JP5197620B2 - Flexible wiring board manufacturing equipment - Google Patents

Description

  The present invention relates to an apparatus for manufacturing a flexible wiring board, and more particularly to an apparatus for manufacturing a cover plate film for protecting a reinforcing plate and an electronic circuit for increasing the rigidity of a partial region of the flexible wiring board.

  In general, a flexible wiring board is made of a thin polyimide film or polyester film as a base material, and the copper foil that constitutes the electronic circuit is attached to the surface of the flexible wiring board. Electronic components are directly mounted on the electronic circuit, and the electronic circuit is covered. Covered with ray film.

  Such a flexible wiring board is thin, soft and can be bent freely. However, when a component is mounted on it or connected to a connector, some thickness and hardness may be required. is there.

  Therefore, in order to ensure the rigidity of a part of the base substrate, a reinforcing plate having a predetermined shape and size is attached to the base substrate.

  Conventionally, the reinforcing plate has been manufactured by punching a film of polyimide resin or polyester resin into a predetermined shape and size using a punch (male type) and a die (female type) (see, for example, Patent Document 1). . In that case, a clearance of about several microns is usually set between the punch and the die. This clearance is set to an appropriate value in consideration of the hardness and thickness of the material of the reinforcing plate. Incidentally, the size of the clearance is preferably 3 to 5% of the thickness of the material.

  However, when punching a film such as a very thin polyimide resin with a punch, if the clearance between the punch and the die is large, the very thin film is pushed into the clearance by the punch, and this causes sufficient shearing force to work. Therefore, there was a problem that the reinforcing plate could not be cut and punched reliably.

  In order to solve this problem, it is desirable to set the amount of clearance between the punch and the die as small as possible. However, if the clearance is set to near zero, the punch and the cutting edge of the die mutually Another problem is that it interferes.

  In addition, when punching a large number of reinforcing plates from a tape-shaped polyimide film, the strength of the tape remaining after punching the reinforcing plates is extremely reduced, making winding difficult, which is a major obstacle to automating production. There is also a problem.

  These problems are not only problems that occur when punching out the reinforcing plate, but are also problems that occur when punching out a cover plastic film or other thin plastic film.

International Publication No. 2007/099654 Pamphlet

  SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for manufacturing a flexible wiring board that can cut a thin plastic film reliably to obtain a reinforcing plate or coverlay film having a predetermined shape and size.

  In order to achieve the above object, an apparatus for manufacturing a flexible wiring board according to the present invention includes a fixed die plate installed immediately below a thin plastic film to be cut and moved from above the fixed die plate toward the plastic film. A movable punch plate, a guide device that guides the movable punch plate toward the fixed die plate, and a pressing device that pushes the movable punch plate into the fixed die plate. The movable punch plate is cut into the movable punch plate. A take-out port through which a later processed product can pass is provided, and a cutting blade is formed at the inner peripheral edge of the entrance of the take-out port.

  In the flexible wiring board manufacturing apparatus of the present invention, the cutting blade has a substantially upright surface on the outer side, an inclined surface is formed on the inner side of the edge of the blade edge, and a predetermined blade angle is set between them. It is preferable that

  Moreover, in the manufacturing apparatus of the flexible wiring board of this invention, it is preferable that the said cutting blade is a loop-shaped continuous blade according to the outline of the reinforcement board which should be cut.

  Further, in the flexible wiring board manufacturing apparatus of the present invention, the guide device includes a plurality of guide rods implanted on the fixed die plate side and the movable punch plate side. It is preferable that it is comprised from the guide hole fitted to.

  In the flexible wiring board manufacturing apparatus of the present invention, the processed product to be cut from the plastic film is a reinforcing plate or a coverlay film.

  Furthermore, a flexible wiring board manufacturing apparatus according to another embodiment of the present invention is moved toward a plastic film from above the stationary die plate, and a stationary die plate installed immediately below a thin plastic film to be cut. A movable punch plate; a guide device that guides the movable punch plate toward the fixed die plate; and a pressing device that pushes the movable punch plate into the fixed die plate. There is a take-out port through which the processed product can pass, a cutting blade is formed at the inner periphery of the entrance of the take-out port, and the cutting amount of the cutting blade is regulated on the lower surface of the movable punch plate outside the cutting blade A stopper is formed.

  Thus, according to the present invention, the cutting blade of the movable punch plate is pushed from above the thin plastic film, and the plastic film is cut into a predetermined shape and size by the cutting blade. Further, it is possible to obtain a reinforcing plate or coverlay film having a predetermined shape and size by reliably cutting without forming a wrinkle.

  Further, according to the present invention, the plastic film is cut into a predetermined shape and size with a cutting blade provided on the lower surface of the movable punch plate, and then the processed product is pulled up as it is from the outlet. It becomes possible to use a two-layer tape affixed to the plastic film, and the plastic film can be wound up together with the mount tape even after the reinforcing plate or the coverlay film is cut off.

It is the side view which showed one Example of the manufacturing apparatus of the flexible wiring board by this invention. It is the perspective view which showed the movable punch plate and the fixed die plate. It is the perspective view seen from the lower surface side of a movable punch plate. It is a top view inside a movable punch plate. FIG. 5 is a cross-sectional view taken along line AA in FIG. 4. FIG. 6 is a cross-sectional view taken along line BB in FIG. 5. It is the top view which showed various reinforcement board taking-out openings and cutting blades. It is the top view which showed the fixed die plate. It is a side view of a fixed die plate. It is the sectional side view which showed clearly the combination of the movable punch plate and fixed die plate by this invention. It is the sectional side view which showed the state which the cutting blade of the movable punch plate cut | disconnected the reinforcement film. It is the sectional side view which showed the state which pulled up the cut-out reinforcement board with a suction pad through a reinforcement board taking-out port.

  Embodiments of a flexible wiring board manufacturing apparatus according to the present invention will be described below with reference to the drawings. In the present embodiment, an example in which a reinforcing plate is cut out from a thin plastic film has been described. However, the present invention is not limited to this, and is applicable to a coverlay film that protects an electronic circuit.

  FIG. 1 is a side view of a flexible wiring board manufacturing apparatus according to the present invention. In FIG. 1, reference numeral 1 denotes a base, and a feed roll 2 and a take-up roll 3 are rotatably mounted on left and right ends of the base 1 via roll stands 4 and 5, respectively. Among these, the feed roll 2 is rotationally driven by the drive motor 6 through the driving pulley 7, the belt 8 and the driven pulley 9 in the direction indicated by the arrow in the figure. On the other hand, the take-up roll 3 is driven to rotate in the direction of the arrow by the drive motor 10 via the driving pulley 11, the belt 12 and the driven pulley 13.

  A tape-like mount / reinforcing film 15 is wound around the feed roll 2 in advance. The mount / reinforcing film 15 is wound around the turning rolls 16, 17 and 18 and is taken up by the take-up roll 3. The mount / reinforcing film 15 is obtained by temporarily bonding a thin reinforcing film 15b on a tape-shaped mount film 15a with a slight adhesive force. Therefore, the reinforcing film 15b can be easily peeled from the mount film 15a with a small peeling force.

  On the other hand, a cutting device 21 for cutting only the reinforcing film 20 from the mount / reinforcing film 15 into a predetermined shape and size is installed between the feeding roll 2 and the take-up roll 3.

  As apparent from FIGS. 2 and 3, the cutting device 21 has a fixed die plate 22, and the mount / reinforcing film 15 slides on the upper surface of the fixed die plate 22 with the mount film 15a facing down. It is sent from left to right in FIG.

  A movable punch plate 23 is disposed directly above the fixed die plate 22 so as to move up and down along a predetermined path. In the embodiment, the movable punch plate 23 has the guide holes 25 fitted to the four guide rods 24... 24 which are planted at the four corners of the fixed die plate 22 so that the axial centers thereof are directed in the vertical direction. In this state, sliding is performed while being guided in the vertical direction along the guide rod 24, and the lower surface 23 a of the movable punch plate 23 is moved in the vertical direction while maintaining a parallel relationship with the upper surface 22 a of the fixed die plate 22.

  Furthermore, a coil spring 27 is elastically mounted on each of the guide rods 24 between the fixed die plate 22 and the movable punch plate 23, as is apparent from FIG. The movable punch plate 23 is given a spring force in a direction away from the fixed die plate 22 by the spring action of the coil spring 27.

  As is apparent from FIGS. 2 to 4, reinforcing plate takeout ports 26A, 26B, 26C, and 26D corresponding to the shape and size of the reinforcing plate to be cut are provided at predetermined positions of the movable punch plate 23. Is formed. In the illustrated example, the reinforcing plate take-out port 26A is a vertically long rectangular hole, and each of the reinforcing plate take-out ports 26B, 26C, and 26D is a rectangular hole having a different size. The shape of the reinforcing plate take-out port 26 can be determined according to an arbitrary shape of the reinforcing plate to be manufactured.

  According to the present invention, as apparent from FIG. 3, a continuous loop-shaped cutting blade 28 is integrally formed along the inner peripheral edge on the entrance side of these reinforcing plate take-out ports 26. These cutting blades 28 are indicated on the drawing by reference numerals 28A, 28B, 28C, 28D corresponding to the reinforcing plate take-out ports 26A, 26B, 26C, 26D, respectively (see FIG. 7).

  These cutting blades 28 are preferably in the form of a single blade consisting of a substantially vertical surface 28a and a surface 28c inclined outward from the leading edge 28b of the blade, as is apparent from FIGS. About 50 ° to 60 ° is sufficient. Also, a V-shaped chevron blade can be used as the cutting blade.

By making such a cutting blade, the cutting surface of the cut edge of the reinforcing plate becomes perpendicular to the surface of the plate, and further, when the cutting blade is pulled up, the polyimide film reinforcing plate is easily separated from the cutting blade Can be expected.

  On the other hand, as is apparent from FIG. 3, stoppers 29 are integrally formed on both sides of the lower surface of the movable punch plate 23. As is clear from FIG. 11, the stopper 29 cuts the reinforcing film 15b by the cutting blade 28. Strictly speaking, when the cutting edge 28b of the cutting blade 28 slightly enters the mount film 15a, the movable punch plate is further moved. It functions to stop so that 23 does not descend.

  The stopper 29 can be omitted if the movement of the movable punch plate 23 can be controlled so that the cutting blade 28 of the movable punch plate 23 can be stopped accurately when the reinforcing film 15b is cut.

  On the other hand, a pressing device 30 for pressing the movable punch plate 23 toward the fixed die plate 22 is provided above the movable punch plate 23 (see FIG. 10).

  In this embodiment, an eccentric cam 31 is used as the pressing device 30, and the movable punch plate 23 can be moved downward by a predetermined stroke by rotating the eccentric cam 31 by a predetermined angle by a drive motor. . It is also possible to use appropriate means for moving up and down by a predetermined stroke instead of the eccentric cam 31.

  Further, in FIG. 1, above the cutting device 21, the reinforcing plate cut out by the cutting process is taken out through the reinforcing plate take-out port 26A to the outside, and the reinforcing plate is placed to a predetermined position of the flexible wiring board to be attached. A transport device 32 is installed for transporting the. The transport device 32 can suck and grip the cutout reinforcing plate with the suction pad 33.

  FIG. 12 shows a state in which the cut-out reinforcing plate 15b is sucked and held by the suction pad 33 and pulled upward in the direction of the arrow. At this time, since the reinforcing film 15b is bonded to the mount film 15a with a weak adhesive force, the reinforcing plate 15b is easily peeled from the mount film 15 when sucked and pulled up by the suction pad 33.

  In the present embodiment, an example in which the present invention is applied to a reinforcing plate manufacturing apparatus has been described. However, the present invention is not limited to this and can be applied to a coverlay film that protects an electronic circuit.

  In the present embodiment, the mount / reinforcing film 15 is a double-layer tape in which a reinforcing film is pasted on the mount. However, the present invention is not limited to this, and the double-sided adhesive tape is reinforced on one side. A three-layer film having a film attached and a backing tape attached to the other surface can also be used.

  As is clear from the above description, according to the present invention, the cutting blade of the movable punch plate is pushed from above the plastic film moving on the fixed die plate, and the plastic film is made into a predetermined size by the cutting blade. Since it was cut out, even a very thin plastic film can be cut without any problem to produce a reinforcing plate or a coverlay film.

  In addition, according to the present invention, the plastic film is cut into a predetermined shape and size with the cutting blade provided on the lower surface of the movable punch plate, and then the processed product is pulled up from the takeout port as it is. It is possible to use a two-layer tape affixed to a paper tape, and the plastic film can be wound with the mount tape even after the reinforcing plate or the coverlay film is cut off.

Claims (8)

A flexible wiring board manufacturing apparatus for cutting a plastic film in a two-layer tape formed by attaching a thin plastic film to be cut to a mount tape to obtain a processed product having a predetermined shape and size. And
A fixed die plate installed immediately below the two-layer tape , a movable punch plate that is moved from above the fixed die plate toward the plastic film and has a cutting blade formed on the lower surface, and the movable punch plate A guide device that guides the fixed die plate toward the fixed die plate, a pressing device that pushes the movable punch plate into the fixed die plate, and a workpiece cut out from the plastic film by cutting processing to a predetermined position on the flexible wiring board. possess a transport device that,
The transport device includes a suction pad capable of sucking and holding the processed product,
The suction pad peels the processed product from the mount tape by sucking and holding the cut-out processed product and pulling it upward.
The apparatus for manufacturing a flexible wiring board, wherein the transport device transports the peeled workpiece to the predetermined position . In the manufacturing apparatus of the flexible wiring board according to claim 1,
When the cutting blade cuts the plastic film, the movable punch plate stops descending when the cutting edge of the cutting blade enters the mount tape . In the manufacturing apparatus of the flexible wiring board according to claim 1 or 2,
The movable punch plate is formed with a blade corresponding to the shape and size of a processed plastic film product to be cut as the cutting blade. In the manufacturing apparatus of the flexible wiring board in any one of Claims 1-3,
The movable punch plate is formed with a plurality of cutting blades as the cutting blades. In the manufacturing apparatus of the flexible wiring board in any one of Claims 1-4,
An apparatus for manufacturing a flexible wiring board, wherein the movable punch plate is formed with a V-shaped chevron blade as the cutting blade. In the manufacturing apparatus of the flexible wiring board in any one of Claims 1-4,
The movable punch plate is formed with a single-edged blade having a substantially vertical surface and a surface inclined outward from the leading edge of the blade as the cutting blade. In the manufacturing apparatus of the flexible wiring board in any one of Claims 1-6,
The guide device includes a plurality of guide rods planted on the fixed die plate side, and guide holes that are drilled on the movable punch plate side and fit into the guide rods. An apparatus for manufacturing a flexible wiring board characterized by the above. In the manufacturing apparatus of the flexible wiring board in any one of Claims 1-7,
A feed roll on which the two-layer tape is wound;
The apparatus for manufacturing a flexible wiring board, further comprising a take-up roll that winds the plastic film after cutting the processed product of the plastic film together with the mount tape.

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