JP5162037B2 - Electronic device manufacturing method and electronic component - Google Patents

Description

Embodiments of the present invention relates to a manufacturing method and an electronic component of the electronic device.

  In an electronic device such as a portable computer, a bottom electrode component such as a BGA is mounted on a printed wiring board. In order to prevent the lower surface electrode component from peeling off the printed wiring board, a reinforcing resin is filled between the lower surface electrode component and the printed wiring board.

  For example, a thermosetting resin is supplied along the lower surface electrode component mounted on the printed wiring board. The resin is softened and enters the gap between the lower electrode part and the printed wiring board by capillary action. The resin is thermally cured to reinforce the connection between the bottom electrode component and the printed wiring board.

  On the other hand, the resin may be applied to the lower surface electrode component in advance. When mounting such lower surface electrode components, solder bonding, resin filling, and resin thermosetting can be performed in the same process.

JP 2003-92465 A

  When the lower electrode part is heated for solder bonding or resin thermosetting, a gas such as water vapor is generated from the solder or resin. If the gas stays between the lower surface electrode component and the printed wiring board, bubbles are generated inside the thermoset resin. The bubbles may weaken the reinforcement of the connection between the bottom electrode component and the printed wiring board by the resin.

The objective of this invention is providing the manufacturing method of an electronic device and electronic component which can reinforce strongly the connection between an electronic component and a board | substrate with resin.

According to the method of manufacturing an electronic device according to one embodiment,
The electronic device includes a housing, a substrate housed in the housing, a plurality of pads provided on the surface of the substrate, a component body having a bottom surface facing the surface of the substrate, and the component body first terminal and a second terminal disposed on the inner side of the first terminal, the bottom surface than the second terminal while being disposed inside of said first terminals disposed in the bottom surface And an electronic component including a thermosetting resin including a flux that covers the second terminal and is heated to remove the oxide film. First, the resin is brought into contact with the surface of the substrate, the electronic component is placed on the surface of the substrate, the electronic component placed on the substrate is heated to soften the resin, and the softened While extruding the gas existing between the electronic component and the substrate by flowing resin, filling the resin between the electronic component and the substrate, further heating the electronic component, The plurality of terminals and the first and second pads are soldered together, and the resin filled between the electronic component and the substrate is cured.

1 is a perspective view showing a portable computer according to a first embodiment with a part cut away. FIG. Sectional drawing which shows the board | substrate and BGA of 1st Embodiment. Sectional drawing which shows BGA before mounting in 1st Embodiment. The top view which shows BGA of 1st Embodiment from the arrow F4 direction of FIG. Sectional drawing which shows schematically the state in which BGA of 1st Embodiment is mounted in a board | substrate. Sectional drawing which shows schematically the state in which resin of 1st Embodiment flows. Sectional drawing which shows schematically the state by which BGA of 1st Embodiment is pressed on a board | substrate. Sectional drawing which shows BGA before mounting which concerns on 2nd Embodiment. The top view which shows BGA of 2nd Embodiment from the arrow F9 direction of FIG. Sectional drawing which shows BGA before mounting which concerns on 3rd Embodiment. The top view which shows BGA of 3rd Embodiment from the arrow F11 direction of FIG. Sectional drawing which shows BGA before mounting which concerns on 4th Embodiment. The top view which shows BGA of 4th Embodiment from the arrow F13 direction of FIG. The top view which shows BGA before mounting which concerns on 5th Embodiment. Sectional drawing which shows BGA before mounting which concerns on 6th Embodiment. Sectional drawing which shows BGA before mounting which concerns on 7th Embodiment. The top view which shows BGA before mounting which concerns on 8th Embodiment. Sectional drawing which shows schematically the state by which BGA which concerns on 9th Embodiment is mounted in a board | substrate.

  A first embodiment will be described below with reference to FIGS. 1 to 7. In this specification, the user side is the front, the side far from the user is the rear, the left side when viewed from the user is the left direction, the right side when viewed from the user is the right direction, the upper side when viewed from the user is the upward direction, and the user is viewing The downward direction is defined as the downward direction.

  FIG. 1 is a perspective view showing the portable computer 1 with a part cut away. The portable computer 1 is an example of an electronic device. As shown in FIG. 1, the portable computer 1 includes a main unit 3 and a display unit 4.

  The main unit 3 includes a flat box-shaped housing 10. On the upper surface of the housing 10, a keyboard 12, a palm rest 13, a touch pad 14, and a pair of buttons 15 are provided.

  The display unit 4 is connected to the rear end of the main unit 3 via a pair of hinge portions 18. The pair of hinge portions 18 are respectively provided at the lower end of the display unit 4.

  The display unit 4 rotates between a closed position and an open position with the hinge portion 18 as a fulcrum. In the closed position, the display unit 4 lies on the main unit 3. In the open position, the display unit 4 stands from the rear end of the main unit 3.

  The display unit 4 includes a flat box-shaped display housing 21 and a display module 22. The display module 22 is a liquid crystal display, for example, and is accommodated in the display housing 21.

  A display opening 21 a is provided on the front surface of the display housing 21. The display opening 21 a exposes the screen 22 a of the display module 22 to the outside of the display unit 4.

  As shown in FIG. 1, the main unit 3 includes a substrate 25, a BGA 26, and a plurality of electronic components 27. The substrate 25 is a printed wiring board, for example, and is accommodated in the housing 10. The BGA 26 is an example of an electronic component. The BGA 26 and the plurality of electronic components 27 are mounted on the substrate 25.

  FIG. 2 is an enlarged cross-sectional view showing the substrate 25 and the BGA 26. As shown in FIG. 2, a plurality of pads 32 are provided on the surface 25 a of the substrate 25. The plurality of pads 32 are arranged in a matrix, for example.

  The BGA 26 has a component main body 35, a plurality of terminals 36, and a resin 37. The component main body 35 is, for example, an LSI housed in a rectangular case. The component main body 35 is not limited to this, and may be an exposed LSI or other components. The bottom surface 35 a of the component main body 35 faces the surface 25 a of the substrate 25. A joining height H1 between the substrate 25 and the component main body 35 is, for example, 0.080 mm ± 0.01 mm.

  The terminal 36 is, for example, a solder ball. The terminal 36 is not limited to this, and may be, for example, a pin-shaped lead wire or a terminal having another shape. The plurality of terminals 36 are arranged in a matrix on the bottom surface 35 a of the component body 35 corresponding to the plurality of pads 32. A terminal 36 is soldered to the pad 32. Thereby, the BGA 26 is mounted on the substrate 25.

  The resin 37 is, for example, a thermosetting epoxy resin to which a flux is added. The resin 37 may be an acrylic resin. The flux is, for example, an organic acid, but is not limited to this, and may be another substance such as halogen. The resin 37 has a function of removing the oxide film when heated by adding flux.

  The resin 37 is filled between the component main body 35 and the substrate 25. The resin 37 is hardened, and the BGA 26 is firmly fixed to the substrate 25 to reinforce the solder joint between the BGA 26 and the substrate 25.

  Hereinafter, an example of a method for manufacturing the portable computer 1 will be described. FIG. 3 is a cross-sectional view showing the BGA 26 before mounting. 4 is a plan view showing the BGA 26 before mounting from the direction of arrow F4 in FIG.

  As shown in FIG. 3, the resin 37 is applied to the bottom surface 35 a of the component body 35 in a rectangular shape by, for example, silk screen printing before the BGA 26 is mounted. The resin 37 before mounting is soft because it is before thermosetting.

  The thickness H2 of the resin 37 before mounting is larger than the bonding height H1 shown in FIG. 2, for example, 0.154 mm. As shown in FIG. 4, the length L1 of the resin 37 before mounting is 20 mm, for example, and the width W1 is 16 mm, for example. On the other hand, the length L2 of the component main body 35 is larger than the length L1 of the resin 37, for example, 26 mm ± 0.03 mm. The width W2 of the component main body 35 is larger than the width W1 of the resin 37, for example, 21 mm ± 0.03 mm. That is, the volume between the component main body 35 and the substrate 25 when the tolerance is the maximum and the volume of the resin 37 before mounting are substantially the same.

  The plurality of terminals 36 constitute a pair of first terminal portions 41 and a pair of second terminal portions 42. The first terminal portion 41 is constituted by a number of terminals 36 arranged along the outer periphery 35 b of the component main body 35. The second terminal portions 42 are respectively configured by extra terminals 36 located inside the component main body 35 with respect to the first terminal portions 41.

  As shown in FIG. 4, the second terminal portion 42 is covered with a resin 37. On the other hand, the first terminal portion 41 before mounting is exposed without being covered with the resin 37. A part of the second terminal portion 42 may be exposed.

  FIG. 5 is a cross-sectional view schematically showing a state in which the BGA 26 is placed on the substrate 25. First, as shown in FIG. 5, the BGA 26 before mounting described above is held by the mounting device 45 and moves onto the substrate 25. The mounting device 45 is a machine tool that moves and mounts the BGA 26. The mounting device 45 places the BGA 26 on the surface 25 a of the substrate 25 with the plurality of terminals 36 corresponding to the plurality of pads 32.

  Next, the mounting device 45 presses the BGA 26 toward the substrate 25 as indicated by an arrow in FIG. The resin 37 softens when heated to, for example, 150 ° C. and has fluidity. For this reason, the resin 37 flows depending on the pressure received from the mounting device 45 and the weight of the component main body 35.

  FIG. 6 is a cross-sectional view schematically showing a state in which the resin 37 flows by pressure. As shown in FIG. 6, the resin 37 spreads outward from the position A where the resin 37 is applied before mounting as indicated by a two-dot chain line, as indicated by an arrow. When the resin 37 contacts the terminal 36 included in the first terminal portion 41, the resin 37 flows to cover the terminal 36.

  When the resin 37 spreads, gas is generated from the heated resin 37. Further, since a redox reaction occurs at the terminal 36 due to the flux added to the resin 37, water vapor is generated from the terminal 36 and the pad 32 in contact with the resin 37. Water vapor is an example of a gas. In addition, water vapor is generated from the heated substrate 25. These gases exist between the substrate 25 and the BGA 26.

  Since the resin 37 spreads outward, the gas generated from the resin 37 and the water vapor generated from the substrate 25 are pushed out from the gap between the BGA 26 and the substrate 25. Further, since the resin 37 flows along the terminal 36, the water vapor generated from the terminal 36 and the pad 32 is pushed out from the gap between the BGA 26 and the substrate 25.

  FIG. 7 is a cross-sectional view schematically showing a state in which the BGA 26 is pressed against the substrate 25. As shown in FIG. 7, the mounting device 45 presses the BGA 26 until the plurality of terminals 36 come into contact with the plurality of pads 32. The resin 37 interposed between the terminal 36 and the pad 32 flows, and the terminal 36 comes into contact with the corresponding pad 32.

  When the terminal 36 contacts the pad 32, the resin 37 reaches the outer periphery 35 b of the component main body 35. That is, the resin 37 is filled between the BGA 26 and the substrate 25. The resin 37 stays between the BGA 26 and the substrate 25 by surface tension, for example, and does not overflow outside.

  With the terminal 36 in contact with the pad 32, the mounting device 45 further heats the BGA 26. For example, when the resin 37 is heated to 200 ° C., the resin 37 starts thermosetting. Furthermore, the terminal 36 which is a solder ball is melted, so that the terminal 36 is soldered to the pad 32.

  When the terminal 36 is soldered, the mounting device 45 is detached from the BGA 26. Since the pressure is released from the pressure by the mounting device 45, the resin 37 protruding from the gap between the BGA 26 and the substrate 25 returns between the BGA 26 and the substrate 25. As described above, the BGA 26 is mounted on the substrate 25 as shown in FIG.

  According to the portable computer 1 and the manufacturing method thereof having the above-described configuration, when the BGA 26 is mounted, a gas such as water vapor is pushed out from the gap between the BGA 26 and the substrate 25 by the resin 37 flowing. Thereby, generation | occurrence | production of a bubble can be suppressed inside the resin 37 hardened | cured.

  The first terminal portion 41 disposed near the outer periphery 35 b of the component body 35 is more susceptible to a load than the second terminal portion 42. Since water vapor generated from the terminal 36 included in the first terminal portion 41 is pushed out by the flowing resin 37, it is possible to suppress the generation of bubbles in contact with the terminal 36 of the first terminal portion 41. Thereby, the connection between the terminal 36 of the BGA 26 and the pad 32 of the substrate 25 is strongly reinforced, and the bonding reliability of the BGA 26 is improved.

  When the BGA 26 is mounted, the resin 37 stays in the gap between the BGA 26 and the substrate 25 and does not overflow outside. Thereby, it is possible to prevent bubbles from being generated inside the resin 37 due to the resin 37 overflowing outside entraining air.

  Further, the solder bonding of the BGA 26 and the filling of the resin 37 are performed in the same process. As a result, the number of steps for mounting the BGA 26 can be reduced, and the manufacturing cost of the portable computer 1 can be reduced.

  Next, a second embodiment will be described with reference to FIGS. At this time, components having the same functions as those of the portable computer 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 8 is a cross-sectional view showing the BGA 26 before mounting in the second embodiment. FIG. 9 is a plan view showing the BGA 26 before mounting from the direction of arrow F9 in FIG. As shown in FIG. 8, in the BGA 26, the resin 37 before mounting is arranged inside the component main body 35 with respect to the second terminal portion 42. For this reason, all the terminals 36 are exposed without being covered with the resin 37. Similar to the first embodiment, the volume of the resin 37 before mounting is substantially the same as the volume between the component main body 35 and the substrate 25 when the tolerance is maximum.

  When mounting the BGA 26 having the above-described configuration, the mounting device 45 presses the BGA 26 while heating it toward the substrate 25 as in the first embodiment. The resin 37 spreads outward from the position where the resin 37 was applied before mounting.

  When the resin 37 comes into contact with the terminal 36 included in the second terminal portion 42, the resin 37 flows so as to cover the terminal 36. At this time, the resin 37 flows along the terminal 36 of the second terminal portion 42, and pushes water vapor generated from the terminal 36 and the pad 32 out from the gap between the BGA 26 and the substrate 25. The resin 37 covers the second terminal portion 42 and then contacts the terminal 36 of the first terminal portion 41.

  According to the portable computer 1 and the manufacturing method thereof having the above-described configuration, the resin 37 pushes out the gas generated from all the terminals 36 through the gap between the BGA 26 and the substrate 25. Thereby, generation | occurrence | production of a bubble is suppressed and the joining reliability of BGA26 improves further.

  Next, a third embodiment will be described with reference to FIG. 10 and FIG. At this time, components having the same functions as those of the portable computer 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 10 is a cross-sectional view showing the BGA 26 before mounting in the third embodiment. FIG. 11 is a plan view showing the BGA 26 before mounting from the direction of arrow F11 in FIG. As shown in FIG. 10, the resin 37 before mounting is divided into a first portion 51, a second portion 52, and a third portion 53 and is applied to the bottom surface 35 a of the component main body 35. The plurality of terminals 36 of the BGA 26 are arranged in two rows.

  The first portion 51 is disposed between the plurality of terminals 36 and one end 35 c of the component main body 35. The second portion 52 is disposed inside the plurality of terminals 36 arranged in two rows. The third portion 53 is disposed between the plurality of terminals 36 and the other end 35 d of the component main body 35.

  As shown in FIG. 11, a pair of grooves 55 is formed between the first portion 51 and the second portion 52 and between the second portion 52 and the third portion 53. The pair of grooves 55 is an example of a space opened toward the outer periphery of the electronic component, and each opens toward the outer periphery of the BGA 26. The plurality of terminals 36 are located in the groove 55 and are exposed without being covered with the resin 37.

  When mounting the BGA 26 having the above-described configuration, the mounting device 45 presses the BGA 26 while heating it toward the substrate 25 as in the first embodiment. The first to third portions 51 to 53 spread outward and flow into the groove 55 as indicated by an arrow B in FIG.

  As the flowing first to third parts 51 to 53 flow into the groove 55, the air in the groove 55 and the water vapor generated from the terminal 36 and the pad 32 are grooved as shown by an arrow C in FIG. It is pushed out from 55. The first to third portions 51 to 53 flowing into the groove 55 are joined to each other, so that the resin 37 is filled between the BGA 26 and the substrate 25.

  According to the portable computer 1 configured as described above and the manufacturing method thereof, the first to third portions 51 to 53 push the air and gas in the groove 55 out of the groove 55. Thereby, generation | occurrence | production of a bubble is suppressed and the joining reliability of BGA26 improves.

  Next, a fourth embodiment will be described with reference to FIGS. At this time, components having the same functions as those of the portable computer 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 12 is a cross-sectional view showing the BGA 26 before mounting in the fourth embodiment. FIG. 13 is a plan view showing the BGA 26 before mounting from the direction of arrow F13 in FIG. As shown in FIG. 13, the resin 37 before mounting is divided into a first part 61, a second part 62, a third part 63, and a fourth part 64, and the bottom surface of the component body 35. 35a is applied. The first to fourth portions 61 to 64 are arranged inside the outer periphery 35b of the component main body 35, respectively. The plurality of terminals 36 are covered with first to fourth portions 61 to 64, respectively.

  A cross-shaped groove 66 is formed between the first to fourth portions 61 to 64. The groove 66 is between the first portion 61 and the second portion 62, between the second portion 62 and the third portion 63, between the third portion 63 and the fourth portion 64, and The fourth portion 64 and the first portion 61 are separated from each other. The groove 66 is an example of a space that opens toward the outer periphery of the electronic component, and opens toward the outer periphery of the BGA 26.

  When mounting the BGA 26 having the above-described configuration, the mounting device 45 presses the BGA 26 while heating it toward the substrate 25 as in the first embodiment. The first to fourth portions 61 to 64 expand outward and flow into the groove 66 as indicated by an arrow D in FIG.

  When the flowing first to fourth portions 61 to 64 flow into the groove 66, the air in the groove 66 is pushed out of the groove 66 as indicated by an arrow E in FIG. The first to fourth portions 61 to 64 flowing into the groove 66 are joined to each other, so that the resin 37 is filled between the BGA 26 and the substrate 25.

  According to the portable computer 1 configured as described above and the manufacturing method thereof, the first to fourth portions 61 to 64 push the air in the groove 66 out of the groove 66. Thereby, generation | occurrence | production of a bubble is suppressed and the joining reliability of BGA26 improves.

  Next, a fifth embodiment will be described with reference to FIG. At this time, components having the same functions as those of the portable computer 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 14 is a plan view showing the BGA 26 before mounting in the fifth embodiment. As shown in FIG. 14, the resin 37 is formed in an X shape and is applied to the component main body 35. In other words, the resin 37 is formed in a shape different from the rectangular component main body 35. The resin 37 is disposed inside the outer periphery 35b of the component body 35.

  The resin 37 has a central portion 68 and four extending portions 69 that respectively extend from the central portion 68. The center portion 68 is disposed substantially at the center of the bottom surface 35 a of the component main body 35. The extending portion 69 covers a part of the plurality of terminals 36.

  Four spaces 70 are formed between the four extending portions 69. The space 70 is an example of a space that opens toward the outer periphery of the electronic component, and opens toward the outer periphery of the BGA 26.

  When mounting the BGA 26 having the above-described configuration, the mounting device 45 presses the BGA 26 while heating it toward the substrate 25 as in the first embodiment. The four extending portions 69 spread outward and flow in directions toward each other as indicated by arrows in FIG. For this reason, the air which exists in the space 70 is pushed out.

  According to the portable computer 1 configured as described above and the manufacturing method thereof, the four extending portions 69 push out the air existing between the extending portions 69 to the outside. Thereby, generation | occurrence | production of a bubble is suppressed and the joining reliability of BGA26 improves.

  Further, since the resin 37 is formed in a shape different from that of the component main body 35, it is easy to adjust the angle when the BGA 26 is placed on the substrate 25 and the flow amount of the resin 37. Thereby, the resin 37 can be uniformly filled in the gap between the substrate 25 and the BGA 26.

  Next, a sixth embodiment will be described with reference to FIG. At this time, components having the same functions as those of the portable computer 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 15 is a cross-sectional view showing the BGA 26 before mounting in the sixth embodiment. As shown in FIG. 15, the resin 37 has a first layer 71 and a second layer 72. The first layer 71 is applied to the bottom surface 35 a of the component body 35. The second layer 72 is laminated on the first layer 71 and contacts the substrate 25 and the pad 32 when the BGA 26 is mounted.

  The first layer 71 is formed of a resin having a filler dispersion amount greater than that of the second layer 72 and a flux activation force being weaker than that of the second layer 72. That is, the second layer 72 is formed of a resin having a filler dispersion amount smaller than that of the first layer 71 and a flux activation force stronger than that of the second layer 72. The flux activation force is adjusted by, for example, the type of resin and the amount of flux.

  According to the portable computer 1 configured as described above and the method for manufacturing the same, the second layer 72 in contact with the substrate 25 and the pad 32 is formed of a resin with a small filler dispersion amount. Thereby, the bonding between the BGA 26 and the substrate 25 becomes good. Furthermore, the second layer 72 is formed of a resin having a high flux activity. Thereby, the electrical connection between the terminal 36 and the pad 32 is improved.

  Next, a seventh embodiment will be described with reference to FIG. At this time, components having the same functions as those of the portable computer 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 16 is a cross-sectional view showing the BGA 26 before mounting in the seventh embodiment. As shown in FIG. 16, the thickness H2 of the resin 37 before mounting is 0.09 mm, for example. On the other hand, the distance H3 from the bottom surface 35a of the component body 35 to the tip of the terminal 36 before mounting is longer than the thickness H2 of the resin 37, for example, 0.10 mm. For this reason, the front ends of the plurality of terminals 36 protrude from the resin 37.

  When mounting the BGA 26 having the above-described configuration, the mounting device 45 mounts the BGA 26 on the surface 25a of the substrate 25 as in the first embodiment. Since the length H3 of the terminal 36 is longer than the thickness H2 of the resin 37, the terminal 36 contacts the pad 32 before the resin 37. With the terminal 36 in contact with the pad 32, the mounting device 45 presses the BGA 26 while heating it toward the substrate 25. The resin 37 softened by heating adheres to the surface of the substrate 25 while pushing out the air between the resin 37 and the substrate 25 and spreads outward.

  Further, the terminal 36 which is a solder ball is melted, so that the joining height between the substrate 25 and the component main body 35 is shortened. The joint height between the substrate 25 and the component main body 35 is, for example, 0.08 mm, which is shorter than the thickness H2 of the resin 37 before mounting. For this reason, as shown in FIG. 2, the resin 37 is filled between the BGA 26 and the substrate 25.

  According to the portable computer 1 configured as described above and the method for manufacturing the same, the terminal 36 contacts the pad 32 before the resin 37. As a result, it is possible to prevent the resin from remaining between the terminal 36 and the pad 32 and insufficient solder bonding between the terminal 36 and the pad 32.

  Next, an eighth embodiment will be described with reference to FIG. At this time, components having the same functions as those of the portable computer 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 17 is a plan view showing the BGA 26 before mounting in the eighth embodiment. As shown in FIG. 17, the BGA 26 has four terminals 36 </ b> A that are closest to the four corners 35 e of the component main body 35, and a plurality of other terminals 36 </ b> B. The four terminals 36 </ b> A are exposed without being covered with the resin 37. The plurality of other terminals 36 </ b> B are covered with a resin 37.

  When mounting the BGA 26 having the above-described configuration, the mounting device 45 moves the BGA 26 onto the substrate 25. The mounting device 45 aligns the BGA 26 by detecting the four terminals 36A exposed by a camera (not shown). In other words, the exposed four terminals 36 </ b> A function as marks for the mounting device 45 to recognize the position of the BGA 26.

  The BGA 26 moved by the mounting device 45 is placed on the surface 25a of the substrate 25 and pressed against the substrate 25 while being heated. The resin 37 softened by heating spreads outward and flows so as to cover the four terminals 36A.

  According to the portable computer 1 configured as described above and the method for manufacturing the same, the four terminals 36 </ b> A close to the corner 35 e of the component main body 35 function as recognition marks for positioning the BGA 26. Thereby, the step of providing a separate recognition mark on the BGA 26 can be omitted, and the productivity of the portable computer 1 is improved.

  Next, a ninth embodiment will be described with reference to FIG. At this time, components having the same functions as those of the portable computer 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 18 is a cross-sectional view schematically showing a state in which the BGA 26 in the ninth embodiment is placed on the substrate 25. As shown in FIG. 18, the resin 37 of the ninth embodiment is applied to the surface 25 a of the substrate 25 instead of the component main body 35.

  The plurality of pads 32 constitute a pair of first pad portions 75 corresponding to the pair of first terminal portions 41 and a pair of second pad portions 76 corresponding to the pair of second terminal portions 42. . The resin 37 is disposed on the inner side than the pair of second pad portions 76.

  When mounting the BGA 26 having the above-described configuration, the mounting device 45 presses the BGA 26 while heating it toward the substrate 25 as in the first embodiment. The resin 37 is softened by being heated by the mounting device 45 via the BGA 26. The softened resin 37 spreads outward as in the first embodiment. As described above, even when the resin 37 is applied to the surface 25a of the substrate 25, the same effect as in the first embodiment can be obtained.

  Next, a tenth embodiment will be described with reference to FIG. At this time, components having the same functions as those of the portable computer 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the tenth embodiment, for example, silver powder is mixed in the resin 37. Silver powder is an example of a conductive powder. The conductor powder is not limited to silver powder, but may be other metal powder such as copper powder or other conductive powder. The silver powder is mixed in the resin 37 by adjusting the amount so that the adjacent terminals 36 are not short-circuited.

  When mounting the BGA 26 having the above-described configuration, the mounting device 45 presses the BGA 26 while heating it toward the substrate 25 as in the first embodiment. If the resin 37 remains between the terminal 36 and the pad 32 even when the BGA 26 is pressed, the terminal 36 and the pad 32 are electrically connected by the silver powder mixed in the resin 37.

  According to the portable computer 1 and the method for manufacturing the same, the terminal 36 can be electrically connected to the pad 32 even if the resin 37 remains between the terminal 36 and the pad 32. Thereby, the BGA 26 can be reliably mounted on the substrate 25.

  In the above embodiment, the BGA 26 is used as an example of the electronic component, but the present invention is not limited to this. Various electronic components such as PGA, CSP, QFN, LGA, and flip chip may be used.

  Furthermore, the thermosetting resin that removes the oxide film by being heated is not limited to the resin to which the flux is added. For example, a resin that removes the oxide film by reducing oxygen from the oxide film on the metal surface by an intermediate product generated during thermosetting may be used.

Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.
The contents of the claims at the beginning of the application of the original application of the present application will be added below.
(1) a housing;
A substrate housed in the housing;
A plurality of pads provided on the surface of the substrate;
A component main body having a bottom surface facing the surface of the substrate, a plurality of terminals disposed on the bottom surface of the component main body, and heat that is disposed on the bottom surface of the component main body and removes the oxide film by heating. A curable resin, and an electronic component mounted on the substrate;
A method of manufacturing an electronic device comprising:
Placing the electronic component on the surface of the substrate;
Heating the electronic component placed on the substrate to soften the resin,
Flowing the softened resin to push out the gas existing between the electronic component and the substrate, and filling the resin between the electronic component and the substrate,
A method of manufacturing an electronic device, wherein the plurality of terminals and the plurality of pads are solder-bonded by further heating the electronic component, and the resin filled between the electronic component and the substrate is cured.
(2) Some of the terminals along the outer periphery of the component body constitute a first terminal portion,
The surplus terminal located inside the component body from the first terminal portion constitutes a second terminal portion,
The said resin before softening is a manufacturing method of the electronic device as described in (1) which covered the said 2nd terminal part while exposing the said 1st terminal part.
(3) The method for manufacturing an electronic device according to (1), wherein the resin before being softened is disposed inside the component main body from the plurality of terminals.
(4) The method for manufacturing an electronic device according to (1), wherein the resin before the electronic component is placed forms a space opened toward an outer periphery of the electronic component.
(5) a first layer in which the resin before softening is applied to the bottom surface of the component main body, and a second layer that is laminated on the first layer and has a smaller filler dispersion than the first layer. The method for manufacturing an electronic device according to (1).
(6) The method for manufacturing an electronic device according to (1), wherein a tip portion of the terminal protrudes from the resin before being softened.
(7) The terminal closest to the corner of the component body before the resin is softened is exposed,
The electronic device manufacturing method according to (1), wherein the electronic component is positioned by detecting the exposed terminal when the electronic component is placed on the substrate.
(8) The method for manufacturing an electronic device according to (1), wherein a conductive powder is mixed into the resin.
(9) a component body having a bottom surface;
A plurality of terminals arranged on the bottom surface of the component body;
A thermosetting resin that is disposed on the bottom surface of the component body and removes an oxide film by being heated,
An electronic component comprising
(10) Some of the terminals along the outer periphery of the component main body constitute a first terminal portion,
The surplus terminal located inside the component body from the first terminal portion constitutes a second terminal portion,
The electronic component according to (9), wherein the resin exposes the first terminal portion and covers the second terminal portion.
(11) The resin is disposed inside the component body with respect to the plurality of terminals,
The electronic component according to (9), wherein the plurality of terminals are exposed.
(12) The electronic component according to (9), wherein the resin forms a space opened toward an outer periphery of the electronic component.
(13) The resin has a first layer applied to the bottom surface of the component main body, and a second layer laminated on the first layer and having a smaller filler dispersion amount than the first layer (9 ) Electronic components.
(14) The electronic component according to (9), wherein a tip portion of the terminal protrudes from the resin.
(15) The electronic component according to (9), wherein a conductive powder is mixed in the resin.
(16) a housing;
A substrate housed in the housing;
A pad provided on the surface of the substrate;
A component body having a bottom surface facing the surface of the substrate;
A terminal disposed on the bottom surface of the component body and electrically connected to the pad;
A thermosetting resin having a function of removing an oxide film by being filled between the substrate and the component main body and being heated;
An electronic device comprising
The contents of the claims immediately before the division of the original application of the present application will be added below.
[1] a housing;
A substrate housed in the housing;
A plurality of pads provided on the surface of the substrate;
A component main body having a bottom surface facing the surface of the substrate, a terminal disposed on the bottom surface of the component main body, and disposed on the bottom surface of the component main body so as to cover the terminal and heated to form an oxide film. A thermosetting resin containing a flux to be removed, and an electronic component mounted on the substrate;
A method of manufacturing an electronic device comprising:
Placing the electronic component on the surface of the substrate;
Heating the electronic component placed on the substrate to soften the resin,
Flowing the softened resin to push out the gas existing between the electronic component and the substrate, and filling the resin between the electronic component and the substrate,
A method of manufacturing an electronic device, wherein the plurality of terminals and the plurality of pads are solder-bonded by further heating the electronic component, and the resin filled between the electronic component and the substrate is cured.
[2] Some of the terminals along the outer periphery of the component body constitute a first terminal portion,
The surplus terminal located inside the component body from the first terminal portion constitutes a second terminal portion,
The resin before softening is the method for manufacturing an electronic device according to [1], in which the first terminal portion is exposed and the second terminal portion is covered.
[3] The method of manufacturing an electronic device according to [1], wherein the resin before being softened is disposed inside the component main body from the plurality of terminals.
[4] The method for manufacturing an electronic device according to [1], wherein the resin before the electronic component is placed forms a space that opens toward an outer periphery of the electronic component.
[5] The first layer of the resin before being softened is applied to the bottom surface of the component body, and the second layer is laminated on the first layer and has a smaller filler dispersion amount than the first layer. The method for manufacturing an electronic device according to [1].
[6] The method for manufacturing an electronic device according to [1], wherein a tip portion of the terminal protrudes from the resin before being softened.
[7] The terminal closest to the corner of the component body before the resin is softened is exposed,
The method of manufacturing an electronic device according to [1], wherein the electronic component is positioned by detecting the exposed terminal when the electronic component is placed on the substrate.
[8] The method for manufacturing an electronic device according to [1], wherein a conductive powder is mixed into the resin.
[9] a component body having a bottom surface;
Terminals arranged on the bottom surface of the component body;
A thermosetting resin that covers the terminal and is disposed on the bottom surface of the component main body and contains a flux;
An electronic component comprising
[10] Some of the terminals along the outer periphery of the component body constitute a first terminal portion,
The surplus terminal located inside the component body from the first terminal portion constitutes a second terminal portion,
The electronic component according to [9], wherein the resin exposes the first terminal portion and covers the second terminal portion.
[11] The resin is disposed inside the component body with respect to the plurality of terminals,
The electronic component according to [9], wherein the plurality of terminals are exposed.
[12] The electronic component according to [9], wherein the resin forms a space opened toward an outer periphery of the electronic component.
[13] The resin has a first layer applied to the bottom surface of the component main body, and a second layer laminated on the first layer and having a smaller filler dispersion amount than the first layer. [9 ] Is an electronic component.
[14] The electronic component according to [9], wherein a tip end portion of the terminal protrudes from the resin.
[15] The electronic component according to [9], wherein a conductive powder is mixed in the resin.
[16] a housing;
A substrate housed in the housing;
A pad provided on the surface of the substrate;
A component body having a bottom surface facing the surface of the substrate;
A terminal disposed on the bottom surface of the component body and electrically connected to the pad;
Covering the terminals, filled between the substrate and the component main body, a thermosetting resin containing flux,
An electronic device comprising

  DESCRIPTION OF SYMBOLS 1 ... Portable computer, 10 ... Housing | casing, 25 ... Board | substrate, 25a ... Front surface, 26 ... BGA, 32 ... Pad, 35 ... Component main body, 35a ... Bottom surface, 35b ... Outer periphery, 35e ... Corner | angular part, 36, 36A, 36B ... Terminal 37, resin 41, first terminal portion 42, second terminal portion 51, 61, first portion 52, 62, second portion 53, 63, third portion 55 , 66 ... groove, 64 ... fourth portion, 70 ... space, 71 ... first layer, 72 ... second layer.

Claims (9)

A housing,
A substrate housed in the housing;
A plurality of pads provided on the surface of the substrate;
A component body having a bottom surface facing the surface of the substrate; a first terminal disposed on the bottom surface of the component body; a second terminal disposed on the inner side of the first terminal; A thermosetting resin that includes a flux that is disposed inside the terminal and protrudes from the bottom surface than the second terminal to cover the second terminal and removes the oxide film by being heated, And an electronic component mounted on the substrate,
A method of manufacturing an electronic device comprising:
Placing the electronic component on the surface of the substrate by bringing the resin into contact with the surface of the substrate;
Heating the electronic component placed on the substrate to soften the resin,
Flowing the softened resin to push out the gas existing between the electronic component and the substrate, and filling the resin between the electronic component and the substrate,
An electronic device that further heats the electronic component to solder the first and second terminals and the plurality of pads and to cure the resin filled between the electronic component and the substrate. Manufacturing method.   The method for manufacturing an electronic device according to claim 1, wherein the resin before the electronic component is placed forms a space opened toward an outer periphery of the electronic component.   The resin before being softened has a first layer applied to a bottom surface of the component main body, and a second layer laminated on the first layer and having a smaller filler dispersion amount than the first layer. Item 12. A method for manufacturing an electronic device according to Item 1.   The method of manufacturing an electronic device according to claim 1, wherein the electronic component is positioned by detecting the first terminal when the electronic component is placed on the substrate.   The manufacturing method of the electronic device of Claim 1 with which the powder of the conductor was mixed in the said resin. A component body having a bottom surface;
Terminals arranged on the bottom surface of the component body;
Covering the terminal protruding from the bottom than the terminal, a thermosetting resin containing flux, and
On the bottom surface of the component body, the other terminals arranged outside the terminals and the resin,
An electronic component comprising   The electronic component according to claim 6, wherein the resin forms a space opened toward an outer periphery of the electronic component.   The said resin has the 1st layer apply | coated to the bottom face of the said component main body, and the 2nd layer laminated | stacked on the said 1st layer and less filler dispersion amount than the said 1st layer. Electronic components.   The electronic component according to claim 6, wherein a conductive powder is mixed in the resin.

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