JP5202530B2 - 放電プラズマ焼結(sps)法によって耐火セラミック部品を接合するための方法 - Google Patents
放電プラズマ焼結(sps)法によって耐火セラミック部品を接合するための方法 Download PDFInfo
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Description
i)鑞付けされたアセンブリの動作温度は、鑞の融点を超えることがない。
ii)鑞は、場合によっては物質の使用にとって許容できなくなり得てまた例えば鑞の中性子不適合を生じさせ得る第二相に対応する。
iii)鑞の性質は、鑞付けされる物質の性質に本質的に関連している。つまり、アセンブリされる各セラミックに対して、新型の特定の鑞を開発する必要があるが、これには、長期にわたり費用のかかる開発期間が必要である。
‐ 部品の接合される表面を、その表面間に何ものも追加されることなく接触させる;その後、
‐ 1から200MPa(つまり2000bar)の圧力(接合圧として知られている)をそれらの部品に印加する;
‐ 500から8000Aの強度を有するパルス電流を、それらの部品に印加して、少なくとも1300℃の温度(接合温度として知られている)に部品の温度を上昇させる;その後、
‐ 電流の印加を中断するのと同時に圧力の印加を中断し、部品を冷却する;その後、
‐ 接続された部品を回収する。
‐ 大気温度から600℃ : 3分間;
‐ 600から1600℃ : 10分間;
‐ 1600から1750℃ : 3分間;
‐ 1750℃で5分間保持。
‐ 0から19.9MPa : 13分間;
‐ 19.9MPaから75.6MPa : 3分間
‐ 75.6MPaで5分間保持。
これらの実施例において、SiC製又はTiN製の部品は直径8mm、厚さ5mmのディスクであり、本発明の方法によるSPSによって接合された。SiC又はTiNの各物質に対して、六つの接合サンプルを製造した。
‐ 50MPa下で5分間にわたる1800℃の温度;
‐ 3.2msのパルス列
‐ 光学観測
得られたサンプルは優れた凝集を示した。目視観測では欠陥は明らかとならなかった。
切断及び研磨後のサンプルの観測を走査型電子顕微鏡を用いて行った。図2Aから2Dは、金属組織学的準備の後の研磨された表面上に得られたサンプルの顕微鏡写真を示す。
‐ 10MPa下で5秒間にわたる1500℃の温度;
‐ 3.2msのパルス列。
‐ 光学観測
得られたサンプルは優れた凝集を示した。目視観測では欠陥は明らかにならなかった。
切断及び研磨後のサンプルの観測を走査型電子顕微鏡を用いて行った。
本発明の方法によるSPSによって接合したSiC及びTiNのサンプルは、微細構造の変形なく、凝集性の界面を示す。
2 グラファイトスリーブ
3 ピストン
4 圧力
5 直流電流
6 電極
7 真空チャンバ
Claims (22)
- 放電プラズマ焼結によって接合される少なくとも一つの表面をそれぞれ有する少なくとも二つの耐火セラミックの部品を放電プラズマ焼結によって接合するための方法であって、
‐ 前記表面の間に何も追加することなく前記部品の接合される表面同士を接触させる段階と、
‐ 1から200MPaの接合圧として知られる圧力を前記部品に印加する段階と、
‐ 前記部品の温度を少なくとも1300℃の接合温度として知られる温度に上昇させるように前記部品に500から8000Aの強度を有するパルス電流を印加する段階と、
‐ 圧力の印加を中断すると同時に電流の印加を中断し、前記部品を冷却する段階と、
接合された前記部品を回収する段階とが実行され、
前記部品の接合される表面同士を接触させる段階から前記部品を回収する段階までの一連の段階を1回実行する、方法。 - 10から150MPaの圧力を印加する、請求項1に記載の方法。
- 500から6000Aの強度を有するパルス電流を印加する、請求項1または2に記載の方法。
- 接合される前記部品の温度を、1400から2000℃に上昇させる、請求項1から3のいずれか一項に記載の方法。
- 少なくとも1300℃の温度を、0から10分間の期間にわたって維持する、請求項1から4のいずれか一項に記載の方法。
- 方法の全所要時間が10から30分間である、請求項1から5のいずれか一項に記載の方法。
- 80℃/分から600℃/分の冷却速度で前記部品を冷却する、請求項1から6のいずれか一項に記載の方法。
- 圧力及び温度を0MPaの圧力及び大気温度から段階的に上昇させる、請求項1から7のいずれか一項に記載の方法。
- 前記接合温度に到達する単一の温度勾配又は異なる傾斜を任意で有する複数の温度勾配を用いることによって温度を上昇させる、請求項8に記載の方法。
- 前記温度勾配が50℃/分から200℃/分の傾斜を有する、請求項9に記載の方法。
- 前記接合圧に到達する単一の圧力勾配又は異なる傾斜を任意で有する複数の圧力勾配を用いることによって圧力を上昇させる、請求項8に記載の方法。
- 前記圧力勾配が1MPa/分から20MPa/分の傾斜を有する、請求項11に記載の方法。
- 温度及び圧力を同一期間にわたって同時に上昇させる、請求項8から12のいずれか一項に記載の方法。
- 対応する圧力及び温度勾配が同一期間を有する複数の圧力勾配及び複数の温度勾配を用いる、請求項13に記載の方法。
- 接合される前記表面を軟化させることのできる温度にまで温度を上昇させた後に前記接合圧を印加する、請求項8から14のいずれか一項に記載の方法。
- 前記接合される前記表面を軟化させることのできる温度が、前記接合温度未満の50から300℃である、請求項15に記載の方法。
- 1から5msのピリオドを有し、1から15パルスの列によって接続されていて、各列が1から15ピリオドによって分離されているパルスの形状で、前記パルス電流を印加する、請求項1から16のいずれか一項に記載の方法。
- 2から100個の部品が接合される、請求項1から17のいずれか一項に記載の方法。
- 接合される前記部品が全て同一の耐火セラミック製である、請求項1から18のいずれか一項に記載の方法。
- 接合される前記部品が異なるセラミック製である、請求項1から19のいずれか一項に記載の方法。
- 耐火セラミックが炭化物セラミック、窒化物セラミック、酸化物セラミックから選択される、請求項1から20のいずれか一項に記載の方法。
- 耐火セラミックがSiC、TiN、ZrC、TiCから選択される、請求項21に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0653973A FR2906242B1 (fr) | 2006-09-27 | 2006-09-27 | Procede d'assemblage de pieces en ceramique refractaire par frittage a chaud avec champ electrique pulse ("sps") |
FR0653973 | 2006-09-27 | ||
PCT/EP2007/060258 WO2008037765A2 (fr) | 2006-09-27 | 2007-09-27 | Procede d'assemblage de pieces en ceramique refractaire par frittage a chaud avec champ electrique pulse (' sps ') |
Publications (2)
Publication Number | Publication Date |
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JP2010504902A JP2010504902A (ja) | 2010-02-18 |
JP5202530B2 true JP5202530B2 (ja) | 2013-06-05 |
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JP2009529704A Expired - Fee Related JP5202530B2 (ja) | 2006-09-27 | 2007-09-27 | 放電プラズマ焼結(sps)法によって耐火セラミック部品を接合するための方法 |
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US (1) | US8956478B2 (ja) |
EP (1) | EP2066598B1 (ja) |
JP (1) | JP5202530B2 (ja) |
CN (1) | CN101516804A (ja) |
FR (1) | FR2906242B1 (ja) |
WO (1) | WO2008037765A2 (ja) |
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FR2933972B1 (fr) * | 2008-07-18 | 2011-06-10 | Commissariat Energie Atomique | Procede de preparation d'une piece en carbure de silicium ne necessitant pas l'usage d'ajouts de frittage |
FR2952367B1 (fr) * | 2009-11-10 | 2012-09-28 | Commissariat Energie Atomique | Synthese d'un fluorophosphate metallique et utilisation comme materiau actif d'electrode pour accumulateur |
JP5759902B2 (ja) * | 2009-11-27 | 2015-08-05 | 昭和電工株式会社 | 積層材およびその製造方法 |
CN101733623B (zh) * | 2009-12-10 | 2012-05-09 | 北京科技大学 | 一种金属层状复合材料放电等离子体制备方法 |
FR2961350B1 (fr) | 2010-06-11 | 2012-08-03 | Commissariat Energie Atomique | Procede de fabrication de cellules electrochimiques elementaires pour systemes electrochimiques producteurs d'energie ou d'hydrogene, notamment du type sofc et eht |
JP5585984B2 (ja) * | 2010-07-27 | 2014-09-10 | 独立行政法人 宇宙航空研究開発機構 | パルス通電接合方法及びパルス通電接合装置 |
FR2966455B1 (fr) | 2010-10-25 | 2013-05-17 | Commissariat Energie Atomique | Procede pour revetir une piece d'un revetement de protection contre l'oxydation |
JP5706193B2 (ja) * | 2011-03-02 | 2015-04-22 | 株式会社タカコ | 摺動部材の製造方法 |
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FR2973265B1 (fr) | 2011-03-31 | 2014-03-28 | Centre Nat Rech Scient | Procede de fabrication par frittage flash d'une piece de forme complexe et dispositif pour la mise en œuvre d'un tel procede. |
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CN102390079A (zh) * | 2011-09-26 | 2012-03-28 | 西安交通大学 | 高压烧结组合模具及其制备纳米陶瓷的高压快速烧结方法 |
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FR2983192B1 (fr) | 2011-11-25 | 2014-05-23 | Commissariat Energie Atomique | Procede pour revetir une piece d'un revetement de protection contre l'oxydation par une technique de depot chimique en phase vapeur, et revetement et piece |
US20140318392A1 (en) * | 2011-12-13 | 2014-10-30 | Pavol Sajgalik | Laboratory heat press |
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US10676400B2 (en) | 2014-05-21 | 2020-06-09 | Ceramtec-Etec Gmbh | Ceramics wringing |
PL234046B1 (pl) | 2014-11-03 | 2020-01-31 | Genicore Spolka Z Ograniczona Odpowiedzialnoscia | Sposób oraz urządzenie do konsolidacji materiałów proszkowych |
CN105364284B (zh) * | 2015-12-04 | 2017-08-08 | 西北工业大学 | 一种氧化锆或氧化锆基复合材料的低温快速焊接方法 |
RU2614006C1 (ru) * | 2015-12-14 | 2017-03-22 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский технологический университет "МИСиС" | Способ получения нанокерамики методом совмещения самораспространяющегося высокотемпературного синтеза и искрового плазменного спекания |
JP6714044B2 (ja) * | 2017-06-26 | 2020-06-24 | エルジー・ケム・リミテッド | 窒化ケイ素焼結体の製造方法、窒化ケイ素焼結体及びそれを用いた放熱基板 |
US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
CN111960844B (zh) * | 2020-07-31 | 2022-08-02 | 广东工业大学 | 一种陶瓷连接件及其制备方法和应用 |
CN113603342A (zh) * | 2021-08-19 | 2021-11-05 | Oppo广东移动通信有限公司 | 玻璃胚体的脱脂方法、玻璃和电子装置 |
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US3250892A (en) | 1961-12-29 | 1966-05-10 | Inoue Kiyoshi | Apparatus for electrically sintering discrete bodies |
US3241956A (en) | 1963-05-30 | 1966-03-22 | Inoue Kiyoshi | Electric-discharge sintering |
FR2707196B1 (fr) | 1993-07-07 | 1995-08-11 | Commissariat Energie Atomique | Procédé d'assemblage de molybdène ou de tungstène avec eux-mêmes ou des céramiques contenant du silicium, par brasage. |
FR2728561B1 (fr) | 1994-12-21 | 1997-01-24 | Commissariat Energie Atomique | Composition et procede de brasage d'une ceramique comprenant de l'alumine |
US5794113A (en) * | 1995-05-01 | 1998-08-11 | The Regents Of The University Of California | Simultaneous synthesis and densification by field-activated combustion |
FR2748471B1 (fr) | 1996-05-07 | 1998-06-12 | Commissariat Energie Atomique | Assemblage par brasage de materiaux ceramiques contenant du carbure de silicium |
FR2749787B1 (fr) | 1996-06-12 | 1998-07-24 | Commissariat Energie Atomique | Procede d'assemblage a l'aide d'un joint epais de pieces en materiaux a base de sic par brasage refractaire et joint refractaire et epais ainsi obtenu |
US6001304A (en) * | 1998-12-31 | 1999-12-14 | Materials Modification, Inc. | Method of bonding a particle material to near theoretical density |
US5989487A (en) * | 1999-03-23 | 1999-11-23 | Materials Modification, Inc. | Apparatus for bonding a particle material to near theoretical density |
US6384365B1 (en) * | 2000-04-14 | 2002-05-07 | Siemens Westinghouse Power Corporation | Repair and fabrication of combustion turbine components by spark plasma sintering |
JP3548509B2 (ja) * | 2000-06-07 | 2004-07-28 | 諏訪熱工業株式会社 | パルス通電接合方法及び接合装置並びに接合体 |
JP4067830B2 (ja) * | 2002-01-24 | 2008-03-26 | 日本碍子株式会社 | セラミックス製構造体の接合装置及び接合方法 |
CA2559121A1 (en) * | 2004-03-11 | 2005-09-22 | Japan Science And Technology Agency | Bulk solidified quenched material and process for producing the same |
JP2005262244A (ja) | 2004-03-17 | 2005-09-29 | Suwa Netsukogyo Kk | パルス通電による金属部材の接合方法 |
JP4520422B2 (ja) * | 2006-03-27 | 2010-08-04 | 株式会社日立製作所 | 通電接合装置及び通電接合方法 |
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- 2007-09-27 EP EP07803612A patent/EP2066598B1/fr not_active Not-in-force
- 2007-09-27 WO PCT/EP2007/060258 patent/WO2008037765A2/fr active Application Filing
- 2007-09-27 CN CNA2007800357568A patent/CN101516804A/zh active Pending
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CN101516804A (zh) | 2009-08-26 |
US20100139840A1 (en) | 2010-06-10 |
US8956478B2 (en) | 2015-02-17 |
WO2008037765A2 (fr) | 2008-04-03 |
EP2066598B1 (fr) | 2012-10-24 |
EP2066598A2 (fr) | 2009-06-10 |
FR2906242B1 (fr) | 2009-01-16 |
JP2010504902A (ja) | 2010-02-18 |
FR2906242A1 (fr) | 2008-03-28 |
WO2008037765A3 (fr) | 2008-05-15 |
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