JP6702343B2 - Shape measuring device, structure manufacturing system, and shape measuring method - Google Patents

Description

The present invention relates to a shape measuring device, a structure manufacturing system, and a shape measuring method.

As a method of measuring a three-dimensional shape of a measurement object in a non-contact manner, a light section method is known (for example, refer to Patent Document 1). In the light cutting method, line light is applied to a measurement target in a predetermined direction, and a light cutting line that is an image of the line light is formed on the surface of the measurement target. At this time, the beam waist of the line light (the portion having the smallest thickness) is applied to the surface of the measurement target. The beam waist of this line light is called the measurement range. The light cutting line is formed in a shape along the surface of the measurement target.

On the other hand, the light cutting line is imaged from a direction different from the line light irradiation direction. Then, by imaging the light cutting line while scanning the light cutting line in a predetermined direction along the surface of the measurement target, image data along the shape of the surface of the measurement target is obtained. From this image data, the three-dimensional shape of the measurement object can be calculated. In such a light cutting method, a sensor unit having a light irradiation unit that irradiates a measurement target with line light to form a light cutting line on the surface of the measurement target and an imaging unit that images the light cutting line is used. ..

U.S. Pat. No. 6,542,249

However, in the conventional configuration, it is necessary to place the measurement target in the measurement range of the line light emitted from the light source of the light emitting unit. Therefore, if the optical cutting line is imaged by a single image pickup unit as in the conventional case, it is necessary to have a large image pickup surface when the measurement range is wide, and there is a problem that it is difficult to downsize the image pickup unit. Further, when the measurement target exceeds the measurement range, clear line light is not formed on the measurement target. The distance from the light source to the measurement range is called the optical working distance.In the conventional configuration, this optical working distance is constant, so the detection accuracy is reduced for the measurement target that has a large change in the irradiation direction of the line light. There is a problem such as doing.

In view of the above circumstances, it is an object of the present invention to provide a shape measuring device, a structure manufacturing system, and a shape measuring method capable of accurately measuring a three-dimensional shape.

According to an aspect of the present invention, there is provided a shape measuring device for measuring a shape of a surface of an object to be inspected, the first line light having a first beam waist is projected on the surface of the object to be inspected along a projection direction. a first measuring optical system you projection Te, the surface of the test object, the second line light having a second beam waist, that to project through the same optical axis as the first line of light along a projection direction A second measurement optical system, an imaging unit that captures an image of the line light projected by the first measurement optical system and the second measurement optical system, and a surface shape of the test object based on the image captured by the imaging unit. The first beam waist and the second beam waist have different positions on the optical axis, and an image of the first line light from the first measurement optical system is displayed in the imaging unit. Provided is a shape measuring device in which an area to be imaged is different from an area to be imaged of the second line light from the second measurement optical system. According to an aspect of the present invention, there is provided a shape measuring device for measuring a shape of a surface of an object to be inspected, the first measuring optical system projecting line light onto the surface of the object to be inspected along a projection direction. , Projecting the line light on the surface of the object to be measured in a region different from the first measurement optical system in the projection direction by the second measurement optical system and the first measurement optical system and the second measurement optical system. There is provided a shape measuring device including an image pickup unit that picks up an image of line light that is generated, and a control unit that calculates the shape of the surface of an object based on the image picked up by the image pickup unit.

According to an aspect of the present invention, a design apparatus for producing design information regarding the shape of a structure, a molding apparatus for producing a structure based on the design information, and an aspect of the present invention for measuring the shape of the produced structure There is provided a structure manufacturing system including the shape measuring device according to 1. and an inspection device for comparing shape information and design information regarding the shape of the structure obtained by the shape measuring device.

According to an aspect of the present invention, there is provided a method for measuring the shape of a surface of an object to be inspected, which comprises projecting first line light from a first measurement optical system onto the surface of the object to be inspected along a projection direction. And projecting the second line light from the second measurement optical system on the surface of the object to be inspected along the projection direction through the same optical axis as the first line light, and the first measurement optical system and the first measurement optical system. (2) capturing an image of the line light projected by the measurement optical system, and calculating the shape of the surface of the test object based on the captured image . And the second beam waist of the second line light have different positions on the optical axis, and when capturing the image of the line light, the image of the first line light from the first measurement optical system is captured. There is provided a method for measuring the shape of the surface of a test object, in which the area to be measured is different from the area where the image of the second line light from the second measurement optical system is captured. According to an aspect of the present invention, there is provided a method for measuring the shape of the surface of a test object, which comprises projecting line light from the first measurement optical system along the projection direction onto the surface of the test object, Projecting the line light from the second measurement optical system on a surface of the object to be measured in a region different from that of the first measurement optical system along the projection direction, and the first measurement optical system and the second measurement. Measuring the shape of the surface of the test object, including capturing an image of the line light projected by the optical system and calculating the shape of the surface of the test object based on the captured image. A method is provided.

According to the first aspect of the present invention, there is provided a sensor unit for measuring the shape of the surface of a test object, the projection optical system projecting line light onto the surface of the test object, and the projected line light. Image pickup unit for picking up the image of the line, a second image pickup unit for picking up the image of the projected line light, and a dividing unit for dividing the light reflected by the object into the first image pickup unit and the second image pickup unit. And a sensor unit that is different in the conjugate surface from the imaging surfaces of the first and second imaging units and that captures an image of the line light on the conjugate surface.

According to the second aspect of the present invention, there is provided a sensor unit for measuring the shape of the surface of a test object, the projection optical system projecting line light on the surface of the test object in the first direction. There is provided a sensor unit that includes an imaging unit that captures an image of the line light of the line light, and a changing unit that changes the line light between the first measurement range and the second measurement range in the first direction.

According to a third aspect of the present invention, it has a sensor unit according to the first aspect of the present invention and a scanning system for relatively moving the sensor unit and a measurement object, and image information from the sensor unit and the scanning system. There is provided a shape measuring device including: a calculation unit that calculates the shape of the measurement target based on the scanning information of 1.

According to a fourth aspect of the present invention, a designing device for producing design information regarding the shape of a structure, a molding device for producing a structure based on the design information, and a present invention for measuring the shape of the produced structure There is provided a structure manufacturing system including the shape measuring device according to the third aspect of the present invention, and an inspection device for comparing shape information and design information regarding the shape of the structure obtained by the shape measuring device.

According to the aspects of the present invention, it is possible to accurately measure a three-dimensional shape.

It is a figure which shows an example of the sensor unit which concerns on 1st Embodiment. It is a figure which shows an example of operation|movement of a sensor unit. It is a figure which shows another example of a sensor unit. It is a figure which shows an example of the sensor unit which concerns on a 1st modification. It is a figure which shows an example of the sensor unit which concerns on 2nd Embodiment. It is a figure which shows an example of the sensor unit which concerns on a 3rd modification. It is a figure which shows an example of the sensor unit which concerns on a 4th modification. It is a figure which shows an example of the sensor unit which concerns on a 5th modification. It is a figure showing an example of an embodiment of a shape measuring device. It is a flow chart explaining an example of a shape measuring method. It is a block diagram showing an example of an embodiment of a structure manufacturing system. It is a flow chart which shows an example of an embodiment of a structure manufacturing method.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to this. Further, in the drawings, in order to explain the embodiment, a part of the drawing is enlarged or emphasized, and the scale is appropriately changed. In the following description, an XYZ rectangular coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ rectangular coordinate system. The Z-axis direction is set to, for example, the vertical direction, and the X-axis direction and the Y-axis direction are set to, for example, directions parallel to the horizontal direction and orthogonal to each other. Further, rotation (tilt) directions around the X axis, the Y axis, and the Z axis are defined as θX, θY, and θZ directions, respectively.

<First Embodiment>
FIG. 1 is a diagram showing an example of a sensor unit according to the first embodiment. The sensor unit 100 obtains the three-dimensional shape of the measurement target (inspection object) M by the light section method. In this case, the sensor unit 100 is a device that irradiates the line light L to form a light cutting line on the measurement target M, images the light cutting line, and acquires image data. The three-dimensional shape of the measurement target M can be calculated by separately performing a predetermined calculation using the image data obtained by the sensor unit 100.

As shown in FIG. 1, the sensor unit 100 includes a light irradiation unit 10, an image pickup optical system 20, a first image pickup unit 30, a second image pickup unit 40, and a control unit CONT. The light irradiation unit 10, the image pickup optical system 20, the first image pickup unit 30, and the second image pickup unit 40 are fixedly arranged in a casing or the like (not shown) so that their positional relationships do not change.

The light irradiation unit 10 is arranged at a position away from the measurement target M in the first direction D1 (for example, the Z direction). The light irradiation unit 10 is an example of a projection optical system that projects the line light L onto the surface of the measurement target M. The measuring object M is placed on the placing surface F which is a flat plane. The measurement target M may be fixed to the mounting surface F via a jig or the like. The mounting surface F is set to be a surface parallel to the XY plane. The first direction D1 is a direction intersecting with the mounting surface F. The light irradiation unit 10 irradiates the measuring object M with the line light L. The line light L is a line-like light along a second direction D2 (for example, the X direction) on the measurement target M that intersects the first direction D1. A first measurement range L1 and a second measurement range L2, which will be described later, are set for the line light L in the first direction D1.

The line light L with which the measurement target M is irradiated forms an optical cutting line (line-shaped pattern) PCL on the surface of the measurement target M. The light cutting line PCL is a projection image of the line light L formed on the surface of the measurement target M. The light cutting line PCL is formed according to the uneven shape of the surface of the measurement target M. Therefore, when there is a step in the first direction D1, the optical cutting line PCL is formed corresponding to the step.

The imaging optical system 20 captures an image of the light section line PCL formed on the measurement target M. The imaging optical system 20 has an optical axis AX. The axial direction of the optical axis AX (optical axis direction) is different from the first direction D1. The imaging optical system 20 is not limited to the use of a single optical element, and is configured by combining a plurality of refractive or reflective optical elements. Further, some or all of these optical elements may be formed so as to be movable in the optical axis AX or in a direction orthogonal to the optical axis AX.

The first imaging unit 30 and the second imaging unit 40 respectively image the optical cutting line PCL of the line light L via the imaging optical system 20. The first image capturing section 30 captures an image of the light cutting line PCL formed in the first measurement range L1 of the line light L. The second image capturing section 40 captures an image of the light cutting line PCL formed in the second measurement range L2 of the line light L. The first image capturing section 30 and the second image capturing section 40 are different from each other in their conjugate planes, and the image of the line light L is captured on the conjugate planes. The light reflected by the measurement target M is split into the first image capturing unit 30 and the second image capturing unit 40. As shown in FIG. 1, the first measurement range L1 and the second measurement range L2 are set in a state of being connected in the first direction D1. The first image capturing unit 30 and the second image capturing unit 40 are not limited to be arranged separately as illustrated in FIG. 1, and may be arranged in contact with each other.

The first imaging unit 30 and the second imaging unit 40 include solid-state imaging devices such as a CCD (Charge Coupled Device) sensor and a CMOS (Complementary Metal Oxide Semiconductor) sensor. The optical cutting line PCL imaged by the first imaging unit 30 and the second imaging unit 40 is acquired as image data of the line light L, converted into an electric signal, and transmitted to the control unit CONT. The first imaging unit 30 and the second imaging unit 40 are controlled by the control unit CONT. Further, although the first image pickup unit 30 and the second image pickup unit 40 use the same type of solid-state image pickup device, different types of solid-state image pickup devices may be used instead. Further, as the first image capturing unit 30 and the second image capturing unit 40, those having the light receiving surfaces of the same size may be used, or those having the light receiving surfaces of different sizes may be used.

The control unit CONT comprehensively controls the operations of the light irradiation unit 10, the first imaging unit 30, and the second imaging unit 40. The control unit CONT includes, for example, a CPU (Central Processing Unit) and a memory. The control unit CONT receives the image pickup data transmitted from the first image pickup unit 30 and the second image pickup unit 40, and stores the image pickup data in a memory or the like. In addition, the control unit CONT may include a calculation unit that calculates a three-dimensional shape based on the stored imaging data such as a memory. Further, the control unit CONT may include a transmission/reception unit for transmitting the imaging data to another external device.

In such a sensor unit 100, the line light L is supplied to the third direction D3 (for example, the Y direction) without changing the positional relationship between the light irradiation unit 10, the imaging optical system 20, the first imaging unit 30, and the second imaging unit 40. ) Can be scanned. The third direction D3 is a direction that intersects the second direction D2 of the line light L. The structure for scanning the line light L may be a structure in which the sensor unit 100 or the measurement target M is translated in the Y direction by a driving unit (not shown), or the sensor unit 100 is θX by a rotation driving unit (not shown). It may be configured to rotate in the direction.

By scanning the line light L in the third direction D3, the light cutting line PCL moves on the surface of the measurement target M in the Y direction. The optical cutting line PCL that moves in the Y direction is imaged by the first imaging unit 30 and the second imaging unit 40 as a moving image at a predetermined time interval or as a continuous moving image, so that the optical cutting line PCL of the measurement target M moves. Image data on the route is obtained. Movement of the optical cutting line PCL in the Y direction is transmitted to the control unit CONT for example as a scanning information in the Y direction of the sensor unit 10 0. The scanning information, and position data for each predetermined time of the sensor unit 10 0 or measured M (mounting surface F), the angle data, and the like around θX per sensor unit 10 0 of time is used.

FIG. 2 is a diagram schematically showing how a light cutting line is formed on a measurement target M0 having a step and an image of this light cutting line is acquired. As shown in FIG. 2A, a first surface M1 and a second surface M2 are formed on the +Z side of the measurement target M0. A step M3 is formed between the first surface M1 and the second surface M2. The step M3 is formed so as to straddle the first measurement range L1 and the second measurement range L2 of the line light L.

The light irradiation unit 10 includes a probe 11, a light source 12, and an illumination optical system 13. The probe 11 is formed, for example, in a cylindrical shape, and houses the light source 12 and the illumination optical system 13 inside. The light source 12 has a laser diode that emits laser light having a single wavelength or a plurality of wavelengths, for example. The light source 12 emits laser light in the −Z direction. The illumination optical system 13 shapes the laser light from the light source 12 into the line light L and emits it in the −Z direction. The line light L is formed along a plane S1 parallel to the XZ plane.

The line light L emitted from the illumination optical system 13 has a thickness t (dimension in the Y direction) gradually reduced in the −Z direction. A portion (beam waist) of the line light L having the smallest thickness is used as a measurement range. In the present embodiment, the first measurement range L1 and the second measurement range L2 are set in this beam waist. A beam waist is formed in a certain range of the line light L in the Z direction, and the first measurement range L1 is set to a range on the −Z side half of the beam waist. The second measurement range L2 is set in the +Z side half range of the beam waist. Therefore, the first measurement range L1 and the second measurement range L2 are set as different measurement ranges in the first direction D1. The first measurement range L1 and the second measurement range L2 may be continuous or separated from each other. As shown in FIG. 2A, in the first measurement range L1, the light cutting line PCL1 of the line light L is formed on the plane S1 including the first direction D1. Further, the first measurement range L1 and the second measurement range L2 may be set so as to partially overlap each other. When the line light L is detected in the area where the first measurement range L1 and the second measurement range L2 overlap, either one of the results can be used. Further, when the line light L is detected in the area where the first measurement range L1 and the second measurement range L2 overlap, both results can be used. In this case, an averaged result may be used from both results. The first measurement range L1 and the second measurement range L2 may be different from each other in the range parallel to the Z direction.

The imaging optical system 20 has one or a plurality of lenses as described above. In FIG. 2, the lens is shown as a single lens in order to make it easy to distinguish the figure. The imaging optical system 20 has a main surface S2. When the imaging optical system 20 has a plurality of lenses, the main surface S2 corresponds to the main surface when the plurality of lenses are one lens.

The first imaging unit 30 has a light receiving surface 30a. The second imaging unit 40 has a light receiving surface 40a. The light receiving surface 30a of the first imaging unit 30 and the light receiving surface 40a of the second imaging unit 40 are arranged side by side on the same plane S3. As shown in FIG. 2A, the first imaging unit 30 can image the range corresponding to the first measurement range L1 on the plane S1. Therefore, in the first measurement range L1, the image of the light section line PCL1 formed on the first surface M1 or the side surface of the measurement target M0 is acquired by the light receiving surface 30a via the imaging optical system 20.

In the sensor unit 100, as shown in FIG. 2, a first measurement range L1 (plane S1) in which a light cutting line PCL1 of the line light L is formed, a main surface S2 (lens main surface) of the imaging optical system 20, The plane S3 including the light receiving surface 30a of the first imaging unit 30 is arranged so as to intersect with one straight line P. As described above, since the first measurement range L1, the image pickup optical system 20, and the light receiving surface 30a are arranged according to the Scheimpflug principle, the light section line PCL1 passes through the image pickup optical system 20 and the first image pickup unit. The image is projected in a focused state on the light receiving surface 30a of 30.

FIG. 2B shows how to measure the second surface M2 of the measurement target M0. 2B, in comparison with FIG. 2A, when the sensor unit 100 is moved in the −Y direction without changing the distance in the Z direction from the measurement target M0 (or the measurement target). (When M0 is moved in the +Y direction). As shown in FIG. 2B, the line light L moves from the first surface M1 of the measurement target M0 to the second surface M2 beyond the step M3. At this time, since the second surface M2 is located on the +Z side of the first measurement range L1 of the line light L, the light cutting line PCL2 of the line light L is out of the first measurement range L1 of the plane S1, Two measurement ranges L2 are formed. Therefore, the light section line PCL2 on the second surface M2 is out of the imaging range of the first imaging unit 30.

On the other hand, the 2nd imaging part 40 can image the range corresponding to the 2nd measurement range L2 in plane S1. Therefore, the second surface M2 of the measurement target M0 and the light cutting line PCL2 formed on the side surface thereof are acquired by the light receiving surface 40a of the second imaging unit 40 via the imaging optical system 20. In this case, the second measurement range L2 (plane S1) in which the light cutting line PCL2 of the line light L is formed, the main surface S2 (lens main surface) of the imaging optical system 20, and the light receiving surface 40a of the second imaging unit 40. Similarly to the above, the plane S3 including is arranged so as to intersect with one straight line P. As described above, since the second measurement range L2, the image pickup optical system 20, and the light receiving surface 40a are arranged according to the Scheimpflug principle, the light cutting line PCL2 passes through the image pickup optical system 20 and the second image pickup section. It is projected in a focused state on the light receiving surface 40a of 40.

In the case shown in FIG. 2B, since the lower portion (the -Z side portion) of the optical cutting line PCL2 formed on the side surface of the measurement target M0 is within the first measurement range L1, the lower side of this side surface is measured. The side portion is acquired by the first imaging unit 30 as described above.

The control unit CONT may include a combination processing unit that combines the image data transmitted from each of the first image capturing unit 30 and the second image capturing unit 40. In the synthesizing processing unit, for example, based on the image data sent from each of the first image pickup unit 30 and the second image pickup unit 40, for example, the feature points are connected, or they are connected using a preset index mark or the like. And combine the image data. Further, the control unit CONT calculates the coordinate data for each pixel of the first image pickup unit 30 based on the image data transmitted from the first image pickup unit 30. On the other hand, the control unit CONT calculates the coordinate data for each pixel of the second imaging unit 40 based on the image data transmitted from the second imaging unit 40. The calculated coordinate data may be combined.

The control unit CONT may be included in the sensor unit 100 or may be included in an external device (for example, a computer) of the sensor unit 100. Of course, the control unit CONT may be provided both inside the sensor unit 100 and outside the sensor unit 100. For example, the control unit CONT inside the sensor unit 100 acquires the image data from the first imaging unit 30 and the second imaging unit 40, and creates a composite image in which the image data is combined. The created composite image is transmitted to the control unit CONT outside the sensor unit 100. The received control unit CONT outside the sensor unit 100 creates coordinate data from the combined image data. In this way, the control unit CONT provided at a plurality of locations may create the coordinate data from the image data. In this case, the control unit CONT included in the sensor unit 100 changes the posture of the control unit CONT as the postures of the light irradiation unit 10, the first imaging unit 30, and the second imaging unit 40 change. On the other hand, the control unit CONT outside the sensor unit 100 does not change the posture of the control unit CONT even if the postures of the light irradiation unit 10, the first imaging unit 30, and the second imaging unit 40 change. That is, since the sensor unit 100 is provided in the external device, the sensor unit 100 is driven independently of the external device.

Further, when the Scheimpflug principle is followed, the size of the image of the first measurement range L1 imaged on the light receiving surface 30a via the imaging optical system 20 and the image size on the light receiving surface 40a via the imaging optical system 20 as well. The size of the image in the second measurement range L2 is different. In FIG. 2, the image projected on the light receiving surface 40a of the second imaging unit 40 is larger than the image projected on the light receiving surface 30a of the first imaging unit 30. Therefore, the control unit CONT or the external device can perform the image composition with high accuracy by acquiring the image size ratio and the like in advance and calculating and processing the ratio when the images are combined. .. Further, the resolutions of the first imaging unit 30 and the second imaging unit 40 may be changed according to the size of such an image. Moreover, as the first image capturing unit 30 and the second image capturing unit 40, those having a size according to the size of the image projected on the light receiving surfaces 30a and 40a may be used.

As described above, according to the first embodiment, in the line light L, the first measurement range L1 and the second measurement range L2 having different measurement ranges in the first direction D1 are set and correspond to the first measurement range L1. Since the first imaging unit 30 that images the region and the second imaging unit 40 that images the region corresponding to the second measurement range L2 are provided, even if the measurement target M0 has a different height in the first direction D1, It is possible to switch the measurement range and image the optical cutting lines PCL1 and PCL2 without moving the sensor unit 100 itself in the Z direction. As a result, it is not necessary to use a large image pickup unit, and the sensor unit 100 can be downsized. In addition, such an effect is the same also in the following modified examples.

When the first imaging unit 30 and the second imaging unit 40 are installed, the imaging optical system 20 is designed according to the installed first imaging unit 30 and the second imaging unit 40, thereby The measurement range L1 and the second measurement range L2 can be set. For example, even if there is a distance where the first imaging unit 30 and the second imaging unit 40 can be installed close to each other and there is a region between the first imaging unit 30 and the second imaging unit 40 that cannot be imaged, the imaging optical system is By designing, the first measurement range L1 and the second measurement range L2 can be set. The first measurement range L1 and the second measurement range L2 that can be set can be continuously set. As described above, the first imaging unit 30 and the second imaging unit are arranged side by side, and the imaging optical system 20 for guiding the light reflected by the measurement object M in a predetermined direction is used to measure the first measurement range. It is possible to increase the measurement range L1 and the second measurement range L2.

In the above-described embodiment, the first measurement range L1 and the second measurement range L2 are set in the first direction D1, but the setting direction is not limited to this. For example, it may be set in a direction orthogonal to the first direction D1. In this case, the first measurement range L1 and the second measurement range L2 may be set in the direction parallel to the longitudinal direction of the line light L.

Further, in the above-described embodiment, the first measurement range L1 and the second measurement range L2 are set, but of course, the number of measurement ranges that can be set is not limited to this. In addition to the first measurement range L1 and the second measurement range L2, a third measurement range may be provided. In this case, the third measurement range may be set outside the first measurement range L1 and the second measurement range L2 in parallel with the first direction D1. Further, for example, with respect to the first measurement range L1 and the second measurement range L2 arranged in the direction parallel to the first direction D1, the third measurement range may be set in the direction orthogonal to the first direction D1. Absent.

Moreover, in the above-described embodiment, the areas of the light receiving surfaces of the first measurement range L1 and the second measurement range L2 may be the same or may be different areas.

In addition, in the above-described embodiment, since the first measurement range L1 and the second measurement range L2 are arranged along the first direction D1, only the first measurement range L1 is arranged along the first direction D1. In this case, when the distance along the first direction D1 of the unevenness of the measurement target M is longer than the first measurement range L1, the sensor unit 100 is arranged such that the surface of the measurement target M is arranged in the first measurement range L1. It is necessary to change the relative distance between the measurement target M and the measurement target M, but if the distance along the first direction D1 of the unevenness of the measurement target M is in the first measurement range L1 and the second measurement range L2, the measurement is performed with the sensor unit 100. There is no need to change the relative distance to the target M. Therefore, the time for adjusting the relative distance between the sensor unit 100 and the measurement target M can be shortened.

In the above-described embodiment, the surface shape of the measurement target M is measured using the first measurement range L1 and the second measurement range L2 set along the first direction D1. The surface shape of the measuring object M may be measured using only one. For example, when the unevenness of the surface shape of the measurement target M in the first direction D1 is within the first measurement range L1, it is possible to use only the first measurement range L1 without using the second measurement range L2. Even if the distance in the first direction D1 of the unevenness of the surface shape of the measurement target M is within the first measurement range L1 from the information on the surface shape of the measurement target M (for example, design information such as CAD), the first When a complicated operation for changing the relative distance between the sensor unit 100 and the measurement target M is necessary to arrange the surface of the measurement target M within the measurement range L1, the first measurement range L1 to be set. And the second measurement range L2 may be used. This can eliminate complicated operations.

In the above-described embodiment, the first imaging unit 30 and the second imaging unit 40 use members (not shown) to change the positional relationship between the imaging optical system 20, the first imaging unit 30, and the second imaging unit 40. It is fixed to a member (not shown) so as not to cause it. The imaging optical system 20 picks up an image of the optical cutting line PCL in only one direction by a member (not shown). That is, the light of the light cutting line PCL reflected by the measurement object can be divided into the light guided to the imaging optical system 20 and received by the first imaging unit 30 and the light received by the second imaging unit 40. .. There may be two or more imaging optical systems 20 for guiding the light received by the first imaging unit 30 and the second imaging unit 40. For example, the first imaging unit 30 and the second imaging unit 40 include independent imaging optical systems 20, and the imaging optical system 20 corresponding to the first imaging unit 30 and the second imaging unit 40 respectively measures an object to be measured. The light of the light section line PCL reflected by M may be received. In this case, the first image pickup unit 30 and the image pickup optical system 20 corresponding thereto, and the second image pickup unit 40 and the image pickup optical system 20 corresponding thereto are respectively provided by members (not shown) in the first direction D1 in the first measurement range. L1 and the second measurement range L2 can be arranged.

Further, the first imaging unit 30 and the second imaging unit 40 may be different in the direction in which the light reflected by the measurement target M is received. For example, the first image pickup unit 30 and the image pickup optical system 20 corresponding thereto, the second image pickup unit 40, and the image pickup optical system 20 corresponding thereto may be arranged with the optical cutting line PCL interposed therebetween. For example, in FIG. 2, the first imaging unit 30 and the second imaging unit 40 may be arranged so as to sandwich the light cutting line PCL in the Y direction. In this case, the plane including the light receiving surface 30a of the first imaging unit 30, the plane including the main surface of the imaging optical system 20, and the plane including the first measurement range L1 are arranged so as to intersect with one straight line P. To be done. As shown in FIG. On the other hand, in this case, the plane including the light receiving surface 40a of the second imaging unit 40, the plane including the main surface of the imaging optical system 20, and the plane including the second measurement range L2 are one straight line P. Arranged to intersect. In this case, since the plane including the first measurement range L1 and the plane including the second measurement range L2 are the same, the straight line P is also the same. On the other hand, in the Y direction, since the first imaging unit 30 and the second imaging unit 40 are arranged so as to sandwich the light cutting line PCL, the plane including the light receiving surface 30a of the first imaging unit 30 and the second imaging unit. It is different from the plane including the light receiving surface 40a of the portion 40. Further, the planes including the main surface of the imaging optical system 20 corresponding to the first imaging unit 30 and the second imaging unit 40 are different.

<First Modification>
Next, a first modified example will be described with reference to the drawings. FIG. 4 is a diagram showing an example of a sensor unit 100A according to the first modification. In addition, the same reference numerals will be given to the same or equivalent components as those in the above-described embodiment, and the description will be omitted or simplified. As shown in FIG. 4, in the sensor unit 100A according to the present modification, the light receiving surface 30a of the first imaging unit 30 and the light receiving surface 40a of the second imaging unit 40 are arranged on planes S3 and S4 intersecting with each other. There is. In the following description, the line of intersection between the plane S3 and the plane S4 is the straight line Q.

Further, the sensor unit 100A has a half mirror (divided portion) HM. The half mirror HM is fixed to the sensor unit 100A by a support tool (not shown) or the like. The half mirror HM divides the images of the optical cutting lines PCL1 and PCL2 formed on the surface of the measurement target into the first imaging unit 30 and the second imaging unit 40. The half mirror HM is arranged on the plane S5. The plane S5 is set so as to intersect the plane S3 and the plane S4 on the straight line Q. The angle between the plane S3 and the angle between the plane S4 are arranged to be equal. Therefore, the plane S3 and the plane S4 are arranged symmetrically with respect to the plane S5. Thereby, as shown in FIG. 4, even when the second imaging unit 40 is arranged on the plane S4, the Scheimpflug principle is applied to the second measurement range L2, the imaging optical system 20, and the second imaging unit 40. Maintained. Therefore, on the light receiving surface 40a of the second imaging unit 40, the light section line PCL2 in the second measurement range L2 is in a focused state.

The second image capturing section 40 has the light receiving surface 40a arranged on the plane S4. That is, the first imaging unit 30 and the second imaging unit 40 are not on the same plane. In addition, in FIG. 4, the second imaging unit 40 is arranged on the plane S4, but instead of this, the first imaging unit 30 may be arranged on the plane S4 and the second imaging unit may be arranged on the plane S3. Good.

A component of the image of the light-section line PCL1 that passes through the half mirror HM reaches the light-receiving surface 30a of the first imaging unit 30. On the other hand, in the image of the light section line PCL1, the component reflected by the half mirror HM does not reach the light receiving surface 30a and is not used for detection. Further, in the image of the light section line PCL2, the component reflected by the half mirror HM reaches the light receiving surface 40a of the second imaging unit 40. On the other hand, in the image of the light section line PCL2, the component that passes through the half mirror HM does not reach the light receiving surface 40a and is not used for detection.

Therefore, the first imaging unit 30 acquires the image of the light section line PCL1 included in the light transmitted through the half mirror HM. The second imaging unit 40 also acquires an image of the light section line PCL2 included in the light reflected by the half mirror HM. In this modification, a part of the light cutting lines PCL1 and PCL2 is received, but when the light intensity of the light cutting lines PCL1 and the like is high, it can be directly used as image data. Further, when the light intensity is low, the gain may be applied in the subsequent image processing stage.

In addition, in this modification, the distance between the second imaging unit 40 and the half mirror HM can be adjusted. Therefore, when the sizes of the images acquired by the first image capturing unit 30 and the second image capturing unit 40 are different as in the first embodiment described above, the position of the second image capturing unit 40 is changed to change the first image capturing unit 40. It is possible to obtain an image having the same size or an image having a small difference in size with respect to the imaging unit 30.

As described above, according to the present modification, the first imaging unit 30 and the second imaging unit 40 are not arranged side by side on the same plane, but are arranged at different positions, so that the first imaging unit 30 and the first imaging unit 30 The degree of freedom of arrangement of the 2 imaging part 40 becomes high. Therefore, the range of design of the sensor unit 100A is widened, and a compact design can be performed.

In addition, although the half mirror HM is used in this modification, the present invention is not limited to this. For example, a total reflection mirror may be used. When a total reflection mirror is used, a drive device for moving the total reflection mirror into or out of the optical path may be used. For example, when measuring the first measurement range L1, the total reflection mirror is retracted and the image data of the first measurement range L1 is acquired by the first imaging unit 30. Next, when measuring the second measurement range L2, the total reflection mirror is caused to enter the optical path, and the reflected light is received by the second imaging unit 40 to acquire image data. By using the total reflection mirror as described above, bright image data can be acquired even when the light intensity of the light cutting line formed on the measurement target is small. Even when the total reflection mirror is arranged, if the total reflection mirror does not interfere with the image in the first measurement range L1, it is not necessary to drive the total reflection mirror back and forth.

Further, for example, unlike a mirror or the like, an electrically driven DMD or liquid crystal display panel may be used.

In addition, in the present modification, the first imaging unit 30 and the second imaging unit 40 correspond to the first measurement range L1 and the second measurement range L2, respectively, but the first imaging unit 30 and the second imaging unit 40 to measure the first measurement range L1 and the first imaging unit 30 and the second imaging unit 40 to measure the first measurement range L1 and the second measurement range L2, respectively. It doesn't matter.

Moreover, although the 1st imaging part 30 and the 2nd imaging part 40 corresponded to the 1st measurement range L1 and the 2nd measurement range L2, respectively, the 3rd imaging part and the 4th imaging part are provided, and Imaging of one measurement range L1 may be performed by a plurality of imaging units. For example, when imaging the first measurement range L1 with the first imaging unit 30 and the third imaging unit, the result of at least one of the first imaging unit 30 and the third imaging unit may be adopted. Also, for example, when the first measurement range L1 is imaged by the first imaging unit 30 and the third imaging unit, the results of both the first imaging unit 30 and the third imaging unit are used as measurement results. I do not care. In this case, the results of the first imaging unit 30 and the third imaging unit may be averaged and used. The method used for averaging can be appropriately selected such as geometrical average and arithmetic average.

<Second Modification>
Next, a second modification will be described. It should be noted that the same or equivalent components as those of the above-described embodiment and modification are denoted by the same reference numerals, and the description thereof will be omitted or simplified.

In the sensor unit according to the second modification (hereinafter referred to as the sensor unit 100B), a dichroic prism (split unit) is used as the split unit instead of the half mirror HM shown in FIG. The dichroic prism has a dichroic film. The dichroic film divides the images of the optical cutting lines PCL1 and PCL2 formed on the surface of the measurement target M into the first imaging unit 30 and the second imaging unit 40 according to the wavelength. The dichroic film is arranged on the plane S5 like the half mirror HM. Therefore, even when the second imaging unit 40 is arranged on the plane S4, the Scheimpflug principle is applied to the second measurement range L2, the imaging optical system 20, and the second imaging unit 40 as in the first modification. Maintained. Therefore, on the light receiving surface 40a of the second imaging unit 40, the light section line PCL2 in the second measurement range L2 is in a focused state.

The dichroic film transmits light having a predetermined wavelength (first wavelength component) and transmits light having a wavelength different from the first wavelength component (second wavelength component). Further, as the light source 12 (see FIG. 2) of the light irradiation unit 10, one that emits the line light L containing these first and second wavelength components is used.

The first wavelength component of the image of the light-section line PCL1 formed in the first measurement range L1 passes through the dichroic film and reaches the light-receiving surface 30a of the first imaging unit 30. On the other hand, the second wavelength component of the image of the light section line PCL1 is reflected by the dichroic film. This second wavelength component does not reach the light receiving surface 30a and is not imaged. The second wavelength component of the image of the light section line PCL2 formed in the second measurement range L2 is reflected by the dichroic film and reaches the light receiving surface 40a of the second imaging unit 40. On the other hand, the first wavelength component of the image of the light section line PCL2 passes through the dichroic film. The first wavelength component does not reach the light receiving surface 40a through the dichroic film and is not imaged.

Therefore, the first imaging unit 30 acquires an image of the optical cutting line PCL1 by the light of the first wavelength component that has passed through the dichroic film. As a result, the light section line PCL1 in the first measurement range L1 is imaged by the first imaging unit 30. Further, the second imaging unit 40 acquires an image of the optical cutting line PCL2 due to the second wavelength component reflected by the dichroic film. As a result, the light section line PCL2 in the second measurement range L2 is imaged by the second imaging unit 40. That is, the images of the first and second measurement ranges L1 and L2 that are different in the first direction D1 are acquired by the different first and second imaging units 30 and 40, respectively.

As described above, according to this modification, as in the case of the first modification described above, the first imaging unit 30 and the second imaging unit 40 are not arranged side by side on the same plane, but are arranged at mutually different positions. As a result, the degree of freedom in arranging the first imaging unit 30 and the second imaging unit 40 is increased. Therefore, the range of design of the sensor unit 100B is widened, and a compact design can be performed. Furthermore, in this modification, since the wavelength is selected by the dichroic film to transmit or reflect, it is possible to obtain an accurate image corresponding to the first and second measurement ranges L1 and L2.

Further, in this modification, the first image pickup unit 30 and the second image pickup unit 40 may have different characteristics. For example, a light receiving element having excellent detection sensitivity for the first wavelength component may be used as the first imaging unit 30, and a light receiving element having excellent detection sensitivity for the second wavelength component may be used as the second imaging unit 40. Good. As a result, the detection sensitivity of the light cutting lines PCL1 and PCL2 can be improved.

Also in this modified example, the first imaging unit 30 and the second imaging unit 40 are arranged at positions according to the Scheimpflug principle. Therefore, the images of the optical cutting lines PCL1 and PCL2 are acquired in a focused state on the light receiving surfaces 30a and 40a, respectively. Further, by correcting the images acquired by the first image pickup unit 30 and the second image pickup unit 40 by the control unit CONT, it is possible to obtain image data with a reduced difference in projection magnification.

Further, in the above-described first embodiment, first and second modified examples, the measurement range in the first direction D1 is divided into two, that is, the first measurement range L1 and the second measurement range L2, but it is not limited to this. .. For example, the measurement range may be divided into three or more in the first direction D1 and set as the third measurement range, the fourth measurement range,.... In this case, the third imaging unit, the fourth imaging unit,... Are arranged so as to acquire the image of the light section line such as the third measurement range. It should be noted that these third image pickup units and the like have light-receiving surfaces arranged along the plane S3 similarly to the first image pickup unit 30 and the like, or may receive the reflected light from the half mirror HM as shown in FIG. The light receiving surface is arranged on the plane S4.

Further, in the above-described first embodiment, first and second modified examples, the images of the optical cutting lines PCL1 and PCL2 are captured through one imaging optical system 20, but the present invention is not limited to this, and the first or An image pickup optical system corresponding to each of the second image pickup units 30 and 40 may be used.

<Second Embodiment>
The second embodiment will be described. In the above-described first embodiment, the measurement range formed on the line light L is divided into the first measurement range L1 and the second measurement range L2, and the respective images are individually detected by the first and second imaging units 30 and 40. The configuration has been described as an example. However, the present invention is not limited to this, and the configuration may be such that the measurement range of the line light L is switched between the first measurement range L1 and the second measurement range L2 to be formed, and the image formed in each measurement range is acquired. Good. For example, if the length of the portion (beam waist) where the thickness t of the line light L is the smallest is short in the first direction D1 (Z direction), it becomes impossible to deal with the measurement target that changes greatly in the Z direction. In this case, by moving the measurement range in the first direction D1, it is possible to deal with a measurement target that greatly changes in the Z direction.

FIG. 5 is a diagram showing an example of the sensor unit 200 according to the second embodiment. It should be noted that the same or equivalent components as those of the above-described embodiment and modification are denoted by the same reference numerals, and the description thereof will be omitted or simplified. As shown in FIG. 5A, the sensor unit 200 includes a light irradiation section 210, an imaging optical system 20, an imaging section 230, a wavelength setting section (changing section) 240, and a control section CONT. .. The configuration of the imaging optical system 20 is the same as that of the first embodiment. The light irradiation unit 210, the imaging optical system 20, and the imaging unit 230 are fixed to a casing (not shown) or the like by a support or the like so as not to change the positional relationship with each other. The light irradiation unit 210 is an example of a projection optical system that projects the line light L onto the surface of the measurement target M.

The light irradiation unit 210 includes a probe 211, a light source 212, and an illumination optical system 213. The probe 211 is formed, for example, in a cylindrical shape, and houses the light source 212 and the illumination optical system 213 inside. The light source 212 has, for example, a laser diode capable of emitting light of different wavelengths. In this embodiment, for example, a laser diode or the like that can emit red light having a wavelength of about 650 nm and blue light having a wavelength of about 450 nm is used. The light source 212 emits laser light in the −Z direction. The illumination optical system 213 shapes the laser light from the light source 212 into the line light L and emits it in the −Z direction. The line light L is formed along a plane S1 parallel to the XZ plane. The wavelengths of the light used are not limited to the above red and blue, and for example, red and green or blue and green may be used. The matters regarding the wavelength of the light to be used are the same for the modified examples described later.

The wavelength setting unit 240 can switch the wavelength of the line light L emitted from the light source 212. The switching of the wavelength of the line light L by the wavelength setting unit 240 is controlled by the control unit CONT. For example, as shown in FIG. 5A, the wavelength setting unit 240 turns on the red light source and turns off the blue light source of the light source 212 according to an instruction from the control unit CONT, so that the red line light Lr is emitted from the light source 212. Can be injected.

The red line light Lr emitted from the illumination optical system 213 is gradually reduced in thickness tr in the −Z direction, and a portion (beam waist) where the thickness tr is minimized is formed. The first measurement range L1 is set to almost the entire beam waist in the Z direction. When the surface of the measurement target is arranged in the first measurement range L1, the light cutting line PCL1 of the red line light Lr is formed on the surface. The optical cutting line PCL1 is formed on the plane S1. Further, as shown in FIG. 5A, in the red line light Lr, the thickness tr is not sufficiently small in the second measurement range L2.

The image capturing section 230 has a light receiving surface 231. Unlike the above-described first embodiment and the like, a single imaging unit 230 is used. The light receiving surface 231 of the imaging unit 230 is arranged on the plane S3. The image of the light cutting line PCL1 of the red line light Lr is acquired by the light receiving surface 231 via the imaging optical system 20.

FIG. 5B is a diagram showing a state in which the line light L emitted from the light source 212 is switched to the blue line light Lb. As shown in FIG. 5B, the wavelength setting unit 240 emits the blue line light Lb from the light source 212 by turning on the blue light source and turning off the red light source of the light source 212 according to an instruction from the control unit CONT. Can be made

The blue line light Lb emitted from the illumination optical system 213 has a thickness tb gradually reduced in the −Z direction, and a portion (beam waist) having the smallest thickness tb is formed. The second measurement range L2 is set almost in the entire beam waist in the Z direction. Further, as shown in FIG. 5B, in the blue line light Lb, the thickness tb in the first measurement range L1 widens in the −Z direction, and the thickness tb is not sufficiently small.

As described above, the measurement range in the first direction D1 can be changed by switching the red line light Lr and the blue line light Lb. This utilizes the axial chromatic aberration in the illumination optical system 213 of the light illumination section 210. That is, the change in the refractive index of the optical system is utilized depending on the wavelength, and the light having a short wavelength has a shorter focal length than the light having a long wavelength. Therefore, the second measurement range L2 of the blue line light Lb is formed on the +Z side of the first measurement range L1 of the red line light Lr. In this way, it is possible to switch between the first measurement range L1 and the second measurement range L2 whose positions in the Z direction are different by utilizing the axial chromatic aberration of the illumination optical system 213.

Therefore, when the surface of the measurement target is arranged in the second measurement range L2, the light cutting line PCL2 is formed on the surface of the measurement target in the second measurement range L2 using the blue line light Lb. The optical cutting line PCL2 is formed on the plane S1. The image of the light-section line PCL2 by the blue line light Lb is acquired by the light-receiving surface 231 of the imaging unit 230 via the imaging optical system 20, similarly to the light-section line PCL1.

In the sensor unit 200, similar to the sensor unit 100 described above, the first and second measurement ranges L1 and L2 (plane S1) where the light cutting line PCL1 of the red line light Lr and the light cutting line PCL2 of the blue line light Lb are formed. ), a main surface S2 (lens main surface) of the image pickup optical system 20, and a plane S3 including the light receiving surface 231 of the image pickup section 230 are arranged so as to intersect with one straight line P. As described above, since the first and second measurement ranges L1 and L2, the image pickup optical system 20, and the light receiving surface 231 are arranged according to the Scheimpflug principle, the optical cutting line PCL1 through the image pickup optical system 20, The PCL 2 is projected while being focused on the light receiving surface 231 of the image capturing unit 230.

The image of the light-section line PCL1 is projected onto the area of the light-receiving surface 231 near the straight line P. On the other hand, the image of the light-section line PCL2 is projected onto the area of the light-receiving surface 231 that is far from the straight line P. Further, the images of the light section lines PCL1 and PCL2 have different optical path lengths with respect to the imaging optical system 20. Therefore, the images of the light cutting lines PCL1 and PCL2 are projected on the light receiving surface 230a of the imaging unit 230 with different magnifications. For example, the image of the light cutting line PCL1 is projected on the light receiving surface 230a as an image smaller than the image of the light cutting line PCL2. In this case, the control unit CONT can eliminate the difference in projection magnification by correcting one or both of the image data acquired by the imaging unit 230.

As described above, according to the second embodiment, the wavelength setting unit 240 switches the wavelength of the line light L emitted from the light irradiation unit 210, whereby the measurement range of the line light L is set to the first measurement range L1 and the second measurement range L1. It can be switched with the measurement range L2. Accordingly, it is possible to obtain an image of the optical cutting line with respect to the measuring objects having different height directions (first direction D1 and Z direction). Therefore, it is possible to easily and surely capture the light cutting line even if the measurement target has a large change in the height direction.

In the sensor unit 200 described above, the single imaging unit 230 is used to obtain the images of the optical cutting lines in a plurality of measurement ranges, but the present invention is not limited to this. For example, a plurality of imaging units may be arranged corresponding to the first and second measurement ranges L1 and L2. In this case, each of the image pickup units is arranged along the plane S3 as shown in FIG. 2, or as shown in FIG. 4, one of the image pickup units is arranged on the plane S4 (see FIG. 4) using a half mirror HM or the like. Etc.).

In the sensor unit 200 described above, the red line light Lr and the blue line light Lb are switched and emitted, but the present invention is not limited to this. For example, the red line light Lr and the blue line light Lb may be irradiated at the same time, and the light section lines PCL1 and PCL2 simultaneously formed in the first and second measurement ranges L1 and L2 may be simultaneously imaged by the imaging unit 230. In this case, the wavelength setting unit 240 described above is unnecessary. In addition, when the red line light Lr and the blue line light Lb are simultaneously emitted, the region corresponding to the first measurement range L1 of the image capturing unit 230 and the second measurement range L2 are supported so as not to receive light of other wavelengths. You may arrange|position a wavelength selection filter to each of the area|region to perform.

<Third Modification>
Next, a third modification will be described with reference to the drawings. FIG. 6 is a diagram showing an example of a sensor unit 200A according to the third modification. In addition, the same reference numerals will be given to the same or equivalent components as those in the above-described embodiment, and the description will be omitted or simplified. As shown in FIGS. 6A and 6B, the sensor unit 200A has a configuration in which the imaging unit 230A is movable between the first position PT1 and the second position PT2. The image pickup unit 230A is smaller than the image pickup unit 230 shown in FIG.

The imaging unit 230A is configured to be movable along the plane S3. For example, a linear guide is formed along the plane S3, and the imaging unit 230A is fixed to a movable member that can move the linear guide. The imaging unit 230A moves by driving a moving device 250 such as a linear motor. The drive of the moving device 250 is controlled by the control unit CONT. As the moving device 250, a ball screw mechanism or an actuator such as a piezo element may be used instead of the linear motor.

The first position PT1 is set at a position corresponding to the first measurement range L1. Therefore, when the image capturing section 230A is at the first position PT1, the image of the optical cutting line PCL1 in the first measurement range L1 can be captured by the image capturing section 230A via the image capturing optical system 20. Further, the second position PT2 is set at a position corresponding to the second measurement range L2. Therefore, when the image capturing section 230A is at the second position PT2, the image of the optical cutting line PCL2 in the second measurement range L2 can be captured by the image capturing section 230A via the image capturing optical system 20. The image capturing section 230A has a light receiving surface 231A capable of capturing images of the optical cutting lines PCL1 and PCL2 at each of the first position PT1 and the second position PT2.

As shown in FIG. 6A, when the red line light Lr is emitted from the light source 212 and is set in the first measurement range L1, the image of the light cutting line PCL1 of the red line light Lr is the imaging optical system 20. To reach the first position PT1. Therefore, when the red line light Lr is emitted, the moving device 250 is driven according to the instruction from the control unit CONT, and the image pickup unit 230A is arranged at the first position PT1. As a result, the image of the light section line PCL1 is projected on the light receiving surface 231A of the imaging unit 230A.

Further, as shown in FIG. 6B, when the blue line light Lb is emitted from the light source 212 and the second measurement range L2 is formed, the image of the light cutting line PCL2 of the blue line light Lb is the image pickup optical. The second position PT2 is reached via the system 20. Therefore, when the blue line light Lb is emitted, the moving device 250 is driven according to the instruction from the control unit CONT, and the image pickup unit 230A is arranged at the second position PT2. As a result, the image of the light section line PCL2 is acquired via the light receiving surface 231A of the imaging unit 230A.

As described above, according to this modification, it is not necessary to use a large image sensor that simultaneously covers both the first and second measurement ranges L1 and L2. Since a small image sensor that can image one of the first and second measurement ranges L1 and L2 can be used, the cost of the image sensor can be reduced.

<Fourth Modification>
Next, a fourth modified example will be described with reference to the drawings. FIG. 7 is a diagram showing an example of a sensor unit 200B according to the fourth modification. In addition, the same reference numerals will be given to the same or equivalent components as those of the above-described embodiment, and the description thereof will be omitted or simplified. As shown in FIGS. 7A and 7B, in the sensor unit 200B, a first light source 212a that emits red light and a second light source 212b that emits blue light are individually arranged in the light irradiation section 210B. Has been done. As the first light source 212a, for example, a red laser diode that emits red light having a wavelength of about 650 nm is used. As the second light source 212b, for example, a blue laser diode that emits blue light having a wavelength of about 450 nm is used.

The sensor unit 200B has a wavelength setting section (changing section) 240B. The wavelength setting unit 240B switches between the first light source 212a and the second light source 212b according to an instruction from the control unit CONT. By switching between the first light source 212a and the second light source 212b by the wavelength setting unit 240B, the red line light Lr and the blue line light Lb can be switched and emitted.

The light irradiation section 210B has a light guide optical system 214. The light guide optical system 214 guides red light from the first light source 212a to the illumination optical system 213. The light guide optical system 214 has a mirror 214a and a dichroic mirror 214b. The mirror 214a totally reflects the red light emitted from the first light source 212a in the +Y direction. The dichroic mirror 214b is arranged at a position in the +Y direction with respect to the mirror 214a and in the −Z direction of the second light source 212b. The dichroic mirror 214b reflects red light and transmits blue light. Both the red line light Lr and the blue line light Lb are emitted by the light guide optical system 214 along the plane S1.

As shown in FIG. 7A, when the red light is emitted from the first light source 212a in the −Z direction, the red light is reflected in the +Y direction by the mirror 214a and is reflected in the −Z direction by the dichroic mirror 214b. It This red light is shaped into red line light Lr by the illumination optical system 213 and is emitted from the light irradiation unit 210B in the −Z direction. As a result, the first measurement range L1 is formed. Therefore, in the first measurement range L1, the image of the light section line PCL1 formed by the red line light Lr is projected onto the light receiving surface 231 of the image capturing unit 230 via the image capturing optical system 20. As a result, the image of the light section line PCL1 is acquired by the imaging unit 230.

As shown in FIG. 7B, when blue light is emitted from the second light source 212b in the −Z direction, this blue light passes through the dichroic mirror 214b in the −Z direction. This blue light is shaped into a blue line light Lb by the illumination optical system 213 and is emitted from the light irradiation unit 210B in the −Z direction. As a result, the second measurement range L2 is formed. Therefore, in the second measurement range L2, the image of the light section line PCL2 formed by the blue line light Lb is projected on the light receiving surface 231 of the image capturing unit 230 via the image capturing optical system 20. As a result, the image of the light section line PCL2 is acquired by the imaging unit 230.

As described above, according to the present modification, by providing the first light source 212a that emits red light and the second light source 212b that emits blue light separately, as compared with the case where light sources of respective colors are collectively arranged. Therefore, a large amount of light can be easily secured. As a result, a bright image can be easily acquired by the imaging unit 230.

In the present modification, the case where the wavelength setting unit 240B uses the first light source 212a and the second light source 212b by switching has been described as an example, but the present invention is not limited to this and the same as in the second embodiment. Moreover, you may make it use the 1st light source 212a and the 2nd light source 212b simultaneously. In this case, the red light emitted from the first light source 212a is emitted from the light irradiation unit 210B as the red line light Lr and forms the first measurement range L1. Further, the blue light emitted from the second light source 212b is emitted from the light irradiation unit 210B as the blue line light Lb and forms the second measurement range L2. In this way, the first measurement range L1 with the red line light Lr and the second measurement range L2 with the blue line light Lb are simultaneously formed.

Further, in the present modification, the configuration in which the first light source 212a and the second light source 212b that emit light of different wavelengths are emitted through the common illumination optical system 213 has been described as an example, but the present invention is not limited to this. However, the light from the first light source 212a and the light from the second light source 212b may be emitted through different illumination optical systems.

Further, the light guide optical system 214 is not limited to the one described above, and for example, an optical fiber or the like may be used. Further, instead of the image pickup unit 230, a movable small image pickup unit 230A as in the third modified example described above may be used.

Further, although the sensor unit 200B described above uses the single imaging unit 230, the present invention is not limited to this. For example, a plurality of imaging units may be arranged corresponding to the first and second measurement ranges L1 and L2. In this case, each imaging unit is arranged along the plane S3 as shown in FIG. 2, or one of the imaging units is arranged on the plane S4 by using a half mirror HM or the like as shown in FIGS. 3 and 4. (See FIG. 3 etc.).

<Fifth Modification>
Next, a fifth modified example will be described with reference to the drawings. FIG. 8 is a diagram showing an example of a sensor unit 200C according to the fifth modification. In addition, the same reference numerals will be given to the same or equivalent components as those of the above-described embodiment, and the description thereof will be omitted or simplified. As shown in FIGS. 8A and 8B, the sensor unit 200C uses the imaging unit 230 having a plurality of pixels 232 that select the wavelength of light and receive the light. The pixel 232 has a plurality of pixels 232 a arranged at the first position 233 and a plurality of pixels 232 b arranged at the second position 234 on the light receiving surface 231 of the imaging unit 230.

The first position 233 corresponds to the first measurement range L1, and the image of the light section line PCL1 is projected via the imaging optical system 20. The second position 234 corresponds to the second measurement range, and the image of the light section line PCL2 is projected via the imaging optical system 20. As the pixel 232a at the first position 233, one that selects the red wavelength and receives the light is used. As the pixel 232b at the second position 234, one that selects a blue wavelength and receives light is used. A pixel selection unit 260 that selects such pixels 232 is connected to the imaging unit 230. The selection of the pixel 232 by the pixel selection unit 260 is performed according to an instruction from the control unit CONT.

As shown in FIG. 8A, when the red line light Lr is emitted from the light source 212 and the first measurement range L1 is set, the image of the light section line PCL1 is captured by the image capturing unit via the image capturing optical system 20. The first position 233 of 230 is reached. Therefore, when the red line light Lr is emitted, the pixel selection unit 260 causes the plurality of pixels 232 a arranged at the first position 233 to receive the light. Accordingly, the image of the light section line PCL1 is acquired via the pixel 232a of the imaging unit 230.

As shown in FIG. 8B, when the blue line light Lb is emitted from the light source 212 and the second measurement range L2 is set, the image of the light cutting line PCL2 is captured by the imaging unit 20 via the imaging optical system 20. The second position 234 of 230 is reached. Therefore, when the blue line light Lb is emitted, the pixel selection unit 260 causes the plurality of pixels 232b arranged at the second position 234 to receive the light. Accordingly, the image of the light section line PCL2 is acquired via the pixel 232b of the imaging unit 230.

As described above, according to the present modification, the wavelengths of light are selected and received by the pixels 232a and 232b of the image capturing unit 230, so that the light cutting lines PCL1 and PCL2 formed by the red line light Lr or the blue line light Lb are formed. Can be efficiently imaged. Further, among the plurality of pixels 232 included in the image capturing unit 230, the pixels that receive light can be selected, so that it is not necessary to constantly drive all the pixels 232, and the drive power of the image capturing unit 230 can be reduced.

In this modification, the pixels 232a and 232b are switched by the pixel selection unit 260, but the present invention is not limited to this. For example, the pixel selection unit 260 may not be provided, and light may be received from all the pixels 232 in both the first and second measurement ranges L1 and L2. Although the pixel 232a is arranged at the first position 233 and the pixel 232b is arranged at the second position 234 in FIG. 8, the invention is not limited to this. For example, the pixels 232a and 232b may be alternately arranged on the entire surface of the imaging unit 230. Further, the image capturing section 230 may be arranged in combination with a pixel (for example, a pixel capable of receiving green light) capable of selecting a wavelength different from that of the pixels 232a and 232b and receiving light.

In the sensor unit 200C described above, the pixels 232a and 232b are arranged along the plane S3, but the invention is not limited to this. For example, the pixel 232a at the first position 233 may be arranged on the plane S3, and the pixel 232b at the second position 234 may be arranged on a different plane (for example, the plane S4 shown in FIG. 3 and the like).

<Sixth Modification>
Next, a sixth modified example will be described. In addition, the same reference numerals will be given to the same or equivalent components as those of the above-described embodiment, and the description thereof will be omitted or simplified. A sensor unit (hereinafter, referred to as a sensor unit 200D) according to a sixth modification has a light source (hereinafter, referred to as a light source 212D) from which a light irradiation unit (hereinafter, referred to as a light irradiation unit 210D) emits light of a single wavelength. Call)). Further, the sensor unit 200D is formed so that the light irradiation section 210D is movable in the first direction D1 (Z direction), and a drive section (hereinafter, referred to as a drive section 270) for moving the light irradiation section 210D. have.

The light irradiation unit 210D is fixed to, for example, a movable member that can move a linear guide arranged along the first direction D1. The driving unit 270 moves the light irradiation unit 210D between the first position 215 and the second position 216. As the drive unit 270, for example, a linear motor, a ball screw mechanism, or the like is used. The driving unit 270 is driven by an instruction from the control unit CONT. The light irradiator 210D uses a contact type or non-contact type limit switch, an optical measuring device, an encoder, or the like, and thus the first position (hereinafter, referred to as the first position 215) or the second position (the first position 215). 2 position 216).

Here, when the line light L is emitted from the light source 212D, the beam waist BW of the line light L is separated from the end surface of the probe 211 on the −Z side by a predetermined distance (hereinafter, referred to as mechanical working distance L3). Formed in position. In this configuration, by driving the drive unit 270 and moving the light irradiation unit 210D between the first position 215 and the second position 216, the line light L of the line light L is changed without changing the value of the mechanical working distance L3. The position of the beam waist BW moves in the first direction D1. In this sensor unit 200D, the position of the light irradiation part 210D at which the beam waist BW is formed at the position corresponding to the first measurement range L1 of the second embodiment described above is set to the first position 215, and the second measurement range L2 is set. The position of the light irradiation part 210D where the beam waist BW is formed at the position corresponding to is the second position 216.

Accordingly, when the drive unit 270 is driven to position the light irradiation unit 210D at the first position 215, the first measurement range L1 is set. Therefore, the image of the light section line PCL1 is projected onto the image capturing section 230 via the image capturing optical system 20. Further, when the drive unit 270 is driven to position the light irradiation unit 210D at the second position 216, the second measurement range L2 is set. Therefore, the image of the light section line PCL2 is projected on the imaging unit 230 via the optical system 20.

As described above, according to the present modification, the drive unit 270 can switch the first measurement range L1 and the second measurement range L2 by moving the light irradiation unit 210D in the first direction D1. Even when using the light source 212D that emits light of the wavelength, the measurement range in the first direction D1 can be easily changed.

Further, although the sensor unit 200D described above uses the single imaging unit 230, the present invention is not limited to this. For example, a plurality of imaging units may be arranged corresponding to the first and second measurement ranges L1 and L2. In this case, each of the image pickup units is arranged along the plane S3 as shown in FIG. 2, or as shown in FIG. 4, one of the image pickup units is arranged on the plane S4 (see FIG. 4) using a half mirror HM or the like. Etc.).

<Seventh Modification>
Next, a seventh modified example will be described. In addition, the same reference numerals will be given to the same or equivalent components as those of the above-described embodiment, and the description thereof will be omitted or simplified. A sensor unit (hereinafter, referred to as a sensor unit 200E) according to a seventh modified example is a light source (hereinafter, referred to as a light source 212E) from which a light irradiation unit (hereinafter, referred to as a light irradiation unit 210E) emits light of a single wavelength. Call)). Further, the sensor unit 200E has a structure in which the illumination optical system 213 of the light irradiation section 210E is moved in the first direction D1 (Z direction).

The illumination optical system 213 is configured by combining one or more optical elements. One or more of these optical elements are movably supported in the first direction D1. The illumination optical system 213 has a drive unit (hereinafter, referred to as a drive unit 270E) that moves the movable optical element. As the drive unit 270E, for example, an actuator such as a piezo element is used. The drive of the drive unit 270E is performed according to an instruction from the control unit CONT.

The drive unit 270E sets one or more optical elements of the illumination optical system 213 between a first position (hereinafter, referred to as a first position 217) and a second position (hereinafter, referred to as a second position 218). Move between. Here, when light of a single wavelength is emitted from the light source 212E and line light L is emitted from the light irradiation unit 210E, the beam waist BW of the line light L is a predetermined distance (−) from the end surface of the probe 211 on the −Z side. (Mechanical working distance). In this configuration, the drive unit 270E moves the optical element of the illumination optical system 213 between the first position 217 and the second position 218, so that the mechanical working distance is changed and the beam waist BW of the line light L is changed. The position moves in the first direction D1.

In this sensor unit 200E, the position of the illumination optical system 213 (optical element) such that the beam waist BW is formed at the position corresponding to the first measurement range L1 of the second embodiment described above is set to the first position 217, and the first position 217 is set. The position of the illumination optical system 213 (optical element) where the beam waist BW is formed at the position corresponding to the second measurement range L2 is referred to as a second position 218.

As a result, when the driving unit 270E is driven to position the illumination optical system 213 at the first position 217, the first measurement range L1 is set. Therefore, the image of the light section line PCL1 is projected onto the image capturing section 230 via the image capturing optical system 20. Further, when the driving unit 270E is driven to position the illumination optical system 213 at the second position 218, the second measurement range L2 is set. Therefore, the image of the light section line PCL2 is projected on the imaging unit 230 via the optical system 20.

As described above, according to the present modification, the drive unit 270E can switch between the first measurement range L1 and the second measurement range L2 by moving the illumination optical system 213 (optical element) in the first direction D1. Therefore, even when the light source 212E that emits light of a single wavelength is used, the measurement range in the first direction D1 can be easily changed.

Further, although the sensor unit 200E described above uses the single imaging unit 230, the present invention is not limited to this. For example, a plurality of imaging units may be arranged corresponding to the first and second measurement ranges L1 and L2. In this case, each of the image pickup units is arranged along the plane S3 as shown in FIG. 2, or as shown in FIG. 4, one of the image pickup units is arranged on the plane S4 (see FIG. 4) using a half mirror HM or the like. Etc.).

Further, in the above-described second embodiment and third to seventh modified examples, the measurement range in the first direction D1 is divided into two, that is, the first measurement range L1 and the second measurement range L2, but the present invention is not limited to this. .. For example, the measurement range may be divided into three or more in the first direction D1 and set as the third measurement range, the fourth measurement range,.... In this case, light of a plurality of wavelengths is used so as to set the third measurement range and the like (second embodiment and third to fifth modifications), and the light irradiation unit 210D is moved (sixth modification). ) And moving the illumination optical system 213 (seventh modified example).

Further, in the above-described second embodiment and third to seventh modified examples, the images of the optical cutting lines PCL1 and PCL2 are captured through one imaging optical system 20, but the present invention is not limited to this, and the first or An image pickup optical system corresponding to each of the second image pickup units 30 and 40 may be used.

<Shape measuring device>
FIG. 9 is a schematic diagram showing an example of an embodiment of a shape measuring apparatus 300 including the sensor unit 100 shown in FIG. As shown in FIG. 9, the shape measuring apparatus 300 includes a measuring machine body 301 and a control unit 340. The measuring machine body 301 includes a base 302, a moving unit (scanning system) 310, a measuring head 313, and a supporting device 330.

The base 302 has a horizontal reference plane. An orthogonal coordinate system (machine coordinate system) is defined based on the reference plane of the base 302. An X axis and a Y axis which are orthogonal to each other are defined in parallel to the reference plane, and a Z axis is defined in a direction orthogonal to the reference plane. Further, the base 302 is provided with a guide rail (not shown) extending in the Y direction (the direction perpendicular to the plane of the drawing, which is the front-back direction).

The moving unit 310 is provided so as to be movable in the Y direction on the guide rail formed on the base 302. The moving unit 310 includes a pair of support columns 310a and 310b and a frame 310c bridged between the support columns 310a and 310b, and is configured in a gate shape. The columns 310a and 310b are provided upright from the base 302 in the Z direction. The frame 310c is bridged horizontally between the columns 310a and 310b along the X direction. The movement of the moving unit 310 is controlled by the control unit 340 described later. The frame 310c is provided with a carriage (not shown) that is movable in the X direction (horizontal direction).

The measurement head 313 is provided so as to be movable in the Z direction (vertical direction) with respect to the carriage of the frame 310c. The measuring head 313 can move the frame 310c in the X direction by moving the carriage. The movement of the measuring head 313 is controlled by the control unit 340 described later. The measurement head 313 has a sensor unit 100 that detects the shape of the measurement target M. The sensor unit 100 is attached to the measurement head 313 via the head rotation mechanism 313a. The sensor unit 100 is rotated in the θZ direction by the head rotation mechanism 313a. The rotation of the sensor unit 100 is controlled by the control unit 340 described later.

A frame rotating unit 310d is provided on the frame 310c. The frame rotating unit 310d rotates the frame 310c in the θX direction. By rotating the frame 310c in the θX direction, the line light L emitted from the sensor unit 100 can be scanned in the Y direction. The scanning of the line light L in the Y direction is not limited to the rotation of the frame 310c. For example, the line light L may be scanned in the Y direction by moving the moving unit 310 in the Y direction.

Inside the moving unit 310, a head driving unit and a head position detecting unit (not shown) are provided. The head driving unit moves the measuring head 313 in the X direction, Y direction, Z direction, θX direction, and θZ direction by, for example, electric driving. The head position detection unit detects the coordinates of the measuring head 313 and outputs a signal indicating the coordinate value of the measuring head 313 to the control unit 340 described later.

A support device 330 is provided on the base 302. The support device 330 includes a stage 331 and a support table 332. The stage 331 holds the measurement target M. The support table 332 rotates the stage 331 in the θX direction and the θZ direction. As a result, the stage 331 is inclined or horizontally rotated with respect to the reference plane of the base 302.

The control unit 340 includes a control unit 341, an input device 342, and a monitor 344. The control unit 341 controls the measuring device main body 301. The control unit 341 calculates the shape of the measurement target M based on the image information from the sensor unit 100 and the scanning information of the sensor unit 100 by the moving unit 310. The input device 342 is a keyboard, a mouse or the like for inputting various kinds of instruction information, and a joystick 343 may be added to this input device. The monitor 344 displays a measurement screen, an instruction screen, a measurement result, and the like.

Next, the flow of the three-dimensional shape measuring process in the shape measuring apparatus 300 having the above configuration will be described below. The shape measuring apparatus 300 uses the sensor unit 100 to measure the three-dimensional shape of the measurement target M by using the light cutting method. FIG. 10 is a flowchart for explaining the flow of the three-dimensional shape measuring process in the shape measuring apparatus 300.

After the measurement target M is placed on the stage 331 at a predetermined position by the user, the measurement process is started. First, the control unit 341 causes the light irradiation unit 10 of the sensor unit 100 to irradiate the measurement target M with the line light L in the Z direction (first direction D1) (step S01). Thereby, the line light L in the X direction (second direction D2) is projected on the surface of the measurement target M, and a light cutting line corresponding to the shape of the measurement target M is formed.

Then, the control unit 341 moves the sensor unit 100 by rotating the frame 310c in the θX direction or moving the moving unit 310 in the Y direction while irradiating the line light L, and moves the line light L in the Y direction ( The scanning is performed in the third direction D3) (step S02). As a result, the light cutting line moves in the Y direction on the surface of the measurement target M. The method of scanning the line light L is not limited to moving the sensor unit 100. For example, the stage 331 on the base 302 is moved in the Y direction or rotated in the θX direction to measure the measurement target M. You may move it.

The control unit 341 causes the first image capturing unit 30 and the second image capturing unit 40 (image capturing unit) of the sensor unit 100 to capture an image of the optical cutting line moving along the surface of the measurement target M (step S03). The control unit 341 determines which of the first measurement range L1 and the second measurement range L2 the light cutting line was formed in, and based on the determination result, the first imaging unit 30 or the second imaging unit. The portion 40 may be selected to capture an image of the light section line. By this step S03, the image data of the surface of the measuring object M is acquired.

The control unit 341 calculates the three-dimensional shape of the surface of the measurement target M based on the scanning information of the line light L (light cutting line) and the image data from the imaging unit (step S04). The control unit 341 calculates, for example, point cloud data regarding the XYZ coordinates of the surface of the measurement target M from the scanning information of the line light and the image data of the light cutting line based on the principle of triangulation. The point cloud data may be displayed on the monitor 344.

In the present embodiment, since the sensor unit 100 is provided, for example, even when the measurement target M has a large step in the Z direction, the measurement range is switched to easily and reliably capture the optical cutting line. can do. Therefore, by making it possible to deal with the measurement target M that has a large change, the shape measuring apparatus 300 having excellent measurement accuracy can be obtained.

In the present embodiment, the configuration including the sensor unit 100 has been described as an example, but the present invention is not limited to this, and the sensor units 100A, 100B, 200, 200A, 200B, 200C, 200D, and 200E described above are not limited thereto. The configuration may be provided. When the sensor units 200 to 200E are used, the control unit 341, when irradiating the line light L, selects the measurement range of the line light L to either the first measurement range L1 or the second measurement range L2. You can

<Structure manufacturing system and structure manufacturing method>
FIG. 11 is a block diagram showing an example of an embodiment of the structure manufacturing system. The structure manufacturing system 400 shown in FIG. 11 includes the shape measuring apparatus 300, the designing apparatus 410, the molding apparatus 420, the control apparatus (inspection apparatus) 430, and the repair apparatus 440 described above.

The design device 410 creates design information regarding the shape of the structure. Then, the design device 410 transmits the created design information to the molding device 420 and the control device 430. Here, the design information is information indicating the coordinates of each position of the structure.

The molding device 420 molds the structure based on the design information transmitted from the design device 410. The forming process of the forming device 420 includes casting, forging, or cutting. The shape measuring apparatus 300 measures the three-dimensional shape of the structure (measurement target M) manufactured by the molding apparatus 420, that is, the coordinates of the structure. Then, shape measuring apparatus 300 transmits information indicating the measured coordinates (hereinafter referred to as shape information) to control apparatus 430.

The control device 430 has a coordinate storage unit 431 and an inspection unit 432. The coordinate storage unit 431 stores the design information transmitted from the design device 410. The inspection unit 432 reads the design information from the coordinate storage unit 431. Further, the inspection unit 432 compares the design information read from the coordinate storage unit 431 with the shape information transmitted from the shape measuring device 300. Then, the inspection unit 432 inspects whether the structure is molded according to the design information based on the comparison result.

The inspection unit 432 also determines whether or not the structure molded by the molding device 420 is a non-defective product. Whether or not the structure is non-defective is determined by, for example, whether or not the error between the design information and the shape information is within a predetermined threshold range. Then, when the structure is not molded according to the design information, the inspection unit 432 determines whether the structure can be restored according to the design information. When it is determined that the repair can be performed, the inspection unit 432 calculates the defective portion and the repair amount based on the comparison result. Then, the inspection unit 432 transmits, to the repair device 440, information indicating a defective portion (hereinafter referred to as defective portion information) and information indicating a repair amount (hereinafter referred to as repair amount information).

The repair device 440 processes the defective part of the structure based on the defective part information and the repair amount information transmitted from the control device 430.

FIG. 12 is a flowchart showing the processing by the structure manufacturing system 400, and shows an example of the embodiment of the structure manufacturing method. As shown in FIG. 12, the designing device 410 creates design information regarding the shape of the structure (step S11). The design device 410 transmits the created design information to the molding device 420 and the control device 430. The control device 430 receives the design information transmitted from the design device 410. Then, the control device 430 stores the received design information in the coordinate storage unit 431.

Next, the molding device 420 molds the structure based on the design information created by the design device 410 (step S12). Then, the shape measuring apparatus 300 measures the three-dimensional shape of the structure molded by the molding apparatus 420 (step S13). After that, the shape measuring apparatus 300 transmits the shape information that is the measurement result of the structure to the control apparatus 430. Next, the inspection unit 432 compares the shape information transmitted from the shape measuring device 300 with the design information stored in the coordinate storage unit 431, and determines whether or not the structure is molded as the design information. Inspect (step S14).

Next, the inspection unit 432 determines whether or not the structure is non-defective (step S15). When it is determined that the structure is non-defective (step S15: YES), the process by the structure manufacturing system 400 ends. On the other hand, when the inspection unit 432 determines that the structure is not a good product (step S15: NO), the inspection unit 432 determines whether the structure can be repaired (step S16).

When the inspection unit 432 determines that the structure can be repaired (step S16: YES), the inspection unit 432 calculates the defective portion and the repair amount of the structure based on the comparison result of step S14. Then, the inspection unit 432 transmits the defective portion information and the repair amount information to the repair device 440. The repair device 440 performs repair (rework) of the structure based on the defective portion information and the repair amount information (step S17). Then, the process proceeds to step S13. That is, the processes after step S13 are executed again for the structure that has been repaired by the repair apparatus 440. On the other hand, when the inspection unit 432 determines that the structure cannot be restored (step S16: NO), the process by the structure manufacturing system 400 ends.

As described above, in the structure manufacturing system 400 and the structure manufacturing method, the inspection unit 432 determines whether the structure is manufactured according to the design information based on the measurement result of the structure by the shape measuring device 300. .. As a result, it is possible to accurately determine whether or not the structure manufactured by the molding apparatus 420 is a good product, and it is possible to shorten the determination time. Further, in the structure manufacturing system 400 described above, when the inspection unit 432 determines that the structure is not good, the structure can be immediately repaired.

In the structure manufacturing system 400 and the structure manufacturing method described above, the molding apparatus 420 may be configured to perform the machining again, instead of the repair apparatus 440 performing the machining.

Although the embodiment and the modified example have been described above, the technical scope of the present invention is not limited to the range described in the above-described embodiment and the modified example. Various modifications and improvements can be added to the above-described embodiments and modifications without departing from the spirit of the present invention. In addition, one or more of the requirements described in the above-described embodiment and modification may be omitted. Such modifications, improvements, and omitted forms are also included in the technical scope of the present invention. Further, it is also possible to apply the configurations of the above-described embodiments and modified examples in an appropriate combination.

In each of the above-described embodiments and modifications, the first direction D1 and the second direction D2 were orthogonal, but if the first direction D1 and the second direction D2 are different directions, they are not orthogonal. Good. For example, the second direction D2 may be set at an angle of 60 degrees or 80 degrees with respect to the first direction D1. Further, the second direction D2 and the third direction D3 are not limited to being orthogonal to each other, and the second direction D2 and the third direction D3 do not have to be orthogonal as long as they are different directions.

Further, in the shape measuring apparatus 300 according to the above-described embodiment, the configuration in which the sensor unit 100 is attached to the gate-shaped moving unit 310 has been described as an example, but the configuration is not limited to this and is disclosed, for example, in the United States. The sensor unit 100 may be attached to the tip of the robot hand as described in 2009/0299688.

In addition, in each of the above-described embodiments and modified examples, when the measurement target M does not fit within the imaging field of view of the first imaging unit 30 or the like in one scan, different positions of the measurement target M are measured to perform each measurement. The three-dimensional shape of the entire measurement target M may be measured by connecting the results. When joining the measurement results, an overlapping process may be used in which some of the measurement results are overlaid. This overlapping processing is performed by the control unit CONT or the control unit 341.

The overlapping process will be described. First, the first imaging unit 30 or the like scans and images the first portion of the measurement target M. Next, the second portion that partially overlaps the first portion of the measurement target M is scanned and imaged. The control unit CONT or the like calculates a three-dimensional shape for each of the first portion and the second portion. Further, the control unit CONT or the like searches for a portion where the first portion and the second portion overlap each other, and overlaps these portions to connect the three-dimensional shapes of the first portion and the second portion. The control unit CONT or the like searches for a pixel in a predetermined area that has common coordinate data in the three-dimensional shape of the first part and the three-dimensional shape of the second part, and overlaps the first part and the second part. Judge the part. Note that the control unit CONT or the like attaches a mark to the measurement target M or a mounting portion on which the measurement target M is mounted in advance, instead of searching for a pixel in a predetermined area that is common coordinate data, and The three-dimensional shape of the first portion and the three-dimensional shape of the second portion may be connected based on the coordinate data.

The three-dimensional shape of the entire measurement target M is measured by repeatedly performing such processing until the entire measurement target M is imaged. According to this, even if the measurement target M is a large object, the three-dimensional shape of the entire measurement target M can be easily measured.

Further, a part of the configuration of the shape measuring apparatus 300 or the like may be realized by a computer. For example, the control unit 341 may be realized by a computer. In this case, the computer, in accordance with the shape measurement program stored in the storage unit, with respect to the measurement object M that is arranged apart in the first direction D1, the second direction D2 on the measurement object M that intersects the first direction D1. To the first direction D1 via the imaging optical system 20 having the optical axis direction AX different from the first direction D1. A process of capturing at least one of an image of the line light L in one measurement range L1 and an image of the line light L in a second measurement range L2 in which the measurement range in the first direction D1 is different from the first measurement range L1; And a process of calculating the shape of the measurement target M based on the image information by the scan and the scan information by the scan.

The shape measuring program may be provided by being stored in a computer-readable storage medium such as an optical disk, a CD-ROM, a USB memory, an SD card, or the like.

M, M0... Measurement object (inspection object) CONT... Control part D1... 1st direction D2... 2nd direction L... Line light L1... 1st measurement range L2... 2nd measurement range L3, L4, L5... Mechanical operation Distance PCL... Optical cutting line AX... Optical axis HM... Half mirror DP... Dichroic prism Lr... Red line light Lb... Blue line light BW... Beam waist PCL1, PCL2... Optical cutting line 10... Light irradiation unit 13... Illumination optical system 20 ... Imaging optical system 30... 1st imaging part 40... 2nd imaging part 100, 100A, 100B, 200, 200A, 200B, 200C, 200D, 200E... Sensor unit 300... Shape measuring device 341... Control part 400... Structure manufacture system

Claims (9)

A shape measuring device for measuring the shape of the surface of a test object,
On the surface of the test object, a first measuring optical system you projected along the first line light having a first beam waist in the projection direction,
Wherein the surface of the test object, a second a second line beam having a beam waist, the second measuring optical system you projecting through the same optical axis and the first line of light along the projection direction,
An imaging unit for capturing an image of the line light projected by the first measurement optical system and the second measurement optical system;
A control unit that calculates the shape of the surface of the object based on the image captured by the image capturing unit,
The first beam waist and the second beam waist have different positions on the optical axis,
In the imaging unit, a region for capturing an image of the first line light from the first measurement optical system and a region for capturing an image of the second line light from the second measurement optical system have different shapes. measuring device. Said second measuring optical system share a least a portion of the optical system and the first measuring optical system, the shape measuring apparatus according to claim 1. The shape measuring apparatus according to claim 1, wherein the focus position of the first measurement optical system is different from the focus position of the second measurement optical system. The wavelength of the first line light from the first measuring optical system, different from the second wavelength of line light from the second measuring optical system, according to any one of claims 1 to 3 Shape measuring device. 5. The image pickup unit according to claim 1 , wherein the image pickup unit includes a first image pickup unit that picks up an image of the first line light and a second image pickup unit that picks up an image of the second line light. The shape measuring device according to the item. It said first line light from the first measuring optical system, the second measurement and the second line light from the optical system, switched projected, claimed in any one of claims 5 Shape measuring device. The shape according to any one of claims 1 to 5, wherein the first line light from the first measurement optical system and the second line light from the second measurement optical system are simultaneously projected. measuring device. A design device that creates design information about the shape of the structure,
A molding apparatus for manufacturing the structure based on the design information,
A shape measuring device according to any one of claims 1 to 7, which measures the shape of the produced structure,
An inspection device that compares the shape information and the design information related to the shape of the structure obtained by the shape measuring device,
Structure manufacturing system including. A method for measuring the shape of the surface of a test object,
Projecting a first line of light from a first measuring optical system along a projection direction onto the surface of the test object;
And said the surface of the test object, the second line of light from the second measuring optical system, for projecting through the same optical axis as the first line of light along the projection direction,
Capturing an image of line light projected by the first measurement optical system and the second measurement optical system;
Calculating the shape of the surface of the test object based on the captured image,
The first beam waist of the first line light and the second beam waist of the second line light have different positions on the optical axis,
In capturing the image of the line light, a region for capturing the image of the first line light from the first measurement optical system and a region for capturing the image of the second line light from the second measurement optical system. A method of measuring the shape of the surface of the test object, which is different.

Images