JP5157016B2 - 共振する障壁層を伴う超紫外線フォトリソグラフィー - Google Patents
共振する障壁層を伴う超紫外線フォトリソグラフィー Download PDFInfo
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- JP5157016B2 JP5157016B2 JP2009503558A JP2009503558A JP5157016B2 JP 5157016 B2 JP5157016 B2 JP 5157016B2 JP 2009503558 A JP2009503558 A JP 2009503558A JP 2009503558 A JP2009503558 A JP 2009503558A JP 5157016 B2 JP5157016 B2 JP 5157016B2
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- 230000004888 barrier function Effects 0.000 title claims description 60
- 238000000206 photolithography Methods 0.000 title description 10
- 238000002310 reflectometry Methods 0.000 claims description 40
- 238000005530 etching Methods 0.000 claims description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- 230000002238 attenuated effect Effects 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052735 hafnium Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 178
- 230000010363 phase shift Effects 0.000 description 24
- 230000003287 optical effect Effects 0.000 description 16
- 238000010521 absorption reaction Methods 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000004364 calculation method Methods 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000002829 reductive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000012780 transparent material Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 230000001066 destructive effect Effects 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 238000009776 industrial production Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004166 TaN Inorganic materials 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000000233 ultraviolet lithography Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optical Elements Other Than Lenses (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
d=(2m+1)λ/4ncosθ
ここで、mは整数、λは波長、そしてθは光の入射角である。
d=2mλ/4ncosθ
−空の或いは空気で満たされた空胴(率1、減衰0)を伴う、実線で示される一つと、
−伝搬率n=0.876、k=0.025を有すると推定される、少しだけ吸収する材料で満たされていると見なされる空胴を伴う、点線で示されるもう一つである。
AR1=[R1+(R1 2+T1).R2exp(jΦ)]/[1+R1R2.exp(jΦ)]
ここで、Φ=(2π/λ)2nA.d.cosθである。
rj=[rj,j−1+rj−1exp2iΦi]/[1+rj,j−1rj−1exp2iΦj]
tj=[tj,j−1tj−1exp2iΦi]/[1+rj,j−1rj−1exp2iΦj]
−下部ミラーの構成、層の対の数、対の厚さ、層及びそれらの厚さ比率の選定と、
−上部ミラーに対する同上の項目と、
−180°の位相差を得るためにエッチングされるべき層の対の数と、
−障壁層(特にその指数nA)の材料と、
−この障壁層の厚さdAとである。
Claims (6)
- 第1の反射域(Z1)と第2の反射域(Z2)から作られるエッチングされたパターンを含む、反射において作用し、そして減衰した位相型の超紫外線フォトリソグラフィー・マスクであって、前記第1の領域は前記第2の領域により反射される光の位相と反対の位相を有する光を反射し、前記マスクは多層の下部反射構造(22)で均一にコーティングされた基板(20)と、第1の領域における前記下部反射構造の上部に、エッチング障壁層(23)及び部分的に反射する上部の多層構造(24)の積み重ねとを備え、前記エッチング障壁層は前記上部の反射構造の層に対してエッチング選択度特性を有するマスクにおいて、
前記第2の反射域が、前記エッチング障壁層だけでコーティングされた前記下部の多層構造を含むこと、そしてエッチング障壁層の厚さ(d)が、前記第1の反射域と前記第2の反射域とで同じであり、かつ一方で前記下部の多層構造(22)、前記エッチング障壁層(23)、及び前記第1の領域(Z1)において部分的に反射する前記上部構造(24)の重なりが、波長に応じて変化する反射率及び前記マスクの使用波長における高い反射率を有するファブリ・ペローの共振空胴を構成し、他方で前記第1の反射域と第2の反射域との間の位相差が約180°であり、そして最後に前記第2の領域の反射係数が前記第1の領域よりも大幅に低いように選定されることを特徴とする、マスク。 - 前記第1の領域の反射率が60%よりも大きく、前記第2の領域と前記第1の領域との間の反射率の比がおよそ6〜10%であることを特徴とする、請求項1に記載のマスク。
- 前記エッチング障壁層がクロムで作られることを特徴とする、請求項1又は2に記載のマスク。
- 前記エッチング障壁層が酸化ケイ素で作られることを特徴とする、請求項1又は2に記載のマスク。
- 前記エッチング障壁層が次の材料:Ru、ZrO2、Ti、TiN、Al、HfO2、Hf、Ta、W、TaNから選択されることを特徴とする、請求項1又は2に記載のマスク。
- その使用波長が13.5ナノメートルであることを特徴とする、請求項1〜5のいずれか一項に記載のマスク。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0603108A FR2899697B1 (fr) | 2006-04-07 | 2006-04-07 | Masque de photolitographie en extreme ultra-violet, avec couche d'arret resonante |
FR0603108 | 2006-04-07 | ||
PCT/EP2007/053143 WO2007115961A1 (fr) | 2006-04-07 | 2007-04-02 | Masque de photolithographie en extreme ultra-violet, avec couche d'arret resonante |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009532890A JP2009532890A (ja) | 2009-09-10 |
JP5157016B2 true JP5157016B2 (ja) | 2013-03-06 |
Family
ID=37428623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009503558A Expired - Fee Related JP5157016B2 (ja) | 2006-04-07 | 2007-04-02 | 共振する障壁層を伴う超紫外線フォトリソグラフィー |
Country Status (5)
Country | Link |
---|---|
US (1) | US7842438B2 (ja) |
EP (1) | EP2005245B1 (ja) |
JP (1) | JP5157016B2 (ja) |
FR (1) | FR2899697B1 (ja) |
WO (1) | WO2007115961A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7684109B2 (en) * | 2007-02-28 | 2010-03-23 | Maxim Integrated Products, Inc. | Bragg mirror optimized for shear waves |
JP5155017B2 (ja) * | 2008-05-29 | 2013-02-27 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
NL2002968A1 (nl) * | 2008-06-30 | 2009-12-31 | Asml Netherlands Bv | Optical element, lithographic apparatus including such an optical element, device manufacturing method, and device manufactured thereby. |
KR101034319B1 (ko) | 2010-09-24 | 2011-05-16 | 주식회사 엘엠에스 | 유전체 마스크 |
US20140170533A1 (en) * | 2012-12-19 | 2014-06-19 | Sematech, Inc. | Extreme ultraviolet lithography (euvl) alternating phase shift mask |
US9442387B2 (en) | 2013-02-01 | 2016-09-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extreme ultraviolet lithography process |
US20140254001A1 (en) * | 2013-03-07 | 2014-09-11 | Globalfoundries Inc. | Fabry-perot thin absorber for euv reticle and a method of making |
US9122166B2 (en) * | 2013-03-13 | 2015-09-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extreme ultraviolet lithography process and mask |
JP2015056451A (ja) * | 2013-09-10 | 2015-03-23 | 株式会社東芝 | 露光方法、露光装置及び反射型投影露光用マスク |
JP2016173392A (ja) * | 2015-03-16 | 2016-09-29 | 株式会社東芝 | 光反射型リソグラフィマスク、その製造方法、マスクデータの生成方法、およびマスクブランク |
WO2016162157A1 (en) | 2015-04-07 | 2016-10-13 | Asml Netherlands B.V. | Patterning devices for use within a lithographic apparatus, methods of making and using such patterning devices |
US10115891B2 (en) * | 2015-04-16 | 2018-10-30 | Toshiba Memory Corporation | Magnetoresistive memory device and manufacturing method of the same |
US10162257B2 (en) | 2016-12-15 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Extreme ultraviolet lithography system, device, and method for printing low pattern density features |
US10468149B2 (en) * | 2017-02-03 | 2019-11-05 | Globalfoundries Inc. | Extreme ultraviolet mirrors and masks with improved reflectivity |
CN110692016A (zh) * | 2017-06-01 | 2020-01-14 | Asml荷兰有限公司 | 图案化装置 |
WO2020153228A1 (ja) * | 2019-01-21 | 2020-07-30 | Agc株式会社 | 反射型マスクブランク、反射型マスク、および反射型マスクブランクの製造方法 |
KR102473558B1 (ko) * | 2019-10-23 | 2022-12-05 | 주식회사 에스앤에스텍 | 극자외선 리소그래피용 하프톤 위상반전 블랭크 마스크 및 포토마스크 |
US20230032950A1 (en) * | 2021-07-30 | 2023-02-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Euv photo masks and manufacturing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6641959B2 (en) * | 2001-08-09 | 2003-11-04 | Intel Corporation | Absorberless phase-shifting mask for EUV |
DE10155112B4 (de) * | 2001-11-09 | 2006-02-02 | Infineon Technologies Ag | Reflexionsmaske für die EUV-Lithographie und Herstellungsverfahren dafür |
US6986974B2 (en) * | 2003-10-16 | 2006-01-17 | Freescale Semiconductor, Inc. | Attenuated phase shift mask for extreme ultraviolet lithography and method therefore |
SG112034A1 (en) * | 2003-11-06 | 2005-06-29 | Asml Netherlands Bv | Optical element, lithographic apparatus comprising such optical element and device manufacturing method |
-
2006
- 2006-04-07 FR FR0603108A patent/FR2899697B1/fr not_active Expired - Fee Related
-
2007
- 2007-04-02 EP EP07727615A patent/EP2005245B1/fr not_active Expired - Fee Related
- 2007-04-02 US US12/295,952 patent/US7842438B2/en not_active Expired - Fee Related
- 2007-04-02 JP JP2009503558A patent/JP5157016B2/ja not_active Expired - Fee Related
- 2007-04-02 WO PCT/EP2007/053143 patent/WO2007115961A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2009532890A (ja) | 2009-09-10 |
FR2899697B1 (fr) | 2009-11-27 |
US7842438B2 (en) | 2010-11-30 |
WO2007115961A1 (fr) | 2007-10-18 |
EP2005245A1 (fr) | 2008-12-24 |
FR2899697A1 (fr) | 2007-10-12 |
US20090305147A1 (en) | 2009-12-10 |
EP2005245B1 (fr) | 2012-08-29 |
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