JP5203221B2 - 2つの次元でイオンビーム角を測定する方法及び装置 - Google Patents
2つの次元でイオンビーム角を測定する方法及び装置 Download PDFInfo
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- 238000010884 ion-beam technique Methods 0.000 title claims description 143
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2446—Position sensitive detectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
- H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
- H01J2237/24528—Direction of beam or parts thereof in view of the optical axis, e.g. beam angle, angular distribution, beam divergence, beam convergence or beam landing angle on sample or workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24571—Measurements of non-electric or non-magnetic variables
- H01J2237/24578—Spatial variables, e.g. position, distance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
- H01J2237/31703—Dosimetry
Description
tanθh=(xpx−xbc)/zpx (1)
ビームレット190がビーム電流センサ162aによって遮断されるスロット144のX座標xbcは、水平ビーム角が変化するに従って変化する。従って、ゼロの水平ビーム角を有するイオンビームの一例については、ビームレット190は、軌道192に沿ってビーム電流センサ162aに運ばれる。負の水平ビーム角を有するイオンビームについては、ビームレット190は、軌道194に沿ってビーム電流センサ162aに運ばれ、正の水平ビーム角を有するイオンビームについては、ビームレット190は、軌道196に沿ってビーム電流センサ162aに運ばれる。ビーム電流センサに対する変位方向は、水平ビーム角の符号を示す。
tanθv=(ypx−ybc)/zpx (2)
Claims (18)
- 第1の形状及び第2の形状を画成し、前記第2の形状は、前記第2の形状上の位置に応じて前記第1の形状から可変の間隔を有するフラグと、
前記フラグがイオンビームの少なくとも一部を遮断するよう前記フラグを並進路に沿って並進させるメカニズムと、
前記並進路に沿っての複数の異なるフラグ位置に対して前記イオンビームを検出し、検出された前記イオンビームに応じてセンサ信号を生成するセンスデバイスと、
を含み、
前記センサ信号及び前記フラグの対応する複数の位置は、前記並進路に対して垂直な垂直面における前記イオンビームの垂直ビーム角を表す、角度測定システム。 - 前記センスデバイスは、
マスクと、
前記マスクを第1の位置と第2の位置との間で並進させるメカニズムと、
を含み、
前記第1の位置における前記マスクは、関連するファラデーセンサの一部の上にビーム電流センサを画成し、
前記ビーム電流センサは、前記センサ信号を生成する、請求項1に記載の角度測定システム。 - 前記ファラデーセンサの一部は、90平方ミリメートル未満の表面積を有する矩形形状を有する、請求項2に記載の角度測定システム。
- 前記マスクは、前記マスクが前記第1の位置にある場合に、前記ビーム電流センサを画成する少なくとも1つのアパーチャを含む、請求項2に記載の角度測定システム。
- 前記マスクは、前記マスクが前記第1の位置にある場合に、関連する複数のファラデーセンサ上に1つの関連のビーム電流センサを画成する複数のアパーチャを含む、請求項2に記載の角度測定システム。
- 前記複数のアパーチャは、
前記マスクが前記第1の位置にある場合に、第1のファラデーセンサの一部の上に第1のビーム電流センサを画成する第1のアパーチャと、
前記マスクが前記第1の位置にある場合に、第2のファラデーセンサの一部の上に第2のビーム電流センサを画成する第2のアパーチャと、
前記マスクが前記第1の位置にある場合に、第3のファラデーセンサの一部の上に第3のビーム電流センサを画成する第3のアパーチャと、
を含む、請求項5に記載の角度測定システム。 - 前記センサ信号に応じて、前記ビーム電流センサにおける、前記垂直面における前記垂直ビーム角及び水平面における水平ビーム角を決定する処理デバイスを更に含む、請求項2に記載の角度測定システム。
- 前記センサ信号は、
前記第1の形状を表す第1の信号成分と、
前記第2の形状を表す第2の信号成分と、
を有し、
前記第1の信号成分と前記第2の信号成分との間の距離は、前記垂直ビーム角を表す、請求項2に記載の角度測定システム。 - 前記第1の形状及び前記第2の形状は、前記フラグの外側エッジを含む、請求項1に記載の角度測定システム。
- 前記第1の形状及び前記第2の形状は、直線であり、且つ、鋭角を成して方向付けられる、請求項9に記載の角度測定システム。
- 前記鋭角は、22.5度である、請求項10に記載の角度測定システム。
- 前記第1の形状は、前記並進路に直交し、
前記第2の形状は、前記フラグの傾斜外側エッジを含む、請求項10に記載の角度測定システム。 - 第1の形状及び第2の形状を画成し、前記第2の形状は、前記第2の形状上の位置に応じて前記第1の形状から可変の間隔を有するフラグを供給することと、
前記フラグがイオンビームの少なくとも一部を遮断するよう前記フラグを並進路に沿って並進させることと、
前記並進路に沿っての複数の異なるフラグ位置に対して前記イオンビームを検出することと、
検出された前記イオンビームに応じてセンサ信号を生成することと、
を含み、
前記センサ信号及び前記フラグの対応する複数の位置は、前記並進路に対して垂直な垂直面における前記イオンビームの垂直ビーム角を表す、方法。 - マスクを第1の位置と第2の位置との間で並進させることを更に含み、
前記第1の位置における前記マスクは、関連するファラデーセンサの一部の上にビーム電流センサを画成し、
前記ビーム電流センサは、前記センサ信号を生成する、請求項13に記載の方法。 - 前記マスクは、前記マスクが前記第1の位置にある場合に、関連する複数のファラデーセンサ上に1つの関連のビーム電流センサを画成する複数のアパーチャを含む、請求項14に記載の方法。
- 前記複数のアパーチャは、
前記マスクが前記第1の位置にある場合に、第1のファラデーセンサの一部の上に第1のビーム電流センサを画成する第1のアパーチャと、
前記マスクが前記第1の位置にある場合に、第2のファラデーセンサの一部の上に第2のビーム電流センサを画成する第2のアパーチャと、
前記マスクが前記第1の位置にある場合に、第3のファラデーセンサの一部の上に第3のビーム電流センサを画成する第3のアパーチャと、
を含む、請求項15に記載の方法。 - 前記ビーム電流センサにおける、前記垂直面における前記垂直ビーム角及び水平面における水平ビーム角を決定するよう前記センサ信号を処理することを更に含む、請求項14に記載の方法。
- モニタリングされた前記垂直ビーム角を予め定められた基準と比べることと、
モニタリングされた前記垂直ビーム角が前記予め定められた基準を満足しない場合に、前記イオンビームを調節する、又は、前記イオンビームに対して基板を傾斜させることで前記垂直ビーム角を調節することと、
を更に含む、請求項17に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US11/336,466 US7394073B2 (en) | 2005-04-05 | 2006-01-20 | Methods and apparatus for ion beam angle measurement in two dimensions |
US11/336,466 | 2006-01-20 | ||
PCT/US2007/001204 WO2007087209A1 (en) | 2006-01-20 | 2007-01-17 | Methods and apparatus for ion beam angle measurement in two dimensions |
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JP2009524195A JP2009524195A (ja) | 2009-06-25 |
JP2009524195A5 JP2009524195A5 (ja) | 2010-02-12 |
JP5203221B2 true JP5203221B2 (ja) | 2013-06-05 |
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US (1) | US7394073B2 (ja) |
JP (1) | JP5203221B2 (ja) |
KR (1) | KR101318803B1 (ja) |
CN (1) | CN101371328B (ja) |
TW (1) | TWI393161B (ja) |
WO (1) | WO2007087209A1 (ja) |
Cited By (1)
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US10790117B2 (en) | 2018-03-26 | 2020-09-29 | Sumitomo Heavy Industries Ion Technology Co., Ltd. | Ion implantation apparatus and measurement device |
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US10790117B2 (en) | 2018-03-26 | 2020-09-29 | Sumitomo Heavy Industries Ion Technology Co., Ltd. | Ion implantation apparatus and measurement device |
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US20060289798A1 (en) | 2006-12-28 |
TWI393161B (zh) | 2013-04-11 |
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KR101318803B1 (ko) | 2013-10-16 |
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US7394073B2 (en) | 2008-07-01 |
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