JP5177436B2 - Surface-treated phosphor-containing curable silicone resin composition and light-emitting device - Google Patents

Description

  The present invention relates to a curable silicone resin composition containing a surface-treated inorganic phosphor, and a light emitting diode (LED) chip having improved moisture resistance by being sealed with a cured product of the silicone resin composition. The present invention relates to a light emitting device provided.

  In a conventional phosphor-containing LED light-emitting device, a translucent mold member is provided to protect an LED chip mounted on a package from the external environment, and a phosphor is appropriately mixed with a mass ratio (for example, 0.1 to 60%).

  In conventional phosphor-containing LED light-emitting devices, it is common to incorporate a yellow YAG phosphor, but in recent years, in order to further improve color rendering properties, sulfide-containing phosphors containing sulfur, such as CaS ZnS-based phosphors have been used in combination. In addition, silicate phosphors have been used instead of YAG phosphors.

  However, it is generally known that these phosphors have low moisture resistance. For example, sulfide-based phosphors have a problem that hydrogen sulfide is generated by the reaction between the phosphor surface and water, and the fluorescence characteristics are significantly deteriorated. Similarly, the silicate phosphor also has a problem that the phosphor is decomposed by the reaction of the phosphor surface with water, and the fluorescence characteristics are remarkably deteriorated. As a result, there is a problem that the long-term reliability of the light emitting diode under high humidity is lowered.

  In order to impart moisture resistance to the phosphor, as disclosed in JP-A-2008-50548 (Patent Document 1) and JP-A-2006-124680 (Patent Document 2), an alkoxysilane or metal alkoxide solution is used. It has been attempted to subject the phosphor to surface treatment. However, in the surface treatment by these methods, when using a highly moisture-permeable resin such as a silicone resin, there is a drawback that the moisture resistance is insufficient and is not suitable for practical use.

JP 2008-50548 A JP 2006-124680 A

  The present invention has been made in view of the above circumstances, a curable silicone resin composition containing a sulfide-based or silicate-based phosphor surface-treated to impart moisture resistance, and a cured product of the silicone resin composition An object of the present invention is to provide a light emitting device in which an LED chip is sealed and can maintain fluorescent characteristics for a long time under high humidity.

The present inventors have made intensive studies for solving the above problems, in the made by mixing an inorganic phosphor fluorescent material-containing curable silicone resin composition, the surface of the inorganic phosphor, hydro alkoxy Sila down The inventors have found that the above-described object can be achieved by surface treatment with an oligomer of the present invention, and have completed the present invention.

（但し、Ｌは０〜８の整数である。Ｍｅはメチル基、Ｅｔはエチル基を示す。）
請求項４：
硬化性シリコーン樹脂組成物が、
（ａ）１分子中にケイ素原子と結合するアルケニル基を２個以上含有するオルガノポリシロキサン、
（ｂ）１分子中に２個以上のケイ素原子に結合した水素原子（ＳｉＨ基）を有するオルガノハイドロジェンポリシロキサン：（ａ）成分中のケイ素原子と結合するアルケニル基に対して、（ｂ）成分のケイ素原子に結合した水素原子がモル比で０．１〜５．０となる量、
（ｃ）触媒量の白金族系触媒
を必須成分とする付加硬化型シリコーン樹脂組成物である請求項１〜３のいずれか１項記載の硬化性シリコーン樹脂組成物。
請求項５：
発光ダイオード（ＬＥＤ）チップの封止用である請求項１〜４のいずれか１項記載の硬化性シリコーン樹脂組成物。
請求項６：
ＬＥＤチップを請求項５記載の硬化性シリコーン樹脂組成物の硬化物により封止してなることを特徴とする発光装置。
請求項７：
硫黄物系又はシリケート系蛍光体とハイドロアルコキシシランのオリゴマーとを混合してなる表面処理蛍光体粒子粉末を室温下で３〜５時間風乾させた後、４００〜６００℃で１〜２４時間乾燥させることを特徴とする表面処理された硫黄物系又はシリケート系蛍光体の製造方法。
Accordingly, the present invention has the following surface-treated sulfur-based or silicate-based phosphor containing has recone resin composition and a light-emitting device, further provides a method for producing a surface-treated sulfur-based or silicate-based phosphor.
Claim 1:
A curable silicone resin composition comprising a sulfide-based or silicate-based phosphor at least partially surface-treated with an oligomer of hydroalkoxysilane .
Claim 2:
Sulfide-based or silicate-based phosphors include CaS, ZnS, Y ₂ O ₂ S, CdS, Ln ₂ O ₂ S (Ln: Y, Gd, La), Sr ₃ SiO ₅ : Eu ²⁺ , Sr ₂ Si _3. The curable silicone resin composition according to claim 1, which is O ₈ · 2SrCl ₂ : Eu ²⁺ or (Sr, Ca, Ba, Mg, Zn) ₂ SiO ₄ : Eu ³⁺ , Mn ²⁺ .
Claim 3:
The curable silicone resin composition according to claim 1 or 2 , wherein the hydroalkoxysilane oligomer is represented by the following general formula (i) or (ii) .

(However, L is an integer of 0 to 8. Me represents a methyl group, and Et represents an ethyl group.)
Claim 4:
The curable silicone resin composition is
(A) an organopolysiloxane containing two or more alkenyl groups bonded to silicon atoms in one molecule;
(B) Organohydrogenpolysiloxane having a hydrogen atom (SiH group) bonded to two or more silicon atoms in one molecule: (b) For an alkenyl group bonded to a silicon atom in component (b) The amount of hydrogen atoms bonded to the silicon atoms of the component is 0.1 to 5.0 by molar ratio,
(C) A catalytic amount of a platinum group catalyst
The curable silicone resin composition according to any one of claims 1 to 3, which is an addition-curable silicone resin composition having an essential component .
Claim 5:
It is an object for sealing of a light emitting diode (LED) chip | tip, The curable silicone resin composition of any one of Claims 1-4 .
Claim 6:
6. A light emitting device comprising an LED chip sealed with a cured product of the curable silicone resin composition according to claim 5 .
Claim 7:
The surface-treated phosphor particle powder obtained by mixing the sulfur-based or silicate-based phosphor and the hydroalkoxysilane oligomer is air-dried at room temperature for 3 to 5 hours and then dried at 400 to 600 ° C. for 1 to 24 hours. A method for producing a surface-treated sulfur-based or silicate-based phosphor.

  According to the present invention, by using a cured product of a curable silicone resin composition containing a phosphor obtained by subjecting a sulfide-based phosphor or a silicate-based phosphor to a surface treatment as an LED chip sealing material, Conventionally, it is possible to obtain a phosphor-containing silicone resin composition and a light-emitting device that can ensure long-term reliability against a light-emitting device whose reliability has been reduced due to decomposition of the phosphor with time.

It is sectional drawing which shows typically embodiment of the fluorescent substance containing LED light-emitting device concerning this invention.

The present invention will be described in detail below.
FIG. 1 is a cross-sectional view of a basic configuration of a typical light emitting device of the present invention. The light-emitting device of the present invention is a light-emitting device including an LED chip 1 and a silicone resin sealing portion 5, and an inorganic phosphor that converts part of the light emitted from the LED chip 1 into different wavelengths in the silicone resin sealing portion 5 3 and at least a part of the inorganic phosphor is surface-treated in advance.

As the phosphor that can be used in the present invention, for example, blue light generated from a blue LED chip can be converted into yellow light, for example, green-yellow, and any of those generally available in the market can be used. However, the most suitable oxide phosphor includes a YAG phosphor. Further, as phosphors for improving color rendering properties, for example, CaS, ZnS, Y ₂ O ₂ S, CdS, Ln ₂ O ₂ S (Ln: Y, Gd, La) and the like are used as a base material. Examples thereof include sulfide-based phosphors containing sulfur as a constituent element.

Examples of the blue phosphor of the silicate phosphor include Sr ₃ SiO ₅ : Eu ²⁺ , Sr ₂ Si ₃ O ₈ .2SrCl ₂ : Eu ^{2+ and the} like. Examples of the red phosphor of the silicate phosphor include (Sr, Ca, Ba, Mg, Zn) ₂ SiO ₄ : Eu ³⁺ , Mn ^{2+ and the} like. The phosphor used in the present invention is not limited to the phosphors exemplified above.

  The light-emitting device of the present invention is characterized in that the phosphor particles are previously surface-treated. By applying the surface treatment and improving the moisture resistance of the phosphor particles, the phosphor characteristics of the phosphor are prolonged. The period is maintained to improve the reliability of the light emitting device.

  In the present invention, as the surface treatment agent used for the surface treatment of the phosphor, hydroalkoxysilane or an oligomer thereof is particularly preferable.

（但し、Ｌは０〜８の整数である。） Such a hydroalkoxysilane or its oligomer is represented by the following general formula (i) or (ii), for example. In the following formulae, Me represents a methyl group, and Et represents an ethyl group.

(However, L is an integer of 0-8.)

  The amount of hydroalkoxysilane or its oligomer added varies depending on the specific surface area of the phosphor particle powder, but usually 1 to 50 parts by mass of hydroalkoxysilane or its oligomer used for processing per 100 parts by mass of the phosphor particle powder. Preferably, it is 10-40 mass parts. When the amount is less than 1 part by mass, a sufficient moisture resistance effect may not be obtained. When the amount exceeds 50 parts by mass, the surface treatment layer becomes too thick, the light conversion rate of the phosphor decreases, and the desired light Characteristics cannot be obtained.

  As a device for mixing the phosphor particle powder and the hydroalkoxysilane or its oligomer, a ball-type kneader such as a rolling ball mill or a vibration ball mill, a hybrid mixer, or the like can be preferably used.

  The obtained surface-treated phosphor particle powder is air-dried at room temperature for 3 to 5 hours, and then dried by using a dryer for 1 to 24 hours to obtain the surface-treated phosphor particle powder. The drying temperature is preferably in the temperature range of 100 to 700 ° C, more preferably 400 to 600 ° C. When the temperature is lower than 100 ° C., the reaction of hydroalkoxysilane or its oligomer is not sufficient, and the effect of surface treatment may not be obtained. When the temperature exceeds 700 ° C., thermal decomposition of the phosphor occurs. The conversion function cannot be obtained, which is not preferable.

  Next, specific examples of the mold member (sealing material) used in the present invention include addition-curable silicone resin compositions. Examples of the addition-curable silicone resin composition include linear diorganopolysiloxanes and organohydrogens having alkenyl groups such as vinyl groups at both ends of the molecular chain, in the middle of the molecular chain, or at both ends of the molecular chain and in the middle of the molecular chain. Examples thereof include those prepared by hydrosilylation addition reaction with polysiloxane in the presence of a platinum group catalyst.

As an addition-curable silicone resin composition, specifically,
(A) an organopolysiloxane containing two or more alkenyl groups bonded to silicon atoms in one molecule;
(B) Organohydrogenpolysiloxane having a hydrogen atom (SiH group) bonded to two or more silicon atoms in one molecule: (b) For an alkenyl group bonded to a silicon atom in component (b) The amount of hydrogen atoms bonded to the silicon atoms of the component is 0.1 to 5.0 by molar ratio,
(C) Addition-curable silicone resin compositions containing a catalytic amount of a platinum group catalyst as an essential component.

The organopolysiloxane containing two or more alkenyl groups bonded to silicon atoms in one molecule of the component (a) used in the addition curable silicone resin composition is used as a base polymer of the addition curable silicone resin composition. It is a known organopolysiloxane, and has a polystyrene-equivalent weight average molecular weight of about 3,000 to 300,000 by GPC (gel permeation chromatography) analysis. (° C.) having a viscosity of about 100 to 1,000,000 mPa · s, particularly about 200 to 100,000 mPa · s, and those represented by the following average composition formula (1) are used.
R ¹ _a SiO _{(4-a) / 2} (1)
Wherein R ¹ is an unsubstituted or substituted monovalent hydrocarbon group having the same or different carbon number of 1 to 10, preferably 1 to 8, and a is 1.5 to 2.8, preferably 1 .8 to 2.5, more preferably a positive number in the range of 1.95 to 2.05.)

Examples of the unsubstituted or substituted monovalent hydrocarbon group bonded to the silicon atom represented by R ¹ include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, and a pentyl group. Alkyl groups such as neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, decyl group; aryl groups such as phenyl group, tolyl group, xylyl group, naphthyl group; benzyl group, phenylethyl group, phenylpropyl group, etc. An aralkyl group of: an alkenyl group such as a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, a hexenyl group, a cyclohexenyl group, or an octenyl group, or a part or all of the hydrogen atoms of these groups is fluorine, bromine Substituted with a halogen atom such as chlorine, cyano group, etc., for example, chloromethyl group, chloro Propyl group, bromoethyl group, trifluoropropyl group, etc. cyanoethyl group.

In this case, it is necessary that at least two of R ¹ are alkenyl groups (particularly those having 2 to 8 carbon atoms are preferred, more preferably 2 to 6). The content of the alkenyl group is 0.01 to in all hydrocarbon groups bonded to silicon atoms (that is, in the unsubstituted or substituted monovalent hydrocarbon group as R ¹ in the average composition formula (1)). It is preferable to set it as 20 mol%, especially 0.1-10 mol%. This alkenyl group may be bonded to a silicon atom at the end of the molecular chain, a silicon atom in the middle of the molecular chain, or both. From the viewpoint of the curing speed of the composition, the physical properties of the cured product, etc., the organo The polysiloxane preferably contains an alkenyl group bonded to the silicon atom at the end of the molecular chain.

The structure of the above-mentioned organopolysiloxane is usually that the main chain consists of repeating diorganosiloxane units ((R ¹ ) ₂ SiO _2/2 units), and both ends of the molecular chain are triorganosiloxy groups ((R ¹ ) ₃ SiO basically blocked with _1/2 unit) is a diorganopolysiloxane having a linear structure, in part branched containing R ¹ SiO _3/2 units and SiO _4/2 units It may be a structure, a ring structure, or the like.

  An unsubstituted or substituted monovalent hydrocarbon group bonded to a silicon atom may be basically any of the above, but an alkenyl group is preferably a vinyl group, and other groups are preferably a methyl group or a phenyl group. .

（式中、ＲはＲ¹と同様であるが、アルケニル基は含まない。ｍ、ｎはｍ≧１、ｎ≧０の整数であり、ｍ＋ｎはこのオルガノポリシロキサンの重量平均分子量を、３，０００〜３００，０００程度及び粘度を室温（２５℃）で１００〜１，０００，０００ｍＰａ・ｓ、特に２００〜１００，０００ｍＰａ・ｓ程度の値とする数である。） Examples of the component (a) include compounds represented by the following general formula.

(In the formula, R is the same as R ¹ , but does not include an alkenyl group. M and n are integers of m ≧ 1 and n ≧ 0, and m + n represents the weight average molecular weight of the organopolysiloxane, 3, 000 to 300,000 and the viscosity at room temperature (25 ° C.) of 100 to 1,000,000 mPa · s, particularly 200 to 100,000 mPa · s.)

The organohydrogenpolysiloxane of component (b) is an organohydrogenpolysiloxane having hydrogen atoms (SiH groups) bonded to two or more silicon atoms in one molecule. Here, the component (b) reacts with the component (a) and acts as a cross-linking agent, and there is no particular limitation on the molecular structure thereof. For example, linear, cyclic, branched, Various types such as a three-dimensional network structure (resin-like) can be used, but one molecule needs to have two or more hydrogen atoms (SiH groups) bonded to silicon atoms, preferably 2 to 200. More preferably, the number is 3 to 100. As the organohydrogenpolysiloxane, those represented by the following average composition formula (2) are used.
R ² _b H _c SiO _{(4-bc) / 2} (2)
(In the formula, R ² is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and examples of R ² include the same groups as R ¹ in the above formula (1). , B is 0.7 to 2.1, c is 0.001 to 1.0, and b + c is a positive number satisfying 0.8 to 3.0, preferably b is 1.0 to 2 0.0, c is 0.01 to 1.0, and b + c is 1.5 to 2.5.)

  The organohydrogenpolysiloxane of component (b) contains at least 2, preferably 3 or more SiH groups in one molecule, but the SiH group is located at either the molecular chain end or in the middle of the molecular chain. Or may be located in both. Further, the molecular structure of the organohydrogenpolysiloxane may be any of linear, cyclic, branched, and three-dimensional network structures, but the number of silicon atoms in one molecule is usually 2 to 300, preferably Is about 4 to 150, and is preferably liquid at room temperature (25 ° C.).

Examples of the organohydrogenpolysiloxane of the formula (2) include 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, tris (hydrogendimethylsiloxy) methylsilane, Tris (hydrogendimethylsiloxy) phenylsilane, methylhydrogencyclopolysiloxane, methylhydrogensiloxane / dimethylsiloxane cyclic copolymer, trimethylsiloxy group-blocked methylhydrogenpolysiloxane at both ends, trimethylsiloxy group-blocked dimethylsiloxane at both ends Methyl hydrogen siloxane copolymer, both ends dimethyl hydrogen siloxy group-capped dimethyl polysiloxane, both ends dimethyl hydrogen siloxy group capped dimethyl siloxane methyl high Rogen siloxane copolymer, trimethylsiloxy group-blocked methylhydrogensiloxane / diphenylsiloxane copolymer, trimethylsiloxy group-blocked methylhydrogensiloxane / diphenylsiloxane / dimethylsiloxane copolymer, both-end trimethylsiloxy group-blocked Methylhydrogensiloxane / methylphenylsiloxane / dimethylsiloxane copolymer, both ends dimethylhydrogensiloxy group-blocked methylhydrogensiloxane / dimethylsiloxane / diphenylsiloxane copolymer, both ends dimethylhydrogensiloxy group-blocked methylhydrogensiloxane / dimethylsiloxane-methylphenylsiloxane copolymer, (CH _{3) 2} HSiO _1/2 units and (CH _{3) 3} SiO _1/2 units and SiO _4/2 Position and a copolymer, (CH ₃₎ a copolymer consisting of ₂ HSiO _1/2 units and SiO _4/2 units, and (CH _{3) 2} HSiO _1/2 units and SiO _4/2 units (C _{And a} copolymer comprising ₆ H ₅ ) SiO _3/2 units.

  The amount of component (b) added is such that the hydrogen atom bonded to the silicon atom is 0.1 to 5.0 times the molar equivalent of one alkenyl group bonded to the silicon atom in component (a). Preferably in the range of 0.5 to 3.0 times equivalent, more preferably 0.8 to 2.0 times equivalent. When it is less than 0.1 times equivalent, the crosslinking density becomes too low, and the heat resistance of the cured silicone rubber may be lowered. Moreover, when more than 5.0 times equivalent, the problem of foaming by a dehydrogenation reaction will arise, and heat resistance may fall further.

  The component (c) platinum group catalyst is used as a catalyst for promoting the curing addition reaction (hydrosilation) between the component (a) and the component (b). Although a well-known thing can be used for a platinum group-type catalyst, it is preferable to use platinum or a platinum compound. Examples of platinum compounds include platinum black, platinous chloride, chloroplatinic acid, alcohol-modified products of chloroplatinic acid, complexes of chloroplatinic acid and olefins, aldehydes, vinyl siloxanes, acetylene alcohols, and the like.

  In addition, the blending amount of the platinum group catalyst may be appropriately increased or decreased depending on the desired curing rate, but is usually 0.1 to 1,000 ppm, preferably 1 to 1,000 parts by weight of platinum with respect to the component (a). It is in the range of 200 ppm.

  Finally, 0.1 to 60 parts by mass, preferably 0.3 to 30 parts by mass of the phosphor subjected to the surface treatment described above is added to 100 parts by mass of the addition-curable silicone resin composition as described above. Thus, a surface-treated phosphor-containing curable silicone resin composition can be obtained.

  In addition to the above-described components, the present composition can contain other components as necessary within the limit that does not impair the object effects of the present invention. For example, an addition type reaction inhibitor, a known component that imparts adhesion, such as alkoxysilane, silane coupling agent, and the like can be blended.

  The light emitting device of the present invention can be obtained by using a silicone resin obtained by curing the surface-treated phosphor-containing curable silicone resin composition as described above as an LED chip sealing resin.

  EXAMPLES Hereinafter, although this invention is demonstrated concretely using an Example and a comparative example, this invention is not restrict | limited to the following Example. In the following examples, parts are parts by mass, Me is a methyl group, and Et is an ethyl group.

で示されるハイドロトリアルコキシシランオリゴマー４０部を加え、ハイブリッドミキサーにて攪拌・混合した。得られた混合溶液を室温下で３時間風乾させた後、乾燥機を用いて５５０℃で１０時間乾燥を行い、表面処理を施した硫化物系蛍光体を得た。 [Example 1]
The following formula is added to 100 parts of calcium sulfide phosphor which is a sulfide phosphor.

40 parts of the hydrotrialkoxysilane oligomer represented by the above was added and stirred and mixed with a hybrid mixer. The obtained mixed solution was air-dried at room temperature for 3 hours and then dried at 550 ° C. for 10 hours using a dryer to obtain a surface-treated sulfide phosphor.

で示される両末端ビニルジメチルシロキシ基封鎖ジメチルポリシロキサン１００部に、下記式（ｉｖ）

で示されるオルガノハイドロジェンポリシロキサンを上記ビニル基含有ジメチルポリシロキサン（ｉｉｉ）中のビニル基に対するＳｉＨ基のモル比が１．５となる量、塩化白金酸のオクチルアルコール変性溶液を０．０５部、及びＹＡＧ系蛍光物質を３部に、前記で表面処理を施した表面処理硫化物系蛍光体を３部加えて混合し、表面処理蛍光体含有硬化性シリコーン樹脂組成物を調製した。 Next, the following formula (iii)

100 parts of vinyldimethylsiloxy group-blocked dimethylpolysiloxane represented by the following formula (iv)

The amount of SiH groups to the vinyl group in the vinyl group-containing dimethylpolysiloxane (iii) is 1.5, and 0.05 part of an octyl alcohol-modified solution of chloroplatinic acid. 3 parts of the YAG phosphor and 3 parts of the surface-treated sulfide phosphor subjected to the surface treatment described above were added and mixed to prepare a surface-treated phosphor-containing curable silicone resin composition.

[Example 2]
In the same manner as in Example 1, surface treatment was performed on Sr ₃ SiO ₅ : Eu ²⁺ , which is a silicate phosphor, using hydrotrialkoxysilane to obtain a surface-treated silicate phosphor.

  Next, to 100 parts of both ends vinyldimethylsiloxy group-blocked dimethylpolysiloxane, an amount in which the molar ratio of SiH groups to vinyl groups in the vinyl group-containing dimethylpolysiloxane is 1.5 for the organohydrogenpolysiloxane, and 0.05 part of an octyl alcohol-modified solution of chloroplatinic acid and 3 parts of the above-treated silicate phosphor were added and mixed to prepare a surface-treated phosphor-containing curable silicone resin composition.

[Comparative Example 1]
In Example 1, a phosphor-containing curable silicone resin composition was prepared in the same manner as in Example 1 except that a sulfide-based phosphor that was not subjected to surface treatment was used.

[Comparative Example 2]
In Example 1, a surface-treated phosphor-containing curable silicone resin composition was prepared in the same manner as in Example 1 except that the surface treatment was performed using trimethoxysilane as a silane coupling agent. Comparative Example 2 was obtained.

  The composition was cured at 80 ° C. for 4 hours, and the physical properties of the obtained cured product were measured according to JISK6301. The hardness test was carried out using a spring type A tester. The results are shown in Table 1.

  Next, an LED chip using an InGaN semiconductor having a main emission peak of 460 nm was sealed with the phosphor-containing curable silicone resin composition prepared in Examples 1 and 2 or Comparative Examples 1 and 2, and 100 ° C. for 1 hour. A light emitting device for evaluation was produced. This evaluation sample was allowed to stand in a constant temperature and humidity chamber at 85 ° C. and 85% RH while being turned on by flowing a current of 25 mA, and the decay rate and color coordinates of the emission intensity with respect to the initial emission intensity were measured. . The results are shown in Table 2.

  In Examples 1 and 2, the mechanical properties of the silicone rubber were not deteriorated, and the light emission intensity was not greatly reduced and the color of the emitted color was not changed even after being left for 300 hours. However, in Comparative Examples 1 and 2, the mechanical properties of the silicone rubber did not decrease, but the strength decreased and the color changed.

DESCRIPTION OF SYMBOLS 1 LED chip 2 Conductive wire 3 Phosphor 4 Package 5 Silicone resin sealing part

Claims (7)

A curable silicone resin composition comprising a sulfide-based or silicate-based phosphor at least partially surface-treated with an oligomer of hydroalkoxysilane . Sulfide-based or silicate-based phosphors include CaS, ZnS, Y ₂ O ₂ S, CdS, Ln ₂ O ₂ S (Ln: Y, Gd, La), Sr ₃ SiO ₅ : Eu ²⁺ , Sr ₂ Si _3. The curable silicone resin composition according to claim 1, which is O ₈ · 2SrCl ₂ : Eu ²⁺ or (Sr, Ca, Ba, Mg, Zn) ₂ SiO ₄ : Eu ³⁺ , Mn ²⁺ . The curable silicone resin composition according to claim 1 or 2 , wherein the hydroalkoxysilane oligomer is represented by the following general formula (i) or (ii) .

(However, L is an integer of 0 to 8. Me represents a methyl group, and Et represents an ethyl group.) The curable silicone resin composition is
(A) an organopolysiloxane containing two or more alkenyl groups bonded to silicon atoms in one molecule;
(B) Organohydrogenpolysiloxane having a hydrogen atom (SiH group) bonded to two or more silicon atoms in one molecule: (b) For an alkenyl group bonded to a silicon atom in component (b) The amount of hydrogen atoms bonded to the silicon atoms of the component is 0.1 to 5.0 by molar ratio,
(C) A catalytic amount of a platinum group catalyst
The curable silicone resin composition according to any one of claims 1 to 3, which is an addition-curable silicone resin composition having an essential component . It is an object for sealing of a light emitting diode (LED) chip | tip, The curable silicone resin composition of any one of Claims 1-4 . 6. A light emitting device comprising an LED chip sealed with a cured product of the curable silicone resin composition according to claim 5 . The surface-treated phosphor particle powder obtained by mixing the sulfur-based or silicate-based phosphor and the hydroalkoxysilane oligomer is air-dried at room temperature for 3 to 5 hours and then dried at 400 to 600 ° C. for 1 to 24 hours. A method for producing a surface-treated sulfur-based or silicate-based phosphor.

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