JP5177937B2 - Sliding valve device - Google Patents

Description

  In the present invention, the first member and the second member disposed so as to be relatively displaceable, and at least one member of the first member or the second member is formed so that fluid can move. And a sliding valve device that controls the flow of fluid by moving the first member and the second member relative to each other. .

  A slide type valve used for a medical sampling valve or a drug solution valve opens and closes a fluid passage formed in each valve body by sliding the two valve bodies relative to each other in contact with each other. The movable valve body and the fixed valve body are rubbed together to open and close the solution passage, but there are portions where the slidability and the sealing performance conflict. In order to improve the sealing performance, it is better to make the sliding surface extremely smooth. However, this causes a problem that the movable valve body and the fixed valve body adhere to each other and do not slide.

As a solution to this problem, there is one in which a sliding surface is impregnated with a lubricant such as resin or oil. However, the deterioration or outflow of the lubricant is likely to cause sliding deterioration, and dust is likely to adhere. As a means for solving such a problem, it is known to strictly define the machining finishing accuracy in the surface roughness of the sliding surface (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 5-44861

  However, in a microvalve that controls a fluid flowing in a minute flow path, since the movable valve body and the fixed valve body are generally small, surface processing by polishing as described in the above-mentioned publication is difficult. become. In addition, after polishing, cleaning such as removal of abrasive particles that have entered the microchannel is extremely difficult.

  The present invention has been made in view of the above circumstances, and has a small flow path to improve the sealing performance and sliding performance of a sliding microvalve having a small movable valve body and a fixed valve body. An object of the present invention is to provide a valve device.

That is, the sliding valve device according to claim 1 according to the present invention has a plate shape and is fixed to the first member on which the first flow path is formed and the first surface of the first member. A guide member having a space inside, a plate member having a space inside, and a plate-like shape that is slidably inserted linearly within the space of the guide member as a displacement range, at a predetermined position within the displacement range. A second member comprising a movable part having a second flow path communicating with the first flow path, and at least a flat contact surface of each of the first member and the movable part of the second member. A film having one of water repellency, oil repellency, and hydrophilicity on one surface, and a film that is a porous film, and the movable part of the second member including the film In the thickness direction of the plate shape, the movable parts of the first member and the second member Gap is less than or equal to 1μm~5μm.

  By being configured in this way, it is possible to provide a high-performance sliding valve device by applying a predetermined surface treatment to a predetermined part.

  The invention according to claim 2 is the invention according to claim 1, wherein the first member or the second member is formed of the same member.

  By being configured in this manner, the first member and the second member can be integrally formed, so that a high-performance and inexpensive valve device can be provided.

  The invention according to claim 3 is the invention according to claim 1, further comprising a guide member for restricting relative displacement of at least one of the first member or the second member. Features.

  With such a configuration, a small and inexpensive valve device can be provided.

  The invention according to claim 4 is the invention according to claim 3, wherein any two of the first member, the second member and the guide member are separated from the same member. It is characterized by being made.

  With this configuration, the guide member in the displacement direction and the displacement restricting portion can be integrally assembled, and thus a high-performance and inexpensive valve device can be provided.

  According to a fifth aspect of the present invention, in the first aspect of the present invention, the flow path connected to the flow path has a surface facing the first member or the second member to be displaced. It further has the 3rd member which has.

  With this configuration, a high-performance valve device can be provided.

  According to a sixth aspect of the present invention, in the first aspect of the present invention, the first surface and the second member are opposed to each other in the predetermined surface treatment. The surface of 1 member or the said 2nd member is included, It is characterized by the above-mentioned.

  By being configured in this manner, the slidability between the displacing member and the opposing member is improved or the leakage is reduced, so that a high performance valve device can be provided. .

  According to a seventh aspect of the present invention, in the first aspect of the present invention, the portion subjected to the predetermined surface treatment has a predetermined gap between the first member and the second member. It is characterized by including the surface below the value of.

  By being configured in this manner, the displacing member can be easily displaced without leaking the fluid, so that the driving force for displacing can be small, so that a small and inexpensive valve device can be provided. it can.

  According to an eighth aspect of the present invention, in the first aspect of the present invention, the first member and the second member are moved relative to each other at the predetermined surface treatment. It is a site including a range.

  With such a configuration, a small and inexpensive valve device can be provided.

  According to a ninth aspect of the present invention, in the first aspect of the present invention, the portion subjected to the predetermined surface treatment includes a surface that does not contact the fluid.

  By being configured in this manner, it is difficult for the fluid to flow except the flow path, and thus leakage is reduced, so that a high-performance valve device can be provided.

  According to a tenth aspect of the present invention, in the first aspect of the present invention, the portion on which the predetermined surface treatment is performed is the flow provided on the first member or the second member. It is characterized by including the wall surface which comprises a path.

  By being configured in this manner, surface treatment can be easily performed, so that an inexpensive and high-performance valve device can be provided.

  According to an eleventh aspect of the present invention, in the first aspect of the present invention, the portion subjected to the predetermined surface treatment includes a surface in contact with the fluid.

  With this configuration, if the inside of the flow path is subjected to a hydrophilic treatment, water can easily flow through the flow path, so that a high-performance valve device can be provided.

  According to a twelfth aspect of the present invention, in the first aspect of the present invention, the portion subjected to the predetermined surface treatment is on the surface of the first member or the second member. It is a site | part except the circumference | surroundings of the said opening part, It is characterized by the above-mentioned.

  By being configured in this manner, the fluid can easily flow toward the opening, so that a high-performance valve device can be provided.

  According to a thirteenth aspect of the present invention, in the first aspect of the present invention, the portion subjected to the predetermined surface treatment is on the surface of the first member or the second member. It is only around the opening.

  By being configured in this way, it is possible to provide a low-cost and high-performance valve device that is simple in surface treatment.

  The invention described in claim 14 is the invention described in claim 1, characterized in that the surface treatment is applied to a predetermined part in a pattern.

  By being configured in this manner, the slidability between the displacing member and the opposing member is improved or the leakage is reduced, so that a high-performance valve device can be provided. .

  According to a fifteenth aspect of the present invention, in the fifth aspect of the present invention, the predetermined surface treatment is performed on the guide member of the first member or the second member. It is a part of the surface of the part where displacement is not regulated.

  By being configured in this manner, the surface treatment becomes easy, so that an inexpensive and high-performance valve device can be provided.

  According to a sixteenth aspect of the present invention, in the fifth aspect of the present invention, the portion subjected to the predetermined surface treatment is the surface of the third member, the first member, or the first member. The surface of the second member is a surface facing the third member.

  By being configured in this manner, the fluid can easily enter the flow path for performing chemical treatment or the like, so that a high-performance valve device can be provided.

  The invention described in claim 17 is the invention described in claim 1, characterized in that the surface treatment is a water repellent treatment.

  With this configuration, water does not flow easily through the water-repellent part, so if this treatment is applied to areas where water is not desired to flow, it is possible to flow water only to specified areas. An apparatus can be provided.

  The invention described in claim 18 is the invention described in claim 1, characterized in that the surface treatment is a hydrophilic treatment.

  By being configured in this manner, water easily flows through the hydrophilic portion. Therefore, water can be easily flowed by performing this treatment on a portion where water is desired to flow, and thus a high-performance valve device can be provided.

  The invention according to claim 19 is the invention according to claim 1, wherein the surface treatment is an oil repellent treatment.

  By being configured in this way, oil and fat hardly flow through the oil-repellent part. Therefore, when this processing is performed on a part where the oil and fat is not desired to flow when the fluid is oil and fat, the fluid can flow only to a predetermined part. This makes it possible to provide a high-performance valve device.

  The invention described in claim 20 is the invention described in claim 1, characterized in that the surface treatment is for increasing the surface energy of the portion through which the fluid flows.

  Since it becomes hydrophilic by being comprised in this way, since it becomes possible to flow water only to a predetermined | prescribed site | part, a highly efficient valve apparatus can be provided.

  The invention according to claim 21 is the invention according to claim 1, wherein the surface treatment is performed so that a contact angle of the fluid with respect to a surface of the first member or the second member that does not contact the fluid is The process is such that the contact angle of the fluid with respect to the surface in contact with the fluid is larger than the contact angle.

  With this configuration, the wettability with respect to the fluid in a portion where the fluid is desired to flow is relatively improved, so that the fluid flows easily by performing this processing, and a high-performance valve device can be provided. .

  The invention according to claim 22 is the invention according to claim 1, wherein the surface treatment is such that the surface-treated portion has a lower coefficient of friction than the non-surface-treated portion. It is characterized by being.

  By being configured in this manner, the slidability between the member that displaces and the member that faces the member is improved, so that a high-performance valve device can be provided.

  The invention described in claim 23 is the invention described in claim 1, wherein the surface treatment is a chemical, physical, or mechanical treatment.

  By comprising in this way, a high performance valve apparatus can be provided by performing surface treatment by chemical, physical, or mechanical treatment.

  The invention described in claim 24 is the invention described in claim 1, characterized in that the surface treatment is a treatment for changing the surface shape of the substrate.

  By being configured in this way, changing the surface shape of the substrate improves the slidability between the displacing member and the opposing member, or reduces leakage, so that high performance A valve device can be provided.

  According to a twenty-fifth aspect of the invention, in the twenty-fourth aspect of the invention, the surface shape of the substrate is changed by forming fine irregularities on the surface of the substrate.

  By being configured in this way, the surface shape of the substrate can be changed by forming fine irregularities and the like.

  According to a twenty-sixth aspect of the invention, in the twenty-fifth aspect of the invention, the fine irregularities are formed by forming fine holes in the surface of the substrate.

  By being configured in this manner, it becomes possible to easily form fine irregularities and the like, so that water repellency and slidability can be improved, so that a high-performance valve device can be provided at low cost. it can.

  According to a twenty-seventh aspect, in the invention according to the twenty-fifth aspect, the fine irregularities are formed by forming fine particles on the surface of the substrate.

  By being configured in this way, it becomes possible to easily form fine irregularities and the like, so that water repellency and slidability can be improved, and a high-performance valve device can be provided at low cost.

  The invention according to claim 28 is the invention according to claim 25, wherein a resin film containing fine additives such as fine particles, fine fibers and fine fillers is formed on the surface of the substrate. The fine irregularities are formed.

  By being configured in this way, it becomes possible to easily form fine irregularities and the like, so that water repellency and slidability can be improved, and a high-performance valve device can be provided at low cost.

  A twenty-ninth aspect of the invention is the invention according to the twenty-fifth aspect, wherein the fine irregularities are formed by forming minute protrusions on the surface of the substrate.

  By being configured in this way, it becomes possible to easily form fine irregularities and the like, so that water repellency and slidability can be improved, and a high-performance valve device can be provided at low cost.

  The invention described in claim 30 is the invention described in claim 1, characterized in that the surface treatment is a treatment for modifying the surface of the substrate itself.

  By being configured in this way, the surface of the substrate itself is denatured, so that the slidability between the displacing member and the opposing member is improved, or leakage is reduced. A valve device can be provided.

  The invention described in claim 31 is the invention described in claim 1, characterized in that the surface treatment is a treatment for forming a film on the surface of the substrate.

  By being configured in this way, by forming a film on the substrate surface, the slidability between the displacing member and the opposing member is improved, or leakage is reduced, so that high performance is achieved. A valve device can be provided.

  A thirty-second aspect of the invention is characterized in that, in the thirty-third aspect of the invention, the film formed on the substrate surface contains a carbon-based material.

  With this configuration, a low friction film can be formed from a material containing carbon such as PTFE.

  A thirty-third aspect of the invention is characterized in that, in the thirty-third aspect of the invention, the film formed on the surface of the substrate contains a fluorine-based material.

  With this configuration, a water-repellent film can be formed using a material containing fluorine, such as PTFE, fluorine-based resin, and fluorine-based polymer.

  The invention according to claim 34 is the invention according to claim 33, characterized in that the film containing the fluorine material is PTFE.

  By being configured in this way, a film having both water repellency and slidability can be formed.

  The invention described in claim 35 is the invention described in claim 1, characterized in that the surface treatment is treatment according to the material of the first member or the second member.

  By being configured in this way, a higher performance valve device can be provided by performing an appropriate surface treatment according to the material of the member.

  A thirty-sixth aspect of the invention is the invention according to the first aspect, wherein the surface treatment is a treatment according to the characteristics of the fluid.

  With such a configuration, it is possible to provide a higher performance valve device by performing an appropriate surface treatment according to the characteristics of the fluid.

  A thirty-seventh aspect of the invention is characterized in that, in the invention of the first aspect, the surface treatment is characterized in that its characteristics change depending on the characteristics of the fluid in contact therewith.

  By being configured in this way, since the surface state of the characteristic varies depending on the characteristics of the fluid in contact with the fluid, it is possible to identify the fluid based on the characteristics of the fluid, and thus provide a high performance valve device Can do.

  A thirty-eighth aspect of the present invention is the invention according to the first aspect, wherein the surface treatment is characterized in that its characteristics change depending on the external environment.

  By being configured in this manner, since the surface state has different characteristics depending on the external environment, it becomes possible to identify the fluid based on the external environment, so that a high-performance valve device can be provided.

  The invention described in claim 39 is the invention described in claim 1, wherein the surface treatment is performed before the first member and the second member are assembled.

  By being configured in this manner, surface treatment can be easily performed on a predetermined portion, and the degree of freedom in selecting a surface treatment method is high, so that an inexpensive and high-performance valve device can be provided.

  The invention described in claim 40 is the invention described in claim 2, wherein the surface treatment is performed after the first member and the second member are separated.

  By being configured in this manner, surface treatment can be easily performed on a predetermined portion, and the degree of freedom in selecting a surface treatment method is high, so that an inexpensive and high-performance valve device can be provided.

  The invention according to claim 41 is the invention according to claim 2, wherein the surface treatment is performed before the first member or the second member is separated. .

  By being configured in this way, it is possible to perform surface treatment collectively, so that the number of steps can be reduced, and an inexpensive and high-performance valve device can be provided.

  The invention described in claim 42 is the invention described in claim 3 or 4, wherein the surface treatment is performed before the first member, the second member, or the guide member is assembled. It is characterized by.

  By being configured in this manner, it is possible to easily perform surface treatment on a predetermined part and the degree of freedom in selecting a surface treatment method is high, so that an inexpensive and high-performance valve device can be provided. .

  The invention according to claim 43 is the invention according to claim 4, wherein the surface treatment is performed after the first member, the second member, or the guide member is separated. And

  By being configured in this manner, it is possible to easily perform surface treatment on a predetermined part and the degree of freedom in selecting a surface treatment method is high, so that an inexpensive and high-performance valve device can be provided. .

  The invention according to claim 44 is the invention according to claim 4, wherein the surface treatment is performed before the first member, the second member, or the guide member is separated. Features.

  By being configured in this way, it is possible to perform surface treatment collectively, so that the number of steps can be reduced, and an inexpensive and high-performance valve device can be provided.

  A 45th aspect of the present invention is the invention according to any one of the 2nd to 4th aspects, wherein the surface treatment is performed in a final step.

  By being configured in this way, it is possible to perform surface treatment collectively, so that the number of steps can be reduced, and an inexpensive and high-performance valve device can be provided.

  According to the present invention, it is possible to provide a high-performance sliding valve device by applying a predetermined surface treatment to a predetermined portion.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a sliding valve device according to the present invention will be described in detail with reference to the drawings.

(First embodiment)
First, a first embodiment of the present invention will be described with reference to FIG. 1 and FIG.

  FIG. 1 is a diagram showing a configuration of a sliding valve device according to a first embodiment of the present invention, and FIG. 2 is a diagram showing a manufacturing process of the sliding valve device.

  In FIG. 1, the sliding valve device according to the present embodiment includes a first member 1 and a second member 2. The first member 1 and the second member 2 are stacked by being arranged in the respective thickness directions.

  Further, at least one member of the first member 1 or the second member 2, in this case, a through hole 3 through which a fluid (not shown) can move is formed as a flow path in a predetermined portion of the second member 2. Has been. The through hole 3 is formed in the thickness direction of the second member 2 (vertical direction in FIG. 1), and an opening 3a is provided on the surface thereof.

  In FIG. 1, the length in the longitudinal direction of the first member 1 is a, the length in the direction perpendicular to the longitudinal direction is b, and the length in the thickness direction perpendicular to these two directions is c. Similarly, the lengths of the second member 2 are a ′, b ′, and c ′. Further, the surface area obtained by the above a × b is S1, the area obtained by the a × c is S2, the area obtained by the b × c is S3, and the surface area obtained by the a ′ × b ′ is S1. The area obtained by ', a' x c 'is S2', and the area obtained by b 'x c' is S3 '.

  Then, the relationship between these lengths and areas is as follows: a> b> c, S1> S2> S3 in the first member 1, a ′> b ′> c ′, S1 ′> S2 ′ in the second member 2. > S3 '. However, here, for convenience, a> b, a ′> b ′, S1> S2, S1 ′> S2 ′, but a = b, a ′ = b ′, S1 = S2, S1 ′ = S2 ′ and a <B, a ′ <b ′, S1 <S2, and S1 ′ <S2 ′ may be satisfied.

  In such a configuration, the movement of the fluid is controlled by relatively displacing the first member 1 and the second member 2. That is, by closing the through hole 3 of the second member 2 with the first member 1, the flow path is closed and the movement of the fluid is controlled.

  Next, with reference to FIG. 2, a semiconductor manufacturing process for manufacturing the sliding valve device configured as described above will be described.

  First, as shown in FIG. 2 (a1), a thin film substrate such as Si, glass, SUS, a ceramic substrate, or a resin substrate is prepared as the second member 15 constituting the movable portion and the guide portion.

  Next, as shown in FIG. 2 (b1), the thinned portion 15a is formed by etching a part of the second member 15 from both sides. At this time, care should be taken so that the thinning amounts on both sides are substantially equal.

  Further, as shown in FIG. 2 (c1), a film 16 having water repellency, glaze oil, and low friction characteristics is formed at a predetermined position on the thinned portion 15a. As this film 16, for example, a fluorine resin film such as Cytop (registered trademark) manufactured by Asahi Glass Co., Ltd. may be formed by a spin coating method, or a silicon nitride film may be formed by a CVD method. You may be made to do.

  The reason why the water-repellent and oil-repellent film is formed is to reduce fluid leakage between the movable part and the fixed substrate that opposes it after the valve is completed. The reason why the low-friction film is formed is to reduce the driving force of the movable part and reduce the size of the apparatus by reducing the frictional force between the movable part and the fixed substrate.

  On the other hand, as shown in FIG. 2A2, a thin film substrate such as Si, glass, SUS, a ceramic substrate, or a resin substrate is prepared as the first member 11 serving as a fixed substrate.

  Next, as shown in FIG. 2B 2, the first through hole 12 is formed in the first member 11. The through-hole 12 can be formed by, for example, etching with a chemical solution or gas, sand blasting, ultrasonic waves, laser processing, machining such as a drill, or the like.

  Next, as shown in FIG. 2 (c2), the sacrificial layer 13 is formed on the upper surface of the first member 11, that is, on the portion facing the portion that will later become a movable portion in the second member. Is done. As a material of the sacrificial layer 13, for example, a film such as a resist, PSG, SOG, or the like, which is more easily removed by etching than Si or a glass substrate is formed.

  Here, as shown in FIG. 2 (d), the second member (thin film substrate) 15 formed in the step shown in FIG. 2 (c1) and the step shown in FIG. 2 (c2). The formed first member (thin film substrate) 11 is joined. At this time, the through hole 12 formed in the first member 11 is aligned and joined so as to overlap a predetermined position of the second member 15. Examples of the bonding method include anodic bonding, diffusion bonding, bonding through an adhesive layer, and the like. At this time, it is necessary to select the material of the sacrificial layer and the bonding method so that the sacrificial layer 13 and the film 16 of the second member 15 are bonded.

  Then, as shown in FIG. 2E, the second through hole 17 is formed in the thinned portion 15a of the second member 15, and is separated into a movable portion and a guide portion. Although not shown, an insertion portion serving as an opening for connecting the movable portion to the external drive device may be formed in the guide portion at this time.

  Further, in the step shown in FIGS. 2 (a3) and (b3), the third member 20 is processed in the same manner as the step shown in FIGS. 2 (a2) and (b2), and the third member 20 is processed. A through hole 21 is formed.

  Next, as shown in FIG. 2F, the third member 20 is further aligned and joined to the second member 15 and the second member side of the joined second member 15. Is done.

Finally, as shown in FIG. 2G, the movable portion is separated from the second member 15 by removing the sacrificial layer 13. For removing the sacrificial layer 13, for example, when a resist is used as the sacrificial layer 13, a chemical solution such as acetone can be used. If the film 16 is an inorganic film such as a silicon nitride film, CF ₄ and It is also possible to use sacrificial layer removal by plasma treatment with a mixed gas of oxygen.

  As described above, the sliding valve device of this configuration is completed.

  Thus, according to the first embodiment, since it can be produced by processing a thin plate-like substrate using a fine processing technique used in semiconductor manufacturing, it is possible to form extremely fine openings and position with high accuracy. Matching is easily possible.

(Second Embodiment)
Next, a second embodiment of the present invention will be described.

  In the embodiment described below, the configuration and the like of the slide type valve device are basically the same as those shown in FIG. 1, and the same reference is made to the same portion as the first embodiment described above. Numbers are given and their illustration and detailed description are omitted.

  FIG. 3A is a diagram showing a configuration of a sliding valve device according to the second embodiment of the present invention.

  In FIG. 3A, the slide type valve device in the present embodiment is configured to have a first member 1 and a second member 2 which are disposed so as to be relatively displaceable. ing. And the through-hole 5 and the through-hole 3 are each formed in the predetermined location of the 1st member 1 and the predetermined location of the 2nd member 2 as a flow path for a fluid to move. Furthermore, the opening part 5a and the opening part 3a are each provided in the surface part of the 1st member in which the through-hole 5 and the through-hole 3 are formed, and the 2nd member.

  The first member 1 and the second member 2 are disposed so as to be relatively displaceable in two different directions intersecting each other. In this case, the first member 1 is movable in two orthogonal directions on the surface on which the opening 3a of the second member is provided.

  As a result, the fluid moves at a position where the through hole 5 and the through hole 3 communicate with each other. When the first member moves in the direction of the arrow in the drawing and the positions of the through hole 5 and the through hole 3 shift, the fluid moves. Will be controlled.

  FIG. 3B is a diagram showing another example in the second embodiment.

  In FIG. 3B, the first member 1 is movable in one direction on the second member 2 and in the illustrated circle direction.

  Thus, even if the moving direction of the first member is changed, the movement of the fluid can be controlled.

  In the second embodiment, the number of through holes is described as one for each member. However, the number of through holes is not limited to this, and a plurality of through holes may be provided.

  According to the second embodiment, since the degree of freedom of arrangement of the plurality of through holes is increased, more complicated fluid control can be performed.

(Third embodiment)
4A and 4B show the configuration of a sliding valve device according to a third embodiment of the present invention. FIG. 4A is a perspective view, and FIG. 4B is a plan view with the first member of FIG. It is.

  In the embodiment described below, the configuration and the like of the slide type valve device are basically the same as those shown in FIG. 1, and the same reference is made to the same portion as the first embodiment described above. Numbers are given and their illustration and detailed description are omitted.

  The sliding valve device according to the present embodiment is configured to have a first member 1 and a second member 2 that are disposed so as to be relatively displaceable. And the through-hole 5 and the through-hole 3 are each formed in the predetermined location of the 1st member 1 and the predetermined location of the 2nd member 2 as a flow path for a fluid to move. Furthermore, the opening part 5a and the opening part 3a are each provided in the surface part of the 1st member in which the through-hole 5 and the through-hole 3 are formed, and the 2nd member.

  Around the second member 2, a guide member 25 that does not have a flow path and restricts the displacement of the second member is disposed. The guide member 25 is formed with a plurality of contact portions 26 for restricting the direction in which the second member 2 is displaced with respect to the guide member 25, in this case, four. In addition, a plurality of, in this case, three positioning portions 27 for positioning the second member 2 are formed on the guide member 25 in the direction in which the second member 2 is displaced.

  The guide member 25 is not connected to the second member 2 that restricts displacement by the guide member 25.

  The contact portion 26 and the positioning portion 27 formed on the guide member 25 are in point contact or line contact with the displaced second member 2.

  The guide member 25 is formed from the same base material as the second member 2.

  In such a configuration, the second member 2 displaced with respect to the first member 1 moves to a position where the second member 2 contacts the positioning portion 27 while contacting the contact portion 26. Thereby, the fluid can be moved at a position where the through hole 5 and the through hole 3 communicate with each other. Further, when the second member 2 is displaced in the one-dimensional direction, the two through holes 5 and the through holes 3 are displaced, and the flow rate is controlled.

  With this configuration, the displacement amount of the displacing member is regulated by the guide member, so that the magnitude of the displacement of the displacing member and the maximum amount of displacement can be regulated.

  In the above-described embodiment, the guide member 25 is formed from the same base material as the second member 2, but is not limited thereto, and is formed from the same base material as the first member 1. Or any one of the first member 1 or the second member 2 or the guide member may be formed separately from the same base material.

  Furthermore, although the displacement direction of the member to be displaced has been described as a one-dimensional direction in the present embodiment, the present invention is not limited to this, and the member may be displaced in the circumferential direction, for example.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described.

  FIG. 5A is a side sectional view showing a configuration of a sliding valve device according to a fourth embodiment of the present invention.

  In the embodiment described below, the configuration and the like of the slide type valve device are basically the same as those shown in FIG. 1, and the same reference is made to the same portion as the first embodiment described above. Numbers are given and their illustration and detailed description are omitted.

  In FIG. 5A, a through hole 5 is formed in the first member 1, and a second member 2 having a through hole 3 is arranged on the lower surface side of the first member 1. It is installed. A guide member 25 is disposed around the second member 2 to support the second member 2 so as to be displaceable.

  The distance d between the second member 2 and the first member 1 is set to be larger than the distance e between the guide member 25 and the first member 1.

  With such a configuration, the second member 2 to be displaced can be easily displaced, so that the driving force for displacing can be small.

  FIG. 5B is a diagram showing a modification of the fourth embodiment.

  In FIG. 5B, a through hole 5 is formed in the first member 1, and a second member 31 having a through hole 32 is arranged on the lower surface side of the first member 1. It is installed. In the second member 32, a portion where the through hole 32 is formed with respect to the outer portion is formed in a concave shape. A guide member 25 that supports the second member 31 so as to be displaceable is disposed around the second member 31.

The distance between the portion of the second member 31 where the through hole 32 is formed and the first member 1 is d, the distance between the outer portion of the second member 31 and the first member 1 is f, and the guide. When the distance between the member 25 and the first member 1 is e, the following relationship is established.
d> e and f ≧ e
With such a configuration, the distance between the portion where the through hole of the second member to be displaced is formed and the first member is greater than the distance between the periphery of the second member and the first member. Therefore, the risk of damaging the through hole due to friction between members is reduced.

  FIG. 6 is a diagram showing a further modification of the fourth embodiment.

  In FIG. 6, a through hole 5 is formed in the first member 1, and a second member 31 having a through hole 32 is disposed on the lower surface side of the first member 1. Yes. In the second member 32, a portion where the through hole 32 is formed with respect to the outer portion is formed in a concave shape. A guide member 25 that supports the second member 31 so as to be displaceable is disposed around the second member 31.

In the example shown in FIG. 6, the following relationship is established among the intervals d, e, and f.
d> e and f <e
Even in this configuration, the distance between the first member and the portion where the through hole of the second member to be displaced is formed is larger than the distance between the periphery of the second member and the first member. Since it is set large, the risk of damaging the through hole is reduced.

  Moreover, in 4th Embodiment containing the modification etc. which are shown by FIG.5 and FIG.6, as FIG. 7 shows, the surface in which the through-hole 32 of the 2nd member 31 to displace is formed, The gap d between the surface and the surface of the first member facing the surface can be restricted to 10 μm or less.

  If the gap between the opposing surfaces is 10 μm or more, the fluid easily enters the gap portion, so that the fluid leaks in the valve device, but if it is 10 μm or less, the fluid must be introduced into the gap portion unless the fluid is introduced at high pressure. Never get in.

  The numerical value of the gap amount was determined by an experiment described below.

  8A and 8B are diagrams showing an experimental system used in an experiment showing the grounds for setting the gap amount to 10 μm or less. FIG. 8A is a top view and FIG. 8B is a cross-sectional view.

(I) A concave portion 34 having a depth of 3, 5, 10, 15 μm to be a gap portion is formed on the substrate 33 (shaded portion in (a)).
(Ii) A through hole serving as a fluid inlet / outlet is formed in the recess 34, and a transparent substrate is bonded to the side where the recess 34 is formed.
(iii) Finally, a tube was connected to the fluid introduction outlet to complete the experimental chip.
(Iv) A fluid (water) was introduced into the fluid introduction port via the pressure sensor 35, and it was evaluated for how much fluid introduction pressure the fluid leaks into the gap and flows out for each gap amount.

The evaluation results are as follows (see FIG. 9).
1) When the gap amount was 15 μm and 10 μm, the fluid leaked into the gap at a fluid introduction pressure of 1 kPa or less.
2) When the gap amount was 5 μm, the pressure at which fluid leak occurred was about 130 kPa.
3) The pressure at which fluid leakage occurred when the gap amount was 3 μm was about 170 kPa.
From the above results, if the gap amount is 10 μm or less, the fluid does not leak unless the fluid is introduced at a high pressure.

  This result was obtained without performing the water repellent surface treatment on the gap. It has already been confirmed that if the gap is treated with a water-repellent surface, no leakage to the gap occurs unless a fluid is introduced at a higher pressure.

  The above is the basis for setting the gap amount to 10 μm or less.

  As shown in the experimental results, the smaller the gap wall, the smaller the leak, which is desirable. However, a certain amount of gap is necessary for the slide portion to move. Considering the stability of the manufacturing process, the minimum gap amount is considered to be about 1 μm. Accordingly, considering both leakage and mobility, the gap amount is desirably 1 to 5 μm.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIGS.

  FIG. 10 is a perspective view showing a configuration of a sliding valve device according to a fifth embodiment of the present invention, and FIG. 11A is a cross section showing a first state of the sliding valve device according to the fifth embodiment. FIG. 5B is a cross-sectional view showing a second state of the sliding valve device according to the fifth embodiment.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  The slide type valve device according to the present embodiment includes a first member 38 and a second member 2 that are disposed so as to be relatively displaceable. The through holes 39 and 40 are formed at predetermined positions of the first member 38, and the through holes 3 are formed at predetermined positions of the second member 2 as flow paths for fluid movement. Furthermore, openings 39a and 40a are provided in the surface portion of the first member 38 in which the through holes 39 and 40 are formed. Similarly, an opening 3a is provided in the surface portion of the second member in which the through hole 3 is formed.

  Around the second member 2, a guide member 25 that does not have a flow path and restricts the displacement of the second member 2 is disposed. The guide member 25 has a plurality of contact portions 26 and a plurality of positioning portions 27 for positioning the second member 2.

  The guide member 25 is not connected to the second member 2 that restricts displacement by the guide member 25.

  The contact portion 26 and the positioning portion 27 formed on the guide member 25 are in point contact or line contact with the displaced second member 2.

  The guide member 25 is formed from the same base material as the second member 2.

  In such a configuration, for example, as shown in FIG. 11A, in the first state, the second member 2 displaced with respect to the first member 38 contacts the positioning portion 27. Set to position. At this time, the through hole 3 of the second member communicates with the through hole 39 of the first member.

  Thereafter, the second member 2 is displaced to be in the second state as shown in FIG. Then, the 2nd member 2 is contact | abutting to the positioning member 27 provided in the opposite side to the positioning member 27 shown by Fig.11 (a). In the second state, the through hole 3 of the second member communicates with the through hole 40 instead of the through hole 39.

  With such a configuration, for example, the through hole communicating with the through hole of the second member can be switched between the first state and the second state. Therefore, the flow path can be switched and controlled.

  With such a configuration, the displacement direction of the displaced member is regulated by the guide member, so that the displaced member can be controlled to a desired position.

  In the above-described embodiment, the guide member 25 is formed from the same base material as the second member 2, but is not limited thereto, and is formed from the same base material as the first member 1. It may be a thing.

(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described with reference to FIG.

  FIG. 12A is a side sectional view showing the configuration of the sliding valve device according to the sixth embodiment of the present invention, and FIG. 12B shows the state where the first member is removed from the sliding valve device of FIG. It is a top view.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  In FIG. 12, a connecting portion 43 formed by extending from the second member 2 is connected to the external driving device 42. The connection portion 43 connects the second member 2 and the external drive device 42 via an insertion portion 44 formed by cutting out a part of the guide member 25.

  The external drive device 42 is for driving the second member 2 whose displacement is regulated by the guide member 25 in the direction of the arrow shown in the figure.

  With this configuration, the displacement member and the external drive device can be easily connected.

  The insertion portion 44 may be a notch or a groove shape as long as the connection portion 43 passes therethrough.

(Seventh embodiment)
FIG. 13 is a view showing a configuration of a sliding valve device according to a seventh embodiment of the present invention, and FIG. 13A is a top view showing a first state of the sliding valve device according to the seventh embodiment. (B) is the top view which showed the 2nd state of the slide type valve apparatus by 7th Embodiment.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  The second member 2 that is displaceable with respect to the first member (not shown) is provided with a guide member 45 that does not have a flow path and restricts the displacement of the second member. The guide member 45 is formed with a plurality of contact portions 46 for restricting the direction in which the second member 2 is displaced with respect to the guide member 45. In addition, a plurality of positioning portions 47 for positioning the second member 2 are formed on one side of the guide member 45 in the direction in which the second member 2 is displaced. Between the positioning portions 47, an insertion portion 48 for pushing the second member by an external drive device (not shown) is formed.

  On the other hand, an urging member 49 having a positioning portion 50 for positioning the second member 2 is provided on the other side of the guide member 45 in the direction in which the second member 2 is displaced. .

  The contact portion 46 and the positioning portions 47 and 50 formed on the guide member 45 are in point contact or line contact with the second member 2 to be displaced.

  In such a configuration, when the second member 2 is pushed in the left direction in FIG. 13A by the external driving device, the urging member 49 is deformed and shown in FIG. 13B. It will be in the second state. After that, when the pushing force from the external drive device disappears, the second member 2 moves because it is urged by the elasticity of the urging member 49, and the first state shown in FIG.

  With such a configuration, after the displacement member is moved by the external drive device, the displacement member can be returned to the position before the movement by the restoring force of the spring.

  The urging member described above does not have to be configured by the same member as the guide member.

(Eighth embodiment)
Next, an eighth embodiment of the present invention will be described with reference to FIG.

  FIG. 14 shows the configuration of a sliding valve device according to an eighth embodiment of the present invention. FIG. 14 (a) is a top view showing the first member removed from the sliding valve device, and FIG. FIG.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  In FIG. 14, an insertion portion 54 through which a connection portion 57 described later is inserted is provided in the first member in which a through hole 53 is formed as a flow path at a predetermined location. A displaceable second member 55 is provided on the first member 53. The second member 55 is provided with a through hole 56 at a predetermined location as a flow path and a connection portion 57. The connection portion 57 is connected to the external drive device 42 via the insertion portion 54.

  In addition, a guide member 58 in which a plurality of contact portions 59 and a plurality of positioning portions 60 are formed is provided around the second member 2.

  The external drive device 42 is for driving the second member 2 whose displacement is regulated by the guide member 25 in the direction of the arrow shown in the figure.

  With such a configuration, the external drive device can be disposed directly above or directly below the valve element.

  The insertion portion 54 may have a notch shape or a groove shape as long as the connection portion 43 passes therethrough.

(Ninth embodiment)
Next, a ninth embodiment of the present invention will be described with reference to FIG.

  FIGS. 15A and 15B show a configuration of a sliding valve device according to a ninth embodiment of the present invention, wherein FIG. 15A is a perspective view and FIG. 15B is a side sectional view.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  The slide type valve device in the present embodiment is configured to have a first member 1 and a second member 63 which are disposed so as to be relatively displaceable. And the through-hole 5 is formed in the predetermined location of the 1st member 1, and the through-hole 64 is formed in the predetermined location of the 2nd member 63, respectively as a flow path for a fluid to move. Further, an opening 5a is provided on the surface of the first member 1 where the through hole 5 is formed, and similarly, an opening 64a is provided on the surface of the second member where the through hole 64 is formed. It has been.

  Further, the surface of the second member 63 facing the first member 1 is formed including a plurality of convex portions 67.

  Around the second member 2, a guide member 25 that does not have a flow path and restricts the displacement of the second member is disposed.

  The guide member 25 is not connected to the second member 2 that restricts displacement by the guide member 25.

  With such a configuration, the contact area between the displaced second member 63 and the opposed first member 1 is reduced. Therefore, since the frictional force is reduced, the driving force for displacing the displacement member can be small.

  Further, the ninth embodiment can be modified as follows.

  16 and 17 are diagrams showing a modification of the ninth embodiment.

  For example, as shown in FIG. 16A, it is assumed that the surface 68a of the second member 63 initially includes rough unevenness. Here, as shown in FIG. 16B, the smoothing thin film 68b is formed on the surface 68a.

  Thus, even if the surface of the second member is initially rough, it can be made smooth by forming a thin film on the surface.

  Further, for example, as shown in FIG. 17 (a), the second member 63 whose surface 69a initially includes rough irregularities is smoothed as shown in FIG. 17 (b). A smooth surface 69b is also possible.

  In this way, the second member having a rough surface is subjected to friction by forming a surface having fine irregularities of a desired size by, for example, forming a thin film on the surface of the surface. The force may be reduced.

(Tenth embodiment)
Here, the surface treatment of the member as described above will be described with reference to FIGS.

About the part where surface treatment is performed
a) Where fluid (solution) does not pass or does not come into contact with fluid
b) The entire opposite surface
c) Location excluding the periphery of the through hole
d) Location surrounding the through hole
e) Locations present on the entire surface or part of the grid, stripes, or polka dots
f) Location where the fluid (solution) passes through and contacts the fluid (hydrophilic treatment)
g) Range in which the member moves relatively
Etc. are considered.

  For example, in FIG. 18 (a), the entire surface of the member 160 other than the through-hole 162 through which the fluid passes is subjected to surface treatment (surface treatment portion 161). This corresponds to the above a) and b). Moreover, the shape of this surface treatment part 161 can consider various shapes as shown in FIG.

  One is a shape that is cut off substantially at right angles to the surface of the member 160 as shown in FIG. 19A and extends from the peripheral surface of the through-hole 162.

  The other is a shape that is tapered from the peripheral surface of the through-hole 162 to the surface of the surface treatment portion 161 in the member 160 as shown in FIG. In this case, in FIG. 19B, the diameter of the surface treatment portion 161 is formed such that the lower side (side where the through hole 162 is set) is smaller than the upper side. By providing the taper in this way, the fluid easily flows into the through hole 162.

  The other is a shape in which the member 160 is tapered in the direction opposite to that of FIG. 19B described above, as shown in FIG. 19C. That is, the diameter of the surface treatment portion 161 is formed such that the lower side (side to be set with the through hole 162) is larger than the upper side. Since the taper is provided in this way, the fluid is less likely to leak from the through hole 162 to the surface treatment unit 161 side.

  In addition to the surfaces where the members are opposed to each other as described above, the surface treatment may be performed on a surface where the gap between the surfaces of the other members facing each other is a predetermined value or less. Such a surface is a surface where the gap is intentionally set to a predetermined value or less in order to prevent liquid leakage, or is a surface that tends to cause friction with the surface facing the design, so surface treatment should be performed. Thus, leakage can be reduced and frictional force can be reduced.

  FIG. 18B corresponds to the above c). In the member 160, the surface treatment is not performed on the periphery of the through-hole 162, and the entire surface of the member 160 except the periphery is subjected to the surface treatment. The surface treatment unit 161 is provided.

  Further, FIG. 18C corresponds to the above d), and the surface treatment is performed only at a position surrounding the through-hole 162 at a predetermined interval from the through-hole 161 formed in the member 160. A portion 161 is formed.

  20A to 20C correspond to the above e), and FIG. 20A shows an example in which a lattice-shaped surface treatment portion 167 is formed on the entire surface of the member 160. FIG. FIG. 20B shows an example in which a striped surface treatment portion 168 is formed on the entire surface of the member 160. Further, FIG. 20C shows an example in which a surface treatment portion 169 existing in a polka dot shape is formed on the entire surface of the member 160.

  As described above, the surface treatment may be performed discontinuously so that portions having different surface characteristics are scattered, that is, a distribution of the surface characteristics is generated in a predetermined portion.

  20 (d) and FIG. 21 correspond to the above f) and show an example in which a surface treatment portion 170 is formed on the peripheral surface of the through-hole 162 through which the fluid passes. . As a result, a so-called hydrophilic treatment is performed to facilitate fluid passage through the through-hole 162.

  The treatment methods include (1) formation of fine irregularities, (2) formation of a water-repellent, oil-repellent, low-friction, wear-resistant film, (3) modification of the substrate surface, (4) hydrophilization, (5 ) Each process of switching hydrophilicity and water repellency is performed. The fine unevenness reduces frictional force and increases slidability. In addition, water repellency is increased and leakage is reduced.

  In the present invention, the surface treatment described above is described as being applied to at least one of the relatively displaceable first member or second member. In addition, the relatively displaceable first member and second member may be originally cut out from one member.

(1) Formation of fine irregularities
(A) Mechanical processing Examples of mechanical processing include polishing, blasting, and sputter etching.

  The polishing is performed by, for example, a polishing apparatus as shown in FIG. That is, a polishing film (or slurry) 176 is laid on a polishing platen 175, and a substrate 177 is placed thereon. Then, polishing is performed by rotating the polishing platen 175 while the processing surface of the substrate 177 is pressed by the pressurizing device 178.

  As a result, when the flow path is formed after polishing, abrasives and polishing debris do not enter the flow path.

  Blasting forms fine irregularities on the surface by spraying a fine-grained abrasive together with compressed air or high-pressure water on a processing surface at high speed. The processing state of the processing surface is controlled by the material and size of the abrasive, the spray pressure, and the like.

  When the flow path is formed after polishing in this way, abrasives and polishing debris do not enter the flow path.

  Sputter etching is performed as shown in FIG. That is, positive ions generated by glow discharge are accelerated by an electric field, collide with the cathode 181 from the anode 180, and etched. In general, Ar gas or the like is used.

  It is known that conical microprotrusions are formed on the PTFE surface by such treatment.

  In addition to performing the above treatment, a surface or layer having desired characteristics may be formed through a process including at least a chemical process such as the following (B) to (D). Alternatively, as represented by (2) of the fourteenth embodiment described later, a film having these characteristics may be added.

(B) Forming micropores
As the formation of micropores, it is conceivable to make the substrate porous and to form a porous film on the substrate.

As a material for making a substrate porous, porous alumina obtained by anodizing aluminum is known (for example, see Non-Patent Document 1).
Applied Physics Vol. 69 No. 5 558-562 (2000) According to this, porous alumina is formed by anodizing aluminum in an acidic electrolysis solution. Then, as shown in FIG. 24A, the aluminum substrate 183 is processed by applying a voltage of several tens to several hundreds V in an electric field solution 184 such as sulfuric acid, oxalic acid, phosphoric acid or the like. As a result, as shown in FIG. 24B, alumina 186 having fine holes 185 opened in a honeycomb shape is formed.

  Further, porous Si by anodizing Si is also known as a method for making a substrate porous.

  This is because if the Si substrate is processed while applying an electric field in a hydrofluoric acid aqueous solution, the substrate is anodized and then the oxide film is removed with the hydrofluoric acid aqueous solution, so that the substrate becomes porous.

  The porous film is formed on the substrate by forming the porous alumina by the above-described aluminum anodic oxidation. After the aluminum film is formed on the substrate, the same treatment is performed, so that the honeycomb surface is formed on the substrate surface. It is possible to form a perforated alumina film.

(C) Formation of fine particles, or formation of fine particles, fine fibers, and fine filler-containing resin For this, it is conceivable to first form a gold or silver metal nanoparticle paste by spin coating or the like.

  In addition, it is conceivable to form a film in which fine beads are blended with a fluorine-based resin or the like. For example, Asahi Glass Co., Ltd. Cytop as a fluororesin is blended with fine beads having a particle size of about 1 μm, and this is formed on a Si substrate by spin coating, for example. Next, a photoresist film is formed on the CYTOP film, and a resist is formed into a desired pattern by photolithography. Next, using this resist pattern as a mask, an RIE process using oxygen plasma is performed to etch the cytotop film, and the resist film is removed by immersing the substrate in an acetone solution. After that, a resist pattern is formed again, using this as a mask, through holes are formed in the Si substrate by ICP etching, and finally the mask resist film is peeled off with acetone, so that a mixture of microbeads at desired positions is obtained. A through hole forming substrate having a top pattern can be produced.

  The Cytop film is a fluorine-based resin film, which is originally water-repellent and has good slidability. Further, by forming in this way, fine irregularities due to microparticles are formed on the surface of the CYTOP film, so the contact surface becomes smaller and the friction is reduced. Water repellency is also increased by the effect.

Instead of fine particles, fine fibers such as carbon nanotubes or TiO ₂ fillers may be used.

Furthermore, a technique for forming a film by blending a TiO ₂ filler with the PTFE resin is also known (see, for example, Patent Document 2).
JP, 8-217941, A (D) Formation of a microprotrusion An experimental result of improvement of water repellency by microprotrusion formation is indicated (for example, refer to nonpatent literature 2). IEEE Micro Electro Mechanical Systems Conference Technical Digest pp 479-482 (2002) For the surface treatment described above, the members to be subjected to the surface treatment are shown only for one substrate, but the first to ninth embodiments described above are shown. Needless to say, the present invention can be applied to any of the first member, the second member, and the third member in the embodiments and the embodiments described below.

  FIG. 25 is a cross-sectional view showing a step of etching a substrate on which a mask is formed as a first example of the manufacturing process of the sliding valve device according to the tenth embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  Further, the surface treatment process described below is manufactured by a semiconductor fine processing technique.

  In FIG. 25A, for example, a silicon oxide film is formed on a silicon substrate 70, and this is patterned at a desired position by photolithography. If this patterned silicon oxide film 71 is used as a mask and the silicon substrate 70 is etched with an alkaline aqueous solution such as KOH or TMAH, the side surfaces are crystallized as shown in FIG. A conical protrusion 70a having a flat surface can be formed.

Further, if etching is performed using a mixed solution of hydrofluoric acid and acetic acid, the etching proceeds isotropically, so that a cone-shaped projection having a curved side surface can be formed. For example, even if a small amount of O ₂ gas is added to CF ₄ gas, SF ₆ gas or the like and plasma treatment is performed, isotropic etching proceeds, and a cone-shaped protrusion having a curved side surface can be formed.

  After the protrusion 70a is formed in this way, the silicon oxide film 71 that becomes a mask is removed as shown in FIG. And if the through-hole 72 is formed lastly as FIG.25 (d) shows, the through-hole formation board | substrate which has a processus | protrusion on the surface can be produced.

  As described above, when the protrusion is present on the surface of the substrate, the contact area is extremely small and the contact area is extremely small and the friction is reduced, so that the slidability is improved.

  With such a configuration, it is possible to form unevenness by a semiconductor microfabrication technique, and thus unevenness can be arranged at a specified position. Therefore, a valve device with stable characteristics can be provided.

  FIG. 26 shows a second example of the manufacturing process of the sliding valve device according to the tenth embodiment of the present invention, in which a mask is formed on a substrate, a RIE process is performed in a rectangular shape, and then a protrusion is formed by alkali anisotropic etching. It is sectional drawing which showed.

  In FIG. 26A, an oxide film mask 191 is formed on a silicon substrate 190 by photolithography, and the silicon substrate 190 is etched into a rectangular shape by RIE or ICP using this as a mask. Next, as shown in FIG. 26B, when anisotropic etching is applied with an aqueous alkali solution such as KOH or TMAH with the oxide film mask 191 on the surface formed in a rectangular shape left, As shown in FIG. 26C, the side surface of the rectangular pattern 190a is etched depending on the crystal plane.

  Therefore, as shown in FIG. 26 (d), as a result, a cone-shaped protrusion 190b can be formed. This method can form a conical pattern with better control than the method of anisotropic etching from the surface.

  FIG. 27 shows a step of forming a protrusion by forming a thin film on a substrate and etching the thin film by mask formation as a third example of the manufacturing process of the sliding valve device according to the tenth embodiment of the present invention. FIG.

  In FIG. 27A, for example, a silicon oxide film 74 is formed on the substrate 70. Then, as shown in FIG. 27B, a resist pattern 75 is formed on the surface. Using this as a mask, the silicon oxide film is etched with a hydrofluoric acid aqueous solution.

  Then, since the etching proceeds isotropically, the lower portion of the mask is gradually etched, and as a result, a cone-shaped pattern 74a is formed as shown in FIG. Further, as shown in FIG. 27D, a through hole 70 is formed.

It should be noted that polysilicon or amorphous silicon is formed instead of silicon oxide as described above, and this is subjected to isotropic etching by plasma etching with a mixed gas of CF ₄ , SF ₆ and oxygen, and the cone is similarly formed. Body-shaped protrusions may be formed.

  Of course, the thin film may be etched vertically by RIE or ICP instead of isotropic.

  In this way, when the thin protrusion is formed by etching the thin film, the controllability of the protrusion height is improved and the characteristics are stabilized.

  FIG. 28 is a cross-sectional view showing a process of forming a protrusion by sacrificial oxidation as a fourth example of the manufacturing process of the sliding valve device according to the tenth embodiment of the present invention.

  In FIG. 28A, a silicon nitride film 76 is formed on the surface of a silicon substrate 70, and a minute pattern is formed by photolithography. Thereafter, when the silicon substrate 70 is thermally oxidized, oxygen is not diffused from the surface of the silicon nitride film 76. Therefore, the silicon substrate 70 is not oxidized, but gradually from the end of the silicon nitride film 76 toward the inside of the pattern. Oxidation 77 proceeds in the lateral direction (FIG. 28 (b)).

  After the oxidation shown in FIG. 28C, if the silicon oxide film 77 is removed with a hydrofluoric acid aqueous solution and the pattern of the silicon nitride film 76 is peeled off with phosphoric acid or the like, the silicon substrate 70 is consumed by the thermal oxidation treatment. Therefore, as shown in FIG. 28D, as a result, a protrusion pattern 78 is formed. Thereafter, the through hole 72 is formed.

  In this method, the controllability of the protrusion height is good, and both surfaces of the substrate can be oxidized simultaneously, so that the process can be simplified.

(Eleventh embodiment)
Next, an eleventh embodiment of the present invention will be described with reference to FIG.

  FIG. 29 is a cross-sectional view showing a manufacturing process of the sliding valve device according to the eleventh embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  Further, the surface treatment process described below is manufactured by a semiconductor fine processing technique.

  In FIG. 29A, a thin film 80 such as aluminum is formed on a silicon substrate 70. Next, as shown in FIG. 29B, a porous thin film 81 is formed. Then, as shown in FIG. 29C, a through hole 72 is finally formed.

  Thus, by forming the porous thin film, the contact area between the member to be displaced and the member to be opposed is reduced, and the frictional force is reduced, so that the driving force for displacing the displacement member can be small. Therefore, a small and inexpensive valve device can be provided.

(Twelfth embodiment)
Next, a twelfth embodiment of the present invention will be described.

  FIG. 30 shows a first example of the manufacturing process of the sliding valve device according to the twelfth embodiment of the present invention, and shows an example of performing the etching process by RIE under the condition that black silicon is formed without a mask. FIG.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  Further, the surface treatment process described below is manufactured by a semiconductor fine processing technique.

First, in FIG. 30A, the silicon substrate 70 is etched by RIE with a mixed gas of SF ₆ gas and O ₂ gas. At this time, if the amount of O ₂ gas added exceeds 20% of the total gas amount, a large number of needle-like microprotrusions 83 are formed on the surface of the silicon substrate, resulting in blackening (FIG. 30B). Therefore, although it is called black silicon, this improves the water repellency and slidability of the substrate surface.

Black silicon can be formed because, as the O ₂ gas content increases, the etching rate ratio of silicon to the oxide film is improved, and the oxide film formed by substrate surface oxidation by discharge becomes a mask. it is conceivable that.

  As shown in FIG. 30C, a through hole 72 is formed on the silicon substrate 70 on which the needle-like microprojections 83 are formed.

  FIG. 31 is a sectional view showing a second example of the manufacturing process of the sliding valve device according to the twelfth embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  Further, the surface treatment process described below is manufactured by a semiconductor fine processing technique.

  Similar to the first example described above, as shown in FIG. 31A, the silicon substrate 70 is etched by RIE. Then, as shown in FIG. 31 (b), a microscopic projection 84 that is made porous is formed on the surface of the silicon substrate 70. Further, as shown in FIG. 31 (c), a through hole 72 is formed in the silicon substrate 70.

  As described above, according to the twelfth embodiment, by making the material porous or needle-shaped, the contact area between the member to be displaced and the member to be opposed is reduced, and the frictional force is reduced, so that the displacement member is displaced. The driving force for making it small is sufficient. In addition, since it is not necessary to form a new material, a small and inexpensive valve device can be provided.

(13th Embodiment)
Next, a thirteenth embodiment of the present invention is described.

  FIG. 32 is a view showing a manufacturing process of the sliding valve device according to the thirteenth embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  Further, the surface treatment process described below is manufactured by a semiconductor fine processing technique.

  First, as shown in FIG. 32A, a film 86 mixed with fine particles and fine fiber-dissolved resin is formed on one surface of the silicon substrate 70, in this case, the upper surface. Next, as shown in FIGS. 32B to 32D, steps of forming the mask pattern 87, etching, peeling the mask pattern, and forming the through hole are performed. The steps executed in FIGS. 32A to 32D are the same as those in the third example of the tenth embodiment shown in FIGS. 27A to 27D.

  FIG. 32 (e) is an enlarged view of the pattern 86a shown in FIG. 32 (d).

  With such a configuration, the unevenness can be stably formed, so that a small and inexpensive valve device can be provided.

(Fourteenth embodiment)
FIG. 33 is a side sectional view showing the configuration of the sliding valve device according to the fourteenth embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  In FIG. 33, the first member 1 has a through hole 5, and a second member 90 having a through hole 92 is disposed on the lower surface side of the first member 1. Yes. Further, a surface treatment portion 91 is provided on the surface of the second member 90 facing the first member 1. A guide member 25 is disposed around the second member 90 to support the second member 90 so that the second member 90 can be displaced.

  The surface treatment portion 91 may be formed of water repellency, oil repellency, or a low friction material such as fluororesin, parylene, or silicon nitride film.

  As described above, when the water and oil repellent material is formed on the surface of the second member, the fluid leaks to the gap between the displaced member and the opposing member. Further, since the frictional force between the members is reduced by forming the low friction material, the driving force for displacing the displacement member can be small. Therefore, it is possible to provide a high-performance, small and inexpensive valve device.

  Here, the formation of the above-described water-repellent, oil-repellent, low-friction, and wear-resistant film will be described.

(2) Water-repellent, oil-repellent, low-friction, wear-resistant film formation
As the wear-resistant film, C (carbon), cBN (cubic boron nitride), TiN, TiC, Si ₃ N ₄ , Al ₂ O _{3 and the} like can be considered.

As the low-friction, PTFE, Au, Ag, MoS 2, WS 2, TiO 2 or the like.

  As the water repellency and cocoon oil, a CF polymer film, PTFE, fluorine resin, silicone rubber, and the like can be considered.

  Among these various film materials, the PETE film has low friction and water and oil repellency functions, so that it is possible to reduce the driving force of the valve transition portion and to reduce the leak amount. Therefore, it is a membrane suitable for providing a high performance, small and inexpensive valve device.

  As film formation methods, sputtering, vapor deposition, LPCVD (low pressure vapor deposition), APCVD (atmospheric pressure vapor deposition), plasma CVD (plasma induced vapor deposition), spin coating, dip, spray coating, LB There are laws.

(3) Modification of substrate surface Modification of the substrate surface includes coupling agent treatment, ion implantation, gas treatment, and the like.

  Coupling agent treatment involves chemical bonding between the coupling agent and the surface by immersing the substrate in a silane, titanium, organophosphate, or silyl peroxide coupling agent and drying in an oven. Is formed. It is also possible to place a coupling agent in an oven and form a chemical bond by a gas phase reaction with the evaporated coupling agent.

  As ion implantation, ion implantation is performed on the substrate to improve water repellency and oil repellency and improve wear resistance.

  Further, as the gas treatment, by leaving the substrate in a fluorine atmosphere, fluorine is introduced to the surface of the substrate to improve water repellency and oil repellency.

(4) Hydrophilization This hydrophilization is a process for increasing the surface energy of the surface through which the fluid flows.

  The wettability is best when the surface energy of the substrate and the surface tension of the solution are comparable. The surface tension of water is about 72 dyn / cm, and the surface energy of the resin material is about 30 to 50 dyn / cm. Therefore, if the surface energy of the substrate is increased, the wettability to water is improved.

  The treatment for increasing the surface energy of the surface through which the fluid flows includes plasma treatment such as corona discharge and glow discharge plasma, UV ozone treatment, and surfactant treatment.

For plasma processing such as corona discharge and glow discharge plasma, for example, in the case of glow discharge plasma processing, the substrate is placed in a processing apparatus, the pressure is reduced and the residual gas is removed, and then O ₂ gas is introduced at 100 cc / min, 100 W The wettability of the substrate is improved by performing oxygen plasma treatment by applying RF. CO gas or the like is also used instead of O ₂ gas.

  For UV ozone treatment, when UV irradiation is applied to the resin surface, hydrogen atoms on the surface are extracted, and when active oxygen is introduced there, oxygen atoms are bonded to the surface to form C—O and C═O bonds, resulting in wetting. Increases nature.

  In the surfactant treatment, a thin film is formed by immersing the substrate in a surfactant solution, lifting the substrate, and drying it in an oven. When 3 surfactants are added to the resin substrate 100 and then baked in an oven at 50 degrees for 10 hours, a hydrophilic surface can be obtained.

  The above-described plasma treatment such as corona discharge and glow discharge plasma and UV ozone treatment are for modifying the substrate, and the surfactant treatment is for forming on the substrate.

(5) Switching between hydrophilicity and water repellency due to changes in temperature, pH, etc. For example, the following documents are known for resins whose hydrophilicity and water repellency are switched depending on the temperature (for example, see Patent Document 4).
According to JP-A-7-318551, for example, a carrier having an amino group, a carboxyl group, a hydroxyl group or the like on the surface, and a polyalkylacrylamide having an amino group, a carboxyl group, a hydroxyl group or the like at the terminal, or the like This is achieved by chemical modification with a copolymer.

  As described above, as described in the ninth to fourteenth embodiments, the predetermined portion of the member (substrate) constituting the slide type valve is represented by, for example, the ninth embodiment and the tenth embodiment. The surface shape is changed, the surface of the member itself is modified as represented by the fourteenth embodiment (3) and (4), or the eleventh embodiment and the fourteenth embodiment (1) and ( By performing a predetermined surface treatment such as forming a film on the surface of the member as typified by 2), a high performance sliding valve device can be provided.

  Furthermore, the above surface treatment is treatment according to the purpose of use of the valve (characteristics of the flowing fluid), and the characteristics of the treatment surface change according to the temperature, the characteristics of the fluid in contact with the pH, the external environment, etc. It may be what you do.

  In addition, the surface treatment as described above may be performed before or after the first member or the second member or the guide member is separated, depending on the part to be treated, the method for treatment, and the method for manufacturing the valve. Before assembling, after assembling, it can be performed in an appropriate process such as the beginning and the end of the manufacturing process.

(Fifteenth embodiment)
Next, a fifteenth embodiment of the present invention is described with reference to FIG.

  FIG. 34 shows a configuration of a slide type valve device according to a fifteenth embodiment of the present invention, in which (a) is a perspective view and (b) is a side sectional view.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  The sliding valve device according to the present embodiment is configured to include a first member 1 and a second member 94 that are disposed so as to be relatively displaceable. And the through-hole 5 is formed in the predetermined location of the 1st member 1, and the through-hole 95 is formed in the predetermined location of the 2nd member 94 as a flow path for a fluid to move, respectively. Furthermore, an opening 5a is provided in the surface portion of the first member 1 where the through hole 5 is formed, and similarly, an opening portion 95a is provided in the surface portion of the second member where the through hole 95 is formed. It has been.

  The surface of at least one of the opposing surfaces of the first member 1 and the second member 94, in this case the surface 97 side of the second member 94 facing the first member 1, is the second member. The surface is smoother than the surface 96 facing the 94 guide members 25.

  As described above, if the surface provided with the opening or the surface facing the surface is excessively rough, the fluid is likely to leak between the surfaces. On the other hand, since the other surface of the member is not related to fluid leakage, the processing accuracy may be lowered and the surface may be somewhat rough. Therefore, an inexpensive valve device can be provided by the configuration of the fifteenth embodiment.

(Sixteenth embodiment)
Next, with reference to FIGS. 35 and 36, a sixteenth embodiment of the present invention will be described.

  FIG. 35 is a perspective view showing a configuration of a sliding valve device according to a sixteenth embodiment of the present invention, and FIG. 36A is a cross section showing a first state of the sliding valve device according to the sixteenth embodiment. FIG. 4B is a cross-sectional view showing a second state of the sliding valve device according to the sixteenth embodiment, and FIG. 4C is a cross-sectional view showing a third state of the sliding valve device according to the sixteenth embodiment. FIG.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  The sliding valve device according to the present embodiment includes a first member 100, a second member 105, and a third member 109 that are disposed so as to be relatively displaceable. Yes. A plurality of, in this case, three through holes 101, 102, and 103 are formed at predetermined locations of the first member 100 as flow paths for fluid movement. Further, a long hole-like through hole 106 and a U-shaped through hole 107 are formed at predetermined positions of the second member 105 as flow paths for fluid movement. Further, for example, three through holes 110, 111, and 112 corresponding to the through holes 101, 112, and 103 formed in the first member 100 move to predetermined locations of the third member 109, respectively. It is formed as a flow path.

  And the opening part 101a, 102a, 103a is provided in the surface part of the 1st member 100 in which the through-holes 101, 102, 103 are formed. Similarly, openings 110a, 111a, and 112a are provided in the surface portion of the third member 109 in which the through holes 109, 110, and 111 are formed.

  A guide member 25 that does not have a flow path and restricts the displacement of the second member 105 is disposed around the second member 105. The guide member 25 is formed with a plurality of contact portions 26 and a plurality of positioning portions 27 for positioning the second member 105.

  The guide member 25 is not connected to the second member 105 that restricts displacement by the guide member 25.

  The contact portion 26 and the positioning portion 27 formed on the guide member 25 are in point contact or line contact with the displaced second member 105.

  The guide member 25 is formed from the same base material as the second member 105.

  In such a configuration, for example, as shown in FIG. 36A, in the first state, the through hole 103 of the first member 100 and the third hole 103 are formed by the through hole 106 of the second member 105. The member 109 communicates with the through hole 112. As a result, fluid accumulates in the through hole 106 of the second member 105. Similarly, the through hole 102 of the first member 100 and the through hole 111 of the third member 109 communicate with each other through the through hole 107 of the second member 105. As a result, fluid accumulates in the through hole 107 of the second member 105.

  Next, as shown in FIG. 36B, a state in which the second member 105 slides and comes into contact with one side of the guide member 25 is defined as a second state. In the second state, the through hole 101 of the first member 100 and the through hole 110 of the third member 109 communicate with each other through the through hole 106 of the second member 105. Thereby, the fluid accumulated in the through hole 106 of the second member 105 is led out to the through hole 110 of the third member 109.

  On the other hand, as shown in FIG. 36C, a state where the second member 105 slides and contacts the other side of the guide member 25 is defined as a third state. In the third state, the through hole 101 of the first member 100 and the through hole 110 of the third member 109 communicate with each other through the through hole 107 of the second member 105. Thereby, the fluid accumulated in the through hole 107 of the second member 105 is led out to the through hole 110 of the third member 109.

  By setting it as such a structure, the through-hole connected for a 1st state, a 2nd state, and a 3rd state can be switched, for example. Therefore, it is possible to switch and control the flow path, and it is possible to introduce different volumes of fluid into the desired flow path.

(Seventeenth embodiment)
FIGS. 37A and 37B show the configuration of a sliding valve device according to a seventeenth embodiment of the present invention. FIG. 37A is a cross-sectional view, and FIG. 37B shows the first member removed from the sliding valve device of FIG. FIG.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  In FIG. 37, light is transmitted on the upper surface side of the first member 1 in which the through holes 5 are formed at predetermined positions, except for a portion irradiated with light from the photodetector 120 as the position detector 116. A prevention film 115 is formed.

  On the lower surface side of the first member 1, a second member 117 having a through hole 118 corresponding to the through hole 5 of the first member 1 formed as a flow path at a predetermined location is provided so as to be displaceable. ing. A connecting portion 57 is also connected to the second member 117. Furthermore, on the upper surface side of the second member 117, position detection means for detecting the relative displacement of the second member 117 with respect to the first member 1 is provided. In this case, the position detection means detects the position by a position detection pattern 119 for detecting the position and a position detector 120 that is a reading device for reading the position detection pattern 119. A pattern 119 is provided.

  On the lower surface side of the second member 117, a through hole 53 is formed as a flow path at a predetermined location, and an insertion portion 54 for inserting the connection portion 57 is formed.

  In addition, a guide member 25 having a plurality of contact portions 26 and a plurality of positioning portions 27 is provided around the second member 117.

  The external drive device 42 is for driving the second member 2 whose displacement is regulated by the guide member 25 in the direction of the arrow shown in the figure.

  With such a configuration, the position of the displaced second member 117 can be detected by the external position detector 120. If this position information is fed back to the external drive device 42, the second member 117 displaced to a free position can be moved.

  The position detection pattern 119 is composed of irregularities, a film having a reflectance different from that of the substrate on which the pattern is formed, a through hole, an impurity diffusion layer, and the like.

  Further, the position detection unit 116 includes a through hole, a member in which the detection unit is formed, and a light transmittance that is changed, and an impurity diffusion layer.

  Furthermore, a position control means for controlling the relative displacement based on the position detected by the position detection means may be provided.

(Eighteenth embodiment)
Next, an eighteenth embodiment of the present invention will be described.

  FIG. 38A is a cross-sectional view showing the configuration of the sliding valve device according to the eighteenth embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  The sliding valve device according to the present embodiment is configured to include a first member 123 and a second member 126 which are disposed so as to be relatively displaceable. Two through holes 124 and 125 are formed at predetermined positions of the first member 123. In addition, a groove 127 is formed horizontally at a predetermined location on the upper surface of the second member 126 on the surface facing the through holes 124 and 125. The through holes 124 and 125 and the groove 127 are each formed as a flow path for fluid movement.

  In addition, a guide member 25 that does not have a flow path and restricts the displacement of the second member 126 is disposed around the second member 126.

  In addition, although the contact part and the positioning part are formed in the said guide member 25 similarly to embodiment mentioned above, in order to simplify description, it shall not illustrate here.

  In such a configuration, for example, in the first state indicated by the solid line, the groove 127 formed in the second member 126 communicates with the two through holes 124 and 125 of the first member 123. Is set to When the second member 126 is slid in the direction indicated by the arrow and reaches the position of the second state indicated by the broken line, the through hole 125 and the groove 127 are communicated, but the through hole 124 is not communicated with the groove 127. It becomes a state.

  By configuring in this way, a flow path is configured in the valve device, so that chemical operations are performed using this flow path, and when connecting to other flow paths, various volume flow rates are cut off. Thus, on / off control is possible.

  In FIG. 38 (a), the groove as the flow path is formed on the side of the second member that is displaced with respect to the first member. However, as shown in FIG. A groove may be provided on one member side.

  In other words, the slide type valve device includes the first member 129 and the second member 131 that are relatively displaceably disposed. Two through holes 132 and 133 are formed at predetermined positions of the second member 131. In addition, a groove 130 is formed horizontally at a predetermined location on the lower surface of the first member 129 on the surface facing the through holes 132 and 133. The through holes 131 and 132 and the groove 130 are each formed as a flow path for fluid movement.

  In addition, a guide member 25 that does not have a flow path and restricts the displacement of the second member 131 is disposed around the second member 131.

  In addition, although the contact part and the positioning part are formed in the said guide member 25 similarly to embodiment mentioned above, in order to simplify description, it shall not illustrate here.

  In such a configuration, for example, in the first state indicated by the solid line, the position where the groove 130 formed in the first member 129 communicates with the two through holes 132 and 133 of the second member 131. Is set to Then, when the second member 131 is slid in the direction indicated by the arrow and reaches the position of the second state indicated by the broken line, the through hole 132 and the groove 130 communicate with each other, but the through hole 133 does not communicate with the groove 130. It becomes a state.

(Nineteenth embodiment)
Next, a nineteenth embodiment of the present invention is described.

  FIG. 39A is a cross-sectional view showing a configuration of a sliding valve device according to a nineteenth embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  In the nineteenth embodiment, in the eighteenth embodiment described above, a sensor composed of an electrode, a diffusion layer, and the like is formed on a member facing the member on which a horizontal groove is formed. is there.

  That is, in FIG. 39A, a sensor 135 is provided in the first member 123 between the through hole 124 and the through hole 125 at a position facing the horizontal groove 127 of the second member. Yes. The sensor 135 is composed of an electrode, a diffusion layer, and the like, and is for detecting physical and chemical characteristics of the fluid flowing in the groove 127.

  Since other configurations and operations are the same as those in the fifteenth embodiment described above, the same parts are denoted by the same reference numerals, and illustration and detailed description thereof are omitted.

  In FIG. 39B, the second member 131 flows into the groove 130 between the through hole 132 and the through hole 133 at a position facing the horizontal groove 130 of the first member. A sensor 136 for detecting the physical and chemical characteristics of the fluid is provided.

  Since other configurations and operations are the same as those in the eighteenth embodiment described above, the same portions are denoted by the same reference numerals, and illustration and detailed description thereof are omitted.

  With this configuration, it becomes possible to detect the physical and chemical characteristics of the fluid flowing in the horizontal groove within the valve, so that a high-performance valve device can be provided.

(20th embodiment)
FIG. 40 is a cross-sectional view showing the configuration of the sliding valve device according to the twentieth embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  In FIG. 40 (a), the sliding valve device according to the present embodiment includes a first member 140 and a second member 143 disposed so as to be relatively displaceable. Has been. A guide member 25 is disposed around the second member 143.

  A plurality of, in this case, two through holes 141 and 142 are formed at predetermined locations of the first member 140 as flow paths for fluid movement. In addition, a groove 144 communicating with the two through holes 141 and 142 is formed in a predetermined portion of the second member 143 on the surface facing the first member 140 as a flow path for fluid movement. Has been.

  Furthermore, as shown in FIG. 40 (b), a third member 145 is disposed on the opposite surface side of the first member 140 to the side opposite to where the second member 143 is disposed. It is installed. And the groove | channels 146 and 147 connected to the two through-holes 141 and 142 of the 1st member are each formed in the predetermined location of this 3rd member 145 as a flow path for a fluid to move.

  With this configuration, it is possible to control the fluid flowing between the flow paths connected via the two through holes.

(21st Embodiment)
Next, a twenty-first embodiment of the present invention will be described.

  FIG. 41 is a cross-sectional view showing the configuration of the sliding valve device according to the twenty-first embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  In FIG. 41, the sliding valve device according to the present embodiment includes a first member 1, a second member 2 disposed so as to be relatively displaceable, a third member 150, and a first member. 4 members 154. Further, a guide member 25 is disposed around the second member 2.

  A through hole 5 is formed at a predetermined location of the first member 1 as a flow path for fluid movement. In addition, a through hole 3 that can communicate with the through hole 5 of the first member 1 is formed at a predetermined location of the second member 2 as a flow path for fluid movement.

  The third member 150 is disposed on the opposite surface side of the second member 2 on the side opposite to the first member 1. In addition, a predetermined portion of the third member 150 includes a through hole 151 communicating with the through hole 3 of the second member 2 and a groove (channel flow path) communicating with the through hole 151 and extending in the horizontal direction. ) 153 and a through-hole 152 communicating with the groove 153 are formed as flow paths for fluid movement.

  A fourth member 154 is disposed on the side of the third member 150 opposite to the surface facing the second member 2 so as to cover the groove 153. Note that the third member 150 and the fourth member 154 form a microchannel structure.

  In such a configuration, for example, a fluid (not shown) introduced from the through hole 5 of the first member 1 is transferred to the third member 150 via the through hole 3 of the second member 2. It is led out from the through hole 152 through the formed through hole 151 and groove 153. Here, the amount of fluid flowing through the through hole 3 is controlled by sliding the second member 2. That is, it is possible to control the fluid flowing through the flow path constituted by the through holes and grooves. Of course, this fluid control is also applicable to the case where the fluid flows from the through hole 152 toward the through hole 5.

  With this configuration, since the groove extending horizontally in the third member is covered with the fourth member, the first and second members may be smaller than the third member. The fluid can flow in the groove.

  Since the production of the relatively movable first and second members takes time, if a large number of these are produced on the same substrate using a semiconductor manufacturing technique, cut and separated, and then joined to the third substrate, It is possible to provide a small and high-performance valve device that can perform high-precision chemical operation at low cost.

  The third member and the fourth member described above form a microchannel structure. However, the present invention is not limited to this, and both the third member and the fourth member are originally integrated. It may be configured as follows.

(Twenty-second embodiment)
Next, a twenty-second embodiment of the present invention is described.

  FIG. 42 is a sectional view showing the structure of a sliding valve device according to the twenty-second embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  42, the sliding valve device according to the present embodiment includes a first member 1, a second member 2 disposed so as to be relatively displaceable, a third member 155, and a second member. 4 members 158. Further, a guide member 25 is disposed around the second member 2.

  A through hole 5 is formed at a predetermined location of the first member 1 as a flow path for fluid movement. In addition, a through hole 3 that can communicate with the through hole 5 of the first member 1 is formed at a predetermined location of the second member 2 as a flow path for fluid movement.

  The third member 155 is disposed on the opposite surface side of the second member 2 and on the opposite side to the first member 1. In addition, at predetermined positions of the third member 155, a through hole 156 communicating with the through hole 3 of the second member 2 and a through hole 157 spaced apart from the through hole 156 are respectively supplied with fluid. It is formed as a flow path for movement.

  A fourth member 158 in which a groove (channel channel) 159 extending in the horizontal direction is formed on the opposite side of the third member 155 from the surface facing the second member 2. Has been. The groove 159 communicates the two through holes 156 and 157 formed in the third member.

  The third member 155 and the fourth member 158 form a microchannel structure.

  In such a configuration, for example, fluid (not shown) introduced from the through hole 5 of the first member 1 is formed in the through hole 3 of the second member 2 and further to the third member 155. It is led out from the through hole 157 of the third member 155 through the groove 159 of the fourth member through the formed through hole 156. Here, the amount of fluid flowing through the through hole 3 is controlled by sliding the second member 2. That is, it is possible to control the fluid flowing through the flow path constituted by the through holes and grooves. Of course, this fluid control is also applicable to the case where the fluid flows from the through hole 157 toward the through hole 5.

  With this configuration, since the groove extending in the horizontal direction on the fourth member is covered with the third member, the first member and the second member are formed with grooves. Even if it is smaller than the member of 4, the fluid can flow in the groove.

  The third member and the fourth member described above form a microchannel structure. However, the present invention is not limited to this, and both the third member and the fourth member are originally integrated. It may be configured as follows.

(23rd embodiment)
Next, a twenty-third embodiment of the present invention is described.

  FIG. 43 is a sectional view showing the structure of a sliding valve device according to a twenty-third embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  Referring to FIG. 43, the sliding valve device according to the present embodiment includes a first member 1 and a second member disposed so as to be relatively displaceable on the upper surface side of the first member 1. 2, and a third member 150 and a fourth member 154. Further, a guide member 25 is disposed around the second member 2.

  A through hole 5 is formed at a predetermined location of the first member 1 as a flow path for fluid movement. In addition, a through hole 3 that can communicate with the through hole 5 of the first member 1 is formed at a predetermined location of the second member 2 as a flow path for fluid movement.

  The third member 150 is disposed on the opposite surface side of the first member 1 and on the opposite side to the second member 2. A predetermined portion of the third member 150 includes a through hole 151 communicating with the through hole 5 of the first member 1 and a groove (channel flow path) communicating with the through hole 151 and extending in the horizontal direction. ) 153 and a through-hole 152 communicating with the groove 153 are formed as flow paths for fluid movement.

  A fourth member 154 is disposed on the side of the third member 150 opposite to the surface facing the first member 1 so as to cover the groove 153. Note that the third member 150 and the fourth member 154 form a microchannel structure.

  In such a configuration, for example, a fluid (not shown) introduced from the through hole 3 of the second member 2 is transferred to the third member 150 via the through hole 5 of the first member 1. It is led out from the through hole 152 through the formed through hole 151 and groove 153. Here, when the second member 2 slides, it is possible to control the fluid flowing in the flow path constituted by the through hole and the groove. Of course, this fluid control is also applicable to the case of flowing from the through hole 152 toward the through hole 3.

  With this configuration, since the groove extending horizontally in the third member is covered with the fourth member, the first and second members may be smaller than the third member. The fluid can flow in the groove.

  Since the production of the relatively movable first and second members takes time, if a large number of these are produced on the same substrate using a semiconductor manufacturing technique, cut and separated, and then joined to the third substrate, It is possible to provide a small and high-performance valve device that can perform high-precision chemical operation at low cost.

  The third member and the fourth member described above form a microchannel structure. However, the present invention is not limited to this, and both the third member and the fourth member are originally integrated. It may be configured as follows.

(24th Embodiment)
Next, a twenty-fourth embodiment of the present invention is described.

  FIG. 44 is a cross-sectional view showing the configuration of the sliding valve device according to the twenty-fourth embodiment of the present invention.

  In the embodiments described below, the same reference numerals are assigned to the same parts as those in the above-described embodiments, and the illustration and detailed description thereof are omitted.

  44, the sliding valve device according to the present embodiment includes a first member 1 and a second member disposed so as to be relatively displaceable on the upper surface side of the first member 1. 2, and a third member 155 and a fourth member 158. Further, a guide member 25 is disposed around the second member 2.

  A through hole 5 is formed at a predetermined location of the first member 1 as a flow path for fluid movement. In addition, a through hole 3 that can communicate with the through hole 5 of the first member 1 is formed at a predetermined location of the second member 2 as a flow path for fluid movement.

  The third member 155 is disposed on the opposite surface side of the first member 1 and on the opposite side of the second member 2. Then, at predetermined positions of the third member 155, a through hole 156 communicating with the through hole 5 of the first member 1 and a through hole 157 provided away from the through hole 156 are respectively supplied with fluid. It is formed as a flow path for movement.

  A fourth member 158 having a groove (channel channel) 159 extending in the horizontal direction is disposed on the opposite side of the third member 155 from the surface facing the first member 1. Has been. The groove 159 communicates the two through holes 156 and 157 formed in the third member.

  The third member 155 and the fourth member 158 form a microchannel structure.

  In such a configuration, for example, a fluid (not shown) introduced from the through hole 3 of the second member 2 is formed in the through hole 5 of the first member 1 and further to the third member 155. It is led out from the through hole 157 of the third member 155 through the groove 159 of the fourth member through the formed through hole 156. Here, when the second member 2 slides, it is possible to control the fluid flowing in the flow path constituted by the through hole and the groove. Of course, this fluid control is also applicable to the case where the fluid flows from the through hole 157 toward the through hole 3.

  With this configuration, since the groove extending in the horizontal direction on the fourth member is covered with the third member, the first member and the second member are formed with grooves. Even if it is smaller than the member of 4, the fluid can flow in the groove.

  The third member and the fourth member described above form a microchannel structure. However, the present invention is not limited to this, and both the third member and the fourth member are originally integrated. It may be configured as follows. Needless to say, the surface treatment as described above may also be performed on the surface of the second member facing the third member or the third member.

  The embodiment relating to the invention described in claim 1 corresponds to the tenth to fourteenth embodiments. And according to invention of Claim 1, a high performance slide type valve apparatus can be provided by performing a predetermined surface treatment to a predetermined part.

  The tenth to fourteenth embodiments correspond to the embodiment relating to the invention described in claim 2. According to the second aspect of the present invention, since the first member and the second member can be integrally formed, a high-performance and inexpensive valve device can be provided.

  The tenth to fourteenth embodiments correspond to the third embodiment related to the invention. And according to invention of Claim 3, a small and cheap valve apparatus can be provided.

  The tenth to fourteenth embodiments correspond to the embodiments of the invention described in claim 4. According to the fourth aspect of the present invention, since the guide member in the displacement direction and the displacement restricting portion can be assembled integrally, it is possible to provide a high-performance and inexpensive valve device. .

  The embodiment related to the invention according to claim 5 corresponds to the tenth to fourteenth embodiments. And according to invention of Claim 5, it becomes possible to provide a highly efficient valve apparatus.

  The embodiment relating to the invention described in claim 6 corresponds to the tenth to fourteenth embodiments. Further, according to the invention described in claim 6, since the slidability between the displacing member and the facing member is improved or the leakage is reduced, a high performance valve device is provided. Is possible.

  The tenth to fourteenth embodiments correspond to the embodiments of the invention described in claim 7. According to the seventh aspect of the present invention, since the displacing member can be easily displaced without leaking the fluid, the driving force for displacing can be small, so a small and inexpensive valve device can be obtained. Can be provided.

  The embodiment related to the invention described in claim 8 corresponds to the tenth to fourteenth embodiments. And according to invention of Claim 8, a small and cheap valve apparatus can be provided.

  The embodiment relating to the ninth aspect of the invention corresponds to the tenth to fourteenth embodiments. According to the ninth aspect of the present invention, since it becomes difficult for the fluid to flow except the flow path, the leakage is reduced, so that a high performance valve device can be provided.

  The tenth to fourteenth embodiments correspond to the embodiments of the invention described in claim 10. According to the invention described in claim 10, since surface treatment can be easily performed, an inexpensive and high-performance valve device can be provided.

  The embodiment relating to the invention described in claim 11 corresponds to the tenth to fourteenth embodiments. According to the eleventh aspect of the invention, if the inside of the flow path is subjected to a hydrophilic treatment, water can easily flow through the flow path, so that a high-performance valve device can be provided.

  The embodiment related to the invention described in claim 12 corresponds to the tenth to fourteenth embodiments. According to the twelfth aspect of the present invention, since the fluid easily flows toward the opening, it is possible to provide a high performance valve device.

  The embodiment related to the invention described in claim 13 corresponds to the tenth to fourteenth embodiments. According to the invention described in claim 13, it is possible to provide a low-cost and high-performance valve device that is simple in surface treatment.

  The embodiment related to the invention described in claim 14 corresponds to the tenth to fourteenth embodiments. And according to invention of Claim 14, since the slidability between the member to which it displaces and the member which opposes improves, or a leaking property reduces, a high performance valve apparatus is provided. Is possible.

  The embodiment related to the invention described in claim 15 corresponds to the tenth to fourteenth embodiments. According to the fifteenth aspect of the present invention, since the surface treatment becomes easy, an inexpensive and high-performance valve device can be provided.

  The embodiment related to the invention described in claim 16 corresponds to the tenth to fourteenth embodiments. According to the sixteenth aspect of the present invention, a fluid can easily enter a flow path for performing chemical treatment or the like, so that a high performance valve device can be provided.

  The embodiment related to the invention described in claim 17 corresponds to the tenth to fourteenth embodiments. And according to the invention of claim 17, since it is difficult for water to flow in the water repellent part, it is possible to flow water only to a predetermined part if this treatment is performed on a part where water is not desired to flow. A high-performance valve device can be provided.

  The tenth to fourteenth embodiments correspond to the embodiment of the invention described in claim 18. According to the invention described in claim 18, since water easily flows in the hydrophilic portion, water can easily flow by applying this treatment to a portion where water is desired to flow, so that a high performance valve device is provided. be able to.

  The embodiment related to the invention described in claim 19 corresponds to the tenth to fourteenth embodiments. According to the nineteenth aspect of the present invention, it is difficult for oil and fat to flow into the oil repellent part. Therefore, when this treatment is applied to a portion where the oil and fat is not desired to flow when the fluid is oil and fat, the fluid is applied only to the predetermined portion This makes it possible to provide a high-performance valve device.

  The embodiment related to the invention described in claim 20 corresponds to the tenth to fourteenth embodiments. According to the twentieth aspect of the present invention, since it becomes hydrophilic, water can be allowed to flow only to a predetermined portion, so that a high performance valve device can be provided.

  The embodiment related to the invention described in claim 21 corresponds to the tenth to fourteenth embodiments. According to the invention as set forth in claim 21, since the wettability with respect to the fluid of the portion where the fluid is desired to flow is relatively improved, the fluid can easily flow by performing this processing, and a high performance valve device is provided. can do.

  The embodiment related to the invention described in claim 22 corresponds to the tenth to fourteenth embodiments. According to the twenty-second aspect of the present invention, the slidability between the displacing member and the opposing member is improved, so that a high performance valve device can be provided.

  The embodiment related to the invention described in claim 23 corresponds to the tenth to fourteenth embodiments. And according to invention of Claim 23, a high performance valve apparatus can be provided by performing surface treatment by chemical, physical, or mechanical treatment.

  The embodiment related to the invention described in claim 24 corresponds to the tenth to fourteenth embodiments. According to the twenty-fourth aspect of the present invention, by changing the surface shape of the substrate, the slidability between the displacing member and the facing member is improved, or leakage is reduced. A high-performance valve device can be provided.

  The embodiment related to the invention described in claim 25 corresponds to the tenth to fourteenth embodiments. And according to invention of Claim 25, the surface shape of a board | substrate can be changed by forming fine unevenness | corrugation.

  The embodiment relating to the invention described in claim 26 corresponds to the tenth to fourteenth embodiments. According to the invention of claim 26, since it is possible to easily form fine irregularities and the like, it is possible to improve water repellency and slidability. Can be provided.

  The embodiment related to the invention described in claim 27 corresponds to the tenth to fourteenth embodiments. According to the invention of claim 27, since fine irregularities can be easily formed, water repellency and slidability can be improved, and a high performance valve device is provided at low cost. be able to.

  The embodiment related to the invention described in claim 28 corresponds to the tenth to fourteenth embodiments. According to the invention of claim 28, fine irregularities can be easily formed, so that water repellency and slidability can be improved, and a high performance valve device is provided at low cost. be able to.

  The embodiment related to the invention described in claim 29 corresponds to the tenth to fourteenth embodiments. According to the invention as set forth in claim 29, since it is possible to easily form fine irregularities and the like, it is possible to improve water repellency and slidability, and provide a high performance valve device at low cost. be able to.

  The tenth to fourteenth embodiments correspond to the embodiment of the invention described in claim 30. According to the invention of claim 30, by knitting the cost of the substrate itself, the slidability between the displacing member and the opposing member is improved, or the leakage is reduced. Therefore, a high performance valve device can be provided.

  The tenth to fourteenth embodiments correspond to the embodiment of the invention described in claim 31. According to the invention of claim 31, by forming a film on the surface of the substrate, the slidability between the displacing member and the facing member is improved, or the leakage is reduced. A high-performance valve device can be provided.

  The embodiment related to the invention described in claim 32 corresponds to the tenth to fourteenth embodiments. According to the thirty-second aspect of the present invention, a low friction film can be formed from a material containing carbon such as PTFE.

  The tenth to fourteenth embodiments correspond to the embodiment of the thirty-third aspect of the invention. According to the thirty-third aspect of the present invention, a water-repellent film can be formed of a material containing fluorine such as PTFE, fluorine-based resin, fluorine-based polymer, or the like.

  The embodiment related to the invention described in claim 34 corresponds to the tenth to fourteenth embodiments. According to the invention of claim 34, by forming a PETE film having low friction and water and oil repellency functions, the driving force of the valve transition portion is reduced and the amount of leakage is reduced. Therefore, it is possible to provide a high-performance, small, and inexpensive valve device.

  The embodiment related to the invention described in claim 35 corresponds to the tenth to fourteenth embodiments. And according to the invention of Claim 35, a higher performance valve apparatus can be provided by performing the appropriate surface treatment according to the material of the member.

  The tenth to fourteenth embodiments correspond to the embodiment of the thirty-sixth aspect. According to the invention of claim 36, it is possible to provide a higher performance valve device by performing an appropriate surface treatment according to the characteristics of the fluid.

  The tenth to fourteenth embodiments correspond to the thirty-seventh aspect of the present invention. According to the invention of claim 37, since the surface state has different characteristics depending on the characteristics of the fluid in contact with the fluid, it is possible to identify the fluid based on the characteristics of the fluid. Can be provided.

  The embodiment related to the invention described in claim 38 corresponds to the tenth to fourteenth embodiments. According to the invention of claim 38, since the surface state has different characteristics depending on the external environment, it becomes possible to identify the fluid based on the external environment, so that a high performance valve device is provided. be able to.

  The tenth to fourteenth embodiments correspond to the embodiment of the thirty-ninth aspect of the present invention. According to the invention described in claim 39, the surface treatment can be easily performed on the predetermined portion, and the degree of freedom of selection of the surface treatment method is high, so that an inexpensive and high performance valve device can be provided. it can.

  The tenth to fourteenth embodiments correspond to the embodiment of the invention described in claim 40. According to the invention described in claim 40, the surface treatment can be easily performed on the predetermined portion, and the degree of freedom of selection of the surface treatment method is high. Therefore, it is possible to provide an inexpensive and high-performance valve device. it can.

  The embodiment related to the invention described in claim 41 corresponds to the tenth to fourteenth embodiments. And according to the invention of Claim 41, since it becomes possible to perform a surface treatment collectively, a process can be reduced and an inexpensive and high performance valve apparatus can be provided.

  The embodiment related to the invention described in claim 42 corresponds to the tenth to fourteenth embodiments. According to the invention described in claim 42, it is possible to easily perform surface treatment on a predetermined portion, and since the degree of freedom in selecting a surface treatment method is high, an inexpensive and high-performance valve device is provided. can do.

  The tenth to fourteenth embodiments correspond to the embodiment of the invention described in claim 43. According to the invention of claim 43, a surface treatment can be easily performed on a predetermined part, and the degree of freedom in selecting a surface treatment method is high, so that an inexpensive and high performance valve device is provided. can do.

  The embodiment related to the invention described in claim 44 corresponds to the tenth to fourteenth embodiments. According to the invention as set forth in claim 44, since the surface treatment can be performed collectively, the number of steps can be reduced, and an inexpensive and high-performance valve device can be provided.

  The tenth to fourteenth embodiments correspond to the embodiment of the invention described in claim 45. And according to the invention of Claim 45, since it becomes possible to perform a surface treatment collectively, a process can be reduced and an inexpensive and highly efficient valve apparatus can be provided.

It is the figure which showed the structure of the slide type valve apparatus by the 1st Embodiment of this invention. It is the figure which showed the manufacturing process of the slide type valve apparatus of FIG. (A) is the figure which showed the structure of the slide type valve apparatus by the 2nd Embodiment of this invention, (b) is the figure which showed the other example in 2nd Embodiment. The structure of the slide type valve apparatus by the 3rd Embodiment of this invention is shown, (a) is a perspective view, (b) is the top view which removed and showed the 1st member of (a). (A) is the sectional side view which showed the structure of the slide type valve apparatus by the 4th Embodiment of this invention, (b) is a figure which shows the modification of this 4th Embodiment. It is a figure which shows the further modification of the 4th Embodiment of this invention. It is a figure shown about the clearance gap d of the surface in which the through-hole 32 of the 2nd member 31 to displace is formed, and the surface of the 1st member facing this surface. It is the figure which showed the experimental system used for the experiment which shows the basis which made the quantity of the gap | interval d of FIG. 7 10 micrometers or less, (a) is a top view, (b) is sectional drawing. FIG. 8 is a characteristic diagram obtained from the experimental system used in the experiment showing the basis for setting the amount of the gap d in FIG. 7 to 10 μm or less. It is a perspective view which shows the structure of the slide type valve apparatus by the 5th Embodiment of this invention. (A) is sectional drawing which showed the 1st state of the sliding valve apparatus by 5th Embodiment, (b) is sectional drawing which showed the 2nd state of the sliding valve apparatus by 5th Embodiment. is there. (A) is side sectional drawing which shows the structure of the slide type valve apparatus by the 6th Embodiment of this invention, (b) is a top view which shows the state which removed the 1st member from the slide type valve apparatus of (a). It is. It is the figure which showed the structure of the slide type valve apparatus by the 7th Embodiment of this invention, (a) is the top view which showed the 1st state of the slide type valve apparatus by 7th Embodiment, (b) These are the top views which showed the 2nd state of the slide type valve apparatus by 7th Embodiment. The structure of the slide type valve apparatus by the 8th Embodiment of this invention is shown, (a) is the top view which removed and showed the 1st member from the slide type valve apparatus, (b) is a sectional side view. . The structure of the slide type valve apparatus by the 9th Embodiment of this invention is shown, (a) is a perspective view, (b) is a sectional side view. It is the figure which showed the modification of 9th Embodiment. It is the figure which showed the modification of 9th Embodiment. FIG. 2 is a diagram illustrating a portion where surface treatment is performed, in which (a) illustrates an example in which surface treatment is performed on the entire surface of a portion other than a through-hole through which a member fluid passes, and (b) illustrates a through-hole in the member. The figure which showed the example by which surface treatment was not given to the circumference | surroundings of the circumference | surroundings, and the surface treatment was given to the whole surface of the member except this circumference | surroundings, (c) is this penetration through predetermined intervals from the through-hole formed in the member. It is the figure which showed the example in which the surface treatment was given only to the position surrounding a hole. The example of the shape of a surface treatment part is shown, (a) is sectional drawing which shows the shape cut out substantially perpendicularly with respect to the surface of a member, and was extended from the surrounding surface of the through-hole, (b) is a member Sectional drawing which shows the shape tapered from the surrounding surface of the through-hole in the surface to the surface of a surface treatment part in this, (c) shows the shape tapered in the direction opposite to (b) with respect to a member. It is sectional drawing. It shows the location where the surface treatment is performed, (a) is a diagram showing an example in which a lattice-like surface treatment portion is formed on the entire surface of the member, (b) is a striped surface treatment portion on the entire surface of the member The figure which showed the example formed, (c) is the figure which showed the example in which the surface treatment part which exists in the shape of a polka dot was formed in the whole surface of a member, (d) is the surface on the surrounding surface of the through-hole which a fluid passes It is the figure which showed the example in which the surface treatment part to which the process was performed was formed. It is sectional drawing which showed the example in which the surface treatment part by which surface treatment was given to the surrounding surface of the through-hole which a fluid passes was formed. It is the figure which showed the example of the grinding | polishing apparatus which grind | polishes. It is the figure which showed the example of the system which performs sputter etching. It is a figure for demonstrating the porosity formation of a board | substrate. It is sectional drawing which showed the process of etching the board | substrate with which the mask was formed as a 1st example of the manufacturing process of the slide type valve apparatus by the 10th Embodiment of this invention. Sectional view showing a step of forming a protrusion by alkali anisotropic etching after forming a mask on a substrate and performing RIE processing in a rectangular shape as a second example of the manufacturing process of the sliding valve device according to the tenth embodiment of the present invention FIG. FIG. 10 is a cross-sectional view showing a step of forming a protrusion by forming a thin film on a substrate and etching the thin film by forming a mask as a third example of the manufacturing process of the sliding valve device according to the tenth embodiment of the present invention. is there. It is sectional drawing which showed the process of forming the processus | protrusion by sacrificial oxidation as the 4th example of the manufacturing process of the sliding valve apparatus by the 10th Embodiment of this invention. It is sectional drawing which showed the manufacturing process of the slide type valve apparatus by the 11th Embodiment of this invention. The 1st example of the manufacturing process of the slide type valve device by a 12th embodiment of the present invention is shown, and it is sectional drawing showing the example which etches by RIE on the conditions that black silicon is formed without a mask. is there. It is sectional drawing which showed the 2nd example of the manufacturing process of the slide type valve apparatus by the 12th Embodiment of this invention. It is the figure which showed the manufacturing process of the slide type valve apparatus by the 13th Embodiment of this invention. It is the sectional side view which showed the structure of the slide type valve apparatus by the 14th Embodiment of this invention. The structure of the slide-type valve apparatus by 15th Embodiment of this invention is shown, (a) is a perspective view, (b) is a sectional side view. It is a perspective view which shows the structure of the slide type valve apparatus by the 16th Embodiment of this invention. (A) is sectional drawing which showed the 1st state of the sliding valve apparatus by 16th Embodiment, (b) is sectional drawing which showed the 2nd state of the sliding valve apparatus by 16th Embodiment, (C) is a sectional view showing a third state of the sliding valve device according to the sixteenth embodiment. The structure of the slide type valve apparatus by the 17th Embodiment of this invention is shown, (a) is sectional drawing, (b) is the upper surface shown by removing the 1st member from the slide type valve apparatus of (a) FIG. (A) is sectional drawing which shows the structure of the slide-type valve apparatus by 18th Embodiment of this invention, (b) is a figure which shows the modification of 18th Embodiment. (A) is sectional drawing which shows the structure of the slide type valve apparatus by 19th Embodiment of this invention, (b) is a figure which shows the deformation | transformation of 19th Embodiment. It is sectional drawing which shows the structure of the slide type valve apparatus by the 20th Embodiment of this invention. It is sectional drawing which shows the structure of the slide type valve apparatus by the 21st Embodiment of this invention. It is sectional drawing which shows the structure of the slide type valve apparatus by the 22nd Embodiment of this invention. It is sectional drawing which shows the structure of the slide type valve apparatus by the 23rd Embodiment of this invention. It is sectional drawing which shows the structure of the slide-type valve apparatus by 24th Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1, 11 ... 1st member, 2, 15 ... 2nd member 3, 5, 12, 17, 21, 72, 162 ... Through-hole, 3a, 5a ... Opening part, 13 ... Sacrificial layer, 15a ... Thin film 16 ... film, 20 ... third member, 25 ... guide member, 26 ... contact part, 27 ... positioning part, 70 ... silicon substrate, 70a ... projection, 71 ... silicon oxide film, 160 ... member, 161, 167, 168, 169, 170 ... surface treatment section.

Claims (1)

A first member having a plate shape and having a first flow path;
A guide member having a frame shape fixed to the first surface of the first member and having a space inside, and a plate shape which can be linearly slidable within the space of the guide member as a displacement range. A second member comprising a movable part inserted and having a second flow path communicating with the first flow path at a predetermined position within the displacement range;
A film having any one of water repellency, oil repellency and hydrophilicity on at least one of the flat contact surfaces of the movable parts of the first member and the second member, and porous A membrane that is a porous membrane,
In the thickness direction of the plate shape of the movable portion of the second member including the said membrane, sliding the gap of the movable portion of the first member and the second member is characterized by a 1μm~5μm Valve device.

Images