JP5196831B2 - ドロップジェネレータ - Google Patents
ドロップジェネレータ Download PDFInfo
- Publication number
- JP5196831B2 JP5196831B2 JP2007098719A JP2007098719A JP5196831B2 JP 5196831 B2 JP5196831 B2 JP 5196831B2 JP 2007098719 A JP2007098719 A JP 2007098719A JP 2007098719 A JP2007098719 A JP 2007098719A JP 5196831 B2 JP5196831 B2 JP 5196831B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- piezoelectric
- layer
- drop
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 10
- 238000003698 laser cutting Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 229920006332 epoxy adhesive Polymers 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/1618—Fixing the piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
35 圧力チャンバ
37 ダイヤフラム
48 受像媒体
49 インクドロップ
Claims (5)
- 未硬化状態で粘性液状態の接着剤を使用して層状ピエゾ構造を基板に付着させることと、
前記接着剤が未硬化状態で複数の圧電変換素子を形成する間に、層状ピエゾ構造をレーザ切断することと、
前記接着剤を硬化させることと、
を含む、複数の圧電変換器を形成する方法。 - 前記接着剤を用いて前記層状ピエゾ構造を取り付けることは、粘性液状態のエポキシ接着剤を用いて前記層状ピエゾ構造を基板に取り付けることを含む、請求項1に記載の方法。
- 前記接着剤が未硬化状態の間に前記層状ピエゾ構造をレーザ切断することは、前記接着剤が未硬化状態の間に走査レーザビームを用いて前記層状ピエゾ構造をレーザ切断することを含む、請求項1に記載の方法。
- 前記接着剤を硬化させることは、基板及び複数の圧電変換器から成る加熱構造を含む、請求項1に記載の方法。
- 前記接着剤を硬化させることは、
基板及び複数の圧電変換器から成る構造を圧縮することと、
基板及び複数の圧電変換器から成る構造を加熱することと、
を含む、請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/398,148 US7862678B2 (en) | 2006-04-05 | 2006-04-05 | Drop generator |
US11/398148 | 2006-04-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007275884A JP2007275884A (ja) | 2007-10-25 |
JP5196831B2 true JP5196831B2 (ja) | 2013-05-15 |
Family
ID=38198599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007098719A Expired - Fee Related JP5196831B2 (ja) | 2006-04-05 | 2007-04-04 | ドロップジェネレータ |
Country Status (4)
Country | Link |
---|---|
US (1) | US7862678B2 (ja) |
EP (1) | EP1842678B1 (ja) |
JP (1) | JP5196831B2 (ja) |
DE (1) | DE602007012382D1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2327115B1 (en) * | 2008-09-23 | 2013-11-06 | Hewlett-Packard Development Company, L.P. | Removing piezoelectric material using electromagnetic radiation |
US8608293B2 (en) | 2011-10-24 | 2013-12-17 | Xerox Corporation | Process for adding thermoset layer to piezoelectric printhead |
US8602523B2 (en) | 2011-11-11 | 2013-12-10 | Xerox Corporation | Fluorinated poly(amide-imide) copolymer printhead coatings |
US9139004B2 (en) * | 2012-03-05 | 2015-09-22 | Xerox Corporation | Print head transducer dicing directly on diaphragm |
US9038269B2 (en) * | 2013-04-02 | 2015-05-26 | Xerox Corporation | Printhead with nanotips for nanoscale printing and manufacturing |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3723223A (en) * | 1971-01-11 | 1973-03-27 | Nat Starch Chem Corp | Heat curing adhesive |
US4730197A (en) * | 1985-11-06 | 1988-03-08 | Pitney Bowes Inc. | Impulse ink jet system |
DE3804165A1 (de) * | 1988-02-11 | 1989-08-24 | Olympia Aeg | Verfahren zum bestuecken eines tintenstrahldruckkopfes mit piezokristallen |
JPH04168049A (ja) * | 1990-10-31 | 1992-06-16 | Matsushita Electric Ind Co Ltd | インクジェット記録装置 |
US5825382A (en) * | 1992-07-31 | 1998-10-20 | Francotyp-Postalia Ag & Co. | Edge-shooter ink jet print head and method for its manufacture |
JPH06171097A (ja) * | 1992-12-07 | 1994-06-21 | Fujitsu Isotec Ltd | インクジェットヘッドの製造方法 |
JPH06171098A (ja) * | 1992-12-09 | 1994-06-21 | Matsushita Electric Ind Co Ltd | インクジェット記録ヘッドの製造方法 |
EP0830945B1 (en) * | 1996-04-04 | 2002-07-10 | Sony Corporation | Printer device and method of manufacturing same |
JPH11334088A (ja) * | 1998-05-27 | 1999-12-07 | Fuji Electric Co Ltd | インクジェット記録ヘッドの製造方法 |
JP3214696B2 (ja) * | 1999-12-24 | 2001-10-02 | 松下電器産業株式会社 | パワーモジュール及びその製造方法 |
US7070674B2 (en) * | 2002-12-20 | 2006-07-04 | Caterpillar | Method of manufacturing a multi-layered piezoelectric actuator |
US20050045272A1 (en) * | 2003-08-28 | 2005-03-03 | Xerox Corporation | Laser removal of adhesive |
-
2006
- 2006-04-05 US US11/398,148 patent/US7862678B2/en not_active Expired - Fee Related
-
2007
- 2007-04-04 DE DE602007012382T patent/DE602007012382D1/de active Active
- 2007-04-04 EP EP07105634A patent/EP1842678B1/en not_active Expired - Fee Related
- 2007-04-04 JP JP2007098719A patent/JP5196831B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2007275884A (ja) | 2007-10-25 |
DE602007012382D1 (de) | 2011-03-24 |
US7862678B2 (en) | 2011-01-04 |
EP1842678B1 (en) | 2011-02-09 |
EP1842678A1 (en) | 2007-10-10 |
US20070236543A1 (en) | 2007-10-11 |
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