JP6814494B1 - Hazardous component heating purification device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To switch between an inflow flow path, an outflow flow path and a purge flow path in a harmful component heating and purifying device by moving a damper provided with a selection port, a large amount of electric power is required for the switching due to the weight of the damper. It was. SOLUTION: The three or more chambers having a communication portion communicating above and a bottom surface having an opening provided with a communication port below, and being separated by a wall other than the communication portion, and the above. A heat storage body portion, a heating portion, and a catalyst portion are connected to the chamber from the opening side toward the communication portion, and are slidably mounted on the bottom surface of the three communication ports. A damper having a selection port for making one communicate, a low friction layer arranged between the bottom surface and the sliding of the damper, and a control for moving the damper to control the opening and closing of the communication port. The harmful component heating purification device, which comprises the device, can easily move the damper by the low friction layer. [Selection diagram] Fig. 1

Description

The present invention relates to harmful components such as CO (carbon monoxide), HC (hydrocarbon: gas containing an organic odor component), bacteria, mites, etc. in various gases (containing any of these components, hereinafter. It relates to a harmful component heating purification device that heats and oxidatively purifies (called "harmful gas").

Hazardous gases emitted from painting factories and chemical factories are usually rendered harmless by heating and burning or oxidizing them with a catalyst. A direct combustion deodorizer or a catalytic deodorizer is used for this detoxification. Further, a heat storage type deodorizing device having improved thermal efficiency by supplying and exhausting air to and from a heating and purification chamber via a heat storage body is also known.

As a conventional heat storage type combustion deodorizer
A communication portion that communicates above, and three or more chambers that have a bottom surface with an opening formed below and are separated by a wall except for the communication portion.
A heat storage layer and a catalyst layer serially provided in the chamber from the opening side toward the communication portion,
It has a heating device provided adjacent to the catalyst layer, and has a heating device.
In the opening
A communication port that communicates with the inflow flow path that introduces harmful gas into the room,
A communication port that communicates with the outflow channel that discharges purified gas from the chamber,
A communication port is provided in the chamber to communicate with the purge flow path for introducing the purge gas.
A damper that is slidably mounted on the bottom surface and has a selection hole that allows one of the communication ports to communicate with each other.
A harmful component heating and purifying device has been known, characterized in that a control device for controlling the opening and closing of the communication port by the damper is provided.

Japanese Unexamined Patent Publication No. 2016-121859

In the harmful component heating and purifying device of Patent Document 1, the damper is slidably and closely mounted on the bottom surface of the chamber. This damper puts one of the three communication ports into a communication state. Therefore, when the communication port communicating with the outflow flow path for discharging the purified gas is set to the communication state, the communication port communicates with the inflow flow path for introducing the harmful gas into the room and communicates with the purge flow path for introducing the purge gas. The communication port is closed.

The sending pressure of these inflow channels and purge channels is as high as several atmospheres. Therefore, the damper needs to be heavy in order to keep these communication ports closed. As a result, there is the first problem that a large amount of power for moving the heavy damper is required in order to keep the bottom surface and the damper in close contact with each other and maintain the slidability.

Further, in the harmful component heating purification device, the purified gas having a high temperature heats the heat storage body layer, and the heat storage body layer is cooled when the harmful gas passes through. However, when the harmful component heating and purifying device starts continuous operation and a harmful gas with a high concentration of harmful components flows in, the amount of heat retained by the heat storage layer becomes too large, and the heat storage occurs when the harmful gas passes for a certain period of time. There is a second problem that the temperature of the body layer does not fall below a certain temperature and the entire device is overheated.

The present invention has been conceived to solve the above-mentioned first problem or the first and second problems. More specifically, the harmful component heating purification device according to the present invention is
A communication portion that communicates above, and three or more chambers that have a bottom surface with an opening formed below and are separated by a wall except for the communication portion.
A heat storage body portion, a heating portion, and a catalyst portion are continuously provided in the chamber from the opening side toward the communication portion.
In the opening
A gas inlet that communicates with the inflow channel that introduces harmful gas into the room,
A gas outlet that communicates with the outflow channel that discharges purified gas from the chamber,
Three communication ports of a purge gas inflow port communicating with a purge flow path for introducing purge gas into the chamber are provided.
A damper that is slidably mounted on the bottom surface and has a selection port that allows one of the three communication ports to communicate with each other.
A low friction layer arranged between the bottom surface and the slide of the damper,
Have a control device to move the damper to control the opening and closing of the communication port,
A cooling device is provided in the communication portion,
The heating unit has a heating unit temperature sensor.
The control device is
The communication state of each room is changed in order from the three states of communication with the inflow flow path, communication with the purge flow path, and communication with the outflow flow path, and further, the communication state of each room is shifted.
The transition of the communication state is controlled by the time limit and the temperature of the heating unit in the chamber communicated with the inflow flow path.
When the temperature of the heating unit is not equal to or lower than the predetermined temperature, the current communication state is not changed even after the time limit has elapsed .

In the harmful component heating and purifying device according to the present invention, since the low friction layer is provided between the sliding surface between the damper and the bottom surface of the chamber, the heavy damper can be moved even with a small driving force. Solve the problem.

Further, in the harmful component heating purification device according to the present invention, when the control device controls the state transition of each chamber by the temperature and time in the heating unit, and the heating unit does not fall below a predetermined temperature, a certain period of time Since the state is not changed even after the lapse of time, the heating unit is suppressed from being overheated, the harmful component heating and purifying device can be operated safely, and the second problem can be solved.

It is a front sectional view of the harmful component heating purification apparatus which concerns on this invention. It is sectional drawing of each room of the harmful component heating purification apparatus which concerns on this invention. It is a figure which shows the structure of the heat storage body part. It is a figure which shows the state transition from the steady state to the next steady state of a toxic component heating purification apparatus. It is a flow chart which shows the processing flow of a control device.

The drawings of the hazardous component heating and purifying apparatus according to the present invention will be shown and described below. The following description illustrates one embodiment of the present invention, and the present invention is not limited to the following description. The following description can be modified without departing from the spirit of the present invention.

1 and 2 show the configuration of the harmful component heating and purifying device according to the present invention. FIG. 1 is a cross-sectional view from the front of the hazardous component heating purification device 1. In the hazardous component heating and purifying device 1, three or more "chambers 12" are arranged side by side with a wall 13 in a space surrounded by an outer shell 10. FIGS. 2 (a), 2 (b), and (c) are shown. , The cross sections of the chamber 12x, the chamber 12y, and the chamber 12z from the side surface are shown. 2 (d), (e), and (f) show the lower surface of the damper slide portion 18 of the chambers 12x, 12y, and 12z, respectively (this is the same as the bottom surface 14 of the chamber 12, as will be described later). And the damper 20 are shown in plan view.

In FIGS. 1 and 2, the arrow W represents the width direction of the harmful component heating purification device 1, and the arrow H represents the vertical direction. In the arrow H, "U" represents above gravity and "D" represents below gravity. Further, in FIGS. 2A, 2B, and 2C, the arrow T indicates the thickness direction. In FIGS. 2D, 2E, and 2F, the width direction W in FIG. 1 is the vertical direction of the paper surface.

First, a schematic configuration of the harmful component heating purification device 1 according to the present invention will be described. The harmful component heating purification device 1 has three or more chambers 12 in the outer shell 10. Here, the case where there are three chambers 12 will be described, but there may be three or more chambers 12. When each room 12 is referred to separately, it is referred to as room 12x, room 12y, and room 12z. Each of the chambers 12 is separated by a wall 13. There is no wall 13 above each chamber 12.

That is, above the chamber 12, a communication portion 36 through which each chamber 12 communicates is formed. The upper part of the communication portion 36 is sealed by the outer shell 10. Further, the lower part is partitioned by a bottom surface 14 having an opening 16 having three communication ports 44. That is, the chamber 12 has a box shape with the upper part open.

A heat storage body unit 26, a heating unit 28, and a catalyst unit 34 are sequentially provided in the chamber 12 from the lower side to the upper side. A damper slide portion 18 is provided between the heat storage body portion 26 and the bottom surface 14. The damper slide portion 18 is a space for movably accommodating the damper 20. The damper slide portion 18 is formed below the chamber 12 in succession with the chamber 12. The lower surface of the damper slide portion 18 is the same as the bottom surface 14 of the chamber 12. The damper 20 selectively opens and closes the three communication ports 44 on the bottom surface 14 of each chamber 12.

Below the bottom surface 14, three flow paths are formed: an inflow flow path 46 through which the harmful gas HG flows, an outflow flow path 48 through which the purification gas DG flows, and a purge flow path 50 through which the purge gas PG flows. These channels communicate with an opening 16 having three communication ports 44 provided on the bottom surface 14 of all chambers 12. That is, each chamber 12 communicates with the communication port 44 (gas inflow port 40) communicating with the inflow flow path 46, the communication port 44 (gas outflow port 42) communicating with the outflow flow path 48, and the purge flow path 50. A communication port 44 (purge gas inflow port 41) is provided on the bottom surface 14.

A harmful gas blowing fan 52 and a purging gas blowing fan 54 may be arranged in the inflow flow path 46 and the purge flow path 50. This is to obtain a strong blast pressure and to control the blast flow rate.

Further, a slide drive device (not shown) is provided outside each chamber 12 in order to slide the damper 20. The form of the slide drive device is not particularly limited as long as it can drive the damper 20 of each chamber 12. In addition, a control device 60 that controls the operation of the slide drive device in each room 12 is arranged. That is, it can be said that the control device 60 controls the movement of the damper 20.

In the above configuration, when the portions provided for each of the X chamber 12x, the Y chamber 12y, and the Z chamber 12z are distinguished from each other, "x", "y", and "z" are added to the symbols of the respective constituent portions. It shall be attached and expressed. For example, the catalyst part 34x (in the X chamber 12x), the heat storage body part 26y (in the Y chamber 12y), and the like.

<Details of each part configuration>
Next, each configuration will be described in detail in sequence.

<Communication department>
The communication portion 36 is located at the upper end of each chamber 12 and communicates with each chamber 12. Therefore, the gas emitted from the upper end of each chamber 12 can flow from the upper end of the other chamber 12 to the other chamber 12. The communication unit 36 may be provided with a temperature sensor 56t that measures the temperature inside the communication unit 36.

Further, the communication unit 36 may be provided with a cooling device 56. The cooling device 56 is used to lower the temperature of the entire harmful component heating and purifying device 1 when the temperature of the communicating portion 36 rises too much. Further, since the cooling device 56 is a heat exchanger, the heat from the communication unit 36 can be taken out and used for other purposes. The cooling device 56 includes a metal pipe 56p, a temperature sensor 56t, and a blower fan 56f.

<Room>
The chamber 12 has an opening 16 on the bottom surface 14. Further, there is no wall 13 above the adjacent chamber 12, and a communication portion 36 is provided. The chamber 12 is above the opening 16 and below the communication portion 36, and the heat storage body portion 26, the heating portion 28, and the catalyst portion 34 are continuously provided from the side closer to the opening 16 toward the communication portion 36. Will be done. As can be seen from FIGS. 1 and 2 (a), (b), and (c), the heat storage body section 26, the heating section 28, and the catalyst section 34 each fill the cross section of the chamber 12, and the opening 16 The gas passing between the communication section 36 and the communication section 36 always passes through the heat storage body section 26, the heating section 28, and the catalyst section 34.

<Heat storage body>
The heat storage body unit 26 receives heat from the outflowing high-temperature purifying gas DG and gives heat to the inflowing low-temperature harmful gas HG. Therefore, one with a large amount of heat is desirable. Further, it goes without saying that since the purified gas DG and the harmful gas HG pass through, the gas can pass through. Usually, a honeycomb structure made of ceramics is used. This is because ceramics have a large heat capacity.

However, since ceramics are porous, they themselves adsorb gas. The timing of the gas passing through the heat storage body 26 will be described later, but after the harmful gas HG has flowed in, the purge gas PG passes through and expels the harmful gas HG from the ceramics. After that, the high temperature purification gas DG flows out. If the heat storage body portion 26 is porous, the purge gas PG cannot completely expel the adsorbed harmful gas HG, and when the high-temperature purification gas DG flows out, the remaining harmful gas HG is also discharged. That is, the harmful gas HG is mixed in the purified gas DG.

If the heat storage body portion 26 is made of metal, the amount of harmful gas HG adsorbed is small, so that all harmful gas HG can be expelled by the purge gas PG, and even if the next high-temperature purification gas DG flows out, The amount of harmful gas HG mixed with the purified gas DG is small. However, if the heat storage body portion 26 is made of metal, the heat capacity is reduced.

Therefore, as shown in FIG. 3, the heat storage body portion 26 is composed of a plurality of stages, and the bottom surface 14 side (gravity downward D) of the heat storage body portion 26 is composed of a metal heat storage body 70, and the communication portion 36 side. (Upper gravity U) is composed of a heat storage body 72 made of ceramics. The metal heat storage body 70 and the ceramic heat storage body 72 have ventilation holes 74, and gas can pass in the vertical direction. By having such a configuration of the heat storage body portion 26, a sufficient amount of heat to be stored can be secured, and the leakage of harmful gas HG is reduced when the purified gas DG flows out.

<Heating part>
The heating unit 28 is a space in which the heating device 30 is arranged. The heating device 30 is not particularly limited as long as the temperature of the heating unit 28 can be raised to a temperature of several hundred degrees, but a heating element having a rod-shaped, coil-shaped, or mesh-shaped shape can be preferably used. A heating unit temperature sensor 32 is arranged at the center of the heating unit 28. The heating unit temperature sensor 32 measures the temperature T inside the heating unit 28.

In the heating unit 28, when the temperature T in the heating unit 28 becomes equal to or lower than the predetermined temperature T0, the heating device 30 operates (ON), and when the temperature T in the heating unit 28 becomes higher than the predetermined temperature T0. The heating device 30 is controlled to stop (OFF). The temperature control of the heating unit 28 is performed regardless of the inflow state, the outflow state, and the purge state of each chamber 12, which will be described later.

The predetermined temperature T0 of the heating unit 28 of each chamber 12 and the ON / OFF control of the heating device may be performed by the control device prepared for each heating unit 28, or the harmful component heating purification device 1 may be used. The control device 60 may be in charge.

<Catalyst part>
The catalyst unit 34 decomposes or modifies the heated harmful gas HG into a purifying gas DG having low toxicity. Here, decomposition means making the constituent molecules of the harmful gas HG into a substance having a smaller molecular weight, and modification means making the constituent molecules of the harmful gas into a substance having the same or larger molecular weight but less toxic. is there. Decomposition and modification are said to be reformed together.

Specifically, a noble metal substance such as platinum or palladium can be preferably used for the catalyst unit 34. Of course, as long as the harmful gas HG can be reformed, it may be a substance other than these substances.

<Damper slide part>
The damper slide portion 18 is formed directly above the bottom surface 14 of the chamber 12. A damper 20 is arranged on the damper slide portion 18. The bottom surface 14 is provided with an opening 16 provided with a communication port 44 that communicates with the inflow flow path 46, the outflow flow path 48, and the purge flow path 50.

<Damper>
The damper 20 opens one of the three communication ports 44 provided on the bottom surface 14 of each chamber 12 to allow each chamber 12 and the selected flow path to communicate with each other. Therefore, the damper 20 has a selection port 24 that overlaps with the communication port 44. In addition, the other two communication ports 44 are closed at a portion other than the selection port 24. The pressure of the purge gas PG and the harmful gas HG may reach several atmospheres, and the damper 20 is heavy so that the damper 20 does not lift up.

<Low friction layer>
A low friction layer 22 is formed between the back surface of the damper 20 and the bottom surface 14 of the damper slide portion 18. As the low friction layer 22, a solid material such as Teflon (registered trademark), molybdenum disulfide, an organic molybdenum compound, graphite, PTFE (polytetrafluoroethylene), and copper, which has a lubricating ability, is preferably used. The low friction layer 22 may be provided on the damper 20 side or may be provided on the bottom surface 14.

<Opening>
The opening 16 is provided on the bottom surface 14 of the damper slide portion 18 (which is also the bottom surface 14 of the chamber 12). The opening 16 of each chamber 12 has an inflow flow path 46 for harmful gas HG, an outflow flow path 48, and a communication port 44 for the purge flow path 50. The communication port 44 with the inflow flow path 46 provided in the opening 16 is the gas inflow port 40, the communication port 44 with the outflow flow path 48 is the gas outflow port 42, and the communication port 44 with the purge flow path 50 is the purge gas inflow port. Let it be 41. These communication ports 44 are provided on the bottom surface 14.

The three flow paths of the inflow flow path 46, the outflow flow path 48, and the purge flow path 50 are separated walls 43 (FIG. 2) in the thickness direction of each chamber 12 (T direction in FIGS. 2A, 2B, and 2C). 2 (a), (b), (c)). However, it communicates with the opening 16 of each room 12. That is, the inflow flow path 46, the outflow flow path 48, and the purge flow path 50 communicate with each other between the chambers 12. However, the inflow flow path 46, the outflow flow path 48, and the purge flow path 50 are separated by a separation wall 43.

Therefore, gas does not mix between the flow paths. Further, each chamber 12 can communicate with the inflow flow path 46, the outflow flow path 48, and the purge flow path 50.

<Control device>
The control device 60 is composed of an MPU (Micro Processor Unit) and a memory. The control device 60 is also provided with a timer 62. The control program may be stored in memory. Of course, other configurations may be used. The control device 60 is connected to a slide drive device (not shown) and controls the movement of the damper 20 in each chamber 12 by transmitting an instruction signal Cs. Specifically, the selection port 24 is moved to any of the gas inflow port 40 provided on the bottom surface 14, the purge gas inflow port 41, and the gas outflow port 42. In other words, the control device 60 transitions the communication state between the inflow flow path 46, the outflow flow path 48, and the purge flow path 50 of the cabin 12.

Further, the control device 60 may be connected to the heating unit temperature sensor 32 and the heating device 30 to control the temperature inside the heating unit 28. Specifically, the control device 60 receives a signal St representing the temperature from the heating unit temperature sensor 32, and transmits an instruction signal Ch to the heating device 30 based on the signal St to generate the temperature inside the heating unit 28. Is controlled based on the set value T0.

<Operation explanation>
The operation of the harmful component heating purification device 1 having the above configuration will be described. See FIGS. 1 and 2. One chamber 12 of the hazardous component heating purification device 1 has three states: an inflow state in which the harmful gas HG flows in, an outflow state in which the purified purified gas DG flows out, and a purge state in which the purge gas PG flows in. It is repeated in the order of state and outflow state.

When this cycle is performed in three chambers 12, the harmful component heat purification device 1 can be operated smoothly by giving a deviation in the order of the cycles in each chamber 12. In addition, the processing capacity is also increased. In FIGS. 1 and 2, the X chamber 12x communicates with the purge flow path 50, the Y chamber 12y communicates with the inflow flow path 46, and the Z chamber 12z communicates with the outflow flow path 48.

Referring to FIG. 2, in FIG. 2A, the selection port 24x of the damper 20x of the X chamber 12x makes the inner purge gas inflow port 41x of the communication port 44x of the opening 16x of the X chamber 12x communicate with each other. The mouth 44x is closed. In FIG. 2B, the selection port 24y of the damper 20y of the Y chamber 12y makes the gas inflow port 40y in the communication port 44y of the opening 16y of the Y chamber 12y in a communicating state, and the other communication ports 44y are closed. There is. Further, in FIG. 2C, the selection port 24z of the damper 20z of the Z chamber 12z makes the gas outlet 42z in the communication port 44z of the opening 16z of the Z chamber 12z in a communicating state, and the other communication ports 44z are closed. I'm out.

<Explanation of steady state>
See FIG. 1 again. The steady state of the hazardous component heating purification device 1 will be described based on the above states. The harmful gas HG flowing into the Y chamber 12y passes through the heat storage body portion 26y and reaches the heating portion 28y. When the harmful gas HG passes through the heat storage body portion 26y, it receives heat from the heat storage body portion 26y and its temperature rises.

On the contrary, the temperature of the heat storage body portion 26y decreases. If the temperature Tg of the harmful gas HG advancing to the heating unit 28y is lower than the temperature T of the heating unit 28y, the temperature T of the heating unit 28y is heated. On the other hand, if the temperature Tg of the harmful gas HG is higher than the temperature T of the heating unit 28y, heat is given to the heating unit 28y to proceed to the next step.

The heated harmful gas HG reaches the catalyst unit 34y, and when it exits the catalyst unit 34y, it is reformed to become a purified gas DG. This purification gas DG is a high temperature gas. The purification gas DG passes through the catalyst portion 34z of the Z chamber 12z, passes through the heating portion 28z of the Z chamber 12z, and passes through the heat storage body portion 26z of the Z chamber 12z. When passing through the heat storage body portion 26z, heat is transferred from the purification gas DG to the heat storage body portion 26z. As a result, the temperature of the purified gas DG decreases, and the temperature of the heat storage body portion 26z of the Z chamber 12z increases.

On the other hand, the X chamber 12x is a chamber 12 in which the harmful gas HG flows in before the state shown in FIG. And now, it is in a purge state in which the purge gas PG flows in. When the purge gas PG enters the X chamber 12x, it takes heat from the heat storage body portion 26x and cools the heat storage body portion 26x. At this time, the harmful gas HG remaining in the heat storage body 26x is expelled from the heat storage body 26x together.

Since the heat storage body portion 26x is adjacent to the heating portion 28x, the temperature is high in the portion close to the heating portion 28x, and the harmful gas HG is easily expelled by the purge gas PG. Therefore, the heat storage body 72 made of porous ceramics can be preferably used. On the contrary, since the temperature on the side close to the gas inflow port 40x is low, it is difficult to be expelled by the purge gas PG. Therefore, if the heat storage body portion 26x on the gas inflow port 40x side is composed of the metal heat storage body 70, the harmful gas HG is less likely to be adsorbed and the purge gas PG can be easily expelled.

When the purge gas PG enters the heating unit 28x, it is heated by the heating unit 28x if the temperature of the purge gas PG is lower than the temperature of the heating unit 28x. If the temperature of the purge gas PG is higher than the temperature of the heating unit 28x, a certain amount of heat is released by the heating unit 28x and moved to the catalyst unit 34x. Heating the purge gas PG in the heating unit 28x heats the harmful gas HG in the purge gas PG, which is useful for reforming the harmful gas HG.

The purge gas PG that has entered the catalyst section 34x passes through the catalyst section 34x as it is. On the other hand, the harmful gas HG mixed in the purge gas PG is reformed by the catalyst unit 34x to become the purified gas DG. Therefore, the purge gas PG and the purification gas DG enter the communication portion 36. The purge gas PG and the purifying gas DG that have reached the communication portion 36 are discharged from the Z chamber 12z together with the purified gas DG that has passed through the Y chamber 12y.

<Explanation of state transition>
In the above description, the X chamber 12x was in the purge state, the Y chamber 12y was in the inflow state, and the Z chamber 12z was in the outflow state. These states are switched according to certain rules. This is called a state transition. The state transition is performed by moving the damper 20 of each chamber 12 to change the position of the selection port 24. Therefore, it is an operation by the control device 60.

FIG. 4 shows a schematic diagram of the state transition. FIG. 4A shows the steady state shown in FIGS. 1 and 2. That is, the X chamber 12x is in the purge state, the Y chamber 12y is in the inflow state, and the Z chamber 12z is in the outflow state. The state of each chamber 12 is changed in the order of inflow state, purge state, and outflow state. Therefore, as shown in FIG. 4D, the steady state of FIG. 4A shifts to the steady state of the X chamber 12x in the outflow state, the Y chamber 12y in the purge state, and the Z chamber 12z in the inflow state. Become.

The harmful component heating and purifying device 1 which was in the steady state of FIG. 4A basically makes a state transition from the steady state to the next steady state after a certain period of time has elapsed. When the state transition starts, the chamber 12 that was initially in the purge state transitions to the outflow state. FIG. 4B shows a state in which the X chamber 12x has undergone a state transition from a purge state to an outflow state. More specifically, the damper 20x of the X chamber 12x moves to match the selection port 24x with the gas outlet 42x. At this time, the heavy damper 20 can be moved with low power due to the presence of the low friction layer 22.

The chamber 12x, which was in the purged state, is considered to have expelled all the harmful gas HG remaining in the chamber 12x, and immediately shifts to the outflow state. Therefore, the purifying gas DG from the communication portion 36 flows in the X chamber 12x. That is, one chamber 12 in the inflow state and two chambers 12 in the outflow state are formed. Such a state is called "transition state 1". The transition state 1 is determined to be completed after a certain period of time has elapsed.

When the transition state 1 is completed, the chamber 12 that was in the outflow state is then transitioned to the inflow state. FIG. 4C shows a state in which the Z chamber 12z that was in the outflow state is changed to the inflow state. Since the purified gas DG was outflowing in the outflow state, the harmful gas HG does not flow out from the outflow state X chamber 12x even if the inflow state of the harmful gas HG is immediately switched. This is because the harmful gas HG inflowed by the catalyst portion 34z of the Z chamber 12z is reformed.

Specifically, this transition also moves the selection port 24z of the damper 20z of the Z chamber 12z from the gas outlet 42z to the gas inlet 40z. The heavy damper 20z can be moved with low power by the low friction layer 22z. As a result of this transition, a chamber 12 having two inflow states and one outflow state is created. This is referred to as "transition state 2". It can be understood that the transition state 2 is completed when the damper 20z of the Z chamber 12z completes the movement.

Finally, the chamber 12 that was in the inflow state is changed to the purge state. FIG. 4D shows a state in which the Y chamber 12y, which was in the inflow state, is changed to the purge state. Since a large amount of harmful gas HG remains in the chamber 12y in the inflow state, the purging gas PG is used to expel it.

Specifically, this transition is also performed by moving the selection port 24y of the damper 20y of the Y chamber 12y from the gas inflow port 40y to the purge gas inflow port 41y. The heavy damper 20y can be moved with low power by the low friction layer 22y. As a result of this transition, a chamber 12 having one inflow state, one outflow state, and one purge state is created. This is referred to as "transition state 3". The transition state 3 is the final stage of the state transition and is the next steady state from the previous steady state. It can be understood that the transition state 3 is completed when the damper 20y of the Y chamber 12y completes the movement.

<Explanation of control device flow>
Since the state transition is due to the processing of the control device 60, the flow of the control device 60 will be described. FIG. 5 shows the flow of the control device 60. The flow of FIG. 5 will be described with reference to FIG. 4 as appropriate. The trigger for the transition from the steady state to the next steady state is basically the set time, but in the harmful component heating purification device 1 according to the present invention, the temperature of the heating unit 28 is also considered for the trigger of the transition.

When the process starts (step S100), the end determination is made (step S102). The determination of termination may be a voluntary termination due to a manual shutdown of the power supply or an abnormality in the safety device provided in the harmful component heating purification device 1. When terminating (Y branch in step S102), the device is stopped (step S104). If not (N branch in step S102), the process proceeds to the next step.

Next, it is determined whether or not the elapsed time t after the transition to the steady state has passed the preset set time ts (step S106). The purpose is to maintain the steady state for the time ts. If the elapsed time has not passed the set time (N branch in step S106), the process waits further. When the steady state elapses for a certain period of time (Y branch in step S106), the process proceeds to the next step.

In step S108, it is determined whether or not the temperature T in the heating unit 28 of the chamber 12 in the inflow state is lower than T0 + α. Here, T0 is the ON / OFF switching temperature of the heating device 30, and α is the threshold temperature for switching the transition state.

In the harmful component heating purification device 1, the harmful gas HG is reformed into a purified gas DG by the catalyst unit 34. Exothermic reactions can also occur with this modification. Therefore, the purified gas DG may have a temperature higher than the temperature of the harmful gas HG that has flowed into the harmful component heating purification device 1 and is heated. This high-temperature purification gas DG is discharged to the heat storage body portion 26 of the outflowing chamber 12 leaving a large amount of heat.

It is the inflow gas, that is, the harmful gas HG when the chamber 12 having the heat storage body 26 changes to the inflow state to cool the heat storage unit 26 having a large amount of heat. The harmful gas HG passing through the heat storage body unit 26 having a large amount of heat takes heat from the heat storage body unit 26. However, if the amount of accumulated heat is large, even if the harmful gas HG flows for the set duration ts in the steady state, the amount of heat of the heat storage body portion 26 cannot be taken away, and the temperature of the harmful component heating purification device 1 as a whole May rise steadily.

Therefore, if the temperature of the heating unit 28 of the chamber 12 that has entered the inflow state does not fall below a certain temperature, the purpose is to continue maintaining the current steady state and wait for the temperature of the heating unit 28 and the heat storage body unit 26 to decrease. Is.

On the other hand, when the temperature of the heating unit 28 becomes T0 or less, the heating device 30 of the heating unit 28 is turned on this time. It cannot be said that this effectively utilized the amount of heat accumulated in the heat storage body unit 26. Therefore, the threshold temperature α for switching is added to the ON / OFF switching temperature T0 of the heating device 30. The threshold temperature α may be dynamically converted based on the temperature of the inflowing harmful gas HG. That is, when the temperature of the heating unit 28 drops, the threshold temperature α is changed based on the temperature of the harmful gas HG so that the heating device 30 does not turn on by undershooting with respect to the switching temperature T0.

In the flow of FIG. 5, if the temperature T of the heating unit 28 of the chamber 12 in which the harmful gas HG is inflowing in step S108 is higher than T0 + α (N branch in step S108), even after the set duration has passed, it is still present. Maintain the steady state of. When the temperature T of the heating unit 28 becomes lower than T0 + α (Y branch in step S108), the process is moved to the next step.

After clearing step S106 (the predetermined duration ts has elapsed) and step S108 (the temperature T of the heating unit 28 is lower than T0 + α), the state transition is started. As described with reference to FIG. 4, it transitions to the transition state 1 (step S110), then to the transition state 2 (step S112), and finally to the transition state 3 (step S114). The transition state 3 is the next steady state.

When a new steady state starts, the timer 62 is cleared and the elapsed time ts is newly measured (step S116). Then, the process is moved to the end determination (step S102) again. As described above, the control device 60 operates the harmful component heating purification device 1.

The harmful component heating purification device according to the present invention can be suitably used for purifying harmful gas.

1 Hazardous component heating and purification device 10 Outer shell 12, 12x, 12y, 12z Room 13 Wall 14 Bottom surface 16 Opening 18 Damper slide part 20 Damper 22 Low friction layer 24 Selection port 26 Heat storage body part 28 Heating part 30 Heating part 32 Heating part temperature Sensor 34 Catalyst part 36 Communication part 40 Gas inlet 41 Purge gas inlet 42 Gas outlet 43 Separation wall 44 Communication port 46 Inflow flow path 48 Outflow flow path 50 Purge flow path 52 Harmful gas blower fan 54 Purge gas blower fan 56 Cooling Device 56f Blower fan 56p Metal pipe 56t Temperature sensor 60 Control device 62 Timer 70 Metal heat storage body 72 Ceramic heat storage body 74 Vent hole HG Harmful gas DG Purification gas PG Purge gas

Claims (2)

A communication portion that communicates above, and three or more chambers that have a bottom surface with an opening formed below and are separated by a wall except for the communication portion.
A heat storage body portion, a heating portion, and a catalyst portion are continuously provided in the chamber from the opening side toward the communication portion.
In the opening
A gas inlet that communicates with the inflow channel that introduces harmful gas into the room,
A gas outlet that communicates with the outflow channel that discharges purified gas from the chamber,
Three communication ports of a purge gas inflow port communicating with a purge flow path for introducing purge gas into the chamber are provided.
A damper that is slidably mounted on the bottom surface and has a selection port that allows one of the three communication ports to communicate with each other.
A low friction layer arranged between the bottom surface and the slide of the damper,
Have a control device to move the damper to control the opening and closing of the communication port,
A cooling device is provided in the communication portion,
The heating unit has a heating unit temperature sensor.
The control device is
The communication state of each room is changed in order from the three states of communication with the inflow flow path, communication with the purge flow path, and communication with the outflow flow path, and further, the communication state of each room is shifted.
The transition of the communication state is controlled by the time limit and the temperature of the heating unit in the chamber communicated with the inflow flow path.
A harmful component heating purification device, characterized in that the current communication state is not changed even after the time limit has elapsed when the temperature of the heating unit is not equal to or lower than a predetermined temperature . The harmful component heating and purifying device according to claim 1, wherein the communication port side of the heat storage body portion is composed of a low adsorbent for the harmful gas.