JP5194364B2 - 新規の吸収体または半導体材料を含む貫入形態のソリッドステート光電池デバイス - Google Patents
新規の吸収体または半導体材料を含む貫入形態のソリッドステート光電池デバイス Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 56
- 239000000463 material Substances 0.000 title claims description 39
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- 230000035515 penetration Effects 0.000 title description 5
- 239000010410 layer Substances 0.000 claims description 103
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 63
- 239000000758 substrate Substances 0.000 claims description 62
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 36
- 239000011148 porous material Substances 0.000 claims description 35
- 238000010521 absorption reaction Methods 0.000 claims description 28
- 239000007787 solid Substances 0.000 claims description 25
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 21
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 20
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- 229910000428 cobalt oxide Inorganic materials 0.000 claims description 10
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims description 7
- 150000004706 metal oxides Chemical class 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 6
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229960002887 deanol Drugs 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
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- 150000002739 metals Chemical class 0.000 claims 1
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- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 12
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- 230000008901 benefit Effects 0.000 description 10
- 239000013078 crystal Substances 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
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- 238000002360 preparation method Methods 0.000 description 6
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- 230000006798 recombination Effects 0.000 description 5
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- 239000010936 titanium Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052976 metal sulfide Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- NNLOHLDVJGPUFR-UHFFFAOYSA-L calcium;3,4,5,6-tetrahydroxy-2-oxohexanoate Chemical compound [Ca+2].OCC(O)C(O)C(O)C(=O)C([O-])=O.OCC(O)C(O)C(O)C(=O)C([O-])=O NNLOHLDVJGPUFR-UHFFFAOYSA-L 0.000 description 3
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- 238000010586 diagram Methods 0.000 description 3
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
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- 238000001246 colloidal dispersion Methods 0.000 description 2
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- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 2
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- BFDHFSHZJLFAMC-UHFFFAOYSA-L nickel(ii) hydroxide Chemical compound [OH-].[OH-].[Ni+2] BFDHFSHZJLFAMC-UHFFFAOYSA-L 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
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- YUKQRDCYNOVPGJ-UHFFFAOYSA-N thioacetamide Chemical compound CC(N)=S YUKQRDCYNOVPGJ-UHFFFAOYSA-N 0.000 description 2
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- AFNRRBXCCXDRPS-UHFFFAOYSA-N tin(ii) sulfide Chemical compound [Sn]=S AFNRRBXCCXDRPS-UHFFFAOYSA-N 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZERULLAPCVRMCO-UHFFFAOYSA-N Dipropyl sulfide Chemical compound CCCSCCC ZERULLAPCVRMCO-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
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- 229910021529 ammonia Inorganic materials 0.000 description 1
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- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
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- ZKKLPDLKUGTPME-UHFFFAOYSA-N diazanium;bis(sulfanylidene)molybdenum;sulfanide Chemical compound [NH4+].[NH4+].[SH-].[SH-].S=[Mo]=S ZKKLPDLKUGTPME-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
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- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
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- 239000011244 liquid electrolyte Substances 0.000 description 1
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- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229940078487 nickel acetate tetrahydrate Drugs 0.000 description 1
- OINIXPNQKAZCRL-UHFFFAOYSA-L nickel(2+);diacetate;tetrahydrate Chemical compound O.O.O.O.[Ni+2].CC([O-])=O.CC([O-])=O OINIXPNQKAZCRL-UHFFFAOYSA-L 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
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- 239000002096 quantum dot Substances 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000002336 sorption--desorption measurement Methods 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/03529—Shape of the potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Description
ジーベントリット(Siebentritt)、ケーネンカンプ(Koenenkamp)他、「第14回欧州光太陽電池エネルギー会議及び展示会論文集(14th European Photovoltaic Solar Energy Conference & Exhibition Proceedings)[バルセロナ(Barcelona)、1997年]」、p.1823 ロスト(Rost)、ケーネンカンプ(Koenenkamp)他、「第2回世界光太陽電池エネルギー変換会議及び展示会論文集(2nd World Conference & Exhibition Photovoltaic Solar Energy Conversion Proceedings)[ウィーン(Vienna)、1998年]」、p.212
この場合、前記多孔質ナノ結晶膜の粗さ係数が(前記吸収層を析出させる前において)100よりも大きいと良い。
また、前記多孔質ナノ結晶膜は、30〜50nmの平均粒子径を有する前記TiO 2 ナノ結晶を有し、かつ20〜50nmの平均細孔サイズを有すると良い。
また、前記被服層が酸化ニッケルであると良い。
更に、酸化ニッケルからなる前記被覆層が、ジメチルアミノエタノールを含む溶媒中にNiジアセテートを溶解させて作られる前駆体溶液を使用し、前記多孔質基体に前記前駆体溶液を含浸させ、引き続いて、100℃より高い温度で空気中で加熱することによって作成される、と良い。
前記多孔質基体の第1の面が、正面の接点として作用する第1の基板であって透明かつ導電性で例えば導電性ガラスである第1の基板の上に析出させられ、この第1の基板はまた透明で非多孔性の遮蔽層によっても被覆されており、この遮蔽層は好ましくは前記n型半導体金属酸化物からなるものであること、及び、
前記多孔質基体は、1μmを超える厚さ、好ましくは2〜10μmの厚さの膜を構成すること、及び、
前記吸収層は、1〜25nmの厚さ、好ましくは2〜10nmの厚さを有していること、及び、
前記被覆層は、前記細孔容積の少なくとも10%、好ましくは15%よりも多くの細孔容積を充填していること、及び、
前記多孔質基体の第2面は、背面の接点として作用する第2の導電基板によって被覆されていること、及び、
前記被覆層が、好ましくは、前記多孔質基体と、前記第2の導電基板の背面接点の導電層との間に設けられる少なくとも10nmの厚さの上掛け層をも構成していること、及び、
前記多孔質基体とその吸収層及び被覆層とが、接点として作用する前記2つの導電基板の間に閉じ込められていること、
という特徴を備えている。
電流電圧曲線が、1000W/m2の放射照度において、0.35よりも大きい、好ましくは0.50よりも大きいフィルファクターと、0.30Vよりも大きい、好ましくは0.40Vよりも大きい開放電圧VOC(I=0において)とを示すこと、
前記多孔質基体の粗さ係数が50よりも大きい、好ましくは100よりも大きいこと、
という特性を備えたデバイスを提供する。
QE(λ)=(短絡電子流れ)/(入射光子の流れ)
=(短絡光電流)/(入射放射の出力)×(1240/λ)
で表現される。
η=(最大出力点における電気的出力)/(入射放射の出力)
で表現される。
η[%]=Isc×Voc×ff (1000W/m2の基準放射照度に対して)
である。但し、式中、
Iscは短絡光電流(すなわちV=0における電流)で単位は[mA/cm2]であり、
Vocは開放電圧(すなわちI=0における電圧)で単位は[V]であり、
ffはフィルファクター(単位なし)で、このフィルファクターは、曲線が理想的な矩形形状(ff=1)にどの程度近いかを表す。
多孔質ナノ結晶TiO2膜(平均粒径30nm)の中への硫化カドミウム(Cd)層の製造、及び、この膜とCuSCN被覆とを含めて作られるソリッドステート光電池デバイスの製造。
多孔質ナノ結晶TiO2膜(平均粒径10nm)内の硫化カドミウム(Cd)層とCuSCNからなる被覆とを含めて作られるソリッドステート光電池デバイスの製造。
多孔質ナノ結晶TiO2膜の中への硫化ビスマス(Bi)層の製造、及び、この膜とCuSCN被覆とを含めて作られるソリッドステート光電池デバイスの製造。
多孔質ナノ結晶TiO2膜の中への硫化スズ(Sn)層の製造、及び、この膜とCuSCN被覆とを含めて作られるソリッドステート光電池デバイスの製造。
多孔質ナノ結晶TiO2膜の中への硫化モリブデン(Mo)層の製造、及び、この膜とCuSCN被覆とを含めて作られるソリッドステート光電池デバイスの製造。
多孔質ナノ結晶TiO2膜の中への硫化銅(Cu)層の製造、及び、この膜とCuSCN被覆とを含めて作られるソリッドステート光電池デバイスの製造。
多孔質ナノ結晶TiO2膜の中への酸化コバルト(Co)“青”の層と別の酸化コバルト(Co)“黒”の層との製造、及び、これらの膜とCuSCN被覆とを含めて作られるソリッドステート光電池デバイスの製造。
多孔質ナノ結晶TiO2膜の中への酸化ニッケル(Ni)または“錯体化”酸化ニッケル(Ni)ベースの被覆または充填の製造。
多孔質ナノ結晶TiO2膜中の硫化カドミウム(Cd)層と、酸化ニッケル(Ni)または“錯体化”酸化ニッケル(Ni)からなる被覆とから作られるソリッドステート光電池デバイスの製造。
多孔質ナノ結晶TiO2膜中の酸化コバルト(Co)《青》の層と、酸化ニッケル(Ni)または“錯体化”酸化ニッケル(Ni)からなる被覆とから作られるソリッドステート光電池デバイスの製造。
11 細孔
12 透明なn型半導体の結晶または粒子
2 吸収体材料層
3 透明なp型半導体からなる細孔の被覆または充填
4 正面接点用の透明な導電基板
5 n型半導体からなる密実な薄い遮蔽層
6 背面接点用の第2の導電基板の導電層
7 シール
8 硫化Cd
9 硫化Bi
10 酸化Co《黒》
11 CuSCNからなるp型半導体
12 酸化Niからなるp型半導体
13 硫化Cdベースの吸収体
14 硫化Biベースの吸収体
15 硫化Cdベースの吸収体であるが粒子サイズ10nmのTiO2膜を使用した場合(13及び14の場合に使用した30nmに代えて)
Claims (5)
- 10〜100nmのサイズの細孔を有する透明なn型半導体金属酸化物の多孔質基体と固体のp型半導体材料とを含むタイプのソリッドステート光電池デバイスであって、
前記多孔質基体は、TiO 2 ナノ結晶により構成された多孔質ナノ結晶膜であり、
前記細孔の内部表面に被膜処理されるBi、Sn、Cu、及びMoの中から選択された金属の硫化物と、酸化コバルトから選択される組成であり、厚さが2〜10nmの無機吸収層と、
前記吸収層が被膜処理された前記細孔に充填率が10%以上となるように充填される固体のp型無機半導体材料からなる被覆層と、を備えていることを特徴とする光電池デバイス。 - 請求項1において、前記多孔質ナノ結晶膜の粗さ係数が(前記吸収層を析出させる前において)100よりも大きいことを特徴とする光電池デバイス。
- 請求項1または2において、前記多孔質ナノ結晶膜は、30〜50nmの平均粒子径を有する前記TiO 2 ナノ結晶を有し、かつ20〜50nmの平均細孔サイズを有することを特徴とする光電池デバイス。
- 請求項1〜3のいずれか1項において、前記被服層が酸化ニッケルからなることを特徴とする光電池デバイス。
- 請求項4において、酸化ニッケルからなる前記被覆層が、ジメチルアミノエタノールを含む溶媒中にNiジアセテートを溶解させて作られる前駆体溶液を使用し、前記多孔質基体に前記前駆体溶液を含浸させ、引き続いて、100℃より高い温度で空気中で加熱することによって作成される、ことを特徴とする光電池デバイス。
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FR0501113 | 2005-02-04 |
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FR2917898B1 (fr) * | 2007-06-21 | 2009-10-30 | Imra Europ Sas Soc Par Actions | Dispositif photovoltaique tout solide comprenant une couche d'absorption a base de compose(s) de sulfure d'antimoine et d'argent ou de compose(s) de sulfure d'antimoine et de cuivre |
FR2973575B1 (fr) * | 2011-04-01 | 2013-12-20 | Imra Europe Sas | Dispositif photovoltaique tout solide comprenant une couche d'absorbeur a base de sulfure d'etain et d'antimoine |
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