JP5200774B2 - Inspection apparatus and method - Google Patents

Inspection apparatus and method Download PDF

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JP5200774B2
JP5200774B2 JP2008226329A JP2008226329A JP5200774B2 JP 5200774 B2 JP5200774 B2 JP 5200774B2 JP 2008226329 A JP2008226329 A JP 2008226329A JP 2008226329 A JP2008226329 A JP 2008226329A JP 5200774 B2 JP5200774 B2 JP 5200774B2
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bonding
measurement
height
bonding wire
measurement workpiece
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JP2010062324A (en
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祥 舟野
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Toyota Motor Corp
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Description

本発明は、ボンディングがなされた測定ワークを検査する検査装置及び方法に関する。   The present invention relates to an inspection apparatus and method for inspecting a measurement workpiece that has been bonded.

従来、半導体素子上、基板上、端子上等に形成されるボンディングワイヤの形状、特にボンディングワイヤの高さを検査する技術が広く提案されている。   2. Description of the Related Art Conventionally, a technique for inspecting the shape of a bonding wire formed on a semiconductor element, a substrate, a terminal, etc., particularly the height of the bonding wire, has been widely proposed.

このようなボンディングワイヤ検査装置は種々提案されており、例えば、特許文献１には、ボンディングワイヤに対して上方から落射照明を照射し、撮像装置を上下方向へ移動させながら撮像した各焦点面での画像において、輝度が最大となる点（輝点）を検出し、輝点の各焦点面での輝度変化からワイヤ高さを算出するボンディングワイヤ検査装置が開示されている。
しかしながら、特許文献１に開示される検査装置は、計測するワイヤ高さの分解能を高くする場合、撮像装置を上下方向へ移動させる移動手段の動作精度を高くする必要があるため、非現実的であった。また、算出されるワイヤ高さは、測定対象である半導体素子、基板等の厚み公差、はんだ接合、ワイヤ接合等の際のバラツキを含むため、ワイヤの絶対的な高さを求めるためには、別途基準位置からの高さを求める必要があり、測定が煩雑となり、サイクルタイムが延びてしまう。そのため、十分な測定精度と検査時間の短縮とを両立させることは困難であった。 Various such bonding wire inspection apparatuses have been proposed. For example, Patent Document 1 irradiates the bonding wire with epi-illumination from above, and moves each image plane while moving the imaging apparatus in the vertical direction. In this image, there is disclosed a bonding wire inspection apparatus that detects a point (bright spot) having the maximum brightness and calculates the wire height from the brightness change at each focal plane of the bright spot.
However, the inspection apparatus disclosed in Patent Document 1 is unrealistic because it is necessary to increase the operation accuracy of the moving means that moves the imaging apparatus in the vertical direction when increasing the resolution of the wire height to be measured. there were. In addition, the calculated wire height includes the thickness tolerance of the semiconductor element, the substrate, etc. to be measured, the solder joint, the variation in the wire joint, etc., so in order to obtain the absolute height of the wire, It is necessary to obtain the height from the reference position separately, which complicates the measurement and extends the cycle time. Therefore, it has been difficult to achieve both sufficient measurement accuracy and shortening of inspection time.

また、特許文献２には、スリットレーザ光を用いた光切断法によって複数の頂点高さを同時に測定するボンディングワイヤ検査装置が開示されている。これによれば、測定対象の寸法公差等の影響を受けずに高精度の高さ測定が可能となるとともに、検査時間を大幅に短縮できる。
しかしながら、例えば特許文献２に記載の検査装置を用いて基板上にボンディングされた複数のボンディングワイヤの高さを測定する場合に、ボンダー加工のバラツキ、基板の傾き等に起因する各ボンディングワイヤの頂点高さのバラツキを吸収するために、前記各頂点高さの平均的な箇所にスリットレーザ光を照射することとなる。このように、スリットレーザ光の直線上にある測定対象の複数の頂点を同時に求める方法を採用しているため、その一つ一つの頂点に対する測定精度は、高速化の背反として精度低下を招いていた。
特開平９−８２７３９号公報 特開２００４−２５９９６８号公報 Patent Document 2 discloses a bonding wire inspection apparatus that simultaneously measures a plurality of apex heights by an optical cutting method using slit laser light. According to this, high-accuracy height measurement can be performed without being affected by the dimensional tolerance of the measurement object, and the inspection time can be greatly shortened.
However, for example, when measuring the heights of a plurality of bonding wires bonded on a substrate using the inspection apparatus described in Patent Document 2, the apex of each bonding wire due to bonder variation, substrate inclination, etc. In order to absorb the height variation, the slit laser light is irradiated to the average portion of each vertex height. As described above, since a method of simultaneously obtaining a plurality of vertices of the measurement target on the straight line of the slit laser beam is employed, the measurement accuracy for each of the vertices causes a decrease in accuracy as a contradiction of high speed. It was.
JP-A-9-823939 JP 2004-259968 A

本発明は、十分な測定精度と検査時間の短縮を両立させることができるとともに、ボンディングワイヤに加え、ボンディングリボンの高さを検査できる検査装置及び方法を提供することを課題とする。   It is an object of the present invention to provide an inspection apparatus and method that can achieve both sufficient measurement accuracy and a reduction in inspection time and can inspect the height of the bonding ribbon in addition to the bonding wire.

本発明の第一態様である検査装置は、基板上にボンディングワイヤ又はボンディングリボンがボンディングされてなる測定ワークにおける前記ボンディングワイヤ又はボンディングリボンの二次元形状及び高さを測定することによって、前記測定ワークを検査する検査装置であって、前記測定ワークの上方に配置される、二次元形状測定用の撮像装置と、前記撮像装置と同軸上に設置される同軸照明と、前記測定ワークの上方に配置される、前記ボンディングワイヤ又はボンディングリボンの高さ測定用のレーザ変位計と、前記撮像装置及びレーザ変位計と、前記測定ワークとを平面方向に相対的に移動させる平面方向移動装置と、を具備し、前記レーザ変位計において受光する受光量に対して所定の閾値を設定するとともに、前記受光量のうち、前記閾値より大きく、かつ、高さ方向に高い側で測定される受光量に基づいた値を前記ボンディングワイヤ又はボンディングリボンの高さとして採用する。   The inspection apparatus according to the first aspect of the present invention is configured to measure the two-dimensional shape and height of the bonding wire or the bonding ribbon in the measurement workpiece formed by bonding a bonding wire or a bonding ribbon on a substrate. A two-dimensional shape measurement imaging device disposed above the measurement workpiece, coaxial illumination installed coaxially with the imaging device, and disposed above the measurement workpiece A laser displacement meter for measuring the height of the bonding wire or the bonding ribbon, a plane direction moving device that relatively moves the imaging device, the laser displacement meter, and the measurement workpiece in a plane direction. And setting a predetermined threshold for the amount of light received by the laser displacement meter, Chi, greater than the threshold value, and employs a value based on a light receiving amount measured by high height direction side as the height of the bonding wire or bonding ribbons.

本発明の検査装置は、前記同軸照明は、前記測定ワークに対してストロボ発光にて照明を照射することが好ましい。   In the inspection apparatus of the present invention, it is preferable that the coaxial illumination irradiates the measurement workpiece with strobe light.

本発明の第二態様である検査方法は、基板上にボンディングワイヤ又はボンディングリボンがボンディングされてなる測定ワークにおける前記ボンディングワイヤ又はボンディングリボンの二次元形状及び高さを検査する検査方法であって、前記測定ワークを平面方向移動装置上に載置し、前記測定ワークの上方に位置する撮像装置の同軸照明にて該測定ワークを照射し、前記撮像装置にて前記ボンディングワイヤ又はボンディングリボンの平面形状及び頂点座標を含む二次元形状に関する測定データを取得し、前記測定ワークの上方に位置するレーザ変位計にて、前記撮像装置にて取得された測定データに基づいて、前記ボンディングワイヤ又はボンディングリボンの高さを測定する際に、前記レーザ変位計において受光する受光量に対して所定の閾値を設定するとともに、前記受光量のうち、前記閾値より大きく、かつ、高さ方向に高い側で測定される受光量に基づいた値を前記ボンディングワイヤ又はボンディングリボンの高さとして採用する。 The inspection method according to the second aspect of the present invention is an inspection method for inspecting the two-dimensional shape and height of the bonding wire or the bonding ribbon in a measurement workpiece formed by bonding a bonding wire or a bonding ribbon on a substrate. The measurement workpiece is placed on a plane direction moving device, the measurement workpiece is irradiated with coaxial illumination of an imaging device located above the measurement workpiece, and the planar shape of the bonding wire or bonding ribbon is irradiated with the imaging device And measurement data related to a two-dimensional shape including vertex coordinates , and a laser displacement meter located above the measurement workpiece, based on the measurement data acquired by the imaging device, the bonding wire or the bonding ribbon When measuring the height, the amount of light received by the laser displacement meter A predetermined threshold is set, and a value based on the amount of received light that is larger than the threshold and measured on the higher side in the height direction is adopted as the height of the bonding wire or bonding ribbon. .

本発明の検査方法は、前記同軸照明は、前記測定ワークに対してストロボ発光にて照明を照射し、前記撮像装置にて測定ワーク上の異なる箇所における二次元形状に関する測定データを連続的に取得することが好ましい。   In the inspection method of the present invention, the coaxial illumination irradiates the measurement workpiece with strobe light emission, and the imaging device continuously acquires measurement data relating to a two-dimensional shape at different locations on the measurement workpiece. It is preferable to do.

本発明の検査方法は、前記二次元形状に関する測定データのうち前記ボンディングワイヤ又はボンディングリボンの頂点座標に関する測定データから、前記ボンディングワイヤ又はボンディングリボンの高さを測定する箇所を決定し、前記決定された箇所を前記レーザ変位計の測定ポイントとするように、前記平面方向移動装置をジグザグ走行させることが好ましい。   The inspection method of the present invention determines a position where the height of the bonding wire or the bonding ribbon is measured from the measurement data related to the apex coordinates of the bonding wire or the bonding ribbon among the measurement data related to the two-dimensional shape, and is determined. It is preferable that the plane direction moving device is moved in a zigzag manner so that the measured position becomes the measurement point of the laser displacement meter.

本発明によれば、十分な測定精度と検査時間の短縮を両立させることができるとともに、ボンディングワイヤに加え、ボンディングリボンの高さを検査できる検査装置及び方法を提供できる。   ADVANTAGE OF THE INVENTION According to this invention, while being able to make sufficient measurement precision and shortening of test | inspection time compatible, the test | inspection apparatus and method which can test | inspect the height of a bonding ribbon in addition to a bonding wire can be provided.

以下では、図１〜図８を参照して、本発明に係る検査装置の実施の一形態である検査装置１について説明する。検査装置１は、ボンディングがなされた検査対象であるボンディングワイヤ又はボンディングリボンの形状（二次元形状及び高さ）を検査する装置である。本実施形態では、検査装置１は測定ワーク２の二次元形状及び高さを測定することによって測定ワーク２のボンディング状態の良否を検査する。   Below, with reference to FIGS. 1-8, the inspection apparatus 1 which is one Embodiment of the inspection apparatus which concerns on this invention is demonstrated. The inspection apparatus 1 is an apparatus that inspects the shape (two-dimensional shape and height) of a bonding wire or a bonding ribbon that is an inspection target that has been bonded. In this embodiment, the inspection apparatus 1 inspects the bonding state of the measurement workpiece 2 by measuring the two-dimensional shape and height of the measurement workpiece 2.

また、図２に示すように、以下の説明において、測定ワーク２は複数のボンディングワイヤ３・３・・・を基板４上に超音波等を用いてボンディングしたものとし、本実施形態の検査装置１は、ボンディングワイヤ３・３・・・の二次元形状及びワイヤ高さｈ・ｈ・・・を測定し、検査するものとする。
図２（ａ）に示すように、ボンディングワイヤ３は、基板４上の三箇所にボンディングされることにより形成されており、ボンド部３ａ・３ａ・３ａを両端部及び中央部に有する。ボンディングワイヤ３は、側面視において、隣り合うボンド部３ａ・３ａの中央部分が高くなる弓形状に形成されている。同じく図２（ｂ）に示すように、平面視におけるボンディングワイヤ３の形状は、両端部及び中央部に他部よりも幅広なボンド部３ａ・３ａ・３ａが形成される直線状である。 As shown in FIG. 2, in the following description, it is assumed that the measurement workpiece 2 is obtained by bonding a plurality of bonding wires 3... On the substrate 4 using ultrasonic waves or the like. 1 measures and inspects the two-dimensional shape of the bonding wires 3... And the wire heights h · h.
As shown in FIG. 2A, the bonding wire 3 is formed by bonding at three locations on the substrate 4, and has bond portions 3a, 3a, and 3a at both ends and a central portion. The bonding wire 3 is formed in a bow shape in which the central portion of the adjacent bond portions 3a and 3a is high when viewed from the side. Similarly, as shown in FIG. 2B, the shape of the bonding wire 3 in a plan view is a linear shape in which bond portions 3 a, 3 a, 3 a wider than the other portions are formed at both end portions and the central portion.

図１に示すように、検査装置１は、測定ワーク２を平面方向へ移動させるＸＹステージ１１、測定ワーク２に向けて照明を照射する同軸照明２１、照明電源２２、測定ワーク２の平面画像を撮像するＣＣＤカメラ２３、レンズ２４、測定ワーク２の高さを測定するレーザ変位計３１、ＣＣＤカメラ２３及びレーザ変位計３１を上下方向へ移動させるＺステージ１２、ＸＹステージ１１及びＺステージ１２を制御するステージ制御ドライバ１３、制御装置４１等を具備する。   As shown in FIG. 1, the inspection apparatus 1 displays a planar image of the XY stage 11 that moves the measurement workpiece 2 in the plane direction, the coaxial illumination 21 that illuminates the measurement workpiece 2, the illumination power supply 22, and the measurement workpiece 2. The CCD camera 23 to be imaged, the lens 24, the laser displacement meter 31 to measure the height of the measurement workpiece 2, the Z stage 12, the XY stage 11 and the Z stage 12 for moving the CCD camera 23 and the laser displacement meter 31 in the vertical direction are controlled. A stage control driver 13, a control device 41, and the like.

ＸＹステージ１１は、測定ワーク２の平面方向への移動手段である。測定ワーク２は、ＸＹステージ１１上に載置されることによって、平面方向（ＸＹ方向）へ移動される。ＸＹステージ１１は、ステージ制御ドライバ１３と接続され、そのステージ制御ドライバ１３から制御信号を受信し、駆動される。これにより、測定ワーク２のＣＣＤカメラ２３及びレーザ変位計３１に対するＸＹ方向の相対位置を調整可能である。   The XY stage 11 is a means for moving the measurement workpiece 2 in the plane direction. The measurement workpiece 2 is moved in the plane direction (XY direction) by being placed on the XY stage 11. The XY stage 11 is connected to the stage control driver 13, receives a control signal from the stage control driver 13, and is driven. Thereby, the relative position of the measurement workpiece 2 with respect to the CCD camera 23 and the laser displacement meter 31 in the XY directions can be adjusted.

同軸照明２１は、ＣＣＤカメラ２３と同軸上に設置されており、同軸照明２１から測定ワーク２に向けて直上方から照明を照射する。同軸照明２１は、電源である照明電源２２と接続されている。
照明電源２２は、同軸照明２１に電流を供給する。照明電源２２は、制御装置４１と接続されており、制御装置４１からトリガー信号を受け取ることによって、適宜のタイミングにて同軸照明２１に電流を供給する。つまり、照明電源２１のオンオフ動作は、制御装置４１によって制御されている。また、このときの照明電源２１からの電流供給量も制御装置４１によって制御されているため、同軸照明２１はストロボ発光可能に構成されている。 The coaxial illumination 21 is installed on the same axis as the CCD camera 23, and irradiates illumination from directly above the coaxial illumination 21 toward the measurement workpiece 2. The coaxial illumination 21 is connected to an illumination power source 22 that is a power source.
The illumination power supply 22 supplies current to the coaxial illumination 21. The illumination power supply 22 is connected to the control device 41 and supplies a current to the coaxial illumination 21 at an appropriate timing by receiving a trigger signal from the control device 41. That is, the on / off operation of the illumination power source 21 is controlled by the control device 41. In addition, since the current supply amount from the illumination power source 21 at this time is also controlled by the control device 41, the coaxial illumination 21 is configured to be able to emit strobe light.

ＣＣＤカメラ２３は、ＸＹステージ１１の上方に配置されている。ＣＣＤカメラ２３は、制御装置４１と接続されており、測定ワーク２を上方から撮像し、制御装置４１に測定ワーク２の平面画像データを送信する。そして、制御装置４１によって適宜のデータ処理を行うことによって、測定ワーク２の二次元形状（本実施形態では特に、ボンディングワイヤ３・３・・・の平面形状及びボンディングワイヤ３・３・・・の頂点座標）が検査される。
レンズ２４は、ＣＣＤカメラ２３に付設されている。レンズ２４は、例えば偏光レンズであり、ＣＣＤカメラ２３は、このレンズ２４を介して撮像することによって、同軸照明２１からの反射光以外のノイズをカットでき、所望の平面画像を撮像できる。
なお、ＣＣＤカメラ２３の撮像範囲は限定されているため、係る撮像範囲を超えた大きさの測定ワーク２を検査する場合は、ＸＹステージ１１を駆動させて複数回に分けて撮像することによって、測定ワーク２の二次元形状を検査する。 The CCD camera 23 is disposed above the XY stage 11. The CCD camera 23 is connected to the control device 41, images the measurement workpiece 2 from above, and transmits planar image data of the measurement workpiece 2 to the control device 41. Then, by performing appropriate data processing by the control device 41, the two-dimensional shape of the measurement workpiece 2 (particularly in the present embodiment, the planar shape of the bonding wires 3, 3. Vertex coordinates) are inspected.
The lens 24 is attached to the CCD camera 23. The lens 24 is a polarizing lens, for example, and the CCD camera 23 can cut noise other than the reflected light from the coaxial illumination 21 by taking an image through the lens 24 and can take a desired plane image.
In addition, since the imaging range of the CCD camera 23 is limited, when inspecting the measurement workpiece 2 having a size exceeding the imaging range, the XY stage 11 is driven to perform imaging in multiple times. The two-dimensional shape of the measurement workpiece 2 is inspected.

Ｚステージ１２は、ＣＣＤカメラ２３及びレーザ変位計３１の上下方向への移動手段である。ＣＣＤカメラ２３及びレーザ変位計３１は、Ｚステージ１２に支持されることによって、上下方向（Ｚ方向）へ移動可能である。Ｚステージ１２は、ステージ制御ドライバ１３と接続され、そのステージ制御ドライバ１３から制御信号を受信して駆動される。これにより、ＣＣＤカメラ２３及びレーザ変位計３１の測定ワーク２に対するＺ方向の相対位置を調整可能である。   The Z stage 12 is a means for moving the CCD camera 23 and the laser displacement meter 31 in the vertical direction. The CCD camera 23 and the laser displacement meter 31 are movable in the vertical direction (Z direction) by being supported by the Z stage 12. The Z stage 12 is connected to a stage control driver 13 and is driven by receiving a control signal from the stage control driver 13. Thereby, the relative position of the CCD camera 23 and the laser displacement meter 31 with respect to the measurement workpiece 2 in the Z direction can be adjusted.

ステージ制御ドライバ１３は、ＸＹステージ１１及びＺステージ１２を駆動するためのデバイスドライバである。ステージ制御ドライバ１３は、制御装置４１と接続されており、制御装置４１からの信号を受信してＸＹステージ１１及びＺステージ１２に制御信号を送信し、これらを駆動する。また、ステージ制御ドライバ１３から制御装置４１に、ＸＹステージ１１及びＺステージ１２の座標データ（つまり、ＣＣＤカメラ２３及びレーザ変位計３１と、測定ワーク２との位置関係）が常時送信されている。   The stage control driver 13 is a device driver for driving the XY stage 11 and the Z stage 12. The stage control driver 13 is connected to the control device 41, receives a signal from the control device 41, transmits a control signal to the XY stage 11 and the Z stage 12, and drives them. Further, the coordinate data of the XY stage 11 and the Z stage 12 (that is, the positional relationship between the CCD camera 23 and the laser displacement meter 31 and the measurement workpiece 2) is constantly transmitted from the stage control driver 13 to the control device 41.

制御装置４１は、ステージ制御ドライバ１３、照明電源２２、ＣＣＤカメラ２３、レーザ変位計３１と接続されており、それぞれに制御信号を送信することによってそれぞれの動作を制御するとともに、ＣＣＤカメラ２３から平面画像データを受信し、レーザ変位計３１から測定データを受信し、それぞれ受信データに基づいて所定の演算を行うことによって測定ワーク２の二次元形状及び高さを検査する装置である。
また、図３に示すように、制御装置４１は、ＣＣＤカメラ２３から得た平面画像データから、ボンディングワイヤ３上で最も輝度の高い点（輝点）Ｓをボンディングワイヤ３の頂点Ｔとして抽出し、係る頂点ＴのＸＹ座標データをステージ制御ドライバ１３に送信し、ＸＹステージ１１の移動経路を制御している。本実施形態では、頂点Ｔ・Ｔ・・・がレーザ変位計３１による測定ポイントとなるようにＸＹステージ１１の作動を制御している。 The control device 41 is connected to the stage control driver 13, the illumination power source 22, the CCD camera 23, and the laser displacement meter 31, and controls each operation by transmitting a control signal to each of the control device 41. The apparatus receives the image data, receives the measurement data from the laser displacement meter 31, and inspects the two-dimensional shape and height of the measurement workpiece 2 by performing predetermined calculations based on the received data.
Further, as shown in FIG. 3, the control device 41 extracts a point (bright spot) S having the highest luminance on the bonding wire 3 as a vertex T of the bonding wire 3 from the planar image data obtained from the CCD camera 23. The XY coordinate data of the vertex T is transmitted to the stage control driver 13, and the movement path of the XY stage 11 is controlled. In this embodiment, the operation of the XY stage 11 is controlled so that the apexes T · T... Serve as measurement points by the laser displacement meter 31.

レーザ変位計３１は、ＸＹステージ１１の上方に配置されており、Ｚステージ１２に支持されている。レーザ変位計３１は、制御装置４１と接続されており、測定ワーク２のワイヤ高さｈを上方から測定し、制御装置４１に測定ワーク２の高さに対する測定データを送信する。そして、制御装置４１によって適宜のデータ処理を行うことによって、測定ワーク２の高さが検査される。
より具体的には、図４に示すように、レーザ変位計３１は、レーザ投光部３２、レーザ受光部３３、解析部３４を具備し、レーザ投光部３２から測定ポイント（本実施形態では、頂点Ｔ・Ｔ・・・）に向けて投光されたレーザ光線の反射光をレーザ受光部３３にて受光し、受光した反射光に基づいて、解析部３４にて測定対象との距離を計測する計測装置である。また、レーザ投光部３２から投光されるレーザ光線は所定の幅を有し、レーザ受光部３３はそのレーザ光線の反射光を十分に受光できるＣＣＤ又はＣＭＯＳセンサを備える。 The laser displacement meter 31 is disposed above the XY stage 11 and is supported by the Z stage 12. The laser displacement meter 31 is connected to the control device 41, measures the wire height h of the measurement workpiece 2 from above, and transmits measurement data for the height of the measurement workpiece 2 to the control device 41. And the height of the measurement workpiece | work 2 is test | inspected by performing appropriate data processing by the control apparatus 41. FIG.
More specifically, as shown in FIG. 4, the laser displacement meter 31 includes a laser projector 32, a laser receiver 33, and an analyzer 34, and the measurement point (in this embodiment, from the laser projector 32). , The reflected light of the laser beam projected toward the apex T · T... Is received by the laser light receiving unit 33, and the distance from the measurement object is determined by the analysis unit 34 based on the received reflected light. A measuring device for measuring. Further, the laser beam projected from the laser projector 32 has a predetermined width, and the laser receiver 33 includes a CCD or CMOS sensor that can sufficiently receive the reflected light of the laser beam.

また、図４に示すように、レーザ変位計３１のレーザ投光部３２により投光されるレーザ光線のスポット幅３２ａは、ボンディングワイヤ３の線径（数十μｍ〜数百μｍ程度）より大きく、ボンディングワイヤ３からの反射光量よりも基板４の上面からの反射光量の方が大きい場合がある。さらに、ボンディングワイヤ３は、円形断面を有するため、ボンディングワイヤ３表面で多方向に反射し、レーザ受光部３３で受光する光が弱くなる場合がある。そのため、基板４の上面がワイヤ高さｈとして測定されてしまい、ボンディングワイヤ３のワイヤ高さｈを安定して測定することは困難であった。   As shown in FIG. 4, the spot width 32a of the laser beam projected by the laser projection unit 32 of the laser displacement meter 31 is larger than the diameter of the bonding wire 3 (several tens μm to several hundreds μm). In some cases, the amount of reflected light from the upper surface of the substrate 4 is greater than the amount of reflected light from the bonding wire 3. Furthermore, since the bonding wire 3 has a circular cross section, the light reflected by the bonding wire 3 surface in multiple directions and received by the laser light receiving unit 33 may be weakened. Therefore, the upper surface of the substrate 4 is measured as the wire height h, and it is difficult to stably measure the wire height h of the bonding wire 3.

そこで本実施形態では、図４に示すように、レーザ受光部３３にて受光する受光量に基づいて測定対象との距離を計測する解析部３４において、前記受光量に対して所定の閾値Ｔｈを設定し、レーザ受光部３３による受光のうち、受光量が前記閾値Ｔｈより大きいもの、かつ、高さ方向（Ｚ方向）の高い側のものを測定ワーク２の高さ（本実施形態では、ワイヤ高さｈ・ｈ・・・）として採用している。なお、この閾値Ｔｈは、円形断面を有する部材の反射光等の影響を考慮して、予め実験等にて決定されており、解析部３４に記憶されている。
このように計測された距離を制御装置４１に測定データとして送信し、制御装置４１によって測定ワーク２の高さ（つまり、ボンディングワイヤ３・３・・・のワイヤ高さｈ・ｈ・・・）が検査される。
なお、本実施形態では、レーザ変位計３１内の解析部３４において、所定の閾値Ｔｈを設定し、閾値Ｔｈより大きいものであってＺ方向の高い側を採用するものとして受光量の解析を行っているが、レーザ変位計３１から制御装置４１に生の計測データを送信し、制御装置４１内で同様の解析を行う構成としても良い。 Therefore, in the present embodiment, as shown in FIG. 4, in the analysis unit 34 that measures the distance from the measurement target based on the amount of light received by the laser light receiving unit 33, a predetermined threshold Th is set for the amount of received light. Of the light received by the laser light receiving unit 33, the light receiving amount that is larger than the threshold Th and the higher side in the height direction (Z direction) is the height of the measurement workpiece 2 (in this embodiment, the wire Adopted as height h · h ...). The threshold value Th is determined in advance through experiments or the like in consideration of the influence of reflected light or the like of a member having a circular cross section, and is stored in the analysis unit 34.
The distance thus measured is transmitted to the control device 41 as measurement data, and the height of the measurement workpiece 2 (that is, the wire height h · h... Of the bonding wires 3. Is inspected.
In the present embodiment, the analysis unit 34 in the laser displacement meter 31 sets a predetermined threshold Th, and analyzes the amount of received light as if it is larger than the threshold Th and adopts the higher side in the Z direction. However, a configuration may be adopted in which raw measurement data is transmitted from the laser displacement meter 31 to the control device 41 and the same analysis is performed in the control device 41.

そして、制御装置４１によって、以上のように測定された二次元形状及び高さ（ワイヤ高さｈ・ｈ・・・）と、予め設定された所定の二次元形状及び高さとを定量的に比較することによって測定ワーク２のボンディング状態の良否が検査される。   Then, the control device 41 quantitatively compares the two-dimensional shape and height (wire height h · h...) Measured as described above with a predetermined two-dimensional shape and height set in advance. By doing so, the bonding state of the measurement workpiece 2 is inspected.

以上のように構成される検査装置１によれば、レーザ変位計３１を用いてボンディングワイヤ３・３・・・のワイヤ高さｈ・ｈ・・・を確実かつ連続的に検査できるので、測定ワーク２の検査精度を向上できる。さらに、ボンディングワイヤ３の線径が細い場合でも、そのワイヤ高さｈを良好に測定できる。
また、従来のように平面画像を撮像してワイヤ高さを測定する場合は、画像ブレを防止するためにＸＹステージを移動させながら連続的に平面画像を撮り込むことは困難であった。しかしながら、検査装置１は、レーザ変位計３１を用いてワイヤ高さｈを測定する構成であることによって、ＸＹステージ１１を移動させながら連続的に測定することが可能となり、検査時間を短縮できる。
従って、検査装置１を用いて測定ワーク２の二次元形状及び高さを測定する際に、十分な検査精度と検査時間の短縮とを両立させることができる。 According to the inspection apparatus 1 configured as described above, the wire heights h, h,... Of the bonding wires 3, 3,. The inspection accuracy of the workpiece 2 can be improved. Furthermore, even when the wire diameter of the bonding wire 3 is thin, the wire height h can be measured well.
Further, when a flat image is taken and the wire height is measured as in the conventional case, it is difficult to continuously capture the flat image while moving the XY stage in order to prevent image blurring. However, since the inspection apparatus 1 is configured to measure the wire height h using the laser displacement meter 31, it is possible to continuously measure while moving the XY stage 11, and the inspection time can be shortened.
Therefore, when measuring the two-dimensional shape and height of the measurement workpiece 2 using the inspection apparatus 1, it is possible to achieve both sufficient inspection accuracy and a reduction in inspection time.

また、測定ワーク２にバラツキ（例えば、ボンディングワイヤ３の加工公差、基板４の製造公差等）が存在する場合でも、ＸＹステージ１１を駆動させ、測定ワーク２を各測定位置に向けてジグザグ走行させることによって、レーザ変位計３１を測定ワーク２の測定ポイント（頂点Ｔ・Ｔ・・・）に向けて連続的に走査させることができる（図５参照）。これにより、複数のボンディングワイヤ３・３・・・のワイヤ高さｈ・ｈ・・・を連続的に高精度に測定できるとともに、測定ワーク２全体の検査時間を短縮できる。
また、ＣＣＤカメラ２３は、同軸照明２１のストロボ発光を用いて測定ワーク２の平面画像を撮像するので、平面画像を取得するためにＸＹステージ１１を長時間停止させる必要がない。例えば、大型の測定ワーク２を検査する場合、又は加工交差を含む測定ワーク２を検査する場合等にも、ＸＹステージ１１を駆動させて、測定ワーク２を各測定位置に向けてジグザグ走行させることによって、ＣＣＤカメラ２３を連続的に走査させつつ平面画像を得ることができる。これにより、測定ワーク２の大きさに左右されずに短時間の検査を維持できる。 Further, even when the measurement workpiece 2 has a variation (for example, a processing tolerance of the bonding wire 3, a manufacturing tolerance of the substrate 4, etc.), the XY stage 11 is driven to make the measurement workpiece 2 travel zigzag toward each measurement position. Thus, the laser displacement meter 31 can be continuously scanned toward the measurement point (vertex T · T...) Of the measurement workpiece 2 (see FIG. 5). As a result, the wire heights h, h,... Of the plurality of bonding wires 3, 3... Can be continuously measured with high accuracy, and the inspection time of the entire measuring workpiece 2 can be shortened.
Further, since the CCD camera 23 captures a planar image of the measurement workpiece 2 using the strobe emission of the coaxial illumination 21, it is not necessary to stop the XY stage 11 for a long time in order to acquire the planar image. For example, when inspecting a large measurement workpiece 2 or inspecting a measurement workpiece 2 including a machining intersection, the XY stage 11 is driven and the measurement workpiece 2 is zigzag-running toward each measurement position. Thus, a planar image can be obtained while the CCD camera 23 is continuously scanned. Thereby, a short-time inspection can be maintained regardless of the size of the measurement workpiece 2.

また、検査装置１を用いて、図６に示すような、ボンディングリボン５の二次元形状及びリボン高さを検査することもできる。
ボンディングリボン５は、幅広（例えば、幅数ｍｍであり、本実施形態では一般的なレーザ変位計の投光スポット幅と同等又はそれより大きいものとする。）、かつ、断面視矩形状を有する導体であり、ボンディングワイヤ３と同様に基板４上にボンディングされている。また、ボンディングリボン５は側面視において、端部から中央部にかけて高くなる弓形状に形成されている。 Moreover, the two-dimensional shape and ribbon height of the bonding ribbon 5 as shown in FIG. 6 can also be inspected using the inspection apparatus 1.
The bonding ribbon 5 has a wide width (for example, a width of several mm, which is equal to or larger than a light projecting spot width of a general laser displacement meter in the present embodiment), and has a rectangular shape in sectional view. It is a conductor and is bonded onto the substrate 4 in the same manner as the bonding wire 3. The bonding ribbon 5 is formed in a bow shape that increases from the end to the center in a side view.

図７に示すように、検査装置１を用いてボンディングリボン５を検査する場合、レーザ変位計３１のレーザ投光部３２のスポット幅３２ａは、ボンディングリボン５よりも小さい。このため、ボンディングリボン５から反射してレーザ受光部３３に受光される受光量は十分に大きくなる。これにより、レーザ変位計３１内の解析において、ボンディングワイヤ３を検査する場合と同じように、前記受光量に対して所定の閾値Ｔｈを設定し、レーザ受光部３３による受光のうち、受光量が前記閾値Ｔｈよりも大きいもの、かつ、Ｚ方向に高い側のものを採用する構成とすることによって、ボンディングリボン５からの反射光に基づいて適正にボンディングリボン５のリボン高さｈを測定することができる。   As shown in FIG. 7, when the bonding ribbon 5 is inspected using the inspection apparatus 1, the spot width 32 a of the laser projector 32 of the laser displacement meter 31 is smaller than the bonding ribbon 5. For this reason, the amount of received light reflected from the bonding ribbon 5 and received by the laser receiving unit 33 is sufficiently large. As a result, in the analysis in the laser displacement meter 31, a predetermined threshold value Th is set for the received light amount in the same manner as when the bonding wire 3 is inspected. The ribbon height h of the bonding ribbon 5 is appropriately measured based on the reflected light from the bonding ribbon 5 by adopting a configuration that employs a value that is larger than the threshold Th and that is higher in the Z direction. Can do.

以上のように、検査装置１を用いれば、図８に示すように、測定ワーク２にボンディングワイヤ３とボンディングリボン５とが混在している場合においても、高精度、かつ、短時間の検査が可能となる。   As described above, when the inspection apparatus 1 is used, even when the bonding wire 3 and the bonding ribbon 5 are mixed in the measurement workpiece 2 as shown in FIG. It becomes possible.

以下では、図９を参照して、検査装置１を用いた測定ワーク２の検査工程について説明する。なお、以下の説明において、測定ワーク２は基板４上に複数のボンディングワイヤ３・３・・・がボンディングされてなるものとし、検査装置１のＣＣＤカメラ２３及びレーザ変位計３１が測定ワーク２に対してキャリブレーションされた後の状態を初期状態として説明する。   Below, with reference to FIG. 9, the test | inspection process of the measurement workpiece | work 2 using the test | inspection apparatus 1 is demonstrated. In the following description, it is assumed that the measurement workpiece 2 is formed by bonding a plurality of bonding wires 3, 3... On the substrate 4, and the CCD camera 23 and the laser displacement meter 31 of the inspection apparatus 1 are attached to the measurement workpiece 2. The state after being calibrated will be described as an initial state.

まず、測定ワーク２をＸＹステージ１１上に載置し（Ｓ０１）、同軸照明２１を測定ワーク２に向けてストロボ発光にて照射し（Ｓ０２）、ＣＣＤカメラ２３により測定ワーク２の平面画像を撮像し、取得された平面画像データを制御装置４１に送信し、制御装置４１によって、測定ワーク２の二次元形状が抽出される（Ｓ０３）。
つまり、この工程において、ボンディングワイヤ３・３・・・の平面形状、及びボンディングワイヤ３・３・・・上の最も輝度の高い輝点Ｓ・Ｓ・・・が抽出される。この輝点Ｓは、それぞれのボンディングワイヤ３の頂点Ｔとして制御装置４１に記憶されるとともに、その頂点ＴのＸＹ座標データがステージ制御ドライバ１３に送信される。同時に、ステージ制御ドライバ１３は、ＸＹステージ１１の移動経路を決定する。 First, the measurement workpiece 2 is placed on the XY stage 11 (S01), the coaxial illumination 21 is irradiated with strobe light toward the measurement workpiece 2 (S02), and a planar image of the measurement workpiece 2 is captured by the CCD camera 23. Then, the acquired plane image data is transmitted to the control device 41, and the control device 41 extracts the two-dimensional shape of the measurement workpiece 2 (S03).
In other words, in this step, the planar shape of the bonding wires 3... And the brightest spots S, S... On the bonding wires 3. The bright spot S is stored in the control device 41 as the vertex T of each bonding wire 3, and the XY coordinate data of the vertex T is transmitted to the stage control driver 13. At the same time, the stage control driver 13 determines the movement path of the XY stage 11.

次に、ＸＹステージ１１を作動して、高さ測定の初期位置へ測定ワーク２を移動する（Ｓ０４）。この測定初期位置は、前工程において抽出されたボンディングワイヤ３・３・・・のうち、例えば最端部に位置するボンディングワイヤ３の頂点Ｔをレーザ変位計３１の測定ポイントとする位置である。   Next, the XY stage 11 is operated to move the measurement work 2 to the initial position for height measurement (S04). This initial measurement position is a position where, for example, the apex T of the bonding wire 3 located at the end of the bonding wires 3... Extracted in the previous process is the measurement point of the laser displacement meter 31.

続いて、レーザ変位計３１によって、頂点Ｔまでの距離を測定し、取得された測定データを上述のように解析した後、制御装置４１に送信し、制御装置４１によって、測定ワーク２の高さが検査される（Ｓ０５）。
つまり、この工程において、制御装置４１内に記憶された頂点Ｔ・Ｔ・・・のＸＹ座標に対応する各測定ポイントでのボンディングワイヤ３のワイヤ高さｈが測定される。 Subsequently, the distance to the apex T is measured by the laser displacement meter 31, and the obtained measurement data is analyzed as described above, and then transmitted to the control device 41. The height of the measurement workpiece 2 is measured by the control device 41. Are inspected (S05).
That is, in this step, the wire height h of the bonding wire 3 at each measurement point corresponding to the XY coordinates of the vertices T · T... Stored in the control device 41 is measured.

そして、初期位置でのワイヤ高さｈの測定が終了した後、その測定が最後の測定位置（例えば初期位置と反対側の端部に位置する頂点Ｔ）の測定であったか否かの判断がなされ（Ｓ０６）、最後の測定位置であると判断されれば（Ｓ０６：ＹＥＳ）検査工程を終了する。他方、最後の測定位置でないと判断されれば（Ｓ０６：ＮＯ）、ＸＹステージ１１を作動して、測定ワーク２を次の測定位置へ移動し（Ｓ０７）、その測定位置にて測定ワーク２の高さを検査する（Ｓ０５）。   Then, after the measurement of the wire height h at the initial position is completed, it is determined whether or not the measurement is the measurement of the last measurement position (for example, the apex T located at the end opposite to the initial position). If it is determined that it is the last measurement position (S06) (S06: YES), the inspection process is terminated. On the other hand, if it is determined that the measurement position is not the last measurement position (S06: NO), the XY stage 11 is operated to move the measurement workpiece 2 to the next measurement position (S07). The height is inspected (S05).

以上の検査工程により、レーザ変位計３１を用いてボンディングワイヤ３・３・・・のワイヤ高さｈ・ｈ・・・を確実かつ連続的に検査できるので、測定ワーク２の検査精度を向上できるとともに、検査時間を短縮できる。
また、ＣＣＤカメラ２３は、同軸照明２１のストロボ発光を用いて測定ワーク２の平面画像を撮像するので、平面画像を取得するためにＸＹステージ１１を長時間停止させる必要がない。例えば、大型の測定ワーク２を検査する場合、又は加工交差を含む測定ワーク２を検査する場合等にも、ＸＹステージ１１を駆動させて、測定ワーク２を各測定位置に向けてジグザグ走行させることによって、ＣＣＤカメラ２３を連続的に走査させつつ平面画像を得ることができる。これにより、測定ワーク２の大きさに左右されずに短時間の検査を維持できる。
また、測定ワーク２にバラツキ（例えば、ボンディングワイヤ３の加工公差、基板４の製造公差等）が存在する場合でも、ＸＹステージ１１を駆動させ、測定ワーク２を各測定位置に向けてジグザグ走行させることによって、レーザ変位計３１を測定ワーク２の測定ポイント（頂点Ｔ・Ｔ・・・）に向けて連続的に走査させることができる。これにより、複数のボンディングワイヤ３・３・・・のワイヤ高さｈ・ｈ・・・を連続的に高精度に測定できるとともに、測定ワーク２全体の検査時間を短縮できる。 Through the above inspection process, the wire heights h, h,... Of the bonding wires 3, 3,... Can be reliably and continuously inspected using the laser displacement meter 31, so that the inspection accuracy of the measurement workpiece 2 can be improved. At the same time, the inspection time can be shortened.
Further, since the CCD camera 23 captures a planar image of the measurement workpiece 2 using the strobe emission of the coaxial illumination 21, it is not necessary to stop the XY stage 11 for a long time in order to acquire the planar image. For example, when inspecting a large measurement workpiece 2 or inspecting a measurement workpiece 2 including a machining intersection, the XY stage 11 is driven and the measurement workpiece 2 is zigzag-running toward each measurement position. Thus, a planar image can be obtained while the CCD camera 23 is continuously scanned. Thereby, a short-time inspection can be maintained regardless of the size of the measurement workpiece 2.
Further, even when the measurement workpiece 2 has a variation (for example, a processing tolerance of the bonding wire 3, a manufacturing tolerance of the substrate 4, etc.), the XY stage 11 is driven to make the measurement workpiece 2 travel zigzag toward each measurement position. Thus, the laser displacement meter 31 can be continuously scanned toward the measurement point (vertex T · T...) Of the measurement workpiece 2. As a result, the wire heights h, h,... Of the plurality of bonding wires 3, 3... Can be continuously measured with high accuracy, and the inspection time of the entire measuring workpiece 2 can be shortened.

本発明のボンディングワイヤ・リボン検査装置を示す図である。It is a figure which shows the bonding wire ribbon inspection apparatus of this invention. 測定ワーク（ボンディングワイヤ）を示す図である。It is a figure which shows a measurement workpiece | work (bonding wire). 撮像装置によって撮像された平面画像を示す図である。It is a figure which shows the planar image imaged with the imaging device. レーザ変位計の構成を示す図である。It is a figure which shows the structure of a laser displacement meter. レーザ変位計の走査経路を示す図である。It is a figure which shows the scanning path | route of a laser displacement meter. 測定ワーク（ボンディングリボン）を示す図である。It is a figure which shows a measurement workpiece | work (bonding ribbon). レーザ変位計によって測定ワーク（ボンディングリボン）を測定する時の様子を示す図である。It is a figure which shows a mode at the time of measuring a measurement workpiece | work (bonding ribbon) with a laser displacement meter. 検査装置によって検査される測定ワークを示す平面図である。It is a top view which shows the measurement workpiece test | inspected by the test | inspection apparatus. 検査装置による検査工程を示すフロー図である。It is a flowchart which shows the inspection process by an inspection apparatus.

１ 検査装置
２ 測定ワーク
３ ボンディングワイヤ
５ ボンディングリボン
１１ ＸＹステージ
２１ 同軸照明
２３ ＣＣＤカメラ（撮像装置）
３１ レーザ変位計
４１ 制御装置
ｈ ワイヤ高さ、リボン高さ（測定ワークの高さ）
Ｔｈ 閾値
DESCRIPTION OF SYMBOLS 1 Inspection apparatus 2 Measurement workpiece 3 Bonding wire 5 Bonding ribbon 11 XY stage 21 Coaxial illumination 23 CCD camera (imaging device)
31 Laser displacement meter 41 Controller h Wire height, Ribbon height (height of measurement workpiece)
Th threshold

Claims (5)

基板上にボンディングワイヤ又はボンディングリボンがボンディングされてなる測定ワークにおける前記ボンディングワイヤ又はボンディングリボンの二次元形状及び高さを測定することによって、前記測定ワークを検査する検査装置であって、
前記測定ワークの上方に配置される、二次元形状測定用の撮像装置と、
前記撮像装置と同軸上に設置される同軸照明と、
前記測定ワークの上方に配置される、前記ボンディングワイヤ又はボンディングリボンの高さ測定用のレーザ変位計と、
前記撮像装置及びレーザ変位計と、前記測定ワークとを平面方向に相対的に移動させる平面方向移動装置と、を具備し、
前記レーザ変位計において受光する受光量に対して所定の閾値を設定するとともに、前記受光量のうち、前記閾値より大きく、かつ、高さ方向に高い側で測定される受光量に基づいた値を前記ボンディングワイヤ又はボンディングリボンの高さとして採用することを特徴とする検査装置。 An inspection apparatus for inspecting the measurement workpiece by measuring a two-dimensional shape and height of the bonding wire or the bonding ribbon in a measurement workpiece formed by bonding a bonding wire or a bonding ribbon on a substrate,
An imaging device for measuring a two-dimensional shape, disposed above the measurement workpiece;
Coaxial illumination installed coaxially with the imaging device;
A laser displacement meter for measuring the height of the bonding wire or bonding ribbon, which is disposed above the measurement workpiece;
A plane-direction moving device that relatively moves the imaging device, the laser displacement meter, and the measurement workpiece in a plane direction;
A predetermined threshold is set for the amount of received light received by the laser displacement meter, and a value based on the amount of received light that is larger than the threshold and measured on the higher side in the height direction out of the amount of received light. An inspection apparatus which is employed as a height of the bonding wire or bonding ribbon. 前記同軸照明は、前記測定ワークに対してストロボ発光にて照明を照射することを特徴とする請求項１に記載の検査装置。   The inspection apparatus according to claim 1, wherein the coaxial illumination irradiates the measurement workpiece with strobe light emission. 基板上にボンディングワイヤ又はボンディングリボンがボンディングされてなる測定ワークにおける前記ボンディングワイヤ又はボンディングリボンの二次元形状及び高さを検査する検査方法であって、
前記測定ワークを平面方向移動装置上に載置し、
前記測定ワークの上方に位置する撮像装置の同軸照明にて該測定ワークを照射し、
前記撮像装置にて前記ボンディングワイヤ又はボンディングリボンの平面形状及び頂点座標を含む二次元形状に関する測定データを取得し、
前記測定ワークの上方に位置するレーザ変位計にて、前記撮像装置にて取得された測定データに基づいて、前記ボンディングワイヤ又はボンディングリボンの高さを測定する際に、前記レーザ変位計において受光する受光量に対して所定の閾値を設定するとともに、前記受光量のうち、前記閾値より大きく、かつ、高さ方向に高い側で測定される受光量に基づいた値を前記ボンディングワイヤ又はボンディングリボンの高さとして採用することを特徴とする検査方法。 An inspection method for inspecting the two-dimensional shape and height of the bonding wire or bonding ribbon in a measurement workpiece formed by bonding a bonding wire or bonding ribbon on a substrate,
Place the measurement work on a plane direction moving device,
Irradiate the measurement workpiece with coaxial illumination of an imaging device located above the measurement workpiece;
Acquire measurement data on a two-dimensional shape including the planar shape and vertex coordinates of the bonding wire or bonding ribbon in the imaging device;
When measuring the height of the bonding wire or the bonding ribbon based on the measurement data acquired by the imaging device with the laser displacement meter located above the measurement workpiece, the laser displacement meter receives light. A predetermined threshold is set for the amount of received light, and a value based on the amount of received light that is larger than the threshold and measured on the higher side in the height direction is selected from the amount of received light of the bonding wire or the bonding ribbon. Inspection method characterized by adopting as height. 前記同軸照明は、前記測定ワークに対してストロボ発光にて照明を照射し、
前記撮像装置にて測定ワーク上の異なる箇所における二次元形状に関する測定データを連続的に取得することを特徴とする請求項３に記載の検査方法。 The coaxial illumination illuminates the measurement workpiece with strobe light emission,
The inspection method according to claim 3, wherein measurement data relating to a two-dimensional shape at different locations on a measurement workpiece is continuously acquired by the imaging device. 前記二次元形状に関する測定データのうち前記ボンディングワイヤ又はボンディングリボンの頂点座標に関する測定データから、前記ボンディングワイヤ又はボンディングリボンの高さを測定する箇所を決定し、
前記決定された箇所を前記レーザ変位計の測定ポイントとするように、前記平面方向移動装置をジグザグ走行させることを特徴とする請求項３又は請求項４に記載の検査方法。 From the measurement data relating to the apex coordinates of the bonding wire or bonding ribbon among the measurement data relating to the two-dimensional shape, the location for measuring the height of the bonding wire or bonding ribbon is determined,
5. The inspection method according to claim 3, wherein the planar movement device is caused to travel in a zigzag manner so that the determined location is a measurement point of the laser displacement meter.
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