JP5174698B2 - Cutting apparatus and method for manufacturing electronic parts - Google Patents

Description

  The present invention is to manufacture a plurality of electronic components by cutting a sealed substrate, in which a substrate on which a plurality of chips such as semiconductor chips are mounted, resin-sealed, is cut along a predetermined line and separated into individual pieces. The present invention relates to a cutting apparatus and a cutting method for manufacturing electronic parts.

  Various types of methods have been developed and put into practical use for cutting a sealed substrate in which one principal surface of a substrate such as a lead frame or a printed circuit board is sealed with a resin or the like. One of them is a cutting method using thermal energy by laser light. This method is generally performed as follows. First, at least one chip is mounted in a section provided in a lattice pattern on the substrate. Next, the plurality of chips mounted on the substrate are collectively sealed with resin. Thereby, the sealed substrate is completed. Next, the sealed substrate is cut by irradiating a laser beam along a line that divides the sealed substrate for each section. As a result, the sealed substrate is divided into a plurality of electronic components respectively corresponding to the plurality of sections (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 9-36151 (page 4, FIG. 2)

  In general, a plastic substrate has been used as a substrate to be cut by this method. However, ceramic substrates made of alumina, etc., which have features superior to plastic substrates in terms of electrical insulation, corrosion resistance, wear resistance, heat dissipation characteristics, and strength, have been widely used, and this method is used for cutting ceramic substrates. It has come to be.

  When cutting with laser light, the substrate is adhered on a dicing tape and then cut so that the work of transporting the separated electronic components after cutting is simplified. The separated electronic components are conveyed to a predetermined place where the next process is performed for each dicing tape while being adhered to the dicing tape.

  However, when a ceramic substrate such as alumina is cut with a laser beam, the ceramic is melted and dross is generated at the cut portion. Since the melted dross cannot move in the vertical direction (downward) due to the presence of the dicing tape adhered to the bottom surface of the substrate, it must be moved in the horizontal direction. For this reason, it is difficult to ensure the quality of the separated electronic components such that the generated dross adheres to the surface of the substrate or is re-welded to the cutting surface of the substrate. In addition, a processing operation for removing dross from the separated electronic parts is required, and there has been a problem in that it cannot be separated into pieces efficiently.

  The object of the present invention is to enable efficient singulation by preventing dross from sticking to the surface and re-welding to the cut surface in the singulation process of cutting a sealed substrate with laser light. At the same time, it is to improve the quality of the separated electronic parts.

  Hereinafter, reference numerals in parentheses in the descriptions of “means for solving the problems”, “effects of the invention”, and “mode for carrying out the invention” indicate terms in the description and components shown in the drawings. It is described for the purpose of facilitating comparison. Further, these symbols and the like do not mean that “the meaning of the terms in the description is limited to the components shown in the drawings”.

  In order to solve the above-described problems, a cutting apparatus according to the present invention includes a circuit board (1), a chip (3) mounted on the circuit board (1), and a resin ( 5) for manufacturing an electronic component by manufacturing an electronic component by cutting the sealed substrate (4) along a predetermined line (6) using a laser beam (9) into pieces. A cutting device, a base (13) to which the sealed substrate (4) is adhered via an adhesive tape (7), and the sealed substrate (4) fixed to the base (13) ) For irradiating the laser beam (9) toward the predetermined line (6), and an assist gas (10) toward the predetermined line (6) of the sealed substrate (4). 16), and the predetermined line (6) is formed on a thin layer portion (11) provided in advance on the circuit board (1). It is characterized in that is.

  Moreover, the cutting device according to the present invention is characterized in that, in the above-described cutting device for manufacturing an electronic component, the thin layer portion (11) is formed on at least one surface of the circuit board (1). .

  The cutting device according to the present invention is the above-described cutting device for manufacturing an electronic component, wherein the resin (5) is thin in a portion overlapping the thin layer portion (11) in the sealed substrate (4). A portion is provided.

  Further, the cutting device according to the present invention is the cutting device for manufacturing an electronic component described above, wherein the adhesive tape (7) to which the electronic component obtained by separating the sealed substrate (4) is adhered is A transport mechanism for transporting to a predetermined place in the process is provided.

  The cutting method according to the present invention includes a circuit board (1), a chip (3) mounted on the circuit board (1), and a resin (5) for resin-sealing the chip (3). A cutting method for manufacturing an electronic component for manufacturing an electronic component by cutting a finished substrate (4) along a predetermined line (6) using a laser beam (9) into pieces. A step of preparing the sealed substrate (4) having the circuit board (1) provided with a thin layer portion (11) in advance so as to overlap a predetermined line (6), and an adhesive tape (7) Through the step of adhering the sealed substrate (4) to the base (13) and irradiating the laser beam (9) toward the predetermined line (6). ) Into the electronic component, and the assist gas (16) is injected toward the predetermined line (6). And degree, the electronic component is characterized by comprising the step of conveying the adhesive tape which is adhesive (7).

  Further, the cutting method according to the present invention is the above-described cutting method for manufacturing an electronic component, wherein in the step of dividing into pieces, the resin (5) and the circuit board (1) are located in the vicinity of the predetermined line (6). And at least a part of the dross (10) generated by melting the substrate is accommodated in a range defined by the thickness of the sealed substrate (4).

  The cutting method according to the present invention is characterized in that, in the above-described cutting method for manufacturing an electronic component, the thin layer portion (11) is formed on at least one surface of the circuit board (1). .

  Moreover, the cutting method according to the present invention is the above-described cutting method for manufacturing an electronic component, wherein the thin layer portion (11) overlaps a portion where the resin (5) is not formed or the resin (5). It is characterized by that.

  According to the present invention, the groove (11) is provided in advance in the sealed substrate (4) along a predetermined line (partition line) (6) that is divided for each section (2). Accordingly, the amount of dross (10) generated by cutting along the dividing line (6) is reduced, and the dross (10) is easily accommodated in the groove (11). As a result, the dross (10) is easily removed and the cut surface is smooth, so that the quality of the separated electronic component can be improved. Furthermore, since the amount of dissolution dissolved by the irradiation of the laser beam (9) is reduced by providing the groove (11), the working time can be shortened, and the dross (10) generated by dissolution as the amount of dissolution decreases And re-welding to the cut surface can be prevented with high probability.

FIG. 1 shows a cutting apparatus for manufacturing an electronic component according to a first embodiment, in which the substrate is cut along a main line of the cutting apparatus and a parting line of the substrate in which a groove is provided on the lower surface of the sealed substrate. FIG. FIG. 2 shows that when a sealed substrate having grooves on the lower surface is cut by laser light irradiation, the generated dross is within a range defined by the thickness including the grooves formed on both surfaces of the sealed substrate. It is sectional drawing which shows the process accommodated. FIG. 3 shows that in Example 2, when a sealed substrate having grooves formed on both upper and lower surfaces of a ceramic substrate is cut by laser light irradiation, the generated dross includes grooves formed on both surfaces of the sealed substrate. It is sectional drawing which shows the process accommodated in the range prescribed | regulated by thickness. FIG. 4 shows a groove formed on both surfaces of a sealed substrate when a sealed substrate having grooves formed on both upper and lower surfaces of the sealed substrate in Example 3 is cut by laser light irradiation. It is sectional drawing which shows the process accommodated in the range prescribed | regulated by the thickness containing.

  The main part (12) of the cutting apparatus adheres the sealed substrate (4) to the laser beam irradiation mechanism (14) that irradiates the sealed substrate (4), which is a cutting object, with the laser beam (9). And a base (13) on which the dicing tape (7) is arranged. The laser beam irradiation mechanism (14) is provided with an assist gas supply pipe (17) for supplying an assist gas (16), and the assist gas (16) is injected from the coaxial direction simultaneously with the irradiation of the laser beam (9). . The sealed substrate (4) is formed by collectively sealing a plurality of chips (3) mounted on the ceramic substrate (1) with a resin (5), and is divided into sections (2). A predetermined line (partition line) (6) is provided. A groove (11) is provided along the dividing line (6), and a laser beam (9) is irradiated and cut along the dividing line (6) so that the generated dross (10) forms the groove (11). It becomes easy to be accommodated in the range prescribed | regulated by the thickness to include.

  Embodiment 1 of a cutting apparatus and a cutting method for manufacturing an electronic component according to the present invention will be described with reference to FIGS.

  As shown in FIG. 1, at least one chip 3 (for example, an LED chip) is mounted on a section 2 provided in a lattice shape on a ceramic substrate 1 that is a circuit board. The sealed substrate 4 is configured by resin-sealing a plurality of chips 3 mounted on the ceramic substrate 1 together with a resin 5. Further, the sealed substrate 4 is virtually provided with a predetermined line (hereinafter referred to as “partition line 6”) for dividing the section 2. The back surface (chip 3 non-mounting surface) of the sealed substrate 4 is adhered to the dicing tape 7. The sealed substrate 4 is adhered to the dicing tape 7 so that the surface on which the LED lens 8 is formed (chip 3 mounting surface) faces upward. Since the dicing tape 7 is made of a material through which the laser light 9 is transmitted, the dicing tape 7 is not cut when the substrate is separated. Therefore, the dicing tape 7 protects the back surface (the chip 3 non-mounting surface) of the sealed substrate 4 and a plurality of electronic components formed by separating the sealed substrate 4 into individual pieces without scattering. It is conveyed all at once to a predetermined place in the next process.

  The ceramic substrate 1 is provided with a groove 11 along the dividing line 6 in which the dross 10 (see FIG. 2) generated during cutting in the process of manufacturing the ceramic substrate 1 is accommodated. The width and shape of the groove 11 are appropriately selected according to the cutting width and the oscillator of the laser beam 9 to be used. As a method of forming the groove 11, for example, a method of cutting the ceramic substrate 1 with a blade or the like can be mentioned.

  The main part 12 of the cutting part is composed of a base 13 arranged by adhering a dicing tape 7 to which the sealed substrate 4 is adhered, and a laser light irradiation mechanism 14. The base 13 can rotate freely in the direction indicated by the arrow θ and move in the horizontal direction (the direction indicated by the arrow X and the arrow Y) according to an instruction from a control unit (not shown). The laser beam irradiation mechanism 14 is disposed so as to be movable in the vertical direction (the direction indicated by the arrow Z; hereinafter referred to as “Z direction”) with respect to the base 13.

The oscillator 15 of the laser beam 9 constituting the laser beam irradiation mechanism 14 is appropriately selected according to the type of substance used for the ceramic substrate 1. For example, a YAG laser light oscillator or a carbon dioxide laser light oscillator is used. Further, the beam diameter irradiated from the laser light irradiation mechanism 14 to the sealed substrate 4 is also appropriately selected according to the type of ceramic material used for the ceramic substrate 1.
In order to improve the flowability of the dross 10 generated on the surface of the sealed substrate 4 at the time of cutting, a gas such as air or nitrogen (hereinafter referred to as “assist gas 16”) is applied to the cut portion, and the assist gas supply pipe 17 is connected. May be used and blown. The assist gas 16 may use argon, helium, oxygen, carbon dioxide, etc. in addition to air and nitrogen.

Hereinafter, the operation of the cutting apparatus when the ceramic substrate 1 provided with the grooves 11 along the dividing line 6 is cut by the laser light 9 will be described with reference to FIG.
First, the dicing tape 7 is installed at a predetermined location on the base 13. Next, the sealed substrate 4 is adhered to a predetermined place of the dicing tape 7. Next, the laser light irradiation mechanism 14 is moved in the + Z direction so that the focal point of the laser light 9 irradiated from the laser light irradiation mechanism 14 is aligned with the chip 3 mounting surface of the sealed substrate 4 so as to approach the sealed substrate 4. . At the same time, the base 13 is moved so that the laser beam 9 is focused on a predetermined position serving as a cutting start point in the dividing line 6 provided on the sealed substrate 4. Thereafter, the base 13 is moved by a route that can be cut most efficiently so that the laser light 9 irradiated from the tip of the laser light irradiation mechanism 14 moves along the dividing line 6 provided on the ceramic substrate 1.

  As shown in FIG. 2 (1), the resin 5 constituting the upper part of the sealed substrate 4 is dissolved by irradiating the laser beam 9 along the dividing line 6. As the melting progresses, the ceramic substrate 1 provided under the resin 5 also melts and penetrates the sealed substrate 4 as shown in FIG. Separately formed for each compartment 2. The assist gas 16 supplied from the assist gas supply pipe 17 is jetted from the coaxial direction simultaneously with the irradiation of the laser light 9. The dross 10 generated by melting the resin 5 and the ceramic in the portion irradiated with the laser light 9 flows downward by its own weight and the blowing of the assist gas 16. As a result, the dross 10 generated on the cut surface cut along the dividing line 6 is easily accommodated within the range defined by the thickness including the formed groove 11 (see FIG. 2 (3)). As described above, since the dross 10 is removed and the cut surface is smooth, the quality of the separated electronic component is improved.

  A second embodiment of the present invention will be described below with reference to FIG.

  In addition, about the component and operation | movement which are common in Example 1, in order to avoid duplication of description, it abbreviate | omits.

  As shown in FIG. 3 (1), the resin 5 constituting the upper part of the sealed substrate 4 is dissolved by irradiating the laser beam 9 along the dividing line 6. As the melting progresses, the ceramic substrate 1 provided under the resin 5 also melts and penetrates through the sealed substrate 4 as shown in FIG. Separately formed for each compartment 2. Simultaneously with the irradiation of the laser beam 9, the assist gas 16 is supplied from the coaxial direction. The dross 10 generated by melting the resin 5 and the ceramic in the portion irradiated with the laser light 9 flows downward by its own weight and the blowing of the assist gas 16. As a result, the dross 10 generated on the cut surface cut along the dividing line 6 is easily accommodated within a range defined by the thickness including the formed groove 11 (see FIG. 3 (3)). The dross 10 is easily removed, and the cut surface is smoothed, so that the quality of the separated electronic component can be improved.

  Furthermore, in the second embodiment, since the grooves 11 are provided on the upper and lower surfaces of the ceramic substrate 1, the thickness of the ceramic substrate 1 cut by the laser light 9 is thinner than that in the first embodiment. As a result, the amount of ceramic dissolved by the irradiation with the laser beam 9 is reduced as compared with the first embodiment. Since the ceramic substrate 1 such as alumina has high hardness, it takes time to cut the ceramic substrate 1 according to the conventional method. However, according to this embodiment, by reducing the amount of ceramic dissolved, the energy efficiency is improved and the time required for cutting is shortened.

  A third embodiment of the present invention will be described below with reference to FIG. In the present embodiment, the groove 11 is also provided in the portion of the resin 5 that overlaps the dividing line 6. In this case, the groove 11 overlaps the resin 5.

  In addition, about the component and operation | movement common to Example 1 and Example 2, in order to avoid duplication of description, it abbreviate | omits.

  As shown in FIG. 4 (1), the resin 5 constituting the upper part of the sealed substrate 4 is dissolved by irradiating the laser beam 9 along the dividing line 6. As the melting progresses, the ceramic substrate 1 provided under the resin 5 also melts as shown in FIG. 4 (2), penetrates the sealed substrate 4, and the electronic component is partitioned 2 Separately formed every time. Simultaneously with the irradiation of the laser beam 9, the assist gas 16 is supplied from the coaxial direction. The dross 10 generated by melting the resin 5 and the ceramic in the portion irradiated with the laser light 9 flows downward by its own weight and the blowing of the assist gas 16. As a result, the dross 10 generated on the cut surface cut along the dividing line 6 is easily accommodated within the range defined by the thickness including the groove 11 (see FIG. 4 (3)). The dross 10 is easily removed, and the cut surface is smooth, so that the quality of the separated electronic component can be improved.

  Furthermore, in Example 3, since the groove | channel 11 is provided in both surfaces of the sealed substrate 4, the thickness of the sealed substrate 4 cut with the laser beam 9 is compared with Example 1 and Example 2. The thinnest. As a result, the amount of dissolution due to the irradiation of the laser beam 9 is the smallest as compared with the first and second embodiments. By reducing the amount of dissolution, the amount of dross 10 generated is also reduced, and re-welding to the cut surface can be prevented with a high probability.

  The groove 11 provided in the resin 5 in the third embodiment is formed by the laser light 9 or a blade. Moreover, you may form the groove | channel 11 with the metal mold | die structure used when resin-sealing. Furthermore, a portion where the resin 5 is not formed may be provided on the sealed substrate 4 so as to overlap the dividing line 6.

  In each of the embodiments so far, the sealed substrate 4 having the LED chip as the chip 3 and the ceramic substrate as the substrate has been described. Not limited to this, a laser diode chip can be used as the chip 3. Furthermore, by using a power semiconductor chip as the chip 3 and a ceramic substrate, a lead frame, a metal base substrate, a metal core substrate, or the like as the substrate, the present invention can be applied when manufacturing a power semiconductor component. Further, the present invention may be applied when using the optical semiconductor chip and the lead frame described above.

  In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

1 Ceramic substrate
2 division 3 chip 4 sealed substrate 5 resin 6 dividing line (predetermined line)
7 Dicing tape 8 LED lens 9 Laser light 10 Dross 11 Groove (thin layer part)
12 Major Parts of Cutting Device 13 Base 14 Laser Light Irradiation Mechanism
15 Oscillator 16 Assist Gas 17 Assist Gas Supply Pipe

Claims (8)

A sealed substrate having a circuit board, a chip mounted on the circuit board, and a resin for sealing the chip with resin is cut along a predetermined line using a laser beam and separated into pieces. A cutting device for manufacturing electronic parts for manufacturing parts,
A base to which the sealed substrate is adhered via an adhesive tape;
An irradiation mechanism for irradiating the laser beam toward the predetermined line of the sealed substrate fixed to the base;
An injection mechanism for injecting an assist gas toward the predetermined line of the sealed substrate,
The cutting apparatus for manufacturing an electronic component, wherein the predetermined line overlaps a thin layer portion provided in advance on the circuit board. A cutting device for manufacturing an electronic component according to claim 1,
The thin layer part is formed on at least one surface of the circuit board. A cutting apparatus for manufacturing an electronic component according to claim 1 or 2,
A cutting apparatus for manufacturing an electronic component, wherein a thin portion of the resin is provided on a portion of the sealed substrate that overlaps the thin layer portion. A cutting apparatus for manufacturing an electronic component according to any one of claims 1 to 3,
A cutting apparatus for manufacturing an electronic component, comprising: a transport mechanism that transports the adhesive tape to which the electronic component having the sealed substrate separated into pieces to a predetermined place in a next process is provided. A sealed substrate having a circuit board, a chip mounted on the circuit board, and a resin for sealing the chip with resin is cut along a predetermined line using a laser beam and separated into pieces. A cutting method for manufacturing electronic parts for manufacturing parts,
A step of preparing the sealed substrate having the circuit board provided with a thin layer portion in advance so as to overlap the predetermined line; and a step of adhering the sealed substrate to a base via an adhesive tape; ,
Dividing the sealed substrate into the electronic components by irradiating the laser beam toward the predetermined line; and
Injecting an assist gas toward the predetermined line;
And a step of conveying the pressure-sensitive adhesive tape to which the electronic component is adhered. In the cutting method for electronic component manufacture described in Claim 5 ,
In the step of dividing into pieces, at least a part of dross generated by melting the resin and the circuit board in the vicinity of the predetermined line is accommodated in a range defined by the thickness of the sealed substrate. A cutting method for manufacturing an electronic component. In the cutting method for electronic component manufacture described in Claim 5 or 6,
The thin layer portion is formed on at least one surface of the circuit board. In the cutting method for electronic component manufacture described in any one of Claims 5-7,
The thin layer portion is a portion where the resin is not formed or overlaps with the resin.

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