JP5198336B2 - Resin injection molding method - Google Patents

Resin injection molding method Download PDF

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Publication number
JP5198336B2
JP5198336B2 JP2009073983A JP2009073983A JP5198336B2 JP 5198336 B2 JP5198336 B2 JP 5198336B2 JP 2009073983 A JP2009073983 A JP 2009073983A JP 2009073983 A JP2009073983 A JP 2009073983A JP 5198336 B2 JP5198336 B2 JP 5198336B2
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mold
movable mold
fixed mold
base material
resin injection
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JP2010221642A (en
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洋一 石丸
康己 宮下
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Toyota Industries Corp
Toyota Motor Corp
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Toyota Motor Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28Shaping operations therefor
    • B29C70/40Shaping or impregnating by compression not applied
    • B29C70/42Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
    • B29C70/46Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
    • B29C70/48Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs and impregnating the reinforcements in the closed mould, e.g. resin transfer moulding [RTM], e.g. by vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28Shaping operations therefor
    • B29C70/40Shaping or impregnating by compression not applied
    • B29C70/42Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
    • B29C70/46Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
    • B29C70/467Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs and impregnating the reinforcements during mould closing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

本発明は、樹脂注入成形方法に関し、より詳しくは、レジントランスファーモールディング(Resin Transfer Molding、以下、RTMとする)成形方法における成形品の品質を向上させる技術に関する。   The present invention relates to a resin injection molding method, and more particularly to a technique for improving the quality of a molded product in a resin transfer molding (hereinafter referred to as RTM) molding method.

従来、車両等の構造部材や部品用として使用される繊維強化プラスチック(Fiber Reinforced Plastics、以下、FRPとする)等の樹脂製品を成形するために、RTM成形方法が用いられている(例えば、特許文献1、特許文献2)。RTM成形方法は、型内に強化繊維である基材を載置し、この型内に熱硬化性の樹脂を注入して前記基材に含浸させた後、加熱硬化させて複合成形材を得る方法である。   Conventionally, an RTM molding method has been used to mold resin products such as fiber reinforced plastics (hereinafter referred to as FRP) used for structural members and parts of vehicles and the like (for example, patents). Literature 1, Patent Literature 2). In the RTM molding method, a base material, which is a reinforcing fiber, is placed in a mold, a thermosetting resin is injected into the mold and impregnated in the base material, and then heat-cured to obtain a composite molding material. Is the method.

特開平8−323870号公報JP-A-8-323870 特開2005−271551号公報JP 2005-271551 A

前記特許文献1に記載の技術によれば、密閉した型内に基材を配置した後に熱硬化性の樹脂を注入する構成としている。このため、樹脂の注入速度を速めるためには、樹脂の粘度を下げた上で注入圧を上げる必要があるが、これによって基材の配置が乱れたり、成形品の表面にしわが入ったりする場合があった。   According to the technique described in Patent Document 1, a thermosetting resin is injected after a substrate is placed in a closed mold. For this reason, in order to increase the injection speed of the resin, it is necessary to increase the injection pressure after lowering the viscosity of the resin, but this may disturb the arrangement of the base material or wrinkles the surface of the molded product was there.

また、前記特許文献2に記載の技術によれば、開いている成形空間に基材と樹脂を投入し、型閉じに応じて樹脂を成形キャビティ内で基材の表面に展開させ、その後の型閉じによって樹脂を基材に含浸させる構成としている。しかし、型と基材との間に隙間があるために、樹脂を含んだ基材が型に押されて移動する場合があった。また、このような基材の移動によって樹脂が周辺に押し出され、樹脂を含んでいなかった基材の部分で繊維の乱れが発生することがあった。さらに、大気圧下で樹脂を注入する構成としている場合は、樹脂の染み込んだ基材の内部に気泡が入り込むことがあり、その後成形キャビティ内を負圧状態としても気泡を除去することが困難であった。   Further, according to the technique described in Patent Document 2, the base material and the resin are put into the open molding space, and the resin is developed on the surface of the base material in the molding cavity in accordance with the mold closing, and the subsequent mold The substrate is impregnated with the resin by closing. However, since there is a gap between the mold and the base material, the base material containing the resin may be pushed and moved by the mold. Further, the resin is pushed out to the periphery by such movement of the base material, and fiber disturbance may occur in the part of the base material that does not contain the resin. Furthermore, if the resin is injected under atmospheric pressure, bubbles may enter the base material soaked in the resin, and it is difficult to remove the bubbles even if the molding cavity is in a negative pressure state. there were.

そこで本発明は上記現状に鑑み、RTM成形の際に、樹脂の注入速度を下げずに基材の移動や成形品の表面のしわを防止することによって、成形品の品質を向上させることができる、樹脂注入成形方法を提供するものである。   Therefore, in view of the above situation, the present invention can improve the quality of a molded product by preventing the movement of the base material and the surface of the molded product from wrinkling without lowering the resin injection speed during RTM molding. The present invention provides a resin injection molding method.

本発明の解決しようとする課題は以上の如くであり、次にこの課題を解決するための手段を説明する。   The problem to be solved by the present invention is as described above. Next, means for solving the problem will be described.

即ち、請求項1においては、固定型と、前記固定型に対向して配設され、前記固定型に対して近接離間可能に構成される可動型と、前記固定型に対する前記可動型の位置を制御する制御装置と、前記固定型と前記可動型の間に基材を配置した状態で樹脂を注入する樹脂注入装置と、を備える樹脂注入成形装置で行われる樹脂注入成形方法であって、前記固定型に前記基材を配置する、基材配置工程と、前記基材配置工程の後に、前記可動型と前記固定型との間隔が、前記基材の大気中での見かけ厚さより小さく、かつ、予め設定された成型品の成形厚さより大きくなるまで、前記可動型を前記固定型に近接させる、近接工程と、前記近接工程の後に、前記樹脂注入装置で前記固定型と前記可動型の間に樹脂を注入する、樹脂注入工程と、前記樹脂注入工程の後に、前記可動型と前記固定型との間隔が、前記成形厚さとなるまで前記可動型を近接させて成形品を成形する、成形工程と、を備えるものである。   That is, according to the first aspect, the fixed mold, the movable mold arranged to face the fixed mold and configured to be able to approach and separate from the fixed mold, and the position of the movable mold with respect to the fixed mold are set. A resin injection molding method performed by a resin injection molding apparatus comprising: a control device for controlling; and a resin injection device for injecting resin in a state where a base material is disposed between the fixed mold and the movable mold, The base material is disposed on a stationary mold, and after the base material placing process, the distance between the movable mold and the stationary mold is smaller than the apparent thickness of the base material in the atmosphere, and The movable mold is brought close to the fixed mold until it becomes larger than a molding thickness set in advance, and after the proximity process, between the fixed mold and the movable mold by the resin injection device Injecting resin into the resin injecting step, After fat injection process, the distance between the movable die and the stationary die is the until the molding thickness is close to the movable die for molding the molded product, those comprising a molding step.

請求項2においては、前記樹脂注入成形装置に、前記固定型と前記可動型の少なくとも何れか一方に配設され、前記可動型が前記固定型に近接する際に、前記可動型と前記固定型とが当接する以前に対向する前記可動型側又は前記固定型側に当接し、前記固定型と前記可動型の間の気密状態を保持するシール構造と、前記シール構造により前記固定型と前記可動型の間の気密状態が保持されている最中に、前記固定型と前記可動型の間を減圧する減圧装置と、を備え、前記近接工程では、前記可動型を前記固定型に近接させ、前記シール構造を前記可動型側又は前記固定型側に当接させることにより前記固定型と前記可動型の間を気密状態にし、前記近接工程の後で前記樹脂注入工程の前に、前記減圧装置で前記固定型と前記可動型の間を減圧する、減圧工程を備えるものである。   3. The resin injection molding apparatus according to claim 2, wherein the movable mold and the fixed mold are disposed in at least one of the fixed mold and the movable mold when the movable mold approaches the fixed mold. A seal structure that abuts against the movable mold side or the fixed mold side facing each other before the abutment, and maintains an airtight state between the fixed mold and the movable mold, and the fixed mold and the movable mold by the seal structure A pressure reducing device for reducing the pressure between the fixed mold and the movable mold while the airtight state between the molds is maintained, and in the proximity step, the movable mold is brought close to the fixed mold, By bringing the seal structure into contact with the movable mold side or the fixed mold side, the space between the fixed mold and the movable mold is brought into an airtight state, and the pressure reducing device is disposed after the proximity process and before the resin injection process. To reduce the space between the fixed mold and the movable mold. To, those with a vacuum process.

請求項3においては、前記基材は繊維材にて構成され、前記基材の大気中での見かけ厚さが、予め設定された前記成形厚さの1.4倍以上であって、前記近接工程では、前記基材の、前記可動型と前記固定型との間に形成される空間に対する、繊維体積比率が35%以上になるまで、前記可動型を前記固定型に近接させるものである。   In Claim 3, the said base material is comprised with a fiber material, and the apparent thickness in the air | atmosphere of the said base material is 1.4 times or more of the said shaping | molding thickness set beforehand, Comprising: The said proximity | contact In the step, the movable mold is brought close to the fixed mold until a fiber volume ratio of the base material to a space formed between the movable mold and the fixed mold becomes 35% or more.

請求項4においては、前記基材は繊維材にて構成され、前記基材の大気中での見かけ厚さが3.7mm〜4.1mmの範囲内であり、かつ、予め設定された前記成形厚さが2.5mm〜2.9mmの範囲内であって、前記近接工程では、前記基材の、前記可動型と前記固定型との間に形成される空間に対する、繊維体積比率が35%以上になるまで、前記可動型を前記固定型に近接させるものである。   In Claim 4, the said base material is comprised with the fiber material, and the apparent thickness in the air | atmosphere of the said base material exists in the range of 3.7 mm-4.1 mm, and the said shaping | molding preset The thickness is in the range of 2.5 mm to 2.9 mm, and in the proximity step, the fiber volume ratio of the base material to the space formed between the movable mold and the fixed mold is 35%. Until the above, the movable mold is brought close to the fixed mold.

本発明の効果として、以下に示すような効果を奏する。   As effects of the present invention, the following effects can be obtained.

本発明により、RTM成形の際に、樹脂の注入速度を下げずに基材の移動や成形品の表面のしわを防止することによって、成形品の品質を向上させることができる。   According to the present invention, the quality of a molded product can be improved by preventing the movement of the base material and the surface of the molded product from wrinkling without lowering the resin injection rate during RTM molding.

本発明に係る樹脂注入成形方法を行う樹脂注入成形装置を示した概略図。Schematic which showed the resin injection molding apparatus which performs the resin injection molding method which concerns on this invention. 本発明に係る樹脂注入成形方法のフローチャートついて示した図。The figure shown about the flowchart of the resin injection molding method which concerns on this invention. 本発明に係る樹脂注入成形方法における基材配置工程について示した図。The figure shown about the base material arrangement | positioning process in the resin injection molding method which concerns on this invention. 同じく近接工程について示した図。The figure similarly shown about the proximity | contact process. 同じく減圧工程について示した図。The figure similarly shown about the pressure reduction process. 同じく樹脂注入工程について示した図。The figure similarly shown about the resin injection | pouring process. 同じく成形工程について示した図。The figure similarly shown about the formation process.

次に、発明の実施の形態を説明する。
なお、本発明の技術的範囲は以下の実施例に限定されるものではなく、本明細書及び図面に記載した事項から明らかになる本発明が真に意図する技術的思想の範囲全体に、広く及ぶものである。
Next, embodiments of the invention will be described.
It should be noted that the technical scope of the present invention is not limited to the following examples, but broadly covers the entire scope of the technical idea that the present invention truly intends, as will be apparent from the matters described in the present specification and drawings. It extends.

[樹脂注入成形装置10]
まず始めに、本発明に係る樹脂注入成形方法を行う樹脂注入成形装置について、図1を用いて説明をする。
図1に示す如く、RTM成形を行う樹脂注入成形装置10は、金属製の固定型11と、前記固定型11に対向して配設され、前記固定型11に対して近接離間可能に構成される金属製の可動型12と、前記固定型11に対する前記可動型12の位置を制御する制御装置21とを備える。
[Resin injection molding apparatus 10]
First, a resin injection molding apparatus that performs the resin injection molding method according to the present invention will be described with reference to FIG.
As shown in FIG. 1, a resin injection molding apparatus 10 that performs RTM molding is arranged so as to face a metal fixed mold 11 and the fixed mold 11, and can be moved close to and away from the fixed mold 11. And a control device 21 for controlling the position of the movable mold 12 with respect to the fixed mold 11.

具体的には、前記固定型11及び前記可動型12はプレス機に配設されており、前記可動型12には電動シリンダ等で構成されるアクチュエータ22が連結され、該アクチュエータ22は制御装置21と電気的に接続されているのである。そして、前記アクチュエータ22は制御装置21から送られる制御信号に基づいて、前記可動型12を前記固定型11に対して近接離間させるように構成されているのである。即ち、前記制御装置21は、前記アクチュエータ22を介して前記可動型12を前記固定型11に対して近接離間するように平行移動させ、又は静止させることにより、前記固定型11に対する前記可動型12の位置を制御するのである。   Specifically, the fixed mold 11 and the movable mold 12 are arranged in a press machine, and an actuator 22 composed of an electric cylinder or the like is connected to the movable mold 12, and the actuator 22 is a control device 21. Are electrically connected to each other. The actuator 22 is configured to move the movable mold 12 close to and away from the fixed mold 11 based on a control signal sent from the control device 21. That is, the control device 21 translates the movable mold 12 so as to be close to and away from the fixed mold 11 via the actuator 22 or stops the movable mold 12 with respect to the fixed mold 11. Is controlled.

本実施形態においては図1に示す如く、前記固定型11及び前記可動型12は、周縁部が突出した平板状に形成されるとともに、突出した前記周縁部が互いに対向するように配設されている。そして、前記可動型12が前記固定型11に向かって接近し、図7に示す如くそれぞれの前記周縁部が当接した際に、固定型11と可動型12との間にキャビティが形成されるのである。
なお、前記固定型11及び前記可動型12の形状、即ち前記固定型11と可動型12とが当接したときに両者の間に形成される空間である前記キャビティの形状は、樹脂注入成形方法で成形する成形品の形状に対応して形成することが可能であり、本実施形態の形状に限定されるものではない。
In the present embodiment, as shown in FIG. 1, the fixed mold 11 and the movable mold 12 are formed in a flat plate shape with protruding peripheral edges, and are arranged so that the protruding peripheral edges face each other. Yes. A cavity is formed between the fixed mold 11 and the movable mold 12 when the movable mold 12 approaches the fixed mold 11 and the respective peripheral edge portions contact each other as shown in FIG. It is.
The shape of the fixed mold 11 and the movable mold 12, that is, the shape of the cavity, which is a space formed between the fixed mold 11 and the movable mold 12 when they abut, is a resin injection molding method. It can be formed corresponding to the shape of the molded product to be molded with, and is not limited to the shape of this embodiment.

また、樹脂注入成形装置10は、前記可動型12に配設されて、前記可動型12が前記固定型11に近接する際に前記可動型12と前記固定型11とが当接するよりも以前に前記固定型11に当接し、前記固定型11と前記可動型12の間の気密状態を保持するシール構造として、シール部材15を備える。   Further, the resin injection molding apparatus 10 is disposed in the movable mold 12 and before the movable mold 12 and the fixed mold 11 come into contact with each other when the movable mold 12 approaches the fixed mold 11. A seal member 15 is provided as a seal structure that contacts the fixed mold 11 and maintains an airtight state between the fixed mold 11 and the movable mold 12.

具体的には、合成樹脂等の弾性素材で形成された環状のシール部材15が、前記可動型12の周縁部に沿って、前記固定型11の側に突出して配設されているのである。そして、図4に示す如く、前記可動型12が前記固定型11に近接する際は、前記可動型12と前記固定型11とが当接するよりも以前に前記シール部材15が前記固定型11の周縁部に当接するのである。このように構成されたシール構造により、前記可動型12が前記固定型11に当接する以前であっても、前記固定型11と前記可動型12の間の気密状態を保持することが可能となるのである。なお、前記シール部材15は前記固定型11に、又は、前記可動型12と前記固定型11の双方に配設される構成でもよく、即ち、前記可動型12と前記固定型11の少なくとも何れか一方に配設される構成であればよい。   Specifically, an annular seal member 15 formed of an elastic material such as a synthetic resin is disposed so as to protrude toward the stationary mold 11 along the peripheral edge of the movable mold 12. As shown in FIG. 4, when the movable mold 12 is close to the fixed mold 11, the seal member 15 is attached to the fixed mold 11 before the movable mold 12 contacts the fixed mold 11. It abuts on the peripheral edge. With the seal structure configured as described above, it is possible to maintain an airtight state between the fixed mold 11 and the movable mold 12 even before the movable mold 12 comes into contact with the fixed mold 11. It is. The seal member 15 may be arranged on the fixed mold 11 or on both the movable mold 12 and the fixed mold 11, that is, at least one of the movable mold 12 and the fixed mold 11. Any configuration may be used as long as it is arranged on one side.

また、樹脂注入成形装置10は、前記シール部材15により前記固定型11と前記可動型12の間の気密状態が保持されている最中に、前記固定型11と前記可動型12の間を減圧する減圧装置31を備える。   Further, the resin injection molding apparatus 10 reduces the pressure between the fixed mold 11 and the movable mold 12 while the sealing member 15 is maintaining the airtight state between the fixed mold 11 and the movable mold 12. A pressure reducing device 31 is provided.

具体的には、前記可動型12には吸入口部17が配設されており、該吸入口部17は吸引ポンプ等で構成される減圧装置31に連通されているのである。そして、図5に示す如く前記シール部材15が前記固定型11の周縁部に当接し、前記固定型11と前記可動型12の間の気密状態が保持されている最中に、前記減圧装置31が前記固定型11と前記可動型12の間の空気を吸引することにより、前記固定型11と前記可動型12の間を減圧するのである。   Specifically, the movable mold 12 is provided with a suction port portion 17, and the suction port portion 17 communicates with a decompression device 31 constituted by a suction pump or the like. Then, as shown in FIG. 5, the pressure reducing device 31 is in a state where the seal member 15 is in contact with the peripheral edge of the fixed mold 11 and the airtight state between the fixed mold 11 and the movable mold 12 is maintained. The pressure between the fixed mold 11 and the movable mold 12 is reduced by sucking the air between the fixed mold 11 and the movable mold 12.

また、樹脂注入成形装置10は、前記固定型11と前記可動型12の間に樹脂を注入する樹脂注入装置41を備える。   In addition, the resin injection molding apparatus 10 includes a resin injection apparatus 41 that injects a resin between the fixed mold 11 and the movable mold 12.

具体的には、前記可動型12にはバルブ19を備える樹脂注入口部18が配設されており、該樹脂注入口部18は熱硬化性の樹脂が充填された混合注入機である樹脂注入装置41に連通されている。前記樹脂は、例えばエポキシ樹脂であり、注入が行われる以前に真空脱泡されている。そして、前記固定型11と前記可動型12の間が減圧された後にバルブ19を開き、図6に示す如く樹脂注入装置41から前記固定型11と前記可動型12の間に樹脂が注入されるように構成されているのである。
前記樹脂注入成形装置10においては、FRP等の複合成形材にて構成される樹脂製品を成形する場合は、後述するよう前記固定型11と前記可動型12の間(型内)に繊維材などにて構成される基材Pを載置した状態で、この型内への樹脂の注入が行われる。
なお、前記可動型12と前記固定型11の何れか一方に、樹脂排出口を開口し、余分な樹脂を樹脂排出口から排出する構成にすることも可能である。
Specifically, the movable mold 12 is provided with a resin injection port portion 18 provided with a valve 19, and the resin injection port portion 18 is a resin injection device filled with a thermosetting resin. It communicates with the device 41. The resin is, for example, an epoxy resin, and is degassed before being injected. Then, after the pressure between the fixed mold 11 and the movable mold 12 is reduced, the valve 19 is opened, and resin is injected between the fixed mold 11 and the movable mold 12 from the resin injection device 41 as shown in FIG. It is configured as follows.
In the resin injection molding apparatus 10, when molding a resin product composed of a composite molding material such as FRP, a fiber material or the like is provided between the fixed mold 11 and the movable mold 12 (inside the mold) as will be described later. The resin is injected into the mold in a state where the base material P constituted by is placed.
In addition, it is also possible to employ a configuration in which a resin discharge port is opened in one of the movable mold 12 and the fixed mold 11 and excess resin is discharged from the resin discharge port.

[樹脂注入成形方法]
上記の如く構成された樹脂注入成形装置10で行われる樹脂注入成形方法について、図2から図7を用いて説明する。なお、図3以降については、前記制御装置21、アクチュエータ22、減圧装置31、及び樹脂注入装置41は図示を省略する。
本発明に係る樹脂注入成形方法は図2に示す如く、前記固定型11に基材Pを配置する、基材配置工程(ステップS1)と、前記基材配置工程の後に、前記可動型12と前記固定型11との間隔H1が、前記基材Pの大気中での見かけ厚さHpより小さく、かつ、予め設定された成形厚さHmより大きくなるまで、前記可動型12を前記固定型11に近接させ、前記固定型11と前記可動型12の間を気密状態にする、近接工程(ステップS2)と、前記近接工程の後に、前記減圧装置31で前記固定型11と前記可動型12の間を減圧する、減圧工程(ステップS3)と、前記減圧工程の後に、前記樹脂注入装置41で前記固定型11と前記可動型12の間に樹脂を注入する、樹脂注入工程(ステップS4)と、前記樹脂注入工程の後に、前記可動型12と前記固定型11との間隔H1が、前記成形厚さHmとなるまで前記可動型12を近接させて成形品を成形する、成形工程(ステップS5)と、を備える。
[Resin injection molding method]
A resin injection molding method performed by the resin injection molding apparatus 10 configured as described above will be described with reference to FIGS. 3 and subsequent figures, the control device 21, the actuator 22, the decompression device 31, and the resin injection device 41 are not shown.
As shown in FIG. 2, the resin injection molding method according to the present invention includes a base material placement step (step S1) in which a base material P is placed on the fixed die 11, and the movable die 12 after the base material placement step. The movable mold 12 is fixed to the fixed mold 11 until the distance H1 from the fixed mold 11 is smaller than the apparent thickness Hp of the base material P in the atmosphere and larger than a preset molding thickness Hm. And the proximity mold (step S2) for making the space between the fixed mold 11 and the movable mold 12 airtight, and after the proximity process, the decompression device 31 is used to connect the fixed mold 11 and the movable mold 12 to each other. A pressure reducing step (step S3) for reducing the pressure, and a resin injecting step (step S4) for injecting a resin between the fixed mold 11 and the movable mold 12 by the resin injection device 41 after the pressure reducing process. After the resin injection step, Serial spacing H1 between the movable mold 12 and the fixed mold 11, the until the molding thickness Hm is close to the movable mold 12 for molding the molded product, comprising a forming step (step S5), and the.

上記の樹脂注入成形方法について、各ステップについて詳細に説明する。
本発明に係る樹脂注入成形方法においてはまず、図3に示す如く、固定型11において前記キャビティを形成する部分に基材Pを配置する(基材配置工程・ステップS1)。前記基材Pは成形品であるFRP等の強化材として機能する、高強度・高弾性率繊維(例えば直交2軸布の高強度炭素繊維)の集合体であり、その内部の空隙部分に熱硬化性の樹脂が含浸するように形成されている。
The above-described resin injection molding method will be described in detail for each step.
In the resin injection molding method according to the present invention, first, as shown in FIG. 3, the base material P is placed in the portion where the cavity is formed in the fixed mold 11 (base material placement step / step S <b> 1). The base material P is an aggregate of high-strength and high-modulus fibers (for example, high-strength carbon fibers of an orthogonal biaxial cloth) that function as a reinforcing material such as FRP that is a molded product. It is formed so as to be impregnated with a curable resin.

また、前記基材Pは上記の如く繊維の集合体であるため、図3中に示す大気中での見かけ厚さHpは、予め設定されている成形厚さHm(図7参照)よりも大きい。換言すれば前記基材Pは、後述するように前記固定型11と前記可動型12とに押し挟まれることにより、大気中での見かけ厚さHpから前記可動型12の近接方向に厚みが縮められて、最終的には予め設定されている成形厚さHmとなるように成形が行われるのである。   Moreover, since the base material P is an aggregate of fibers as described above, the apparent thickness Hp in the atmosphere shown in FIG. 3 is larger than a preset molding thickness Hm (see FIG. 7). . In other words, the base material P is pressed between the fixed mold 11 and the movable mold 12 as will be described later, so that the apparent thickness Hp in the atmosphere is reduced in the proximity direction of the movable mold 12. As a result, the molding is finally performed so as to have a preset molding thickness Hm.

次に、図4に示す如く、前記可動型12と前記固定型11との間隔H1が、前記基材Pの大気中での見かけ厚さHpより小さく、かつ、予め設定された成形厚さHmより大きくなるまで、前記可動型12を前記固定型11に近接させる(近接工程・ステップS2)。即ち、前記制御装置21で、前記固定型11に対する前記可動型12の位置を制御し、前記可動型12を図4中矢印Aの方向に平行移動させ、前記可動型12と前記固定型11との間隔H1が上記の範囲となる位置で静止させるのである。ここで、前記間隔H1は前記見かけ厚さHpよりも小さいため、前記可動型12が前記基材Pに当接する。即ち、前記基材Pは前記固定型11と前記可動型12とに押し挟まれて、大気中での見かけ厚さHpから前記可動型12の近接方向に厚みが縮められて、前記可動型12と前記固定型11との間隔H1と同じ幅となるのである。
またこの際には、図4に示す如く、前記シール部材15が前記固定型11の周縁部に当接するため、前記固定型11と前記可動型12の間が気密状態となるのである。
Next, as shown in FIG. 4, the distance H1 between the movable mold 12 and the fixed mold 11 is smaller than the apparent thickness Hp of the base material P in the atmosphere, and the molding thickness Hm is set in advance. The movable mold 12 is brought close to the fixed mold 11 until it becomes larger (proximity step / step S2). That is, the control device 21 controls the position of the movable mold 12 with respect to the fixed mold 11 and translates the movable mold 12 in the direction of arrow A in FIG. Is stopped at a position where the interval H1 falls within the above range. Here, since the interval H1 is smaller than the apparent thickness Hp, the movable mold 12 comes into contact with the substrate P. That is, the base material P is pressed between the fixed mold 11 and the movable mold 12, and the thickness is reduced in the proximity direction of the movable mold 12 from the apparent thickness Hp in the atmosphere. And the width H1 between the fixed mold 11 and the fixed mold 11.
At this time, as shown in FIG. 4, the seal member 15 contacts the peripheral edge of the fixed mold 11, so that the space between the fixed mold 11 and the movable mold 12 is airtight.

なお、後述する本願出願人の実験結果に示す如く、前記基材Pの大気中での見かけ厚さが3.7mm〜4.1mmの範囲内であり、かつ、予め設定された成形厚さが2.5mm〜2.9mmの範囲内である場合は、本工程において、前記基材Pの前記可動型12と前記固定型11との間に形成される空間に対する繊維体積比率が35%以上になるまで、前記可動型12を前記固定型11に近接させることが望ましい。ただし、前記基材Pの種類や成形品の大きさによっては、最適な前記繊維体積比率は異なる。
また、上記の場合において、前記可動型12と前記固定型11との間隔H1が、予め設定された成形厚さHmとなったときの前記繊維体積比率は55%程度であるため、本工程において、繊維体積比率が55%程度にまで前記可動型12を前記固定型11に近接させるのは望ましくない。
In addition, as shown in the experiment result of the applicant of the present invention described later, the apparent thickness of the base material P in the atmosphere is in a range of 3.7 mm to 4.1 mm, and a preset molding thickness is set. When it is within the range of 2.5 mm to 2.9 mm, in this step, the fiber volume ratio to the space formed between the movable mold 12 and the fixed mold 11 of the substrate P is 35% or more. Until this occurs, it is desirable that the movable mold 12 be brought close to the fixed mold 11. However, the optimal fiber volume ratio varies depending on the type of the substrate P and the size of the molded product.
In the above case, since the fiber volume ratio is about 55% when the distance H1 between the movable mold 12 and the fixed mold 11 reaches a preset molding thickness Hm, in this step It is not desirable to bring the movable mold 12 close to the fixed mold 11 until the fiber volume ratio is about 55%.

次に、図5に示す如く、前記減圧装置31で前記固定型11と前記可動型12の間を減圧する(減圧工程・ステップS3)。即ち、前記固定型11と前記可動型12の間の空気を、前記減圧装置31で前記吸入口部17から図5中矢印Bの方向に吸引するのである。この際、前記の如く前記シール部材15により前記固定型11と前記可動型12の間は気密状態となっているため、前記固定型11と前記可動型12の間は略真空状態となる。   Next, as shown in FIG. 5, the pressure reducing device 31 reduces the pressure between the fixed mold 11 and the movable mold 12 (pressure reducing step / step S3). That is, the air between the fixed mold 11 and the movable mold 12 is sucked in the direction of the arrow B in FIG. At this time, since the sealing member 15 is airtight between the fixed mold 11 and the movable mold 12 as described above, the space between the fixed mold 11 and the movable mold 12 is substantially vacuum.

次に、図6に示す如く、前記樹脂注入装置41で前記固定型11と前記可動型12の間に樹脂を注入する(樹脂注入工程・ステップS4)。即ち、前記の如く、樹脂注入口部18に備えられたバルブ19を開くことにより、樹脂注入装置41に充填された熱硬化性の樹脂が前記固定型11と前記可動型12の間に、即ち図6中矢印Cの方向に注入されるのである。ここで、前記樹脂及び前記固定型11、前記可動型12は、樹脂が基材Pの周囲及び内部を流動できる程度に温度設定されている。   Next, as shown in FIG. 6, a resin is injected between the fixed mold 11 and the movable mold 12 by the resin injection device 41 (resin injection step, step S4). That is, as described above, by opening the valve 19 provided in the resin injection port portion 18, the thermosetting resin filled in the resin injection device 41 is placed between the fixed mold 11 and the movable mold 12, that is, It is injected in the direction of arrow C in FIG. Here, the temperature of the resin and the fixed mold 11 and the movable mold 12 is set so that the resin can flow around and inside the substrate P.

図6及び図7においては、基材Pのうち、濃く網掛けをした部分は樹脂が含浸した部分を、濃く網掛けをしていない部分は樹脂が含浸していない部分を示す。
本実施形態においては、前記の如く前記固定型11と前記可動型12の間は略真空状態となっているため、前記樹脂は負圧により前記固定型11と前記可動型12の間に吸引される。さらに、樹脂の注入時には、前記基材Pの厚みは前記可動型12と前記固定型11との間隔H1であって成形厚さHmよりも大きく、前記基材Pの繊維密度が成形後よりも低いため、樹脂の流動抵抗を低下させることができ、樹脂を素早く前記固定型11と前記可動型12の間に注入することが可能となるのである。
また、前記固定型11と前記可動型12の間は略真空状態となっているため、樹脂の染み込んだ基材Pの内部に気泡が入り込むことがないのである。
In FIGS. 6 and 7, in the base material P, the darkly shaded portion indicates the portion impregnated with the resin, and the darkly shaded portion indicates the portion not impregnated with the resin.
In this embodiment, since the fixed mold 11 and the movable mold 12 are in a substantially vacuum state as described above, the resin is sucked between the fixed mold 11 and the movable mold 12 by negative pressure. The Further, at the time of injecting the resin, the thickness of the base material P is the distance H1 between the movable mold 12 and the fixed mold 11 and larger than the molding thickness Hm, and the fiber density of the base material P is higher than that after molding. Since it is low, the flow resistance of the resin can be reduced, and the resin can be quickly injected between the fixed mold 11 and the movable mold 12.
Further, since the space between the fixed mold 11 and the movable mold 12 is in a substantially vacuum state, bubbles do not enter the inside of the base material P soaked with resin.

さらに、前記の如く、基材Pは前記固定型11と前記可動型12とに押し挟まれ、前記可動型12の近接方向に幅が縮められて配設されている。即ち、前記基材Pと前記固定型11及び前記可動型12との間には摩擦力が作用し、前記基材Pは前記可動型12の近接方向に直交する方向への自由度が規制されているのである。このため、本実施形態の如く樹脂が素早く注入された場合でも、基材Pが移動したり、配置が乱れたりするのを防ぐことができるのである。   Further, as described above, the base material P is pressed between the fixed mold 11 and the movable mold 12 and is disposed with a reduced width in the proximity direction of the movable mold 12. That is, a frictional force acts between the base P and the fixed mold 11 and the movable mold 12, and the degree of freedom of the base P in the direction perpendicular to the proximity direction of the movable mold 12 is restricted. -ing For this reason, even when the resin is quickly injected as in the present embodiment, it is possible to prevent the base material P from moving or the arrangement from being disturbed.

次に、図7に示す如く、前記可動型12と前記固定型11との間隔H1が、前記成形厚さHmとなるまで前記可動型12を近接させて成形品を成形する(成形工程・ステップS5)。即ち、前記可動型12の図7中矢印Dの方向への近接によって、基材Pが圧縮されるのと同時に、前記樹脂が前記固定型11と前記可動型12との間に形成されるキャビティ内に全体的かつ均一に広げられるのである。
この際、前記樹脂注入工程において既に樹脂が基材Pの広い部分に広がっているため、キャビティ内に全体的に広げるための流動抵抗を小さくすることができる。また、大きな流動抵抗によって基材Pが押されることがないため、成形品におけるしわの発生を防ぐことが可能となるのである。
その後、図示しない過熱装置で樹脂注入成形装置10の温度を上昇させ、又は、そのままの温度で、樹脂を硬化させた上で前記可動型12を前記固定型11から離間させ、成形品を取り出すのである。
Next, as shown in FIG. 7, the movable mold 12 is brought close to each other until the distance H1 between the movable mold 12 and the fixed mold 11 reaches the molding thickness Hm (molding process / step). S5). That is, when the movable mold 12 approaches in the direction of arrow D in FIG. 7, the substrate P is compressed, and at the same time, the resin is formed between the fixed mold 11 and the movable mold 12. It is spread throughout and uniformly within.
At this time, since the resin has already spread over a wide portion of the base material P in the resin injection step, the flow resistance for spreading the whole in the cavity can be reduced. Moreover, since the base material P is not pushed by a large flow resistance, it becomes possible to prevent the generation of wrinkles in the molded product.
Thereafter, the temperature of the resin injection molding device 10 is increased by an overheating device (not shown), or the resin is cured at the same temperature and then the movable mold 12 is separated from the fixed mold 11 and the molded product is taken out. is there.

本発明に係る樹脂注入成形方法によれば、以上のように構成することにより、RTM成形の際に樹脂の注入速度を下げずに基材Pの移動や成形品の表面のしわを防止することによって、成形品の品質を向上させることができる。   According to the resin injection molding method of the present invention, by configuring as described above, it is possible to prevent the movement of the base material P and the surface of the molded product from wrinkling without lowering the resin injection speed during RTM molding. Thus, the quality of the molded product can be improved.

具体的には、基材Pは前記固定型11と前記可動型12とに押し挟まれ、前記基材Pは前記可動型12の近接方向に直交する方向への自由度が規制されていることにより、本実施形態の如く樹脂が素早く注入された場合でも、基材Pが移動したり、配置が乱れたりするのを防ぐことができるのである。   Specifically, the base material P is sandwiched between the fixed mold 11 and the movable mold 12, and the degree of freedom of the base material P in the direction orthogonal to the proximity direction of the movable mold 12 is regulated. Thus, even when the resin is quickly injected as in the present embodiment, it is possible to prevent the base material P from moving or the arrangement from being disturbed.

また、樹脂注入工程の最中に樹脂を基材Pの広い部分に広げることができるため、キャビティ内に全体的に広げるための流動抵抗を小さくすることができ、基材Pにおける繊維の乱れや成形品におけるしわの発生を防ぐことが可能となるのである。   In addition, since the resin can be spread over a wide portion of the base material P during the resin injection process, the flow resistance for spreading the whole in the cavity can be reduced, and the fiber disturbance in the base material P can be reduced. It is possible to prevent the generation of wrinkles in the molded product.

なお、前記樹脂注入工程においては、前記樹脂注入装置41を射出機で構成し、該射出機で樹脂を射出することにより、前記樹脂を前記固定型11と前記可動型12の間に樹脂を注入する構成にすることも可能である。この場合にあっては、前記固定型11と前記可動型12の間が略真空状態となっていなくても、樹脂を前記固定型11と前記可動型12の間に注入することができるのである。   In the resin injection step, the resin injection device 41 is constituted by an injection machine, and the resin is injected between the fixed mold 11 and the movable mold 12 by injecting the resin with the injection machine. It is also possible to adopt a configuration to do so. In this case, the resin can be injected between the fixed mold 11 and the movable mold 12 even if the space between the fixed mold 11 and the movable mold 12 is not substantially in a vacuum state. .

加えて、樹脂注入工程において前記固定型11と前記可動型12の間を略真空状態にし、さらに前記基材Pの幅を前記可動型12と前記固定型11との間隔H1として成形厚さHmよりも大きくした場合は、樹脂を素早く前記固定型11と前記可動型12の間に注入することができるとともに、樹脂の染み込んだ基材Pの内部に気泡が入り込むのを防ぐことができるのである。
また、樹脂が基材Pに含浸しやすい構成としているため、樹脂を含浸しやすくするために樹脂注入口の数を増やす必要がないのである。
In addition, in the resin injecting step, the space between the fixed mold 11 and the movable mold 12 is set in a substantially vacuum state, and the width of the base material P is set as an interval H1 between the movable mold 12 and the fixed mold 11 to form a molding thickness Hm. In the case of larger than that, the resin can be quickly injected between the fixed mold 11 and the movable mold 12, and air bubbles can be prevented from entering the base material P infiltrated with the resin. .
Further, since the resin is easily impregnated into the substrate P, it is not necessary to increase the number of resin injection ports in order to facilitate the resin impregnation.

[実験結果]
次に、本発明に係る樹脂注入成形方法について、本願出願人が行った実験結果について説明する。
本実験では、上記の樹脂注入成形方法において、前記基材Pの大気中での見かけ厚さHpが3.9mm、予め設定された成形厚さHmが2.7mmの実験対象(即ち、基材Pの大気中での見かけ厚さHpが成形厚さHmの1.4倍以上である実験対象)について、前記可動型12と前記固定型11との間隔H1を3.8mmとした場合(前記基材Pの、前記可動型12と前記固定型11との間に形成される空間に対する、繊維体積比率は約35%)と、同じく間隔H1を4.5mmとした場合(同じく繊維体積比率は約25%)について、それぞれ同じ手順及び条件で実験を行った。
[Experimental result]
Next, the experimental results conducted by the applicant of the present application for the resin injection molding method according to the present invention will be described.
In this experiment, in the above-described resin injection molding method, an experimental object (that is, a base material P) in which the apparent thickness Hp in the atmosphere is 3.9 mm and a preset molding thickness Hm is 2.7 mm (that is, the base material). In the case where the distance H1 between the movable mold 12 and the fixed mold 11 is set to 3.8 mm for an experimental object in which the apparent thickness Hp of P in the atmosphere is 1.4 times or more the molding thickness Hm (see above) The fiber volume ratio with respect to the space formed between the movable mold 12 and the fixed mold 11 of the base material P is about 35%, and when the distance H1 is 4.5 mm (also the fiber volume ratio is About 25%) was conducted under the same procedure and conditions.

その結果、前記間隔H1を3.8mmとした場合は、成形品の表面にしわが発生しなかったのに対し、前記間隔H1を4.5mmとした場合は、成形品の表面にしわが発生した。
即ち、近接工程において、可動型12と固定型11との間隔H1が、基材Pの大気中での見かけ厚さHp=3.9mmより小さく、かつ、予め設定された成形厚さHm=2.7mmより大きいH1=3.8mmとなるまで(繊維体積比率が約35%となるまで)、可動型12を固定型11に近接させ、固定型11と可動型12の間に樹脂を注入した結果、成形品の表面のしわを防止することができ、成形品の品質を向上させることに成功したのである。
換言すれば、本発明に係る樹脂注入成形方法を実施することにより、RTM成形の際に樹脂の注入速度を下げずに基材Pの移動や成形品の表面のしわを防止することによって、成形品の品質が向上することが確認できたのである。
As a result, when the distance H1 was 3.8 mm, no wrinkles occurred on the surface of the molded product, whereas when the distance H1 was 4.5 mm, wrinkles occurred on the surface of the molded product.
That is, in the proximity process, the distance H1 between the movable mold 12 and the fixed mold 11 is smaller than the apparent thickness Hp = 3.9 mm of the base material P in the atmosphere, and a preset molding thickness Hm = 2. The movable mold 12 was brought close to the fixed mold 11 until H1 = 3.8 mm, which was larger than 0.7 mm (until the fiber volume ratio was about 35%), and the resin was injected between the fixed mold 11 and the movable mold 12. As a result, wrinkles on the surface of the molded product can be prevented, and the quality of the molded product has been successfully improved.
In other words, by carrying out the resin injection molding method according to the present invention, it is possible to prevent the movement of the substrate P and the surface of the molded product from wrinkling without lowering the resin injection speed during RTM molding. It was confirmed that the quality of the product was improved.

10 樹脂注入成形装置
11 固定型
12 可動型
15 シール部材
21 制御装置
31 減圧装置
41 樹脂注入装置
DESCRIPTION OF SYMBOLS 10 Resin injection molding apparatus 11 Fixed type 12 Movable type 15 Seal member 21 Control apparatus 31 Pressure reduction apparatus 41 Resin injection apparatus

Claims (4)

固定型と、
前記固定型に対向して配設され、前記固定型に対して近接離間可能に構成される可動型と、
前記固定型に対する前記可動型の位置を制御する制御装置と、
前記固定型と前記可動型の間に基材を配置した状態で樹脂を注入する樹脂注入装置と、を備える樹脂注入成形装置で行われる樹脂注入成形方法であって、
前記固定型に前記基材を配置する、基材配置工程と、
前記基材配置工程の後に、前記可動型と前記固定型との間隔が、前記基材の大気中での見かけ厚さより小さく、かつ、予め設定された成型品の成形厚さより大きくなるまで、前記可動型を前記固定型に近接させる、近接工程と、
前記近接工程の後に、前記樹脂注入装置で前記固定型と前記可動型の間に樹脂を注入する、樹脂注入工程と、
前記樹脂注入工程の後に、前記可動型と前記固定型との間隔が、前記成形厚さとなるまで前記可動型を近接させて成形品を成形する、成形工程と、を備える、
ことを特徴とする、樹脂注入成形方法。
Fixed type,
A movable mold that is arranged to face the fixed mold and is configured to be able to approach and separate from the fixed mold;
A control device for controlling the position of the movable mold with respect to the fixed mold;
A resin injection molding method performed by a resin injection molding apparatus comprising: a resin injection device that injects a resin in a state where a base material is disposed between the fixed mold and the movable mold;
A base material placement step of placing the base material on the fixed mold;
After the base material arranging step, until the distance between the movable mold and the fixed mold is smaller than the apparent thickness of the base material in the atmosphere and larger than the molding thickness of the preset molded product, A proximity process for bringing the movable mold close to the fixed mold;
A resin injection step of injecting a resin between the fixed mold and the movable mold by the resin injection device after the proximity step;
After the resin injection step, a molding step is performed in which the movable mold is brought close to the molding until the distance between the movable mold and the fixed mold reaches the molding thickness, and a molded product is formed.
A resin injection molding method.
前記樹脂注入成形装置に、
前記固定型と前記可動型の少なくとも何れか一方に配設され、前記可動型が前記固定型に近接する際に、前記可動型と前記固定型とが当接する以前に対向する前記可動型側又は前記固定型側に当接し、前記固定型と前記可動型の間の気密状態を保持するシール構造と、
前記シール構造により前記固定型と前記可動型の間の気密状態が保持されている最中に、前記固定型と前記可動型の間を減圧する減圧装置と、を備え、
前記近接工程では、前記可動型を前記固定型に近接させ、前記シール構造を前記可動型側又は前記固定型側に当接させることにより前記固定型と前記可動型の間を気密状態にし、
前記近接工程の後で前記樹脂注入工程の前に、前記減圧装置で前記固定型と前記可動型の間を減圧する、減圧工程を備える、
ことを特徴とする、請求項1に記載の樹脂注入成形方法。
In the resin injection molding device,
The movable mold is disposed on at least one of the fixed mold and the movable mold, and the movable mold is opposed to the movable mold when the movable mold approaches the fixed mold before the movable mold and the fixed mold come into contact with each other. A seal structure that contacts the fixed mold side and maintains an airtight state between the fixed mold and the movable mold;
A pressure reducing device that reduces the pressure between the fixed mold and the movable mold while the airtight state between the fixed mold and the movable mold is maintained by the seal structure;
In the proximity step, the movable mold is brought close to the fixed mold, and the seal structure is brought into contact with the movable mold side or the fixed mold side to make an airtight state between the fixed mold and the movable mold,
A pressure reducing step of reducing the pressure between the fixed mold and the movable mold with the pressure reducing device after the proximity step and before the resin injection step;
The resin injection molding method according to claim 1, wherein:
前記基材は繊維材にて構成され、
前記基材の大気中での見かけ厚さが、予め設定された前記成形厚さの1.4倍以上であって、
前記近接工程では、前記基材の、前記可動型と前記固定型との間に形成される空間に対する、繊維体積比率が35%以上になるまで、前記可動型を前記固定型に近接させる、
ことを特徴とする、請求項1又は請求項2に記載の樹脂注入成形方法。
The base material is composed of a fiber material,
The apparent thickness of the base material in the atmosphere is at least 1.4 times the preset molding thickness,
In the proximity step, the movable mold is brought close to the fixed mold until a fiber volume ratio is 35% or more with respect to a space formed between the movable mold and the fixed mold of the base material.
The resin injection molding method according to claim 1, wherein the resin injection molding method is characterized by the above.
前記基材は繊維材にて構成され、
前記基材の大気中での見かけ厚さが3.7mm〜4.1mmの範囲内であり、かつ、予め設定された前記成形厚さが2.5mm〜2.9mmの範囲内であって、
前記近接工程では、前記基材の、前記可動型と前記固定型との間に形成される空間に対する、繊維体積比率が35%以上になるまで、前記可動型を前記固定型に近接させる、
ことを特徴とする、請求項1から請求項3の何れか1項に記載の樹脂注入成形方法。
The base material is composed of a fiber material,
The apparent thickness of the base material in the atmosphere is in the range of 3.7 mm to 4.1 mm, and the molding thickness set in advance is in the range of 2.5 mm to 2.9 mm,
In the proximity step, the movable mold is brought close to the fixed mold until a fiber volume ratio is 35% or more with respect to a space formed between the movable mold and the fixed mold of the base material.
The resin injection molding method according to any one of claims 1 to 3, characterized in that:
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