JP5201872B2 - Ink jet recording head and method for storing information in ink jet recording head - Google Patents

Description

  The present invention relates to an ink jet recording head substrate and an ink jet recording head on which the substrate is mounted.

  The ink jet recording apparatus is a so-called non-impact recording type recording apparatus that performs recording by ejecting ink from an ink jet recording head, and is capable of high-speed recording, compatible with various recording media, noise It has the feature that almost does not occur. For this reason, the ink jet recording apparatus is widely adopted as an apparatus that bears a recording mechanism such as a printer, a copier, a facsimile machine, and a word processor.

  Ink jet recording heads (hereinafter also simply referred to as recording heads) are known that form ink droplets that are ejected by various methods. Among them, a recording head that uses heat as energy for ink ejection can relatively easily realize a high-density multi-nozzle, and can perform high-resolution and high-quality recording at high speed.

  Many recording heads are attached to an ink jet recording apparatus in a replaceable manner to perform recording. In such a recording head, a ROM (Res Only Memory) is mounted on the recording head base so that information specific to the recording head such as an ID (Identity) code of the recording head and driving characteristics of the ink ejection mechanism can be read out. Sometimes. This function is a very effective means for performing optimum driving by obtaining information specific to a recording head at the time of recording when a recording head that can be attached to and detached from the ink jet recording apparatus main body is used.

  For example, Patent Document 1 discloses mounting an EEPROM (Electrically Erasable Programmable ROM) on a recording head. However, since the recording head disclosed in Patent Document 1 is equipped with an EEPROM that is configured separately from the recording head and not on the recording head substrate, the structure is complicated and the productivity is not good, and the apparatus is compact and lightweight. Inhibition is also possible. Further, such a ROM is useful for storing a large amount of information, but is disadvantageous in terms of cost if the information to be stored is not a large amount.

  Japanese Patent Application Laid-Open No. H10-228688 discloses that a fuse element that functions as a ROM is formed simultaneously when a recording head is manufactured. The fuse element is appropriately blown out so that the presence or absence of the blowout can be read at the time of use so that the fuse element can function as a ROM holding binary data. Such a recording head can realize the simplification of the structure, the improvement of productivity, the reduction of cost, and the reduction in size and weight while retaining the information unique to the head.

  As described above, when the fuse element is incorporated in the substrate of the recording head, the ink adheres to the recording head during recording. Therefore, when the ink enters the fusing part of the fuse element, the fusing part is corroded or the fuse element. The electrodes may corrode and reliability may be impaired. For this reason, when a fuse element is formed on an ink jet substrate, a structure in which ink does not enter the fuse element portion must be provided. Therefore, the layer in which the ink ejection mechanism and the fuse element are formed on the recording head substrate is positioned in the lower layer portion by forming another layer on the upper layer.

Japanese Patent Laid-Open No. 3-126560 Japanese Patent No. 3428683

  As a method for fusing the fuse element used in Patent Document 2, there is a method using laser light. This method is the most effective method for electrically opening the fuse element by fusing and evaporating. However, this method is not suitable for mass production because the eluate generated when the fuse element is melted adheres to the substrate and the cost is high in the melting process.

  As another fusing method, there is a method of fusing by supplying a pulse wave current to the fuse element. This method is suitable for mass production because it does not cost much and the effluent hardly adheres to the substrate. However, when the fuse element is blown by flowing a large rising pulse wave current, the interval between the fused portions of the fuse is narrowed, and the resin layer around the fuse element is not melted so much. Therefore, there is almost no space for allowing the melted fuse material to scatter, and the melted fuse material exists in the same space even after fusing, so that there is a possibility that it will be reconnected.

  Therefore, in order to surely blow the fuse element mounted on the recording head substrate, a resistance element is provided outside the recording head substrate (on the apparatus main body side). There is a method of adjusting the current so that the current flows. When the fuse is blown using a pulse wave current having a small rise in this way, the interval between the fuse blown portions becomes wide, and the resin layer around the fuse element is also melted. Therefore, a sufficient space that allows the melted fuse material to scatter is formed and the interval between the fusing parts is widened, so that the fusing parts are not reconnected and a highly reliable open circuit state is realized. can do.

  However, the optimum current waveform for fusing the fuse varies from one fuse element to another. When a resistance element is provided outside the recording head substrate (on the apparatus main body side), the resistance element is a fixed resistance and does not correspond to variations among individual fuse elements of the replaceable recording head. Therefore, depending on the combination of the recording head and the apparatus main body, the fuse element may not be sufficiently melted.

  Accordingly, an object of the present invention is to provide an ink jet recording head substrate capable of recording information with high reliability by reliably fusing fuse elements, and an ink jet recording head mounting the substrate. And

For this reason, the information storage method for the ink jet recording head of the present invention has a recording element that generates energy used for ejecting ink, and a central portion that is thin and melted by flowing current. An information storage method for an ink jet recording head, comprising: a fuse element capable of storing information depending on presence / absence; and a resistance element serving as a resistance of a current that flows when the fuse element is blown. The fuse element is blown by passing a current through the resistance element provided by patterning the same thin film layer as the fuse element.

  According to the present invention, on a logic circuit through which a current for fusing the fuse element flows, the current adjusting means is provided in the same layer as the layer provided with the fuse element, so that the fuse element is suitable for fusing. It becomes possible to adjust to the current. Therefore, the reliability of the information recorded on the ink jet recording head is increased, and an ink jet recording head substrate and an ink jet recording head that can perform recording under optimum discharge conditions can be realized.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a serial scan type ink jet recording apparatus (hereinafter also simply referred to as a recording apparatus) 300 on which an ink jet recording head 400 (hereinafter also simply referred to as a recording head) of the present embodiment can be mounted. The recording apparatus 300 according to the present embodiment mounts the recording head 400 on the carriage 303 and performs recording by scanning the carriage 303. The recording head 400 incorporates a recording element substrate H1110 (see FIG. 3) described later, and a heater element H1103 and wiring are formed on the surface of the recording element substrate H1110. Further, in the recording head 400, a fuse element 410 and a resistance element 411 as current adjusting means are made of the same material in the same thin film layer. The recording element substrate H1110 is also formed with electrode pads H1104 (af) for electrically connecting the recording head 400 and external terminals.

  The recording head 400 is detachably mounted on the carriage 303 of the head moving mechanism 302. The carriage 303 is supported so as to be movable in the main scanning direction indicated by the arrow X by the guide shaft 304 and the like, and is further moved by the head moving mechanism 302 in the main scanning direction. Is reciprocated. A platen roller 305 that holds and conveys the recording paper P as a recording medium is disposed at a position facing the recording head 400 supported in this manner. The platen roller 305 and the like constitute a paper transport mechanism 306 that sequentially transports the recording paper P in the sub-scanning direction indicated by the arrow Y.

  FIG. 2 is a block diagram illustrating a control system of the recording apparatus 300 according to the present embodiment. As shown in FIG. 2, the head moving mechanism 302 and the paper transport mechanism 306 are connected to a movement control circuit 311. The movement control circuit 311 is connected to a control unit 312 in the form of a microcomputer. The control unit 312 integrally controls the head moving mechanism 302 and the paper transport mechanism 306, so that the recording head 400 and the recording paper P are relatively moved. The control unit 312 is also connected to a data input circuit 313 as data input means, a data read circuit 314 as data read means, a communication I / F 315, and the like. A host device 210 such as a host computer is connected to the communication I / F 315 via a communication cable 220.

  The data input circuit 313 is connected to a recording logic circuit (see FIG. 3) of the recording head 400 via a connection connector of the carriage 303, and supplies recording data to the recording logic circuit. The data reading circuit 315 is connected to a fuse logic circuit (see FIG. 3) of the recording head 400 via a connection connector of the carriage 303, and reads data stored in a fuse element 410 described later from the fuse logic circuit.

  The control unit 312 in the form of a microcomputer integrally controls the various circuits 311, 313 and 314 as described above. For example, the recording data input from the host apparatus 210 to the communication I / F 315 is supplied to the data input circuit 313, and the storage data read from the recording head 400 by the data reading circuit 314 is output from the communication I / F 315 to the host apparatus 210. To do.

  In the recording apparatus 300 of this embodiment, an ink tank as an ink supply unit is mounted as a cartridge integrated with the recording head, and is detachable from the carriage 303 when the ink is used up. The ink tank is filled with ink, and this ink is supplied to the recording head 400.

  In FIG. 2, the image processing system 200 includes a host device (host computer) 210 that is a central control device, and a recording device 300. The recording device 300 and the host device 210 are connected by a communication cable 220. For example, the image processing system 200 causes the recording apparatus 300 to perform a recording operation based on recording data supplied from the host apparatus 210. At this time, the head moving mechanism 302 moves the recording head 400 in the main scanning direction and the paper transport mechanism 306 transports the recording paper P in the sub-scanning direction by the integrated control of the control unit 312. In synchronization with these operations, the data input circuit 313 inputs recording data to the recording head 400.

  The recording head 400 holds ink that is constantly supplied from the ink tank, and the recording logic circuit of the recording head 400 selectively heats a number of heater elements H1103 described later based on the recording data. By the selective heat generation of the large number of heater elements H1103, ink is foamed and ink droplets are ejected from the corresponding ejection ports. When the ink droplets adhere to the surface of the recording paper P, a so-called dot matrix image that represents the image in a dot array is formed.

  FIG. 3 is a diagram illustrating a logic circuit provided on the printing element substrate H1110 of the printing apparatus 300 according to the present embodiment. A recording element substrate H1110 shown in FIG. 3 is incorporated in the recording head 400 of this embodiment. On the recording element substrate H1110, a logic circuit including a heater element H1103, a fuse element 410, a resistance element 411 as current adjusting means, an electrode pad H1104 (af), wiring, and the like is formed. The heater element H1103 generates thermal energy as ink discharge energy, and discharges ink droplets from a discharge port (not shown) by heating and foaming the ink. The electrode pads H1104 (a to f) constitute electrodes for electrically connecting wirings formed on the recording element substrate H1110 to external terminals, and are supplied with driving signals for the heater element H1103. The fuse element 410 is formed with a plurality of fuse elements 410 that can be blown by an electric current, and various data can be stored by selectively blowing each fuse element 410. The resistance value of the resistance element 411 serving as the current adjusting means is adjusted so that the fuse element 410 can be surely blown and data can be stored with high reliability in accordance with the presence or absence of the blowout. The ink supply port H1102 is formed at the center of the recording element substrate H1110, and the heater element H1103 is disposed around the ink supply port H1102.

  Further, the logic circuit of FIG. 3 is configured as follows. In the present embodiment, the fuse element 410 is formed of a polysilicon resistor and is disposed on the short side of the ink supply port H1102. The second drive element H1118 that is driven to blow and read the fuse element 410 is disposed adjacent to the first drive element H1116.

  The selection signal for selecting the second drive element H1118 and the selection signal for selecting the first drive element H1116 are both configured in the same signal system, and in parallel with the logic circuit for selecting the first drive element H1116. A logic circuit for selecting the second driving element H1118 is connected. That is, a signal line for sending a selection signal to the first drive element H1116, a time-division drive signal decoder (DECODER), a latch circuit (LT), a shift register (S / R), and an external signal input pad (not used) (Shown) is shared by the first and second drive elements. Therefore, the second drive element H1118 can be selected without adding a new signal line, wiring region, circuit, or the like. A selection circuit H1112 that selects the second drive element H1118 by a signal output from a shift register (S / R) or the like has the same form as the selection circuit H1100 of the first drive element H1116. Note that the VH power supply wiring H1114 extending from the VH power supply pad H1104e for supplying the VH power to the electrothermal conversion element H1103 is connected to the electrothermal conversion element H1103. A GNDH power supply wiring H1113 extending from the GNDH power supply pad H1104f for supplying the GNDH power supply is connected to the electrothermal transducer H1103 and the second drive element H1118 connected to the fuse element 410. And shared.

  In the upper layer of the recording element substrate H1110 configured as described above, the flow path for supplying and discharging ink and the constituent members of the discharge port can be formed of the organic resin layer. The ink jet recording head 400 is completed by connecting an ink supply unit for supplying ink to the ink supply port H1102 below the recording element substrate H1110.

  Since the recording head 400 includes the fuse element 410, for example, data related to the ID code, the operating characteristics of the heater element H1103, and the like are recorded in the fuse element 410 before the recording head 400 is manufactured and shipped. be able to. This can be performed, for example, using an inspection system having the same configuration as the image processing system 200 shown in FIG.

  The recording head 400 shipped after recording such data is mounted on the carriage 303 for use. At that time, the recording apparatus 300 can read out data stored in the fuse element 410 of the recording head 400 by the data reading circuit 314. Therefore, the recording apparatus 300 can perform known control corresponding to the operating characteristics of the heater element H1103 read from the fuse element 410 of the recording head 400. For example, the driving power supplied to the heater element H1103 can be adjusted, or the ID code of the recording head 400 can be notified to the host device 210.

  Next, a method for forming the fuse element 410 and the resistance element 411 as current adjusting means in the recording head 400 will be described.

  In manufacturing the recording head 400, a fuse element 410 and a resistance element 411 are formed using polysilicon in a gate portion used when a semiconductor element such as a driving element or a logic circuit provided on the recording element substrate H1110 is formed in a laminated state. Is built as follows. Before forming the fuse element 410 and the resistor element 411, a fuse element 410 and a logic element such as a drive element and a logic circuit are previously formed on the upper layer using a substrate on which a semiconductor element is manufactured using a semiconductor manufacturing process. A resistance element 411 may be formed.

  FIG. 4 is an enlarged plan view showing the fuse element 410 in FIG. 3 and a resistance element 411 as current adjusting means existing in a circuit through which a current for energizing and blowing the fuse element 410 flows. An ink flow path for ejecting ink is formed of an organic resin above the layer in which the fuse element 410 and the resistance element 411 are formed.

  5 is a cross-sectional view taken along the line V-V of the fuse element and the resistance element of FIG.

  In FIG. 4, the fuse element 410 formed of polysilicon has a thin center portion. For example, the central part is formed to be long and thin with a length of about 10 μm and a width of about 1.5 μm, and is easily melted. The end of the fuse element 410 is connected to the Al electrode 105. The through hole portion 108 is provided to connect the fuse element 410 and the Al electrode 105.

  In FIG. 5, the fuse element 410 is formed of a polysilicon film of about 4000 mm stacked on the thermal oxide film 402 on the surface of the recording element substrate H1110. Over the fuse element 410, an SiO film 104 is formed as an interlayer insulating film to a thickness of about 8000 mm by plasma CVD. The SiO film 104 has a melting point lower than that of the polysilicon fuse element 410, and is easily gasified by heat generated when the fuse is blown to form a cavity. The thickness of the SiO film 104 is desirably set in the range of 0.5 to 1 μm so that cracks do not occur when the fuse is blown and it does not break down significantly.

  Next, in order to control the cavity formed in the SiO film 104 when the fuse element 410 is blown, a SiO film 106 having a different composition is formed on the SiO film 104 as a protective film by a plasma CVD method to 6000 mm (0.6 μm). Form to thickness. The protective film 106 has a higher melting point than the interlayer insulating film 104 and has a composition that does not easily dissolve by heat, so that the expansion of the cavity of the interlayer insulating film 104 is suppressed and controlled to a predetermined size. However, although the protective film 106 has a low melting speed, it is partially melted by heat to form a hole so that the ejected matter is discharged from the hole and the expansion of the cavity is completely suppressed. Generation of cracks due to pressure can be prevented. Therefore, it is desirable that the thickness of the protective film 106 be set in the range of 0.3 to 0.8 μm so as to suppress the expansion of the cavity and partially generate a hole.

After forming the fuse element 410 in this way, TaSiN as a material of the heater element H1103 (see FIG. 5) is formed to a thickness of about 500 mm by sputtering, and subsequently, an AL layer is formed as a wiring layer. Form a thickness of 5000 mm. They are patterned into a predetermined shape by photolithography, and an AL layer and a TaSiN layer are simultaneously formed into a predetermined shape by dry etching using BCl ₃ gas. Further, the arrangement portion of the heater element H1103 is patterned into a predetermined shape by photolithography, and the arrangement portion of the heater element H1103 is formed by wet etching mainly containing phosphoric acid.

  Further, a SiN film as a protective film is formed to a thickness of about 3000 mm by a plasma CVD method on the upper layer, and a Ta film as a cavitation-resistant film is formed to a thickness of about 2000 mm by a sputtering method. Then, the Ta film and the SiN film are dry-etched by a photolithography method to obtain a predetermined shape. At that time, the Ta film and the SiN film on the fuse element 410 are removed. Next, an ink flow path for ejecting ink is three-dimensionally formed by an organic resin layer using a photolithography method. As described above, the substrate of the recording head 400 including the fuse element 410 capable of storing information is completed.

  FIG. 6 is a diagram showing a drive circuit connected to the fuse element 410. The fuse element 410 is connected to a driving element H1118 for melting and reading information. In the present embodiment, a drive element H1118 is individually connected to each of the plurality of fuse elements 410, and these drive elements H1118 are selectively driven by a selection circuit H1112. The selection circuit H1112 includes a signal line, a decoder (DECODER) that generates a time division selection signal (BLE), a latch circuit (LT) for signals including other signals, a shift register (S / R), and an external portion of the printhead substrate. Including an input pad (see FIG. 3) of the signal from. The selection circuit H1112 is configured similarly to a circuit for selectively driving a plurality of heater elements H1103 (see FIG. 3).

  When fusing the fuse element 410, the switch 503 provided on the inspection system side is turned on. Thereby, only one ID pad H1104a (only one is shown in the figure is shown) from the wiring 506 to the fusing voltage of the power source 504 (for example, 24V of the driving voltage of the heater element H1103). Applied). Then, by selectively driving the drive element H1118, the corresponding fuse element 410 is fused. On the other hand, when information stored according to the presence or absence of fusing of the fuse element 410 is read out to the recording apparatus side, a voltage (for example, logic) is applied to the fuse reading power supply pad H1104b connected to the plurality of fuse elements 410 in common. Apply a circuit power supply voltage of 3.3V. Then, by selectively driving the driving element H1118, the storage information of the corresponding fuse element 410, that is, the signal corresponding to the presence or absence of fusing is read out.

  By setting an obvious voltage difference between the fusing voltage and the read voltage in this way, the stored information can be read without limiting the read time and without damaging the fuse element 410. In reading the stored information, when the drive element H1118 corresponding to the blown fuse element 410 is driven, the output signal of the ID pad H1104a becomes high level (H). When the unfused fuse element 410 is driven, the output signal of the ID pad H1104a is at a low level due to a read resistor H1111 (a resistance larger than the resistance value of the fuse element 410) connected to the read power supply pad H1104b. (L). In this way, binary data can be stored in one fuse element by confirming the presence or absence of fusing.

  In the present embodiment, the resistor element 411 is provided by a polysilicon layer, which is the same thin film layer as the fuse blown portion, in a circuit on the recording element substrate H1110 through which a current for blowing the fuse element 410 flows. . For example, the resistance value of the resistance element 411 is about 40 to 120Ω, the resistance value of the fuse element 410 including the central taper portion is 200 to 410Ω, and the resistance value of the circuit excluding the fuse element 410 and including the resistance element 411 is It is about 170 to 330Ω. In the case of this embodiment, 24 V, which is the same as the drive voltage of the heater element H1103, is used as the voltage used for fusing the fuse element 410.

  FIGS. 7A and 7B are diagrams showing the state of the fuse element blown by currents having different pulse waveforms. FIGS. 8A and 8B are diagrams showing different pulse waveforms. When a resistance element as in this embodiment is not provided in a circuit through which a current for fusing the fuse element 410 is blown, that is, when the fuse element is blown by a current having a large rising pulse and a short pulse width (FIG. 8B). The fused part of the fuse element 410 is as shown in FIG. In this case, a large current flows through the fuse element and blows, but since the pulse width of the current is narrow (the time for energizing the fuse element is short), heat is not easily transmitted to the resin layer around the fuse element. Therefore, the resin layer around the fuse element is hardly melted, and only the fuse is blown short. At that time, the melted portion is formed with a space that is occupied by the fuse before melting, and the melted fuse material is also present in the space. As described above, a fusing method in which the melted fuse material has a narrow width and there is no escape space for the melted fuse material (the space is narrow) is not preferable because it may be connected again after fusing.

  When the resistance element is provided as in the present embodiment, that is, when the fuse element is blown by supplying a current having a waveform with a gradual change in time, the blown portion of the fuse element 410 is shown in FIG. become that way. In this case, since the width of the pulse is wide (the energization time to the fuse element is long), heat is sufficiently transmitted to the resin layer around the fuse element. Therefore, the resin layer around the fuse element is melted to form a wide space such as the space S in FIG. Thus, the fusing method in which the width of the fusing part after fusing is wide (the space is wide) is preferable because there is no fear of reconnecting after fusing.

  FIG. 9 is a diagram showing a circuit in which a resistance element 505 is provided in a portion other than the recording element substrate H1110 on a circuit through which a current for fusing the fuse element 410 flows. It is conceivable that the shape of the fuse element 410 provided on the recording element substrate H1110 varies in the manufacturing process, and accordingly, the current required for fusing also changes. When the resistance element 505 is provided other than the recording element substrate H1110, the resistance value of the resistance element 505 cannot correspond to the variation in the shape of the fuse element 410. Therefore, an appropriate current is supplied to the fuse element 410 at the time of fusing. You may not be able to.

  FIG. 10 is a diagram for explaining the relationship between the size of the fuse element and the current, FIG. 10 (a) is a diagram showing a relatively small fuse element, and FIG. 10 (b) is a relatively large fuse. It is a figure showing an element. FIGS. 11A and 11B are also diagrams for explaining the relationship between the size of the fuse element and the current, and represent cross-sectional views from the side surfaces of FIGS. 10A and 10B, respectively.

  As shown in FIGS. 10A and 11A, when the fuse element is relatively small and thin, it is blown slowly over a relatively long time with a current having a waveform as shown in FIG. There is a need to. Therefore, the resistance element to be used must have a large resistance value. Also, as shown in FIGS. 10B and 11B, when the fuse element is relatively large and thick, it needs to be blown in a relatively short time with a current having a waveform as shown in FIG. 8B. is there. Therefore, the resistance element to be used must have a small resistance value.

  Therefore, in order to effectively perform optimum adjustment of different currents due to variations in the shape of the fuse element 410, the same thin film layer as the fusing portion of the fuse element 410 is formed on the recording element base H1110 of the ink jet recording head as in this embodiment. It is preferable to form the current adjusting means 411. By forming the fuse element 410 and the resistance element 411 in the same thin film layer, the fuse element 410 and the resistance element 411 are necessarily formed to have the same thickness, and the current for fusing the fuse element 410 can be optimally adjusted. Possible resistance elements 411 can be formed. That is, when the fuse blown portion 410 (a) as shown in FIGS. 10 (a) and 11 (a) is relatively thin and thin, it needs to be blown by a gentle current change at the rising edge. Therefore, by forming the resistance element 411 (a) in the same layer, the thickness of the resistance element 411 (a) is also reduced at the same time, so that the resistance as the current adjusting means of the fusing circuit is large, the current waveform becomes gentle, and the fuse The reliability of fusing can be secured. In the case of a recording head in which the thin film layer 103 (b) constituting the fuse element 410 is formed to be relatively thick, the thin film layer constituting the electric resistance element 411 (b) provided as current adjusting means is also thick at the same time. Become. Such a fuse blown portion formed of a relatively thick film needs to be blown with a sufficiently large current, but since the film is thick, resistance as a current adjusting means of the fusing circuit is reduced. Reliability can be ensured.

  As described above, the resistance element for adjusting the current when fusing the fuse element is provided on the recording element substrate used in the ink jet recording head, and the resistance element is provided in the same layer as the fuse element. It becomes possible to adjust the current suitable for fusing. Therefore, the reliability of the information recorded on the ink jet recording head is improved, and an ink jet recording head substrate and an ink jet recording head capable of recording under optimum discharge conditions can be realized.

(Other embodiments)
Other embodiments of the present invention will be described below.
In the above-described embodiment, one resistance element 411 plays a role of resistance to a plurality of fuse elements, but in this embodiment, the resistance elements 411 are individually provided corresponding to the respective fuse elements 410. Other configurations are the same as those of the above-described embodiment.

  FIG. 12 is a diagram illustrating a configuration of a circuit according to the present embodiment. As shown in FIG. 12, the resistance elements 411 are individually provided corresponding to the plurality of fuse elements 410. In this case, since the optimum fusing current change can be brought about for each individual fuse regardless of the wiring resistance of the circuits other than the fuse element 410 and the resistance element 411, the degree of freedom of arrangement of the fuse elements in the substrate can be increased. Can do.

  Further, the thin film layer 103 forming the fuse element 410 and the resistance element 411 shown in FIG. 5 is the same material as the electrothermal conversion element, and even if it is a TaSiN thin film, the same invention effect can be obtained.

  In addition, a circuit for supplying a fusing current of the fuse element 410 may be provided in a fuse fusing device different from the recording device. In this case, the fuse element 410 is connected by connecting the recording head 400 to the fuse fusing device. Various data can be stored by fusing. In addition, a selection circuit H1112 for selecting the fuse element 410 for flowing a fusing current may be provided on the recording apparatus side. The recording apparatus may include a circuit for reading data corresponding to whether or not the fuse element 410 is blown, and a part of the circuit may be provided on the recording head side.

1 is a perspective view showing a serial scan type ink jet recording apparatus on which an ink jet recording head according to an embodiment of the present invention can be mounted. FIG. 2 is a block diagram illustrating a control system of the recording apparatus in FIG. 1. FIG. 2 is a diagram illustrating a logic circuit provided on a recording element substrate of the recording apparatus of FIG. 1. FIG. 4 is an enlarged plan view showing a fuse element and a resistance element in FIG. 3. FIG. 5 is a cross-sectional view of the fuse element and the resistance element in FIG. 4. It is the figure which showed the drive circuit connected to a fuse element. (A), (b) is a figure which shows the state of the fuse element fuse | melted by the electric current of a different pulse waveform. (A), (b) is a figure showing a different pulse waveform. It is a figure which shows the circuit by which the resistive element was provided in parts other than the board | substrate for recording elements. (A), (b) is a figure for demonstrating the relationship between the magnitude | size of a fuse element, and an electric current. (A), (b) is a figure for demonstrating the relationship between the magnitude | size of a fuse element, and an electric current. It is a figure which shows the structure of the circuit of other embodiment.

Explanation of symbols

108 through-hole portion 210 host device 300 recording device 400 recording head 410 fuse element 411 resistance element 505 resistance element H1102 ink supply port H1103 heater element H1110 recording element substrate H1116 first driving element H1118 second driving element

Claims (10)

A recording element that generates energy used for ejecting ink, a fuse element that has a narrow central portion, is blown by flowing current, and can store information depending on whether or not fusing, and the fuse element A resistance element that becomes a resistance of a current that flows when fusing, and an information storage method for an ink jet recording head,
Information for an ink jet recording head, wherein the fuse element is blown by passing a current through the resistance element provided by patterning the same thin film layer as the fuse element to the fuse element. Memory method.   2. The method of storing information in an ink jet recording head according to claim 1, wherein the material of the thin film layer is polysilicon.   3. The method for storing information in an ink jet recording head according to claim 1, wherein the film thickness of the fuse element and the film thickness of the resistance element are substantially equal.   The information to the ink jet recording head according to any one of claims 1 to 3, wherein the ink jet recording head further includes a constituent member having an ink ejection port corresponding to the recording element. Memory method. The inkjet recording head further includes a terminal used for applying a voltage to the fuse element and the resistance element,
5. The ink jet recording head according to claim 1, wherein when a voltage is applied to the terminal from the outside, a current flows to the fuse element through the resistance element. 6. Information storage method. A recording element that generates energy used for ejecting ink, a fuse element that has a narrow central portion, is blown by flowing current, and can store information depending on whether or not fusing, and the fuse element An ink jet recording apparatus comprising an ink jet recording head having a resistance element that becomes a resistance of a current that flows when fusing,
An ink jet recording apparatus, wherein the fuse element is blown by passing a current through the resistance element provided by patterning the same thin film layer as the fuse element.   The inkjet recording apparatus according to claim 6, wherein a material of the thin film layer is polysilicon.   8. The ink jet recording apparatus according to claim 6, wherein a film thickness of the fuse element and a film thickness of the resistance element are substantially equal.   The ink jet recording apparatus according to claim 6, wherein the ink jet recording head further includes a constituent member having an ink ejection port corresponding to the recording element. The inkjet recording head further includes a terminal used for applying a voltage to the fuse element and the resistance element,
10. The ink jet recording apparatus according to claim 6, wherein a current flows to the fuse element through the resistance element when a voltage is applied to the terminal from the outside. 11.

Images