JPH10327498A - Manufacture of ultrasonic wave probe - Google Patents

Manufacture of ultrasonic wave probe

Info

Publication number
JPH10327498A
JPH10327498A JP9135560A JP13556097A JPH10327498A JP H10327498 A JPH10327498 A JP H10327498A JP 9135560 A JP9135560 A JP 9135560A JP 13556097 A JP13556097 A JP 13556097A JP H10327498 A JPH10327498 A JP H10327498A
Authority
JP
Japan
Prior art keywords
ultrasonic
ultrasonic element
signal input
channel
output line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9135560A
Other languages
Japanese (ja)
Inventor
Hironori Komata
博教 小俣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP9135560A priority Critical patent/JPH10327498A/en
Publication of JPH10327498A publication Critical patent/JPH10327498A/en
Pending legal-status Critical Current

Links

Landscapes

  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

PROBLEM TO BE SOLVED: To enhance the reliability of a probe by simplifying and ensuring connection between an ultrasonic wave element and a signal input output line member (printed circuit board or the like) being components of the ultrasonic wave probe. SOLUTION: A signal input output line member (flexible cable) 2 is directly connected as connection parts A1, A2 shown to each channel of an ultrasonic wave element 12 of the ultrasonic probe where an ultrasonic wave element 12 is placed on a base 14 via an attenuation material 13 and matching layers 11A, 11B are formed on the element 12 (conventionally connected via a metallic wire) so as to facilitate wiring and to reduce wiring time.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、生体などの診断
に使用される超音波診断装置、特に超音波を送受信する
ための超音波探触子の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic diagnostic apparatus used for diagnosing a living body or the like, and more particularly to a method for manufacturing an ultrasonic probe for transmitting and receiving ultrasonic waves.

【0002】[0002]

【従来の技術】従来、超音波探触子を構成する超音波素
子を、信号入出力線部材(フレキシブルプリント配線基
板として形成されることが多い)に接続するに当たって
は、電気抵抗の小さな所定金属の細線(金属ワイヤー)
を用いて、半田付けにより行なうのが一般的である。こ
のとき、超音波素子に予め金属箔が接続されている場合
は、これと信号入出力線部材とを金属ワイヤーを介して
半田付けするようにしている。
2. Description of the Related Art Conventionally, when an ultrasonic element constituting an ultrasonic probe is connected to a signal input / output line member (often formed as a flexible printed circuit board), a predetermined metal having a small electric resistance is used. Thin wire (metal wire)
Is generally performed by soldering. At this time, if a metal foil is connected to the ultrasonic element in advance, this is soldered to the signal input / output line member via a metal wire.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、超音波
素子の小型化やチャネル数の増大化を図ろうとすると、
超音波素子と信号入出力線部材との接続作業に従来より
も細かな作業が要求され、作業者の習熟が追いつかなく
なるおそれが生じる。また、チャネル数の増大に伴って
製造に要する時間も長くなる。さらには、超音波素子の
小型化やチャネル数の増大化によって、金属ワイヤーが
細くなって断線が生じたり、その数の増大によってチャ
ネル間が接触して短絡が生じたりで不良品が増える、な
どの問題がある。したがって、この発明の課題は超音波
素子と信号入出力線部材との接続を簡単かつ確実にし、
不良品を少なくして信頼性を向上させることにある。
However, when trying to reduce the size of the ultrasonic element and increase the number of channels,
Finer work than before is required for the work of connecting the ultrasonic element and the signal input / output line member, and there is a possibility that the skill of the operator may not be able to keep up. In addition, the time required for manufacturing increases as the number of channels increases. In addition, due to the miniaturization of the ultrasonic element and the increase in the number of channels, the metal wires become thinner and broken, and the increase in the number increases the number of defective products due to short-circuit due to contact between the channels. There is a problem. Therefore, an object of the present invention is to simply and reliably connect the ultrasonic element and the signal input / output line member,
It is to improve the reliability by reducing defective products.

【0004】[0004]

【課題を解決するための手段】このような課題を解決す
るため、請求項1の発明によれば、基台に減衰材料を介
在させて複数チャネルからなる超音波素子を配置し、さ
らにその上に整合層を形成してなる超音波探触子の、前
記超音波素子の各チャネル対応部分に、信号入出力線部
材を直接接続することを特徴としている。この請求項1
の発明においては、前記超音波素子の各チャネル対応部
分と信号入出力線部材とを、所定金属の金属箔を介して
接続することができる(請求項2の発明)。
According to the first aspect of the present invention, an ultrasonic element having a plurality of channels is arranged on a base with an attenuating material interposed therebetween. A signal input / output line member is directly connected to a portion corresponding to each channel of the ultrasonic element of an ultrasonic probe having a matching layer formed thereon. This claim 1
In the present invention, the portion corresponding to each channel of the ultrasonic element and the signal input / output line member can be connected via a metal foil of a predetermined metal (the invention of claim 2).

【0005】また、上記請求項1の発明においては、前
記超音波素子の各チャネルをさらに細分割する場合、チ
ャネル分割のための深い溝間に、前記超音波素子を切断
してしまわない程度の浅い溝を少なくとも1箇所形成し
てチャネル対応部分の面積を大きくし、超音波素子の各
チャネル対応部分と信号入出力線部材との接続を容易に
することができ(請求項3の発明)、または、前記超音
波素子が湾曲している場合は、予め複数種類の曲げ治具
を用意しておき、これにより超音波素子の曲率を前もっ
て調整したのち、前記信号入出力線部材と接続すること
ができる(請求項4の発明)。
According to the first aspect of the present invention, when each of the channels of the ultrasonic element is further subdivided, the ultrasonic element is not cut between deep grooves for channel division. At least one shallow groove is formed to increase the area of the channel-corresponding portion, thereby facilitating connection between each channel-corresponding portion of the ultrasonic element and the signal input / output line member (claim 3). Alternatively, when the ultrasonic element is curved, a plurality of types of bending jigs are prepared in advance, and the curvature of the ultrasonic element is adjusted in advance, and then connected to the signal input / output line member. (Invention of claim 4).

【0006】[0006]

【発明の実施の形態】図1はこの発明の第1の実施の形
態を示す説明図である。同図(イ)は超音波探触子を示
す断面図、同図(ロ)は同図(イ)の接続部分拡大図で
ある。同図(イ)において、12は超音波素子、11
A,11Bは超音波素子12から発射される超音波の強
弱等、検体の特性に合わせるための音響マッチング層
(整合層)、13は超音波素子12から図の下方に発射
される超音波を、上方に跳ね返らせないよう減衰させる
ためのゴム等の減衰材料、14はこれら各部を支持する
ための基台である。なお、超音波素子としては、高分子
材料またはセラミックス材料からなる圧電素子が用いら
れる。
FIG. 1 is an explanatory diagram showing a first embodiment of the present invention. FIG. 1A is a cross-sectional view showing an ultrasonic probe, and FIG. 2B is an enlarged view of a connection portion of FIG. In FIG. 2A, reference numeral 12 denotes an ultrasonic element;
A and 11B are acoustic matching layers (matching layers) for matching the characteristics of the specimen such as the strength of the ultrasonic waves emitted from the ultrasonic element 12, and 13 is an ultrasonic wave emitted from the ultrasonic element 12 below the figure. A damping material 14 such as rubber for damping so as not to bounce upwards, and 14 is a base for supporting these components. Note that a piezoelectric element made of a polymer material or a ceramic material is used as the ultrasonic element.

【0007】上記のような構成において、超音波素子1
2は電気信号を送受(入出力)するために、フレキシブ
ルプリント配線基板等の信号入出力線部材(以下、単に
フレキケーブルともいう)2が接続される。その接続
に、従来は上述の如く金属ワイヤーを介して接続するよ
うにしていたが、ここでは図示のように直接接続するこ
とにより、接続を簡単にし短絡,断線等の事故を極力防
止できるようにするものである。なお、その接続は従来
と同様、主として導電性を有する半田付けにより行なわ
れる。接続部分を同図(イ)ではA1,A2として示
し、同図(ロ)にA2部分の拡大図を示す。
In the above configuration, the ultrasonic element 1
Reference numeral 2 denotes a signal input / output line member (hereinafter, also simply referred to as a flexible cable) 2 such as a flexible printed wiring board for transmitting / receiving (input / output) an electric signal. Conventionally, the connection is made via a metal wire as described above. However, the connection is directly made as shown in the figure, so that the connection can be simplified and accidents such as short circuit and disconnection can be prevented as much as possible. Is what you do. The connection is made mainly by conductive soldering as in the prior art. The connection portion is shown as A1 and A2 in FIG. 1A, and the enlarged view of the A2 portion is shown in FIG.

【0008】図2はこの発明の第2の実施の形態を示す
説明図である。同図(イ)は超音波探触子を示す断面
図、同図(ロ)は同図(イ)の接続部分拡大図である。
すなわち、図1では超音波素子12とフレキケーブル2
とを直接接続するようにしたが、ここでは超音波素子1
2に予め接続されている、リン青銅のようなバネ性を持
った金属箔15を介してフレキケーブル2を接続するよ
うにした点が特徴で、その他は図1の場合と同様であ
る。
FIG. 2 is an explanatory view showing a second embodiment of the present invention. FIG. 1A is a cross-sectional view showing an ultrasonic probe, and FIG. 2B is an enlarged view of a connection portion of FIG.
That is, in FIG. 1, the ultrasonic element 12 and the flexible cable 2
Are connected directly, but here, the ultrasonic element 1
It is characterized in that the flexible cable 2 is connected via a metal foil 15 having a spring property, such as phosphor bronze, which is connected to the flexible cable 2 in advance, and the other points are the same as those in FIG.

【0009】図3はこの発明の第3の実施の形態を示す
説明図である。同図(イ)は超音波探触子を示す斜視
図、同図(ロ)は同図(イ)の接続部分拡大図である。
フラットな超音波探触子1を構成する超音波素子12
に、図(イ)のようにダイシング溝を形成して複数チャ
ネルに分割するとき、超音波素子の横振動を抑制すべ
く、1つのチャネルをさらに細分割する加工が行なわれ
る。つまり、ダイシング溝として、深い溝16A間に少
なくとも1つ(同図(イ)では2ヵ所)の浅い溝16B
を形成する。このとき、従来のように減衰材料13の部
分に達するまで溝加工をすると、これらを1つのチャネ
ルにまとめるための手数,時間が長くなってしまう。
FIG. 3 is an explanatory view showing a third embodiment of the present invention. FIG. 1A is a perspective view showing an ultrasonic probe, and FIG. 2B is an enlarged view of a connection portion of FIG.
Ultrasonic element 12 constituting flat ultrasonic probe 1
When a dicing groove is formed and divided into a plurality of channels as shown in FIG. 2A, a process for further subdividing one channel is performed in order to suppress lateral vibration of the ultrasonic element. In other words, at least one (two in FIG. 10A) shallow grooves 16B are provided between the deep grooves 16A as dicing grooves.
To form At this time, if grooves are formed until the damping material 13 is reached as in the related art, the number of steps and time required to combine the grooves into one channel increases.

【0010】そこで、この図3の例では浅い溝16Bの
深さを、超音波素子12を完全に切断してしまわない深
さ、つまり減衰材料13の部分迄達しないようにするこ
とにより、1チャネル当たりの接続部分面積を大きく
し、超音波素子の各チャネル対応部分とフレキケーブル
2との接続(同図(ロ)ではフレキケーブル等2のパッ
ド21を介して接続)を容易にするものである。こうす
ることで、半田付けのための手数,時間を大幅に短縮す
ることができる。
Therefore, in the example of FIG. 3, the depth of the shallow groove 16B is adjusted so as not to reach the depth at which the ultrasonic element 12 is completely cut, that is, the depth of the attenuation material 13, so that 1 The area of the connection portion per channel is increased to facilitate connection between the corresponding portion of each ultrasonic element and the flexible cable 2 (in FIG. 2B, connection via the pad 21 of the flexible cable 2). is there. By doing so, the number of steps and time for soldering can be greatly reduced.

【0011】図4はこの発明の第4の実施の形態を示す
説明図である。同図(イ)は超音波探触子を示す断面
図、同図(ロ)はその正面図、同図(ハ)はその曲げ治
具、同図(ニ)はその部分拡大図である。すなわち、同
図(イ)の如く積層構成される超音波探触子1を、同
(ロ)の如く湾曲させる場合には、フラットな超音波探
触子1に上記のようなダイシングを施して複数チャネル
に分割した後、予め用意されている同(ハ)に示すよう
な複数種類の曲げ治具31,32,33等を用いて湾曲
させる。
FIG. 4 is an explanatory diagram showing a fourth embodiment of the present invention. 2A is a cross-sectional view showing the ultrasonic probe, FIG. 2B is a front view thereof, FIG. 2C is a bending jig thereof, and FIG. 2D is a partially enlarged view thereof. That is, when the ultrasonic probe 1 configured as shown in FIG. 2A is curved as shown in FIG. 2B, the flat ultrasonic probe 1 is subjected to dicing as described above. After being divided into a plurality of channels, the channels are bent using a plurality of types of bending jigs 31, 32, 33, etc. prepared in advance as shown in FIG.

【0012】そして、湾曲された超音波探触子1にフレ
キケーブル2を接続するには、この場合は超音波素子の
曲率を(ハ)に示すような複数種類の曲げ治具31,3
2,33等を用いて調整したのちに、前記フレキケーブ
ル2と接続するようにしている。こうすることで、超音
波素子に適正な曲率が与えられ、フレキケーブルの寸法
誤差を吸収した確実な接続が可能となる。
To connect the flexible cable 2 to the curved ultrasonic probe 1, a plurality of types of bending jigs 31 and 3 as shown in FIG.
After adjustment using the cable 2, 33 or the like, the cable is connected to the flexible cable 2. By doing so, an appropriate curvature is given to the ultrasonic element, and a reliable connection that absorbs the dimensional error of the flexible cable becomes possible.

【0013】[0013]

【発明の効果】この発明によれば、超音波素子をフレキ
ケーブル(信号入出力線部材)等で直接に接続するよう
にしたので、超音波探触子1台当たり最大で20分程度
短縮されることが確かめられている。また、ワイヤレス
となるため、ワイヤ断線事故をなくすことができ、チャ
ネル間の短絡事故も極力少なくなり、大幅な品質の向上
が望める。さらに、ワイヤレスのため、曲率の小さなも
のやチャネル数の多いものにも直ちに適応できるだけで
なく、信頼性の高い超音波探触子を提供することが可能
となる、などの利点が得られる。
According to the present invention, the ultrasonic element is directly connected by a flexible cable (signal input / output line member) or the like, so that the ultrasonic probe can be shortened by up to about 20 minutes per ultrasonic probe. Has been confirmed. In addition, since it is wireless, it is possible to eliminate a wire breakage accident, minimize a short circuit accident between channels as much as possible, and expect a significant improvement in quality. Further, since wireless is used, it is possible to provide an ultrasonic probe with high reliability as well as to be able to immediately adapt to a device having a small curvature or a device having a large number of channels.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の第1の実施の形態を示す説明図であ
る。
FIG. 1 is an explanatory diagram showing a first embodiment of the present invention.

【図2】この発明の第2の実施の形態を示す説明図であ
る。
FIG. 2 is an explanatory diagram showing a second embodiment of the present invention.

【図3】この発明の第3の実施の形態を示す説明図であ
る。
FIG. 3 is an explanatory diagram showing a third embodiment of the present invention.

【図4】この発明の第4の実施の形態を示す説明図であ
る。
FIG. 4 is an explanatory diagram showing a fourth embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1…超音波探触子、11A,11B…音響マッチング層
(整合層)、12…超音波素子、13…減衰材料、14
…基台、15…金属箔、16A,16B…ダイシング
溝、2…フレキケーブル(フレキシブルプリント配線基
板)、21…パッド、31,32,33…治具。
DESCRIPTION OF SYMBOLS 1 ... Ultrasonic probe, 11A, 11B ... Acoustic matching layer (matching layer), 12 ... Ultrasonic element, 13 ... Attenuation material, 14
... Base, 15 ... Metal foil, 16A, 16B ... Dicing groove, 2 ... Flexible cable (flexible printed wiring board), 21 ... Pad, 31, 32, 33 ... Jig.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 基台に減衰材料を介在させて複数チャネ
ルからなる超音波素子を配置し、さらにその上に整合層
を形成してなる超音波探触子の、前記超音波素子の各チ
ャネル対応部分に、信号入出力線部材を直接接続するこ
とを特徴とする超音波探触子の製造方法。
An ultrasonic probe comprising a plurality of channels arranged on a base with an attenuating material interposed therebetween, and a matching layer formed thereon further, wherein each channel of the ultrasonic elements is provided. A method for manufacturing an ultrasonic probe, wherein a signal input / output line member is directly connected to a corresponding portion.
【請求項2】 前記超音波素子の各チャネル対応部分と
信号入出力線部材とを、所定金属の金属箔を介して接続
することを特徴とする請求項1に記載の超音波探触子の
製造方法。
2. The ultrasonic probe according to claim 1, wherein a portion corresponding to each channel of the ultrasonic element and a signal input / output line member are connected via a metal foil of a predetermined metal. Production method.
【請求項3】 前記超音波素子の各チャネルをさらに細
分割する場合、チャネル分割のための深い溝間に、前記
超音波素子を切断してしまわない程度の浅い溝を少なく
とも1箇所形成してチャネル対応部分の面積を大きく
し、超音波素子の各チャネル対応部分と信号入出力線部
材との接続を容易にすることを特徴とする請求項1に記
載の超音波探触子の製造方法。
3. When subdividing each channel of the ultrasonic element, at least one shallow groove is formed between deep grooves for channel division so as not to cut the ultrasonic element. The method for manufacturing an ultrasonic probe according to claim 1, wherein the area of the channel corresponding portion is increased to facilitate connection between each channel corresponding portion of the ultrasonic element and the signal input / output line member.
【請求項4】 前記超音波素子が湾曲している場合は、
予め複数種類の曲げ治具を用意しておき、これにより超
音波素子の曲率を前もって調整したのち、前記信号入出
力線部材と接続することを特徴とする請求項1に記載の
超音波探触子の製造方法。
4. When the ultrasonic element is curved,
2. The ultrasonic probe according to claim 1, wherein a plurality of types of bending jigs are prepared in advance, and the curvature of the ultrasonic element is adjusted in advance, and then connected to the signal input / output line member. Child manufacturing method.
JP9135560A 1997-05-26 1997-05-26 Manufacture of ultrasonic wave probe Pending JPH10327498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9135560A JPH10327498A (en) 1997-05-26 1997-05-26 Manufacture of ultrasonic wave probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9135560A JPH10327498A (en) 1997-05-26 1997-05-26 Manufacture of ultrasonic wave probe

Publications (1)

Publication Number Publication Date
JPH10327498A true JPH10327498A (en) 1998-12-08

Family

ID=15154674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9135560A Pending JPH10327498A (en) 1997-05-26 1997-05-26 Manufacture of ultrasonic wave probe

Country Status (1)

Country Link
JP (1) JPH10327498A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010197314A (en) * 2009-02-26 2010-09-09 Mitsubishi Heavy Ind Ltd Apparatus and method for detecting ultrasonic flaw
JP2011066921A (en) * 2010-11-05 2011-03-31 Toshiba Corp Ultrasonic probe
CN105726059A (en) * 2014-12-26 2016-07-06 三星麦迪森株式会社 Probe and manufacturing method thereof
KR20190030849A (en) * 2017-09-15 2019-03-25 지멘스 메디컬 솔루션즈 유에스에이, 인크. Ultrasound transducer and manufacturing method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010197314A (en) * 2009-02-26 2010-09-09 Mitsubishi Heavy Ind Ltd Apparatus and method for detecting ultrasonic flaw
JP2011066921A (en) * 2010-11-05 2011-03-31 Toshiba Corp Ultrasonic probe
CN105726059A (en) * 2014-12-26 2016-07-06 三星麦迪森株式会社 Probe and manufacturing method thereof
CN105726059B (en) * 2014-12-26 2021-05-04 三星麦迪森株式会社 Probe and method of manufacturing the same
KR20190030849A (en) * 2017-09-15 2019-03-25 지멘스 메디컬 솔루션즈 유에스에이, 인크. Ultrasound transducer and manufacturing method thereof
US11101424B2 (en) 2017-09-15 2021-08-24 Siemens Medical Solutions Usa, Inc. Ultrasound transducer and manufacturing method thereof

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