JP5156358B2 - Glass substrate processing method - Google Patents

Glass substrate processing method Download PDF

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JP5156358B2
JP5156358B2 JP2007322718A JP2007322718A JP5156358B2 JP 5156358 B2 JP5156358 B2 JP 5156358B2 JP 2007322718 A JP2007322718 A JP 2007322718A JP 2007322718 A JP2007322718 A JP 2007322718A JP 5156358 B2 JP5156358 B2 JP 5156358B2
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glass substrate
scribing
film
processing method
processing
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JP2009143764A (en
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武志 及川
俊英 高橋
善浩 ▲高▼橋
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Hitachi Media Electronics Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Description

本発明は、コンパクトディスクドライブ、DVDドライブ、Blu-rayディスクドライブ、HD-DVDドライブなどに搭載されている光ピックアップに用いられるミラー及びガラス基板、並びに、プロジェクタなどに使用されているガラス基板を加工する方法に関する。   The present invention processes mirrors and glass substrates used in optical pickups mounted on compact disc drives, DVD drives, Blu-ray disc drives, HD-DVD drives, etc., and glass substrates used in projectors, etc. On how to do.

光ピックアップやプロジェクタに使用されるガラス基板は、一枚の例えばミラー及び蒸着ガラスの一方の面に罫書き線を縦方向と横方向に交差させて形成し、罫書き線に沿って蒸着ガラス基板を分割することによって作製される。   A glass substrate used for an optical pickup or a projector is formed by crossing a ruled line in a vertical direction and a horizontal direction on one surface of, for example, a mirror and vapor-deposited glass, and the vapor-deposited glass substrate along the ruled line. It is produced by dividing.

ガラス基板の加工方法に関する技術として、例えば、下記特許文献1がある。   As a technique related to a method for processing a glass substrate, for example, there is Patent Document 1 below.

特開2003−12335号公報JP 2003-12335 A

ガラス基板をスクライブ加工により罫書き、分割する際に罫書き線を同一面上で交差させることによって、交点部分で欠けが発生したり、あるいは分割時に境界部分で突起が発生したり、またはスクライブ加工の罫書き屑によりガラス基板表面に傷が発生することがあり品質の低下と生産性の悪化を引き起こしていた。   When scribing and dividing a glass substrate, the ruled lines intersect on the same plane when they are divided, so that chipping occurs at the intersection, or protrusions occur at the boundary when dividing, or scribing The scratches on the glass substrate may cause scratches on the surface of the glass substrate, causing deterioration in quality and deterioration in productivity.

一方、特許文献1のように、ガラス基板をスクライブ加工する際にはガラス基盤の一方の面に縦若しくは横方向に罫書き線を形成させ、もう一方の面に先に加工した罫書き線と交差させるような罫書き線を形成する加工方法は、交点を発生させることがなく品質の安定化が可能である。   On the other hand, as in Patent Document 1, when scribing a glass substrate, a scribing line is formed on one surface of the glass substrate in the vertical or horizontal direction, and the other scribing line is processed on the other surface. The processing method for forming the ruled lines that intersect each other can stabilize the quality without generating an intersection.

しかしながら、ガラス基板をまったく保持するものが無い状態、若しくはガラス基板の表面を覆うものが無い状態で両面スクライブ加工を行った場合、罫書き線を形成する際に発生する加工屑によってガラス基板の表面に傷が発生したり、ガラス基板を分割する際に分割された小片が落下するなどして品質及び生産性が低下するなどの課題があった。   However, when performing double-sided scribing with nothing holding the glass substrate at all, or without covering the surface of the glass substrate, the surface of the glass substrate is caused by processing debris generated when forming scribing lines. There is a problem that the quality and productivity are deteriorated due to the occurrence of scratches on the glass substrate or the small pieces that are divided when the glass substrate is divided.

本発明は、かかる課題を解決するためになされたものであり、品質及び生産性を向上させることができるガラス基板の加工方法を提供することを目的とする。   This invention is made | formed in order to solve this subject, and it aims at providing the processing method of the glass substrate which can improve quality and productivity.

上記目的は、例えば、特許請求の範囲に記載の発明により達成することができきる。本願において開示される発明のうち代表的なものの概要を簡単に説明すれば次のとおりである。   The above object can be achieved, for example, by the invention described in the claims. The following is a brief description of an outline of typical inventions disclosed in the present application.

本発明に従うガラス基板の加工方法は、前記ガラス基板の両方の面に、粘着性を有する第1のフィルムを貼り付ける。そして、前記第1のフィルムを介して前記ガラス基板の一方の面にスクライブ加工して、罫書き線を形成し、前記第1のフィルムを前記ガラス基板の前記一方の面より剥がして、前記一方の面に再び粘着性を有する第2のフィルムを貼り付ける。次いで、前記ガラス基板の他方の面に、前記罫書き線と交差するようにスクライブ加工により前記第1のフィルムを介して罫書き線を形成し、前記ガラス基板を前記罫書き線に沿って分割する。   In the glass substrate processing method according to the present invention, an adhesive first film is attached to both surfaces of the glass substrate. Then, a scribing process is performed on one surface of the glass substrate through the first film to form ruled lines, and the first film is peeled off from the one surface of the glass substrate, A second film having adhesiveness is again applied to the surface. Next, a scribing line is formed on the other surface of the glass substrate through the first film by a scribing process so as to intersect the scribing line, and the glass substrate is divided along the scribing line. To do.

本発明によれば、品質を向上させることができ、生産性を向上させることができる。   According to the present invention, quality can be improved and productivity can be improved.

以下、本発明のガラス基板の加工方法の実施の形態について図に示しながら説明を行う。   Hereinafter, embodiments of the glass substrate processing method of the present invention will be described with reference to the drawings.

まず、図1に示すように加工対象であるガラス基板10の両方の面に粘着性を有するフィルム材料11、12を貼り付ける。この際のフィルムは粘着性を有するのはもちろんのこと、0.1mm以下で薄ければ薄いほうがガラス基板の加工面にスクライブ加工の荷重が伝わり易くなり、垂直クラック13aの進行性が向上する。   First, as shown in FIG. 1, film materials 11 and 12 having adhesiveness are attached to both surfaces of a glass substrate 10 to be processed. In this case, the film is not only sticky, but if it is thinner than 0.1 mm, the thinner the film, the easier the scribe processing load is transmitted to the processing surface of the glass substrate, and the progress of the vertical crack 13a is improved.

次にたとえば焼結ダイヤモンド製若しくはダイヤモンド製あるいは超硬合金製などのスクライブ加工刃を使用してスクライブ加工を行い、図2のようにフィルム材料を介してガラス基板に罫書き線14を形成する。このときのスクライブ加工圧力は任意であるが、最初の面のスクライブ加工ではガラス基板反対の面に垂直クラック13aが到達してはならない。図3a、図3bは図2にあるスクライブ加工後のガラス基板を矢印15の方向から見た正面図を示しているが、実際の加工時にはガラス基板に加工圧力のみが伝わればよいので、フィルム材料12は14のように切断されてもよいが、16のように切断されないこともあっても構わない。   Next, scribing is performed using, for example, a scribing blade made of sintered diamond, diamond, or cemented carbide to form a ruled line 14 on the glass substrate through the film material as shown in FIG. The scribing pressure at this time is arbitrary, but the vertical crack 13a must not reach the surface opposite to the glass substrate in the first surface scribing. 3a and 3b show front views of the glass substrate after scribing shown in FIG. 2 as viewed from the direction of arrow 15, but only the processing pressure needs to be transmitted to the glass substrate during actual processing, so the film material 12 may be cut as 14 but may not be cut as 16.

一方の面のスクライブ加工が終了した後、罫書き線を形成した面のフィルム材料を剥離し、同一面に再び新たにフィルム材料を貼り付ける。このとき、もしフィルムを貼り付けない状態で上記スクライブ加工を行ったのならば、罫書き屑がガラス基板の表面に付着しているため、フィルム材料を再び貼り付ける妨げとなる。ただし、スクライブ加工後のフィルム張替えは必ずしも行う必要は無いが、フィルム材料が一部でも切断されている場合には反対の面をスクライブ加工する際に加工圧力が均等に加わらないため、できるだけ張り替えたほうがよい。   After the scribing process on one surface is completed, the film material on the surface on which the scribe lines are formed is peeled off, and a new film material is pasted on the same surface again. At this time, if the scribing process is performed without attaching the film, the ruled scraps are attached to the surface of the glass substrate, which prevents the film material from being attached again. However, it is not always necessary to replace the film after scribing, but when the film material is partially cut, the processing pressure is not evenly applied when scribing the opposite surface, so the film was re-covered as much as possible. Better.

また、罫書き屑は刷毛、エアブロー及び超音波洗浄などにより除去が可能であるが、それらの方法は完全ではなく、フィルム材料を貼り付けた状態でスクライブ加工による罫書き線を形成する方法が罫書き屑自体の飛散を防ぐため、最も効果的である。   In addition, scribing scraps can be removed by brushing, air blowing, ultrasonic cleaning, etc., but these methods are not perfect, and the method of forming scribing scribing lines with the film material attached is a ruled method. It is the most effective because it prevents scattering of scraps.

次に図4のように罫書き線を形成していない面に上記スクライブ加工により罫書き線を形成した方向と交差する形で罫書き線17を形成する。このときガラス基板の双方の面には罫書き線が交差され形成されているが、同一面上ではないため交点に欠けなどが発生することはなく、垂直クラック13aと13bはガラス基板内部で交わっても問題にはならない。   Next, as shown in FIG. 4, a ruled line 17 is formed on the surface on which no ruled line is formed so as to intersect the direction in which the ruled line is formed by the scribing process. At this time, the scribing lines are formed on both surfaces of the glass substrate so as to intersect with each other. However, since they are not on the same surface, there is no chipping at the intersection, and the vertical cracks 13a and 13b intersect inside the glass substrate. It doesn't matter.

上記両面の罫書きが完了したガラス基板を罫書き線に沿って分割を行って得られたのが図5の小片18であるが、本加工方法では罫書き線が同一面上で無いため交点19に欠け、突起等の発生は無く、フィルムを介してスクライブ加工を行っているためガラス基板表面に傷等の発生は無い。   The piece 18 of Fig. 5 is obtained by dividing the glass substrate on which the double-sided scoring has been completed along the scoring line. However, in this processing method, the scoring line is not on the same surface, so it is an intersection. No cracks, protrusions, etc. are generated in 19, and since scribing is performed through the film, there is no damage on the glass substrate surface.

なお、罫書き線に沿って行う分割方法に関してはガラス基板上下方向から押し付け荷重を与える方法、またはガラス基板の側面から引っ張り荷重を与える方法などあるが、特に限定するものではない。   The dividing method performed along the ruled lines includes a method of applying a pressing load from the upper and lower directions of the glass substrate and a method of applying a tensile load from the side surface of the glass substrate, but are not particularly limited.

図6にスクライブ加工による罫書き線を同一面で交差させるように形成した場合の小片分割後のガラス基板を示す。罫書きの交点には欠け20や突起21が発生し、品質が悪化する。   FIG. 6 shows the glass substrate after dividing the small pieces when the scribing lines are formed so as to intersect on the same plane. Chips 20 and protrusions 21 are generated at the intersections of the ruled lines, and the quality deteriorates.

また、フィルム材料を貼り付けない状態で加工した場合、ガラス基板の表面に罫書き屑による傷22、23が発生する。   Further, when the film material is processed without being attached, scratches 22 and 23 due to ruled scraps are generated on the surface of the glass substrate.

また、上記加工方法では罫書き線1本ごとに表と裏を変更して加工してもよいなど、スクライブ加工時にガラス基板の表面にフィルム材料を貼り付けた状態であれば加工の順序を規制するものではない。   In the above processing method, the front and back sides may be changed for each ruled line. For example, if the film material is pasted on the surface of the glass substrate during scribe processing, the processing order is regulated. Not what you want.

また、本加工方法ではガラス基板分割後の洗浄工程を必要としていないが、実際に洗浄を行ったとしても品質に変化は無く問題はない。   In addition, this processing method does not require a cleaning step after dividing the glass substrate, but even if the cleaning is actually performed, the quality does not change and there is no problem.

更に、上記加工材料としてはガラス基板としているがフィルム材料を貼り付けて加工するという加工方法の特徴上、加工面を保護するという観点から、例えば光ピックアップやプロジェクタなどの200mm四方以下の比較的小型で所定膜厚の蒸着膜が形成された蒸着ガラス基板の加工に有効である。   In addition, the processing material is a glass substrate, but due to the characteristics of the processing method of processing by attaching a film material, from the viewpoint of protecting the processing surface, for example, a relatively small size of 200 mm square or less such as an optical pickup or projector This is effective for processing a vapor-deposited glass substrate on which a vapor-deposited film having a predetermined thickness is formed.

以上説明してきたように、本発明に従う加工方法によれば、分割後のガラス基板の交点品質を安定させることができると同時に、ガラス基板の表面をフィルムで覆うため罫書き加工屑が付着せず、ガラス基板表面に傷を発生させることが無いため、品質を向上させることができ、その上、ガラス基板表面に罫書き屑が発生しないため、分割後に通常行う純水若しくはその他溶剤による洗浄工程を必要とせず、生産性を向上させることができる。   As described above, according to the processing method according to the present invention, it is possible to stabilize the intersection quality of the glass substrate after the division, and at the same time, the surface of the glass substrate is covered with a film so that the scribing scraps do not adhere. Since the surface of the glass substrate is not scratched, the quality can be improved, and furthermore, no scribing scraps are generated on the surface of the glass substrate. Productivity can be improved without the need.

以上、本発明に従うガラス基板の加工方法の実施形態について説明したが、本発明は上記実施形態に限定されず、本発明の要旨を逸脱しない範囲において種々の改良や変形を行うことができる。   As mentioned above, although embodiment of the processing method of the glass substrate according to this invention was described, this invention is not limited to the said embodiment, A various improvement and deformation | transformation can be performed in the range which does not deviate from the summary of this invention.

ガラス基板の両方の面にフィルム材料を貼り付けた状態の斜視図Perspective view with film material pasted on both sides of glass substrate ガラス基板にスクライブ加工によりフィルム材料を介して罫書き線を形成した状態の斜視図A perspective view of a scribing line formed on a glass substrate with a scribing line through a film material 図2を矢印15の方向から見た正面図Front view of FIG. 2 viewed from the direction of arrow 15 図2とは反対の面に図2の罫書き線と交差するようにフィルムを介してスクライブ加工による罫書き線を形成した状態の斜視図2 is a perspective view in which a scribing ruled line is formed through a film on the surface opposite to FIG. 2 so as to intersect the ruled line of FIG. ガラス基板を罫書き線に沿って分割した状態の斜視図Perspective view of a state in which the glass substrate is divided along the ruled lines スクライブ加工により発生した不具合を説明するための図Diagram for explaining a problem caused by scribing

符号の説明Explanation of symbols

10 ・・・ガラス基板材料
11 、12、・・・フィルム材料
13a 、13b ・・・スクライブ加工による垂直クラック
14 、17 ・・・スクライブ加工による罫書き線
15 ・・・正面図案内の矢印
16 ・・・スクライブ加工後、切断されていないフィルム材料
18 ・・・分割後のガラス小片
19 ・・・分割後の交点
20 ・・・交点に発生した欠け
21 ・・・交点に発生した突起(そげ)
22、23 ・・・ガラス基板表面の傷
10 ... Glass substrate material
11, 12, ... Film material
13a, 13b ・ ・ ・ Vertical crack by scribing
14, 17 ・ ・ ・ Scribe lines by scribing
15 ・ ・ ・ Front view guide arrow
16 ... Film material not cut after scribing
18 ・ ・ ・ Glass pieces after division
19 ・ ・ ・ Intersection after division
20 ・ ・ ・ Deficit at the intersection
21 ・ ・ ・ Protrusions at the intersection
22, 23 ... scratches on the surface of the glass substrate

Claims (3)

ガラス基板の加工方法であって、
前記ガラス基板の両方の面に、粘着性を有する第1のフィルムを貼り付け、
前記第1のフィルムを介して前記ガラス基板の一方の面にスクライブ加工して、罫書き線を形成し、
前記第1のフィルムを前記ガラス基板の前記一方の面より剥がして、前記一方の面に再び粘着性を有する第2のフィルムを貼り付け、
前記ガラス基板の他方の面に、前記罫書き線と交差するようにスクライブ加工により前記第1のフィルムを介して罫書き線を形成し、
前記ガラス基板を前記罫書き線に沿って分割するガラス基板の加工方法。
A method for processing a glass substrate,
Affixing a first film having adhesiveness to both surfaces of the glass substrate,
Scribe processing on one side of the glass substrate through the first film, forming a ruled line,
The first film is peeled off from the one surface of the glass substrate, and a second film having adhesiveness is again attached to the one surface,
On the other surface of the glass substrate, a scribing line is formed through the first film by scribing so as to intersect the scribing line,
A glass substrate processing method for dividing the glass substrate along the ruled lines.
請求項1に記載の加工方法であって、前記第1のフィルム及び前記第2のフィルムを貼り付けた状態で前記ガラス基板を分割することを特徴とするガラス基板の加工方法。 It is a processing method of Claim 1, Comprising: The said glass substrate is divided | segmented in the state which bonded the said 1st film and the said 2nd film, The processing method of the glass substrate characterized by the above-mentioned. 請求項1に記載の加工方法であって、前記ガラス基板は、少なくとも一方の面に蒸着膜が形成された蒸着ガラスであることを特徴とするガラス基板の加工方法。 The processing method according to claim 1, wherein the glass substrate is a deposited glass having a deposited film formed on at least one surface.
JP2007322718A 2007-12-14 2007-12-14 Glass substrate processing method Expired - Fee Related JP5156358B2 (en)

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