JP5201823B2 - Conductive polyamide resin composition and method for producing the same - Google Patents

Conductive polyamide resin composition and method for producing the same Download PDF

Info

Publication number
JP5201823B2
JP5201823B2 JP2006335182A JP2006335182A JP5201823B2 JP 5201823 B2 JP5201823 B2 JP 5201823B2 JP 2006335182 A JP2006335182 A JP 2006335182A JP 2006335182 A JP2006335182 A JP 2006335182A JP 5201823 B2 JP5201823 B2 JP 5201823B2
Authority
JP
Japan
Prior art keywords
mass
carbon particles
polyamide
resin composition
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006335182A
Other languages
Japanese (ja)
Other versions
JP2008144085A (en
Inventor
新一郎 片平
茂太 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitika Ltd
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Priority to JP2006335182A priority Critical patent/JP5201823B2/en
Publication of JP2008144085A publication Critical patent/JP2008144085A/en
Application granted granted Critical
Publication of JP5201823B2 publication Critical patent/JP5201823B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

本発明は導電性ポリアミド樹脂組成物およびその製造方法に関する。   The present invention relates to a conductive polyamide resin composition and a method for producing the same.

自動車用途、電子電気部品用途には、導電性を有する樹脂組成物が幅広く用いられている。金属と比較して軽量であること、成形性に優れていることの理由からである。しかし、かかる樹脂組成物は、本来不導体の樹脂に導電性の充填材すなわち導電材を混ぜ合わせているため、樹脂本来の成形性や機械物性が犠牲になっているという欠点がある。   Conductive resin compositions are widely used for automobile applications and electronic / electrical component applications. This is because it is lighter than metal and has excellent formability. However, such a resin composition has a drawback in that the inherent moldability and mechanical properties of the resin are sacrificed because the conductive material, that is, the conductive material, is mixed with the originally non-conductive resin.

そこで、導電材に樹脂との親和性を高める表面処理を施したり、樹脂組成物の製造時の混錬条件を強化したりする改良がなされている。例えば、特許文献1に記載されているように潤滑油で導電材としての黒鉛を表面処理したり、特許文献2に記載されているように導電材としての炭素繊維に電解質化合物で表面処理したり、さらには特許文献3に記載されているように導電材としてのカーボン粒子を空気やオゾンを含む雰囲気中で25℃〜600℃で熱処理して表面を酸化させる方法が提案されている。   In view of this, improvements have been made in that the conductive material is subjected to a surface treatment for increasing the affinity with the resin, or the kneading conditions during the production of the resin composition are strengthened. For example, surface treatment of graphite as a conductive material with a lubricating oil as described in Patent Document 1, or surface treatment of carbon fiber as a conductive material with an electrolyte compound as described in Patent Document 2 Furthermore, as described in Patent Document 3, a method is proposed in which carbon particles as a conductive material are heat-treated at 25 ° C. to 600 ° C. in an atmosphere containing air or ozone to oxidize the surface.

特に特許文献3では、硝酸や過マンガン酸カリウムなどの酸化剤中にカーボン粒子を浸漬させることにより、カーボン粒子の表面を酸化させている。そしてこれら処理されたカーボン粒子をポリマーと溶融混練させて、導電性を有する樹脂組成物を作製している。しかし、このようにして作製された樹脂組成物では、導電材としてのカーボン粒子が表面処理されているため、導電材と樹脂との界面での電気抵抗を高めるおそれがある。さらには、混錬条件を強化すると導電性を発現させているカーボン粒子同士の接点を切る作用もあるため、樹脂組成物としての電気抵抗値を制御することは非常に困難である。特にフィルムや糸においては、ロット内における抵抗値のばらつきの制御が困難であるため、その用途が限られたものとなっている。
特開昭63−23993号公報 特開2002−212876号公報 特開2003−86405号公報
In particular, Patent Document 3 oxidizes the surface of carbon particles by immersing the carbon particles in an oxidizing agent such as nitric acid or potassium permanganate. These treated carbon particles are melt-kneaded with a polymer to produce a conductive resin composition. However, in the resin composition produced in this way, the carbon particles as the conductive material are surface-treated, and thus there is a risk of increasing the electrical resistance at the interface between the conductive material and the resin. Furthermore, if the kneading conditions are strengthened, there is an effect of cutting the contact between the carbon particles exhibiting electrical conductivity, so that it is very difficult to control the electrical resistance value as the resin composition. In particular, the use of film and yarn is limited because it is difficult to control variation in resistance value within a lot.
JP 63-23993 A JP 2002-212876 A JP 2003-86405 A

本発明は、前記実情に鑑みなされたものであり、その目的は、ポリアミド樹脂の成形性と耐薬品性とを維持しつつ、機械物性等と導電性とを向上させた導電性ポリアミド樹脂組成物およびその製造方法を提供することにある。   The present invention has been made in view of the above circumstances, and its purpose is to provide a conductive polyamide resin composition having improved mechanical properties and conductivity while maintaining the moldability and chemical resistance of the polyamide resin. And providing a manufacturing method thereof.

本発明者らは、下記の樹脂組成物であれば、ポリアミド樹脂の成形性と耐薬品性とを維持しつつ、機械物性等と導電性とを向上可能であることを見出し、本発明を完成した。
すなわち、本発明の要旨は、下記の通りである。
The present inventors have found that the following resin composition can improve the mechanical properties and conductivity while maintaining the moldability and chemical resistance of the polyamide resin, and have completed the present invention. did.
That is, the gist of the present invention is as follows.

(1)ポリアミド樹脂100質量部と、酸溶媒で湿式処理され、不活性ガス雰囲気中で25℃から600℃まで昇温させたときの質量減少率が1〜20質量%であるカーボン粒子0.5〜40質量部とを含有する樹脂組成物であり、前記ポリアミド樹脂がポリアミド6またはポリアミド66であり、前記カーボン粒子が天然黒鉛であることを特徴とする導電性ポリアミド樹脂組成物。 (1) Carbon particles having a mass reduction rate of 1 to 20% by mass when wet-treated with 100 parts by mass of a polyamide resin and an acid solvent and heated from 25 ° C. to 600 ° C. in an inert gas atmosphere. a resin composition containing 5 to 40 parts by weight, the polyamide resin is a polyamide 6 or polyamide 66, conductive polyamide resin composition, wherein the carbon particles are natural black lead.

(2)ポリアミドモノマー100質量部と、酸溶媒で湿式処理され、不活性ガス雰囲気中で25℃から600℃まで昇温させたときの質量減少率が1〜20質量%であるカーボン粒子0.5〜40質量部とを共存させた状態で、前記ポリアミドモノマーを重合させる樹脂組成物の製造方法であり、前記ポリアミドモノマーとして、ε−カプロラクタムを用いるか、または、ヘキサメチレンジアミンとアジピン酸の混合物を用い、前記カーボン粒子として、天然黒鉛を用いることを特徴とする導電性ポリアミド樹脂組成物の製造方法。 (2) Carbon particles having a mass reduction rate of 1 to 20% by mass when wet treated with 100 parts by mass of a polyamide monomer and an acid solvent and heated from 25 ° C. to 600 ° C. in an inert gas atmosphere. A method for producing a resin composition in which 5 to 40 parts by mass of the polyamide monomer is polymerized, and ε-caprolactam is used as the polyamide monomer or a mixture of hexamethylenediamine and adipic acid the use, as the carbon particles, method for producing a conductive polyamide resin composition which comprises using a natural black lead.

本発明によれば、特殊な処理を施した特定のカーボン粒子を用いることで、ポリアミド樹脂の成形性と耐薬品性とを維持しつつ、機械物性等と導電性とを向上させた導電性ポリアミド樹脂組成物を得ることができる。よって、本発明の導電性ポリアミド樹脂組成物は、導電性および機械物性と、ポリアミド樹脂が本来有している成形性や耐薬品性とを兼備し、このため安定した導電性を必要とする電子・電機分野、あるいは、静電気防止分野や自動車外装材分野などの広範囲の分野に利用できる。   According to the present invention, by using specific carbon particles subjected to a special treatment, the conductive polyamide having improved mechanical properties and conductivity while maintaining the moldability and chemical resistance of the polyamide resin. A resin composition can be obtained. Therefore, the conductive polyamide resin composition of the present invention combines the electrical conductivity and mechanical properties with the moldability and chemical resistance inherent in the polyamide resin. -It can be used in a wide range of fields such as the electric field or the field of static electricity prevention and automobile exterior materials.

本発明の導電性ポリアミド樹脂組成物は、ポリアミド樹脂100質量部と、酸溶媒で湿式処理され、不活性ガス雰囲気中で25℃から600℃まで昇温させたときの質量減少率が1〜20質量%であるカーボン粒子0.5〜40質量部とを含有するものである。   The conductive polyamide resin composition of the present invention has a mass reduction rate of 1 to 20 when it is wet-treated with 100 parts by mass of a polyamide resin and an acid solvent and heated from 25 ° C. to 600 ° C. in an inert gas atmosphere. It contains 0.5 to 40 parts by mass of carbon particles that are mass%.

本発明の導電性ポリアミド樹脂組成物の製造方法は、ポリアミドモノマー100質量部と、酸溶媒で湿式処理され、不活性ガス雰囲気中で25℃から600℃まで昇温させたときの質量減少率が1〜20質量%であるカーボン粒子0.5〜40質量部とを共存させた状態で、前記ポリアミドモノマーを重合させるものである。   The production method of the conductive polyamide resin composition of the present invention is a mass reduction rate when the wet treatment is performed with 100 parts by mass of a polyamide monomer and an acid solvent and the temperature is raised from 25 ° C. to 600 ° C. in an inert gas atmosphere. The polyamide monomer is polymerized in a state where 0.5 to 40 parts by mass of carbon particles of 1 to 20% by mass coexist.

モノマーは、重縮合してアミド結合を生じることにより、ポリアミド樹脂を形成するものであればよい。一般に、(i)一種の環状モノマーの中にアミド結合が存在し、水等の開始剤で開環させて、ポリアミドポリマーとする場合と、(ii)分子内にアミド基を2個有するモノマーと、同様に分子内にカルボキシル基を2個有するモノマーとを実質的に等モル量配合し、高温下でアミド結合を生じさせてポリアミドポリマーとする場合とがある。   Any monomer may be used as long as it forms a polyamide resin by polycondensation to produce an amide bond. In general, (i) a case where an amide bond is present in one kind of cyclic monomer and the ring is opened with an initiator such as water to form a polyamide polymer; and (ii) a monomer having two amide groups in the molecule; Similarly, there are cases where a substantially equimolar amount of a monomer having two carboxyl groups in the molecule is blended to produce an amide bond at a high temperature to form a polyamide polymer.

例えば、ポリアミド6の場合は、環状モノマーであるε−カプロラクタムと少量の水との混合物を、240℃程度まで温度を上げることにより開環重合する。これによって、ポリアミド6が得られる。この場合、少量の酸を添加することにより、重合度や重合速度をコントロールすることもできる。これ以外には、ω−ラウロラクタムや12−アミノドデカン酸からポリアミド12を得ることができ、これも本発明に用いることができる。   For example, in the case of polyamide 6, ring-opening polymerization is performed by raising the temperature of a mixture of ε-caprolactam, which is a cyclic monomer, and a small amount of water to about 240 ° C. Thereby, polyamide 6 is obtained. In this case, the polymerization degree and polymerization rate can be controlled by adding a small amount of acid. Other than this, polyamide 12 can be obtained from ω-laurolactam or 12-aminododecanoic acid, which can also be used in the present invention.

ポリアミド66の場合は、ヘキサメチレンジアミンとアジピン酸とを等モル量混合し、280℃まで温度を上げることにより、重縮合して、ポリアミド66が得られる。モノマーを変えて、ポリアミド46、ポリアミド612や、成分中に芳香族を導入した芳香族ポリアミド等も、本発明に用いることができる。   In the case of polyamide 66, hexamethylenediamine and adipic acid are mixed in an equimolar amount, and the temperature is raised to 280 ° C. to polycondensate to obtain polyamide 66. Polyamide 46, polyamide 612, and aromatic polyamide with aromatics introduced into the components by changing the monomers can also be used in the present invention.

本発明で用いるカーボン粒子は、天然黒鉛であることが必要であり、物質中にグラフェンシートの積層体がある程度発達したものであることが好ましい。本発明によれば、このグラフェンシートの積層体の層間に酸イオンを挿入させることがポイントである。このようなカーボン粒子として、具体的には、天然の鱗状黒鉛や塊状黒鉛、膨張黒鉛、キッシュ黒鉛が例示される。これらを混合して用いることもできる。 Carbon particles used in the present invention must be a natural graphite, it is preferable laminate of graphene sheets in the material is obtained by somewhat developed. According to the present invention, the point is that acid ions are inserted between the layers of the graphene sheet laminate. As such carbon particles, specifically, natural scaly graphite or bulk graphite, expanded graphite, kish graphite is exemplified. A mixture of these can also be used.

カーボン粒子の層間へ酸イオンを挿入方させる方法としては、97%硫酸や94%硝酸あるいはその混合物と、カーボン粒子とを、室温で混合撹拌し、純水を洗浄液としてこの洗浄液が中性になるまで洗浄した後、通常、約100℃で24時間以上真空乾燥させる。この場合、使用される酸は、カーボン粒子に対して酸化力のあるものであればよく、硫酸、硝酸、過マンガン酸カリウム、りん酸、塩酸、酢酸などの無機酸、また有機酸を、単品もしくは混合物として使用することができる。   As a method of inserting acid ions between the layers of carbon particles, 97% sulfuric acid, 94% nitric acid or a mixture thereof, and carbon particles are mixed and stirred at room temperature, and this cleaning liquid becomes neutral using pure water as a cleaning liquid. And then vacuum-dried at about 100 ° C. for 24 hours or longer. In this case, the acid used is not particularly limited as long as it has an oxidizing power for carbon particles. Inorganic acids such as sulfuric acid, nitric acid, potassium permanganate, phosphoric acid, hydrochloric acid, acetic acid, and organic acids can be used separately. Or it can be used as a mixture.

この方法は、前記した特許文献3に記載された表面酸化処理とは異なる。特許文献3では、0.3%過マンガン酸カリウム等の低濃度の酸を用いてカーボン粒子の表面に水酸基やカルボキシル基を導入しているが、本発明では、上述した97%硫酸と94%硝酸との
混合物のような高濃度の酸を用いることで、黒鉛などのカーボン粒子の層間に酸イオンを挿入させている点が異なる。
This method is different from the surface oxidation treatment described in Patent Document 3 described above. In Patent Document 3, hydroxyl groups and carboxyl groups are introduced on the surface of carbon particles using a low concentration acid such as 0.3% potassium permanganate. In the present invention, the 97% sulfuric acid and 94% described above are used. By using a high concentration acid such as a mixture with nitric acid, acid ions are inserted between layers of carbon particles such as graphite.

酸イオンの挿入方法として、それ以外に、電解法を用いることもできる。これは、一方の電極に目的のカーボン粒子を付着させて、酸溶媒中で電気を流すことにより、カーボン粒子の層間に酸イオンを挿入させるものである。   In addition to this, an electrolytic method can be used as a method for inserting an acid ion. In this method, the target carbon particles are attached to one electrode, and electricity is passed in an acid solvent, whereby acid ions are inserted between the layers of the carbon particles.

つまり、本発明は、前述の特許文献1や特許文献3に示されたような、高温下で空気と接触させることにより、カーボン粒子の表面に水酸基やカルボキシル基などの官能基を導入したり、また樹脂との相溶性を向上させるためにカーボン粒子の表面にシランカップリング剤を付着させたりする方法とは異なる。   That is, the present invention introduces a functional group such as a hydroxyl group or a carboxyl group to the surface of the carbon particles by bringing it into contact with air at a high temperature as shown in Patent Document 1 or Patent Document 3 described above, Moreover, it differs from the method of attaching a silane coupling agent to the surface of carbon particles in order to improve the compatibility with the resin.

さらには、これら特許文献1〜3に記載のものでは、特定の物性を有する黒鉛もしくは酸処理した黒鉛と、熱可塑性樹脂とを溶融混錬させているが、本発明は、モノマー溶液中に黒鉛を共存させた状態でそのモノマーを重合させる点において異なっている。また、本発明では、カーボン粒子として、その層間に予め酸溶媒で湿式処理されたものを用いている。そのため、樹脂中におけるカーボン粒子の分散性がよく、溶融混練する場合に較べて得られた樹脂組成物の導電性の向上効果が高い。   Furthermore, in those described in Patent Documents 1 to 3, graphite having specific physical properties or acid-treated graphite and a thermoplastic resin are melted and kneaded. Is different in that the monomer is polymerized in the state of coexistence. In the present invention, carbon particles that have been wet-treated with an acid solvent between the layers are used. Therefore, the dispersibility of the carbon particles in the resin is good, and the effect of improving the conductivity of the resin composition obtained is higher than in the case of melt kneading.

本発明においては、グラフェンシートの層間に酸イオンを挿入されたカーボン粒子を用いるが、このようなカーボン粒子を用いることで、例えばポリアミド樹脂がポリアミド6である場合には、グラフェンシート中に存在する酸イオンが、ε−カプロラクタムの重合開始剤となり、グラフェンシート間でε−カプロラクタムが重合するため、グラフェンシートがへき開して、ポリアミド6中へのカーボン粒子の分散性が向上する。このとき、酸イオンの挿入量が多くなるほど、カーボン粒子の分散性がより進行するので、得られる樹脂組成物の導電性が向上する。逆にその挿入量が少なくなると、得られる樹脂組成物の導電性の向上効果が低下する。   In the present invention, carbon particles in which acid ions are inserted between layers of the graphene sheet are used. By using such carbon particles, for example, when the polyamide resin is polyamide 6, the carbon particles are present in the graphene sheet. Since the acid ion serves as a polymerization initiator for ε-caprolactam and ε-caprolactam is polymerized between the graphene sheets, the graphene sheets are cleaved, and the dispersibility of the carbon particles in the polyamide 6 is improved. At this time, as the insertion amount of acid ions increases, the dispersibility of the carbon particles further progresses, so that the conductivity of the obtained resin composition improves. On the other hand, when the amount of insertion decreases, the effect of improving the conductivity of the resulting resin composition decreases.

カーボン粒子のグラフェンシートの層間に挿入した酸イオン量は、窒素等の不活性ガス流通下で、25℃から600℃まで昇温させたときの質量減少率を測定することにより、知ることができる。本発明で用いることができるのは、この質量減少率が1〜20質量%のカーボン粒子である。質量減少率が1質量%より少ない場合は、酸イオンの挿入量が不足で導電性の向上効果や、曲げ弾性率などの機械物性の向上効果が期待できない。質量減少率が20質量%を超えるカーボン粒子は、上記の方法では得ることができない。   The amount of acid ions inserted between the layers of the graphene sheet of carbon particles can be determined by measuring the mass reduction rate when the temperature is raised from 25 ° C. to 600 ° C. under an inert gas flow such as nitrogen. . The carbon particles having a mass reduction rate of 1 to 20% by mass can be used in the present invention. When the mass reduction rate is less than 1% by mass, the insertion amount of acid ions is insufficient, and the effect of improving conductivity and the effect of improving mechanical properties such as bending elastic modulus cannot be expected. Carbon particles having a mass reduction rate exceeding 20% by mass cannot be obtained by the above method.

樹脂組成物におけるカーボン粒子の含有率は、ポリアミド樹脂100質量部に対して0.5〜40質量部である。カーボン粒子の含有率が0.5質量部よりも少ない場合は、導電性の向上が期待できない。反対にカーボン粒子の含有率が40質量部を超えると、モノマーの重合が阻害されるため、ポリマーを得ることができない。   The content rate of the carbon particles in the resin composition is 0.5 to 40 parts by mass with respect to 100 parts by mass of the polyamide resin. When the carbon particle content is less than 0.5 parts by mass, no improvement in conductivity can be expected. On the contrary, when the content of the carbon particles exceeds 40 parts by mass, the polymerization of the monomer is inhibited, so that a polymer cannot be obtained.

本発明においては、カーボン粒子の平均粒径には制限がなく、例えば天然鱗状黒鉛などの数百マイクロメートルのものを使用することができる。 In the present invention, there is no limitation on the average particle size of the carbon particles, it is possible to use those of a few hundred micrometers, such as natural flake graphite, for example.

以下に、本発明を実施例にもとづいて詳しく説明する。
カーボン粒子の酸溶媒での湿式処理は、表1に示した内容でおこなった。その詳細は次のとおりである。なお、以下のC−1〜C−3のカーボン粒子について、不活性ガス雰囲気中で25℃から600℃まで昇温させたときの質量減少率を測定するときに使用した不活性ガスは、窒素であった。
The present invention will be described in detail below based on examples.
The wet treatment of the carbon particles with the acid solvent was performed according to the contents shown in Table 1. The details are as follows. In addition, about the following carbon particles of C-1 to C-3 , the inert gas used when measuring the mass reduction rate when the temperature was raised from 25 ° C. to 600 ° C. in an inert gas atmosphere was nitrogen. Met.

C−1:天然鱗状黒鉛50g(日本黒鉛社製 平均粒径380μm)を、90%硫酸2000ミリリットルと80%硝酸1000ミリリットルとの混合溶媒に投入し、室温で20分間混合撹拌させた。その後、大量の純水を洗浄液としてその内部に投入し、洗浄作業をおこなった。この洗浄作業は、洗浄液のpHが6〜7となるまで繰り返しおこなった。次いで、80℃×24hの熱風乾燥をおこない、その後、80℃×48hの真空乾燥を実施した。これによってカーボン粒子C−1が得られた。このカーボン粒子C−1は、不活性ガス雰囲気中で25℃から600℃まで昇温させたときの質量減少率が3.0質量%であった。   C-1: 50 g of natural scaly graphite (manufactured by Nippon Graphite Co., Ltd., average particle size: 380 μm) was put into a mixed solvent of 2000 ml of 90% sulfuric acid and 1000 ml of 80% nitric acid, and mixed and stirred at room temperature for 20 minutes. Thereafter, a large amount of pure water was introduced into the interior as a cleaning liquid, and cleaning work was performed. This washing operation was repeated until the pH of the washing solution reached 6-7. Next, hot air drying at 80 ° C. × 24 h was performed, and then vacuum drying at 80 ° C. × 48 h was performed. As a result, carbon particles C-1 were obtained. The carbon particles C-1 had a mass reduction rate of 3.0% by mass when heated from 25 ° C. to 600 ° C. in an inert gas atmosphere.

C−2:酸溶媒を、97%硫酸2000ミリリットルと94%硝酸1000ミリリットルとの混合溶媒に変更した。それ以外はC−1と同様にして、カーボン粒子C−2を作製した。得られたカーボン粒子C−2の質量減少率は15.0質量%であった。   C-2: The acid solvent was changed to a mixed solvent of 2000 ml of 97% sulfuric acid and 1000 ml of 94% nitric acid. Other than that was carried out similarly to C-1, and produced the carbon particle C-2. The mass reduction rate of the obtained carbon particles C-2 was 15.0% by mass.

C−3:酸溶媒を、10%硫酸2000ミリリットルと25%硝酸1000ミリリットルとの混合溶媒に変更した。それ以外はC−1と同様にして、カーボン粒子C−3を作製した。得られたカーボン粒子C−3の質量減少率は0.5質量%であった。 C-3 : The acid solvent was changed to a mixed solvent of 2000 ml of 10% sulfuric acid and 1000 ml of 25% nitric acid. Other than that produced carbon particle C-3 like C-1. The mass reduction rate of the obtained carbon particles C-3 was 0.5 mass%.

上述のカーボン粒子C−1〜C−3について、表1にまとめて示す。 The above-mentioned carbon particles C-1 to C-3 are shown together in Table 1.

Figure 0005201823
Figure 0005201823

下記の実施例・比較例における成形性の評価は、以下のようにして行った。すなわち、実施例1〜3、比較例1、4、5においては、東芝機械社製のEC100型成形機を用い、成形温度260℃、金型温度80℃、射出および保圧時間10秒、冷却時間15秒の条件で、ASTM曲げ試験片を10本成形した。そのときに10本全部が金型から正常に離型した場合を成形性良好(○)と評価した。金型から正常に離型した本数が9本以下の場合は、成形性不良(×)と評価した。 Evaluation of moldability in the following examples and comparative examples was performed as follows. That is, in Examples 1 to 3 and Comparative Examples 1, 4, and 5, using an EC100 type molding machine manufactured by Toshiba Machine Co., Ltd., a molding temperature of 260 ° C., a mold temperature of 80 ° C., injection and pressure holding time of 10 seconds, cooling Ten ASTM bending test pieces were molded under the condition of a time of 15 seconds. At that time, the case where all 10 pieces were normally released from the mold was evaluated as good moldability (◯). When the number of molds that were normally released from the mold was 9 or less, the moldability was evaluated as poor (x).

実施例4、比較例2においては、成形温度を220℃、金型温度を70℃に変えた。それ以外の成形条件は上記の通りとして評価した。
実施例5、比較例3においては、成形温度を240℃、金型温度を100℃に変えた。それ以外の成形条件は上記の通りとして評価した。
In Example 4 and Comparative Example 2, the molding temperature was changed to 220 ° C and the mold temperature was changed to 70 ° C. Other molding conditions were evaluated as described above.
In Example 5 and Comparative Example 3, the molding temperature was changed to 240 ° C and the mold temperature was changed to 100 ° C. Other molding conditions were evaluated as described above.

下記の実施例・比較例における樹脂組成物中のカーボン粒子量の測定は、樹脂組成物を6N塩酸中で還流させてポリマーを除去することにより行った。
実施例1
ε−カプロラクタム(以下、「ε−CL」と略称する)を100質量部、C−1を5質量部、純水を10質量部準備して、これらをオートクレーブに投入し、窒素置換後、液温を260℃まで上昇させ、この温度で2時間保持して、ε−CLを重合させた。そして、内容物をペレット状に払い出した後、100℃の熱水に浸漬させて未反応モノマーの除去を行い、これを乾燥して樹脂組成物を得た。得られた樹脂組成物の曲げ弾性率、体積抵抗率を測定した結果と、成形性を評価した結果を表2に示す。
Measurement of the amount of carbon particles in the resin compositions in the following Examples and Comparative Examples was performed by refluxing the resin compositions in 6N hydrochloric acid to remove the polymer.
Example 1
100 parts by mass of ε-caprolactam (hereinafter abbreviated as “ε-CL”), 5 parts by mass of C-1, and 10 parts by mass of pure water were prepared, and these were put into an autoclave. The temperature was raised to 260 ° C. and held at this temperature for 2 hours to polymerize ε-CL. And after paying out the contents in the form of pellets, it was immersed in hot water at 100 ° C. to remove unreacted monomers and dried to obtain a resin composition. Table 2 shows the results of measuring the flexural modulus and volume resistivity of the obtained resin composition and the results of evaluating the moldability.

なお、曲げ弾性率はASTM D638にもとづき測定し、体積抵抗率はASTM D257にもとづき測定した。
実施例2
ε−CLを100質量部、C−1を30質量部、純水を10質量部準備して、これらをオートクレーブに投入し、実施例1と同様にして樹脂組成物を作製し、曲げ弾性率と体積抵抗率を測定するとともに成形性を評価した。その結果を表2に示す。
実施例3
ε−CLを100質量部、C−2を10質量部、純水を10質量部準備して、これらをオートクレーブに投入し、実施例1と同様にして樹脂組成物を作製し、曲げ弾性率と体積抵抗率を測定するとともに成形性を評価した。その結果を表2に示す。
実施例4
12−アミノドデカン酸を100質量部、C−2を10質量部、純水を10質量部準備して、これらをオートクレーブに投入した。また、実施例1と比べて払い出し後の熱水浸漬を行わなかった。そして、それ以外は実施例1と同様にして樹脂組成物を作製し、曲げ弾性率と体積抵抗率を測定するとともに成形性を評価した。その結果を表2に示す。
実施例5
ヘキサメチレンジアミンを44質量部、アジピン酸を56質量部、C−2を10質量部、純水を10質量部準備して、これらをオートクレーブに投入した。また、実施例1と比べて払い出し後の熱水浸漬を行わなかった。そして、それ以外は実施例1と同様にして樹脂組成物を作製し、曲げ弾性率と体積抵抗率を測定するとともに成形性を評価した。その結果を表2に示す。
The flexural modulus was measured based on ASTM D638, and the volume resistivity was measured based on ASTM D257.
Example 2
100 parts by mass of ε-CL, 30 parts by mass of C-1 and 10 parts by mass of pure water were prepared, and these were put into an autoclave to prepare a resin composition in the same manner as in Example 1 to obtain a flexural modulus. The volume resistivity was measured and the moldability was evaluated. The results are shown in Table 2.
Example 3
100 parts by mass of ε-CL, 10 parts by mass of C-2, and 10 parts by mass of pure water were prepared, and these were put into an autoclave to prepare a resin composition in the same manner as in Example 1 to obtain a flexural modulus. The volume resistivity was measured and the moldability was evaluated. The results are shown in Table 2.
Example 4
100 parts by mass of 12-aminododecanoic acid, 10 parts by mass of C-2, and 10 parts by mass of pure water were prepared, and these were put into an autoclave. Moreover, the hot water immersion after discharge | payout was not performed compared with Example 1. FIG. Other than that, a resin composition was prepared in the same manner as in Example 1, and the flexural modulus and volume resistivity were measured and the moldability was evaluated. The results are shown in Table 2.
Example 5
44 parts by mass of hexamethylenediamine, 56 parts by mass of adipic acid, 10 parts by mass of C-2, and 10 parts by mass of pure water were prepared, and these were put into an autoclave. Moreover, the hot water immersion after discharge | payout was not performed compared with Example 1. FIG. Other than that, a resin composition was prepared in the same manner as in Example 1, and the flexural modulus and volume resistivity were measured and the moldability was evaluated. The results are shown in Table 2.

Figure 0005201823
Figure 0005201823

比較例1〜3
表3に示されたモノマーをそれぞれオートクレーブに投入し、カーボン粒子は入れずに、それ以外は実施例1と同様にして、それぞれのモノマーを重合させ、比較例1〜3の樹脂組成物を作製した。ただし、比較例2および比較例3では、払い出し後の熱水浸漬を行わなかった。このようにして作製された比較例1〜3の樹脂組成物について、曲げ弾性率と体積抵抗率を測定するとともに成形性を評価した。その結果を表3に示す。
比較例4
ε−CLを100質量部、C−3を10質量部、純水を10質量部準備して、これらをオートクレーブに投入し、実施例1と同様にして樹脂組成物を作製し、曲げ弾性率と体積抵抗率を測定するとともに成形性を評価した。その結果を表3に示す。
比較例5
ε−CLを100質量部、C−2を50質量部、純水を10質量部準備して、これらをオートクレーブに投入し、実施例1と同様にして樹脂組成物を作製しようとした。しかし、C−2の配合量が多すぎたため、ε−CLが充分重合せず、ポリマーとはならなかった。
Comparative Examples 1-3
Each of the monomers shown in Table 3 was charged into an autoclave, carbon particles were not added, and the other monomers were polymerized in the same manner as in Example 1 to produce resin compositions of Comparative Examples 1 to 3. did. However, in Comparative Example 2 and Comparative Example 3, hot water immersion after dispensing was not performed. The resin compositions of Comparative Examples 1 to 3 thus prepared were measured for flexural modulus and volume resistivity and evaluated for moldability. The results are shown in Table 3.
Comparative Example 4
100 parts by mass of ε-CL, 10 parts by mass of C-3, and 10 parts by mass of pure water were prepared, and these were put into an autoclave to prepare a resin composition in the same manner as in Example 1 to obtain a flexural modulus. The volume resistivity was measured and the moldability was evaluated. The results are shown in Table 3.
Comparative Example 5
100 parts by mass of ε-CL, 50 parts by mass of C-2 and 10 parts by mass of pure water were prepared, and these were put into an autoclave, and an attempt was made to produce a resin composition in the same manner as in Example 1. However, since there were too many compounding quantities of C-2, (epsilon) -CL did not fully polymerize but it did not become a polymer.

Figure 0005201823
Figure 0005201823

実施例1〜5の樹脂組成物は、ポリアミド樹脂100質量部に対し、酸溶媒で湿式処理され、不活性ガス雰囲気中で25℃から600℃まで昇温させたときの質量減少率が1〜20質量%であるカーボン粒子0.5〜40質量部を含有したものであったため、所要の曲げ弾性率を示すとともに、体積抵抗率は満足なレベル低下したものであった。成形性も良好であった。すなわち、所要の機械物性と導電性と成形性とを兼備したものであった。
The resin compositions of Examples 1 to 5 were wet-treated with an acid solvent with respect to 100 parts by mass of the polyamide resin, and had a mass reduction rate of 1 to 1 when the temperature was raised from 25 ° C. to 600 ° C. in an inert gas atmosphere. Since it contained 0.5 to 40 parts by mass of carbon particles of 20% by mass, the required flexural modulus was exhibited and the volume resistivity was reduced to a satisfactory level. The moldability was also good. That is, it has required mechanical properties, conductivity, and moldability.

これに対し比較例1〜比較例3の樹脂組成物は、カーボン粒子を含まないものであったため、曲げ弾性率と成形性は満足できるものであったが、導電性が不良であった。
比較例4の樹脂組成物は、不活性ガス雰囲気中で25℃から600℃まで昇温させたときの質量減少率が所要レベル未満のカーボン粒子を用いたものであったため、すなわちカーボン粒子のグラフェンシートの層間への酸イオンの挿入が不十分であったため、実施例3と較べて、配合するカーボン粒子は同量であっても、体積抵抗率が大幅に増大し、曲げ弾性率が低下し、成形性は不良であった。
On the other hand, since the resin compositions of Comparative Examples 1 to 3 did not contain carbon particles, the flexural modulus and moldability were satisfactory, but the conductivity was poor.
The resin composition of Comparative Example 4 uses carbon particles having a mass reduction rate of less than a required level when heated from 25 ° C. to 600 ° C. in an inert gas atmosphere, that is, graphene of carbon particles Since the insertion of acid ions between the layers of the sheet was insufficient, even when the amount of carbon particles to be blended was the same as in Example 3, the volume resistivity was greatly increased and the flexural modulus was decreased. The moldability was poor.

Claims (2)

ポリアミド樹脂100質量部と、酸溶媒で湿式処理され、不活性ガス雰囲気中で25℃から600℃まで昇温させたときの質量減少率が1〜20質量%であるカーボン粒子0.5〜40質量部とを含有する樹脂組成物であり、前記ポリアミド樹脂がポリアミド6またはポリアミド66であり、前記カーボン粒子が天然黒鉛であることを特徴とする導電性ポリアミド樹脂組成物。 Carbon particles having a mass reduction rate of 1 to 20% by mass when the wet process is performed with 100 parts by mass of a polyamide resin and an acid solvent and the temperature is increased from 25 ° C. to 600 ° C. in an inert gas atmosphere. a resin composition containing a mass portion, wherein the polyamide resin is a polyamide 6 or polyamide 66, conductive polyamide resin composition, wherein the carbon particles are natural black lead. ポリアミドモノマー100質量部と、酸溶媒で湿式処理され、不活性ガス雰囲気中で25℃から600℃まで昇温させたときの質量減少率が1〜20質量%であるカーボン粒子0.5〜40質量部とを共存させた状態で、前記ポリアミドモノマーを重合させる樹脂組成物の製造方法であり、前記ポリアミドモノマーとして、ε−カプロラクタムを用いるか、または、ヘキサメチレンジアミンとアジピン酸の混合物を用い、前記カーボン粒子として、天然黒鉛を用いることを特徴とする導電性ポリアミド樹脂組成物の製造方法。 Carbon particles having a mass reduction rate of 1 to 20% by mass when the wet process is performed with 100 parts by mass of a polyamide monomer and an acid solvent and the temperature is increased from 25 ° C. to 600 ° C. in an inert gas atmosphere. It is a method for producing a resin composition in which the polyamide monomer is polymerized in a state where a mass part coexists, and as the polyamide monomer, ε-caprolactam is used, or a mixture of hexamethylenediamine and adipic acid is used, production method of Examples carbon particles, conductive polyamide resin composition which comprises using a natural black lead.
JP2006335182A 2006-12-13 2006-12-13 Conductive polyamide resin composition and method for producing the same Expired - Fee Related JP5201823B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006335182A JP5201823B2 (en) 2006-12-13 2006-12-13 Conductive polyamide resin composition and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006335182A JP5201823B2 (en) 2006-12-13 2006-12-13 Conductive polyamide resin composition and method for producing the same

Publications (2)

Publication Number Publication Date
JP2008144085A JP2008144085A (en) 2008-06-26
JP5201823B2 true JP5201823B2 (en) 2013-06-05

Family

ID=39604616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006335182A Expired - Fee Related JP5201823B2 (en) 2006-12-13 2006-12-13 Conductive polyamide resin composition and method for producing the same

Country Status (1)

Country Link
JP (1) JP5201823B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112795007B (en) * 2021-04-02 2021-06-29 苏州大学 Nylon 6 in-situ coloring slice based on water-based carbon black nano color paste and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60108428A (en) * 1983-11-17 1985-06-13 Agency Of Ind Science & Technol Production of electrically conductive polyamide composition
JPH07179750A (en) * 1993-12-24 1995-07-18 Asahi Chem Ind Co Ltd Molded article of carbon black-containing polyamide resin
JP2000095947A (en) * 1998-09-21 2000-04-04 Unitika Ltd Conductive resin composition
JP2003012922A (en) * 2001-06-26 2003-01-15 Nippon Polypenco Ltd Impact-resistant polyamide resin molding
JP2004182866A (en) * 2002-12-03 2004-07-02 Mitsubishi Engineering Plastics Corp Conductive polyamide resin composition
JP2005179434A (en) * 2003-12-17 2005-07-07 Ube Ind Ltd Fuel piping joint

Also Published As

Publication number Publication date
JP2008144085A (en) 2008-06-26

Similar Documents

Publication Publication Date Title
TWI448415B (en) Process and performance aid for carbon nanotubes
JP4241070B2 (en) Resin composition and method for producing the same
KR102004954B1 (en) Additive for modifying polymer and manufacturing method thereof
JP5041209B2 (en) Heat resistant resin composition, production method thereof, heat resistant resin molded product, and electronic component for surface mounting
TW201809145A (en) Polyarylene sulfide resin composition having improved chemical resistance
JP2008007742A5 (en)
Kultravut et al. Localization of poly (glycidyl methacrylate) grafted on reduced graphene oxide in poly (lactic acid)/poly (trimethylene terephthalate) blends for composites with enhanced electrical and thermal conductivities
JP5201823B2 (en) Conductive polyamide resin composition and method for producing the same
KR101380734B1 (en) Composition of Polymer Resin for Enhancing Electrical Conductivity including Multifunctional Filler
JP5057763B2 (en) Polyamide resin composition and method for producing the same
EP2190926B1 (en) Injection molded article and composition for the preparation thereof
JP5011825B2 (en) Heat resistant resin composition and surface mount electronic component
KR100792781B1 (en) Thermoplastic polyphenylene ethers / partially aromatic polyamides resin composition and process for preparing the same
JP2004217895A (en) Polyarylene sulfide resin composition
KR100792782B1 (en) Partially aromatic polyamides resin composition and process for preparing the same
JP2002080720A (en) Cassette for substrate
JP2006291076A (en) Thermoplastic resin composition as coil-sealing material
JP4046214B2 (en) Molding resin composition and electric / electronic apparatus
KR102537764B1 (en) Heat resistant resin composition and manufacturing method thereof
JP7309790B2 (en) Method for producing polyarylene sulfide resin composition
JP2004043786A (en) Rubber composition
JP5362312B2 (en) Conductive resin molding
JP4974420B2 (en) Thermoplastic resin composition
JPH07258543A (en) Polyarylene sulfide resin composition and its production
JPH083327A (en) Connector

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20080430

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090910

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101027

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111213

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120213

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120306

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120420

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130115

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130212

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160222

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees