacts is formed, and the signal lead pad is formed on the contact surface of the groove portion, 3. The ultrasonic wave according to claim 2, wherein the signal lead pad is electrically connected to the first connection pad and / or the second connection pad by fitting an end surface of the IC substrate into the groove portion. probe. A plurality of ultrasonic vibration elements arranged in a matrix, and
A backing material for braking the ultrasonic vibration element by inserting a plurality of signal leads provided so as to protrude from each of the ultrasonic vibration elements in order to transmit an electrical signal from the ultrasonic vibration element;
A first relay pad having a flat plate shape is formed on a surface facing the backing material, and a second relay pad conducting to the first relay pad is opposed to the backing material. A relay board formed on the surface opposite to the surface to be
An ultrasonic probe having an integrated circuit for processing the electrical signal and having an IC substrate having a connection pad connected to the second relay pad,
The connection pad is a first connection pad provided on the front surface and / or the back surface of the IC substrate, and an end surface that converts the connection surface of the first connection pad in a direction facing the second relay pad. An ultrasonic probe, comprising: a connection member having a connection surface of the first connection pad.   The ultrasonic probe according to claim 4, wherein a second connection pad is provided on an end surface of the IC substrate facing the second relay pad.   The relay board is formed with a groove portion having a contact surface with which the first connection pad and / or the second connection pad contacts, and the second relay pad is formed on the contact surface of the groove portion. 6. The electrical connection between the second relay pad and the first connection pad and / or the second connection pad is achieved by fitting an end face of the IC substrate into the groove. The described ultrasonic probe.   The ultrasonic probe according to claim 2, 3, 5, or 6, wherein the first connection pad and the second connection pad are connected to each other.   The ultrasonic probe according to claim 1, wherein a resin is filled between the plurality of IC substrates so that the connection surface is exposed.

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