JP5198173B2 - Terminal mounting structure with busbar - Google Patents

Terminal mounting structure with busbar Download PDF

Info

Publication number
JP5198173B2
JP5198173B2 JP2008193426A JP2008193426A JP5198173B2 JP 5198173 B2 JP5198173 B2 JP 5198173B2 JP 2008193426 A JP2008193426 A JP 2008193426A JP 2008193426 A JP2008193426 A JP 2008193426A JP 5198173 B2 JP5198173 B2 JP 5198173B2
Authority
JP
Japan
Prior art keywords
bus bar
terminal
electronic circuit
circuit board
support portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008193426A
Other languages
Japanese (ja)
Other versions
JP2010034204A (en
Inventor
真一 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keihin Corp
Original Assignee
Keihin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keihin Corp filed Critical Keihin Corp
Priority to JP2008193426A priority Critical patent/JP5198173B2/en
Publication of JP2010034204A publication Critical patent/JP2010034204A/en
Application granted granted Critical
Publication of JP5198173B2 publication Critical patent/JP5198173B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

本発明は、半導体装置などに実装して使用されるバスバーを有する端子の実装構造に関する。   The present invention relates to a terminal mounting structure having a bus bar that is used by being mounted on a semiconductor device or the like.

モータの制御に用いるインバータ装置では、絶縁ゲート型バイポーラトランジスタなどの半導体素子を電子回路基板に実装し、金属板等からなるバスバーを用いて半導体素子に外部電源から給電したり、信号の入出力を行ったりしていた。
ここで、バスバーを有する端子を電子回路基板に実装する構造の従来例としては、例えば、特許文献１に開示されているように、導電性を有するベースプレートを用いる構造が知られている。ベースプレートには、半導体素子が実装された電子回路基板が搭載されると共に、バスバーが半田で固定される。半導体素子のリードには金属線の一端が接合され、金属線の他端はベースプレートに接続される。ベースプレートはバスバーに半田付けされているので、ベースプレート及び金属線を介して半導体素子とバスバーとが電気的に接続される。バスバーの固定位置には、ベースプレートに切込部を設けることで肉薄部が形成されており、バスバーを抵抗加熱したり、コテで加熱したりする際の熱マスを減少させることで半田を溶融させ易くしていた。なお、切込部は、バスバーの接合時に発生する熱がベースプレート全体に伝わることを抑制する役割も担っていた。
特開２００２−２８０４８９号公報 In an inverter device used for motor control, a semiconductor element such as an insulated gate bipolar transistor is mounted on an electronic circuit board, and a bus bar made of a metal plate or the like is used to supply power to the semiconductor element from an external power source or to input / output signals. I went there.
Here, as a conventional example of a structure in which a terminal having a bus bar is mounted on an electronic circuit board, for example, as disclosed in Patent Document 1, a structure using a conductive base plate is known. An electronic circuit board on which a semiconductor element is mounted is mounted on the base plate, and the bus bar is fixed with solder. One end of a metal wire is joined to the lead of the semiconductor element, and the other end of the metal wire is connected to the base plate. Since the base plate is soldered to the bus bar, the semiconductor element and the bus bar are electrically connected via the base plate and the metal wire. A thin part is formed by providing a notch in the base plate at the fixed position of the bus bar. The solder is melted by reducing the thermal mass when the bus bar is heated with resistance or with a trowel. It was easy. In addition, the notch part also played the role which suppresses that the heat | fever generate | occur | produced at the time of joining of a bus bar is transmitted to the whole baseplate.
JP 2002-280489 A

しかしながら、バスバーはプレス加工等によって屈曲させた形状を有するが、バスバーの屈曲角度にばらつきがあると、バスバーとベースプレートとの間に十分な接触面積を確保することができないことがあった。両者の間に十分な接触面積を確保できないと、バスバーとベースプレートの半田付け性が悪くなり、端子の実装工程を作業効率を低下させていた。
この発明は、このような事情に鑑みてなされたものであり、バスバーの半田付け性を向上させることを主な目的とする。 However, the bus bar has a shape bent by pressing or the like. However, if the bending angle of the bus bar varies, a sufficient contact area may not be ensured between the bus bar and the base plate. If a sufficient contact area cannot be ensured between the two, the solderability of the bus bar and the base plate deteriorates, reducing the work efficiency of the terminal mounting process.
The present invention has been made in view of such circumstances, and its main object is to improve the solderability of the bus bar.

上記の課題を解決する本発明の請求項１に係る発明は、導電性のバスバーを絶縁性の支持部に支持させた端子と、前記端子を通して電力の供給や信号の入出力が行われる半導体素子とを備え、半田を用いて前記バスバーを前記電子回路基板に接合させるバスバーを有する端子の実装構造において、前記バスバーは前記支持部から前記電子回路基板に略並行に延設される対向部を有し、前記対向部の端部側が屈曲された後に前記電子回路基板に半田接合される接続部が形成されており、前記支持部は、前記電子回路基板上に載置される底部に曲面が前記バスバーの延設方向に傾斜可能に設けられていることを特徴とするバスバーを有する端子の実装構造とした。   The invention according to claim 1 of the present invention for solving the above-described problem is a semiconductor element in which a conductive bus bar is supported on an insulating support, and power is supplied and signals are input / output through the terminal. And a terminal mounting structure having a bus bar for joining the bus bar to the electronic circuit board using solder, the bus bar having a facing portion extending substantially parallel to the electronic circuit board from the support portion. A connecting portion that is solder-bonded to the electronic circuit board after the end portion side of the facing portion is bent, and the support portion has a curved surface at a bottom portion that is placed on the electronic circuit substrate. The mounting structure of the terminal having the bus bar is provided so as to be inclined in the extending direction of the bus bar.

請求項２に係る発明は、請求項１に記載のバスバーを有する端子の実装構造において、前記支持部の前記底部の中央と前記接続部とを結ぶ仮想線上に前記支持部の前記底部の前記バスバーの前記対向部が延出される側の隅部が配置され、前記隅部から前記底部の中央部に至る間に前記曲面が形成されていることを特徴とする。   According to a second aspect of the present invention, in the terminal mounting structure having the bus bar according to the first aspect, the bus bar at the bottom portion of the support portion on an imaginary line connecting the center of the bottom portion of the support portion and the connection portion. A corner portion on the side where the facing portion extends is disposed, and the curved surface is formed between the corner portion and the central portion of the bottom portion.

請求項３に係る発明は、請求項１又は請求項２に記載のバスバーを有する端子の実装構造において、前記支持部の上部に突起を設け、前記電子回路基板を覆うカバーに前記支持部を傾斜させたときでも前記突起を挿入可能な孔と、前記支持部を傾斜させて前記接続部を前記電子回路基板の電極パッドに当接させるように前記支持部を押さえ付ける押圧部とを設けたことを特徴とする。   According to a third aspect of the present invention, in the terminal mounting structure having the bus bar according to the first or second aspect, a protrusion is provided on an upper portion of the support portion, and the support portion is inclined to a cover that covers the electronic circuit board. A hole into which the protrusion can be inserted even when the protrusion is inserted, and a pressing portion that presses the support portion so that the support portion is inclined to bring the connection portion into contact with the electrode pad of the electronic circuit board. It is characterized by.

本発明によれば、接続部の位置がずれていた場合には樹脂部を傾斜させることで接続部と電子回路基板とを略平行に、かつ半田接合可能な位置に配置させることができるので、バスバーを確実に半田接合させることが可能になる。これによって、バスバーを有する端子の実装工程を効率化できる。   According to the present invention, when the position of the connecting portion is shifted, the connecting portion and the electronic circuit board can be arranged in substantially parallel and solderable positions by inclining the resin portion. The bus bar can be securely soldered. Thereby, the mounting process of the terminal having the bus bar can be made efficient.

本発明の実施形態について図面を参照しながら詳細に説明する。
図１及び図２に本実施の形態に係る半導体装置の一例としてインバータ装置の構成を示す。インバータ装置１は、樹脂製のケース１０上に制御基板１２が固定され、ケース１０内に本実施の形態が特徴とするバスバーの接合構造を有する電子回路基板１４が収容されている。なお、ケース１０は、図示を省略するが、ボルト等の締結部材で、金属製等の放熱部材に固定される。 Embodiments of the present invention will be described in detail with reference to the drawings.
1 and 2 show a configuration of an inverter device as an example of a semiconductor device according to the present embodiment. In the inverter device 1, a control board 12 is fixed on a resin case 10, and an electronic circuit board 14 having a bus bar joining structure characterized in the present embodiment is accommodated in the case 10. In addition, although illustration is abbreviate | omitted, case 10 is fixed to heat radiating members, such as metal, with fastening members, such as a volt | bolt.

電子回路基板１４は、図示を省略するが、ケース１０の内側に配置される面に金等の導電性材料からなる回路パターンが形成されており、絶縁ゲート型バイポーラトランジスタである半導体素子１６が実装されている。半導体素子１６は、図示は省略するが、電子回路基板上に形成された導電性のパッドに半田により接着されている。なお、半導体素子１６は、絶縁ゲート型バイポーラトランジスタに限定されない。   Although not shown, the electronic circuit board 14 is formed with a circuit pattern made of a conductive material such as gold on the surface disposed inside the case 10, and the semiconductor element 16, which is an insulated gate bipolar transistor, is mounted on the electronic circuit board 14. Has been. Although not shown, the semiconductor element 16 is bonded to a conductive pad formed on the electronic circuit board by solder. The semiconductor element 16 is not limited to an insulated gate bipolar transistor.

また、電子回路基板１４上には、半導体素子１６に加えて、入力端子１８、出力端子２０及び中継端子２２が実装されている。具体的には、入力端子１８は、半導体素子１６の動作を安定化する平滑コンデンサを介して直流の入力電源に接続されるＰ端子及びＮ端子の２端子を有し、出力端子２０は、半導体素子１６から出力されて車両用モータや電動コンプレッサ等の負荷に印加される３相交流用のＵ相端子２０Ｕ、Ｖ相端子２０Ｖ及びＷ相端子２０Ｗの３端子を有する。また、中継端子２２は、半導体素子１６の動作を制御するために制御基板１２側に設けられたコントローラに接続される複数本のピンを有する。このような入力端子１８、出力端子２０及び中継端子２２は、いずれも図示は省略するが、導電性のパッドに対して接続面を位置整合された状態で、半田により半田接合部を形成されながら各々接着される。なお、説明の便宜上、平滑コンデンサ、入力電源、車両用モータや電動コンプレッサ等の負荷及びコントローラは、図示を省略している。   In addition to the semiconductor element 16, an input terminal 18, an output terminal 20, and a relay terminal 22 are mounted on the electronic circuit board 14. Specifically, the input terminal 18 has two terminals of a P terminal and an N terminal connected to a DC input power supply through a smoothing capacitor that stabilizes the operation of the semiconductor element 16, and the output terminal 20 is a semiconductor It has three terminals of a U-phase terminal 20U, a V-phase terminal 20V, and a W-phase terminal 20W for three-phase alternating current output from the element 16 and applied to a load such as a vehicle motor or an electric compressor. The relay terminal 22 has a plurality of pins connected to a controller provided on the control board 12 side in order to control the operation of the semiconductor element 16. The input terminal 18, the output terminal 20, and the relay terminal 22 are not shown in the figure, but the solder joints are formed by soldering while the connection surfaces are aligned with the conductive pads. Each is glued. For convenience of explanation, a smoothing capacitor, an input power source, loads such as a vehicle motor and an electric compressor, and a controller are not shown.

さらに、入力端子１８は、絶縁性を有する樹脂部１８ｍ（支持部）からＰ端子のバスバー１８ｂｐ及びＮ端子のバスバー１８ｂｎをインサート成形によって突設させた構造を有する。また、出力端子２０のＵ相端子２０Ｕは、樹脂部２０ｍｕ（支持部）からバスバー２０ｂｕが突設され、Ｖ相端子２０Ｖは、樹脂部２０ｍｖ（支持部）からバスバー２０ｂｖが突設され、Ｗ相端子２０Ｗは、樹脂部２０ｍｗ（支持部）からバスバー２０ｂｗが突設された構造を各々有する。また、中継端子２２においては、樹脂部２２ｍ（支持部）から複数本の接続ピン２２ｂが突設された構造を有する。   Further, the input terminal 18 has a structure in which a P-terminal bus bar 18 bp and an N-terminal bus bar 18 bn are protruded by insert molding from an insulating resin portion 18 m (support portion). Further, the U-phase terminal 20U of the output terminal 20 has a bus bar 20bu projecting from the resin portion 20mu (support portion), and the V-phase terminal 20V has a bus bar 20bv projecting from the resin portion 20mv (support portion). Each terminal 20W has a structure in which a bus bar 20bw protrudes from a resin portion 20mw (support portion). The relay terminal 22 has a structure in which a plurality of connection pins 22b protrude from the resin portion 22m (support portion).

つまり、かかる構成においては、入力端子１８の樹脂部１８ｍ、Ｕ相端子２０Ｕの樹脂部２０ｍｕ、Ｖ相端子２０の樹脂部２０ｍｖ、Ｗ相端子２０Ｗの樹脂部２０ｍｗ及び中継端子２２の樹脂部２２ｍは、電子回路基板１４上で互いが分割されており、入力端子１８、出力端子２０のＵ相端子２０Ｕ、Ｖ相端子２０Ｖ及びＷ相端子２０Ｗ、並びに中継端子２２は、電子回路基板１４上で互いに空間的に独立した分割モジュールをなしている。   That is, in such a configuration, the resin portion 18m of the input terminal 18, the resin portion 20mu of the U-phase terminal 20U, the resin portion 20mv of the V-phase terminal 20, the resin portion 20mw of the W-phase terminal 20W and the resin portion 22m of the relay terminal 22 are The input terminal 18, the U-phase terminal 20 U of the output terminal 20, the V-phase terminal 20 V and the W-phase terminal 20 W, and the relay terminal 22 are separated from each other on the electronic circuit board 14. It is a spatially independent division module.

ここで、この実施の形態に係るバスバーを有する端子の実装構造について出力端子２０のＵ相端子２０Ｕを例にして説明する。
図３及び図４に示すように、Ｕ相端子２０Ｕのバスバー２０ｂｕは、樹脂部２０ｍｕに支持されており、樹脂部２０ｍｕから電子回路基板１４外に延出される一方の端部は、図示を省略する外部機器などに接続される外部接続部３０になっている。樹脂部２０ｍｕから電子回路基板１４の上方に延びる部分は、電子回路基板１４から離間し、かつ電子回路基板１４の基板面１４に略平行して延びる対向部３１になっている。さらに、屈曲部３２によって電子回路基板１４に向かって略垂直に折り曲げられた後、電子回路基板１４に略平行な接続部３３が形成されている。接続部３３は、半田３４によって電子回路基板１４上の導電性のパッド３５に接合されている。 Here, the mounting structure of the terminal having the bus bar according to this embodiment will be described by taking the U-phase terminal 20U of the output terminal 20 as an example.
As shown in FIGS. 3 and 4, the bus bar 20bu of the U-phase terminal 20U is supported by the resin portion 20mu, and one end portion extending from the resin portion 20mu to the outside of the electronic circuit board 14 is not shown. The external connection unit 30 is connected to an external device or the like. A portion extending from the resin portion 20 mu to the upper side of the electronic circuit board 14 is a facing portion 31 that is separated from the electronic circuit board 14 and extends substantially parallel to the substrate surface 14 of the electronic circuit board 14. Further, after being bent substantially vertically toward the electronic circuit board 14 by the bent portion 32, a connection portion 33 substantially parallel to the electronic circuit board 14 is formed. The connecting portion 33 is joined to a conductive pad 35 on the electronic circuit board 14 by solder 34.

樹脂部２０ｍｕは、上部４０（載置される側と反対側）にリブ４１が鉛直方向上向きに突設されると共に、実装時に電子回路基板１４に接する底部に曲面部４２が形成されている。図５に示すように、曲面部４２は、バスバー２０ｂｕの対向部３１の延設方向に垂直な側面視において、樹脂部２０ｍｕの中央線Ｃ１（中央部）に対して両隅部４３側が上がるような、即ち、樹脂部２０ｍｕの中央線Ｃ１が最も低い位置となり、ここから下向きに凸となるような円弧形状を形成している。具体的には、樹脂２０ｍｕの中心線Ｃ１に対して両隅部４３のそれぞれが長さＢだけ上方に配置され、その傾斜角度はαになっている。   The resin part 20mu has a rib 41 projecting upward in the vertical direction on the upper part 40 (opposite side on which it is placed), and a curved part 42 is formed on the bottom part in contact with the electronic circuit board 14 during mounting. As shown in FIG. 5, the curved surface portion 42 is such that both corner portions 43 side are raised with respect to the center line C1 (center portion) of the resin portion 20mu in a side view perpendicular to the extending direction of the facing portion 31 of the bus bar 20bu. In other words, an arc shape is formed such that the center line C1 of the resin portion 20mu is the lowest position and protrudes downward therefrom. Specifically, each of the corner portions 43 is disposed above the center line C1 of the resin 20mu by a length B, and the inclination angle is α.

ここで、電子回路基板１４上にＵ相端子２０Ｕを載置したときの樹脂部２０ｍｕの中心から接続部３３の近位端までの水平距離をＬ、基板面１４Ａ（より詳細にはパッド３５の上面）から接続部３３までの垂直距離をａとすると、α＝tan−１（ａ／Ｌ）で求められる。なお、水平距離Ｌ及び垂直距離ａのバラツキは、成形加工や板金加工における加工精度で所定の範囲内に収まるように管理することができるので、傾斜角度αの値を予め算出することが可能である。なお、基板面１４Ａからパッド３５の上面までの距離は極めて薄いので、垂直距離ａは基板面１４Ａから接続部３３までの距離としても良い。   Here, the horizontal distance from the center of the resin part 20mu to the proximal end of the connection part 33 when the U-phase terminal 20U is placed on the electronic circuit board 14 is L, and the board surface 14A (more specifically, the pad 35 If the vertical distance from the upper surface) to the connection portion 33 is a, α is determined by α = tan−1 (a / L). The variation in the horizontal distance L and the vertical distance a can be managed so as to be within a predetermined range with the processing accuracy in forming or sheet metal processing, so that the value of the inclination angle α can be calculated in advance. is there. Since the distance from the substrate surface 14A to the upper surface of the pad 35 is extremely thin, the vertical distance a may be the distance from the substrate surface 14A to the connecting portion 33.

また、長さＢは、Ｕ相端子２０Ｕを傾斜角度αだけ傾斜させて接続部３３を半田３４に当接させたとき、樹脂部２０ｍｕの隅部４３が基板面１４Ａに接触する長さである。長さＢは、予め算出される傾斜角度αが最も大きいときに隅部４３が基板面１４Ａに当接する長さにしている。つまり、対向部３１側の隅部４３は、支持部２０ｍの底部の中央部（中心線Ｃ１）と接続部３３の端部とを結ぶ仮想線上に配置されている。   Further, the length B is a length in which the corner portion 43 of the resin portion 20 mu contacts the substrate surface 14 </ b> A when the U-phase terminal 20 </ b> U is inclined by the inclination angle α and the connecting portion 33 is brought into contact with the solder 34. . The length B is set such that the corner 43 abuts against the substrate surface 14A when the inclination angle α calculated in advance is the largest. That is, the corner portion 43 on the facing portion 31 side is disposed on an imaginary line connecting the center portion (center line C1) of the bottom portion of the support portion 20m and the end portion of the connection portion 33.

さらに、樹脂部２０ｍｕの中心線Ｃ１から隅部４３に至るまでの曲面部４２は、隅部４３が基板面１４Ａに当接するまで傾斜させる際に基板面１４Ａに干渉しない形状になっている。例えば、垂直距離ａ以下の各垂直距離において樹脂部２０ｍｕが中心線Ｃ１から隅部４３に至るまでの途中の一箇所（図５で紙面に垂直な幅方向を考慮すると一ライン）で基板面１４に当接するような点（ライン）の集まりから形成しても良い。このようにすると、想定される値より垂直距離ａが小さかった場合でも樹脂部２０ｍｕと基板面１４Ａとの接触を確保することができる。なお、曲面部４２はこれ以外の曲面形状であっても良い。   Furthermore, the curved surface portion 42 from the center line C1 of the resin portion 20mu to the corner portion 43 has a shape that does not interfere with the substrate surface 14A when the curved portion 42 is inclined until the corner portion 43 abuts against the substrate surface 14A. For example, at each vertical distance equal to or less than the vertical distance a, the substrate surface 14 at one point in the middle of the resin portion 20 mu from the center line C 1 to the corner 43 (one line in consideration of the width direction perpendicular to the paper surface in FIG. 5). You may form from the collection of the point (line) which contact | abuts. In this way, it is possible to ensure contact between the resin portion 20mu and the substrate surface 14A even when the vertical distance a is smaller than an assumed value. The curved surface portion 42 may have a curved surface shape other than this.

また、ケース１０は、電子回路基板１４の上方に配置される天井部１０Ａを有し、天井部１０Ａには、樹脂部２０ｍｕのリブ４１を受け入れ可能な呼び込み孔１０Ｂが、Ｕ相端子２０Ｕの実装位置に対応させて形成されている。呼び込み孔１０Ｂは、リブ４１の外形より大きく、より詳細には樹脂部２０ｍｕが傾斜角度αだけ傾斜したときにリブ４１と呼び込み孔１０Ｂの内周面が干渉しない大きさになっている。なお、カバー１０の天井部１０Ａは、樹脂部２０ｍｕの傾斜の有無に係わらず、樹脂部２０ｍｕを基板面１４Ａに押し付ける押圧部になっている。そして、天井部１０Ａの高さは傾斜角度によらずに樹脂部２０ｍｕに当接可能な高さに設定されている。   The case 10 has a ceiling portion 10A disposed above the electronic circuit board 14, and the ceiling portion 10A has a call-in hole 10B that can receive the rib 41 of the resin portion 20mu, and the U-phase terminal 20U is mounted thereon. It is formed corresponding to the position. The inlet hole 10B is larger than the outer shape of the rib 41, and more specifically, the size is such that the rib 41 and the inner peripheral surface of the inlet hole 10B do not interfere when the resin portion 20mu is inclined by the inclination angle α. The ceiling portion 10A of the cover 10 is a pressing portion that presses the resin portion 20mu against the substrate surface 14A regardless of whether the resin portion 20mu is inclined. And the height of 10 A of ceiling parts is set to the height which can contact | abut to resin part 20mu irrespective of an inclination angle.

図示及び説明を省略するが他の端子２０Ｖ，２０Ｗについても同様のバスバーの接続構造を有する。さらに、他の端子１８，２２も同様の構造を設けても良い。この場合、ケース１０には、各端子１８，２０Ｖ，２０Ｗ，２２のリブの位置に合わせて呼び込み孔１０Ｂを形成する。   Although illustration and description are omitted, the other terminals 20V and 20W have the same bus bar connection structure. Further, the other terminals 18 and 22 may be provided with the same structure. In this case, the call hole 10B is formed in the case 10 in accordance with the positions of the ribs of the terminals 18, 20V, 20W, and 22.

次に、Ｕ相端子２０Ｕの実装方法について図５を主に参照して説明する。
Ｕ相端子２０Ｕを電子回路基板１４に実装する際には、予め公知の印刷技術を用いてペースト状の半田３４を電子回路基板１４のパッド３５上に印刷しておく。その後、図示を省略する吸着パッドを備えるマウンタで樹脂部２０ｍｕを吸着保持し、Ｕ相端子２０Ｕを電子回路基板１４上の予め定められた位置に載置させる。他の必要な部品も同様にして所定位置に載置させたら電子回路基板１４をリフロー炉に搬入して半田付けを行う。 Next, a mounting method of the U-phase terminal 20U will be described with reference mainly to FIG.
When the U-phase terminal 20U is mounted on the electronic circuit board 14, the paste-like solder 34 is printed on the pads 35 of the electronic circuit board 14 in advance using a known printing technique. Thereafter, the resin portion 20 mu is sucked and held by a mounter having a suction pad (not shown), and the U-phase terminal 20 U is placed at a predetermined position on the electronic circuit board 14. When other necessary components are similarly placed at predetermined positions, the electronic circuit board 14 is carried into a reflow furnace and soldered.

なお、Ｕ相端子２０Ｕを電子回路基板１４に載置した状態では、Ｕ相端子２０Ｕの接続部３３とパッド３５の間が離れているので、垂直距離ａを打ち消すように半田３４を予め厚く形成することでＵ相端子２０Ｕを半田接合させる。又は、図示を省略する治具を使用し、Ｕ相端子２０Ｕを傾斜させて接続部３３を半田３４に接触させた状態でリフロー炉に搬入しても良い。   When the U-phase terminal 20U is placed on the electronic circuit board 14, the connection portion 33 of the U-phase terminal 20U and the pad 35 are separated from each other, so that the solder 34 is formed thick in advance so as to cancel the vertical distance a. By doing so, the U-phase terminal 20U is soldered. Or you may carry in to a reflow furnace in the state which inclined the U-phase terminal 20U and contacted the connection part 33 with the solder 34 using the jig | tool which abbreviate | omits illustration.

半田接合が終了したら、カバー１０が装着される。天井部１０Ａによって樹脂部２０ｍｕが基板面１４Ａに押し付けられて、移動が防止される。樹脂部２０ｍｕが傾斜することで、上部４０のリブ４１も傾斜角度αで傾斜しているが、呼び込み孔１０Ｂは十分な径を有するのでリブ４１とカバー１０とが干渉して樹脂部２０ｍｕの傾斜が妨げられることはない。   When the solder bonding is completed, the cover 10 is attached. The resin portion 20mu is pressed against the substrate surface 14A by the ceiling portion 10A, and the movement is prevented. Since the resin part 20mu is inclined, the rib 41 of the upper part 40 is also inclined at the inclination angle α. However, since the inlet hole 10B has a sufficient diameter, the rib 41 and the cover 10 interfere with each other so that the resin part 20mu is inclined. Will not be disturbed.

次に、以上の構成において、インバータ装置１の動作について詳細に説明する。
具体的には、図示を省略する入力電源から平滑コンデンサを介して、入力端子１８におけるＰ端子のバスバー１８ｂｐ及びＮ端子のバスバー１８ｂｎに直流電流が供給される一方で、コントローラからの制御信号が接続ピン２２ｂを介して中継端子２２に入力されると、半導体素子１６は、コントローラの制御の下でスイッチング動作をしながら、出力端子２０におけるＵ相端子２０Ｕのバスバー２０ｂｕ、Ｖ相端子２０Ｖのバスバー２０ｂｖ及びＷ相端子２０Ｗのバスバー２０ｂｗから、対応してＵ相、Ｖ相及びＷ相の３相交流を出力し、負荷を駆動させる。 Next, the operation of the inverter device 1 in the above configuration will be described in detail.
Specifically, a direct current is supplied from an input power supply (not shown) to the P terminal bus bar 18 bp and the N terminal bus bar 18 bn of the input terminal 18 through a smoothing capacitor, while a control signal from the controller is connected. When input to the relay terminal 22 via the pin 22b, the semiconductor element 16 performs the switching operation under the control of the controller, and the bus bar 20bu of the U-phase terminal 20U and the bus bar 20bv of the V-phase terminal 20V in the output terminal 20 And correspondingly, a U-phase, V-phase and W-phase three-phase alternating current is output from the bus bar 20bw of the W-phase terminal 20W to drive the load.

以上、説明したように本実施の形態に係るバスバーを有する端子の実装構造によれば、樹脂部２０ｍｕの底部に曲面形状を設けたので、電子回路基板１４に対して樹脂部２０ｍｕを傾斜させればバスバー２０ｂｕ側の接続部３３と電子回路基板１４側のパッド３５とが平行配置されるようになり、バスバー２０ｂｕの接続部３３とパッド３５との接触面積を十分に確保できる。これによって、Ｕ相端子２０Ｕと電子回路基板１４とを確実に接合できる。   As described above, according to the mounting structure of the terminal having the bus bar according to the present embodiment, since the curved portion is provided at the bottom of the resin portion 20mu, the resin portion 20mu can be inclined with respect to the electronic circuit board 14. For example, the connection part 33 on the bus bar 20bu side and the pad 35 on the electronic circuit board 14 side are arranged in parallel, and a sufficient contact area between the connection part 33 and the pad 35 of the bus bar 20bu can be secured. Thereby, the U-phase terminal 20U and the electronic circuit board 14 can be reliably joined.

樹脂部２０ｍｕの底部の曲面形状を、バスバー２０ｂｕの接続部３３の垂直方向の位置ずれ量に合わせて設けたので、接続部３３の位置が製造誤差等でずれてしまったときでもＵ相端子２０Ｕの全体を傾斜させることで、接続部３３をパッド３５に対して略平行に、かつ半田で接合可能な位置に配置することが可能になる。なお、樹脂部２０ｍｕは傾斜配置させたときでも電子回路基板１４に線接触（中央線Ｃ１又は中心線Ｃ１に平行な曲面部４２上の線）するので、Ｕ相端子２０Ｕの姿勢が不安定になることはない。さらに、樹脂部２０ｍｕをカバー１０で基板面１４Ａに押し付けるようにしたので、樹脂部２０ｍｕを傾斜配置させたときでも移動を防止できる。
また、このようなバスバーの接合構造を採用することで、信頼性の高く安価なインバータ装置１を実現できる。 Since the curved surface shape of the bottom portion of the resin portion 20mu is provided in accordance with the amount of vertical displacement of the connecting portion 33 of the bus bar 20bu, the U-phase terminal 20U even when the position of the connecting portion 33 is displaced due to a manufacturing error or the like. By inclining the whole, the connecting portion 33 can be disposed substantially parallel to the pad 35 and at a position where it can be joined with solder. Even when the resin portion 20mu is inclined, it makes line contact with the electronic circuit board 14 (center line C1 or a line on the curved surface portion 42 parallel to the center line C1), so that the posture of the U-phase terminal 20U is unstable. Never become. Furthermore, since the resin portion 20mu is pressed against the substrate surface 14A by the cover 10, the movement can be prevented even when the resin portion 20mu is inclined.
Further, by adopting such a bus bar joining structure, a highly reliable and inexpensive inverter device 1 can be realized.

なお、本発明は前記の実施の形態に限定されずに発明の要旨を逸脱しない範囲で広く応用することができる。
例えば、中心線Ｃ１から接続部３３側の隅部４３に至るまでの間に曲面部４２を設け、中心線Ｃ１から外部接続部３０側の隅部４３に至るまでの間には曲面部４２を設けなくても良い。また、中心線Ｃ１からそれぞれの隅部４３に至るまでの間の曲面部４２の形状を接続部３３側と外部接続部３０側とで異ならせても良い。 The present invention is not limited to the above-described embodiment, and can be widely applied without departing from the gist of the invention.
For example, the curved surface portion 42 is provided from the center line C1 to the corner portion 43 on the connection portion 33 side, and the curved surface portion 42 is provided from the center line C1 to the corner portion 43 on the external connection portion 30 side. It is not necessary to provide it. Further, the shape of the curved surface portion 42 from the center line C1 to each corner 43 may be different between the connection portion 33 side and the external connection portion 30 side.

本発明の実施形態におけるバスバーを有する端子を含むインバータ装置の斜視図である。It is a perspective view of the inverter apparatus containing the terminal which has a bus-bar in embodiment of this invention. 本実施形態におけるインバータ装置の分解斜視面図である。It is a disassembled perspective view of the inverter apparatus in this embodiment. バスバーを有する端子の斜視図である。It is a perspective view of the terminal which has a bus bar. 図１のＡ−Ａ線に沿った断面図であって、バスバーを有する端子の実装構造を説明する側面図である。It is sectional drawing along the AA line of FIG. 1, Comprising: It is a side view explaining the mounting structure of the terminal which has a bus bar. 樹脂部の底部の曲面と接続部の傾斜との関係を説明する図である。It is a figure explaining the relationship between the curved surface of the bottom part of a resin part, and the inclination of a connection part.

符号の説明Explanation of symbols

１ インバータ装置（半導体装置）
１０ カバー
１４ 電子回路基板
２０Ｕ Ｕ相端子
２０ｂｕ バスバー
２０ｍｕ 樹脂部
３１ 対向部
３３ 接続部
３４ 半田
４０ 上部
４１ リブ
４２ 曲面部
４３ 隅部
Ｃ１ 中心線 1 Inverter device (semiconductor device)
DESCRIPTION OF SYMBOLS 10 Cover 14 Electronic circuit board 20U U-phase terminal 20bu Bus bar 20mu Resin part 31 Opposite part 33 Connection part 34 Solder 40 Upper part 41 Rib 42 Curved part 43 Corner C1 Center line

Claims (3)

導電性のバスバーを絶縁性の支持部に支持させた端子と、前記端子を通して電力の供給や信号の入出力が行われる半導体素子とを備え、半田を用いて前記バスバーを電子回路基板に接合させるバスバーを有する端子の実装構造において、
前記バスバーは前記支持部から前記電子回路基板に略並行に延設される対向部を有し、前記対向部の端部側が屈曲された後に前記電子回路基板に半田接合される接続部が形成されており、前記支持部は、前記電子回路基板上に載置される底部に曲面が前記バスバーの延設方向に傾斜可能に設けられていることを特徴とするバスバーを有する端子の実装構造。 A terminal having a conductive bus bar supported by an insulating support; and a semiconductor element for supplying power and inputting / outputting signals through the terminal, and bonding the bus bar to the electronic circuit board using solder. In the mounting structure of the terminal having a bus bar,
The bus bar has a facing portion that extends substantially parallel to the electronic circuit board from the support portion, and a connection portion that is soldered to the electronic circuit board after the end portion side of the facing portion is bent is formed. A mounting structure of a terminal having a bus bar, wherein the support portion is provided with a curved surface at a bottom portion placed on the electronic circuit board so as to be inclined in an extending direction of the bus bar. 前記支持部の前記底部の中央と前記接続部とを結ぶ仮想線上に前記支持部の前記底部の前記バスバーの前記対向部が延出される側の隅部が配置され、前記隅部から前記底部の中央部に至る間に前記曲面が形成されていることを特徴とする請求項１に記載のバスバーを有する端子の実装構造。   A corner portion of the support portion on the side where the facing portion of the bus bar extends is disposed on an imaginary line connecting the center of the bottom portion of the support portion and the connection portion. The mounting structure for a terminal having a bus bar according to claim 1, wherein the curved surface is formed while reaching a central portion. 前記支持部の上部に突起を設け、前記電子回路基板を覆うカバーに前記支持部を傾斜させたときでも前記突起を挿入可能な孔と、前記支持部を傾斜させて前記接続部を前記電子回路基板の電極パッドに当接させるように前記支持部を押さえ付ける押圧部とを設けたことを特徴とする請求項１又は請求項２に記載のバスバーを有する端子の実装構造。   A protrusion is provided on the upper portion of the support portion, and a hole into which the protrusion can be inserted even when the support portion is inclined to a cover that covers the electronic circuit board, and the connection portion is connected to the electronic circuit by inclining the support portion. The mounting structure for a terminal having a bus bar according to claim 1, further comprising: a pressing portion that presses the support portion so as to contact the electrode pad of the substrate.
JP2008193426A 2008-07-28 2008-07-28 Terminal mounting structure with busbar Expired - Fee Related JP5198173B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008193426A JP5198173B2 (en) 2008-07-28 2008-07-28 Terminal mounting structure with busbar

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008193426A JP5198173B2 (en) 2008-07-28 2008-07-28 Terminal mounting structure with busbar

Publications (2)

Publication Number Publication Date
JP2010034204A JP2010034204A (en) 2010-02-12
JP5198173B2 true JP5198173B2 (en) 2013-05-15

Family

ID=41738349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008193426A Expired - Fee Related JP5198173B2 (en) 2008-07-28 2008-07-28 Terminal mounting structure with busbar

Country Status (1)

Country Link
JP (1) JP5198173B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210001043A (en) * 2019-06-26 2021-01-06 엘지전자 주식회사 Printed circuit board assembly
US11464113B2 (en) 2019-02-15 2022-10-04 Lg Magna E-Powertrain Co., Ltd. Printed circuit board assembly

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7134137B2 (en) * 2019-05-31 2022-09-09 三菱電機株式会社 semiconductor equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0482860U (en) * 1990-11-29 1992-07-20
JP2882143B2 (en) * 1991-12-10 1999-04-12 富士電機株式会社 Internal wiring structure of semiconductor device
JP3749137B2 (en) * 2001-03-21 2006-02-22 株式会社日立製作所 Semiconductor device
JP2005064398A (en) * 2003-08-20 2005-03-10 Toyota Motor Corp Semiconductor device and manufacture of semiconductor device
JP2007250700A (en) * 2006-03-15 2007-09-27 Hitachi Appliances Inc Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11464113B2 (en) 2019-02-15 2022-10-04 Lg Magna E-Powertrain Co., Ltd. Printed circuit board assembly
KR20210001043A (en) * 2019-06-26 2021-01-06 엘지전자 주식회사 Printed circuit board assembly
KR102350939B1 (en) * 2019-06-26 2022-01-12 엘지마그나 이파워트레인 주식회사 Printed circuit board assembly

Also Published As

Publication number Publication date
JP2010034204A (en) 2010-02-12

Similar Documents

Publication Publication Date Title
JP5319979B2 (en) Terminal with busbar
AU2006335521B2 (en) Drive circuit of motor and outdoor unit of air conditioner
JP4764979B2 (en) Semiconductor device
JP5176507B2 (en) Semiconductor device
CN101714545B (en) Semiconductor device
JP4609504B2 (en) Electronics
JP5892250B2 (en) Semiconductor module
US20120071010A1 (en) Electronic Control Device
US20100038758A1 (en) Semiconductor module with two cooling surfaces and method
JP2006186170A (en) Semiconductor device
JP5256994B2 (en) Semiconductor device
JP5108421B2 (en) Inverter device having split module terminals
JP5198173B2 (en) Terminal mounting structure with busbar
US7902464B2 (en) Heat sink arrangement for electrical apparatus
JP2009283567A (en) Semiconductor device
WO2021100747A1 (en) Power semiconductor device, method for manufacturing same, and power conversion apparatus
JP5062029B2 (en) Semiconductor device
JP2013115322A (en) Semiconductor package module
CN101399243B (en) Semiconductor package and method for manufacturing the same
JP2009129974A (en) Power module and motor drive device using the same
JP2015080383A (en) Semiconductor module
JP4622646B2 (en) Semiconductor device
JP2010035303A (en) Terminal having bus bar
JP2017022336A (en) Heat radiation structure of heat generating element
JP5198174B2 (en) Semiconductor device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110519

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120227

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130123

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130206

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160215

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees