JP5190617B2 - 光源とこれを有する光出射モジュール及び表示装置 - Google Patents
光源とこれを有する光出射モジュール及び表示装置 Download PDFInfo
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- JP5190617B2 JP5190617B2 JP2007025247A JP2007025247A JP5190617B2 JP 5190617 B2 JP5190617 B2 JP 5190617B2 JP 2007025247 A JP2007025247 A JP 2007025247A JP 2007025247 A JP2007025247 A JP 2007025247A JP 5190617 B2 JP5190617 B2 JP 5190617B2
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 61
- 239000000758 substrate Substances 0.000 claims description 21
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
- G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
Description
前記第1発光チップ及び第2発光チップは青色光を出射し、前記蛍光体は、前記青色光の入射を受けて白色光を出射する黄色蛍光体を含むことが好ましい。
前記第1角度は、30°〜45°であることが好ましい。
前記蛍光体の表面は、前記突出部の表面に対応して円形に丸められた曲面で形成されることが好ましい。
出光面と、前記光源が配置される溝を含む光ガイドユニットと、前記光源を実装して、前記発光体に駆動電流を供給する電源供給基板とを更に有することが好ましい。
前記出光面から出射された光を利用して画像を表示する表示パネルを更に有することが好ましい。
前記出光面から出射された光を利用して画像を表示する表示パネルを更に含むことが好ましい。
前記側面には複数個の前記溝が形成され、前記光源は前記溝にそれぞれ配置されることが好ましい。
前記溝は、前記第1傾斜面に対応する第1内側面と、前記第2傾斜面に対応する第2内側面とを含むことが好ましい。
11、110、311、511 本体
12、112 基底部
13、113 突出部
14 第1傾斜面
15 第2傾斜面
16 上面
20、120、320 発光体
21、22、121、122、520 (第1及び第2)発光チップ
23、123、323、523 蛍光体
300 光出射モジュール
328、528 電源供給基板
330、530 光ガイドユニット
331、531 出光面
333、335、337、339 (第1〜第4)側面
334、534 溝
550 収納容器
570 光学シート
590 表示パネル
Claims (15)
- 基底部と、該基底部の中央から凸状に形成された突出部とを含む本体と、
前記基底部に対して傾斜角をなすように前記突出部に配置される発光チップを含む発光体と、
前記基底部、突出部、及び発光チップを覆う蛍光体とを有し、
前記基底部はプレート形状であり、
前記突出部は、前記基底部の表面と第1角度をなす第1傾斜面、前記基底部の表面と垂直の平面に対して前記第1傾斜面と対称をなす第2傾斜面、及び前記第1傾斜面の上端及び第2傾斜面の上端を連結する上面とを含み、
前記蛍光体の表面は、前記第1傾斜面に対応する第1面、前記第2傾斜面に対応する第2面、及び前記上面に対応する第3面と、を含むことを特徴とする光源。 - 前記発光体は、前記第1傾斜面に配置される第1発光チップと、
前記第2傾斜面に配置される第2発光チップとを含むことを特徴とする請求項1に記載の光源。 - 前記第1発光チップ及び第2発光チップは青色光を出射し、
前記蛍光体は、前記青色光の入射を受けて白色光を出射する黄色蛍光体を含むことを特徴とする請求項2に記載の光源。 - 前記第1角度は、30°〜45°であることを特徴とする請求項1に記載の光源。
- 前記突出部の表面は、円形に丸められた曲面で形成されることを特徴とする請求項1に記載の光源。
- 前記蛍光体の表面は、前記突出部の表面に対応して円形に丸められた曲面で形成されることを特徴とする請求項5に記載の光源。
- 出光面と、前記光源が配置される溝を含む光ガイドユニットと、
前記光源を実装して、前記発光体に駆動電流を供給する電源供給基板とを更に有することを特徴とする請求項1に記載の光源。 - 前記出光面から出射された光を利用して画像を表示する表示パネルを更に有することを特徴とする請求項7に記載の光源。
- 溝が形成された光ガイドユニットと、
前記溝に配置され、基底部及び前記基底部の中央から凸状に形成された突出部とを含む本体、
前記基底部に対して傾斜角をなすように前記突出部に配置され、第1光を出射する発光チップ、及び前記基底部、突出部、及び発光チップを覆って前記第1光の入射を受けて第2光を前記光ガイドユニットに出射する蛍光体と、を含む光源と、
前記光源が実装され、前記発光チップに駆動電流を印加する電源供給基板とを有し、
前記基底部はプレート形状であり、
前記突出部は、前記基底部の表面と第1角度をなす第1傾斜面、前記基底部の表面と垂直の平面に対して前記第1傾斜面と対称をなす第2傾斜面、及び前記第1傾斜面の上端及び第2傾斜面の上端を連結する上面とを含み、
前記蛍光体の表面は、前記第1傾斜面に対応する第1面、前記第2傾斜面に対応する第2面、及び前記上面に対応する第3面と、を含むことを特徴とする光出射モジュール。 - 前記光ガイドユニットは、ガイドされた前記第2光が出射される出光面と、
前記出光面と対向する対向面と、
前記出光面と対向面とを連結して、前記溝が形成される側面とを含むことを特徴とする請求項9に記載の光出射モジュール。 - 前記出光面から出射された光を利用して画像を表示する表示パネルを更に含むことを特徴とする請求項10に記載の光出射モジュール。
- 前記側面には複数個の前記溝が形成され、前記光源は前記溝にそれぞれ配置されることを特徴とする請求項10に記載の光出射モジュール。
- 前記溝は、前記第1傾斜面に対応する第1内側面と、
前記第2傾斜面に対応する第2内側面とを含むことを特徴とする請求項9に記載の光出射モジュール。 - 基底面と、該基底面と第1角度をなす第1傾斜面と、前記基底面の垂直仮想中心平面に対して前記第1傾斜面と対称をなす第2傾斜面とを含む本体と、前記第1傾斜面に配置される第1発光チップと、前記第2傾斜面に配置される第2発光チップとを含む発光体と、前記基底面、第1傾斜面、第2傾斜面、第1発光チップ、及び第2発光チップを覆う蛍光体とを含む光源と、
前記光源が実装され、前記第1発光チップ及び第2発光チップに駆動電流を印加する電源供給基板と、
出光面と、該出光面と対向する対向面と、前記光源が配置される溝が形成された側面と、を含む光ガイドユニットと、
前記出光面から出射された光に基づいて画像を表示する表示パネルとを有し、
前記基底部はプレート形状であり、
前記蛍光体の表面は、前記第1傾斜面に対応する第1面、前記第2傾斜面に対応する第2面、及び前記上面に対応する第3面と、を含むことを特徴とする表示装置。 - 前記出光面には、前記表示パネルの有効表示領域に対応する有効出射領域が定義され、
前記第1傾斜面から延長される第1延長面と前記第2傾斜面から延長される第2延長面は、前記有効出射領域の外側で交差することを特徴とする請求項14に記載の表示装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020060016530A KR101308701B1 (ko) | 2006-02-21 | 2006-02-21 | 점광원, 이를 갖는 광 출사 모듈 및 표시장치 |
KR10-2006-0016530 | 2006-02-21 |
Publications (2)
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JP2007227373A JP2007227373A (ja) | 2007-09-06 |
JP5190617B2 true JP5190617B2 (ja) | 2013-04-24 |
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JP2007025247A Expired - Fee Related JP5190617B2 (ja) | 2006-02-21 | 2007-02-05 | 光源とこれを有する光出射モジュール及び表示装置 |
Country Status (3)
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US (1) | US7611273B2 (ja) |
JP (1) | JP5190617B2 (ja) |
KR (1) | KR101308701B1 (ja) |
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TWI411123B (zh) * | 2007-01-09 | 2013-10-01 | Epistar Corp | 發光裝置 |
DE102008018353A1 (de) * | 2008-01-30 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelelements |
KR100899563B1 (ko) * | 2008-12-19 | 2009-05-27 | 주식회사 지앤에이치 | 조명기구용 엘이디모듈의 엘이디장착구조 |
KR101072143B1 (ko) | 2009-02-20 | 2011-10-10 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
KR100931266B1 (ko) | 2009-04-08 | 2009-12-11 | 주식회사 지엘비젼 | 넓고 균일한 배광을 가지는 실내용 led 조명 |
KR101546741B1 (ko) * | 2009-05-13 | 2015-08-25 | 삼성디스플레이 주식회사 | 광 출사 모듈 및 이를 갖는 표시장치 |
KR101081069B1 (ko) * | 2009-12-21 | 2011-11-07 | 엘지이노텍 주식회사 | 발광소자 및 그를 이용한 라이트 유닛 |
KR101039881B1 (ko) * | 2009-12-21 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 및 그를 이용한 라이트 유닛 |
US8550647B2 (en) | 2010-06-15 | 2013-10-08 | Micron Technology, Inc. | Solid state lighting device with different illumination parameters at different regions of an emitter array |
WO2012147650A1 (ja) * | 2011-04-27 | 2012-11-01 | シャープ株式会社 | Ledモジュール、バックライトユニット及び液晶表示装置 |
TWI553382B (zh) * | 2011-06-24 | 2016-10-11 | Lg伊諾特股份有限公司 | 照明系統 |
US20130135358A1 (en) * | 2011-11-30 | 2013-05-30 | Qualcomm Mems Technologies, Inc. | Light collimating manifold for producing multiple virtual light sources |
CN103187406A (zh) * | 2011-12-27 | 2013-07-03 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及封装方法 |
FR3019938B1 (fr) * | 2014-04-09 | 2017-09-01 | Commissariat Energie Atomique | Dispositif optoelectronique a diodes electroluminescentes a diagramme d'emission ameliore |
CN104019403A (zh) * | 2014-05-23 | 2014-09-03 | 京东方光科技有限公司 | 发光二极管、背光模组、液晶显示器、照明装置 |
CN111490146A (zh) * | 2014-11-18 | 2020-08-04 | 首尔半导体株式会社 | 发光装置 |
CN105068320B (zh) * | 2015-09-22 | 2018-08-14 | 深圳市华星光电技术有限公司 | 一种背光模组 |
US20170082793A1 (en) * | 2015-09-23 | 2017-03-23 | Boe Technology Group Co., Ltd. | Backlight module, display module and electronic device |
JP7148543B2 (ja) * | 2017-11-24 | 2022-10-05 | 京セラ株式会社 | 発光素子搭載用基板およびアレイ基板、ならびに発光装置 |
JP6801695B2 (ja) | 2018-08-03 | 2020-12-16 | 日亜化学工業株式会社 | 発光モジュールおよびその製造方法 |
CN114967230A (zh) * | 2022-05-06 | 2022-08-30 | 惠科股份有限公司 | 背光模组及显示装置 |
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JPH11249131A (ja) * | 1998-02-27 | 1999-09-17 | Matsushita Electric Ind Co Ltd | 表示パネル用照明装置とその製造方法、その照明装置を用いたビューファインダ及びカメラ |
US6635987B1 (en) * | 2000-09-26 | 2003-10-21 | General Electric Company | High power white LED lamp structure using unique phosphor application for LED lighting products |
JP2004212830A (ja) | 2003-01-08 | 2004-07-29 | Optrex Corp | 液晶表示素子用バックライト装置 |
TWI291770B (en) * | 2003-11-14 | 2007-12-21 | Hon Hai Prec Ind Co Ltd | Surface light source device and light emitting diode |
JP4163641B2 (ja) * | 2004-02-25 | 2008-10-08 | 株式会社東芝 | Led素子 |
WO2005078338A1 (en) * | 2004-02-17 | 2005-08-25 | Kelly William M | A utility lamp |
JP4939938B2 (ja) * | 2004-04-23 | 2012-05-30 | 東芝モバイルディスプレイ株式会社 | 面光源装置及び表示装置 |
WO2006004160A1 (ja) * | 2004-07-07 | 2006-01-12 | Fuji Photo Film Co., Ltd. | 導光部材及びそれを用いた面状照明装置並びに棒状照明装置 |
TWI254821B (en) * | 2004-10-01 | 2006-05-11 | Delta Electronics Inc | Backlight module |
-
2006
- 2006-02-21 KR KR1020060016530A patent/KR101308701B1/ko not_active IP Right Cessation
- 2006-11-29 US US11/564,683 patent/US7611273B2/en not_active Expired - Fee Related
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JP2007227373A (ja) | 2007-09-06 |
KR20070083332A (ko) | 2007-08-24 |
US7611273B2 (en) | 2009-11-03 |
KR101308701B1 (ko) | 2013-09-13 |
US20070195524A1 (en) | 2007-08-23 |
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