JP5174413B2 - Control device - Google Patents

Control device Download PDF

Info

Publication number
JP5174413B2
JP5174413B2 JP2007261490A JP2007261490A JP5174413B2 JP 5174413 B2 JP5174413 B2 JP 5174413B2 JP 2007261490 A JP2007261490 A JP 2007261490A JP 2007261490 A JP2007261490 A JP 2007261490A JP 5174413 B2 JP5174413 B2 JP 5174413B2
Authority
JP
Japan
Prior art keywords
connector
substrate
control device
case
waterproof
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007261490A
Other languages
Japanese (ja)
Other versions
JP2009094175A (en
Inventor
勝 鴨志田
壮志 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2007261490A priority Critical patent/JP5174413B2/en
Publication of JP2009094175A publication Critical patent/JP2009094175A/en
Application granted granted Critical
Publication of JP5174413B2 publication Critical patent/JP5174413B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

本発明は機関の制御装置に関する。   The present invention relates to an engine control device.

従来より、内燃機関の制御装置は、防水性,防塵及び防錆の観点から防水構造をとることが一般的である。防水構造は、成形された弾性部材をケース及びカバーにより挟み込む形で緊迫力を持たせ防水する構造と、液体の防水用接着剤を塗布し硬化させることで防水する構造とが主流である。または、基板,コネクタを収容するケースをカップ状とし、基板を内設後に防水用ゲル剤等を充填させて防水構造を構築している。   Conventionally, a control device for an internal combustion engine generally has a waterproof structure from the viewpoint of waterproofness, dustproofing, and rustproofing. The main structures of the waterproof structure are a structure in which a molded elastic member is sandwiched between a case and a cover to give a tight force and waterproof, and a structure in which a liquid waterproof adhesive is applied and cured to waterproof. Or the case which accommodates a board | substrate and a connector is made into cup shape, and after installing a board | substrate, the waterproofing gel agent etc. are filled and the waterproof structure is constructed | assembled.

しかしながら、前者構造においては防水用接着剤が確実に接着できる表面状態を確保する必要があり、特別に洗浄する等の管理が必要になる。また、内部に空気層が存在するために高低差や温度差による制御装置内の内圧が変化することによる制御装置に接続されるハーネス側に影響を及ぼしてしまうという課題や制御装置自体が急激な環境変化を受けた場合、防水構造部に内圧変化による変形や圧力が印加され信頼性を低下するという課題がある。   However, in the former structure, it is necessary to ensure a surface state where the waterproofing adhesive can be reliably bonded, and management such as special cleaning is required. In addition, since there is an air layer inside, there is a problem of affecting the harness side connected to the control device due to changes in internal pressure in the control device due to height difference or temperature difference, and the control device itself is abrupt. When an environmental change is received, there is a problem that deformation or pressure due to a change in internal pressure is applied to the waterproof structure portion to reduce reliability.

また、後者の構造においては、確実に漏れないように基板を収容するケースをカップ状に形成する必要があり、更に防水用ゲル等を充填するため、ケースとの分解が困難であるという課題がある。全周を充填しないタイプにおいては、更にケースとカバー間を防水する構造を有する必要があり、この場合、前者の構造のように内圧が変化するという課題がある。   Further, in the latter structure, it is necessary to form a case for housing the substrate in a cup shape so that it does not leak reliably, and further, since it is filled with a waterproofing gel or the like, there is a problem that it is difficult to disassemble the case. is there. In the type that does not fill the entire circumference, it is necessary to further have a structure for waterproofing between the case and the cover. In this case, there is a problem that the internal pressure changes as in the former structure.

特許文献1に記されているような制御装置では、分解性の課題と接続部がコーティングされていないためカバーとの防水構造が必要になっており、高価な構造となっている。特許文献2に記載されている構造においても分解性の課題があり、確実な漏れない構造を構築するために複雑な構造が採用されており、高価な構造となっている。   In the control device as described in Patent Document 1, a waterproof structure with the cover is required because the problem of decomposability and the connection portion are not coated, and the structure is expensive. The structure described in Patent Document 2 also has a problem of decomposability, and a complicated structure is adopted to construct a structure that does not leak reliably, resulting in an expensive structure.

特開2002−198471号公報JP 2002-198471 A 特開平8−125071号公報JP-A-8-125071

本発明の目的は、防水性,防塵性を損なうことなく、容易に基板,コネクタを取り出すことができ、簡略化された収納用のケース,カバーを採用できる製造原価の安価な制御装置を提供するものである。   An object of the present invention is to provide an inexpensive control device with a low manufacturing cost, in which a substrate and a connector can be easily taken out without impairing waterproofness and dustproofness, and a simplified housing case and cover can be adopted. Is.

基板とコネクタの内設部のみを全周或いは放熱,アースを取る必要がある部位を除いた全周を防水用接着剤でコーティングする形で防水性,防塵性を確保し、このコネクタ,基板を収容するケース,カバーを簡略化できる構造とするものである。この構造とすることで上記目的を達成させることができる。   Only the inner part of the board and the connector is coated with a waterproofing adhesive on the entire circumference except for the part that needs to be taken around the whole area or to dissipate heat and ground. The case and cover to be accommodated can be simplified. With this structure, the above object can be achieved.

本発明によれば、防水性,防塵性及び防錆能力を確保しつつ、制御装置用のハーネスへの影響を低減しうる構造にできる。また、分解性に優れ、更に安価なケース,カバーの採用が可能となるため、高信頼性で安価な制御装置を提供できる。   ADVANTAGE OF THE INVENTION According to this invention, it can be set as the structure which can reduce the influence on the harness for control apparatuses, ensuring waterproofness, dustproof property, and rust prevention capability. In addition, since it is possible to use a case and a cover that are excellent in decomposability and are inexpensive, it is possible to provide a highly reliable and inexpensive control device.

基板と基板に接続されたコネクタのカバー,ケース内に内設される部位の全周が防水用接着剤によりコーティングされており、そのコネクタ,基板を収容するケース,カバー間には防水構造が設けられていない。また、制御装置内の圧力差をハーネス等に影響させないように従来技術では設けられている換気用部品又はコネクタ部をシーリングする構造が設けられていない。基板のコーティングは、伝熱,アースとの接続が必要な部位がマスキングされており、防水用接着剤によりコーティングされていない。これらの部位には、ケース側に設けられている伝熱用ボス,アース,固定用ボスと接触するような構造となっている。   The cover of the connector connected to the board and the entire circumference of the part installed inside the case are coated with waterproof adhesive, and a waterproof structure is provided between the connector and the case that houses the board, and the cover It is not done. Moreover, the structure which seals the ventilation component or connector part currently provided in the prior art is not provided so that the pressure difference in a control apparatus may not affect a harness etc. The substrate coating is masked at portions that need to be connected to heat transfer and ground, and is not coated with a waterproof adhesive. These parts have a structure in contact with a heat transfer boss, a ground, and a fixing boss provided on the case side.

以下、図面を参照して本発明の一実施例を説明する。   An embodiment of the present invention will be described below with reference to the drawings.

図1は本発明の実施例の構成を示す断面図である。図示されない機関を電気的に制御するために電子部品1,パターンにより構成された回路を有する基板2は、外部との電気的な接続をするためのコネクタ3と半田5とにより接続されている。また、コネクタ3及び基板2は、放熱用のフィン41を有するケース4にネジ6により固定されている。基板2を覆うようにケース4にカバー7がネジ6により固定されている。コネクタ3が設置される設置エリア31と基板2の全周が防水用接着剤8により防水,防塵のためにコーティングされている。   FIG. 1 is a sectional view showing the configuration of an embodiment of the present invention. A substrate 2 having a circuit composed of electronic components 1 and patterns for electrically controlling an engine (not shown) is connected by a connector 3 and solder 5 for electrical connection to the outside. The connector 3 and the board 2 are fixed to the case 4 having the heat radiation fins 41 by screws 6. A cover 7 is fixed to the case 4 with screws 6 so as to cover the substrate 2. The installation area 31 where the connector 3 is installed and the entire circumference of the substrate 2 are coated with a waterproofing adhesive 8 for waterproofing and dustproofing.

ケース4とカバー7との間には防水構造が設けられていない。このため接触面には微小な隙間が生じるので、制御装置の内外圧差防止用の換気フィルタ9やコネクタ3の防水部32が設けられていない(点線で図示)。このように構成されているため、コネクタ3と基板2がケース4,カバー7からネジ6を取り外すことで容易に分解が可能な構造となっている。   A waterproof structure is not provided between the case 4 and the cover 7. For this reason, since a minute gap is generated on the contact surface, the ventilation filter 9 for preventing the internal / external pressure difference of the control device and the waterproof portion 32 of the connector 3 are not provided (illustrated by dotted lines). Since the connector 3 and the substrate 2 are configured as described above, the structure can be easily disassembled by removing the screw 6 from the case 4 and the cover 7.

図2は本発明の別の実施例を示す断面図である。ケース4には、伝熱用ボス42と基板2とのアース,固定用ボス43が設けられている。基板2には、電子部品1の発熱をケース4に伝熱するための伝熱エリア21とケース4と基板2とのアースを確保するために固定エリア22が設けられており、この2つの伝熱エリア21と固定エリア22とが露出する形でコネクタ3の設置エリア31と基板2が防水用接着剤8によりコーティングされている。防水用接着剤8でのコーティング後にコネクタ3,基板2をケース4に組付ける際に露出した2つの伝熱エリア21と固定エリア22とがケース4と接触するように構成されている。   FIG. 2 is a cross-sectional view showing another embodiment of the present invention. The case 4 is provided with a grounding / fixing boss 43 between the heat transfer boss 42 and the substrate 2. The board 2 is provided with a heat transfer area 21 for transferring heat generated by the electronic component 1 to the case 4 and a fixed area 22 for securing the ground between the case 4 and the board 2. The installation area 31 of the connector 3 and the substrate 2 are coated with the waterproof adhesive 8 so that the heat area 21 and the fixed area 22 are exposed. The two heat transfer areas 21 and the fixed area 22 exposed when the connector 3 and the substrate 2 are assembled to the case 4 after coating with the waterproof adhesive 8 are configured to come into contact with the case 4.

図3は図2で露出している伝熱エリア21に予め伝熱用部品10が設置されていることを示す断面図である。基板2に設けられている伝熱エリア21に防水用接着剤8でコーティングされる前に予め伝熱用部品10が伝熱用接着剤11等により設置され、その後防水用接着剤8でコーティングするものである。   FIG. 3 is a cross-sectional view showing that the heat transfer component 10 is installed in advance in the heat transfer area 21 exposed in FIG. Before the heat transfer area 21 provided on the substrate 2 is coated with the waterproof adhesive 8, the heat transfer component 10 is installed in advance with the heat transfer adhesive 11 or the like, and then coated with the waterproof adhesive 8. Is.

図4は本発明の別の実施例を示す断面図である。コネクタ3には、基板2と接続するための基板接続用端子33が設置されている。防水用接着剤8の粘度を高くすることで基板接続用端子33の内側まで防水用接着剤8が含浸しない構造とすることで、コネクタ3に設けてある図示しないハーネス接続用端子34側への防水用接着剤8が浸透を防止できる構造となっている。   FIG. 4 is a cross-sectional view showing another embodiment of the present invention. The connector 3 is provided with a board connection terminal 33 for connecting to the board 2. By increasing the viscosity of the waterproof adhesive 8, the waterproof adhesive 8 is not impregnated to the inside of the board connecting terminal 33, so that the connector 3 is connected to the harness connecting terminal 34 (not shown). The waterproof adhesive 8 has a structure that can prevent penetration.

図5は本発明の別の実施例を示す断面図である。本発明の構造は、ケース4とカバー7の間に防水構造を設けていないため、外部からの水の浸入が想定される。基板2やコネクタ3は防水用接着剤8でコーティングされているため、浸入と同時に破損することはないが長期的に水が内部に存在した場合に防水用接着剤8やケース4,カバー7の劣化を促進する可能性があるため、この浸入した水が外部に抜けるように少なくとも2方向に水抜き穴44が設けられている。   FIG. 5 is a sectional view showing another embodiment of the present invention. Since the structure of the present invention does not provide a waterproof structure between the case 4 and the cover 7, it is assumed that water enters from the outside. Since the board 2 and the connector 3 are coated with the waterproof adhesive 8, the waterproof adhesive 8 and the case 4 and the cover 7 are not damaged at the time of intrusion. Since there is a possibility of accelerating the deterioration, drain holes 44 are provided in at least two directions so that the infiltrated water can escape to the outside.

本発明の実施例を示す断面図。Sectional drawing which shows the Example of this invention. 本発明の一部が露出している実施例を示す断面図。Sectional drawing which shows the Example which a part of this invention has exposed. 図2で示した別の実施例を示す断面図。Sectional drawing which shows another Example shown in FIG. 本発明のコネクタ端子部に含浸させずに構成する実施例を示す断面図。Sectional drawing which shows the Example comprised without making the connector terminal part of this invention impregnate. 本発明の水抜き穴を設置されていることを示す断面図。Sectional drawing which shows that the drain hole of this invention is installed.

符号の説明Explanation of symbols

1 電子部品
2 基板
3 コネクタ
4 ケース
5 半田
6 ネジ
7 カバー
8 防水用接着剤
9 換気フィルタ
10 伝熱用部品
11 伝熱用接着剤
21 伝熱エリア
22 固定エリア
31 設置エリア
32 コネクタ防水部
33 基板接続用端子
34 ハーネス接続用端子
41 フィン
42 伝熱用ボス
43 固定用ボス
44 水抜き穴
DESCRIPTION OF SYMBOLS 1 Electronic component 2 Board | substrate 3 Connector 4 Case 5 Solder 6 Screw 7 Cover 8 Waterproof adhesive 9 Ventilation filter 10 Heat transfer component 11 Heat transfer adhesive 21 Heat transfer area 22 Fixing area 31 Installation area 32 Connector waterproof part 33 Board Connection terminal 34 Harness connection terminal 41 Fin 42 Heat transfer boss 43 Fixing boss 44 Drain hole

Claims (4)

制御するための電子回路を電子部品及び基板上のパターンにより形成された基板とその基板と外部の機器とを接続するためのコネクタを有し、その基板が放熱用のフィンを備えアルミダイカストで成形されたケースの内面側に固定され、更に基板を覆うように形成されたカバーがケースにネジにより固定されることにより形成されており防水性を必要とする環境下に設置されることが前提の制御装置において、前記基板とコネクタの内設部が防水を目的とした防水用接着剤で基板、コネクタのみの状態で全周をコーティグされており、更にそれらを組み込む前記カバーとケース間に防水用部材が一切設置されておらず、制御装置の内圧を逃す目的の換気用部品、コネクタ部を密閉するためのシール構造も設置されていないことを特徴とする制御装置。An electronic circuit for control has a connector formed by a pattern formed on an electronic component and a substrate and a connector for connecting the substrate and an external device, and the substrate is provided with fins for heat dissipation and formed by aluminum die casting. It is assumed that the cover is fixed to the inner surface of the case, and is further fixed to the case with screws to cover the board, and is installed in an environment that requires waterproofness. in the control device, the substrate with waterproof adhesive inner portion of the substrate and the connector is intended for waterproofing, the entire circumference in a state of the connector only are Koti in g, further between the cover and the case incorporate them It is characterized in that no waterproof member is installed, no venting parts for the purpose of releasing the internal pressure of the control device, and no sealing structure for sealing the connector part is installed. Control device. 請求項1のように形成されたものにおいて、基板上に搭載された電子部品の発熱を伝導するためにケースと接する部位及び基板とケースを接触させアースを取る必要がある部位が露出するように防水用接着剤がコーティングされていることを特徴とする制御装置。   In order to conduct the heat generation of the electronic component mounted on the substrate, the portion that contacts the case and the portion that needs to be grounded by contacting the substrate and the case are exposed. A control device characterized by being coated with a waterproof adhesive. 請求項1のように形成されたものにおいて、コーティングされる防水用接着剤の粘度が前記コネクタ前記基板とを接続する接続用端子側から前記コネクタ内部へ含浸しない程度に高く前記コネクタと対向しない側の前記接続用端子表層のみをコーティングし、前記接続用端子表層と前記コネクタとの間に空洞を設けていることを特徴とする制御装置。 In those formed as claim 1, the viscosity of waterproof adhesives to be coated, high enough not impregnated into the connector inside the connection terminal side for connecting the said connector board, said connector A control device, wherein only the connection terminal surface layer on the non-opposing side is coated, and a cavity is provided between the connection terminal surface layer and the connector. 請求項1または3のように形成されたものにおいて、伝熱用部品を予め基板に設置し伝熱用部品が露出するように防水用接着剤がコーティングされていることを特徴とする制御装置。   4. The control device according to claim 1, wherein the heat transfer component is previously installed on the substrate and coated with a waterproof adhesive so that the heat transfer component is exposed.
JP2007261490A 2007-10-05 2007-10-05 Control device Active JP5174413B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007261490A JP5174413B2 (en) 2007-10-05 2007-10-05 Control device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007261490A JP5174413B2 (en) 2007-10-05 2007-10-05 Control device

Publications (2)

Publication Number Publication Date
JP2009094175A JP2009094175A (en) 2009-04-30
JP5174413B2 true JP5174413B2 (en) 2013-04-03

Family

ID=40665897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007261490A Active JP5174413B2 (en) 2007-10-05 2007-10-05 Control device

Country Status (1)

Country Link
JP (1) JP5174413B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103999343B (en) * 2012-01-13 2017-05-10 富士电机株式会社 Power conversion apparatus
JP5652453B2 (en) 2012-09-28 2015-01-14 株式会社村田製作所 Composite module and electronic device equipped with the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005032912A (en) * 2003-07-10 2005-02-03 Hitachi Industrial Equipment Systems Co Ltd Power conversion apparatus
JP2005093905A (en) * 2003-09-19 2005-04-07 Hitachi Ltd Electronic substrate unit
JP2007216823A (en) * 2006-02-16 2007-08-30 Hitachi Ltd Case storage structure of on-vehicle control device

Also Published As

Publication number Publication date
JP2009094175A (en) 2009-04-30

Similar Documents

Publication Publication Date Title
US11370372B2 (en) Electronic control device
JP4470980B2 (en) Electronic equipment
JP4272818B2 (en) Control device for vehicle
JP6023524B2 (en) Electronic control unit
JP4892527B2 (en) Electronic control device
JP5350311B2 (en) Automotive electronics
JP2019216131A (en) Water-proof electronic apparatus and manufacturing method for water-proof electronic apparatus
JP2009123558A (en) Electronic control device
JP2007305494A (en) Mounting structure of connector
JP2016096039A (en) Waterproof connector
JP6652038B2 (en) Electronic equipment
JP4291215B2 (en) Sealed enclosure of electronic equipment
JP5932553B2 (en) Connector and connector molding method
JP6584547B2 (en) Electronic control unit
JP6277061B2 (en) Electronic control unit
JP5174413B2 (en) Control device
JP2007109993A (en) Casing having built-in circuit board
JP6685252B2 (en) Electronic control unit
JP2016092046A (en) Housing for electric device and electric device
CN109479381B (en) Electronic control device and assembling method thereof
JP6463981B2 (en) Resin-sealed in-vehicle electronic control device
JP2015216061A (en) Electronic control device
JP2015003621A (en) Electronic control device
CN111372402A (en) Connector sealing structure
JP2019200837A (en) Fitting structure of connector assembly to frame

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20091224

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100224

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100224

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110802

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110930

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120403

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120531

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121204

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121228

R150 Certificate of patent or registration of utility model

Ref document number: 5174413

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350